CN114916211A - Supporting structure of heat dissipation unit - Google Patents

Abstract

The invention relates to a support structure for a heat dissipation unit, which is suitable for use in a heat dissipation unit. A condensation side and an evaporation side are respectively formed on both sides of the heat dissipation unit and are respectively abutted against both ends of the support structure. The support structure includes: A carrier part and a spine-shaped part are formed, the carrier part has a contact surface and a bearing surface, the spine-shaped part is arranged on the bearing surface of the carrier part by a plurality of needle columns in an array, and the plurality of needle columns are mutually There is a gap therebetween to form a channel, and by means of the support structure provided with the spine-shaped portion, the circulating flow rate of the vapor and liquid in the heat dissipation unit can be accelerated, thereby greatly improving the heat dissipation performance.

Description

Support structure for cooling unit

technical field

The present invention relates to a heat dissipation unit, in particular to a support structure of the heat dissipation unit.

Background technique

With the rapid development of technology, the power and efficiency of electronic products are increasing day by day, which in turn generates more heat during operation; if the heat cannot be dissipated in time, it will accumulate in the electronic components (such as processors or processors) inside the electronic products. Graphics processor), the temperature of the electronic component will be too high and its performance will be affected, and even severe cases will lead to the failure of the electronic component. Therefore, the industry has been continuously developing various heat dissipation devices to solve the problems of electronic components, and the vapor chamber is a very common heat dissipation device.

Generally, the existing vapor chamber structure consists of an upper plate covered with a lower plate and jointly defines a chamber, the chamber is filled with a working liquid (such as pure water), and the chamber is provided with a capillary structure and a plurality of supporting columns. The two ends of the plurality of support columns are respectively abutted on the inner sides of the upper and lower plates in the chamber, and the upper plate and the lower plate respectively form a condensation area and an evaporation area in contact with the heating element, and the working liquid in the evaporation area passes through. By the heat of the heating element, it evaporates into vapor (ie, gaseous working fluid) and flows toward the condensation area, and the vapor is condensed on the condensation area and turns into liquid (ie, liquid working fluid) and passes through the plurality of support columns and gravity Return to the evaporation area, and repeat the continuous vapor-liquid circulation to dissipate heat.

However, the existing plurality of support columns is a solid copper column, which only has a supporting function and cannot provide a capillary force effect, so that the working fluid can only be recirculated from the condensation zone to the evaporation zone by gravity, and the reflux speed is too slow. It is easy to make the evaporation area dry and burn, resulting in poor heat transfer efficiency.

Therefore, the industry has improved the support column, so that it has the function of capillary force in addition to the support function;

After the improvement, the support column with capillary force can be roughly divided into three types; one of the support columns is the design of the sintered support column formed by powder sintering. Liquid is returned to the evaporation zone. Although the sintering support has capillary force, it has a problem of extension. When the working fluid is at a high temperature of 120 degrees, the vapor pressure of the steam is 2kg/cm^2, and the pressure movement direction is irregular. The top and bottom surfaces of the support columns are irregular, so that the bonding force between each sintered support column and the inner side of the upper and lower plates can resist a pull-out force of 1kg/cm^2, which makes each sintered support column unable to hold If the upper and lower plates expand and bulge outwards, the lighter ones will cause bulging of the temperature equalizing plate, and the serious ones will lead to the problem of cracking and failure of the supporter due to deformation.

Another type of support column is a design in which a powder ring structure made of powder sintered is covered on the periphery of a solid copper column. The liquid is returned to the evaporation area, although the problem of bulging of the vapor chamber caused by the sintering support column above is solved. However, because the overall outer diameter width of each support column is the outer diameter width of the powder ring structure, the overall volume of each support column is too large and occupies too much space in the chamber (severely affects the chamber volume), making the steam When the flow channel is reduced, the relative moving range of the steam is also reduced (reduced) and the flow resistance is increased, thereby causing the problems of poor vapor-liquid circulation and low heat dissipation efficiency.

Another type of support column is a design in which the outer surface of a solid copper column is made into a plurality of grooves, and the condensed liquid is returned to the surface by the capillary force generated by the plurality of grooves on the outer surface of the solid copper body. In the evaporation area, although this support column structure can solve the above-mentioned problems of the bulge of the temperature equalizing plate and the shrinkage of the vapor channel of the chamber, it also extends another problem, because the overall outer diameter of the solid copper column in actual production needs to be When the thickness is greater than 5 millimeters (mm), there is enough space to form the plurality of trenches on the outer surface of the solid copper column. And the number, size and depth of the plurality of grooves will affect the capillary strength (that is, the capillary capacity). Because the capillary force of the plurality of grooves is not strong enough, the amount of water entrained into the evaporation zone is limited and the amount of backwater is insufficient. Or the problem of not being able to return to the evaporation area, so that no working fluid inside the evaporation area is in a dry state (so-called dry out), resulting in problems of poor heat soaking and heat dissipation.

Therefore, how to solve the problems and deficiencies of the above-mentioned support column structure in the vapor chamber is the direction that the inventor of the present application and related manufacturers in the industry are eager to research and improve.

SUMMARY OF THE INVENTION

The main purpose of the present invention is to provide a support structure composed of a plurality of needle columns with a spine-like portion to replace the traditional support structure with a sintered capillary structure or a groove, so as to accelerate the flow rate of vapor-liquid circulation, thereby effectively improving the heat dissipation efficiency. The support structure of the cooling unit.

Another object of the present invention is to provide a support structure for a heat dissipation unit that has better temperature uniformity and can improve capillary capacity, and can also reduce the overall weight of the support structure and increase the heat dissipation area.

In order to achieve the above purpose, the present invention provides a support structure for a heat dissipation unit, which is suitable for use in a heat dissipation unit (such as a temperature equalizing plate). The two ends of the structure are in contact with each other, the supporting structure includes a carrier part and a spine-shaped part, the carrier part has a contact surface and a bearing surface, and the spine-shaped part is arranged on the carrier part of the carrier part by a plurality of needle post arrays On the surface, and the plurality of needle posts have gaps between each other to form a channel, so that the support structure not only has a supporting effect, but also can dissipate heat through the arrangement of the spine and the channel without increasing the volume. The effect of guiding the working fluid condensed on the condensing side of the unit to the evaporating side, thereby accelerating the vapor-liquid circulation flow rate and greatly improving the heat dissipation efficiency.

Description of drawings

FIG. 1 is a schematic exploded perspective view of a heat dissipation unit of the present invention.

FIG. 2 is a schematic cross-sectional view of the assembly of the heat dissipation unit of the present invention.

3A is a schematic perspective view of the support structure of the present invention.

FIG. 3B is a schematic top view of FIG. 3A .

Description of reference numerals: support structure-1; carrier part-11; contact surface-111; bearing surface-112; spine-12; free end-121; fixed end-122; pin post-123; channel-14; Heat dissipation unit-2; upper plate-21; lower plate-22; chamber-23; capillary structure-24; condensation side-25; evaporation side-26.

Detailed ways

The above object of the present invention and its structural and functional characteristics will be described with reference to the preferred embodiments of the accompanying drawings.

The present invention provides a support structure for a heat dissipation unit, please refer to FIG. 1 and FIG. 2 . The support structure 1 is suitable for use in a heat dissipation unit 2. The heat dissipation unit 2 is, for example, a temperature equalizing plate, a hot plate, a flat heat pipe or a water cooling plate. In this embodiment, the heat dissipation unit 2 is described as a temperature equalizing plate. But not limited to this.

The heat dissipation unit 2 includes an upper plate 21 and a lower plate 22. The upper plate 21 and the lower plate 22 cover together to define a chamber 23, and the chamber 23 is filled with a working fluid (such as pure water or inorganic compounds, alcohols, liquid metals, refrigerants, organic compounds or mixtures), and the inner wall of the chamber 23 is provided with a capillary structure 24, the capillary structure 24 is any one of powder sintered body, groove, mesh body, fiber body and braided body In this embodiment, the capillary structure 24 is selected as a powder sintered body formed on the inner sides of the upper plate 21 and the lower plate 22 in the chamber 23 . And the upper plate 21 and the lower plate 22 respectively form a condensation side (condensation area) 25 and an evaporation side (evaporation area) 26, and the outer side of the lower plate 22 of the evaporation side 26 is in indirect or direct contact with a heating element (such as CPUs, display adapter chips, north-south bridge chips, or other electronic components (such as transistors) to absorb heat from this heat-generating component.

2, 3A, and 3B, the aforementioned support structure 1 in this embodiment is a plurality of support structures 1 disposed in the cavity 23 of the heat dissipation unit 2, which can not only serve as a support function, but also provide better capillary strength and high permeability. However, the number of the supporting structures 1 of the present invention is not limited to the number in the drawings. During the specific implementation, the user can adjust and design the number of the supporting structures 1 according to the required supporting strength and power of the cooling unit 2 .

As described in more detail later, each support structure 1 is made of a metal material with high thermal conductivity, such as a columnar body of copper, silver, aluminum or alloys of the former. And the support structure 1 has a carrier portion 11 and a spine portion 12 .

The carrier portion 11 has a contact surface 111 and a bearing surface 112 respectively disposed on both sides of the carrier portion 11 . The contact surface 111 of the carrier portion 11 (ie, one end of the aforementioned support structure 1 ) is in contact with the heat dissipation unit 2 The condensation side 25 or the evaporation side 26, in this embodiment, the contact surface 111 of the carrier part 11 is connected to the inner side of the upper plate 21 of the chamber 23 and is connected to the adjacent capillary structure 24, and the carrier part 11 carries The surface 112 is provided with the spine-shaped portion 12 composed of a plurality of needle columns 123 arranged in an array, that is, the plurality of needle columns 123 of the spine-shaped portion 12 are distributed in the carrier portion 11 in a staggered array or a side-by-side array. on the bearing surface 112 . In addition, referring to FIG. 3B , in this embodiment, the cross section of the carrier portion 11 is a circular block, but it is not limited to this, and can also be a rectangular or polygonal block (sheet or column).

The spine-shaped portion 12 is integrally or non-integrally provided on the bearing surface 112 of the carrier portion 11 . In this embodiment, the plurality of needle posts 123 of the spine-shaped portion 12 are fin posts and are integrally formed (generated) on the carrier portion 111 . bearing surface 112. The spine-shaped portion 12 has a free end 121 and a fixed end 122 respectively disposed at both ends of the spine-shaped portion 12 , and the fixed end 122 is fixed on the bearing surface 112 of the carrier portion 11 and is located adjacent to the bearing surface 112 . On the condensation side 25 or the evaporation side 26, the free end 121 (ie the other end of the aforementioned support structure 1) protrudes outward from the carrier portion 11 to contact (not contact) adjacent to the evaporation side 26 or the condensation side 25, In this embodiment, the free end 121 of the spine 12 (ie, the free ends of the plurality of needle posts 123 ) is connected to the inner side of the lower plate 22 of the chamber 23 on the evaporation side 26 and is connected to the adjacent capillary structure 24 . The cross-sections of the plurality of needle posts 123 of the spine-shaped portion 12 in this embodiment are illustrated as circular copper cylinders, but not limited thereto, and may also be rectangular, triangular or polygonal cylinders (sheets). In addition, the carrier portion 11 and the spine-shaped portion 12 are also made of metal material with high thermal conductivity.

The plurality of needle posts 123 of the spine-shaped portion 12 are spaced apart from each other, so there is a gap between each two needle posts 123 to form a channel 14 that communicates with the cavity 23 of the heat dissipation unit 2 and is supported by the carrier portion 11 The width of each channel 14 on the surface 112 is 0.1 mm (mm) to 0.25 mm (mm), and the widths of the channels 14 between the plurality of pin posts 123 are the same or different, for example, the width of the plurality of pin posts 123 The channels 14 are arranged on the bearing surface 112 of the carrier portion 11 with equidistant widths, or the channels 14 of the plurality of needle posts 123 are arranged on the bearing surface 112 of the carrier portion 11 with non-equidistant widths tapering outward or gradually widening. .

Specifically, in this embodiment, the plurality of needle posts 123 of the spine-shaped portion 12 are integrally formed on the carrier portion 111 by machining (wire cutting or CNC machining) or laser (laser) cutting. the surface 112, and the channel 14 between each two needle posts 123 has the same equidistant width (eg, 0.1 mm). In this way, the early evaporation of the working fluid on the evaporation side 26 of the heat dissipation unit 2 can be accelerated by the spine 12, and the channels 14 between the plurality of needle posts 123 have the effect of guiding (draining) the working fluid, just like It has the same capillary force to absorb the condensed working fluid, and the width of each channel 14 is designed in the range of 0.1mm (mm) to 0.25mm (mm) to obtain a better permeability, so that the working fluid of the liquid can be quickly returned to The evaporating side 26 accelerates the flow rate of the vapor-liquid circulation, thereby effectively improving the heat dissipation performance.

Referring back to FIG. 2, when the evaporation side 26 of the heat dissipation unit 2 absorbs the heat of the heating element, the working fluid on the capillary structure 24 in the evaporation side 26 will be heated and converted into a gaseous working fluid, so that the gaseous working fluid The fluid will flow rapidly in the chamber 23 and the channels 14 of the plurality of needle posts 123 toward the inner side of the upper plate 21 of the condensation side 25 . After the gaseous working fluid is condensed on the condensation side 25 and transformed into a liquid working fluid , the liquid working fluid of the capillary structure 24 on the inner side of the upper plate 21 will be quickly guided (drained) back to the evaporation side 26 by the spines 12 of the plurality of supporting structures 1 and the plurality of channels 14. The upper capillary structure 24 on the inner side of the lower plate 22 accelerates the vapor-liquid circulation of the working fluid in the chamber 23 of the heat dissipation unit 2, and keeps repeating the vapor-liquid circulation for heat dissipation, so as to improve the overall vapor-liquid circulation efficiency, and further achieve the Better soaking and soaking effect and prevent dry burning problem caused by the evaporation side 26 .

Although in this embodiment, the outer side of the upper plate 21 of the condensation side 25 of the heat dissipation unit 2 is not provided with a heat dissipation component. But not limited to this, in another embodiment, a heat dissipation fin group composed of a plurality of fins may be disposed on the outer side of the upper plate 21 of the condensation side 25 to increase the heat dissipation area.

Although the plurality of needle posts 123 of the spine portion 12 of each support structure 1 in this embodiment are provided on the carrier portion 11 . But not limited to this, in another alternative embodiment, the carrier portion 11 includes a plurality of microcarrier portions, and at least one pin post 123 is provided on the bearing surface of each microcarrier portion, and the plurality of microcarrier portions are combined with each other (eg, spliced together). , clipping or welding) together constitute the support structure 1 .

Although the plurality of supporting structures 1 in this embodiment are disposed upside down in the cavity 23 of the heat dissipation unit 2 (as shown in FIG. 2 ), the contact surface 111 of the carrier portion 11 and the free end 121 of the spine portion 12 are respectively connected to the The condensation side 25 and the evaporation side 26 of the heat dissipation unit 2 are in contact. But not limited to this, in other alternative embodiments, the plurality of support structures 1 are disposed in the cavity 23 of the heat dissipation unit 2 in an upright manner, so that the contact surface 111 of the carrier portion 11 and the free end 121 of the spine portion 12 are respectively Contact with the evaporation side 26 and the condensation side 25 of the heat dissipation unit 2, or a part of the support structures 1 of the plurality of support structures 1 is upright, and the other support structures 1 are inverted and staggered (distributed) in the chamber 23 of the heat dissipation unit 2 Inside.

The support structure 1 provided with the spines 12 and the channels 14 of the present invention is suitable for the design in the heat dissipation unit 2, so that it can effectively replace (replace) the traditional copper pillars with sintered capillary structures 24 or grooves, and not only can On the premise of increasing the volume, the overall weight of the support structure 1 can be reduced and the flow space of the vapor (ie, the gaseous working fluid) in the chamber 23 can be increased, which can further greatly accelerate the evaporation efficiency in the heat dissipation unit 2 and obtain the condensed energy. The liquid working fluid needs large capillary force and high permeability, so as to improve the overall heat dissipation performance.

The above description is only illustrative rather than restrictive for the present invention. Those skilled in the art understand that many modifications, changes or equivalents can be made without departing from the spirit and scope defined by the claims. All will fall within the protection scope of the present invention.

Claims (8)

1. A support structure for a heat dissipation unit, which is suitable for use in a heat dissipation unit, characterized in that: a condensation side and an evaporation side are respectively formed on both sides of the heat dissipation unit, and the condensation side and the evaporation side are respectively connected with the support structure. The two ends are in contact with each other, the supporting structure includes a carrier part and a spine-shaped part, the carrier part has a contact surface and a bearing surface, and the spine-shaped part is arranged on the bearing surface of the carrier part by a plurality of needle posts in an array , and the plurality of needle posts have gaps between each other to form a channel. 2 . The support structure of the heat dissipation unit according to claim 1 , wherein the plurality of pin posts are integrally or non-integrally provided on the bearing surface of the carrier portion. 3 . 3 . The support structure of the heat dissipation unit as claimed in claim 1 , wherein the plurality of pin posts are arranged on the bearing surface of the carrier portion at equal or non-equidistant intervals. 4 . 4 . The support structure of the heat dissipation unit as claimed in claim 1 , wherein the plurality of pin posts are arranged on the bearing surface of the carrier portion in a staggered array at intervals or a side-by-side array. 5 . 5 . The support structure of the heat dissipation unit as claimed in claim 1 , wherein the carrier portion and the spine-shaped portion are made of high thermal conductivity material. 6 . 6 . The support structure of the heat dissipation unit as claimed in claim 1 , wherein the heat dissipation unit is a uniform temperature plate, a hot plate, a flat heat pipe or a water cooling plate. 7 . 7 . The support structure of the heat dissipation unit according to claim 1 , wherein the widths of the channels between the plurality of pin posts are the same or different. 8 . 8 . The support structure of the heat dissipation unit as claimed in claim 1 , wherein the heat dissipation unit comprises an upper plate and a lower plate, and the upper plate and the lower plate cover together to define a cavity, and the cavity is filled with There is a working fluid, and the inner wall of the chamber is provided with a capillary structure, the spine-shaped portion has a free end, the free end extends outward from the carrier portion, and the free end of the spine-shaped portion is in contact with the carrier portion One of the surfaces is connected to the inner side of the lower plate or the upper plate, and the other is connected to the inner side of the upper plate or the lower plate, and the plurality of channels of the spine-shaped portion communicate with the chamber, the upper plate and the lower plate The condensation side and the evaporation side are respectively formed.

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