TWM634862U - Supporting structure of heat dissipation unit - Google Patents

Abstract

This invention creates a support structure for a heat dissipation unit, which is suitable for use in a heat dissipation unit. The two sides of the heat dissipation unit respectively form a condensation side and an evaporation side, which are respectively abutted against the two ends of the support structure. The support structure includes a carrier part and a spine part, the carrier part has a contact surface and a bearing surface, the spine part is arranged on the bearing surface of the carrier part by a plurality of needle column arrays, and there is a gap between the needle columns A channel is formed, and through the supporting structure provided with the spine, the vapor-liquid in the heat dissipation unit can be accelerated to circulate and flow rate, thereby greatly improving the heat dissipation performance.

Description

Support structure for cooling unit

The invention relates to a cooling unit, especially a supporting structure of the cooling unit.

With the rapid development of science and technology, the power and performance of electronic products are increasing day by day, and more heat is generated during operation; graphics processor), it will cause the temperature of the electronic component to be too high and affect its performance, or even cause the failure of the electronic component to be damaged. Therefore, the industry has been continuously developing various heat dissipation devices to solve the problems of electronic components, and the vapor chamber is a very common heat dissipation device.

Generally, the conventional chamber structure is covered by an upper plate and a lower plate to jointly define a chamber, which is filled with a working liquid (such as pure water), and a capillary structure and a plurality of support columns are arranged in the chamber, these The two ends of the support column abut against the inside of the upper and lower plates in the chamber respectively, and the upper plate and the lower plate respectively form a condensation area and an evaporation area in contact with the heating element, through which the working liquid in the evaporation area is received The heat of the heating element is evaporated into vapor (i.e. vapor working fluid) and flows toward the condensation area, and the vapor turns into liquid (i.e. liquid working fluid) after being condensed on the condensation area and passes through the support columns and gravity It flows back to the evaporation area and repeats the vapor-liquid circulation to dissipate heat.

However, it is known that the support column is a solid copper column, which only has a supporting function and cannot provide capillary force, so that the working fluid can only flow back from the condensation area to the evaporation area by gravity, and the return speed is too slow. It is easy to cause dry burning in the evaporation area, resulting in poor heat transfer efficiency.

Therefore, the proprietor improved the support column so that it not only has the support function but also has the capillary force effect; After the improvement, the support column with capillary force can be roughly divided into three types; one of the support columns is designed by sintered support column formed by powder sintering, and the condensed liquid is refluxed by the capillary force of the capillary structure on the sintered support column to the evaporation zone. Although the sintering support has capillary force, it also extends a problem. When the working fluid is at a high temperature of 120 degrees, the vapor pressure of the steam is 2kg/cm^2, and the direction of its pressure movement is irregular, because each sintering The top and bottom surfaces of the support columns are irregular, so that the bonding force between each sintered support column and the inner side of the upper and lower plates can resist a pullout force of 1kg/cm^2, which makes each sintered support column unable to grasp The upper and lower plates expand and bulge outwards. In mild cases, the vapor chamber will bulge, and in severe cases, it will cause the support to crack and become incapacitated due to deformation of the vapor chamber.

Another type of supporting column is a design in which a powder ring structure made of sintered powder is placed on the periphery of a solid copper cylinder, and the condensed liquid is transported through the capillary force of the powder ring structure on the solid copper cylinder. Returning to the evaporation area solves the problem of bulging of the vapor chamber caused by the above-mentioned sintered support column. However, because the overall outer diameter width of each support column is exactly the outer diameter width of the powder ring structure, the overall volume of each support column is too large and occupies too much space in the chamber (seriously affecting the chamber volume), making the steam flow As the channel shrinks, the range where the steam can move becomes smaller (shrinks) and the flow resistance increases, which in turn causes the problems of poor vapor-liquid circulation and low heat dissipation efficiency.

Another type of support column is a design in which the outer surface of a solid copper cylinder is made into multiple grooves, and the condensed liquid is returned to the evaporation by the capillary force generated by the grooves on the outer surface of the solid copper. Although this support column structure can solve the above-mentioned problems of bulging of the vapor chamber and the shrinking of the steam channel in the chamber, another problem arises, because the overall outer diameter of the solid copper column needs to be larger than More than 5 millimeters (mm), there is enough space to form the grooves on the outer surface of the solid copper cylinder. Moreover, the number, size, and depth of these grooves will affect the capillary strength (that is, capillary capacity). Because the capillary force of these grooves is not strong enough, the amount of water entrained back to the evaporation area is limited and the amount of return water is insufficient. or fail to reflow To the problem of the evaporation area, and then there is no working fluid in the evaporation area to appear dry state (so-called dry out), resulting in the problem of heat uniformity and poor heat dissipation.

Therefore, how to solve the above-mentioned problems and deficiencies of the support column structure in the chamber is the direction that the author of this case and the relevant manufacturers engaged in this industry want to study and improve.

The main purpose of this creation is to provide a support structure with spines composed of multiple needle columns to replace the traditional support structure with sintered capillary structure or grooves, so as to accelerate the flow rate of vapor-liquid circulation, thereby effectively improving the heat dissipation performance of the person. The supporting structure of the unit.

Another purpose of the present invention is to provide a support structure for a heat dissipation unit that has better temperature uniformity and can improve capillary capacity, and can also reduce the overall weight of the support structure and increase the heat dissipation area.

In order to achieve the above purpose, this creation provides a support structure of a heat dissipation unit, which is suitable for use in a heat dissipation unit (such as a vapor chamber), and the two sides of the heat dissipation unit respectively form a condensation side and an evaporation side, which are respectively connected to the support structure. The two ends are abutted against each other, the support structure includes a carrier part and a spine part, the carrier part has a contact surface and a bearing surface, and the spine part is arranged on the bearing surface of the carrier part by a plurality of pin column arrays There is a gap between the pin posts to form a channel, so that the support structure can not only have a supporting function, but also can dissipate the heat dissipation unit through the arrangement of the spine and the channel without increasing the volume. The working fluid condensed on the condensing side is guided to the evaporating side, thereby accelerating the flow rate of the vapor-liquid cycle and greatly improving the heat dissipation performance.

1: Support structure

11: Carrier Department

111: contact surface

112: bearing surface

12: spine

121: free end

122: fixed end

123: needle column

14: channel

2: cooling unit

21: upper board

22: Lower board

23: chamber

24: capillary structure

25: Condensation side

26: Evaporation side

Figure 1 is a three-dimensional exploded schematic diagram of the cooling unit of this creation.

Figure 2 is a schematic cross-sectional view of the combination of the heat dissipation unit of this invention.

Figure 3A is a three-dimensional schematic diagram of the supporting structure of this creation.

Fig. 3B is a schematic top view of Fig. 3A.

The above-mentioned purpose of this creation and its structural and functional characteristics will be described according to the preferred embodiments of the accompanying drawings.

This creation provides a support structure for the cooling unit, please refer to Figures 1 and 2. The supporting structure 1 is suitable for a heat dissipation unit 2, the heat dissipation unit 2 is, for example, a vapor chamber, a hot plate, a flat heat pipe or a water cooling plate. In this embodiment, the heat dissipation unit 2 is described as a vapor chamber. But not limited to this.

The cooling unit 2 includes an upper plate 21 and a lower plate 22. The upper plate 21 and the lower plate 22 are covered together to define a chamber 23, which is filled with a working fluid (such as pure water or inorganic compound, Alcohols, liquid metals, refrigerants, organic compounds or mixtures), and the inner wall of the chamber 23 is provided with a capillary structure 24, the capillary structure 24 is any of powder sintered body, groove, grid body, fiber body and braided body First, in this embodiment, the capillary structure 24 is selected as a powder sintered body formed on the inside of the upper plate 21 and the lower plate 22 in the chamber 23 . And this upper plate 21 and this lower plate 22 form a condensation side (condensation zone) 25 and an evaporation side (evaporation zone) 26 respectively, and this lower plate 22 outside of this evaporation side 26 is indirect or direct contact with a heating element (such as Central processing unit, display card chip, north-south bridge chip or other electronic components (such as transistors)) to absorb the heat on the heating element.

Referring back to Figures 2, 3A, and 3B, the aforementioned support structure 1 in this embodiment is a plurality of support structures 1 arranged in the cavity 23 of the heat dissipation unit 2, which can not only serve as a support function, but also provide better capillary force And the function of high permeability. However, the number of supporting structures 1 in this case is not limited to the number in the drawing. During actual implementation, the user can adjust and design the number of supporting structures 1 according to the required supporting strength and power of the cooling unit 2 .

As described in detail later, each supporting structure 1 is made of a metal material with high thermal conductivity, such as a columnar body of copper, silver, aluminum or the former alloy. And the supporting structure 1 has a carrier portion 11 and a spine portion 12 .

The carrier part 11 has a contact surface 111 and a bearing surface 112 which are respectively arranged on both sides of the carrier part 11, and the contact surface 111 of the carrier part 11 (i.e. one end of the aforementioned supporting structure 1) is in contact with the cooling unit 2. The condensation side 25 or the evaporation side 26, in this embodiment, the contact surface 111 of the carrier part 11 is connected to the inner side of the upper plate 21 of the chamber 23 and contacts the adjacent capillary structure 24, and the carrier part 11 carries The surface 112 is provided with the spine part 12 which is composed of a plurality of needle columns 123 arranged in an array, that is, the needle columns 123 of the spine part 12 are distributed in a staggered array at intervals or in a side-by-side array on the bearing surface of the carrier part 11 112 on. In addition, referring to FIG. 3B , in this embodiment, the cross section of the carrier part 11 is a circular block, but not limited thereto, and may also be a rectangular or polygonal block (sheet or column).

The spine part 12 is integrally or non-integrally arranged on the bearing surface 112 of the carrier part 11. In this embodiment, the needle columns 123 of the spine part 12 are fin columns and are integrally formed (generated) on the carrier part 11. The bearing surface 112. And the spinous part 12 has a free end 121 and a fixed end 122 which are respectively arranged at two ends of the spinous part 12, and the fixed end 122 is fixedly connected to the bearing surface 112 of the carrier part 11, and is located adjacent to On the condensing side 25 or the evaporating side 26, the free end 121 (i.e. the other end of the aforementioned supporting structure 1) protrudes outward from the carrier part 11 and contacts (does not touch) adjacent to the evaporating side 26 or the condensing side 25, In this embodiment, the free end 121 of the spinous part 12 (that is, the free end of the needle posts 123) is connected to the inner side of the lower plate 22 of the chamber 23 on the evaporation side 26 and connected to the adjacent capillary structure 24. . The cross-sections of the pin posts 123 of the spinous part 12 in this embodiment are circular copper posts for illustration, but not limited thereto, and may also be rectangular, triangular or polygonal posts (sheets). Moreover, the above-mentioned carrier portion 11 and the spine portion 12 are also made of a metal material with a high thermal conductivity material.

The pin posts 123 of the spine-shaped part 12 are spaced apart from each other, so there is a gap between every two pin posts 123 to form a channel 14 which communicates with the cavity 23 of the heat dissipation unit 2, and is carried on the carrier part 11. The width of each channel 14 on the surface 112 is 0.1 mm (millimeter) to 0.25 mm (millimeter), and the widths of the channels 14 between the needle posts 123 are the same or different, such as the needle posts The passages 14 of 123 are arranged on the bearing surface 112 of the carrier part 11 in equidistant width, or the passages 14 of the needle posts 123 are arranged on the bearing surface of the carrier part 11 in a non-equidistant width outwardly tapered or gradually widened. Surface 112.

In detail, in this embodiment, the pin posts 123 of the spinous part 12 are integrally formed on the carrying surface 112 of the carrier part 11 by machining (wire cutting or CNC processing) or laser cutting, And the channels 14 between every two pin posts 123 have the same equidistant width (for example, 0.1 mm). In this way, the early evaporation of the working fluid on the evaporation side 26 of the heat dissipation unit 2 can be accelerated through the spine 12, and the channels 14 between the needle columns 123 have the function of guiding (draining) the working fluid, just like It has the same capillary force to absorb the condensed working fluid, and the width of each channel 14 is designed in the range of 0.1mm (millimeter) to 0.25mm (millimeter) to obtain better permeability and let the liquid working fluid quickly The flow is returned to the evaporation side 26 to accelerate the flow rate of the vapor-liquid circulation, so as to effectively improve the heat dissipation performance.

Referring again to FIG. 2, when the evaporation side 26 of the heat dissipation unit 2 absorbs the heat of the heating element, the working fluid on the capillary structure 24 in the evaporation side 26 will be heated and transformed into a vapor working fluid, making the vapor The working fluid in the vapor state will flow rapidly toward the inner side of the upper plate 21 of the condensation side 25 in the chamber 23 and the channels 14 of the needle columns 123, and the working fluid in the vapor state will condense on the condensation side 25 and turn into a liquid state After the working fluid is released, the liquid working fluid in the capillary structure 24 on the inner side of the upper plate 21 will be quickly guided (drainage) by the spines 12 and the channels 14 of the support structure 1 and sent back to the upper plate 21. The capillary structure 24 on the inner side of the lower plate 22 of the evaporation side 26 is used to accelerate the vapor-liquid circulation of the working fluid in the chamber 23 of the cooling unit 2 The loop keeps repeating the vapor-liquid circulation to dissipate heat, so as to improve the overall vapor-liquid circulation efficiency, thereby achieving better uniform heat and temperature effects and preventing the evaporation side 26 from causing dry burning.

Although in this embodiment, no heat dissipation element is provided outside the upper plate 21 of the condensation side 25 of the heat dissipation unit 2 . But not limited thereto, in another embodiment, a heat dissipation fin group composed of a plurality of fins may be disposed on the outer side of the upper plate 21 of the condensation side 25 to increase the heat dissipation area.

Although the pin posts 123 of the spinous portion 12 of each support structure 1 in this embodiment are disposed on the carrier portion 11 . But not limited thereto, in another alternative embodiment, the carrier part 11 comprises a plurality of microcarrier parts, and at least one needle post 123 is arranged on the loading surface of each microcarrier part, and the microcarrier parts are combined (such as splicing) through these microcarrier parts. , clamping or welding) constitute the supporting structure 1 together.

Although the supporting structures 1 of the present embodiment are installed upside down in the cavity 23 of the heat dissipation unit 2 (as shown in FIG. 2 ), the contact surface 111 of the carrier portion 11 and the free end 121 of the spinous portion 12 are respectively in contact with The condensation side 25 and the evaporation side 26 of the cooling unit 2 are in contact. But not limited thereto, in other alternative embodiments, the supporting structures 1 are placed upright in the cavity 23 of the heat dissipation unit 2, so that the contact surface 111 of the carrier part 11 and the free end 121 of the spine part 12 are respectively It is in contact with the evaporation side 26 and the condensation side 25 of the heat dissipation unit 2, or some of the support structures 1 are upright, and the other support structure 1 is inverted and staggered (distributed) in the chamber 23 of the heat dissipation unit 2 Inside.

The support structure 1 provided with the spine-shaped portion 12 and the channel 14 of the present invention is applicable to the design of the heat dissipation unit 2, so that it can effectively replace (replace) the copper column with the traditional sintered capillary structure 24 or the groove, and not only can be used in Under the premise of increasing the volume, the overall weight of the support structure 1 can be reduced and the flow space of the vapor (i.e., vaporous working fluid) in the chamber 23 can be increased, thereby greatly accelerating the evaporation efficiency in the heat dissipation unit 2 and obtaining a condensed The liquid working fluid requires strong capillary force and high permeability, so as to improve the overall heat dissipation performance.

The above has described this creation in detail, but the above is only one of the preferred embodiments of this creation, and should not limit the scope of this creation. That is, all equal changes and modifications made according to the application scope of this creation should still be covered by the patent of this creation.

1: Support structure

11: Carrier Department

111: contact surface

112: bearing surface

12: spine

121: free end

123: needle column

14: channel

2: cooling unit

21: upper board

22: Lower board

23: chamber

24: capillary structure

25: Condensation side

26: Evaporation side

Claims (8)

A supporting structure of a heat dissipation unit, which is suitable for a heat dissipation unit, and the two sides of the heat dissipation unit respectively form a condensation side and an evaporation side, which are respectively abutted against the two ends of the support structure, and the support structure includes a carrier part and A spine-shaped part, the carrier part has a contact surface and a bearing surface, the spine-shaped part is arranged on the bearing surface of the carrier part by a plurality of needle pillar arrays, and the needle pillars have gaps between each other to form a channel , through the arrangement of the spines, the flow rate of the vapor-liquid circulation is accelerated and the heat dissipation performance is greatly improved. The supporting structure of the heat dissipation unit as described in item 1 of the scope of the patent application, wherein the pin columns are integrally or non-integrally arranged on the bearing surface of the carrier part. The supporting structure of the cooling unit as described in item 1 of the scope of the patent application, wherein the pin columns are arranged equidistantly or non-equidistantly on the bearing surface of the carrier part. The supporting structure of the heat dissipation unit as described in item 1 of the scope of the patent application, wherein the pin columns are arranged in a staggered array at intervals or in a side-by-side array on the bearing surface of the carrier part. The supporting structure of the heat dissipation unit as described in item 1 of the scope of the patent application, wherein the carrier part and the spine part are made of materials with high thermal conductivity. The supporting structure of the heat dissipation unit as described in item 1 of the scope of the patent application, wherein the heat dissipation unit is a uniform temperature plate, a heat plate, a flat heat pipe or a water cooling plate. The supporting structure of the cooling unit described in item 1 of the scope of the patent application, wherein the widths of the passages between the pin columns are the same or different. As the supporting structure of the heat dissipation unit described in item 1 of the scope of the patent application, wherein the heat dissipation unit includes an upper plate and a lower plate, the upper plate and the lower plate are covered together to define a chamber, and a working chamber is filled in the chamber. fluid, and the inner wall of the chamber is provided with a capillary structure, and the spine has A free end is extended outward from the carrier part, one of the free end of the spine part and the contact surface of the carrier part is connected to the inner side of the lower board or the upper board, and the other is connected to the inner side of the upper board. The inner side of the upper plate or the lower plate, and the channels of the spine part communicate with the chamber, and the upper plate and the lower plate respectively form the condensation side and the evaporation side.

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