JP3244723U - wireless transmission module - Google Patents

Abstract

An object of the present invention is to provide a wireless transmission module applied to wireless communication or wireless charging that can meet various needs of users. The invention is used to transmit energy or signals and includes an inductive board and a first circuit assembly mounted on the inductive board, the inductive board being electrically independent of the first circuit assembly. It is a wireless transmission module. [Selection diagram] Figure 2

Description

The present invention relates to a wireless transmission module, and particularly to a wireless transmission module applied to wireless communication or wireless charging.

With the development of technology, many electronic devices (eg, tablets or smartphones) now have the capability of wireless charging. A user can place an electronic device on the wireless charging transmitter and a wireless charging receiver within the electronic device uses electromagnetic induction or resonance to generate an electrical current to charge the battery. Due to the convenience of wireless charging, electronic devices having wireless charging modules are also becoming more popular.

Generally speaking, a wireless charging module includes one magnetically permeable substrate that supports a coil. When the coil is energized and operated in wireless charging mode or wireless communication mode, the magnetically permeable substrate can better concentrate the magnetic field lines from the coil and obtain better performance. However, the structure and coil winding method of existing wireless charging (or communication) modules cannot meet various requirements for wireless transmission modules, such as improving charging and communication performance, and reducing size.

Therefore, how to design a wireless transmission module that can meet the various needs of users is currently a problem to be explored and solved.

The present invention aims to provide a wireless transmission module applied to wireless communication or wireless charging that can meet various needs of users.

The present invention provides a wireless transmission module used to transmit energy or signals, including an inductive board and a first circuit assembly. A first circuit assembly is installed on the inductive board. The inductive board is electrically independent of the first circuit assembly.

According to some embodiments of the invention, a first circuit assembly has a body and at least one first lead and at least one second lead. The main body has a winding shaft. The extending direction of at least one first lead wire is not parallel to the winding axis. The extending direction of the at least one first lead wire is parallel to the extending direction of the at least one second lead wire. The guiding substrate has a plate-like structure. The guide substrate defines a plurality of receiving grooves configured to receive the body of the first circuit assembly. The guide substrate has a first surface, and these receiving grooves are formed by recessing the first surface. Each receiving groove has an inner concave surface configured to support a winding of the body. The guiding substrate further has a second side, the first side and the second side being located on opposite sides of the plate-like structure. The first surface is a plane. When viewed along the first direction perpendicular to the winding axis, the at least one first lead wire does not overlap the first surface. When viewed along the first direction, these inner concave surfaces are located between the first surface and the second surface. When viewed along the first direction, the distances between these inner concave surfaces and the first surface along the winding axis are equal.

According to some embodiments of the present invention, the guide substrate includes a first lead groove configured to accommodate at least one first lead. The guide substrate includes a second lead groove configured to receive at least one second lead. The first lead wire groove is formed by recessing the first surface inward along the direction of the winding axis. The second lead wire groove is formed by recessing the first surface inward along the direction of the winding axis. The first lead groove has a first support surface configured to support at least one first lead. The second lead groove has a second support surface configured to support at least one second lead. When viewed along the first direction, the first support surface and the second support surface are located between the first surface and the second surface. When viewed along the first direction, there is a first distance between the first surface and the second surface. When viewed along the first direction, there is a second distance between the first support surface and the second surface. There is a third distance between the first surface and the first support surface. The third distance is greater than the diameter of the at least one first lead. There is a fourth distance between the first surface and the second support surface. The fourth distance is greater than the diameter of the at least one second lead. The fourth distance is greater than the third distance.

According to some embodiments of the present invention, the wireless transmission module further includes a heat dissipation structure fixedly installed on the second surface. The heat dissipation structure includes a plurality of protrusions. When viewed along the direction of the winding axis, these protrusions extend along the first direction. The heat dissipation structure is integrally molded with the induction board. The wireless transmission module further includes a first adhesive assembly installed between the body and the guide board. The first adhesive assembly includes corresponding first lead grooves, second lead grooves, and a plurality of first adhesive members respectively disposed within these receiving grooves.

According to some embodiments of the present invention, the guide board further includes a protrusion structure that protrudes from the first surface along the direction of the winding shaft. The winding shaft passes through the protruding structure. When viewed along the direction of the winding axis, the main body does not overlap with the protruding structure. When viewed along the direction of the winding axis, the body surrounds the protruding structure. When viewed along the direction of the winding axis, the first lead groove is not connected to the protruding structure. When viewed along the direction of the winding shaft, the second lead groove is connected to the protruding structure. When viewed along the first direction, the body does not overlap the protruding structure. The wireless transmission module further includes a heat dissipation element installed on the first surface. A heat dissipation element covers the body and the protruding structure. The heat dissipation element is made of non-metallic material.

According to some embodiments of the present invention, the wireless transmission module further includes an adhesive element configured to be adhered to the heat dissipation element. An adhesive element covers the heat dissipation element and adheres to the first surface. When viewed along the first direction, the adhesive element does not overlap the first lead groove. When viewed along the first direction, the adhesive element does not overlap the second lead groove. When viewed along the first direction, the adhesive elements do not overlap these receiving grooves. When viewed along the direction of the winding axis, the adhesive element overlaps the first lead groove, the second lead groove and their receiving groove. A heat dissipation element is located between the adhesive element and the guiding substrate. The adhesive element is made of plastic material.

According to some embodiments of the present invention, the guide substrate further includes a through hole formed in the protruding structure. The wireless transmission module further includes a fastening element configured to pass through the through hole and connect to the housing of the external device. The fastening element is configured to abut against the inner wall surface of the through hole. When viewed along the direction of the winding shaft, the through hole is located between two adjacent protrusions.

According to some embodiments of the present invention, the wireless transmission module further includes a second circuit assembly electrically connected to the first circuit assembly. The guide substrate includes a first section and a second section. The first section is connected to the second section, and the first section and the second section are integrally molded. A first circuit assembly is installed on the first section. A second circuit assembly is installed on the second section. When viewed along the second direction, the first thickness of the first section on the winding shaft is different from the second thickness of the second section on the winding shaft. The second direction is perpendicular to the first direction and the winding axis. The first thickness is greater than the second thickness when viewed along the second direction.

According to some embodiments of the invention, the first section and the second section extend along the first direction when viewed along the direction of the winding axis. These protrusions are located in the first section when viewed along the direction of the winding axis. When viewed along the direction of the winding axis, the second circuit assembly does not overlap these protrusions.

According to some embodiments of the present invention, the guide substrate is further formed with a first opening communicating with the first lead groove and the second lead groove. A first opening is formed facing the second circuit assembly. An airflow generating element is disposed on the second circuit assembly, with an exhaust port of the airflow generating element facing the first opening. The guide substrate further has a second opening formed therein. The first aperture and the second aperture are located on opposite sides of the first circuit assembly when viewed along the direction of the winding axis. When viewed along the third direction, the main body is exposed through the second opening. The third direction is opposite to the first direction. When viewed along the second direction, a portion of the guide substrate does not overlap the main body. When viewed along the direction of the winding axis, the airflow generating element is located between the first lead wire and the second lead wire. The guide substrate further has a plurality of groove structures recessed along the second direction. These groove structures are located on opposite sides of the first circuit assembly when viewed along the direction of the winding axis.

The present invention proposes a wireless transmission module used to transmit energy or signals, including one circuit assembly and one guiding board. A guiding board is placed adjacent to the first circuit assembly, and the guiding board is configured to change the electromagnetic field distribution in the vicinity of the first circuit assembly, such that the electromagnetic waves of the first circuit assembly are more concentrated. do it like this. The wireless transmission module design of the present invention achieves improved mechanical strength, improved usage efficiency, improved charging efficiency, improved heat dissipation efficiency, overall smaller size, overall lighter weight, and reduced electromagnetic interference. can be achieved.

In the present invention, the guiding board has a plurality of receiving grooves configured to receive the main body of the first circuit assembly. Based on the design of the receiving groove, the height of the wireless transmission module can be effectively reduced and the purpose of miniaturization can be achieved. In addition, the bottom of the induction board can be formed with a heat dissipation structure, and the induction board can quickly and effectively help the high-power first circuit assembly heat dissipation, and the operation of the first circuit assembly Efficiency can be increased.

FIG. 1 is a perspective view of a wireless transmission module 100 according to an embodiment of the present invention. FIG. 2 is an exploded view of a wireless transmission module 100 according to an embodiment of the present invention. FIG. 3 is a top view of the wireless transmission module 100 after assembly, according to an embodiment of the present invention. FIG. 4 is a schematic cross-sectional view along line AA of FIG. 3 after assembly of the wireless transmission module 100 according to an embodiment of the present invention. FIG. 5 is a bottom view of a partial structure of the wireless transmission module 100 according to an embodiment of the present invention. FIG. 6 is a schematic diagram of the guiding board 106 attached to the housing 11 of the external device 10, according to one embodiment of the present invention. FIG. 7 is a perspective view of a wireless transmission module 100A according to another embodiment of the present invention. FIG. 8 is a bottom view of a wireless transmission module 100A according to another embodiment of the present invention. FIG. 9 is a perspective view of a wireless transmission module 100B according to another embodiment of the present invention.

Several different implementation methods or examples are disclosed below for implementing different features of the provided subject matter. Examples of specific elements and their arrangement are described below to explain the invention. These are, of course, merely illustrative and are not intended to be limiting. For example, references herein to a first feature being formed on a second feature may include embodiments where the first feature is in direct contact with the second feature, or Embodiments having other features between the first feature element and the second feature element may also be included. In other words, elements of the first feature may not be in direct contact with elements of the second feature.

Also, different embodiments may use repeated symbols or labels, and these repetitions are only for the purpose of explaining the invention briefly and clearly, and the different embodiments discussed and/or It does not imply that there is any particular relationship between the structures. Furthermore, in the present invention, forming, connecting, and/or combining an element of another feature on an element of another feature includes embodiments in which the elements of the feature are formed in direct contact with each other. Embodiments may also be included in which additional feature elements can be formed that are inserted into the above-mentioned feature elements such that the above-mentioned feature elements are not in direct contact. Also, spatially related terms such as, for example, "vertical," "above," "above," "below," "bottom," and similar terms (e.g., "downward," "upward," etc.) are used. Sometimes these spatially relative terms are used to concisely describe the relationship of one element or feature to another in a drawing. used for These spatially relative terms are intended to encompass different orientations of the device containing the feature.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. It will be understood that terms defined in commonly used dictionaries should be construed to have meanings appropriate to the relative skill and background or context of the invention. and should not be construed in an idealized or overly formal manner unless specifically defined.

Furthermore, ordinal numbers such as "first" and "second" used in this specification and the claims of the utility model registration are used to distinguish between claim elements, and as such, the ordinal numbers such as "first" and "second" used in the present specification and the claims of the utility model registration are used to distinguish between claim elements, and as such, the ordinal numbers such as "first" and "second" are used in claim elements. It does not imply or imply any ordering of one claim element over another or any method of manufacture. The use of such ordinal numbers is only to clearly distinguish one named claim element from another similarly named claim element.

Additionally, in some embodiments of the present invention, terms related to joining, coupling, etc., such as "joined" or "interconnected", refer to structures that are in direct contact with each other, unless otherwise defined. It can refer to a relationship in which the two structures are movable or in which the two structures are fixed.

As shown in FIGS. 1 and 2, FIG. 1 is a perspective view of a wireless transmission module 100 according to an embodiment of the present invention, and FIG. 2 is an exploded view of the wireless transmission module 100 according to an embodiment of the present invention. It is a diagram. As shown in FIG. 1, wireless transmission module 100 is a wireless transmission module that can be used to transmit energy or signals. In this embodiment, wireless transmission module 100 may include a first circuit assembly 102, a first adhesive assembly 104, an inductive substrate 106, and a second circuit assembly 103.

In this embodiment, the first circuit assembly 102, the first adhesive assembly 104, and the guide board 106 are sequentially arranged along the extending direction of the winding axis RX of the first circuit assembly 102.

The first circuit assembly 102 here is installed on a guide board 106, and the guide board 106 is electrically independent from the first circuit assembly 102. In this embodiment, the first circuit assembly 102 is a wire-wound coil, the second circuit assembly 103 is a circuit board carrying a plurality of electronic components, and the first circuit assembly 102 is a wire-wound coil. electrically connected to.

In this embodiment, the first circuit assembly 102 can be a charging coil that provides wireless charging for use with an external charging device. For example, the first circuit assembly 102 can be used as a resonant charging coil based on the Alliance for Wireless Power (A4WP) standard, but is not limited thereto.

The first circuit assembly 102 may also be based on a Wireless Power Consortium (WPC) standard, such as the Qi standard, and is a sensitive charging coil. Therefore, this embodiment allows the first circuit assembly 102 to simultaneously support different forms of charging methods, increasing the applicability range. For example, when the distance is short (for example, 1 cm or less), a responsive operation is used, and when the distance is long, a resonance operation is used.

In this embodiment, the first circuit assembly 102 can also be a communication coil that operates in a Near Field Communication (NFC) mode and communicates with external electronic equipment, for example.

In this embodiment, an inductive board 106 is positioned adjacent to the first circuit assembly 102, and the inductive board 106 is configured to alter the electromagnetic field distribution near the first circuit assembly 102. The guide substrate 106 may be made of a magnetic material such as ferrite, but is not limited thereto. For example, in other embodiments, guiding substrate 106 may also include nanocrystalline materials. The guiding substrate 106 can have a magnetic permeability corresponding to the first circuit assembly 102, so that the electromagnetic waves of the first circuit assembly 102 are more concentrated.

The first adhesive assembly 104 can be a double-sided adhesive or a single-sided adhesive used to adhere to one or two adjacent components. In some embodiments, first adhesive assembly 104 can be made of polyethylene terephthalate (PET), but is not limited thereto. For example, first adhesive assembly 104 may be made of polypropylene (PP).

As shown in FIGS. 1 to 4, FIG. 3 is a top view of the wireless transmission module 100 after being assembled according to an embodiment of the present invention, and FIG. 4 is a top view of the wireless transmission module 100 according to an embodiment of the present invention. FIG. 4 is a schematic cross-sectional view taken along line AA in FIG. 3 after the wireless transmission module 100 is assembled. As shown in FIGS. 2 and 3, the wireless transmission module 100 defines a first axis AX1 and a second axis AX2, the first axis AX1 being perpendicular to the second axis AX2. For example, the first axis AX1 is parallel to the Y axis, the second axis AX2 is parallel to the X axis, and the first axis AX1, second axis AX2, and winding axis RX are orthogonal to each other. .

In this embodiment, the first circuit assembly 102 has a body 1020 and at least one first lead 1021 and at least one second lead 1022, the body 1020 having the aforementioned winding axis RX has. The extending direction of at least one first lead wire 1021 is not parallel to the winding axis RX, and the extending direction of at least one first lead wire 1021 is parallel to the extending direction of at least one second lead wire 1022. parallel.

In this embodiment, the guide board 106 has a plate-like structure, and the guide board 106 forms a plurality of receiving grooves 106RC configured to receive the body 1020 of the first circuit assembly 102. The guide substrate 106 has a first surface 106S1, and these receiving grooves 106RC are formed by recessing the first surface 106S1.

Each receiving groove 106RC has an inner concave surface 106RS configured to support the winding of the main body 1020. The guiding substrate 106 further has a second side 106S2, with the first side 106S1 and the second side 106S2 located on opposite sides of the plate-like structure.

The first surface 106S1 is a plane, and when viewed along the first direction D1 perpendicular to the winding axis RX (FIG. 4), at least one first lead wire 1021 does not overlap with the first surface 106S1. . The first direction D1 is parallel to the first axis AX1.

When viewed along the first direction D1, these inner concave surfaces 106RS are located between the first surface 106S1 and the second surface 106S2. It should be noted that when viewed along the first direction D1, the distances between these inner concave surfaces 106RS and the first surface 106S1 along the winding axis RX are equal.

As shown in FIG. 2, the guide substrate 106 can further include a first lead groove 1061 configured to accommodate at least one first lead 1021. As shown in FIG. Similarly, the guide substrate 106 can further include a second lead groove 1062 configured to receive at least one second lead 1022.

The first lead wire groove 1061 is formed by recessing the first surface 106S1 inward along the direction of the winding axis RX, and the second lead wire groove 1062 is formed by recessing the first surface 106S1 inward along the direction of the winding axis RX. It is formed by being recessed inward along the direction of the axis RX.

As shown in FIG. 4, first lead groove 1061 has a first support surface 1063 configured to support at least one first lead 1021. As shown in FIG. Second lead groove 1062 has a second support surface 1064 configured to support at least one second lead 1022 .

When viewed along the first direction D1, the first support surface 1063 and the second support surface 1064 are located between the first surface 106S1 and the second surface 106S2. When viewed along the first direction D1, there is a first distance DS1 between the first surface 106S1 and the second surface 106S2.

When viewed along the first direction D1, there is a second distance DS2 between the first support surface 1063 and the second surface 106S2. In this embodiment, the second distance DS2 is at most 40 percent of the first distance DS1.

Furthermore, there is a third distance DS3 between the first surface 106S1 and the first support surface 1063. The third distance DS3 is greater than the diameter of at least one first lead wire 1021. There is a fourth distance DS4 between the first surface 106S1 and the second support surface 1064. The fourth distance DS4 is greater than the diameter of at least one second lead 1022, and the fourth distance DS4 is greater than the third distance DS3. Accordingly, the second lead groove 1062 can completely accommodate the second lead 1022 therein.

As shown in FIGS. 4 and 5, FIG. 5 is a bottom view of a partial structure of a wireless transmission module 100 according to an embodiment of the present invention. In this embodiment, the wireless transmission module 100 may further include a heat dissipation structure 130 fixedly disposed on the second surface 106S2.

The heat dissipation structure 130 here includes a plurality of protrusions 1301, and these protrusions 1301 extend along the first direction D1 when viewed along the direction of the winding axis RX. Note that the heat dissipation structure 130 is integrally molded with the guide substrate 106. Since the power of the first circuit assembly 102 of the present invention is larger than that of a typical coil (e.g., 30W to 50W), based on such a design, the inductive board 106 can quickly and easily power the first circuit assembly 102. It can help dissipate heat effectively.

2 and 4, in this embodiment, the first adhesive assembly 104 is installed between the body 1020 and the guiding substrate 106, and the first adhesive assembly 104 is connected to the corresponding first adhesive assembly 104. The first lead wire groove 1061, the second lead wire groove 1062, and a plurality of first adhesive members 1040 installed in each of these housing grooves 106RC can be included.

These first adhesive members 1040 correspond to the shapes of the accommodation groove 106RC, the first lead wire groove 1061, and the second lead wire groove 1062, and fix the first circuit assembly 102 to the guide board 106.

As shown in FIGS. 2 to 4, the guide board 106 further includes a protrusion structure 106P that protrudes from the first surface 106S1 along the direction of the winding axis RX. The winding axis RX passes through the protruding structure 106P, and when viewed along the direction of the winding axis RX, the main body 1020 does not overlap the protruding structure 106P.

When viewed along the direction of the winding axis RX, the main body 1020 surrounds the protruding structure 106P. When viewed along the direction of the winding axis RX, the first lead wire groove 1061 is not connected to the protrusion structure 106P. When viewed along the direction of the winding axis RX, the second lead wire groove 1062 is connected to the protruding structure 106P.

Further, as shown in FIG. 4, when viewed along the first direction D1, the main body 1020 does not overlap the protruding structure 106P. Based on such a structure, not only the efficiency of the first circuit assembly 102 can be increased, but also the objective of miniaturization can be achieved.

Furthermore, in this embodiment, the wireless transmission module 100 includes a heat dissipation element installed on the first surface 106S1, and installed in the first lead wire groove 1061, the second lead wire groove 1062, and the accommodation groove 106RC. 150.

The heat dissipation element 150 can cover the body 1020 and the protrusion structure 106P, and the heat dissipation element 150 is made of non-metallic material. For example, the heat dissipation element 150 may be a thermal paste made of a non-metallic material, but is not limited thereto.

Furthermore, the wireless transmission module 100 may further include an adhesive element 112 configured to be adhered to the heat dissipation element 150, such that the heat dissipation element 150 is located between the adhesive element 112 and the guide substrate 106. .

Specifically, adhesive element 112 covers heat dissipation element 150 and adheres to first surface 106S1. When viewed along the first direction D1, the adhesive element 112 does not overlap the first lead groove 1061. Adhesive element 112 does not overlap second lead groove 1062 when viewed along first direction D1.

When viewed along the first direction D1, the adhesive elements 112 do not overlap these receiving grooves 106RC. When viewed along the direction of the winding axis RX, the adhesive element 112 overlaps with the first lead wire groove 1061, the second lead wire groove 1062, and their accommodation groove 106RC.

In this embodiment, adhesive element 112 is made of plastic material. For example, adhesive element 112 can be, but is not limited to, a double-sided adhesive made of polyethylene terephthalate (PET).

Based on the above structure, the heat dissipation element 150 can be stably fixed on the first circuit assembly 102, and the heat generated by the first circuit assembly 102 can be effectively reduced. Furthermore, such a design can also avoid the problem of particles generated by the guiding substrate 106 and can increase the structural strength of the guiding substrate 106.

3-6, FIG. 6 is a schematic diagram of the guiding board 106 attached to the housing 11 of the external device 10, according to one embodiment of the present invention. The guide board 106 may further include a through hole 106H formed in the protrusion structure 106P, and the through hole 106H is located between two adjacent protrusions 1301 when viewed along the direction of the winding axis RX. ing.

Correspondingly, the wireless transmission module 100 may further include a fastening element SCE configured to pass through the through hole 106H and be connected to the housing 11 of the external device 10. The fastening element SCE is, for example, a screw, and fastens the guide board 106 onto the housing 11 by coming into contact with the inner wall surface of the through hole 106H.

Based on such a structure, not only miniaturization is achieved, but also the fastening element SCE quickly transfers the heat of the first circuit assembly 102 to the housing 11 (for example, made of metal material) and dissipates the heat. efficiency can be further increased.

7 and 8, FIG. 7 is a perspective view of a wireless transmission module 100A according to another embodiment of the present invention, and FIG. 8 is a perspective view of a wireless transmission module 100A according to another embodiment of the present invention. FIG. This embodiment is similar to the previous embodiment, except that the guide substrate 106 includes a first section SG1 and a second section SG2.

The first section SG1 here is connected to the second section SG2, and the first section SG1 and the second section SG2 are integrally molded. As shown in FIG. 7, the first circuit assembly 102 is installed on the first section SG1, and the second circuit assembly 103 is installed on the second section SG2.

When viewed along the second direction D2, the first thickness TH1 of the first section SG1 on the winding axis RX (Z axis) is the second thickness of the second section SG2 on the winding axis RX. It is different from TH2.

For example, when viewed along the second direction D2, the first thickness TH1 is greater than the second thickness TH2, and the second direction D2 is relative to the first direction D1 and the winding axis RX. Vertical.

Moreover, as shown in FIG. 8, when viewed along the direction of the winding axis RX, the first section SG1 and the second section SG2 extend along the first direction D1. When viewed along the direction of the winding axis RX, these protrusions 1301 are installed in the first section SG1. The second circuit assembly 103 does not overlap these protrusions 1301 when viewed along the direction of the winding axis RX.

Note that the first thickness TH1 includes the height of the protrusion 1301, and the second thickness TH2 does not include the height of the protrusion 1301. Therefore, based on the structural design of the induction board 106A of this embodiment, not only can the purpose of miniaturization be achieved, but also the heat dissipation effect can be improved by the second section SG2 installed at the bottom of the second circuit assembly 103. can be further increased.

Next, as shown in FIG. 9, FIG. 9 is a perspective view of a wireless transmission module 100B according to another embodiment of the present invention. This embodiment is similar to the previous embodiment, but the difference is that the guide board 106B of this embodiment has a first opening that communicates with the first lead wire groove 1061 and the second lead wire groove 1062. OP1 is further formed.

The first opening OP1 is formed facing the second circuit assembly 103, an airflow generation element 1032 is installed on the second circuit assembly 103, and an exhaust port 1033 of the airflow generation element 1032 is formed to face the second circuit assembly 103. Facing. The airflow generating element 1032 can be, for example, but not limited to, an exhaust element consisting of a fan or a micromotor.

Further, the guide board 106B is further formed with a second opening OP2, and when viewed along the direction of the winding axis RX, the first opening OP1 and the second opening OP2 are connected to the first circuit assembly 102. Located on opposite sides.

When viewed along the third direction D3, the main body 1020 is exposed through the second opening OP2, and the third direction D3 is opposite to the first direction D1 and perpendicular to the second direction D2. be.

When viewed along the second direction D2, a portion of the guide board 106B does not overlap the main body 1020. Further, when viewed along the direction of the winding axis RX, the airflow generating element 1032 is located between the first lead wire 1021 and the second lead wire 1022. Based on such a configuration, the airflow blown out from the airflow generating element 1032 enters through the first opening OP1, blows through the main body 1020, and then is blown out again through the second opening OP2, and the airflow flows through the first circuit assembly 102. The heat generated can be effectively carried away.

Furthermore, in the present embodiment, the guide substrate 106B may further have a plurality of groove structures 106RT recessed along the second direction D2 (second axis AX2). These groove structures 106RT are located on opposite sides of the first circuit assembly 102 when viewed along the direction of the winding axis RX. The design of the groove structure 106RT can enhance the convection effect between the guide substrate 106B and the surrounding environment, and further improve the heat dissipation efficiency.

In summary, the present invention proposes a wireless transmission module used to transmit energy or signals, including a first circuit assembly and a guiding board. A guiding board is disposed adjacent to the first circuit assembly, and the guiding board is configured to change the electromagnetic field distribution in the vicinity of the first circuit assembly, such that the electromagnetic waves of the first circuit assembly are more concentrated. do it like this. The wireless transmission module design of the present invention achieves improved mechanical strength, improved usage efficiency, improved charging efficiency, improved heat dissipation efficiency, overall smaller size, overall lighter weight, and reduced electromagnetic interference. can be achieved.

In the present invention, the guiding board 106 has a plurality of receiving grooves 106RC configured to accommodate the body 1020 of the first circuit assembly 102. Based on the design of the receiving groove 106RC, the height of the wireless transmission module can be effectively reduced and the purpose of miniaturization can be achieved. Furthermore, the bottom of the guiding board 106 can be formed with a heat dissipation structure 130, and the guiding board 106 can quickly and effectively help the high-power first circuit assembly 102 to dissipate heat, and the first The operating efficiency of circuit assembly 102 can be increased.

The use of ordinal numbers in the description and claims, such as "first," "second," "third," etc., do not themselves imply an order, but rather refer to two different elements having the same name. It should be understood that it is used only to distinguish between

Although embodiments of the present invention and its advantages have been disclosed above, those of ordinary skill in the art will appreciate that modifications and substitutions can be made without departing from the spirit and scope of the invention. Please understand that it can be done. Moreover, the scope of protection of the present invention is not limited to the process, machine, manufacture, composition of matter, apparatus, method, and steps in the specific embodiments described herein. Anyone of ordinary skill in the art will appreciate that the embodiments described herein can perform substantially the same functions or achieve substantially the same results. The content of the invention provides an understanding of current or future developed processes, machines, manufacture, compositions of matter, devices, methods, and steps. Therefore, the scope of protection of the present invention includes the above-mentioned processes, machines, manufacture, compositions of matter, devices, methods and steps. Furthermore, each claim of the utility model registration claims constitutes a separate embodiment, and the protection scope of the present invention also includes a combination of each claim of the utility model registration claims and the embodiments.

10 External device 11 Housing 100, 100A, 100B Wireless transmission module 102 First circuit assembly 1020 Main body 1021 First lead wire 1022 Second lead wire 103 Second circuit assembly 1032 Air flow generation element 1033 Exhaust port 104 First Adhesive assembly 1040 First adhesive member 106, 106A, 106B Guide board 1061 First lead wire groove 1062 Second lead wire groove 1063 First support surface 1064 Second support surface 106H Through hole 106P Projection structure 106RC Accommodation groove 106RS Inner concave surface 106RT Concave groove structure 106S1 First surface 106S2 Second surface 112 Adhesive element 130 Heat dissipation structure 1301 Projection 150 Heat dissipation element AX1 First axis AX2 Second axis D1 First direction D2 Second direction D3 Third direction DS1 First distance DS2 Second distance DS3 Third distance DS4 Fourth distance OP1 First opening OP2 Second opening RX Winding shaft SCE Fastening element SG1 First section SG2 Second section TH1 First thickness TH2 Second thickness AA Line X X-axis Y Y-axis Z Z-axis

Claims (10)

used to transmit energy or signals,
an inductive board; and a first circuit assembly mounted on the inductive board;
The wireless transmission module, wherein the guiding board is electrically independent from the first circuit assembly. The first circuit assembly has a body and at least one first lead and at least one second lead;
the main body has a winding shaft;
The extending direction of the first lead wire is not parallel to the winding axis,
The extending direction of the first lead wire is parallel to the extending direction of the second lead wire,
The guide substrate has a plate-like structure,
the guide board forming a plurality of receiving grooves configured to receive the body of the first circuit assembly;
The guide substrate has a first surface, and each accommodation groove is formed by recessing the first surface,
each receiving groove has an inner concave surface configured to support a winding of the main body;
the guiding substrate further has a second surface, the first surface and the second surface being located on opposite sides of the plate-like structure;
the first surface is a plane;
When viewed along a first direction perpendicular to the winding axis, the first lead wire does not overlap the first surface,
When viewed along the first direction, each inner concave surface is located between the first surface and the second surface,
The wireless transmission module according to claim 1, wherein the distance between each inner concave surface along the winding axis and the first surface is equal when viewed along the first direction. The guide board includes a first lead groove configured to accommodate the first lead wire, and
The guide board includes a second lead groove configured to accommodate the second lead wire,
The first lead wire groove is formed by recessing the first surface inward along the direction of the winding shaft,
The second lead wire groove is formed by recessing the first surface inward along the direction of the winding shaft,
The first lead wire groove has a first support surface configured to support the first lead wire,
The second lead wire groove has a second support surface configured to support the second lead wire,
When viewed along the first direction, the first support surface and the second support surface are located between the first surface and the second surface,
When viewed along the first direction, there is a first distance between the first surface and the second surface,
When viewed along the first direction, there is a second distance between the first support surface and the second surface;
a third distance between the first surface and the first support surface;
the third distance is larger than the diameter of the first lead wire;
a fourth distance between the first surface and the second support surface;
the fourth distance is larger than the diameter of the second lead wire;
The wireless transmission module according to claim 2, wherein the fourth distance is greater than the third distance. The wireless transmission module further includes a heat dissipation structure fixedly installed on the second surface,
The heat dissipation structure includes a plurality of protrusions,
When viewed along the direction of the winding shaft, the protrusion extends along the first direction,
The heat dissipation structure is integrally molded with the induction board,
The wireless transmission module further includes a first adhesive assembly installed between the main body and the guide board;
4. The first adhesive assembly includes a plurality of first adhesive members respectively installed in the corresponding first lead groove, the second lead groove, and the receiving groove. wireless transmission module. The guide board further has a protruding structure that protrudes from the first surface along the direction of the winding shaft,
the winding shaft passes through the protruding structure;
When viewed along the direction of the winding shaft, the main body does not overlap the protruding structure,
When viewed along the direction of the winding axis, the body surrounds the protruding structure;
When viewed along the direction of the winding shaft, the first lead wire groove is not connected to the protruding structure,
When viewed along the direction of the winding shaft, the second lead wire groove is connected to the protruding structure,
When viewed along the first direction, the main body does not overlap the protruding structure,
The wireless transmission module further includes a heat dissipation element installed on the first surface,
the heat dissipation element covers the main body and the protruding structure;
The wireless transmission module according to claim 4, wherein the heat dissipation element is made of non-metallic material. The wireless transmission module further includes an adhesive element configured to be adhered to the heat dissipation element,
the adhesive element covers the heat dissipation element and adheres to the first surface;
When viewed along the first direction, the adhesive element does not overlap the first lead groove;
When viewed along the first direction, the adhesive element does not overlap the second lead groove;
When viewed along the first direction, the adhesive element does not overlap the receiving groove;
When viewed along the direction of the winding shaft, the adhesive element overlaps the first lead wire groove, the second lead wire groove, and the accommodation groove,
the heat dissipation element is located between the adhesive element and the guide substrate;
6. The wireless transmission module according to claim 5, wherein the adhesive element is made of plastic material. The guide substrate further includes a through hole formed in the protruding structure,
The wireless transmission module further includes a fastening element configured to pass through the through hole and be connected to a housing of an external device;
The fastening element is configured to abut an inner wall surface of the through hole,
The wireless transmission module according to claim 5, wherein the through hole is located between two adjacent protrusions when viewed along the direction of the winding shaft. The wireless transmission module further includes a second circuit assembly electrically connected to the first circuit assembly,
The guide substrate includes a first section and a second section,
the first section is connected to the second section, the first section and the second section are integrally molded,
the first circuit assembly is installed on the first section;
the second circuit assembly is installed on the second section;
When viewed along a second direction, a first thickness of the first section on the winding shaft is different from a second thickness of the second section on the winding shaft,
the second direction is perpendicular to the first direction and the winding axis;
The wireless transmission module according to claim 4, wherein the first thickness is larger than the second thickness when viewed along the second direction. When viewed along the direction of the winding axis, the first section and the second section extend along the first direction,
When viewed along the direction of the winding shaft, the protrusion is installed in the first section,
The wireless transmission module according to claim 8, wherein the second circuit assembly does not overlap the protrusion when viewed along the direction of the winding shaft. The guide substrate further includes a first opening communicating with the first lead wire groove and the second lead wire groove,
the first opening is formed facing the second circuit assembly;
an airflow generating element is disposed on the second circuit assembly, and an exhaust port of the airflow generating element faces the first opening;
The guide substrate further has a second opening formed therein,
When viewed along the direction of the winding axis, the first opening and the second opening are located on opposite sides of the first circuit assembly,
When viewed along the third direction, the main body is exposed from the second opening,
the third direction is opposite to the first direction,
When viewed along the second direction, a portion of the guide substrate does not overlap the main body,
When viewed along the direction of the winding axis, the airflow generating element is located between the first lead wire and the second lead wire,
The guide substrate further includes a plurality of groove structures recessed along the second direction,
The wireless transmission module according to claim 8, wherein the groove structure is located on opposite sides of the first circuit assembly when viewed along the direction of the winding axis.

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