TWM641000U - Heat-dissipation components of dual-faced heat-conductive transistor - Google Patents

Abstract

A double-sided heat conduction type transistor heat dissipation component is used to perform conduction heat dissipation on a first heat dissipation surface and a second heat dissipation surface opposite to each other in an insulating package casing of a transistor, and includes a heat sink and a Thermal clip. The heat sink and the heat conduction clip are clamped and fixed to the transistor, and are respectively thermally connected to the first heat dissipation surface and the second heat dissipation surface of the insulating package housing of the transistor, so as to conduct heat conduction on both sides of the transistor, so as to Improve cooling performance.

Description

Double-sided heat conduction type transistor cooling components

The invention relates to a heat dissipation component, in particular to a heat dissipation component for conducting heat conduction on both sides of a transistor to improve heat dissipation performance.

Since human beings have more and more requirements for the functions of electronic products, the requirements for their performance are also getting higher and higher, resulting in an increasing amount of calculations that need to be performed for the generation of electronics. In order to support higher and higher computing vehicles, higher-power power components and corresponding transistors are often required.

Since transistors need to operate with power components with higher and higher power, they need to generate higher and higher heat energy during operation. In addition, since the pins of the transistor need to maintain better insulation to prevent short circuit or leakage between the pins of the circuit, an insulating packaging material is required for packaging. In practice, based on manufacturing cost considerations, plastic materials are usually used as insulating packaging materials.

However, when the transistor works with high-power power components, the temperature of its internal pins will also rise significantly. Once the temperature rises to a certain level, it will cause the plastic material to soften or deform and affect its performance. insulation properties. In the existing prior art, the transistor is usually fixed on a heat sink, and then the heat generated by the heat sink is contacted by the heat sink to conduct the operation of the transistor. Under the limited space and contact conditions, the heat conduction and heat dissipation performance is quite limited. As a result, when the transistor operates with high-power power components, the temperature of the internal pins is still high, resulting in the softening or deformation of the above-mentioned plastic materials. Problems affecting its insulating properties occur.

In view of the limited heat conduction and heat dissipation performance in the prior art, the plastic material is softened or deformed to affect its insulation performance. The main purpose of this creation is to provide a double-sided heat conduction type transistor cooling component, hoping to improve the heat conduction and heat dissipation performance of the transistor by means of double-side heat conduction.

Therefore, a kind of necessary technical means adopted by this work to solve the problems of the prior art is to provide a kind of double-sided heat conduction type transistor cooling assembly, which is used to dissipate the first heat dissipation in an insulating package housing of a transistor opposite to each other. The surface and a second heat dissipation surface conduct conduction heat dissipation, and include a heat sink and a heat conduction clip. The radiator includes a radiator body and a plurality of cooling fins. The heat sink body has a heat conduction contact surface and a fin setting surface opposite to each other, and the heat conduction contact surface is thermally connected to the first heat dissipation surface. The cooling fins protrude integrally from the fin setting surface.

The heat conduction clip is fixed on the heat sink, and is thermally connected to the second heat dissipation surface, so as to clip and fix the transistor between the heat sink and the heat conduction clip. Wherein, the heat sink and the heat conduction clip conduct and dissipate heat energy from the first heat dissipation surface and the second heat dissipation surface respectively after the operation of the transistor generates heat energy.

Under the above necessary technical means, among the subsidiary technical means derived, preferably, the thermally conductive clip can be provided with a through hole, and the thermally conductive clip is locked in the heat dissipation by a locking element passing through the through hole and the transistor. device body. The heat-conducting clip system can be an integrated component, and includes a main body, two side boards and two bottom boards. The main body is thermally attached to the second heat dissipation surface; the side plate is bent and extended from both ends of the main body toward the heat sink; and the bottom plate is bent and extended from the side plate parallel to the heat-conducting contact surface. , and thermally connected to the thermal contact surface. Preferably, the heat sink can be an aluminum heat sink. The thermally conductive clip can also be an aluminum thermally conductive clip.

Based on the above, in the double-sided heat conduction type transistor heat sink assembly provided by this creation, the heat sink and the heat conduction clip are used to clamp and fix the transistor, and they are respectively thermally connected to the insulating package of the transistor The first heat dissipation surface and the second heat dissipation surface of the casing are used to conduct heat conduction on both sides of the transistor, so it can effectively improve the heat conduction and heat dissipation performance and reduce the temperature rise of each pin inside the transistor, so it can effectively avoid the use of The insulating package shell (usually made of plastic material) of each pin inside the package softens or deforms, so as to ensure that it maintains better insulation performance.

The specific embodiments adopted in this creation will be further described by the following embodiments and drawings.

Since the double-sided heat conduction type transistor cooling assembly provided by this invention can be widely used to dissipate heat of various transistors, there are many combinations and implementations, and in particular, only one preferred embodiment is listed below to illustrate. In addition, the diagrams in the various embodiments are all in a very simplified form, and the components are not presented in an absolutely accurate ratio, but are only used to facilitate and clearly illustrate the purpose and function of the inventive embodiment.

Please refer to the first figure, which is a schematic diagram showing the relative positional relationship between the disassembled double-sided heat conduction transistor heat sink assembly provided by the preferred embodiment of the present invention, the transistor and the power module. As shown in the first figure, a double-sided heat conduction type transistor heat dissipation component (hereinafter referred to as "heat dissipation component") 100 is used for a first heat dissipation surface opposite to each other in an insulating packaging casing 201 of a transistor 200. S1 and a second heat dissipation surface S2 conduct conduction heat dissipation, and include a heat sink 1 and a heat conduction clip 2 . A plurality of pins 202 of the transistor 200 are encapsulated by an insulating packaging case 201 made of plastic material, and partially extend out of the insulating packaging case 201 . In addition, the transistor 200 works with a power module 300 .

The radiator 1 includes a radiator body 11 and a plurality of cooling fins 12 . The heat sink body 11 has a heat conduction contact surface Sc and a fin disposition surface Sf opposite to each other, and the heat conduction contact surface Sc is thermally attached to the first heat dissipation surface S1. The heat dissipation fins 12 protrude integrally from the fin installation surface Sf. Preferably, the heat sink 1 can be an aluminum heat sink composed of aluminum or aluminum alloy.

The heat-conducting clip 2 can be a one-piece component, and includes a body portion 21 , two side plate portions 22 and two bottom plate portions 23 . The body portion 21 of the heat conducting clip 2 is provided with a perforation H, and the two side plate portions 22 are bent and extended from both ends of the body portion 21 towards the radiator 1, and the two bottom plate portions 23 are parallel to the heat conduction plate from the two side plate portions 22 respectively. The contact surface Sc is bent and extended. Preferably, the thermally conductive clip 2 can also be an aluminum thermally conductive clip composed of aluminum or aluminum alloy. The locking element 3 can be a screw, and can be used to lock the heat conducting clip 2 , the transistor 200 and the power module 300 to the heat sink 1 .

Please continue to refer to the second figure and the third figure. The second figure is a schematic diagram showing the relative positional relationship between the double-sided heat conduction type transistor heat sink assembly, the transistor and the power module provided by the preferred embodiment of the invention; Figure 3 is a cross-sectional view along section A-A in Figure 2. When assembling the heat dissipation component 100, the transistor 200 and the power module 300, the transistor 200 can be placed on the heat conduction contact surface Sc of the heat sink body 11, so that the heat conduction contact surface Sc is thermally attached to the first heat dissipation surface S1. The so-called "thermal connection" refers to the connection method that transfers heat energy efficiently through direct contact or contact with a heat-conducting medium (such as heat-conducting glue or heat-conducting strip).

Next, place the thermally conductive clip 2 on the transistor 200 and the heat sink body 11, make the body part 21 of the thermally conductive clip 2 thermally attached to the second heat dissipation surface S2, and make the bottom plate part 23 thermally connected Attached to the thermal contact surface Sc. Then, use the locking element 3 to sequentially pass through the hole H of the body part 21 of the thermally conductive clip 2 and the transistor 200, and lock to the heat sink body 11, thereby clamping and fixing the transistor 200 to the heat sink 1 between the thermal clip 2. Finally, the power module 300 is locked to the radiator body 11 by the locking element 3 , and the power module 300 is electrically connected to the pin 202 of the transistor 200 by wire bonding or wiring.

After the transistor 200 cooperates with the power module 300 to operate and generate heat, the heat is conducted from the first heat dissipation surface S1 and the second heat dissipation surface S2 to the heat sink 1 and the heat conduction clip 2 respectively, and then dissipates into the air.

Next, compare the heat conduction and heat dissipation performance. Because in the prior art, the heat conduction clip 2 is not installed, so it can only conduct heat conduction on one side through the side in contact with the heat sink 1. After computer software simulation, it can be known that when simulating a specific operating state, the transistor The temperature of the portion of each pin 202 of 200 located inside the insulating package casing 201 (such as the portion of the pin 202 marked in FIG. 3 ) is approximately between 120.76°C and 126.84°C.

On the contrary, in the technology provided by this creation, since the heat conduction clip 2 is installed, the heat energy can be conducted to the radiator 1 and the heat conduction clip 2 through the first heat dissipation surface S1 and the second heat dissipation surface S2 at the same time, After computer software simulation, it can be known that when simulating the same specific operating state, the pins 202 of the transistor 200 are located in the inner part of the insulating package casing 201 (as the part of the pins 202 marked in the third figure) The temperature is approximately between 100.55°C and 108.82°C. In contrast, with the technology provided by the invention, the temperature of the part of each pin 202 of the transistor 200 located inside the insulating package casing 201 (such as the part of the pin 202 marked in the third figure) can be reduced by about 18°C to 20°C. It has been verified again that the double-sided heat conduction type transistor heat dissipation component provided by the invention can provide better heat dissipation effect for the transistor 200 in operation.

Based on the above, in the double-sided heat conduction type transistor cooling assembly (radiation assembly 100) provided by this creation, the transistor 200 is clamped and fixed by the heat sink 1 and the heat conduction clip 2, and the thermal connections are respectively connected to each other. Attached to the first heat dissipation surface S1 and the second heat dissipation surface S2 of the insulating package casing 201 of the transistor 200, so as to conduct heat conduction on both sides of the transistor 200, and verified by computer software simulation, it can indeed effectively improve the heat conduction and heat dissipation performance To reduce the temperature rise of each pin inside the transistor. Therefore, through the implementation of the present invention, it is possible to effectively avoid softening or deformation of the insulating package case 201 used to package the internal pins 202 , so as to ensure that it maintains better insulating performance for a long time.

Through the above detailed description of the preferred embodiments, it is hoped that the characteristics and spirit of the creation can be described more clearly, and the scope of the creation is not limited by the preferred embodiments disclosed above. On the contrary, its purpose is to hope to cover various changes and arrangements with equivalents within the scope of the patent scope of this creation.

100: cooling components 200: Transistor 201: Insulation package shell 202: pin 300: power module 1: Radiator 11: radiator body 12: cooling fins 2: Thermal clip 21: Body Department 22: side panel 23: Bottom plate 3: Locking element S1: the first cooling surface S2: Second cooling surface Sc: thermal contact surface Sf: fin setting surface H: perforated

The first figure is a schematic diagram showing the relative positional relationship between the disassembled double-sided heat conduction type transistor heat dissipation component provided by the preferred embodiment of the invention, the transistor and the power module; The second figure is a schematic diagram showing the relative positional relationship between the double-sided heat conduction type transistor heat sink assembly, transistor and power module provided by the preferred embodiment of the invention; and The third figure is a sectional view along the A-A section in the second figure.

100: cooling components

200: Transistor

201: Insulation package shell

202: pin

300: power module

1: Radiator

11: radiator body

12: cooling fins

2: Thermal clip

21: Body Department

22: side panel

23: Bottom plate

3: Locking element

S1: the first cooling surface

S2: Second cooling surface

Sc: thermal contact surface

Sf: fin setting surface

H: perforated

Claims (5)

A double-sided heat conduction type transistor heat dissipation component is used to conduct conduction heat dissipation to a first heat dissipation surface and a second heat dissipation surface opposite to each other in an insulating package casing of a transistor, including: A radiator, comprising: A heat sink body has a heat conduction contact surface and a fin arrangement surface opposite to each other, and the heat conduction contact surface is thermally connected to the first heat dissipation surface; and a plurality of cooling fins protrude integrally from the fin setting surface; and A heat conduction clip is fixed on the heat sink and thermally connected to the second heat dissipation surface, so that the transistor is clamped and fixed between the heat sink and the heat conduction clip; Wherein, the heat sink and the heat conduction clip conduct and dissipate the heat energy from the first heat dissipation surface and the second heat dissipation surface respectively after the transistor operates to generate heat energy. The double-sided heat conduction type transistor heat sink assembly as described in claim 1, wherein the heat conduction clip is provided with a through hole, and the heat conduction clip is locked with the transistor through the through hole by a locking element on the radiator body. The double-sided heat conduction type transistor cooling assembly as described in Claim 1, wherein the heat conduction clip is an integrated component and includes: A body portion is thermally connected to the second heat dissipation surface; two side plate parts are bent and extended from both ends of the body part toward the radiator; and The two bottom board parts are bent and extended from the two side board parts parallel to the heat conduction contact surface, and are thermally connected to the heat conduction contact surface. The double-sided heat conduction type transistor heat sink assembly as described in claim 1, wherein the heat sink is an aluminum heat sink. The double-sided heat conduction type transistor cooling assembly as described in claim 1, wherein the heat conduction clip is an aluminum heat conduction clip.

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