TWM634459U - Wireless transmission module - Google Patents

Abstract

A wireless transmission module corresponds to an electronic module and is configured to transmit a first signal, and the wireless transmission module includes a corresponding surface, a base assembly and a first coil. The corresponding surface faces the electronic module and is perpendicular to a main axis. The first coil is disposed on the base assembly. The first coil overlaps at least a portion of the base assembly when viewed along the main axis. The first coil overlaps at least a portion of the base assembly when viewed in a direction perpendicular to the main axis.

Description

Wireless transmission module

The present disclosure relates to a wireless transmission module, in particular to a wireless transmission module applied to wireless communication or wireless charging.

With the development of technology, many electronic devices (such as tablets or smart phones) now have the function of wireless charging. The user can place the electronic device on a wireless charging transmitter, so that the wireless charging receiver in the electronic device generates current by electromagnetic induction or electromagnetic resonance to charge the battery. Due to the convenience of wireless charging, electronic devices with wireless charging modules are gradually becoming popular with the public.

Generally speaking, a wireless charging module includes a magnetically permeable substrate carrying a coil. Wherein, when the coil is energized to operate in a wireless charging mode or a wireless communication mode, the magnetically permeable substrate can make the magnetic field lines emitted by the coil more concentrated to obtain better performance. However, the structure of the existing wireless charging (or communication) module and the winding method of the coil cannot meet various requirements for the wireless transmission module, such as better charging, communication performance and more miniaturized size.

Therefore, how to design a wireless transmission module that can meet various needs of users is a topic worth discussing and solving.

According to some embodiments of the present disclosure, the present disclosure provides a wireless transmission module corresponding to an electronic module and configured to transmit a first signal, and the wireless transmission module includes a corresponding surface, a base component and a first coil . The corresponding surface faces the electronic module and is perpendicular to a main axis. The first coil is disposed on the base component. When viewed along the main axis, the first coil overlaps at least a portion of the base assembly. When viewed along a direction perpendicular to the main axis, the first coil overlaps at least a portion of the base component.

According to some embodiments of the present disclosure, the base component includes a first magnetically permeable part having a first magnetically permeable material; the base component includes a plurality of first magnetically permeable elements; the base component includes iron; the base component includes silicon; the base component Including chromium element; the diameter of these first magnetically permeable elements is less than 0.05mm; the wireless transmission module further includes a first bonding element configured to connect to these first magnetically permeable elements; the first bonding element directly contacts these first magnetically permeable elements ; The first bonding element directly contacts the first coil; the first coil is fixedly connected to these first magnetic permeable elements via the first bonding element; the melting point of the first bonding element is higher than 70 degrees Celsius; the melting point of the first bonding element is lower than Celsius 400 degrees.

According to some embodiments of the present disclosure, when viewed along a first direction, the base component covers at least a portion of the first coil; the first direction is opposite to the direction in which the corresponding surface faces; the base component further includes: a support portion configured to support the first coil; and a covering part covering a part of the first coil. When viewed along a direction perpendicular to the main axis, the first coil is located between the support portion and the electronic module; when viewed along the main axis, the first coil overlaps with at least a part of the support portion; when viewed along the first direction , at least a part of the covering portion overlaps the first coil; when viewed along a direction perpendicular to the main axis, at least a portion of the covering portion overlaps the first coil; when viewed along a direction perpendicular to the main axis, on the main axis, the first The center of a coil is located between the covering part and the supporting part.

According to some embodiments of the present disclosure, the first coil includes: a first lead located on a first sidewall surface of the base component; and a reinforcing element disposed on the first lead. The first side wall surface is parallel to the main shaft; the first lead wire passes through one of the first openings on the first side wall surface; the first opening has a closed structure; the reinforcing element directly contacts the first opening; the reinforcing element has a non-metallic material; on the main shaft, the first The shortest distance between the coil and the corresponding surface is different from the shortest distance between the first lead and the corresponding surface; on the main axis, the shortest distance between the first coil and the corresponding surface is smaller than the shortest distance between the first lead and the corresponding surface; the base component further includes a first The base surface faces the electronic module; the first base surface is not parallel to the first side wall surface; the base component further includes a first structural strengthening portion configured to strengthen the mechanical structure of the base component; the first structural strengthening portion is located on the first base Between the surface and the first side wall surface; the surface of the first structure strengthening part is not parallel to the first base surface and the first side wall surface; the angle between the surface of the first structure strengthening part and the first base surface is greater than 15 degrees; the first structure The angle between the surface of the reinforcing part and the surface of the first side wall is greater than 15 degrees; the base component further includes a second base surface facing in the opposite direction from the first base surface; the base component further includes a second structural reinforcement configured to strengthen The mechanical structure of the base component; the second structural strengthening portion is located between the second base surface and the first side wall surface; the surface of the second structural strengthening portion is not parallel to the second base surface and the first side wall surface; the second structural strengthening portion The structure is different from that of the first structural reinforcement; the surface of the second structural reinforcement has a radius of curvature greater than 0.05 mm; when viewed along the main axis, the first structural reinforcement overlaps at least a portion of the second structural reinforcement; wireless The transmission module further includes a second coil disposed on the base component; the second coil is electrically independent from the first coil; one of the first coil and the second coil is configured to transmit the first signal, and the other is configured to A second signal is transmitted; when viewed along a direction perpendicular to the main axis, the second coil overlaps with at least a part of the first coil.

According to some embodiments of the present disclosure, the base assembly further includes a first base surface facing the electronic module; the base assembly further includes a second base surface facing in the opposite direction to the first base surface; the wireless transmission module further includes A second coil is arranged on the base component; the second coil is electrically independent from the first coil; the wireless transmission module further includes a first protection element, which is arranged on the first coil; the first protection element has a plate structure, directly Contacting the first base surface; the first protection element directly contacts the first coil; the first protection element directly contacts the second coil; the first protection element includes a first bonding portion configured to be connected to the first coil; the first bonding portion is connected to On the first base surface; the first connecting portion is followed by the covering portion; when viewed along a direction perpendicular to the main axis, the first coil is located between the support portion and the first protection element; the first protection element further includes a first body , and the first bonding portion is disposed on the first body; the first protection element further includes a second bonding portion configured to connect to a first external element; the first body is located between the first bonding portion and the second bonding portion ; The first external component is a housing of an electronic device; the base component further includes a first structural strengthening portion configured to strengthen the mechanical structure of the base component; when viewed along the main axis, the first protection component and the first structural reinforcement At least a part of the part overlaps; the first connection part is followed by the first structural strengthening part; the wireless transmission module further includes a second protection element, which is arranged on the second base surface; the second protection element has a plate structure; when along the vertical When viewed in the direction of the main axis, the support portion is located between the first coil and the second protection element; the second protection element includes a third connecting portion configured to be attached to the surface of the second base; the second protection element further includes a second The main body, and the third bonding part is arranged on the second body; the second protection element further includes a fourth bonding part configured to be connected to a second external element; the second body is located between the third bonding part and the fourth bonding part between; the second external component is a circuit component of the electronic device; the base component further includes a second structural strengthening portion configured to strengthen the mechanical structure of the base component; when viewed along the main axis, the second protection component and the second structural reinforcement At least a part of the portion overlaps; the third bonding portion is connected to the second structural strengthening portion; the first protection element directly contacts the second protection element; the first bonding portion is connected to the third bonding portion; the base component further includes: a first groove , located on the second substrate surface; a second groove located on the second substrate surface; and a third groove located on the second substrate surface. The third connecting portion corresponds to the first groove; the first groove extends to the first coil; when viewed along a direction perpendicular to the main axis, the first groove does not overlap with the first coil; when viewed along the main axis, The first groove overlaps at least a part of the first coil; when viewed along a direction perpendicular to the main axis, the second groove overlaps at least a part of the first coil; the second groove is located on the surface of the first substrate; the first and then part corresponds to the second groove; the third part corresponds to the second groove; on the main shaft, the maximum size of the first groove is different from the maximum size of the second groove; on the main shaft, the maximum size of the first groove The size is smaller than the maximum dimension of the second groove; when viewed along the direction perpendicular to the main axis, the third groove does not overlap with the second coil; when viewed along the main axis, the third groove and at least a part of the second coil overlapping; the third connecting portion corresponds to the third groove; on the main axis, the maximum dimension of the third groove is smaller than the maximum dimension of the second groove.

According to some embodiments of the present disclosure, the wireless transmission module further includes a first conductive element; the first coil is electrically connected to an external circuit through the first conductive element; the first conductive element has a plate structure; the first conductive element has a metal material ; At least a part of the first conductive element is buried and not exposed by the base assembly; a surface of a first external electrical connection part of the first conductive element is perpendicular or parallel to the main axis; the first external electrical connection part is configured to electrically connect the external circuit; a part of the first external electrical connection part is exposed from the base assembly; a surface of a first internal electrical connection part of the first conductive element is perpendicular or parallel to the main axis; the first internal electrical connection part is configured to electrically connect The first coil; the first internal electrical connection part is exposed from the base component; the wireless transmission module further includes a first reinforcing element directly contacting the first internal electrical connection part; a first wire of the first coil has a first Cross-section, the first conductive element has a second cross-section, and the first cross-section and the second cross-section have different structures; the first cross-section has a circular arc structure; the second cross-section has a polygonal structure; the wireless transmission module further includes: an electronic component, It is arranged on the base component; a second conductive element, and the electronic element is electrically connected to the external circuit through the second conductive element; and a third conductive element, and the second coil is electrically connected to the external circuit through the third conductive element. The second conductive element has a plate structure; the second conductive element has a metal material; at least a part of the second conductive element is buried and is not exposed by the base component; a surface of a second external electrical connection part of the second conductive element is perpendicular to the main axis or parallel; the second external electrical connection part is configured to electrically connect the external circuit; the second external electrical connection part is exposed from the base assembly; the surface of the first external electrical connection part is parallel to the surface of the second external electrical connection part The surface of the first external electrical connection part is coplanar with the surface of the second external electrical connection part; one surface of the first external electrical connection part facing the first coil and the first internal electrical connection part face the second The surface of a coil is located in different planes; a surface of a second internal electrical connection part of the second conductive element is perpendicular or parallel to the main axis; the second internal electrical connection part is configured to electrically connect electronic components; the second internal electrical connection The connection part is exposed from the base component; the second conductive element has a second cross section, and the second cross section has a polygonal structure; the surface of the first internal electrical connection part is parallel to the surface of the second internal electrical connection part; the first internal electrical connection part The surface of the connection part is coplanar with the surface of the second internal electrical connection part; the third conductive element has a plate structure; the third conductive element has a metal material; at least a part of the third conductive element is buried and is not exposed by the base component; the third A surface of one of the third external electrical connection parts of the conductive element is perpendicular to or parallel to the main axis; the third external electrical connection part is configured to be electrically connected to an external circuit; the third external electrical connection part is exposed from the base component; the third conductive A surface of one of the third internal electrical connection parts of the element is perpendicular or parallel to the main axis; the third internal electrical connection part is configured to electrically connect the second coil; the third internal electrical connection part is exposed from the base component; the third internal The surface of the electrical connection part is coplanar with the surface of the first internal electrical connection part; wherein the wireless transmission module further includes: a second reinforcement element, directly contacting the second internal electrical connection part; a third reinforcement element, directly contacting the third internal electrical connection part; and a fourth reinforcing element directly contacting the first external electrical connection part. The second reinforcing element has a non-metallic material; the third reinforcing element has a non-metallic material; the first reinforcing element and the fourth reinforcing element have an integrated structure; The first base surface; the wireless transmission module further includes a first protection element disposed on the first coil; the first protection element further includes an opening corresponding to the accommodating portion; when viewed along the first direction, the electronic element At least a part is exposed by the opening; at least a part of the first coil is exposed by the receiving part; on the main shaft, the maximum size of one of the first inductive body of the first coil is different from the maximum size of the base component; on the main shaft, the first inductive body The maximum size is smaller than the maximum size of the base component; on the main shaft, the maximum size of the first induction body is less than one-third of the maximum size of the base component.

According to some embodiments of the present disclosure, the wireless transmission module further includes a second coil disposed on the base component; the base component further includes: a first induction part corresponding to the first coil and having a first characteristic function; and a first characteristic function The two induction parts correspond to the second coil and have a second characteristic function. When viewed along the main axis, the first induction portion overlaps at least a part of the first coil; when viewed along the main axis, the second induction portion overlaps at least a portion of the second coil; corresponding to an electromagnetic wave of a first frequency, the second induction portion overlaps with at least a portion of the second coil; 1. The second characteristic function is different; the base component further includes a second magnetically permeable part, which has a different material from the first magnetically permeable part; when viewed along the main axis, the second magnetically permeable part is at least at least the same as the first coil or the second coil One overlaps; the first induction part covers a part of the first magnetic conduction part; the second induction part covers a part of the second magnetic conduction part; when viewed along the main axis, at least A part overlaps; when viewed along the direction perpendicular to the main axis, the second magnetically permeable part does not overlap with the first magnetically permeable part; on the main axis, the maximum size of the first inductive part is different from the maximum size of the second inductive part; one The external circuit includes an accommodation space configured to accommodate at least a part of the base assembly; the accommodation space has an opening structure; when viewed along a direction perpendicular to the main axis, the external circuit overlaps with at least a part of the base assembly; when viewed along the direction of the main axis , the external circuitry overlaps at least a portion of the base assembly.

According to some embodiments of the present disclosure, when viewed along a direction perpendicular to the main axis, the external circuit overlaps with at least a portion of the first magnetic conducting portion; when viewed along a direction perpendicular to the main axis, the external circuit overlaps at least part of the first coil A portion overlaps; when viewed along a direction perpendicular to the main axis, the external circuit overlaps at least a portion of the second coil; the base component defines a first overlapping portion, and when viewed along a direction perpendicular to the main axis, the external circuit overlaps with the second coil An overlapping portion overlaps; when viewed along the main axis, the external circuit does not overlap with the first overlapping portion; when viewed along the main axis, there is a gap between the first overlapping portion and the external circuit.

According to some embodiments of the present disclosure, when viewed along a direction perpendicular to the main axis, the external circuit does not overlap with the first coil; when viewed along the main axis, the external circuit does not overlap with the first coil; when viewed along the main axis, the external circuit does not overlap with the first coil; The external circuit overlaps at least a part of the second coil; when viewed along a direction perpendicular to the main axis, the external circuit overlaps at least a part of the second magnetically conductive part.

According to some embodiments of the present disclosure, the base component defines a first overlapping portion, a second overlapping portion, and a third overlapping portion; when viewed along a direction perpendicular to the main axis, the external circuit overlaps the first overlapping portion; When viewed along the main axis, the external circuit does not overlap with the first overlapping portion; when viewed along the main axis, the external circuit overlaps with the second overlapping portion; when viewed along a direction perpendicular to the main axis, the external circuit does not overlap with the second overlapping portion Overlap; when viewed along the main axis, the external circuit overlaps the third overlapping portion; when viewed along the direction perpendicular to the main axis, the external circuit does not overlap the third overlapping portion; when viewed along the direction perpendicular to the main axis, The external circuit is located between the second overlapping part and the third overlapping part; the first overlapping part, the second overlapping part and the third overlapping part have an integrated structure; the first overlapping part contacts the external circuit.

This disclosure proposes a wireless transmission module for transmitting energy or signals, including a base component and at least one coil. The coil is arranged in the base component, and the base component is composed of a plurality of magnetic permeable elements. After being heated and pressed, these magnetically permeable components are connected to each other, so that the base component forms a solid plate-like structure, and the coil can be firmly fixed in the base component.

Based on the design of the wireless transmission module disclosed in this disclosure, the coil can be fixed in the base component without using glue or tape, so the mechanical strength can be improved, the use efficiency can be improved, the charging efficiency can be improved, the heat dissipation efficiency can be improved, and the overall miniaturization can be achieved. Overall lightweight and reduce electromagnetic interference.

Many different implementation methods or examples are disclosed below to implement different features of the provided subject matter, and specific elements and embodiments of their arrangement are described below to illustrate the present disclosure. Of course, these examples are only for illustration, and do not limit the scope of the present disclosure. For example, it is mentioned in the specification that the first characteristic component is formed on the second characteristic component, which may include the embodiment that the first characteristic component is in direct contact with the second characteristic component, and may also be included in the first characteristic component Embodiments where there are additional features between the second feature, in other words, the first feature is not in direct contact with the second feature.

In addition, repeated symbols or symbols may be used in different embodiments, and these repetitions are only for the purpose of simply and clearly describing the present disclosure, and do not mean that there is a specific relationship between the different embodiments and/or structures discussed. Furthermore, forming on, connecting to, and/or coupling to another feature in this disclosure may include embodiments in which features are formed in direct contact, and may also include embodiments in which intervening features described above may be formed. Embodiments of additional features of features such that the aforementioned features may not be in direct contact. In addition, space-related terms may be used, such as "vertical", "above", "upper", "lower", "bottom" and similar words (such as "downwardly", "upwardly", etc. ), these spatially relative terms are used to facilitate the description of the relationship between one element or feature(s) and another element or feature(s) in the drawings, and these spatially relative terms are intended to cover different orientations of the device that includes the feature .

Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure belongs. It is understood that these terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning consistent with the background or context of the related art and the present disclosure, and not in an idealized or overly formal manner Interpretation, unless otherwise defined herein.

Furthermore, the ordinal numbers used in the description and the claims, such as "first", "second", etc., are used to modify the elements of the claims, which do not imply and represent that the requested elements have any previous ordinal numbers. It does not represent the order of a claimed element with another claimed element, or the order of the manufacturing method, and the use of equal ordinal numbers is only used to make a claimed element with a certain designation clear from another claimed element with the same designation. distinguish.

In addition, in some embodiments of the present disclosure, terms related to bonding and connection, such as "connection" and "interconnection", unless otherwise specified, may mean that two structures are in direct contact, or may also mean that two structures are not in direct contact. Contact, where other structures are placed between the two structures. And the terms about joining and connecting may also include the situation that both structures are movable, or both structures are fixed.

Please refer to FIG. 1 , which is a schematic cross-sectional view of a wireless transmission module 100 and an electronic module 200 according to an embodiment of the present disclosure. The wireless transmission module 100 is a wireless transmission module capable of transmitting energy or signals, and the electronic module 200 is, for example, an electronic device with a coil 202 . As shown in FIG. 1 , the wireless transmission module 100 corresponds to the electronic module 200 and is configured to transmit a first signal, wherein the first signal can be, for example, a charging signal. In this embodiment, the wireless transmission module 100 may include a base component 102 and a first coil 104 , and the first coil 104 is disposed on the base component 102 .

In this embodiment, the first coil 104 can be used as a charging coil for wirelessly charging an external device. For example, the first coil 104 can be used as a resonant charging coil based on the standard of the Alliance for Wireless Power (A4WP), but is not limited thereto. In addition, the first coil 104 can be based on the standard of the Wireless Power Consortium (WPC), such as the Qi standard, so as to be an inductive charging coil. Therefore, this embodiment enables the first coil 104 to correspond to different charging modes at the same time, so as to increase the applicable range. For example, in short distance (for example, less than 1cm), use inductive operation; and in long distance, use resonance operation.

In this embodiment, the first coil 104 can also be used as a communication coil, such as operating in near field communication (Near Field Communication, NFC) mode, to communicate with external electronic devices (such as the coil 202 of the electronic module 200) .

As shown in FIG. 1 , the wireless transmission module 100 may define a corresponding surface ICS facing the electronic module 200 and perpendicular to a main axis AX. The main axis AX is, for example, the winding axis of the first coil 104 , but is not limited thereto. When viewed along the axis AX, the first coil 104 overlaps at least a portion of the base assembly 102 . When viewed along a direction perpendicular to the main axis AX, the first coil 104 overlaps at least a portion of the base component 102 .

The base assembly 102 may include a first base surface 102S1 and a second base surface 102S2, the first base surface 102S1 faces the electronic module 200, and the first base surface 102S1 and the second base surface 102S2 face different directions. In this embodiment, the corresponding surface ICS is an imaginary surface completely overlapping the first substrate surface 102S1 (plane). It should be noted that when the first substrate surface 102S1 is non-planar, the corresponding surface ICS is correspondingly non-planar, such as a curved surface.

Please refer to FIG. 1 and FIG. 2 . FIG. 2 is an enlarged view of the structure of the base component 102 according to an embodiment of the present disclosure before being pressurized and heated. In this embodiment, the base component 102 includes a first magnetically permeable portion 1021 having a first magnetically permeable material. For example, the first magnetically permeable material may include iron, silicon or chromium. That is, the base component 102 may include iron, the base component 102 may include silicon, and the base component 102 may include chromium.

As shown in FIG. 2 , the first magnetically permeable portion 1021 of the base component 102 includes a plurality of first magnetically permeable elements MCE1 , wherein the first magnetically permeable elements MCE1 may be in the form of powder or sheet. The maximum diameter of these first magnetic permeable elements MCE1 is less than 0.05mm. Furthermore, the wireless transmission module 100 further includes a first connecting element AE1 configured to connect the first magnetically permeable elements MCE1. Specifically, as shown in FIG. 2 , each first magnetically permeable element MCE1 is surrounded by a first bonding element AE1 .

Next, please refer to FIG. 2 and FIG. 3 . FIG. 3 is an enlarged view of the structure of the base component 102 according to an embodiment of the present disclosure after being pressurized and heated. As shown in FIG. 3 , after being pressurized and heated, the first bonding element AE1 will be melted to connect the first magnetic permeable elements MCE1 together. That is, the first connecting element AE1 is in direct contact with the first magnetic permeable elements MCE1 .

Moreover, the melted first bonding element AE1 will also directly contact the first coil 104 , so that the first coil 104 is fixedly connected to the first magnetic permeable elements MCE1 via the first bonding element AE1 . In this embodiment, the melting point of the first bonding element AE1 is higher than 70 degrees Celsius, and the melting point of the first bonding element AE1 is lower than 400 degrees Celsius, but it is not limited thereto.

In addition, in this embodiment, the base component 102 may further include a second magnetically permeable part 1022 connected to the first magnetically permeable part 1021 , and the second magnetically permeable part 1022 and the first magnetically permeable part 1021 have different materials. For example, the second magnetically permeable portion 1022 is composed of a plurality of second magnetically permeable elements of different materials. For example, the first magnetically permeable element can be made of iron, and the second magnetically permeable element can be made of chromium. Similar to the first magnetically permeable part 1021, these second magnetically permeable elements can be connected by a second connecting element, so the configuration thereof will not be described in detail.

As shown in FIG. 1 , when viewed along a first direction D1 , the base component 102 covers at least a part of the first coil 104 . Wherein, the first direction D1 is opposite to a direction D2 facing the corresponding surface ICS. The base assembly 102 may include at least one supporting portion STP and at least one covering portion CVP. The supporting part STP is configured to support the first coil 104 , and the covering part CVP is configured to cover a part of the first coil 104 .

When viewed along a direction perpendicular to the main axis AX (eg, the Y axis), the first coil 104 is located between the support portion STP and the electronic module 200 . When viewed along the main axis AX, the first coil 104 overlaps with at least a portion of the support portion STP.

When viewed along the first direction D1 , at least a portion of the covering portion CVP overlaps with the first coil 104 . When viewed along a direction perpendicular to the main axis AX (for example, the X axis), at least a part of the covering portion CVP overlaps the first coil 104 . When viewed along a direction perpendicular to the main axis AX, on the main axis AX, the center 104C of the first coil 104 is located between the covering portion CVP and the supporting portion STP.

Please refer to FIG. 4 and FIG. 5. FIG. 4 is a schematic cross-sectional view of a wireless transmission module 100A according to another embodiment of the present disclosure, and FIG. 5 is a schematic diagram of a wireless transmission module 100A according to another embodiment of the present disclosure. Side view. Similar to the foregoing embodiments, the wireless transmission module 100A has a first magnetically conductive portion 1021 and a second magnetically conductive portion 1022 .

As shown in FIG. 4 , the second magnetically permeable part 1022 has a U-shaped structure and surrounds the first magnetically permeable part 1021 . Moreover, the wireless transmission module 100A of this embodiment further includes a second coil 106 disposed in the second magnetically conductive portion 1022 of the base component 102 . When viewed along a direction perpendicular to the main axis AX, the second magnetically permeable portion 1022 overlaps at least a part of the first magnetically permeable portion 1021 .

In this embodiment, the first coil 104 includes a first lead WR1 and a reinforcement element GU, and the second coil 106 includes a second lead WR2. The first lead WR1 and the second lead WR2 are located on a first sidewall surface 102S3 of the base assembly 102 , and the reinforcing element GU is disposed on the first lead WR1 and the second lead WR2 .

The first side wall surface 102S3 is parallel to the main axis AX. The first lead WR1 passes through a first opening OP1 of the first sidewall surface 102S3 , and the second lead WR2 passes through a second opening OP2 of the first sidewall surface 102S3 . The first opening OP1 and the second opening OP2 have a closed structure. That is, as shown in FIG. 5 , the contours of the first opening OP1 and the second opening OP2 are closed.

In this embodiment, the reinforcing element GU directly contacts the first opening OP1 and the second opening OP2. The reinforcing element GU has a non-metallic material, and the reinforcing element GU is, for example, glue, but not limited thereto. The reinforcing element GU can avoid the problem that the first lead WR1 and the second lead WR2 are easily broken.

As shown in FIG. 4 , on the main axis AX, the shortest distance between the first coil 104 and the corresponding surface ICS is different from the shortest distance between the first lead WR1 and the corresponding surface ICS. For example, on the main axis AX, the shortest distance between the first coil 104 and the corresponding surface ICS is smaller than the shortest distance between the first lead WR1 and the corresponding surface ICS.

Similarly, the base assembly 102 includes a first base surface 102S1 facing an electronic module (not shown in the figure), and the first base surface 102S1 is not parallel to the first sidewall surface 102S3 .

Furthermore, the base component 102 may further include at least one first structural reinforcing portion 1023 configured to strengthen the mechanical structure of the base component 102 . The first structural strengthening portion 1023 is located between the first base surface 102S1 and the first sidewall surface 102S3 . The first structural strengthening portion 1023 is, for example, a surface (slope), which is not parallel to the first base surface 102S1 and the first sidewall surface 102S3 .

In this embodiment, the angle between the surface of the first structural reinforcement 1023 and the first base surface 102S1 is greater than 15 degrees, and the angle between the surface of the first structural reinforcement 1023 and the first sidewall surface 102S3 is greater than 15 degrees, but not limited to this. In other embodiments, the first structural strengthening portion 1023 is, for example, a curved surface with a radius of curvature greater than 0.05 mm.

Similarly, the second base surface 102S2 and the first base surface 102S1 face in opposite directions. Furthermore, the base component 102 may further include at least one second structural reinforcing portion 1024 configured to strengthen the mechanical structure of the base component 102 . The second structural reinforcement 1024 is located between the second base surface 102S2 and the first sidewall surface 102S3.

The surface of the second structural strengthening portion 1024 is not parallel to the second base surface 102S2 and the first sidewall surface 102S3 . When viewed along the axis AX, the first structural reinforcement 1023 overlaps at least a portion of the second structural reinforcement 1024 .

In this embodiment, the structure of the second structural strengthening part 1024 is different from that of the first structural strengthening part 1023 . Specifically, the surface of the second structural strengthening portion 1024 is a curved surface with a radius of curvature greater than 0.05 mm, but not limited thereto. In other embodiments, the second structural strengthening portion 1024 can also be a plane, and the angle between the plane and the second base surface 102S2 and the angle between the plane and the first side wall surface 102S3 are both greater than 15 degrees.

In this embodiment, the second coil 106 is electrically independent from the first coil 104 . One of the first coil 104 and the second coil 106 is configured to transmit a first signal (such as a charging signal), and the other is configured to transmit a second signal (such as a communication signal). When viewed along a direction perpendicular to the main axis AX (eg, the X axis), the second coil 106 overlaps at least a portion of the first coil 104 .

Next, please refer to FIG. 6 . FIG. 6 is a schematic cross-sectional view of a wireless transmission module 100B according to another embodiment of the present disclosure. In this embodiment, the wireless transmission module 100B may further include a first protection element 110 disposed on the first coil 104 and the second coil 106 . The first protection element 110 may be double-sided tape, such as polyethylene terephthalate (PET), but not limited thereto.

The first protection element 110 has a plate structure and directly contacts the first base surface 102S1. The first protective element 110 directly contacts the first coil 104 as well as the second coil 106 . The first protection element 110 may include a first connecting portion 112 configured to be connected to the first coil 104 and the second coil 106 .

Furthermore, the first bonding portion 112 is connected to the first base surface 102S1 , and the first bonding portion 112 is connected to the covering portion CVP. When viewed along a direction perpendicular to the main axis AX, the first coil 104 is located between the support portion STP and the first protection element 110 .

The first protection element 110 further includes a first body 111 , and the first bonding portion 112 is disposed on the first body 111 . The first protection element 110 further includes a second connecting portion 113 configured to be connected to a first external element (not shown in the figure). The first body 111 is located between the first connecting portion 112 and the second connecting portion 113 , and the first external component is a casing of an electronic device. The electronic device can be, for example, a smart phone, and the casing is, for example, the back cover of the smart phone, but is not limited thereto.

Similar to the foregoing embodiments, the base component 102 also includes a first structural reinforcing portion 1023 configured to strengthen the mechanical structure of the base component 102 . When viewed along the main axis AX, the first protective element 110 overlaps at least a portion of the first structural reinforcement 1023 . For example, the first bonding portion 112 is connected to the first structural strengthening portion 1023 .

Furthermore, the wireless transmission module 100 may further include a second protection element 120 disposed on the second base surface 102S2. Similar to the first protection member 110, the second protection member 120 has a plate-like structure. When viewed along a direction perpendicular to the main axis AX, the support portion STP is located between the first coil 104 and the second protection element 120 .

The second protection element 120 includes a third bonding portion 122 configured to be bonded to the second base surface 102S2. The second protection element 120 further includes a second body 121 , and the third connecting portion 122 is disposed on the second body 121 . The second protection element 120 further includes a fourth bonding portion 123 configured to be bonded to a second external element, and the second body 121 is located between the third bonding portion 122 and the fourth bonding portion 123 .

The second external component is a circuit component of the electronic device. For example, the electronic device is a smart phone, and the circuit component can be a circuit board of the smart phone, but not limited thereto.

Similarly, the base component 102 also includes a second structural strengthening portion 1024 configured to strengthen the mechanical structure of the base component 102 . When viewed along the axis AX, the second protective element 120 overlaps at least a portion of the second structural reinforcement 1024 . For example, the third bonding portion 122 is connected to the second structure reinforcing portion 1024 .

It should be noted that in this embodiment, the first protection element 110 directly contacts the second protection element 120 . Specifically, the first bonding portion 112 is connected to the third bonding portion 122 .

In addition, in this embodiment, the base component 102 may further include at least one first trench TR1 , at least one second trench TR2 and at least one third trench TR3 . The first trench TR1 is located on the second substrate surface 102S2 , the second trench TR2 is located on the second substrate surface 102S2 , and the third trench TR3 is located on the second substrate surface 102S2 .

As shown in FIG. 6 , the third bonding portion 122 corresponds to the first trench TR1 , and the first trench TR1 extends to the first coil 104 . When viewed along a direction perpendicular to the main axis AX, the first trench TR1 does not overlap with the first coil 104 . When viewed along the main axis AX, the first trench TR1 overlaps at least a portion of the first coil 104 .

When viewed along a direction perpendicular to the main axis AX, the second trench TR2 overlaps at least a portion of the first coil 104 . The second trench TR2 is located on the first substrate surface 102S1 , the first bonding portion 112 corresponds to the second trench TR2 , and the third bonding portion 122 corresponds to the second trench TR2 . Specifically, the first bonding portion 112 and the third bonding portion 122 are configured to adhere to the first magnetic permeable portion 1021 on both sides of the second trench TR2.

On the main axis AX, the maximum dimension of the first trench TR1 is different from the maximum dimension of the second trench TR2. For example, on the main axis AX, the maximum dimension of the first trench TR1 is smaller than the maximum dimension of the second trench TR2.

When viewed along the direction perpendicular to the main axis AX, the third trench TR3 does not overlap with the second coil 106 . When viewed along the main axis AX, the third trench TR3 overlaps with at least a portion of the second coil 106 . The third bonding portion 122 corresponds to the third trench TR3. On the main axis AX, the maximum dimension of the third trench TR3 is smaller than the maximum dimension of the second trench TR2.

Based on the structural design of the first trench TR1 , the second trench TR2 and the third trench TR3 in this embodiment, the heat dissipation efficiency of the base component 102 can be improved, and the base component 102 can also be made flexible.

Please refer to FIG. 7 , which is a schematic cross-sectional view of a wireless transmission module 100C according to another embodiment of the present disclosure. In this embodiment, the wireless transmission module 100C may further include at least one first conductive element 130 , and the first coil 104 is electrically connected to an external circuit through the first conductive element 130 . The external circuit is, for example, the circuit board of the aforementioned smart phone, but is not limited thereto.

As shown in FIG. 7 , the first conductive element 130 has a plate structure, and the first conductive element 130 has a metal material. At least a portion of the first conductive element 130 is buried and not exposed by the base assembly 102 .

Moreover, the surface of the first external electrical connection portion 131 of the first conductive element 130 is perpendicular or parallel to the main axis AX. For example, the surface 1311 is perpendicular to the axis AX. The first external electrical connection part 131 is configured to electrically connect the external circuit. A part (for example, the surface 1311 ) of the first external electrical connection portion 131 is exposed from the base assembly 102 .

Similarly, the surface of the first internal electrical connection portion 132 is perpendicular or parallel to the main axis AX. For example, surface 1322 is perpendicular to axis AX. The first internal electrical connection part 132 is configured to be electrically connected to the first coil 104 .

The first internal electrical connection part 132 is exposed from the base component 102 through a through hole PR1. Moreover, the wireless transmission module 100C may further include a first reinforcing element EF1 disposed in the through hole PR1 and directly contacting the first internal electrical connection portion 132 . The first reinforcement element EF1 can be, for example, glue, but not limited thereto.

As shown in FIG. 7 , the first wire 1041 of the first coil 104 has a first section, the first conductive element 130 has a second section, and the first section and the second section have different structures. For example, the first section has a circular arc structure, and the second section has a polygonal structure (rectangular structure).

In addition, it should be noted that in other embodiments, the base component 102 may not include the through hole PR1 , which means that the first internal electrical connection portion 132 is buried and not exposed by the base component 102 .

The wireless transmission module 100C further includes an electronic component 170 , at least one second conductive component 140 and at least one third conductive component 150 . The electronic component 170 can be, for example, a temperature sensor or a magnetic sensor, etc., and is disposed on the base component 102 . The electronic element 170 can be electrically connected to the external circuit through the second conductive element 140 , and the second coil 106 is electrically connected to the external circuit through the third conductive element 150 .

Similarly, the second conductive element 140 has a plate structure, and the second conductive element 140 has a metal material. At least a portion of the second conductive element 140 is buried and not exposed by the base assembly 102 .

Moreover, the surface of the second external electrical connection portion 141 of the second conductive element 140 is perpendicular or parallel to the main axis AX. For example, the surface 1411 is perpendicular to the axis AX. The second external electrical connection part 141 is configured to be electrically connected to an external circuit. A part (such as the surface 1411 ) of the second external electrical connection portion 141 is exposed from the base assembly 102 .

As shown in FIG. 7 , the surface 1311 of the first external electrical connection part 131 is parallel to the surface 1411 of the second external electrical connection part 141 . In this embodiment, the surface 1311 of the first external electrical connection part 131 is coplanar with the surface 1411 of the second external electrical connection part 141 .

In addition, the surface 1312 of the first external electrical connection portion 131 facing the first coil 104 and the surface 1322 of the first internal electrical connection portion 132 facing the first coil 104 are located on different planes.

As shown in FIG. 7 , the surface of the second internal electrical connection portion 142 of the second conductive element 140 is perpendicular or parallel to the main axis AX. For example, surface 1422 is perpendicular to axis AX. The second internal electrical connection portion 142 is configured to be electrically connected to the electronic component 170 , and the second internal electrical connection portion 142 is exposed from the base assembly 102 .

The second conductive element 140 has a second cross section, and the second cross section has a polygonal structure (rectangular structure). The surface 1322 of the first internal electrical connection part 132 is parallel to the surface 1422 of the second internal electrical connection part 142 . In this embodiment, the surface 1322 of the first internal electrical connection part 132 is coplanar with the surface 1422 of the second internal electrical connection part 142 .

Similarly, the third conductive element 150 has a plate structure, and the third conductive element 150 has a metal material. At least a portion of the third conductive element 150 is buried and not exposed by the base assembly 102 .

Furthermore, the surface of the third external electrical connection portion 151 of the third conductive element 150 is perpendicular or parallel to the main axis AX. For example, the surface 1511 is perpendicular to the axis AX. The third external electrical connection part 151 is configured to be electrically connected to an external circuit. A part (such as the surface 1511 ) of the third external electrical connection portion 151 is exposed from the base assembly 102 .

A surface of the third internal electrical connection portion 152 of the third conductive element 150 is perpendicular or parallel to the main axis AX, for example, the surface 1522 is perpendicular to the main axis AX. Furthermore, the third internal electrical connection part 152 is configured to electrically connect the second coil 106 . Specifically, a lead wire 1061 of the second coil 106 is configured to contact the surface 1522 of the third conductive element 150 . In addition, the surface 1522 of the third internal electrical connection part 152 is coplanar with the surface 1322 of the first internal electrical connection part 132 .

Similarly, the third internal electrical connection portion 152 can be exposed from the base assembly 102 through a through hole PR3. Furthermore, the wireless transmission module 100C may further include a third reinforcing element EF3 disposed in the through hole PR3 and directly contacting the third internal electrical connection portion 152 . The third reinforcement element EF3 can be, for example, glue, but not limited thereto.

Similarly, the second internal electrical connection portion 142 can be exposed from the base assembly 102 through a through hole PR2. Furthermore, the wireless transmission module 100C may further include a second reinforcing element EF2 disposed in the through hole PR2 and directly contacting the second internal electrical connection portion 142 . The second reinforcement element EF2 can be, for example, glue, but not limited thereto.

In addition, the wireless transmission module 100 may further include a fourth reinforcing element EF4 disposed on the bottom of the base component 102 and directly contacting the first external electrical connection portion 131 . Wherein, the second reinforcing element EF2 has a non-metallic material, the third reinforcing element EF3 has a non-metallic material, and the first reinforcing element EF1 and the fourth reinforcing element EF4 have an integrated structure.

As shown in FIG. 7 , the electronic component 170 is disposed on a receiving portion 102R of the base assembly 102 , and the receiving portion 102R has a recessed structure and is located on the first base surface 102S1 . The first protection element 110 further includes an opening 110H corresponding to the receiving portion 102R.

When viewed along the first direction D1, at least a portion of the electronic component 170 is exposed by the opening 110H. In addition, at least a part of the first coil 104 is exposed from the accommodation portion 102R. Specifically, the first coil 104 can be exposed from the side of the receiving portion 102R, so that the first coil 104 can be positioned by a mold (not shown in the figure).

On the main axis AX, the maximum size of the first inductive body 1040 of the first coil 104 (excluding the first wire 1041 ) is different from the maximum size of the base component 102 . On the axis AX, the maximum dimension of the first sensing body 1040 is smaller than the maximum dimension of the base assembly 102 . On the main axis AX, the maximum dimension of the first sensing body 1040 is less than one third of the maximum dimension of the base assembly 102 .

Next, please refer to FIG. 8 , which is a three-dimensional schematic diagram of a wireless transmission module 100D and an external circuit 300 according to another embodiment of the present disclosure. Similar to the foregoing embodiments, the base assembly 102 of the wireless transmission module 100D includes a first magnetically permeable portion 1021 and a second magnetically permeable portion 1022 , and the second magnetically permeable portion 1022 and the first magnetically permeable portion 1021 have different materials.

Please refer to FIG. 9 , which is a schematic cross-sectional view of a wireless transmission module 100D and an external circuit 300 according to another embodiment of the present disclosure. The external circuit 300 is, for example, the aforementioned circuit board, and the external circuit 300 may include a receiving space 300R configured to receive at least a part of the base assembly 102 . Specifically, the accommodating space 300R has an opening structure, and the second magnetic permeable part 1022 is disposed in the accommodating space 300R.

As shown in FIG. 9, the external circuit 300 overlaps at least a portion of the base assembly 102 when viewed along a direction perpendicular to the main axis AX. In addition, the external circuit 300 overlaps at least a part of the base unit 102 when viewed along the direction of the main axis AX (X-axis).

When viewed along a direction perpendicular to the main axis AX, the external circuit 300 does not overlap with the first coil 104 . The external circuit 300 does not overlap the first coil 104 when viewed along the main axis AX. The external circuit 300 overlaps at least a portion of the second coil 106 when viewed along the main axis AX. When viewed along the direction perpendicular to the main axis AX, the external circuit 300 overlaps with at least a part of the second magnetic permeable portion 1022 .

In this embodiment, the base component 102 may further include a first sensing portion ITP1 and a second sensing portion ITP2. The first induction part ITP1 corresponds to the first coil 104 and has a first characteristic function, and the second induction part ITP2 corresponds to the second coil 106 and has a second characteristic function. The first and second characteristic functions are the magnetic permeability function or the magnetic loss rate function and so on for a specific electromagnetic wave.

It should be noted that when corresponding to an electromagnetic wave of a specific frequency (the first frequency), the first and second characteristic functions will be different.

As shown in FIG. 9, when viewed along the main axis AX, the first induction part ITP1 overlaps at least a part of the first coil 104, and when viewed along the main axis AX, the second induction part ITP2 overlaps with the second coil 106. at least partially overlap.

When viewed along the main axis AX, the second magnetically conductive portion 1022 overlaps with at least one of the first coil 104 or the second coil 106 . For example, the second magnetically permeable part 1022 overlaps with the first coil 104 , and the second magnetically permeable part 1022 does not overlap with the second coil 106 .

In addition, as shown in FIG. 9 , in this embodiment, the first induction part ITP1 covers a part of the first magnetically permeable part 1021 , and the second induction part ITP2 covers a part of the first magnetically permeable part 1021 .

When viewed along the main axis AX, the second magnetically permeable part 1022 overlaps at least a part of the first magnetically permeable part 1021 , but is not limited thereto. In other embodiments, the second magnetically permeable part 1022 may not overlap the first magnetically permeable part 1021 . For example, the second magnetically permeable part 1022 can surround the first magnetically permeable part 1021 and be located on the same plane as the first magnetically permeable part 1021 .

In this embodiment, when viewed along the direction perpendicular to the main axis AX, the second magnetically permeable portion 1022 does not overlap the first magnetically permeable portion 1021 . Furthermore, on the main axis AX, the maximum size of the first sensing part ITP1 is different from the maximum size of the second sensing part ITP2. For example, the maximum size of the first sensing part ITP1 is larger than the maximum size of the second sensing part ITP2.

Next, please refer to FIG. 10 . FIG. 10 is a schematic cross-sectional view of a wireless transmission module 100E and an external circuit 300 according to another embodiment of the present disclosure. Similar to the foregoing embodiments, the base assembly 102 of the wireless transmission module 100E includes a first magnetically permeable portion 1021 and a second magnetically permeable portion 1022 , and the second magnetically permeable portion 1022 and the first magnetically permeable portion 1021 have different materials.

When viewed along the direction (X axis) perpendicular to the main axis AX, the external circuit 300 overlaps with at least a part of the first magnetic permeable portion 1021 . When viewed along a direction perpendicular to the main axis AX, the external circuit 300 overlaps at least a portion of the first coil 104 . When viewed along a direction perpendicular to the main axis AX, the external circuit 300 overlaps at least a portion of the second coil 106 .

In this embodiment, the base component 102 can define a first overlapping portion OVP1. When viewed along a direction perpendicular to the main axis AX, the external circuit 300 overlaps the first overlapping portion OVP1. When viewed along the main axis AX, the external circuit 300 does not overlap with the first overlapping portion OVP1.

When viewed along the main axis AX, there is a gap between the first overlapping portion OVP1 and the external circuit 300 . Based on this structural design, the efficiency of the operator in installing the wireless transmission module 100E can be increased.

Similarly, the base component 102 includes a first sensing portion ITP1 and a second sensing portion ITP2. In this embodiment, the first sensing part ITP1 covers a portion of the first magnetically permeable part 1021 , and the second sensing part ITP2 covers a part of the second magnetically permeable part 1022 .

Next, please refer to FIG. 11 , which is a schematic cross-sectional view of a wireless transmission module 100F and an external circuit 300 according to another embodiment of the present disclosure. Similar to the foregoing embodiments, the base assembly 102 of the wireless transmission module 100F includes a first magnetically permeable portion 1021 and a second magnetically permeable portion 1022 , and the second magnetically permeable portion 1022 and the first magnetically permeable portion 1021 have different materials.

As shown in FIG. 11 , the base component 102 defines a first overlapping portion OVP1 , a second overlapping portion OVP2 and a third overlapping portion OVP3 . When viewed along a direction (X-axis) perpendicular to the main axis AX, the external circuit 300 overlaps the first overlapping portion OVP1. When viewed along the main axis AX, the external circuit 300 does not overlap with the first overlapping portion OVP1.

The external circuit 300 overlaps the second overlapping portion OVP2 when viewed along the main axis AX. When viewed along the direction perpendicular to the main axis AX, the external circuit 300 does not overlap with the second overlapping portion OVP2.

When viewed along the main axis AX, the external circuit 300 overlaps with the third overlapping portion OVP3. When viewed along the direction perpendicular to the main axis AX, the external circuit 300 does not overlap with the third overlapping portion OVP3. When viewed along a direction perpendicular to the main axis AX, the external circuit 300 is located between the second overlapping portion OVP2 and the third overlapping portion OVP3.

In this embodiment, the first overlapping portion OVP1 , the second overlapping portion OVP2 and the third overlapping portion OVP3 have an integrally formed structure. That is, the first overlapping portion OVP1 , the second overlapping portion OVP2 and the third overlapping portion OVP3 do not need to be connected by means of adhesion or welding.

In addition, it should be noted that the first overlapping portion OVP1 of this embodiment will contact the external circuit 300 . Based on this structural design, it can be ensured that the wireless transmission module 100F can be tightly connected to the external circuit 300 .

This disclosure proposes a wireless transmission module for transmitting energy or signals, including a base component and at least one coil. The coil is arranged in the base component, and the base component is composed of a plurality of magnetic permeable elements. After being heated and pressed, these magnetically permeable components are connected to each other, so that the base component forms a solid plate-like structure, and the coil can be firmly fixed in the base component.

Based on the design of the wireless transmission module disclosed in this disclosure, the coil can be fixed in the base component without using glue or tape, so the mechanical strength can be improved, the use efficiency can be improved, the charging efficiency can be improved, the heat dissipation efficiency can be improved, and the overall miniaturization can be achieved. Overall lightweight and reduce electromagnetic interference.

The ordinal numbers in this specification and the scope of the patent application, such as "first", "second", "third", etc., have no sequential relationship with each other, and are only used to mark and distinguish between two The different elements of the name.

Although the embodiments of the present disclosure and their advantages have been disclosed above, it should be understood that those skilled in the art can make changes, substitutions and modifications without departing from the spirit and scope of the present disclosure. In addition, the protection scope of the present disclosure is not limited to the process, machine, manufacture, material composition, device, method and steps in the specific embodiments described in the specification, and anyone with ordinary knowledge in the technical field can learn from the content of the present disclosure It is understood that the current or future developed process, machine, manufacture, material composition, device, method and step can be used according to the present disclosure as long as it can perform substantially the same function or obtain substantially the same result in the embodiments described herein. Therefore, the protection scope of the present disclosure includes the above-mentioned process, machine, manufacture, composition of matter, device, method and steps. In addition, each patent application scope constitutes an individual embodiment, and the protection scope of the present disclosure also includes combinations of various patent application scopes and embodiments.

100: Wireless transmission module 100A~100F: wireless transmission module 102: Base components 1021: The first magnetic conduction part 1022: The second magnetic conduction part 1023: First Structure Strengthening Department 1024:Second Structural Strengthening Department 102R: Housing 102S1: first substrate surface 102S2: Second substrate surface 102S3: first side wall surface 104: the first coil 1040: The first induction body 1041: The first wire 104C: center 106: Second coil 1061: Lead 110: the first protection element 110H: opening 111: The first body 112: The first joint 113: The second joint 120: the second protection element 121: The second body 122: The third part 123: The fourth part 131: the first external electrical connection part 1311: surface 1312: surface 132: the first internal electrical connection part 1322: surface 140: second conductive element 141: the second external electrical connection part 1411: surface 142: the second internal electrical connection part 1422: surface 150: the third conductive element 151: the third external electrical connection part 1511: surface 152: The third internal electrical connection part 1522: surface 170: Electronic components 200: Electronic module 202: Coil 300: external circuit 300R: storage space AE1: the first connecting element AX:Spindle CVP: Coverage Department D1: the first direction D2: Direction EF1: First reinforcing element EF2: Second reinforcement element EF3: The third reinforcing element EF4: Fourth reinforcing element GU: Enhancement Element ICS: corresponding surface ITP1: the first induction part ITP2: The second induction part MCE1: The first magnetic permeable element OP1: first opening OP2: second opening OVP1: first overlapping part OVP2: Second Overlap OVP3: The third overlap PR1: Perforation PR2: Piercing PR3: Perforation STP: support part TR1: first groove TR2: second groove TR3: the third groove WR1: first lead WR2: Second lead X: X-axis Y: Y-axis Z: Z-axis

FIG. 1 is a schematic cross-sectional view of a wireless transmission module 100 and an electronic module 200 according to an embodiment of the present disclosure. FIG. 2 is an enlarged view of the structure of the base component 102 before being pressurized and heated according to an embodiment of the present disclosure. FIG. 3 is an enlarged view of the structure of the base component 102 after being pressurized and heated according to an embodiment of the present disclosure. FIG. 4 is a schematic cross-sectional view of a wireless transmission module 100A according to another embodiment of the present disclosure. FIG. 5 is a schematic side view of a wireless transmission module 100A according to another embodiment of the disclosure. FIG. 6 is a schematic cross-sectional view of a wireless transmission module 100B according to another embodiment of the disclosure. FIG. 7 is a schematic cross-sectional view of a wireless transmission module 100C according to another embodiment of the present disclosure. FIG. 8 is a three-dimensional schematic diagram of a wireless transmission module 100D and an external circuit 300 according to another embodiment of the present disclosure. FIG. 9 is a schematic cross-sectional view of a wireless transmission module 100D and an external circuit 300 according to another embodiment of the present disclosure. FIG. 10 is a schematic cross-sectional view of a wireless transmission module 100E and an external circuit 300 according to another embodiment of the present disclosure. FIG. 11 is a schematic cross-sectional view of a wireless transmission module 100F and an external circuit 300 according to another embodiment of the present disclosure.

100: Wireless transmission module

102: Base components

1021: The first magnetic conduction part

1022: The second magnetic conduction part

102S1: first substrate surface

102S2: Second substrate surface

104: the first coil

104C: center

200: Electronic module

202: Coil

AX:Spindle

CVP: Coverage Department

D1: the first direction

D2: Direction

ICS: corresponding surface

STP: support part

X: X-axis

Y: Y-axis

Z: Z-axis

Claims (10)

A wireless transmission module, corresponding to an electronic module and configured to transmit a first signal, and the wireless transmission module includes: a corresponding surface facing the electronic module and perpendicular to a main axis; a base component; and A first coil disposed on the base component; wherein when viewed along the main axis, the first coil overlaps with at least a portion of the base component; wherein when viewed along a direction perpendicular to the main axis, the first coil Overlaps at least a portion of the base component. The wireless transmission module as described in claim 1, wherein the base component includes a first magnetically permeable part having a first magnetically permeable material; the base component includes a plurality of first magnetically permeable elements; the base component includes iron ; the base component includes silicon; the base component includes chromium; the diameter of the first magnetically permeable elements is less than 0.05 mm; the wireless transmission module further includes a first bonding element configured to connect the first magnetically permeable elements element; the first connecting element directly contacts the first magnetically permeable elements; the first connecting element directly contacts the first coil; the first coil is fixedly connected to the first magnetically permeable elements via the first connecting element pieces; the melting point of the first bonding element is higher than 70 degrees Celsius; the melting point of the first bonding element is lower than 400 degrees Celsius. The wireless transmission module as claimed in claim 2, wherein when viewed along a first direction, the base component covers at least a part of the first coil; the first direction is opposite to the direction in which the corresponding surface faces; The base component further includes: a supporting part configured to support the first coil; and a covering part covering a part of the first coil; when viewed along a direction perpendicular to the main axis, the first coil is located on the support part and the electronic module; when viewed along the main axis, the first coil overlaps with at least a part of the supporting part; when viewed along the first direction, at least a part of the covering part overlaps with the first The coil overlaps; when viewed along the direction perpendicular to the main axis, at least a portion of the covering part overlaps the first coil; when viewed along the direction perpendicular to the main axis, on the main axis, the first coil The center is located between the covering part and the supporting part. The wireless transmission module as described in claim 3, wherein the first coil includes: A first lead, located on a first side wall surface of the base component; and a reinforcing element, disposed on the first lead; the first side wall surface is parallel to the main axis; the first lead passes through the first side wall surface A first opening; the first opening has a closed structure; the reinforcing element directly contacts the first opening; the reinforcing element has a non-metallic material; on the main axis, the shortest distance between the first coil and the corresponding surface is different from the The shortest distance between the first lead and the corresponding surface; on the main axis, the shortest distance between the first coil and the corresponding surface is smaller than the shortest distance between the first lead and the corresponding surface; the base component further includes a first base surface , facing the electronic module; the first base surface is not parallel to the first side wall surface; the base component further includes a first structural strengthening portion configured to strengthen the mechanical structure of the base component; the first structural strengthening portion Located between the first base surface and the first side wall surface; the surface of the first structural strengthening portion is not parallel to the first base surface and the first side wall surface; the surface of the first structural strengthening portion and the first The angle between the surface of the base is greater than 15 degrees; the angle between the surface of the first structural reinforcement and the surface of the first side wall is greater than 15 degrees; the base component further includes a second base surface facing the first base surface In the opposite direction; the base component further includes a second structural reinforcement configured to strengthen the mechanical structure of the base component; the second structural reinforcement is located between the second base surface and the first sidewall surface; the second structure The surface of the reinforced portion is not parallel to the second base surface and the first side wall surface; the structure of the second structurally reinforced portion is different from that of the first structurally reinforced portion; the surface of the second structurally reinforced portion has a thickness greater than 0.05mm radius of curvature; when viewed along the main axis, the first structural reinforcement overlaps at least a part of the second structural reinforcement; the wireless transmission module further includes a second coil disposed on the base component; the second The coil is electrically independent from the first coil; one of the first coil and the second coil is configured to transmit the first signal, and the other is configured to transmit a second signal; The second coil overlaps with at least a part of the first coil when viewed in the direction of . The wireless transmission module as described in claim 3, wherein the base component further includes a first base surface facing the electronic module; the base component further includes a second base surface facing the first base surface In the opposite direction; the wireless transmission module further includes a second coil disposed on the base component; The second coil is electrically independent from the first coil; the wireless transmission module further includes a first protection element disposed on the first coil; the first protection element has a plate-like structure and directly contacts the first base surface; the first protection element directly contacts the first coil; the first protection element directly contacts the second coil; the first protection element includes a first connection portion configured to be connected to the first coil; the first The bonding portion is connected to the first base surface; the first bonding portion is connected to the covering portion; when viewed along a direction perpendicular to the main axis, the first coil is located between the support portion and the first protection element; The first protection element further includes a first body, and the first bonding portion is disposed on the first body; the first protection element further includes a second bonding portion configured to be bonded to a first external element; The first body is located between the first connecting portion and the second connecting portion; the first external component is a casing of an electronic device; the base component further includes a first structural strengthening portion configured to strengthen the base component The mechanical structure; when viewed along the main axis, the first protective element overlaps with at least a part of the first structural strengthening part; the first bonding part is followed by the first structural strengthening part; the wireless transmission module further includes a The second protection element is arranged on the surface of the second substrate surface; the second protection element has a plate structure; when viewed along the direction perpendicular to the main axis, the support portion is located between the first coil and the second protection element; the second protection element includes a third The connecting portion is configured to be bonded to the second base surface; the second protection element further includes a second body, and the third bonding portion is disposed on the second body; the second protection element further includes a fourth bonding part, configured to be connected to a second external component; the second body is located between the third connecting part and the fourth connecting part; the second external component is a circuit component of the electronic device; the base component further includes A second structural reinforcement configured to reinforce the mechanical structure of the base component; when viewed along the main axis, the second protective element overlaps at least a portion of the second structural reinforcement; the third bonding portion follows the first Two structural strengthening parts; the first protection element directly contacts the second protection element; the first connection part is connected to the third connection part; the base component further includes: a first groove located on the second base surface; a second groove located on the second substrate surface; and A third groove, located on the second substrate surface; the third bonding portion corresponds to the first groove; the first groove extends to the first coil; when viewed along a direction perpendicular to the main axis, The first groove does not overlap the first coil; when viewed along the main axis, the first groove overlaps at least a portion of the first coil; when viewed along a direction perpendicular to the main axis, the first groove Two grooves overlap with at least a part of the first coil; the second groove is located on the surface of the first substrate; the first bonding portion corresponds to the second groove; the third bonding portion corresponds to the second groove ; on the principal axis, the maximum dimension of the first groove is different from the maximum dimension of the second groove; on the principal axis, the maximum dimension of the first groove is smaller than the maximum dimension of the second groove; when along When viewed in a direction perpendicular to the main axis, the third groove does not overlap with the second coil; when viewed along the main axis, the third groove overlaps with at least a portion of the second coil; the third next corresponding to the third groove; on the main axis, the maximum dimension of the third groove is smaller than the maximum dimension of the second groove Inch. The wireless transmission module as described in claim 2, wherein the wireless transmission module further includes a first conductive element; the first coil is electrically connected to an external circuit through the first conductive element; the first conductive element has a plate shape structure; the first conductive element has a metal material; at least a part of the first conductive element is buried and not exposed by the base component; a surface of a first external electrical connection part of the first conductive element is perpendicular to the main axis or Parallel; the first external electrical connection part is configured to electrically connect the external circuit; a part of the first external electrical connection part is exposed from the base component; a first internal electrical connection part of the first conductive element A surface is perpendicular or parallel to the main axis; the first internal electrical connection part is configured to electrically connect the first coil; the first internal electrical connection part is exposed from the base component; the wireless transmission module further includes a first A reinforcing element directly contacts the first internal electrical connection; a first wire of the first coil has a first cross section, the first conductive element has a second cross section, and the first cross section and the second The sections have different structures; the first section has a circular arc structure; the second section has a polygonal structure; The base assembly further includes a first base surface facing the electronic module; the wireless transmission module further includes a second coil disposed on the base assembly; the wireless transmission module further includes: an electronic component disposed on The base component; a second conductive element, and the electronic element is electrically connected to the external circuit through the second conductive element; and a third conductive element, and the second coil is electrically connected to the external circuit through the third conductive element circuit; the second conductive element has a plate structure; the second conductive element has a metal material; at least a part of the second conductive element is buried and is not exposed by the base component; a second external electrical connection of the second conductive element A surface of the portion is perpendicular or parallel to the main axis; the second external electrical connection portion is configured to electrically connect the external circuit; the second external electrical connection portion is exposed from the base assembly; the first external electrical connection portion The surface of the first external electrical connection part is parallel to the surface of the second external electrical connection part; the surface of the first external electrical connection part is coplanar with the surface of the second external electrical connection part; the first external electrical connection part A surface of the part facing the first coil and the surface of the first internal electrical connection part facing the first coil are located in different planes; a surface of a second internal electrical connection part of the second conductive element perpendicular to the axis Straight or parallel; the second internal electrical connection portion is configured to electrically connect the electronic component; the second internal electrical connection portion is exposed from the base component; the second conductive element has a second cross section, the second cross section Has a polygonal structure; the surface of the first internal electrical connection part is parallel to the surface of the second internal electrical connection part; the surface of the first internal electrical connection part is parallel to the surface of the second internal electrical connection part The surface is coplanar; the third conductive element has a plate structure; the third conductive element has a metal material; at least a part of the third conductive element is buried and is not exposed by the base component; a third outer portion of the third conductive element One surface of the electrical connection part is perpendicular to or parallel to the main axis; the third external electrical connection part is configured to electrically connect the external circuit; the third external electrical connection part is exposed from the base assembly; the third conductive element A surface of a third internal electrical connection part is perpendicular or parallel to the main axis; the third internal electrical connection part is configured to electrically connect the second coil; the third internal electrical connection part is exposed from the base assembly ; The surface of the third internal electrical connection part is coplanar with the surface of the first internal electrical connection part; wherein the wireless transmission module further includes: a second reinforcing element directly contacting the second internal electrical connection; a third reinforcing element directly contacting the third internal electrical connection; and a fourth reinforcing element directly contacting the first external electrical connection part; the second reinforcing element has a non-metallic material; the third reinforcing element has a non-metallic material; the first reinforcing element and the fourth reinforcing element have an integrally formed structure; the electronic component is arranged in a housing portion of the base component ; the accommodating part has a concave structure and is located on the surface of the first base; the wireless transmission module further includes a first protection element disposed on the first coil; the first protection element further includes an opening corresponding to the accommodating part; when viewed along a first direction, at least a part of the electronic component is exposed from the opening; at least a part of the first coil is exposed from the accommodating part; on the main shaft, a first induction of the first coil The maximum size of the body is different from the maximum size of the base component; on the main axis, the maximum size of the first sensing body is smaller than the maximum size of the base component; on the main axis, the maximum size of the first sensing body is smaller than the base one third of the maximum dimension of the component. The wireless transmission module as described in claim 2, wherein the wireless transmission module further includes a second coil disposed on the base component; the base component further includes: A first induction part corresponds to the first coil and has a first characteristic function; and a second induction part corresponds to the second coil and has a second characteristic function; when viewed along the main axis, the The first induction part overlaps at least a part of the first coil; when viewed along the main axis, the second induction part overlaps at least a part of the second coil; corresponding to an electromagnetic wave of a first frequency, the first, The second characteristic function is different; the base component further includes a second magnetically permeable part, which has a different material from the first magnetically permeable part; when viewed along the main axis, the second magnetically permeable part is different from the first coil or the At least one of the second coils overlaps; the first induction part covers a part of the first magnetic conduction part; the second induction part covers a part of the second magnetic conduction part; when viewed along the main axis, the second guide The magnetic portion overlaps at least a part of the first magnetic portion; when viewed along a direction perpendicular to the main axis, the second magnetic portion does not overlap with the first magnetic portion; on the main axis, the first induction portion the maximum size of which is different from the maximum size of the second sensing part; an external circuit includes a receiving space configured to accommodate at least a part of the base component; The accommodating space has an opening structure; when viewed along a direction perpendicular to the main axis, the external circuit overlaps at least a part of the base component; when viewed along the main axis, the external circuit overlaps at least part of the base component Some overlap. The wireless transmission module according to claim 7, wherein when viewed along a direction perpendicular to the main axis, the external circuit overlaps at least a part of the first magnetically conductive portion; when viewed along a direction perpendicular to the main axis , the external circuit overlaps at least a portion of the first coil; when viewed along a direction perpendicular to the main axis, the external circuit overlaps at least a portion of the second coil; the base component defines a first overlapping portion, and When viewed along a direction perpendicular to the main axis, the external circuit overlaps the first overlapping portion; when viewed along the main axis, the external circuit does not overlap the first overlapping portion; when viewed along the main axis , there is a gap between the first overlapping portion and the external circuit. The wireless transmission module as described in claim 7, wherein when viewed along a direction perpendicular to the main axis, the external circuit does not overlap with the first coil; when viewed along the main axis, the external circuit does not overlap with the second coil A coil does not overlap; when viewed along the main axis, the external circuit and at least a portion of the second coil Overlapping: when viewed along a direction perpendicular to the main axis, the external circuit overlaps at least a part of the second magnetically conductive portion. The wireless transmission module as claimed in claim 7, wherein the base component defines a first overlapping portion, a second overlapping portion, and a third overlapping portion; when viewed along a direction perpendicular to the main axis, the external circuit overlaps with the first overlapping portion; when viewed along the main axis, the external circuit does not overlap with the first overlapping portion; when viewed along the main axis, the external circuit overlaps with the second overlapping portion; when viewed along the main axis When viewed in a direction perpendicular to the main axis, the external circuit does not overlap with the second overlapping portion; when viewed along the main axis, the external circuit overlaps with the third overlapping portion; when viewed in a direction perpendicular to the main axis , the external circuit does not overlap with the third overlapping portion; when viewed along a direction perpendicular to the main axis, the external circuit is located between the second overlapping portion and the third overlapping portion; the first overlapping portion, The second overlapping portion and the third overlapping portion have integrally formed structures; the first overlapping portion contacts the external circuit.

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