CN114916211A - Supporting structure of heat dissipation unit - Google Patents

Abstract

The invention relates to a supporting structure of a heat radiating unit, which is suitable for a heat radiating unit, wherein a condensation side and an evaporation side are respectively formed at two sides of the heat radiating unit and are respectively abutted against two ends of the supporting structure, the supporting structure comprises a carrier part and a spine part, the carrier part is provided with a contact surface and a bearing surface, the spine part is formed by arranging a plurality of pins on the bearing surface of the carrier part in an array manner, a gap is formed among the plurality of pins to form a channel, and vapor and liquid in the heat radiating unit can accelerate the circulation flow rate by virtue of the supporting structure with the spine part so as to greatly improve the heat radiating efficiency.

Description

Supporting structure of heat dissipation unit

Technical Field

The present invention relates to a heat dissipation unit, and more particularly, to a support structure for a heat dissipation unit.

Background

With the increasing development of science and technology, the power and efficiency of electronic products are increasingly improved, and more heat is generated during operation; if the heat is not dissipated in time and is accumulated on an electronic component (such as a processor or a graphics processor) inside the electronic product, the temperature of the electronic component is too high to affect the performance of the electronic component, and even serious, the electronic component is damaged due to malfunction. Therefore, various heat dissipation devices have been continuously developed to solve the problems of electronic components, and a vapor chamber is a common heat dissipation device.

Generally, in the conventional temperature equalization plate structure, an upper plate is covered on a lower plate and defines a cavity together, a working fluid (such as pure water) is filled in the cavity, a capillary structure and a plurality of support pillars are arranged in the cavity, two ends of the plurality of support pillars are respectively abutted to the inner sides of the upper plate and the lower plate in the cavity, the upper plate and the lower plate respectively form a condensation area and an evaporation area contacted with a heating element, the working fluid in the evaporation area is evaporated into vapor (i.e. gaseous working fluid) by the heat of the heating element and flows towards the condensation area, the vapor is condensed in the condensation area and then converted into liquid (i.e. liquid working fluid) and flows back to the evaporation area through the plurality of support pillars and gravity, and the vapor-liquid circulation heat dissipation is repeated.

However, the existing plural supporting columns are a solid copper column, which only has a supporting function and cannot provide a capillary force, so that the working fluid can only flow back to the evaporation zone from the condensation zone by gravity, and the backflow speed is too slow, which is easy to dry and burn the evaporation zone, resulting in poor heat transfer efficiency.

Therefore, the practitioner can improve the supporting column to have the supporting effect and the capillary force;

the improved support column with capillary force can be roughly divided into three types; in one design of the sintered support column formed by sintering the powder, the condensed liquid is refluxed to the evaporation area by the capillary force of the capillary structure on the sintered support column. Although the sintering support has capillary force, the problem is still extended, when the working fluid is at high temperature of 120 ℃, the steam pressure is 2kg/cm 2, and the pressure moving direction is irregular, because the top surface and the bottom surface of each sintering support column are irregular, the pulling force which can resist the bonding force between each sintering support column and the inner sides of the upper plate and the lower plate is 1kg/cm 2, each sintering support column cannot hold the upper plate and the lower plate to expand and bulge outwards, the temperature-equalizing plate is slightly bulged, and the temperature-equalizing plate is severely deformed to cause the problem of collapse and energy loss.

The other type of the supporting column is a design that a powder ring structure formed by sintering powder is sleeved on the periphery of a solid copper cylinder, and condensed liquid flows back to an evaporation area through the capillary force of the powder ring structure on the solid copper cylinder, so that the problem that the temperature equalizing plate is bulged due to the sintering of the supporting column is solved. However, since the total outer diameter width of each supporting pillar is the outer diameter width of the powder ring structure, the total volume of each supporting pillar is too large to occupy too much space in the cavity (which seriously affects the volume of the cavity), so that the steam flow channel is reduced, the movable range of the steam is also reduced (reduced) and the flow resistance is increased, thereby causing the problems of poor steam-liquid circulation and low heat dissipation efficiency.

The support column structure can solve the problem that the vapor passage of the temperature-equalizing plate bulge and the cavity is reduced, but the other problem extends, and the overall outer diameter of the solid copper column body in actual manufacturing needs to be more than 5 millimeters (mm), so that a method is provided for forming the plurality of grooves on the outer surface of the solid copper column body. The amount, size and depth of the grooves affect the capillary strength (i.e., capillary capacity), and the capillary force of the grooves is not strong enough, so that the amount of water brought back to the evaporation zone is limited, the amount of water returned is insufficient or cannot flow back to the evaporation zone, and further, no working fluid in the evaporation zone is dry (i.e., dry out), so that the problems of uniform heating and poor heat dissipation are caused.

Therefore, how to solve the problems and disadvantages of the supporting pillar structure in the vapor chamber is the direction in which the inventors of the present invention and related manufacturers engaged in the industry need to research and improve.

Disclosure of Invention

The main objective of the present invention is to provide a supporting structure of a spine portion composed of a plurality of pins instead of the conventional supporting structure with sintered capillary structure or grooves, so as to accelerate the vapor-liquid circulation flow rate and further effectively enhance the heat dissipation efficiency.

Another objective of the present invention is to provide a supporting structure of a heat dissipating unit, which has a better temperature uniformity and a better capillary ability, and can reduce the overall weight of the supporting structure and increase the heat dissipating area.

The present invention provides a supporting structure of a heat dissipating unit, which is suitable for a heat dissipating unit (such as a vapor chamber), wherein a condensing side and an evaporating side are formed on two sides of the heat dissipating unit respectively and are abutted against two ends of the supporting structure, the supporting structure comprises a carrier part and a spine part, the carrier part has a contact surface and a carrying surface, the spine part is formed by a plurality of pin columns arranged on the carrying surface of the carrier part in an array manner, and a gap is formed between the plurality of pin columns to form a channel, so that the supporting structure has a supporting effect, and can guide a working fluid condensed on the condensing side of the heat dissipating unit to the evaporating side by the arrangement of the spine part and the channel on the premise of not increasing the volume, thereby accelerating the vapor-liquid circulation rate and greatly improving the heat dissipating effect.

Drawings

Fig. 1 is a schematic perspective exploded view of a heat dissipation unit according to the present invention.

Fig. 2 is a schematic sectional view of the heat dissipating unit according to the present invention.

Fig. 3A is a perspective view of the support structure of the present invention.

Fig. 3B is a top view of fig. 3A.

The reference numbers illustrate: a support structure-1; a carrier portion-11; -111, a contact surface; a bearing surface-112; spine-12; a free end-121; a fixed end-122; a needle post-123; channel-14; a heat dissipation unit-2; an upper plate-21; a lower plate-22; a chamber-23; capillary structure-24; condenser side-25; evaporation side-26.

Detailed Description

The above objects, together with the structural and functional features thereof, are accomplished by the preferred embodiments according to the accompanying drawings.

The present invention provides a supporting structure of a heat dissipation unit, please refer to fig. 1 and fig. 2. The supporting structure 1 is suitable for use in a heat dissipating unit 2, the heat dissipating unit 2 is, for example, a temperature equalizing plate, a hot plate, a flat heat pipe, or a water cooling plate, and the heat dissipating unit 2 is illustrated as a temperature equalizing plate in this embodiment, but is not limited thereto.

The heat dissipating unit 2 includes an upper plate 21 and a lower plate 22, the upper plate 21 and the lower plate 22 are covered together to define a chamber 23, the chamber 23 is filled with a working fluid (such as pure water or inorganic compound, alcohol, liquid metal, refrigerant, organic compound or mixture), and a capillary structure 24 is disposed on an inner wall of the chamber 23, the capillary structure 24 is any one of a powder sintered body, a groove, a mesh, a fiber body and a woven body, in this embodiment, the capillary structure 24 is selected as a powder sintered body formed on inner sides of the upper plate 21 and the lower plate 22 in the chamber 23. The upper plate 21 and the lower plate 22 form a condensation side (condensation zone) 25 and an evaporation side (evaporation zone) 26, respectively, and the outer side of the lower plate 22 of the evaporation side 26 is indirectly or directly contacted with a heat generating component (such as a cpu, a display adapter chip, a north-south bridge chip or other electronic components (such as transistors)) to absorb heat on the heat generating component.

Referring to fig. 2, fig. 3A and fig. 3B, in the embodiment, the supporting structures 1 are a plurality of supporting structures 1 disposed in the chamber 23 of the heat dissipating unit 2, which not only can serve as a supporting function, but also can provide a better capillary force and high permeability. However, the number of the supporting structures 1 of the present invention is not limited to the number shown in the drawings, and in the specific implementation, a user can design and adjust the number of the supporting structures 1 according to the required supporting strength and power of the heat dissipating unit 2.

As will be described in more detail later, each support structure 1 is made of a metallic material having a high thermal conductivity, such as a columnar body of copper, silver, aluminum or an alloy thereof. The supporting structure 1 has a carrier portion 11 and a spine portion 12.

The carrier part 11 has a contact surface 111 and a carrying surface 112 respectively disposed on two sides of the carrier part 11, the contact surface 111 (i.e. one end of the support structure 1) of the carrier part 11 contacts the condensation side 25 or the evaporation side 26 of the heat dissipation unit 2, in this embodiment, the contact surface 111 of the carrier part 11 is connected to the inner side of the upper plate 21 contacting the cavity 23 and is connected to the adjacent capillary structure 24, and the carrying surface 112 of the carrier part 11 is disposed with the spine part 12 formed by a plurality of pins 123 arranged in an array, i.e. the plurality of pins 123 of the spine part 12 are distributed on the carrying surface 112 of the carrier part 11 in a staggered array or a side-by-side array. Referring to fig. 3B, the cross section of the carrier part 11 is a circular block, but the present invention is not limited thereto, and a rectangular or polygonal block (sheet or column) may be used.

The spine portion 12 is integrally or non-integrally disposed on the carrying surface 112 of the carrier portion 11, and in this embodiment, the plurality of pins 123 of the spine portion 12 are fins integrally formed (generated) on the carrying surface 112 of the carrier portion 111. The spine portion 12 has a free end 121 and a fixed end 122 respectively disposed at two ends of the spine portion 12, the fixed end 122 is fixed on the carrying surface 112 of the carrier portion 11 and located adjacent to the condensing side 25 or the evaporating side 26, the free end 121 (i.e. the other end of the supporting structure 1) protrudes from the carrier portion 11 to contact (not contact) the evaporating side 26 or the condensing side 25, in this embodiment, the free end 121 of the spine portion 12 (i.e. the free ends of the plurality of pins 123) is connected to the inner side of the lower plate 22 of the chamber 23 contacting the evaporating side 26 and is connected to the adjacent capillary structure 24. The cross section of the plurality of pins 123 of the spine portion 12 of the present embodiment is illustrated as a circular copper cylinder, but is not limited thereto, and may also be a rectangular, triangular or polygonal cylinder (sheet). The carrier portion 11 and the spine portion 12 are also made of a metal material having a high thermal conductivity.

The plurality of pins 123 of the spine portion 12 are spaced apart from each other, so that a gap is formed between each two pins 123 to form a channel 14 communicating with the cavity 23 of the heat dissipating unit 2, and the width of each channel 14 on the carrying surface 112 of the carrier portion 11 is 0.1mm (mm) to 0.25mm (mm), and the width of the channels 14 between the plurality of pins 123 is the same or different, for example, the channels 14 of the plurality of pins 123 are arranged on the carrying surface 112 of the carrier portion 11 in an equidistant width, or the channels 14 of the plurality of pins 123 are arranged on the carrying surface 112 of the carrier portion 11 in a non-equidistant width, and are tapered outwardly or gradually widened.

In detail, in the embodiment, the plurality of pins 123 of the spine portion 12 are integrally formed on the bearing surface 112 of the carrier portion 111 by machining (wire cutting or CNC machining) or laser (laser) cutting, and the channels 14 between every two pins 123 are equal in width (e.g. 0.1 mm). With such an arrangement, the ratchet portion 12 can accelerate the working fluid to evaporate earlier on the evaporation side 26 of the heat dissipation unit 2, and the channels 14 between the plurality of pins 123 have the function of guiding (guiding) the working fluid, as well as having the capillary action to draw the capillary force of the condensed working fluid, and the width of each channel 14 is designed within the range of 0.1mm (millimeter) to 0.25mm (millimeter), so as to obtain a better permeability to allow the working fluid to rapidly flow back to the evaporation side 26, thereby accelerating the vapor-liquid circulation flow rate, and effectively improving the heat dissipation efficiency.

Referring back to fig. 2, when the evaporation side 26 of the heat dissipation unit 2 absorbs the heat of the heat generating component, the working fluid on the capillary structure 24 in the evaporation side 26 is heated and transformed into a gaseous working fluid, so that the gaseous working fluid rapidly flows in the cavity 23 and the channels 14 of the plurality of pins 123 toward the inner side of the upper plate 21 of the condensation side 25, after the gaseous working fluid is condensed on the condensation side 25 and transformed into a liquid working fluid, the liquid working fluid on the capillary structure 24 on the inner side of the upper plate 21 is rapidly guided (drained) by the spine-shaped portions 12 of the plurality of support structures 1 and the plurality of channels 14 and is then transferred back to the capillary structure 24 on the inner side of the lower plate 22 of the evaporation side 26, thereby accelerating the vapor-liquid circulation of the working fluid in the cavity 23 of the heat dissipation unit 2, and heat dissipation is repeated without interrupting the vapor-liquid circulation, thereby improving the overall vapor-liquid circulation efficiency, further achieving better uniform heating and temperature equalization effects and preventing the evaporation side 26 from causing dry burning.

In this embodiment, no heat sink is provided on the outside of the upper plate 21 on the condensation side 25 of the heat dissipating unit 2. But not limited thereto, in another embodiment, a heat dissipating fin set composed of a plurality of fins may be disposed on the outer side of the upper plate 21 of the condensation side 25 to increase the heat dissipating area.

Although the plurality of pins 123 of the spine portion 12 of each supporting structure 1 of the present embodiment are disposed on the carrier portion 11. But not limited thereto, in another alternative embodiment, the carrier part 11 comprises a plurality of micro carrier parts, each of which has at least one pin 123 disposed on a carrying surface thereof, and the plurality of micro carrier parts are combined (e.g. spliced, clamped or welded) together to form the supporting structure 1.

Although the plurality of supporting structures 1 are disposed in the cavity 23 of the heat dissipating unit 2 in an inverted manner (see fig. 2), the contact surface 111 of the carrier portion 11 and the free end 121 of the spine portion 12 are respectively in contact with the condensation side 25 and the evaporation side 26 of the heat dissipating unit 2. But not limited thereto, in other alternative embodiments, the plurality of supporting structures 1 are disposed in the cavity 23 of the heat dissipating unit 2 in a manner of being disposed upright, such that the contact surface 111 of the carrier portion 11 and the free end 121 of the spine portion 12 are respectively in contact with the evaporation side 26 and the condensation side 25 of the heat dissipating unit 2, or a portion of the plurality of supporting structures 1 are disposed upright, and the other supporting structures 1 are disposed in the cavity 23 of the heat dissipating unit 2 in an inverted staggered manner.

The supporting structure 1 with the spine portion 12 and the channel 14 is suitable for the design in the heat dissipation unit 2, so that the traditional copper column with the sintered capillary structure 24 or the groove can be effectively replaced, the overall weight of the supporting structure 1 can be reduced and the flow space of vapor (namely gaseous working fluid) in the cavity 23 can be improved on the premise of increasing the volume, further the evaporation efficiency in the heat dissipation unit 2 can be greatly accelerated, and the large capillary force and high permeability required by obtaining the condensed liquid working fluid can be achieved, thereby achieving the purpose of improving the overall heat dissipation efficiency.

The foregoing description is intended to be illustrative rather than limiting, and it will be appreciated by those skilled in the art that many modifications, variations or equivalents may be made without departing from the spirit and scope of the invention as defined in the appended claims.

Claims (8)

1. The utility model provides a supporting structure of heat dissipation unit, is applicable to in the heat dissipation unit, its characterized in that: the two sides of the heat dissipation unit respectively form a condensation side and an evaporation side, the condensation side and the evaporation side are respectively abutted against two ends of the support structure, the support structure comprises a carrier part and a spine part, the carrier part is provided with a contact surface and a bearing surface, the spine part is formed by arranging a plurality of pins on the bearing surface of the carrier part in an array manner, and gaps are formed among the plurality of pins to form a channel.

2. The support structure of a heat dissipating unit according to claim 1, wherein: the plurality of pins are integrally or non-integrally disposed on the carrying surface of the carrier.

3. The support structure of a heat dissipating unit according to claim 1, wherein: the plurality of pins are arranged on the carrying surface of the carrier part at equal intervals or at non-equal intervals.

4. The support structure of a heat dissipating unit according to claim 1, wherein: the plurality of pins are arranged on the bearing surface of the carrier part in a staggered array or a side-by-side array.

5. The support structure of a heat dissipating unit according to claim 1, wherein: the carrier portion and the spine portion are made of a material with high thermal conductivity.

6. The support structure of a heat dissipating unit according to claim 1, wherein: the heat dissipation unit is a temperature equalization plate, a hot plate, a flat heat pipe or a water cooling plate.

7. The support structure of a heat dissipating unit according to claim 1, wherein: the width of the channels between the plurality of the needle columns is the same or different.

8. The support structure of a heat dissipating unit according to claim 1, wherein: the heat dissipation unit comprises an upper plate and a lower plate, the upper plate and the lower plate are covered together to define a cavity, a working fluid is filled in the cavity, a capillary structure is arranged on the inner wall of the cavity, the spine part is provided with a free end, the free end extends outwards from the carrier part, one of the contact surface of the spine part and the free end of the spine part is connected with the inner side of the lower plate or the upper plate, the other contact surface of the spine part is connected with the inner side of the upper plate or the lower plate, the plurality of channels of the spine part are communicated with the cavity, and the upper plate and the lower plate form the condensation side and the evaporation side respectively.

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