TW202349829A - Wireless transmission module - Google Patents

Wireless transmission module Download PDF

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Publication number
TW202349829A
TW202349829A TW111121942A TW111121942A TW202349829A TW 202349829 A TW202349829 A TW 202349829A TW 111121942 A TW111121942 A TW 111121942A TW 111121942 A TW111121942 A TW 111121942A TW 202349829 A TW202349829 A TW 202349829A
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Taiwan
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coil
main axis
base component
viewed along
electrical connection
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TW111121942A
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Chinese (zh)
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簡鳳龍
林建宏
賴妮妮
徐湘惠
陳茂軍
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台灣東電化股份有限公司
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Priority to TW111121942A priority Critical patent/TW202349829A/en
Publication of TW202349829A publication Critical patent/TW202349829A/en

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Abstract

A wireless transmission module corresponds to an electronic module and is configured to transmit a first signal, and the wireless transmission module includes a corresponding surface, a base assembly and a first coil. The corresponding surface faces the electronic module and is perpendicular to a main axis. The first coil is disposed on the base assembly. The first coil overlaps at least a portion of the base assembly when viewed along the main axis. The first coil overlaps at least a portion of the base assembly when viewed in a direction perpendicular to the main axis.

Description

無線傳輸模組Wireless transmission module

本揭露係關於一種無線傳輸模組,特別係關於一種應用於無線通訊或無線充電的無線傳輸模組。The present disclosure relates to a wireless transmission module, particularly to a wireless transmission module used in wireless communication or wireless charging.

隨著科技的發展,現今許多電子裝置(例如平板電腦或智慧型手機)皆具有無線充電的功能。使用者可以將電子裝置放置在一無線充電發射端上,以使電子裝置中的無線充電接收端利用電磁感應方式或電磁共振方式產生電流來對電池進行充電。由於無線充電的便利性,使得具有無線充電模組的電子裝置也逐漸受到大眾的喜愛。With the development of technology, many electronic devices (such as tablets or smartphones) now have wireless charging capabilities. The user can place the electronic device on a wireless charging transmitter, so that the wireless charging receiver in the electronic device uses electromagnetic induction or electromagnetic resonance to generate current to charge the battery. Due to the convenience of wireless charging, electronic devices with wireless charging modules are gradually becoming popular among the public.

一般而言,無線充電模組都會包括一個導磁性基板,承載一線圈。其中,當線圈通電而操作於一無線充電模式或者是一無線通訊模式時,導磁性基板可以使得線圈發出的磁力線更為集中,以獲得更好的效能。然而,現有的無線充電(或通訊)模組的結構以及線圈的繞線方式並無法滿足對於無線傳輸模組的各種要求,例如需要更好的充電、通訊效能與更微型化的尺寸。Generally speaking, a wireless charging module will include a magnetically conductive substrate carrying a coil. Among them, when the coil is energized and operated in a wireless charging mode or a wireless communication mode, the magnetic conductive substrate can make the magnetic lines of force emitted by the coil more concentrated to obtain better performance. However, the structure of the existing wireless charging (or communication) module and the winding method of the coil cannot meet the various requirements for wireless transmission modules, such as better charging, communication performance and more miniaturized size.

因此,如何設計出可滿足使用者各種需求的無線傳輸模組,便是現今值得探討與解決之課題。Therefore, how to design a wireless transmission module that can meet the various needs of users is a topic worthy of discussion and solution today.

根據本揭露的一些實施例,本揭露提供一種無線傳輸模組,對應於一電子模組並配置以傳輸一第一訊號,並且無線傳輸模組包含一對應表面、一基底組件以及一第一線圈。對應表面面朝電子模組並垂直於一主軸。第一線圈設置於基底組件。當沿著主軸觀察時,第一線圈與基底組件之至少一部分重疊。當沿著垂直於主軸之方向觀察時,第一線圈與基底組件之至少一部分重疊。According to some embodiments of the present disclosure, the present disclosure provides a wireless transmission module corresponding to an electronic module and configured to transmit a first signal, and the wireless transmission module includes a corresponding surface, a base component and a first coil . The corresponding surface faces the electronic module and is perpendicular to a main axis. The first coil is disposed on the base component. The first coil overlaps at least a portion of the base assembly when viewed along the principal axis. When viewed along a direction perpendicular to the main axis, the first coil overlaps at least a portion of the base component.

根據本揭露一些實施例,基底組件包含一第一導磁部,具有一第一導磁性材質;基底組件包含複數個第一導磁性元件;基底組件包含鐵元素;基底組件包含矽元素;基底組件包含鉻元素;這些第一導磁性元件之直徑小於0.05mm;無線傳輸模組更包含一第一接著元件,配置以接著這些第一導磁性元件;第一接著元件直接接觸這些第一導磁性元件;第一接著元件直接接觸第一線圈;第一線圈經由第一接著元件固定地連接這些第一導磁性元件;第一接著元件之熔點高於攝氏70度;第一接著元件之熔點低於攝氏400度。According to some embodiments of the present disclosure, the base component includes a first magnetic conductive part with a first magnetic conductive material; the base component includes a plurality of first magnetic conductive elements; the base component includes an iron element; the base component includes a silicon element; the base component Contains chromium element; the diameter of these first magnetic permeable elements is less than 0.05mm; the wireless transmission module further includes a first connecting element configured to connect these first magnetic permeable elements; the first connecting element directly contacts these first magnetic permeable elements ; The first connecting element directly contacts the first coil; the first coil is fixedly connected to these first magnetic conductive elements through the first connecting element; the melting point of the first connecting element is higher than 70 degrees Celsius; the melting point of the first connecting element is lower than Celsius 400 degrees.

根據本揭露一些實施例,當沿著一第一方向觀察時,基底組件覆蓋第一線圈之至少一部分;第一方向相反於對應表面所面朝之方向;基底組件更包含:一支撐部,配置以支撐第一線圈;以及一覆蓋部,覆蓋第一線圈之一部分。當沿著垂直於主軸之方向觀察時,第一線圈位於支撐部與電子模組之間;當沿著主軸觀察時,第一線圈與支撐部之至少一部分重疊;當沿著第一方向觀察時,覆蓋部之至少一部分與第一線圈重疊;當沿著垂直於主軸之方向觀察時,覆蓋部之至少一部分與第一線圈重疊;當沿著垂直於主軸之方向觀察時,在主軸上,第一線圈之中心位於覆蓋部與支撐部之間。According to some embodiments of the present disclosure, when viewed along a first direction, the base component covers at least a portion of the first coil; the first direction is opposite to the direction in which the corresponding surface faces; the base component further includes: a support portion configured to support the first coil; and a covering part covering a part of the first coil. When viewed along the direction perpendicular to the main axis, the first coil is located between the support part and the electronic module; when viewed along the main axis, the first coil overlaps at least a part of the supporting part; when viewed along the first direction , at least part of the covering part overlaps with the first coil; when viewed along the direction perpendicular to the main axis, at least part of the covering part overlaps with the first coil; when viewed along the direction perpendicular to the main axis, on the main axis, the third The center of a coil is located between the covering part and the supporting part.

根據本揭露一些實施例,第一線圈包含:一第一引線,位於基底組件之一第一側壁表面;以及一增強元件,設置於第一引線上。第一側壁表面與主軸平行;第一引線通過第一側壁表面之一第一開口;第一開口具有封閉結構;增強元件直接接觸第一開口;增強元件具有非金屬材質;在主軸上,第一線圈與對應表面之最短距離不同於第一引線與對應表面之最短距離;在主軸上,第一線圈與對應表面之最短距離小於第一引線與對應表面之最短距離;基底組件更包含一第一基底表面,面朝電子模組;第一基底表面與第一側壁表面不平行;基底組件更包含一第一結構強化部,配置以強化基底組件之機械結構;第一結構強化部位於第一基底表面與第一側壁表面之間;第一結構強化部之表面不平行於第一基底表面以及第一側壁表面;第一結構強化部之表面與第一基底表面之夾角大於15度;第一結構強化部之表面與第一側壁表面之夾角大於15度;基底組件更包含一第二基底表面,與第一基底表面係面朝相反方向;基底組件更包含一第二結構強化部,配置以強化基底組件之機械結構;第二結構強化部位於第二基底表面與第一側壁表面之間;第二結構強化部之表面不平行於第二基底表面以及第一側壁表面;第二結構強化部之結構與第一結構強化部之結構不同;第二結構強化之表面具有大於0.05mm的曲率半徑;當沿著主軸觀察時,第一結構強化部重疊於第二結構強化部之至少一部分;無線傳輸模組更包含一第二線圈,設置於基底組件;第二線圈與第一線圈電性獨立;第一線圈與第二線圈之其中一者配置以傳輸第一訊號,並且另一者配置以傳輸一第二訊號;當沿著垂直於主軸之方向觀察時,第二線圈與第一線圈之至少一部分重疊。According to some embodiments of the present disclosure, the first coil includes: a first lead located on a first side wall surface of the base component; and a reinforcing element disposed on the first lead. The first side wall surface is parallel to the main axis; the first lead passes through one of the first openings on the first side wall surface; the first opening has a closed structure; the reinforcing element directly contacts the first opening; the reinforcing element has a non-metallic material; on the main axis, the first The shortest distance between the coil and the corresponding surface is different from the shortest distance between the first lead and the corresponding surface; on the main axis, the shortest distance between the first coil and the corresponding surface is less than the shortest distance between the first lead and the corresponding surface; the base component further includes a first The base surface faces the electronic module; the first base surface and the first side wall surface are not parallel; the base component further includes a first structural strengthening part configured to strengthen the mechanical structure of the base component; the first structural strengthening part is located on the first base Between the surface and the first side wall surface; the surface of the first structural reinforcement part is not parallel to the first base surface and the first side wall surface; the angle between the surface of the first structural reinforcement part and the first base surface is greater than 15 degrees; the first structure The angle between the surface of the reinforced portion and the surface of the first side wall is greater than 15 degrees; the base component further includes a second base surface facing in the opposite direction to the first base surface; the base component further includes a second structural reinforcement portion configured to strengthen The mechanical structure of the base component; the second structural reinforcement part is located between the second base surface and the first side wall surface; the surface of the second structural reinforcement part is not parallel to the second base surface and the first side wall surface; the second structural reinforcement part The structure is different from that of the first structural reinforcement; the surface of the second structural reinforcement has a curvature radius greater than 0.05mm; when viewed along the main axis, the first structural reinforcement overlaps at least a part of the second structural reinforcement; wireless transmission The module further includes a second coil disposed on the base component; the second coil is electrically independent from the first coil; one of the first coil and the second coil is configured to transmit the first signal, and the other is configured to transmit the first signal. a second signal; when viewed along a direction perpendicular to the main axis, the second coil overlaps at least a portion of the first coil.

根據本揭露一些實施例,基底組件更包含一第一基底表面,面朝電子模組;基底組件更包含一第二基底表面,與第一基底表面係面朝相反方向;無線傳輸模組更包含一第二線圈,設置於基底組件;第二線圈與第一線圈電性獨立;無線傳輸模組更包含一第一保護元件,設置於第一線圈上;第一保護元件具有板狀結構,直接接觸第一基底表面;第一保護元件直接接觸第一線圈;第一保護元件直接接觸第二線圈;第一保護元件包含一第一接著部,配置以接著於第一線圈;第一接著部接著於第一基底表面;第一接著部接著於覆蓋部;當沿著垂直於主軸之方向觀察時,第一線圈位於支撐部與第一保護元件之間;第一保護元件更包含一第一本體,並且第一接著部設置於第一本體上;第一保護元件更包含一第二接著部,配置以接著於一第一外部元件;第一本體位於第一接著部與第二接著部之間;第一外部元件為一電子設備之一殼體;基底組件更包含一第一結構強化部,配置以強化基底組件之機械結構;當沿著主軸觀察時,第一保護元件與第一結構強化部之至少一部分重疊;第一接著部接著於第一結構強化部;無線傳輸模組更包含一第二保護元件,設置於第二基底表面;第二保護元件具有板狀結構;當沿著垂直於主軸之方向觀察時,支撐部位於第一線圈與第二保護元件之間;第二保護元件包含一第三接著部,配置以接著於第二基底表面;第二保護元件更包含一第二本體,並且第三接著部設置於第二本體上;第二保護元件更包含一第四接著部,配置以接著於一第二外部元件;第二本體位於第三接著部與第四接著部之間;第二外部元件為電子設備之一電路組件;基底組件更包含一第二結構強化部,配置以強化基底組件之機械結構;當沿著主軸觀察時,第二保護元件與第二結構強化部之至少一部分重疊;第三接著部接著於第二結構強化部;第一保護元件直接接觸第二保護元件;第一接著部接著於第三接著部;基底組件更包含:一第一溝槽,位於第二基底表面;一第二溝槽,位於第二基底表面;以及一第三溝槽,位於第二基底表面。第三接著部對應於第一溝槽;第一溝槽延伸至第一線圈;當沿著垂直於主軸之方向觀察時,第一溝槽與第一線圈不重疊;當沿著主軸觀察時,第一溝槽與第一線圈之至少一部分重疊;當沿著垂直於主軸之方向觀察時,第二溝槽與第一線圈之至少一部分重疊;第二溝槽位於第一基底表面;第一接著部對應於第二溝槽;第三接著部對應於第二溝槽;在主軸上,第一溝槽之最大尺寸不同於第二溝槽之最大尺寸;在主軸上,第一溝槽之最大尺寸小於第二溝槽之最大尺寸;當沿著垂直於主軸之方向觀察時,第三溝槽與第二線圈不重疊;當沿著主軸觀察時,第三溝槽與第二線圈之至少一部分重疊;第三接著部對應於第三溝槽;在主軸上,第三溝槽之最大尺寸小於第二溝槽之最大尺寸。According to some embodiments of the present disclosure, the base component further includes a first base surface facing the electronic module; the base component further includes a second base surface facing in the opposite direction to the first base surface; the wireless transmission module further includes A second coil is arranged on the base component; the second coil is electrically independent from the first coil; the wireless transmission module further includes a first protection element, which is arranged on the first coil; the first protection element has a plate-like structure and is directly Contacting the first substrate surface; the first protection element directly contacts the first coil; the first protection element directly contacts the second coil; the first protection element includes a first connecting portion configured to be connected to the first coil; the first connecting portion is connected to On the first base surface; the first connecting portion is connected to the covering portion; when viewed along the direction perpendicular to the main axis, the first coil is located between the supporting portion and the first protection element; the first protection element further includes a first body , and the first connecting portion is provided on the first body; the first protection element further includes a second connecting portion configured to be connected to a first external component; the first body is located between the first connecting portion and the second connecting portion ; The first external component is a housing of an electronic device; the base component further includes a first structural strengthening part configured to strengthen the mechanical structure of the base component; when viewed along the main axis, the first protection element and the first structural strengthening part At least a part of the parts overlaps; the first connecting part is connected to the first structural reinforcement part; the wireless transmission module further includes a second protection element, which is disposed on the second base surface; the second protection element has a plate-like structure; when along the vertical When viewed in the direction of the main axis, the support portion is located between the first coil and the second protection element; the second protection element includes a third connecting portion configured to be attached to the second base surface; the second protection element further includes a second The main body, and the third connecting part is provided on the second body; the second protection element further includes a fourth connecting part configured to be connected to a second external component; the second body is located between the third connecting part and the fourth connecting part between; the second external component is a circuit component of the electronic device; the base component further includes a second structural strengthening part configured to strengthen the mechanical structure of the base component; when viewed along the main axis, the second protection element and the second structural strengthening part At least a part of the parts overlaps; the third connecting part is connected to the second structural reinforcement part; the first protection element directly contacts the second protection element; the first connecting part is connected to the third connecting part; the base component further includes: a first groove , located on the second substrate surface; a second trench located on the second substrate surface; and a third trench located on the second substrate surface. The third connecting portion corresponds to the first groove; the first groove extends to the first coil; when viewed along the direction perpendicular to the main axis, the first groove does not overlap with the first coil; when viewed along the main axis, The first trench overlaps at least a portion of the first coil; the second trench overlaps at least a portion of the first coil when viewed in a direction perpendicular to the main axis; the second trench is located on the first substrate surface; the first part corresponds to the second groove; the third connecting part corresponds to the second groove; on the main shaft, the maximum size of the first groove is different from the maximum size of the second groove; on the main shaft, the maximum size of the first groove The size is smaller than the maximum size of the second groove; when viewed along the direction perpendicular to the main axis, the third groove does not overlap with the second coil; when viewed along the main axis, at least a part of the third groove and the second coil Overlap; the third connecting portion corresponds to the third groove; on the main axis, the maximum dimension of the third groove is smaller than the maximum dimension of the second groove.

根據本揭露一些實施例,無線傳輸模組更包含一第一導電元件;第一線圈經由第一導電元件電性連接一外部電路;第一導電元件具有板狀結構;第一導電元件具有金屬材質;第一導電元件之至少一部分埋藏且不由基底組件露出;第一導電元件之一第一外部電性連接部之一表面與主軸垂直或平行;第一外部電性連接部配置以電性連接外部電路;第一外部電性連接部之一部分由基底組件露出;第一導電元件之一第一內部電性連接部之一表面與主軸垂直或平行;第一內部電性連接部配置以電性連接第一線圈;第一內部電性連接部由基底組件露出;無線傳輸模組更包含一第一補強元件,直接接觸第一內部電性連接部;第一線圈之一第一導線具有一第一截面,第一導電元件具有一第二截面,且第一截面與第二截面具有不同結構;第一截面具有圓弧結構;第二截面具有多邊形結構;無線傳輸模組更包含:一電子元件,設置於基底組件;一第二導電元件,並且電子元件經由第二導電元件電性連接外部電路;以及一第三導電元件,並且第二線圈經由第三導電元件電性連接外部電路。第二導電元件具有板狀結構;第二導電元件具有金屬材質;第二導電元件之至少一部分埋藏且不由基底組件露出;第二導電元件之一第二外部電性連接部之一表面與主軸垂直或平行;第二外部電性連接部配置以電性連接外部電路;第二外部電性連接部由基底組件露出;第一外部電性連接部之表面與第二外部電性連接部的表面平行;第一外部電性連接部之表面與第二外部電性連接部的表面共平面;第一外部電性連接部中面朝第一線圈之一表面與第一內部電性連接部面朝第一線圈之表面位於不同平面;第二導電元件之一第二內部電性連接部之一表面與主軸垂直或平行;第二內部電性連接部配置以電性連接電子元件;第二內部電性連接部由基底組件露出;第二導電元件具有一第二截面,第二截面具有多邊形結構;第一內部電性連接部之表面與第二內部電性連接部的表面平行;第一內部電性連接部之表面與第二內部電性連接部的表面共平面;第三導電元件具有板狀結構;第三導電元件具有金屬材質;第三導電元件之至少一部分埋藏且不由基底組件露出;第三導電元件之一第三外部電性連接部之一表面與主軸垂直或平行;第三外部電性連接部配置以電性連接外部電路;第三外部電性連接部由基底組件露出;第三導電元件之一第三內部電性連接部之一表面與主軸垂直或平行;第三內部電性連接部配置以電性連接第二線圈;第三內部電性連接部由基底組件露出;第三內部電性連接部之表面與第一內部電性連接部的表面共平面;其中無線傳輸模組更包含:一第二補強元件,直接接觸第二內部電性連接部;一第三補強元件,直接接觸第三內部電性連接部;以及一第四補強元件,直接接觸第一外部電性連接部。第二補強元件具有非金屬材質;第三補強元件具有非金屬材質;第一補強元件與第四補強元件具有一體成型結構;電子元件設置於基底組件之一容納部;容納部具有凹陷結構且位於第一基底表面;無線傳輸模組更包含一第一保護元件,設置於第一線圈上;第一保護元件更包含一開口,對應於容納部;當沿著第一方向觀察時,電子元件之至少一部分由開口露出;第一線圈之至少一部分由容納部露出;在主軸上,第一線圈之一第一感應本體的最大尺寸不同於基底組件的最大尺寸;在主軸上,第一感應本體的最大尺寸小於基底組件的最大尺寸;在主軸上,第一感應本體的最大尺寸小於基底組件的最大尺寸的三分之一。According to some embodiments of the present disclosure, the wireless transmission module further includes a first conductive element; the first coil is electrically connected to an external circuit through the first conductive element; the first conductive element has a plate-like structure; the first conductive element has a metal material ; At least part of the first conductive element is buried and not exposed by the base component; a surface of the first external electrical connection portion of the first conductive element is perpendicular or parallel to the main axis; the first external electrical connection portion is configured to electrically connect to the outside circuit; a portion of the first external electrical connection portion is exposed from the base component; a surface of the first internal electrical connection portion of the first conductive element is perpendicular or parallel to the main axis; the first internal electrical connection portion is configured to be electrically connected The first coil; the first internal electrical connection part is exposed from the base component; the wireless transmission module further includes a first reinforcing element, directly contacting the first internal electrical connection part; one of the first conductors of the first coil has a first Cross-section, the first conductive element has a second cross-section, and the first cross-section and the second cross-section have different structures; the first cross-section has an arc structure; the second cross-section has a polygonal structure; the wireless transmission module further includes: an electronic component, Disposed on the base component; a second conductive element, and the electronic component is electrically connected to the external circuit through the second conductive element; and a third conductive element, and the second coil is electrically connected to the external circuit through the third conductive element. The second conductive element has a plate-like structure; the second conductive element is made of metal; at least a part of the second conductive element is buried and not exposed by the base component; a surface of the second external electrical connection portion of the second conductive element is perpendicular to the main axis or parallel; the second external electrical connection portion is configured to electrically connect to an external circuit; the second external electrical connection portion is exposed from the base component; the surface of the first external electrical connection portion is parallel to the surface of the second external electrical connection portion ; The surface of the first external electrical connection part and the surface of the second external electrical connection part are coplanar; a surface of the first external electrical connection part facing the first coil and the first internal electrical connection part face the third The surfaces of a coil are located in different planes; a surface of a second internal electrical connection part of the second conductive element is perpendicular or parallel to the main axis; the second internal electrical connection part is configured to electrically connect the electronic component; the second internal electrical connection part is The connection part is exposed from the base component; the second conductive element has a second cross-section, and the second cross-section has a polygonal structure; the surface of the first internal electrical connection part is parallel to the surface of the second internal electrical connection part; the first internal electrical connection part The surface of the connecting part is coplanar with the surface of the second internal electrical connection part; the third conductive element has a plate-like structure; the third conductive element has a metal material; at least a part of the third conductive element is buried and not exposed by the base component; the third A surface of a third external electrical connection part of one of the conductive elements is perpendicular or parallel to the main axis; the third external electrical connection part is configured to electrically connect to an external circuit; the third external electrical connection part is exposed from the base component; the third conductive part A surface of the third internal electrical connection part of one of the components is perpendicular or parallel to the main axis; the third internal electrical connection part is configured to electrically connect the second coil; the third internal electrical connection part is exposed from the base component; the third internal The surface of the electrical connection part is coplanar with the surface of the first internal electrical connection part; the wireless transmission module further includes: a second reinforcing element, directly contacting the second internal electrical connection part; a third reinforcing element, directly contacting the second internal electrical connection part; Contacting the third internal electrical connection part; and a fourth reinforcing element directly contacting the first external electrical connection part. The second reinforcing element is made of non-metallic material; the third reinforcing element is made of non-metallic material; the first reinforcing element and the fourth reinforcing element have an integrally formed structure; the electronic component is arranged in a receiving portion of the base component; the receiving portion has a recessed structure and is located The first base surface; the wireless transmission module further includes a first protection element disposed on the first coil; the first protection element further includes an opening corresponding to the receiving portion; when viewed along the first direction, the electronic component At least a part of it is exposed by the opening; at least a part of the first coil is exposed by the receiving part; on the main axis, the maximum size of the first induction body of one of the first coils is different from the maximum size of the base component; on the main axis, the first induction body of the first coil is exposed The maximum dimension is smaller than the maximum dimension of the base component; on the main axis, the maximum dimension of the first sensing body is smaller than one-third of the maximum dimension of the base component.

根據本揭露一些實施例,無線傳輸模組更包含一第二線圈,設置於基底組件;基底組件更包含:一第一感應部,對應於第一線圈並具有一第一特性函數;以及一第二感應部,對應於第二線圈並具有一第二特性函數。當沿著主軸觀察時,第一感應部與第一線圈之至少一部分重疊;當沿著主軸觀察時,第二感應部與第二線圈之至少一部分重疊;對應於一第一頻率之電磁波,第一、第二特性函數不同;基底組件更包含一第二導磁部,與第一導磁部具有不同材質;當沿著主軸觀察時,第二導磁部與第一線圈或第二線圈至少一者重疊;第一感應部涵蓋第一導磁部之一部分;第二感應部涵蓋第二導磁部之一部分;當沿著主軸觀察時,第二導磁部與第一導磁部之至少一部分重疊;當沿著垂直於主軸之方向觀察時,第二導磁部與第一導磁部不重疊;在主軸上,第一感應部之最大尺寸與第二感應部之最大尺寸不同;一外部電路包含一容納空間,配置以容納基底組件之至少一部分;容納空間具有開口結構;當沿著垂直於主軸之方向觀察時,外部電路與基底組件之至少一部分重疊;當沿著主軸之方向觀察時,外部電路與基底組件之至少一部分重疊。According to some embodiments of the present disclosure, the wireless transmission module further includes a second coil disposed on the base component; the base component further includes: a first sensing part corresponding to the first coil and having a first characteristic function; and a first Two induction parts correspond to the second coil and have a second characteristic function. When viewed along the main axis, the first induction part overlaps with at least a part of the first coil; when viewed along the main axis, the second induction part overlaps with at least a part of the second coil; corresponding to an electromagnetic wave of a first frequency, the 1. The second characteristic function is different; the base component further includes a second magnetically conductive part, which is made of a different material from the first magnetically conductive part; when viewed along the main axis, the second magnetically conductive part is at least the same as the first coil or the second coil. One overlaps; the first induction part covers a part of the first magnetic conductive part; the second induction part covers a part of the second magnetic conductive part; when viewed along the main axis, at least one of the second magnetic conductive part and the first magnetic conductive part A portion overlaps; when viewed along the direction perpendicular to the main axis, the second magnetic conductive part does not overlap with the first magnetic conductive part; on the main axis, the maximum size of the first sensing part is different from the maximum size of the second sensing part; 1. The external circuit includes an accommodation space configured to accommodate at least a portion of the base component; the accommodation space has an opening structure; when viewed along a direction perpendicular to the main axis, the external circuit overlaps with at least a portion of the base component; when viewed along the direction of the main axis When the external circuit overlaps at least a portion of the base component.

根據本揭露一些實施例,當沿著垂直於主軸之方向觀察時,外部電路與第一導磁部之至少一部分重疊;當沿著垂直於主軸之方向觀察時,外部電路與第一線圈之至少一部分重疊;當沿著垂直於主軸之方向觀察時,外部電路與第二線圈之至少一部分重疊;基底組件定義有一第一重疊部,並且當沿著垂直於主軸之方向觀察時,外部電路與第一重疊部重疊;當沿著主軸觀察時,外部電路與第一重疊部不重疊;當沿著主軸觀察時,第一重疊部與外部電路之間具有間隙。According to some embodiments of the present disclosure, when viewed in a direction perpendicular to the main axis, the external circuit overlaps at least a portion of the first magnetic conductive portion; when viewed in a direction perpendicular to the main axis, at least a portion of the external circuit and the first coil overlaps. A portion overlaps; when viewed in a direction perpendicular to the main axis, the external circuit overlaps at least a portion of the second coil; the base component defines a first overlapping portion, and when viewed in a direction perpendicular to the main axis, the external circuit overlaps with the third coil An overlapping portion overlaps; when viewed along the main axis, the external circuit does not overlap with the first overlapping portion; when viewed along the main axis, there is a gap between the first overlapping portion and the external circuit.

根據本揭露一些實施例,當沿著垂直於主軸之方向觀察時,外部電路與第一線圈不重疊;當沿著主軸觀察時,外部電路與第一線圈不重疊;當沿著主軸觀察時,外部電路與第二線圈之至少一部分重疊;當沿著垂直於主軸之方向觀察時,外部電路與第二導磁部之至少一部分重疊。According to some embodiments of the present disclosure, when viewed along a direction perpendicular to the main axis, the external circuit does not overlap with the first coil; when viewed along the main axis, the external circuit does not overlap with the first coil; when viewed along the main axis, The external circuit overlaps with at least a portion of the second coil; when viewed along a direction perpendicular to the main axis, the external circuit overlaps with at least a portion of the second magnetic conductive portion.

根據本揭露一些實施例,基底組件定義有一第一重疊部、一第二重疊部以及一第三重疊部;當沿著垂直於主軸之方向觀察時,外部電路與第一重疊部重疊;當沿著主軸觀察時,外部電路與第一重疊部不重疊;當沿著主軸觀察時,外部電路與第二重疊部重疊;當沿著垂直於主軸之方向觀察時,外部電路與第二重疊部不重疊;當沿著主軸觀察時,外部電路與第三重疊部重疊;當沿著垂直於主軸之方向觀察時,外部電路與第三重疊部不重疊;當沿著垂直於主軸之方向觀察時,外部電路位於第二重疊部與第三重疊部之間;第一重疊部、第二重疊部以及第三重疊部具有一體成型結構;第一重疊部接觸外部電路。According to some embodiments of the present disclosure, the base component defines a first overlapping portion, a second overlapping portion and a third overlapping portion; when viewed along a direction perpendicular to the main axis, the external circuit overlaps the first overlapping portion; when viewed along a direction perpendicular to the main axis, When viewed along the main axis, the external circuit does not overlap with the first overlapping portion; when viewed along the main axis, the external circuit does not overlap with the second overlapping portion; when viewed along the direction perpendicular to the main axis, the external circuit does not overlap with the second overlapping portion. Overlap; when viewed along the main axis, the external circuit overlaps with the third overlapping portion; when viewed along the direction perpendicular to the main axis, the external circuit does not overlap with the third overlapping portion; when viewed along the direction perpendicular to the main axis, The external circuit is located between the second overlapping part and the third overlapping part; the first overlapping part, the second overlapping part and the third overlapping part have an integrally formed structure; the first overlapping part contacts the external circuit.

本揭露提出一種用於傳輸能量或訊號的無線傳輸模組,包括一基底組件以及至少一線圈。線圈是設置在基底組件中,並且基底組件是由複數個導磁性元件所組成。在經過加熱加壓後,這些導磁性元件會彼此連接,使得基底組件形成固體的板狀結構,並且線圈可以穩固地固定於基底組件中。The present disclosure proposes a wireless transmission module for transmitting energy or signals, including a base component and at least one coil. The coil is arranged in the base component, and the base component is composed of a plurality of magnetic conductive elements. After being heated and pressurized, these magnetically permeable elements will be connected to each other, so that the base assembly forms a solid plate-like structure, and the coil can be firmly fixed in the base assembly.

基於本揭露之無線傳輸模組的設計,不需要使用膠水或膠帶便可以將線圈固定於基底組件內,因此可以提升機械強度、提升使用效率、提升充電效率、提升散熱效率、達成整體小型化、整體輕量化以及降低電磁干擾等。Based on the design of the wireless transmission module disclosed in this disclosure, the coil can be fixed in the base component without the use of glue or tape. Therefore, the mechanical strength, usage efficiency, charging efficiency, heat dissipation efficiency, and overall miniaturization can be improved. Overall lightweight and reduction of electromagnetic interference, etc.

以下公開許多不同的實施方法或是範例來實行所提供之標的之不同特徵,以下描述具體的元件及其排列的實施例以闡述本揭露。當然這些實施例僅用以例示,且不以此限定本揭露的範圍。舉例來說,在說明書中提到第一特徵部件形成於第二特徵部件之上,其可包括第一特徵部件與第二特徵部件是直接接觸的實施例,另外也可包括於第一特徵部件與第二特徵部件之間另外有其他特徵的實施例,換句話說,第一特徵部件與第二特徵部件並非直接接觸。Many different implementation methods or examples are disclosed below to implement different features of the provided subject matter, and examples of specific elements and their arrangements are described below to illustrate the present disclosure. Of course, these embodiments are only for illustration and do not limit the scope of the present disclosure. For example, it is mentioned in the description that the first feature component is formed on the second feature component, which may include an embodiment in which the first feature component is in direct contact with the second feature component, or may also include an embodiment where the first feature component is in direct contact with the second feature component. There are other embodiments with other features between the second feature component, in other words, the first feature component and the second feature component are not in direct contact.

此外,在不同實施例中可能使用重複的標號或標示,這些重複僅為了簡單清楚地敘述本揭露,不代表所討論的不同實施例及/或結構之間有特定的關係。此外,在本揭露中的在另一特徵部件之上形成、連接到及/或耦接到另一特徵部件可包括其中特徵部件形成為直接接觸的實施例,並且還可包括其中可形成插入上述特徵部件的附加特徵部件的實施例,使得上述特徵部件可能不直接接觸。此外,其中可能用到與空間相關用詞,例如“垂直的”、“上方”、"上"、"下"、"底"及類似的用詞(如"向下地"、"向上地"等),這些空間相關用詞係為了便於描述圖示中一個(些)元件或特徵與另一個(些)元件或特徵之間的關係,這些空間相關用詞旨在涵蓋包括特徵的裝置的不同方向。In addition, repeated numbers or designations may be used in different embodiments. These repetitions are only for the purpose of describing the present disclosure simply and clearly, and do not represent a specific relationship between the different embodiments and/or structures discussed. Additionally, forming on, connecting to, and/or coupling to another feature in the present disclosure may include embodiments in which the feature is formed in direct contact, and may also include embodiments in which the feature may be formed in direct contact. Embodiments of additional features of features such that said features may not be in direct contact. In addition, words related to space may be used, such as "vertical", "above", "upper", "lower", "bottom" and similar words (such as "downwardly", "upwardly", etc. ), these spatially relative terms are used to facilitate describing the relationship between one element or feature(s) in the illustrations and another element or feature(s), and these spatially relative terms are intended to encompass different orientations of the device including the features. .

除非另外定義,在此使用的全部用語(包括技術及科學用語)具有與此篇揭露所屬之一般技藝者所通常理解的相同涵義。能理解的是這些用語,例如在通常使用的字典中定義的用語,應被解讀成具有一與相關技術及本揭露的背景或上下文一致的意思,而不應以一理想化或過度正式的方式解讀,除非在此有特別定義。Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure belongs. It is understood that these terms, such as terms defined in commonly used dictionaries, should be interpreted to have a meaning consistent with the relevant technology and the background or context of the present disclosure, and should not be interpreted in an idealized or overly formal manner. Interpretation, unless otherwise defined herein.

再者,說明書與請求項中所使用的序數例如”第一”、”第二”等之用詞,以修飾請求項之元件,其本身並不意含及代表請求元件有任何之前的序數,也不代表某一請求元件與另一請求元件的順序、或是製造方法上的順序,等序數的使用僅用來使具有某命名的一請求元件得以和另一具有相同命名的請求元件能作出清楚區分。Furthermore, the ordinal numbers used in the specification and claims, such as "first", "second", etc., are used to modify the elements of the claim. They themselves do not imply or represent that the claim element has any previous ordinal number, nor do they mean that the claim element has any previous ordinal number. It does not represent the order of a certain request component and another request component, or the order in the manufacturing method. The use of equal ordinal numbers is only used to make one request component with a certain name clear from another request component with the same name. Distinguish.

此外,在本揭露一些實施例中,關於接合、連接之用語例如「連接」、「互連」等,除非特別定義,否則可指兩個結構係直接接觸,或者亦可指兩個結構並非直接接觸,其中有其它結構設於此兩個結構之間。且此關於接合、連接之用語亦可包括兩個結構都可移動,或者兩個結構都固定之情況。In addition, in some embodiments of the present disclosure, terms related to joining and connecting, such as "connection", "interconnection", etc., unless otherwise defined, may mean that two structures are in direct contact, or may also mean that the two structures are not in direct contact. Contact, where other structures are located between the two structures. And the terms about joining and connecting can also include the situation where both structures are movable, or both structures are fixed.

請參考第1圖,第1圖為根據本揭露一實施例之一無線傳輸模組100與一電子模組200之剖面示意圖。無線傳輸模組100是一種可用於傳輸能量或是訊號之無線傳輸模組,並且電子模組200例如為具有線圈202的電子裝置。如第1圖所示,無線傳輸模組100對應於電子模組200並配置以傳輸一第一訊號,其中第一訊號例如可為充電訊號。於此實施例中,無線傳輸模組100可包括一基底組件102以及一第一線圈104,並且第一線圈104設置於基底組件102。Please refer to Figure 1 , which is a schematic cross-sectional view of a wireless transmission module 100 and an electronic module 200 according to an embodiment of the present disclosure. The wireless transmission module 100 is a wireless transmission module that can be used to transmit energy or signals, and the electronic module 200 is, for example, an electronic device having a coil 202 . As shown in FIG. 1 , the wireless transmission module 100 corresponds to the electronic module 200 and is configured to transmit a first signal, where the first signal may be a charging signal, for example. In this embodiment, the wireless transmission module 100 may include a base component 102 and a first coil 104, and the first coil 104 is disposed on the base component 102.

於此實施例中,第一線圈104可作為一充電線圈,用以對一外部裝置進行無線充電。舉例來說,第一線圈104可基於無線充電聯盟(Alliance for Wireless Power;A4WP)的標準作為一共振式充電線圈,但不限於此。另外,第一線圈104是可基於無線電力聯盟(Wireless Power Consortium,WPC)的標準,例如Qi標準,以作為一感應式充電線圈。因此,此實施方式可使第一線圈104能同時對應不同形式的充電方式,以增加可應用的範圍。舉例來說,在近距離(例如1cm以下)時,使用感應式操作;而在遠距離時,使用共振式操作。In this embodiment, the first coil 104 can be used as a charging coil for wirelessly charging an external device. For example, the first coil 104 can be a resonant charging coil based on the Alliance for Wireless Power (A4WP) standard, but is not limited thereto. In addition, the first coil 104 may be based on the Wireless Power Consortium (WPC) standard, such as the Qi standard, and serve as an inductive charging coil. Therefore, this implementation can enable the first coil 104 to handle different forms of charging methods at the same time, thereby increasing the applicable range. For example, at short distances (for example, less than 1cm), inductive operation is used; while at long distances, resonance operation is used.

於此實施例中,第一線圈104也可作為一通訊線圈,例如操作在近場通訊(Near Field Communication,NFC)模式,以與外部之電子裝置(例如電子模組200的線圈202)進行通訊。In this embodiment, the first coil 104 can also be used as a communication coil, for example, operating in a Near Field Communication (NFC) mode to communicate with an external electronic device (such as the coil 202 of the electronic module 200 ). .

如第1圖所示,無線傳輸模組100可定義有一對應表面ICS,面朝電子模組200並與一主軸AX垂直。主軸AX例如為第一線圈104的繞線軸,但不限於此。當沿著主軸AX觀察時,第一線圈104與基底組件102之至少一部分重疊。當沿著垂直於主軸AX之方向觀察時,第一線圈104與基底組件102之至少一部分重疊。As shown in Figure 1, the wireless transmission module 100 can define a corresponding surface ICS, facing the electronic module 200 and perpendicular to a main axis AX. The main axis AX is, for example, the winding axis of the first coil 104, but is not limited thereto. The first coil 104 overlaps at least a portion of the base assembly 102 when viewed along the main axis AX. When viewed along a direction perpendicular to the main axis AX, the first coil 104 overlaps at least a portion of the base assembly 102 .

基底組件102可包含有一第一基底表面102S1以及一第二基底表面102S2,第一基底表面102S1是面朝電子模組200,並且第一基底表面102S1以及第二基底表面102S2面朝不同方向。於此實施例中,對應表面ICS為一假想面,完全重疊於第一基底表面102S1(平面)。要注意的是,當第一基底表面102S1非平面時,對應表面ICS也對應地為非平面,例如為曲面。The base component 102 may include a first base surface 102S1 and a second base surface 102S2. The first base surface 102S1 faces the electronic module 200, and the first base surface 102S1 and the second base surface 102S2 face different directions. In this embodiment, the corresponding surface ICS is an imaginary surface that completely overlaps the first substrate surface 102S1 (plane). It should be noted that when the first substrate surface 102S1 is non-planar, the corresponding surface ICS is also correspondingly non-planar, such as a curved surface.

請參考第1圖與第2圖,第2圖為根據本揭露一實施例之基底組件102未加壓加熱前的結構放大圖。於此實施例中,基底組件102包含一第一導磁部1021,具有一第一導磁性材質。舉例來說,第一導磁性材質可包含鐵元素、矽元素或鉻元素。意即,基底組件102可包含鐵元素,基底組件102可包含矽元素,並且基底組件102可包含鉻元素。Please refer to Figures 1 and 2. Figure 2 is an enlarged structural view of the base component 102 before pressure and heating according to an embodiment of the present disclosure. In this embodiment, the base component 102 includes a first magnetically conductive portion 1021 with a first magnetically conductive material. For example, the first magnetic conductive material may include iron element, silicon element or chromium element. That is, the base component 102 may include iron element, the base component 102 may include silicon element, and the base component 102 may include chromium element.

如第2圖所示,基底組件102之第一導磁部1021包含複數個第一導磁性元件MCE1,其中第一導磁性元件MCE1可為粉粒狀或是片狀。這些第一導磁性元件MCE1之最大直徑是小於0.05mm。再者,無線傳輸模組100更包含一第一接著元件AE1,配置以接著這些第一導磁性元件MCE1。具體而言,如第2圖所示,每一第一導磁性元件MCE1外是由第一接著元件AE1包圍。As shown in FIG. 2 , the first magnetic conductive part 1021 of the base component 102 includes a plurality of first magnetic conductive elements MCE1 , where the first magnetic conductive elements MCE1 can be in the form of powder or sheet. The maximum diameter of these first magnetic conductive elements MCE1 is less than 0.05mm. Furthermore, the wireless transmission module 100 further includes a first connecting element AE1 configured to connect the first magnetic conductive elements MCE1. Specifically, as shown in FIG. 2 , each first magnetic conductive element MCE1 is surrounded by a first connecting element AE1 .

接著,請參考第2圖與第3圖,第3圖為根據本揭露一實施例之基底組件102經過加壓加熱後結構放大圖。如第3圖所示,經過加壓加熱後,第一接著元件AE1會熔解以將這些第一導磁性元件MCE1連接在一起。意即,第一接著元件AE1是直接接觸這些第一導磁性元件MCE1。Next, please refer to Figures 2 and 3. Figure 3 is an enlarged structural view of the base component 102 after pressure and heating according to an embodiment of the present disclosure. As shown in Figure 3, after pressure and heating, the first connecting element AE1 will melt to connect the first magnetic conductive elements MCE1 together. That is to say, the first connecting element AE1 is in direct contact with the first magnetic conductive elements MCE1.

再者,熔解的第一接著元件AE1也會直接接觸第一線圈104,使得第一線圈104經由第一接著元件AE1固定地連接這些第一導磁性元件MCE1。於此實施例中,第一接著元件AE1之熔點高於攝氏70度,並且第一接著元件AE1之熔點低於攝氏400度,但不限於此。Furthermore, the melted first connecting element AE1 will also directly contact the first coil 104, so that the first coil 104 is fixedly connected to the first magnetic conductive elements MCE1 through the first connecting element AE1. In this embodiment, the melting point of the first connecting element AE1 is higher than 70 degrees Celsius, and the melting point of the first connecting element AE1 is lower than 400 degrees Celsius, but is not limited thereto.

另外,於此實施例中,基底組件102可更包含一第二導磁部1022,連接於第一導磁部1021,並且第二導磁部1022與第一導磁部1021具有不同材質。例如,第二導磁部1022是由複數個不同材質的第二導磁性元件所構成。舉例來說,第一導磁性元件可為鐵製成,而第二導磁性元件可為鉻製成。相似於第一導磁部1021,這些第二導磁性元件可由一第二接著元件所連接,故其配置便不再詳述。In addition, in this embodiment, the base component 102 may further include a second magnetic conductive part 1022 connected to the first magnetic conductive part 1021, and the second magnetic conductive part 1022 and the first magnetic conductive part 1021 are made of different materials. For example, the second magnetic conductive part 1022 is composed of a plurality of second magnetic conductive elements of different materials. For example, the first magnetically permeable element can be made of iron, and the second magnetically permeable element can be made of chromium. Similar to the first magnetic conductive part 1021, these second magnetic conductive elements can be connected by a second connecting element, so their configuration will not be described in detail.

如第1圖所示,當沿著一第一方向D1觀察時,基底組件102是覆蓋第一線圈104之至少一部分。其中,第一方向D1是相反於對應表面ICS所面朝之一方向D2。基底組件102可包含至少一支撐部STP以及至少一覆蓋部CVP。支撐部STP是配置以支撐第一線圈104,而覆蓋部CVP是配置以覆蓋第一線圈104之一部分。As shown in FIG. 1 , when viewed along a first direction D1 , the base component 102 covers at least a portion of the first coil 104 . The first direction D1 is opposite to the direction D2 facing the corresponding surface ICS. The base component 102 may include at least one supporting part STP and at least one covering part CVP. The supporting portion STP is configured to support the first coil 104 , and the covering portion CVP is configured to cover a portion of the first coil 104 .

當沿著垂直於主軸AX之方向(例如Y軸)觀察時,第一線圈104是位於支撐部STP與電子模組200之間。當沿著主軸AX觀察時,第一線圈104與支撐部STP之至少一部分重疊。When viewed along the direction perpendicular to the main axis AX (for example, the Y-axis), the first coil 104 is located between the support part STP and the electronic module 200 . When viewed along the main axis AX, the first coil 104 overlaps at least a portion of the support portion STP.

當沿著第一方向D1觀察時,覆蓋部CVP之至少一部分與第一線圈104重疊。當沿著垂直於主軸AX之方向(例如X軸)觀察時,覆蓋部CVP之至少一部分與第一線圈104重疊。當沿著垂直於主軸AX之方向觀察時,在主軸AX上,第一線圈104之中心104C是位於覆蓋部CVP與支撐部STP之間。When viewed along the first direction D1, at least a portion of the covering portion CVP overlaps the first coil 104. When viewed along a direction perpendicular to the main axis AX (eg, the X-axis), at least a portion of the covering portion CVP overlaps the first coil 104 . When viewed along the direction perpendicular to the main axis AX, the center 104C of the first coil 104 is located between the covering part CVP and the supporting part STP on the main axis AX.

請參考第4圖與第5圖,第4圖為根據本揭露另一實施例之無線傳輸模組100A之剖面示意圖,並且第5圖為根據本揭露另一實施例之無線傳輸模組100A之側面示意圖。相似於前述實施例,無線傳輸模組100A具有第一導磁部1021與第二導磁部1022。Please refer to Figures 4 and 5. Figure 4 is a schematic cross-sectional view of a wireless transmission module 100A according to another embodiment of the present disclosure, and Figure 5 is a schematic cross-sectional view of a wireless transmission module 100A according to another embodiment of the present disclosure. Side view. Similar to the previous embodiment, the wireless transmission module 100A has a first magnetic conductive part 1021 and a second magnetic conductive part 1022.

如第4圖所示,第二導磁部1022具有U形結構,環繞第一導磁部1021。再者,此實施例之無線傳輸模組100A更包含一第二線圈106,設置於基底組件102之第二導磁部1022中。當沿著垂直於主軸AX之方向觀察時,第二導磁部1022與第一導磁部1021之至少一部分重疊。As shown in FIG. 4 , the second magnetic conductive part 1022 has a U-shaped structure surrounding the first magnetic conductive part 1021 . Furthermore, the wireless transmission module 100A of this embodiment further includes a second coil 106 disposed in the second magnetic conductive portion 1022 of the base component 102 . When viewed along the direction perpendicular to the main axis AX, the second magnetic conductive portion 1022 overlaps at least a portion of the first magnetic conductive portion 1021 .

於此實施例中,第一線圈104包含一第一引線WR1以及一增強元件GU,並且第二線圈106包含一第二引線WR2。第一引線WR1與第二引線WR2是位於基底組件102之一第一側壁表面102S3,並且增強元件GU是設置於第一引線WR1以及第二引線WR2上。In this embodiment, the first coil 104 includes a first lead WR1 and a reinforcing element GU, and the second coil 106 includes a second lead WR2. The first lead WR1 and the second lead WR2 are located on one of the first sidewall surfaces 102S3 of the base component 102, and the enhancement element GU is disposed on the first lead WR1 and the second lead WR2.

第一側壁表面102S3與主軸AX平行。第一引線WR1通過第一側壁表面102S3之一第一開口OP1,並且第二引線WR2通過第一側壁表面102S3之一第二開口OP2。第一開口OP1與第二開口OP2具有封閉結構。意即,如第5圖所示,第一開口OP1與第二開口OP2的輪廓是封閉的。The first side wall surface 102S3 is parallel to the main axis AX. The first lead WR1 passes through a first opening OP1 of the first sidewall surface 102S3, and the second lead WR2 passes through a second opening OP2 of the first sidewall surface 102S3. The first opening OP1 and the second opening OP2 have a closed structure. That is, as shown in FIG. 5 , the outlines of the first opening OP1 and the second opening OP2 are closed.

於此實施例中,增強元件GU直接接觸第一開口OP1以及第二開口OP2。增強元件GU具有非金屬材質,增強元件GU例如為膠水,但不限於此。增強元件GU可避免第一引線WR1與第二引線WR2容易斷裂的問題。In this embodiment, the reinforcing element GU directly contacts the first opening OP1 and the second opening OP2. The reinforcing element GU is made of non-metallic material. The reinforcing element GU is, for example, glue, but is not limited thereto. The reinforcing element GU can avoid the problem that the first lead WR1 and the second lead WR2 are easily broken.

如第4圖所示,在主軸AX上,第一線圈104與對應表面ICS之最短距離不同於第一引線WR1與對應表面ICS之最短距離。舉例來說,在主軸AX上,第一線圈104與對應表面ICS之最短距離小於第一引線WR1與對應表面ICS之最短距離。As shown in FIG. 4 , on the main axis AX, the shortest distance between the first coil 104 and the corresponding surface ICS is different from the shortest distance between the first lead WR1 and the corresponding surface ICS. For example, on the main axis AX, the shortest distance between the first coil 104 and the corresponding surface ICS is smaller than the shortest distance between the first lead WR1 and the corresponding surface ICS.

相似地,基底組件102包含第一基底表面102S1,面朝一電子模組(圖中未表示),並且第一基底表面102S1與第一側壁表面102S3不平行。Similarly, the base assembly 102 includes a first base surface 102S1 facing an electronic module (not shown in the figure), and the first base surface 102S1 and the first side wall surface 102S3 are not parallel.

再者,基底組件102可更包含至少一第一結構強化部1023,配置以強化基底組件102之機械結構。第一結構強化部1023位於第一基底表面102S1與第一側壁表面102S3之間。第一結構強化部1023例如為一表面(斜面),其係不平行於第一基底表面102S1與第一側壁表面102S3。Furthermore, the base component 102 may further include at least a first structural strengthening part 1023 configured to strengthen the mechanical structure of the base component 102. The first structural reinforcement part 1023 is located between the first base surface 102S1 and the first side wall surface 102S3. The first structural reinforcement part 1023 is, for example, a surface (inclined surface) that is not parallel to the first base surface 102S1 and the first side wall surface 102S3.

於此實施例中,第一結構強化部1023之表面與第一基底表面102S1之夾角大於15度,並且第一結構強化部1023之表面與第一側壁表面102S3之夾角大於15度,但不限於此。在其他實施例中,第一結構強化部1023例如為一曲面,具有大於0.05mm的曲率半徑。In this embodiment, the angle between the surface of the first structural reinforcement part 1023 and the first base surface 102S1 is greater than 15 degrees, and the angle between the surface of the first structural reinforcement part 1023 and the first side wall surface 102S3 is greater than 15 degrees, but is not limited to this. In other embodiments, the first structural reinforcement part 1023 is, for example, a curved surface with a curvature radius greater than 0.05 mm.

相似地,第二基底表面102S2與第一基底表面102S1係面朝相反方向。再者,基底組件102可更包含至少一第二結構強化部1024,配置以強化基底組件102之機械結構。第二結構強化部1024位於第二基底表面102S2與第一側壁表面102S3之間。Similarly, the second substrate surface 102S2 and the first substrate surface 102S1 face opposite directions. Furthermore, the base component 102 may further include at least a second structural strengthening portion 1024 configured to strengthen the mechanical structure of the base component 102 . The second structural reinforcement 1024 is located between the second base surface 102S2 and the first sidewall surface 102S3.

第二結構強化部1024之表面不平行於第二基底表面102S2與第一側壁表面102S3。當沿著主軸AX觀察時,第一結構強化部1023重疊於第二結構強化部1024之至少一部分。The surface of the second structural reinforcement part 1024 is not parallel to the second base surface 102S2 and the first side wall surface 102S3. When viewed along the main axis AX, the first structural reinforcement portion 1023 overlaps at least a portion of the second structural reinforcement portion 1024 .

於此實施例中,第二結構強化部1024之結構與第一結構強化部1023之結構不同。具體而言,第二結構強化部1024之表面為一曲面,具有大於0.05mm的曲率半徑,但不限於此。在其他實施例中,第二結構強化部1024也可為平面,並且此平面與第二基底表面102S2之夾角以及此平面與第一側壁表面102S3之夾角皆大於15度。In this embodiment, the structure of the second structural strengthening part 1024 is different from the structure of the first structural strengthening part 1023. Specifically, the surface of the second structural reinforcement part 1024 is a curved surface with a curvature radius greater than 0.05 mm, but is not limited thereto. In other embodiments, the second structural reinforcement part 1024 may also be a plane, and the angle between the plane and the second base surface 102S2 and the angle between the plane and the first side wall surface 102S3 are both greater than 15 degrees.

於此實施例中,第二線圈106與第一線圈104是電性獨立。第一線圈104與第二線圈106之其中一者配置以傳輸第一訊號(例如為充電訊號),並且另一者配置以傳輸一第二訊號 (例如為通訊訊號)。當沿著垂直於主軸AX之方向(例如X軸)觀察時,第二線圈106與第一線圈104之至少一部分重疊。In this embodiment, the second coil 106 and the first coil 104 are electrically independent. One of the first coil 104 and the second coil 106 is configured to transmit a first signal (eg, a charging signal), and the other is configured to transmit a second signal (eg, a communication signal). The second coil 106 overlaps at least a portion of the first coil 104 when viewed along a direction perpendicular to the main axis AX (eg, the X-axis).

接著請參考第6圖,第6圖為根據本揭露另一實施例之無線傳輸模組100B之剖面示意圖。於此實施例中,無線傳輸模組100B可更包含一第一保護元件110,設置於第一線圈104以及第二線圈106上。第一保護元件110可為雙面膠,例如為聚乙烯對苯二甲酸酯(PET)所製成,但不限於此。Next, please refer to Figure 6 , which is a schematic cross-sectional view of a wireless transmission module 100B according to another embodiment of the present disclosure. In this embodiment, the wireless transmission module 100B may further include a first protection element 110 disposed on the first coil 104 and the second coil 106 . The first protective element 110 may be double-sided tape, for example, made of polyethylene terephthalate (PET), but is not limited thereto.

第一保護元件110具有板狀結構,直接接觸第一基底表面102S1。第一保護元件110直接接觸第一線圈104以及第二線圈106。第一保護元件110可包含一第一接著部112,配置以接著於第一線圈104與第二線圈106。The first protection element 110 has a plate-like structure and directly contacts the first substrate surface 102S1. The first protection element 110 directly contacts the first coil 104 and the second coil 106 . The first protection element 110 may include a first connecting portion 112 configured to be connected to the first coil 104 and the second coil 106 .

再者,第一接著部112接著於第一基底表面102S1,並且第一接著部112接著於覆蓋部CVP。當沿著垂直於主軸AX之方向觀察時,第一線圈104位於支撐部STP與第一保護元件110之間。Furthermore, the first bonding portion 112 is bonded to the first base surface 102S1, and the first bonding portion 112 is bonded to the covering portion CVP. When viewed along the direction perpendicular to the main axis AX, the first coil 104 is located between the support part STP and the first protection element 110 .

第一保護元件110更包含一第一本體111,並且第一接著部112設置於第一本體111上。第一保護元件110更包含一第二接著部113,配置以接著於一第一外部元件(圖中未表示)。第一本體111是位於第一接著部112與第二接著部113之間,並且第一外部元件為一電子設備之一殼體。電子設備例如可為一智慧型手機,並且所述殼體例如為智慧型手機的背蓋,但不限於此。The first protection element 110 further includes a first body 111, and the first connecting portion 112 is disposed on the first body 111. The first protection component 110 further includes a second connecting portion 113 configured to be connected to a first external component (not shown in the figure). The first body 111 is located between the first connecting portion 112 and the second connecting portion 113 , and the first external component is a casing of an electronic device. The electronic device may be, for example, a smart phone, and the housing may be, for example, the back cover of the smart phone, but is not limited thereto.

相似於前述實施例,基底組件102也包含第一結構強化部1023,配置以強化基底組件102之機械結構。當沿著主軸AX觀察時,第一保護元件110與第一結構強化部1023之至少一部分重疊。舉例來說,第一接著部112接著於第一結構強化部1023。Similar to the previous embodiments, the base component 102 also includes a first structural strengthening portion 1023 configured to strengthen the mechanical structure of the base component 102 . When viewed along the main axis AX, the first protective element 110 overlaps at least a portion of the first structural reinforcement 1023 . For example, the first connecting part 112 is connected to the first structural strengthening part 1023 .

再者,無線傳輸模組100可更包含一第二保護元件120,設置於第二基底表面102S2上。相似於第一保護元件110,第二保護元件120具有板狀結構。當沿著垂直於主軸AX之方向觀察時,支撐部STP位於第一線圈104與第二保護元件120之間。Furthermore, the wireless transmission module 100 may further include a second protection element 120 disposed on the second substrate surface 102S2. Similar to the first protection element 110, the second protection element 120 has a plate-like structure. When viewed along the direction perpendicular to the main axis AX, the support portion STP is located between the first coil 104 and the second protection element 120 .

第二保護元件120包含一第三接著部122,配置以接著於第二基底表面102S2。第二保護元件120更包含一第二本體121,並且第三接著部122設置於第二本體121上。第二保護元件120更包含一第四接著部123,配置以接著於一第二外部元件,並且第二本體121位於第三接著部122與第四接著部123之間。The second protection element 120 includes a third bonding portion 122 configured to bond to the second substrate surface 102S2. The second protection element 120 further includes a second body 121, and the third connecting portion 122 is disposed on the second body 121. The second protection component 120 further includes a fourth connecting portion 123 configured to be connected to a second external component, and the second body 121 is located between the third connecting portion 122 and the fourth connecting portion 123 .

第二外部元件為電子設備之一電路組件。舉例來說,電子設備為智慧型手機,而所述電路組件可為智慧型手機的電路板,但不限於此。The second external component is a circuit component of the electronic device. For example, the electronic device is a smartphone, and the circuit component can be a circuit board of the smartphone, but is not limited thereto.

相似地,基底組件102也包含第二結構強化部1024,配置以強化基底組件102之機械結構。當沿著主軸AX觀察時,第二保護元件120與第二結構強化部1024之至少一部分重疊。舉例來說,第三接著部122接著於第二結構強化部1024。Similarly, the base component 102 also includes a second structural strengthening portion 1024 configured to strengthen the mechanical structure of the base component 102 . The second protective element 120 overlaps at least a portion of the second structural reinforcement 1024 when viewed along the main axis AX. For example, the third connecting part 122 is connected to the second structural strengthening part 1024.

值得注意的是,於此實施例中,第一保護元件110直接接觸第二保護元件120。具體來說,第一接著部112是接著於第三接著部122。It is worth noting that in this embodiment, the first protection element 110 directly contacts the second protection element 120 . Specifically, the first bonding part 112 is bonded to the third bonding part 122 .

另外,於此實施例中,基底組件102可更包含至少一第一溝槽TR1、至少一第二溝槽TR2以及至少一第三溝槽TR3。第一溝槽TR1位於第二基底表面102S2上,第二溝槽TR2位於第二基底表面102S2上,並且第三溝槽TR3位於第二基底表面102S2上。In addition, in this embodiment, the base component 102 may further include at least a first trench TR1, at least a second trench TR2, and at least a third trench TR3. The first trench TR1 is located on the second substrate surface 102S2, the second trench TR2 is located on the second substrate surface 102S2, and the third trench TR3 is located on the second substrate surface 102S2.

如第6圖所示,第三接著部122是對應於第一溝槽TR1,並且第一溝槽TR1延伸至第一線圈104。當沿著垂直於主軸AX之方向觀察時,第一溝槽TR1與第一線圈104不重疊。當沿著主軸AX觀察時,第一溝槽TR1與第一線圈104之至少一部分重疊。As shown in FIG. 6 , the third connecting portion 122 corresponds to the first trench TR1 , and the first trench TR1 extends to the first coil 104 . When viewed along the direction perpendicular to the main axis AX, the first trench TR1 does not overlap the first coil 104 . The first trench TR1 overlaps at least a portion of the first coil 104 when viewed along the main axis AX.

當沿著垂直於主軸AX之方向觀察時,第二溝槽TR2與第一線圈104之至少一部分重疊。第二溝槽TR2位於第一基底表面102S1上,第一接著部112對應於第二溝槽TR2,並且第三接著部122對應於第二溝槽TR2。具體而言,第一接著部112與第三接著部122配置以黏著於第二溝槽TR2兩側的第一導磁部1021。When viewed along the direction perpendicular to the main axis AX, the second trench TR2 overlaps at least a portion of the first coil 104 . The second trench TR2 is located on the first substrate surface 102S1, the first connecting portion 112 corresponds to the second trench TR2, and the third connecting portion 122 corresponds to the second trench TR2. Specifically, the first connecting portion 112 and the third connecting portion 122 are configured to adhere to the first magnetic conductive portion 1021 on both sides of the second trench TR2.

在主軸AX上,第一溝槽TR1之最大尺寸不同於第二溝槽TR2之最大尺寸。舉例來說,在主軸AX上,第一溝槽TR1之最大尺寸小於第二溝槽TR2之最大尺寸。On the spindle AX, the maximum size of the first groove TR1 is different from the maximum size of the second groove TR2. For example, on the spindle AX, the maximum size of the first groove TR1 is smaller than the maximum size of the second groove TR2.

當沿著垂直於主軸AX之方向觀察時,第三溝槽TR3與第二線圈106不重疊。當沿著主軸AX觀察時,第三溝槽TR3與第二線圈106之至少一部分重疊。第三接著部122對應於第三溝槽TR3。在主軸AX上,第三溝槽TR3之最大尺寸小於第二溝槽TR2之最大尺寸。When viewed along the direction perpendicular to the main axis AX, the third trench TR3 does not overlap the second coil 106 . The third trench TR3 overlaps at least a portion of the second coil 106 when viewed along the main axis AX. The third connecting portion 122 corresponds to the third trench TR3. On the spindle AX, the maximum size of the third groove TR3 is smaller than the maximum size of the second groove TR2.

基於此實施例之第一溝槽TR1 、第二溝槽TR2 與第三溝槽TR3 之結構設計,可以提升基底組件102的散熱效率,並且也可使基底組件102具有可撓性。Based on the structural design of the first trench TR1 , the second trench TR2 and the third trench TR3 in this embodiment, the heat dissipation efficiency of the base component 102 can be improved, and the base component 102 can also be made flexible.

請參考第7圖,第7圖為根據本揭露另一實施例之無線傳輸模組100C之剖面示意圖。於此實施例中,無線傳輸模組100C可更包含至少一第一導電元件130,並且第一線圈104是經由第一導電元件130電性連接一外部電路。所述外部電路例如為前述智慧型手機的電路板,但不限於此。Please refer to Figure 7 , which is a schematic cross-sectional view of a wireless transmission module 100C according to another embodiment of the present disclosure. In this embodiment, the wireless transmission module 100C may further include at least a first conductive element 130, and the first coil 104 is electrically connected to an external circuit through the first conductive element 130. The external circuit is, for example, the circuit board of the aforementioned smart phone, but is not limited thereto.

如第7圖所示,第一導電元件130具有板狀結構,並且第一導電元件130具有金屬材質。第一導電元件130之至少一部分是埋藏且不由基底組件102露出。As shown in FIG. 7 , the first conductive element 130 has a plate-like structure, and the first conductive element 130 is made of metal material. At least a portion of the first conductive element 130 is buried and not exposed by the base component 102 .

再者,第一導電元件130之一第一外部電性連接部131之表面與主軸AX垂直或平行。舉例來說,表面1311垂直於主軸AX。第一外部電性連接部131配置以電性連接所述外部電路。第一外部電性連接部131之一部分(例如表面1311)是由基底組件102露出。Furthermore, the surface of the first external electrical connection portion 131 of the first conductive element 130 is perpendicular or parallel to the main axis AX. For example, surface 1311 is perpendicular to the main axis AX. The first external electrical connection part 131 is configured to electrically connect the external circuit. A portion of the first external electrical connection portion 131 (for example, the surface 1311 ) is exposed from the base component 102 .

相似地,第一內部電性連接部132之表面與主軸AX垂直或平行。舉例來說,表面1322垂直於主軸AX。第一內部電性連接部132配置以電性連接第一線圈104。Similarly, the surface of the first internal electrical connection portion 132 is perpendicular or parallel to the main axis AX. For example, surface 1322 is perpendicular to principal axis AX. The first internal electrical connection portion 132 is configured to electrically connect the first coil 104 .

第一內部電性連接部132是經由一穿孔PR1由基底組件102露出。再者,無線傳輸模組100C可更包含一第一補強元件EF1,設置於穿孔PR1內並且直接接觸第一內部電性連接部132。第一補強元件EF1例如可為膠水,但不限於此。The first internal electrical connection portion 132 is exposed from the base component 102 through a through hole PR1. Furthermore, the wireless transmission module 100C may further include a first reinforcing element EF1, which is disposed in the through hole PR1 and directly contacts the first internal electrical connection part 132. The first reinforcing element EF1 may be glue, for example, but is not limited thereto.

如第7圖所示,第一線圈104之一第一導線1041具有一第一截面,第一導電元件130具有一第二截面,且第一截面與第二截面具有不同結構。舉例來說,第一截面具有圓弧結構,並且第二截面具有多邊形結構(矩形結構)。As shown in FIG. 7 , the first conductor 1041 of the first coil 104 has a first cross section, the first conductive element 130 has a second cross section, and the first cross section and the second cross section have different structures. For example, the first cross section has an arc structure, and the second cross section has a polygonal structure (rectangular structure).

另外,要注意的是,在其他實施例中,基底組件102可不包含穿孔PR1,意即第一內部電性連接部132是埋藏且不由基底組件102露出。In addition, it should be noted that in other embodiments, the base component 102 may not include the through hole PR1 , which means that the first internal electrical connection portion 132 is buried and not exposed by the base component 102 .

無線傳輸模組100C更包含一電子元件170、至少一第二導電元件140以及至少一第三導電元件150。電子元件170例如可為溫度感測器或磁力感測器等,設置於基底組件102上。電子元件170可經由第二導電元件140電性連接於外部電路,並且第二線圈106是經由第三導電元件150電性連接外部電路。The wireless transmission module 100C further includes an electronic component 170, at least a second conductive component 140 and at least a third conductive component 150. The electronic component 170 may be, for example, a temperature sensor or a magnetic sensor, which is disposed on the base component 102 . The electronic component 170 may be electrically connected to the external circuit via the second conductive component 140 , and the second coil 106 is electrically connected to the external circuit via the third conductive component 150 .

相似地,第二導電元件140具有板狀結構,並且第二導電元件140具有金屬材質。第二導電元件140之至少一部分埋藏且不由基底組件102露出。Similarly, the second conductive element 140 has a plate-like structure, and the second conductive element 140 has a metal material. At least a portion of the second conductive element 140 is buried and not exposed by the base component 102 .

再者,第二導電元件140之一第二外部電性連接部141之表面與主軸AX垂直或平行。舉例來說,表面1411垂直於主軸AX。第二外部電性連接部141配置以電性連接外部電路。第二外部電性連接部141之一部分(例如表面1411)是由基底組件102露出。Furthermore, the surface of the second external electrical connection portion 141 of the second conductive element 140 is perpendicular or parallel to the main axis AX. For example, surface 1411 is perpendicular to the main axis AX. The second external electrical connection part 141 is configured to electrically connect to an external circuit. A portion of the second external electrical connection portion 141 (for example, the surface 1411 ) is exposed from the base component 102 .

如第7圖所示,第一外部電性連接部131之表面1311與第二外部電性連接部141的表面1411平行。於此實施例中,第一外部電性連接部131之表面1311與第二外部電性連接部141的表面1411共平面。As shown in FIG. 7 , the surface 1311 of the first external electrical connection part 131 is parallel to the surface 1411 of the second external electrical connection part 141 . In this embodiment, the surface 1311 of the first external electrical connection part 131 and the surface 1411 of the second external electrical connection part 141 are coplanar.

另外,第一外部電性連接部131中面朝第一線圈104之表面1312與第一內部電性連接部132面朝第一線圈104之表面1322位於不同平面。In addition, the surface 1312 of the first external electrical connection part 131 facing the first coil 104 and the surface 1322 of the first internal electrical connection part 132 facing the first coil 104 are located on different planes.

如第7圖所示,第二導電元件140之一第二內部電性連接部142之表面與主軸AX垂直或平行。舉例來說,表面1422垂直於主軸AX。第二內部電性連接部142配置以電性連接於電子元件170,並且第二內部電性連接部142由基底組件102露出。As shown in FIG. 7 , the surface of the second internal electrical connection portion 142 of the second conductive element 140 is perpendicular or parallel to the main axis AX. For example, surface 1422 is perpendicular to main axis AX. The second internal electrical connection portion 142 is configured to be electrically connected to the electronic component 170 , and the second internal electrical connection portion 142 is exposed from the base component 102 .

第二導電元件140具有一第二截面,第二截面具有多邊形結構(矩形結構)。第一內部電性連接部132之表面1322與第二內部電性連接部142的表面1422平行。於此實施例中,第一內部電性連接部132之表面1322與第二內部電性連接部142的表面1422共平面。The second conductive element 140 has a second cross-section, and the second cross-section has a polygonal structure (rectangular structure). The surface 1322 of the first internal electrical connection portion 132 is parallel to the surface 1422 of the second internal electrical connection portion 142 . In this embodiment, the surface 1322 of the first internal electrical connection portion 132 and the surface 1422 of the second internal electrical connection portion 142 are coplanar.

相似地,第三導電元件150具有板狀結構,並且第三導電元件150具有金屬材質。第三導電元件150之至少一部分埋藏且不由基底組件102露出。Similarly, the third conductive element 150 has a plate-like structure, and the third conductive element 150 has a metal material. At least a portion of the third conductive element 150 is buried and not exposed by the base component 102 .

再者,第三導電元件150之一第三外部電性連接部151之表面與主軸AX垂直或平行。舉例來說,表面1511垂直於主軸AX。第三外部電性連接部151配置以電性連接外部電路。第三外部電性連接部151之一部分(例如表面1511)是由基底組件102露出。Furthermore, the surface of the third external electrical connection portion 151 of the third conductive element 150 is perpendicular or parallel to the main axis AX. For example, surface 1511 is perpendicular to the main axis AX. The third external electrical connection part 151 is configured to electrically connect to an external circuit. A portion of the third external electrical connection portion 151 (for example, the surface 1511 ) is exposed from the base component 102 .

第三導電元件150之一第三內部電性連接部152之表面與主軸AX垂直或平行,舉例來說,表面1522垂直於主軸AX。再者,第三內部電性連接部152配置以電性連接第二線圈106。具體而言,第二線圈106的一引線1061是配置以接觸第三導電元件150之表面1522。另外,第三內部電性連接部152之表面1522與第一內部電性連接部132的表面1322共平面。The surface of the third internal electrical connection portion 152 of the third conductive element 150 is perpendicular or parallel to the main axis AX. For example, the surface 1522 is perpendicular to the main axis AX. Furthermore, the third internal electrical connection portion 152 is configured to electrically connect the second coil 106 . Specifically, a lead 1061 of the second coil 106 is configured to contact the surface 1522 of the third conductive element 150 . In addition, the surface 1522 of the third internal electrical connection portion 152 is coplanar with the surface 1322 of the first internal electrical connection portion 132 .

相似地,第三內部電性連接部152可經由一穿孔PR3由基底組件102露出。再者,無線傳輸模組100C可更包含一第三補強元件EF3,設置於穿孔PR3內並且直接接觸第三內部電性連接部152。第三補強元件EF3例如可為膠水,但不限於此。Similarly, the third internal electrical connection portion 152 can be exposed from the base component 102 through a through hole PR3. Furthermore, the wireless transmission module 100C may further include a third reinforcing element EF3, which is disposed in the through hole PR3 and directly contacts the third internal electrical connection portion 152. The third reinforcing element EF3 may be glue, for example, but is not limited thereto.

相似地,第二內部電性連接部142可經由一穿孔PR2由基底組件102露出。再者,無線傳輸模組100C可更包含一第二補強元件EF2,設置於穿孔PR2內並且直接接觸第二內部電性連接部142。第二補強元件EF2例如可為膠水,但不限於此。Similarly, the second internal electrical connection portion 142 can be exposed from the base component 102 through a through hole PR2. Furthermore, the wireless transmission module 100C may further include a second reinforcing element EF2, which is disposed in the through hole PR2 and directly contacts the second internal electrical connection part 142. The second reinforcing element EF2 may be glue, for example, but is not limited thereto.

另外,無線傳輸模組100可更包含一第四補強元件EF4,設置於基底組件102的底部,直接接觸第一外部電性連接部131。其中,第二補強元件EF2具有非金屬材質 ,第三補強元件EF3具有非金屬材質,並且第一補強元件EF1與第四補強元件EF4具有一體成型結構。In addition, the wireless transmission module 100 may further include a fourth reinforcing element EF4, which is disposed at the bottom of the base component 102 and directly contacts the first external electrical connection part 131. Among them, the second reinforcing element EF2 is made of non-metallic material, the third reinforcing element EF3 is made of non-metallic material, and the first reinforcing element EF1 and the fourth reinforcing element EF4 have an integrally formed structure.

如第7圖所示,電子元件170設置於基底組件102之一容納部102R,並且容納部102R具有凹陷結構且位於第一基底表面102S1。第一保護元件110更包含一開口110H,對應於容納部102R。As shown in FIG. 7 , the electronic component 170 is disposed in a receiving portion 102R of the base component 102 , and the receiving portion 102R has a recessed structure and is located on the first base surface 102S1 . The first protection element 110 further includes an opening 110H corresponding to the receiving portion 102R.

當沿著第一方向D1觀察時,電子元件170之至少一部分由開口110H露出。另外,第一線圈104之至少一部分由容納部102R露出。具體而言,第一線圈104是可由容納部102R的側邊露出,使得第一線圈104可藉由一模具(圖中未表示)來進行定位。When viewed along the first direction D1, at least a portion of the electronic component 170 is exposed through the opening 110H. In addition, at least part of the first coil 104 is exposed from the accommodating portion 102R. Specifically, the first coil 104 can be exposed from the side of the receiving portion 102R, so that the first coil 104 can be positioned by a mold (not shown in the figure).

在主軸AX上,第一線圈104之一第一感應本體1040的最大尺寸(不包含第一導線1041)是不同於基底組件102的最大尺寸。在主軸AX上,第一感應本體1040的最大尺寸小於基底組件102的最大尺寸。在主軸AX上,第一感應本體1040的最大尺寸小於基底組件102的最大尺寸的三分之一。On the main axis AX, the maximum size of the first induction body 1040 of the first coil 104 (excluding the first wire 1041 ) is different from the maximum size of the base assembly 102 . On the main axis AX, the maximum dimension of the first sensing body 1040 is smaller than the maximum dimension of the base assembly 102 . On the main axis AX, the maximum dimension of the first sensing body 1040 is less than one third of the maximum dimension of the base assembly 102 .

接著請參考第8圖,第8圖為根據本揭露另一實施例之無線傳輸模組100D與一外部電路300之立體示意圖。相似於前述實施例,無線傳輸模組100D的基底組件102包含第一導磁部1021與第二導磁部1022,並且第二導磁部1022與第一導磁部1021具有不同材質。Next, please refer to Figure 8, which is a three-dimensional schematic diagram of a wireless transmission module 100D and an external circuit 300 according to another embodiment of the present disclosure. Similar to the previous embodiment, the base component 102 of the wireless transmission module 100D includes a first magnetic conductive part 1021 and a second magnetic conductive part 1022, and the second magnetic conductive part 1022 and the first magnetic conductive part 1021 are made of different materials.

請參考第9圖,第9圖為根據本揭露另一實施例之無線傳輸模組100D與外部電路300之剖面示意圖。外部電路300例如為前述電路板,並且外部電路300可包含一容納空間300R,配置以容納基底組件102之至少一部分。具體而言,容納空間300R具有開口結構,並且第二導磁部1022是設置於容納空間300R內。Please refer to Figure 9 , which is a schematic cross-sectional view of a wireless transmission module 100D and an external circuit 300 according to another embodiment of the present disclosure. The external circuit 300 is, for example, the aforementioned circuit board, and the external circuit 300 may include a receiving space 300R configured to receive at least a portion of the base assembly 102 . Specifically, the accommodation space 300R has an opening structure, and the second magnetic conductive part 1022 is disposed in the accommodation space 300R.

如第9圖所示,當沿著垂直於主軸AX之方向觀察時,外部電路300與基底組件102之至少一部分重疊。另外,當沿著主軸AX之方向(X軸)觀察時,外部電路300與基底組件102之至少一部分重疊。As shown in FIG. 9 , when viewed along a direction perpendicular to the main axis AX, the external circuit 300 overlaps at least a portion of the base component 102 . In addition, when viewed along the direction of the main axis AX (X-axis), the external circuit 300 overlaps at least a portion of the base component 102 .

當沿著垂直於主軸AX之方向觀察時,外部電路300與第一線圈104不重疊。當沿著主軸AX觀察時,外部電路300與第一線圈104不重疊。當沿著主軸AX觀察時,外部電路300與第二線圈106之至少一部分重疊。當沿著垂直於主軸AX之方向觀察時,外部電路300與第二導磁部1022之至少一部分重疊。When viewed along the direction perpendicular to the main axis AX, the external circuit 300 does not overlap the first coil 104 . The external circuit 300 does not overlap the first coil 104 when viewed along the main axis AX. The external circuit 300 overlaps at least a portion of the second coil 106 when viewed along the main axis AX. When viewed along the direction perpendicular to the main axis AX, the external circuit 300 overlaps with at least a portion of the second magnetic conductive portion 1022 .

於此實施例中,基底組件102可更包含一第一感應部ITP1以及一第二感應部ITP2。第一感應部ITP1是對應於第一線圈104並具有一第一特性函數,而第二感應部ITP2是對應於第二線圈106並具有一第二特性函數。第一、第二特性函數是對於特定電磁波的導磁率函數或磁損率函數等等。In this embodiment, the base component 102 may further include a first sensing part ITP1 and a second sensing part ITP2. The first sensing part ITP1 corresponds to the first coil 104 and has a first characteristic function, and the second sensing part ITP2 corresponds to the second coil 106 and has a second characteristic function. The first and second characteristic functions are magnetic permeability functions or magnetic loss rate functions for specific electromagnetic waves, etc.

要注意的是,對應於一特定頻率(第一頻率)之電磁波時,第一、第二特性函數會有所不同。It should be noted that when corresponding to an electromagnetic wave of a specific frequency (first frequency), the first and second characteristic functions will be different.

如第9圖所示,當沿著主軸AX觀察時,第一感應部ITP1與第一線圈104之至少一部分重疊,並且當沿著主軸AX觀察時,第二感應部ITP2與第二線圈106之至少一部分重疊。As shown in FIG. 9 , when viewed along the main axis AX, the first induction part ITP1 overlaps with at least a part of the first coil 104 , and when viewed along the main axis AX, the second induction part ITP2 overlaps with the second coil 106 At least some overlap.

當沿著主軸AX觀察時,第二導磁部1022與第一線圈104或第二線圈106之至少一者重疊。舉例來說,第二導磁部1022與第一線圈104重疊,並且第二導磁部1022與第二線圈106不重疊。When viewed along the main axis AX, the second magnetic conductive portion 1022 overlaps with at least one of the first coil 104 or the second coil 106 . For example, the second magnetic conductive part 1022 overlaps the first coil 104, and the second magnetic conductive part 1022 does not overlap the second coil 106.

另外,如第9圖所示,於此實施例中,第一感應部ITP1涵蓋第一導磁部1021之一部分,並且第二感應部ITP2涵蓋第一導磁部1021之一部分。In addition, as shown in FIG. 9 , in this embodiment, the first sensing part ITP1 covers a part of the first magnetic conductive part 1021 , and the second sensing part ITP2 covers a part of the first magnetic conductive part 1021 .

當沿著主軸AX觀察時,第二導磁部1022與第一導磁部1021之至少一部分重疊,但不限於此。在其他實施例中,第二導磁部1022可不重疊於第一導磁部1021。舉例來說,第二導磁部1022是可環繞於第一導磁部1021並且與第一導磁部1021位於同一平面上。When viewed along the main axis AX, the second magnetic conductive part 1022 overlaps at least a part of the first magnetic conductive part 1021, but is not limited thereto. In other embodiments, the second magnetic conductive part 1022 may not overlap the first magnetic conductive part 1021. For example, the second magnetic conductive part 1022 may surround the first magnetic conductive part 1021 and be located on the same plane as the first magnetic conductive part 1021 .

於此實施例中,當沿著垂直於主軸AX之方向觀察時,第二導磁部1022不重疊於第一導磁部1021。再者,在主軸AX上,第一感應部ITP1之最大尺寸與第二感應部ITP2之最大尺寸不同。舉例來說,第一感應部ITP1之最大尺寸大於第二感應部ITP2之最大尺寸。In this embodiment, when viewed along the direction perpendicular to the main axis AX, the second magnetic conductive part 1022 does not overlap the first magnetic conductive part 1021. Furthermore, on the spindle AX, the maximum size of the first sensing part ITP1 is different from the maximum size of the second sensing part ITP2. For example, the maximum size of the first sensing part ITP1 is larger than the maximum size of the second sensing part ITP2.

接著請參考第10圖,第10圖為根據本揭露另一實施例之無線傳輸模組100E與外部電路300之剖面示意圖。相似於前述實施例,無線傳輸模組100E的基底組件102包含第一導磁部1021與第二導磁部1022,並且第二導磁部1022與第一導磁部1021具有不同材質。Next, please refer to Figure 10. Figure 10 is a schematic cross-sectional view of a wireless transmission module 100E and an external circuit 300 according to another embodiment of the present disclosure. Similar to the previous embodiment, the base component 102 of the wireless transmission module 100E includes a first magnetic conductive part 1021 and a second magnetic conductive part 1022, and the second magnetic conductive part 1022 and the first magnetic conductive part 1021 are made of different materials.

當沿著垂直於主軸AX之方向(X軸)觀察時,外部電路300與第一導磁部1021之至少一部分重疊。當沿著垂直於主軸AX之方向觀察時,外部電路300與第一線圈104之至少一部分重疊。當沿著垂直於主軸AX之方向觀察時,外部電路300與第二線圈106之至少一部分重疊。When viewed along the direction perpendicular to the main axis AX (X-axis), the external circuit 300 overlaps with at least a portion of the first magnetic conductive portion 1021 . The external circuit 300 overlaps at least a portion of the first coil 104 when viewed along a direction perpendicular to the main axis AX. The external circuit 300 overlaps at least a portion of the second coil 106 when viewed along a direction perpendicular to the main axis AX.

於此實施例中,基底組件102可定義有一第一重疊部OVP1。當沿著垂直於主軸AX之方向觀察時,外部電路300與第一重疊部OVP1重疊。當沿著主軸AX觀察時,外部電路300與第一重疊部OVP1不重疊。In this embodiment, the base component 102 may define a first overlapping portion OVP1. When viewed along the direction perpendicular to the main axis AX, the external circuit 300 overlaps the first overlapping portion OVP1. When viewed along the main axis AX, the external circuit 300 does not overlap the first overlapping portion OVP1.

當沿著主軸AX觀察時,第一重疊部OVP1與外部電路300之間具有間隙,基於此結構設計,可以增加操作人員安裝無線傳輸模組100E的效率。When viewed along the main axis AX, there is a gap between the first overlapping portion OVP1 and the external circuit 300. Based on this structural design, the efficiency of the operator in installing the wireless transmission module 100E can be increased.

相似地,基底組件102包含一第一感應部ITP1以及一第二感應部ITP2。於此實施例中,第一感應部ITP1涵蓋第一導磁部1021之一部分,並且第二感應部ITP2涵蓋第二導磁部1022之一部分。Similarly, the base component 102 includes a first sensing part ITP1 and a second sensing part ITP2. In this embodiment, the first sensing part ITP1 covers a part of the first magnetic conductive part 1021, and the second sensing part ITP2 covers a part of the second magnetic conductive part 1022.

接著請參考第11圖,第11圖為根據本揭露另一實施例之無線傳輸模組100F與外部電路300之剖面示意圖。相似於前述實施例,無線傳輸模組100F的基底組件102包含第一導磁部1021與第二導磁部1022,並且第二導磁部1022與第一導磁部1021具有不同材質。Next, please refer to Figure 11. Figure 11 is a schematic cross-sectional view of a wireless transmission module 100F and an external circuit 300 according to another embodiment of the present disclosure. Similar to the previous embodiment, the base component 102 of the wireless transmission module 100F includes a first magnetic conductive part 1021 and a second magnetic conductive part 1022, and the second magnetic conductive part 1022 and the first magnetic conductive part 1021 are made of different materials.

如第11圖所示,基底組件102定義有一第一重疊部OVP1、一第二重疊部OVP2以及一第三重疊部OVP3。當沿著垂直於主軸AX之方向(X軸)觀察時,外部電路300與第一重疊部OVP1重疊。當沿著主軸AX觀察時,外部電路300與第一重疊部OVP1不重疊。As shown in FIG. 11 , the base component 102 defines a first overlapping portion OVP1, a second overlapping portion OVP2, and a third overlapping portion OVP3. When viewed along the direction perpendicular to the main axis AX (X-axis), the external circuit 300 overlaps the first overlapping portion OVP1. When viewed along the main axis AX, the external circuit 300 does not overlap the first overlapping portion OVP1.

當沿著主軸AX觀察時,外部電路300與第二重疊部OVP2重疊。當沿著垂直於主軸AX之方向觀察時,外部電路300與第二重疊部OVP2不重疊。When viewed along the main axis AX, the external circuit 300 overlaps the second overlapping portion OVP2. When viewed along the direction perpendicular to the main axis AX, the external circuit 300 does not overlap with the second overlapping portion OVP2.

當沿著主軸AX觀察時,外部電路300與第三重疊部OVP3重疊。當沿著垂直於主軸AX之方向觀察時,外部電路300與第三重疊部OVP3不重疊。當沿著垂直於主軸AX之方向觀察時,外部電路300位於第二重疊部OVP2與第三重疊部OVP3之間。When viewed along the main axis AX, the external circuit 300 overlaps the third overlapping portion OVP3. When viewed along the direction perpendicular to the main axis AX, the external circuit 300 does not overlap with the third overlapping portion OVP3. When viewed along the direction perpendicular to the main axis AX, the external circuit 300 is located between the second overlapping portion OVP2 and the third overlapping portion OVP3.

於此實施例中,第一重疊部OVP1、第二重疊部OVP2以及第三重疊部OVP3具有一體成型結構。意即第一重疊部OVP1、第二重疊部OVP2以及第三重疊部OVP3不需要利用黏著或焊接等方式進行連接。In this embodiment, the first overlapping part OVP1, the second overlapping part OVP2 and the third overlapping part OVP3 have an integrally formed structure. That is to say, the first overlapping portion OVP1, the second overlapping portion OVP2, and the third overlapping portion OVP3 do not need to be connected by adhesion or welding.

另外,要注意的是,此實施例的第一重疊部OVP1會接觸外部電路300。基於此結構設計,可以確保無線傳輸模組100F可以緊密地連接於外部電路300。In addition, it should be noted that the first overlapping portion OVP1 of this embodiment will contact the external circuit 300 . Based on this structural design, it can be ensured that the wireless transmission module 100F can be tightly connected to the external circuit 300 .

本揭露提出一種用於傳輸能量或訊號的無線傳輸模組,包括一基底組件以及至少一線圈。線圈是設置在基底組件中,並且基底組件是由複數個導磁性元件所組成。在經過加熱加壓後,這些導磁性元件會彼此連接,使得基底組件形成固體的板狀結構,並且線圈可以穩固地固定於基底組件中。The present disclosure proposes a wireless transmission module for transmitting energy or signals, including a base component and at least one coil. The coil is arranged in the base component, and the base component is composed of a plurality of magnetic conductive elements. After being heated and pressurized, these magnetically permeable elements will be connected to each other, so that the base assembly forms a solid plate-like structure, and the coil can be firmly fixed in the base assembly.

基於本揭露之無線傳輸模組的設計,不需要使用膠水或膠帶便可以將線圈固定於基底組件內,因此可以提升機械強度、提升使用效率、提升充電效率、提升散熱效率、達成整體小型化、整體輕量化以及降低電磁干擾等。Based on the design of the wireless transmission module disclosed in this disclosure, the coil can be fixed in the base component without the use of glue or tape. Therefore, the mechanical strength, usage efficiency, charging efficiency, heat dissipation efficiency, and overall miniaturization can be improved. Overall lightweight and reduction of electromagnetic interference, etc.

在本說明書以及申請專利範圍中的序數,例如「第一」、「第二」、「第三」等等,彼此之間並沒有順序上的先後關係,其僅用於標示區分兩個具有相同名字之不同元件。The ordinal numbers in this specification and the scope of the patent application, such as "first", "second", "third", etc., have no sequential relationship with each other. They are only used to distinguish two items with the same Different components with names.

雖然本揭露的實施例及其優點已揭露如上,但應瞭解的是,任何所屬技術領域中具有通常知識者,在不脫離本揭露之精神和範圍內,當可作更動、替代與潤飾。此外,本揭露之保護範圍並未侷限於說明書內所述特定實施例中的製程、機器、製造、物質組成、裝置、方法及步驟,任何所屬技術領域中具有通常知識者可從本揭露揭示內容中理解現行或未來所發展出的製程、機器、製造、物質組成、裝置、方法及步驟,只要可以在此處所述實施例中實施大抵相同功能或獲得大抵相同結果皆可根據本揭露使用。因此,本揭露之保護範圍包括上述製程、機器、製造、物質組成、裝置、方法及步驟。另外,每一申請專利範圍構成個別的實施例,且本揭露之保護範圍也包括各個申請專利範圍及實施例的組合。Although the embodiments and their advantages of the present disclosure have been disclosed above, it should be understood that anyone with ordinary skill in the art can make changes, substitutions and modifications without departing from the spirit and scope of the present disclosure. In addition, the protection scope of the present disclosure is not limited to the processes, machines, manufacturing, material compositions, devices, methods and steps in the specific embodiments described in the specification. Anyone with ordinary knowledge in the relevant technical field can learn from the disclosure It is understood that processes, machines, manufacturing, material compositions, devices, methods and steps currently or developed in the future can be used according to the present disclosure as long as they can perform substantially the same functions or obtain substantially the same results in the embodiments described herein. Therefore, the protection scope of the present disclosure includes the above-mentioned processes, machines, manufacturing, material compositions, devices, methods and steps. In addition, each claimed patent scope constitutes an individual embodiment, and the protection scope of the present disclosure also includes the combination of each claimed patent scope and embodiments.

100:無線傳輸模組 100A~100F:無線傳輸模組 102:基底組件 1021:第一導磁部 1022:第二導磁部 1023:第一結構強化部 1024:第二結構強化部 102R:容納部 102S1:第一基底表面 102S2:第二基底表面 102S3:第一側壁表面 104:第一線圈 1040:第一感應本體 1041:第一導線 104C:中心 106:第二線圈 1061:引線 110:第一保護元件 110H:開口 111:第一本體 112:第一接著部 113:第二接著部 120:第二保護元件 121:第二本體 122:第三接著部 123:第四接著部 131:第一外部電性連接部 1311:表面 1312:表面 132:第一內部電性連接部 1322:表面 140:第二導電元件 141:第二外部電性連接部 1411:表面 142:第二內部電性連接部 1422:表面 150:第三導電元件 151:第三外部電性連接部 1511:表面 152:第三內部電性連接部 1522:表面 170:電子元件 200:電子模組 202:線圈 300:外部電路 300R:容納空間 AE1:第一接著元件 AX:主軸 CVP:覆蓋部 D1:第一方向 D2:方向 EF1:第一補強元件 EF2:第二補強元件 EF3:第三補強元件 EF4:第四補強元件 GU:增強元件 ICS:對應表面 ITP1:第一感應部 ITP2:第二感應部 MCE1:第一導磁性元件 OP1:第一開口 OP2:第二開口 OVP1:第一重疊部 OVP2:第二重疊部 OVP3:第三重疊部 PR1:穿孔 PR2:穿孔 PR3:穿孔 STP:支撐部 TR1:第一溝槽 TR2:第二溝槽 TR3:第三溝槽 WR1:第一引線 WR2:第二引線 X:X軸 Y:Y軸 Z:Z軸 100:Wireless transmission module 100A~100F: Wireless transmission module 102: Base component 1021: The first magnetic conductive part 1022: The second magnetic conductive part 1023:First Structural Strengthening Department 1024:Second Structural Strengthening Department 102R: Accommodation Department 102S1: First substrate surface 102S2: Second substrate surface 102S3: First side wall surface 104:First coil 1040: The first sensing body 1041: First wire 104C: Center 106:Second coil 1061:Lead 110: First protection element 110H:Open your mouth 111:First body 112:The first part 113:The second part 120: Second protection element 121:Second body 122:The third part 123:The fourth part continues 131: First external electrical connection part 1311:Surface 1312:Surface 132: First internal electrical connection part 1322:Surface 140: Second conductive element 141: Second external electrical connection part 1411:Surface 142: Second internal electrical connection part 1422:Surface 150:Third conductive element 151: The third external electrical connection part 1511:Surface 152: The third internal electrical connection part 1522:Surface 170:Electronic components 200: Electronic modules 202:Coil 300:External circuit 300R: Accommodation space AE1: The first connected component AX: spindle CVP: Coverage Department D1: first direction D2: direction EF1: The first reinforcing element EF2: Second reinforcing element EF3: The third reinforcing element EF4: The fourth reinforcing element GU: Enhancement element ICS: corresponding surface ITP1: First induction part ITP2: Second induction part MCE1: the first magnetic element OP1: First opening OP2: Second opening OVP1: First overlap part OVP2: Second overlap part OVP3: The third overlapping part PR1: Perforation PR2: Perforation PR3: Perforation STP: support part TR1: first trench TR2: Second trench TR3:Third trench WR1: first lead WR2: second lead X:X axis Y:Y axis Z:Z axis

第1圖為根據本揭露一實施例之一無線傳輸模組100與一電子模組200之剖面示意圖。 第2圖為根據本揭露一實施例之基底組件102未加壓加熱前的結構放大圖。 第3圖為根據本揭露一實施例之基底組件102經過加壓加熱後結構放大圖。 第4圖為根據本揭露另一實施例之無線傳輸模組100A之剖面示意圖。 第5圖為根據本揭露另一實施例之無線傳輸模組100A之側面示意圖。 第6圖為根據本揭露另一實施例之無線傳輸模組100B之剖面示意圖。 第7圖為根據本揭露另一實施例之無線傳輸模組100C之剖面示意圖。 第8圖為根據本揭露另一實施例之無線傳輸模組100D與一外部電路300之立體示意圖。 第9圖為根據本揭露另一實施例之無線傳輸模組100D與外部電路300之剖面示意圖。 第10圖為根據本揭露另一實施例之無線傳輸模組100E與外部電路300之剖面示意圖。 第11圖為根據本揭露另一實施例之無線傳輸模組100F與外部電路300之剖面示意圖。 Figure 1 is a schematic cross-sectional view of a wireless transmission module 100 and an electronic module 200 according to an embodiment of the present disclosure. Figure 2 is an enlarged structural view of the base component 102 before pressure heating according to an embodiment of the present disclosure. Figure 3 is an enlarged view of the structure of the base component 102 after pressure and heating according to an embodiment of the present disclosure. Figure 4 is a schematic cross-sectional view of a wireless transmission module 100A according to another embodiment of the present disclosure. FIG. 5 is a schematic side view of a wireless transmission module 100A according to another embodiment of the present disclosure. Figure 6 is a schematic cross-sectional view of a wireless transmission module 100B according to another embodiment of the present disclosure. Figure 7 is a schematic cross-sectional view of a wireless transmission module 100C according to another embodiment of the present disclosure. FIG. 8 is a three-dimensional schematic diagram of a wireless transmission module 100D and an external circuit 300 according to another embodiment of the present disclosure. Figure 9 is a schematic cross-sectional view of a wireless transmission module 100D and an external circuit 300 according to another embodiment of the present disclosure. Figure 10 is a schematic cross-sectional view of a wireless transmission module 100E and an external circuit 300 according to another embodiment of the present disclosure. FIG. 11 is a schematic cross-sectional view of a wireless transmission module 100F and an external circuit 300 according to another embodiment of the present disclosure.

100:無線傳輸模組 100:Wireless transmission module

102:基底組件 102: Base component

1021:第一導磁部 1021: The first magnetic conductive part

1022:第二導磁部 1022: The second magnetic conductive part

102S1:第一基底表面 102S1: First substrate surface

102S2:第二基底表面 102S2: Second substrate surface

104:第一線圈 104:First coil

104C:中心 104C: Center

200:電子模組 200: Electronic modules

202:線圈 202:Coil

AX:主軸 AX: spindle

CVP:覆蓋部 CVP: Coverage Department

D1:第一方向 D1: first direction

D2:方向 D2: Direction

ICS:對應表面 ICS: corresponding surface

STP:支撐部 STP: support part

X:X軸 X:X axis

Y:Y軸 Y:Y axis

Z:Z軸 Z:Z axis

Claims (10)

一種無線傳輸模組,對應於一電子模組並配置以傳輸一第一訊號,並且該無線傳輸模組包含: 一對應表面,面朝該電子模組並垂直於一主軸; 一基底組件;以及 一第一線圈,設置於該基底組件; 其中當沿著該主軸觀察時,該第一線圈與該基底組件之至少一部分重疊; 其中當沿著垂直於該主軸之方向觀察時,該第一線圈與該基底組件之至少一部分重疊。 A wireless transmission module corresponds to an electronic module and is configured to transmit a first signal, and the wireless transmission module includes: a corresponding surface facing the electronic module and perpendicular to a main axis; a base component; and a first coil disposed on the base component; wherein the first coil overlaps at least a portion of the base component when viewed along the main axis; When viewed along a direction perpendicular to the main axis, the first coil overlaps at least a portion of the base component. 如請求項1所述之無線傳輸模組,其中 該基底組件包含一第一導磁部,具有一第一導磁性材質; 該基底組件包含複數個第一導磁性元件; 該基底組件包含鐵元素; 該基底組件包含矽元素; 該基底組件包含鉻元素; 該些第一導磁性元件之直徑小於0.05mm; 該無線傳輸模組更包含一第一接著元件,配置以接著該些第一導磁性元件; 該第一接著元件直接接觸該些第一導磁性元件; 該第一接著元件直接接觸該第一線圈; 該第一線圈經由該第一接著元件固定地連接該些第一導磁性元件; 該第一接著元件之熔點高於攝氏70度; 該第一接著元件之熔點低於攝氏400度。 The wireless transmission module as described in claim 1, wherein The base component includes a first magnetic conductive part with a first magnetic conductive material; The base component includes a plurality of first magnetic conductive elements; The base component contains iron; The base component contains silicon elements; The base component contains chromium; The diameter of the first magnetic conductive elements is less than 0.05mm; The wireless transmission module further includes a first connecting element configured to connect the first magnetic conductive elements; The first connecting element directly contacts the first magnetically permeable elements; The first connecting element directly contacts the first coil; The first coil is fixedly connected to the first magnetic conductive elements via the first connecting element; The melting point of the first bonding element is higher than 70 degrees Celsius; The melting point of the first connecting element is lower than 400 degrees Celsius. 如請求項2所述之無線傳輸模組,其中 當沿著一第一方向觀察時,該基底組件覆蓋該第一線圈之至少一部分; 該第一方向相反於該對應表面所面朝之方向; 該基底組件更包含: 一支撐部,配置以支撐該第一線圈;以及 一覆蓋部,覆蓋該第一線圈之一部分; 當沿著垂直於該主軸之方向觀察時,該第一線圈位於該支撐部與該電子模組之間; 當沿著該主軸觀察時,該第一線圈與該支撐部之至少一部分重疊; 當沿著該第一方向觀察時,該覆蓋部之至少一部分與該第一線圈重疊; 當沿著垂直於該主軸之方向觀察時,該覆蓋部之至少一部分與該第一線圈重疊; 當沿著垂直於該主軸之方向觀察時,在該主軸上,該第一線圈之中心位於該覆蓋部與該支撐部之間。 The wireless transmission module as described in claim 2, wherein When viewed along a first direction, the base component covers at least a portion of the first coil; The first direction is opposite to the direction in which the corresponding surface faces; The base component further includes: a support portion configured to support the first coil; and a covering part covering a part of the first coil; When viewed along the direction perpendicular to the main axis, the first coil is located between the support part and the electronic module; When viewed along the main axis, the first coil overlaps at least a portion of the support portion; When viewed along the first direction, at least a portion of the covering portion overlaps the first coil; When viewed along a direction perpendicular to the main axis, at least a portion of the covering portion overlaps the first coil; When viewed along a direction perpendicular to the main axis, the center of the first coil is located between the covering part and the supporting part on the main axis. 如請求項3所述之無線傳輸模組,其中 該第一線圈包含: 一第一引線,位於該基底組件之一第一側壁表面;以及 一增強元件,設置於該第一引線上; 該第一側壁表面與該主軸平行; 該第一引線通過該第一側壁表面之一第一開口; 該第一開口具有封閉結構; 該增強元件直接接觸該第一開口; 該增強元件具有非金屬材質; 在該主軸上,該第一線圈與該對應表面之最短距離不同於該第一引線與該對應表面之最短距離; 在該主軸上,該第一線圈與該對應表面之最短距離小於該第一引線與該對應表面之最短距離; 該基底組件更包含一第一基底表面,面朝該電子模組; 該第一基底表面與該第一側壁表面不平行; 該基底組件更包含一第一結構強化部,配置以強化該基底組件之機械結構; 該第一結構強化部位於該第一基底表面與該第一側壁表面之間; 該第一結構強化部之表面不平行於該第一基底表面以及該第一側壁表面; 該第一結構強化部之表面與該第一基底表面之夾角大於15度; 該第一結構強化部之表面與該第一側壁表面之夾角大於15度; 該基底組件更包含一第二基底表面,與該第一基底表面係面朝相反方向; 該基底組件更包含一第二結構強化部,配置以強化該基底組件之機械結構; 該第二結構強化部位於該第二基底表面與該第一側壁表面之間; 該第二結構強化部之表面不平行於該第二基底表面以及該第一側壁表面; 該第二結構強化部之結構與該第一結構強化部之結構不同; 該第二結構強化之表面具有大於0.05mm的曲率半徑; 當沿著該主軸觀察時,該第一結構強化部重疊於第二結構強化部之至少一部分; 該無線傳輸模組更包含一第二線圈,設置於該基底組件; 該第二線圈與該第一線圈電性獨立; 該第一線圈與該第二線圈之其中一者配置以傳輸該第一訊號,並且另一者配置以傳輸一第二訊號; 當沿著垂直於該主軸之方向觀察時,該第二線圈與該第一線圈之至少一部分重疊。 The wireless transmission module as described in claim 3, wherein This first coil contains: a first lead located on a first side wall surface of the base component; and A reinforcing element is provided on the first lead; The first side wall surface is parallel to the main axis; The first lead passes through a first opening on the first side wall surface; The first opening has a closed structure; The reinforcing element directly contacts the first opening; The reinforcing element is of non-metallic material; On the main axis, the shortest distance between the first coil and the corresponding surface is different from the shortest distance between the first lead and the corresponding surface; On the main axis, the shortest distance between the first coil and the corresponding surface is smaller than the shortest distance between the first lead and the corresponding surface; The base component further includes a first base surface facing the electronic module; The first base surface and the first side wall surface are not parallel; The base component further includes a first structural strengthening part configured to strengthen the mechanical structure of the base component; The first structural reinforcement is located between the first base surface and the first sidewall surface; The surface of the first structural reinforcement is not parallel to the first base surface and the first side wall surface; The angle between the surface of the first structural reinforcement part and the surface of the first base is greater than 15 degrees; The angle between the surface of the first structural reinforcement part and the surface of the first side wall is greater than 15 degrees; The base component further includes a second base surface facing in the opposite direction to the first base surface; The base component further includes a second structural strengthening part configured to strengthen the mechanical structure of the base component; The second structural reinforcement is located between the second base surface and the first sidewall surface; The surface of the second structural reinforcement is not parallel to the second base surface and the first side wall surface; The structure of the second structural reinforcement part is different from the structure of the first structural reinforcement part; The surface reinforced by the second structure has a radius of curvature greater than 0.05mm; When viewed along the main axis, the first structural reinforcement overlaps at least a portion of the second structural reinforcement; The wireless transmission module further includes a second coil disposed on the base component; The second coil is electrically independent from the first coil; One of the first coil and the second coil is configured to transmit the first signal, and the other is configured to transmit a second signal; The second coil overlaps at least a portion of the first coil when viewed along a direction perpendicular to the main axis. 如請求項3所述之無線傳輸模組,其中 該基底組件更包含一第一基底表面,面朝該電子模組; 該基底組件更包含一第二基底表面,與該第一基底表面係面朝相反方向; 該無線傳輸模組更包含一第二線圈,設置於該基底組件; 該第二線圈與該第一線圈電性獨立; 該無線傳輸模組更包含一第一保護元件,設置於該第一線圈上; 該第一保護元件具有板狀結構,直接接觸該第一基底表面; 該第一保護元件直接接觸該第一線圈; 該第一保護元件直接接觸該第二線圈; 該第一保護元件包含一第一接著部,配置以接著於該第一線圈; 該第一接著部接著於該第一基底表面; 該第一接著部接著於該覆蓋部; 當沿著垂直於該主軸之方向觀察時,該第一線圈位於該支撐部與該第一保護元件之間; 該第一保護元件更包含一第一本體,並且該第一接著部設置於該第一本體上; 該第一保護元件更包含一第二接著部,配置以接著於一第一外部元件; 該第一本體位於該第一接著部與該第二接著部之間; 該第一外部元件為一電子設備之一殼體; 該基底組件更包含一第一結構強化部,配置以強化該基底組件之機械結構; 當沿著該主軸觀察時,該第一保護元件與第一結構強化部之至少一部分重疊; 該第一接著部接著於該第一結構強化部; 該無線傳輸模組更包含一第二保護元件,設置於該第二基底表面; 該第二保護元件具有板狀結構; 當沿著垂直於該主軸之方向觀察時,該支撐部位於該第一線圈與該第二保護元件之間; 該第二保護元件包含一第三接著部,配置以接著於該第二基底表面; 該第二保護元件更包含一第二本體,並且該第三接著部設置於該第二本體上; 該第二保護元件更包含一第四接著部,配置以接著於一第二外部元件; 該第二本體位於該第三接著部與該第四接著部之間; 該第二外部元件為該電子設備之一電路組件; 該基底組件更包含一第二結構強化部,配置以強化該基底組件之機械結構; 當沿著該主軸觀察時,該第二保護元件與第二結構強化部之至少一部分重疊; 該第三接著部接著於該第二結構強化部; 該第一保護元件直接接觸該第二保護元件; 該第一接著部接著於該第三接著部; 該基底組件更包含: 一第一溝槽,位於該第二基底表面; 一第二溝槽,位於該第二基底表面;以及 一第三溝槽,位於該第二基底表面; 該第三接著部對應於該第一溝槽; 該第一溝槽延伸至該第一線圈; 當沿著垂直於該主軸之方向觀察時,該第一溝槽與該第一線圈不重疊; 當沿著該主軸觀察時,該第一溝槽與該第一線圈之至少一部分重疊; 當沿著垂直於該主軸之方向觀察時,該第二溝槽與該第一線圈之至少一部分重疊; 該第二溝槽位於該第一基底表面; 該第一接著部對應於該第二溝槽; 該第三接著部對應於該第二溝槽; 在該主軸上,該第一溝槽之最大尺寸不同於該第二溝槽之最大尺寸; 在該主軸上,該第一溝槽之最大尺寸小於該第二溝槽之最大尺寸; 當沿著垂直於該主軸之方向觀察時,該第三溝槽與該第二線圈不重疊; 當沿著該主軸觀察時,該第三溝槽與該第二線圈之至少一部分重疊; 該第三接著部對應於該第三溝槽; 在該主軸上,該第三溝槽之最大尺寸小於該第二溝槽之最大尺寸。 The wireless transmission module as described in claim 3, wherein The base component further includes a first base surface facing the electronic module; The base component further includes a second base surface facing in the opposite direction to the first base surface; The wireless transmission module further includes a second coil disposed on the base component; The second coil is electrically independent from the first coil; The wireless transmission module further includes a first protection element disposed on the first coil; The first protection element has a plate-like structure and directly contacts the first substrate surface; The first protection element directly contacts the first coil; The first protection element directly contacts the second coil; The first protection element includes a first connecting portion configured to be connected to the first coil; The first bonding portion is bonded to the first base surface; The first connecting part is connected to the covering part; When viewed along the direction perpendicular to the main axis, the first coil is located between the support part and the first protection element; The first protection element further includes a first body, and the first connecting portion is provided on the first body; The first protection component further includes a second connecting portion configured to be connected to a first external component; The first body is located between the first connecting part and the second connecting part; The first external component is a housing of an electronic device; The base component further includes a first structural strengthening part configured to strengthen the mechanical structure of the base component; The first protective element overlaps at least a portion of the first structural reinforcement when viewed along the main axis; The first connecting part is connected to the first structural strengthening part; The wireless transmission module further includes a second protection element disposed on the second base surface; The second protective element has a plate-like structure; When viewed along a direction perpendicular to the main axis, the support portion is located between the first coil and the second protection element; The second protection element includes a third bonding portion configured to bond to the second substrate surface; The second protection element further includes a second body, and the third connecting portion is provided on the second body; The second protection component further includes a fourth connecting portion configured to be connected to a second external component; The second body is located between the third connecting part and the fourth connecting part; The second external component is a circuit component of the electronic device; The base component further includes a second structural strengthening part configured to strengthen the mechanical structure of the base component; The second protective element overlaps at least a portion of the second structural reinforcement when viewed along the main axis; The third connecting part is connected to the second structural strengthening part; The first protection element directly contacts the second protection element; The first connecting part is connected to the third connecting part; The base component further includes: a first groove located on the surface of the second substrate; a second trench located on the second substrate surface; and a third groove located on the surface of the second substrate; The third connecting portion corresponds to the first groove; The first trench extends to the first coil; When viewed along a direction perpendicular to the main axis, the first groove does not overlap the first coil; The first groove overlaps at least a portion of the first coil when viewed along the main axis; The second groove overlaps at least a portion of the first coil when viewed along a direction perpendicular to the main axis; The second trench is located on the first substrate surface; The first connecting portion corresponds to the second groove; The third connecting portion corresponds to the second groove; On the spindle, the maximum dimension of the first groove is different from the maximum dimension of the second groove; On the main shaft, the maximum dimension of the first groove is smaller than the maximum dimension of the second groove; When viewed along a direction perpendicular to the main axis, the third groove does not overlap the second coil; The third groove overlaps at least a portion of the second coil when viewed along the main axis; The third connecting portion corresponds to the third groove; On the spindle, the maximum dimension of the third groove is smaller than the maximum dimension of the second groove. 如請求項2所述之無線傳輸模組,其中 該無線傳輸模組更包含一第一導電元件; 該第一線圈經由該第一導電元件電性連接一外部電路; 該第一導電元件具有板狀結構; 該第一導電元件具有金屬材質; 該第一導電元件之至少一部分埋藏且不由該基底組件露出; 該第一導電元件之一第一外部電性連接部之一表面與該主軸垂直或平行; 該第一外部電性連接部配置以電性連接該外部電路; 該第一外部電性連接部之一部分由該基底組件露出; 該第一導電元件之一第一內部電性連接部之一表面與該主軸垂直或平行; 該第一內部電性連接部配置以電性連接該第一線圈; 該第一內部電性連接部由該基底組件露出; 該無線傳輸模組更包含一第一補強元件,直接接觸該第一內部電性連接部; 該第一線圈之一第一導線具有一第一截面,該第一導電元件具有一第二截面,且該第一截面與該第二截面具有不同結構; 該第一截面具有圓弧結構; 該第二截面具有多邊形結構; 該無線傳輸模組更包含: 一電子元件,設置於該基底組件; 一第二導電元件,並且該電子元件經由該第二導電元件電性連接該外部電路;以及 一第三導電元件,並且該第二線圈經由該第三導電元件電性連接該外部電路; 該第二導電元件具有板狀結構; 該第二導電元件具有金屬材質; 該第二導電元件之至少一部分埋藏且不由該基底組件露出; 該第二導電元件之一第二外部電性連接部之一表面與該主軸垂直或平行; 該第二外部電性連接部配置以電性連接該外部電路; 該第二外部電性連接部由該基底組件露出; 該第一外部電性連接部之該表面與該第二外部電性連接部的該表面平行; 該第一外部電性連接部之該表面與該第二外部電性連接部的該表面共平面; 該第一外部電性連接部中面朝該第一線圈之一表面與該第一內部電性連接部面朝該第一線圈之該表面位於不同平面; 該第二導電元件之一第二內部電性連接部之一表面與該主軸垂直或平行; 該第二內部電性連接部配置以電性連接該電子元件; 該第二內部電性連接部由該基底組件露出; 該第二導電元件具有一第二截面,該第二截面具有多邊形結構; 該第一內部電性連接部之該表面與該第二內部電性連接部的該表面平行; 該第一內部電性連接部之該表面與該第二內部電性連接部的該表面共平面; 該第三導電元件具有板狀結構; 該第三導電元件具有金屬材質; 該第三導電元件之至少一部分埋藏且不由該基底組件露出; 該第三導電元件之一第三外部電性連接部之一表面與該主軸垂直或平行; 該第三外部電性連接部配置以電性連接該外部電路; 該第三外部電性連接部由該基底組件露出; 該第三導電元件之一第三內部電性連接部之一表面與該主軸垂直或平行; 該第三內部電性連接部配置以電性連接該第二線圈; 該第三內部電性連接部由該基底組件露出; 該第三內部電性連接部之該表面與該第一內部電性連接部的該表面共平面; 其中該無線傳輸模組更包含: 一第二補強元件,直接接觸該第二內部電性連接部; 一第三補強元件,直接接觸該第三內部電性連接部;以及 一第四補強元件,直接接觸該第一外部電性連接部; 該第二補強元件具有非金屬材質; 該第三補強元件具有非金屬材質; 該第一補強元件與該第四補強元件具有一體成型結構; 該電子元件設置於該基底組件之一容納部; 該容納部具有凹陷結構且位於該第一基底表面; 該無線傳輸模組更包含一第一保護元件,設置於該第一線圈上; 該第一保護元件更包含一開口,對應於該容納部; 當沿著該第一方向觀察時,該電子元件之至少一部分由該開口露出; 該第一線圈之至少一部分由該容納部露出; 在該主軸上,該第一線圈之一第一感應本體的最大尺寸不同於該基底組件的最大尺寸; 在該主軸上,該第一感應本體的最大尺寸小於該基底組件的最大尺寸; 在該主軸上,該第一感應本體的最大尺寸小於該基底組件的最大尺寸的三分之一。 The wireless transmission module as described in claim 2, wherein The wireless transmission module further includes a first conductive element; The first coil is electrically connected to an external circuit through the first conductive element; The first conductive element has a plate-like structure; The first conductive element is made of metal; At least a portion of the first conductive element is buried and not exposed by the base component; A surface of a first external electrical connection portion of the first conductive element is perpendicular or parallel to the main axis; The first external electrical connection portion is configured to electrically connect to the external circuit; A portion of the first external electrical connection portion is exposed from the base component; A surface of a first internal electrical connection portion of the first conductive element is perpendicular or parallel to the main axis; The first internal electrical connection portion is configured to electrically connect the first coil; The first internal electrical connection portion is exposed from the base component; The wireless transmission module further includes a first reinforcing element directly contacting the first internal electrical connection part; A first conductor of the first coil has a first cross-section, the first conductive element has a second cross-section, and the first cross-section and the second cross-section have different structures; The first section has an arc structure; The second cross-section has a polygonal structure; The wireless transmission module also includes: An electronic component is provided on the base component; a second conductive element, and the electronic component is electrically connected to the external circuit via the second conductive element; and a third conductive element, and the second coil is electrically connected to the external circuit via the third conductive element; The second conductive element has a plate-like structure; The second conductive element is made of metal; At least a portion of the second conductive element is buried and not exposed by the base component; A surface of a second external electrical connection portion of the second conductive element is perpendicular or parallel to the main axis; The second external electrical connection portion is configured to electrically connect to the external circuit; The second external electrical connection portion is exposed from the base component; The surface of the first external electrical connection part is parallel to the surface of the second external electrical connection part; The surface of the first external electrical connection part is coplanar with the surface of the second external electrical connection part; A surface of the first external electrical connection portion facing the first coil and the surface of the first internal electrical connection portion facing the first coil are located in different planes; A surface of a second internal electrical connection portion of the second conductive element is perpendicular or parallel to the main axis; The second internal electrical connection portion is configured to electrically connect the electronic component; The second internal electrical connection portion is exposed from the base component; The second conductive element has a second cross-section, and the second cross-section has a polygonal structure; The surface of the first internal electrical connection part is parallel to the surface of the second internal electrical connection part; The surface of the first internal electrical connection is coplanar with the surface of the second internal electrical connection; The third conductive element has a plate-like structure; The third conductive element is made of metal; At least a portion of the third conductive element is buried and not exposed by the base component; A surface of a third external electrical connection portion of the third conductive element is perpendicular or parallel to the main axis; The third external electrical connection portion is configured to electrically connect to the external circuit; The third external electrical connection portion is exposed from the base component; A surface of a third internal electrical connection portion of the third conductive element is perpendicular or parallel to the main axis; The third internal electrical connection portion is configured to electrically connect the second coil; The third internal electrical connection portion is exposed from the base component; The surface of the third internal electrical connection portion is coplanar with the surface of the first internal electrical connection portion; The wireless transmission module further includes: a second reinforcing element directly contacting the second internal electrical connection; a third reinforcing element directly contacting the third internal electrical connection; and a fourth reinforcing element directly contacting the first external electrical connection part; The second reinforcing element is made of non-metallic material; The third reinforcing element is made of non-metallic material; The first reinforcing element and the fourth reinforcing element have an integrally formed structure; The electronic component is arranged in a receiving portion of the base component; The receiving portion has a recessed structure and is located on the first base surface; The wireless transmission module further includes a first protection element disposed on the first coil; The first protection element further includes an opening corresponding to the receiving portion; When viewed along the first direction, at least a portion of the electronic component is exposed from the opening; At least a portion of the first coil is exposed from the receiving portion; On the main axis, the maximum size of the first induction body of the first coil is different from the maximum size of the base component; On the main axis, the maximum dimension of the first sensing body is smaller than the maximum dimension of the base component; On the main axis, the maximum dimension of the first sensing body is less than one-third of the maximum dimension of the base assembly. 如請求項2所述之無線傳輸模組,其中 該無線傳輸模組更包含一第二線圈,設置於該基底組件; 該基底組件更包含: 一第一感應部,對應於該第一線圈並具有一第一特性函數;以及 一第二感應部,對應於該第二線圈並具有一第二特性函數; 當沿著該主軸觀察時,該第一感應部與該第一線圈之至少一部分重疊; 當沿著該主軸觀察時,該第二感應部與該第二線圈之至少一部分重疊; 對應於一第一頻率之電磁波,該第一、第二特性函數不同; 該基底組件更包含一第二導磁部,與該第一導磁部具有不同材質; 當沿著該主軸觀察時,該第二導磁部與該第一線圈或該第二線圈至少一者重疊; 該第一感應部涵蓋該第一導磁部之一部分; 該第二感應部涵蓋該第二導磁部之一部分; 當沿著該主軸觀察時,該第二導磁部與第一導磁部之至少一部分重疊; 當沿著垂直於該主軸之方向觀察時,該第二導磁部與第一導磁部不重疊; 在該主軸上,該第一感應部之最大尺寸與該第二感應部之最大尺寸不同; 一外部電路包含一容納空間,配置以容納該基底組件之至少一部分; 該容納空間具有開口結構; 當沿著垂直於該主軸之方向觀察時,該外部電路與該基底組件之至少一部分重疊; 當沿著該主軸之方向觀察時,該外部電路與該基底組件之至少一部分重疊。 The wireless transmission module as described in claim 2, wherein The wireless transmission module further includes a second coil disposed on the base component; The base component further includes: a first induction part corresponding to the first coil and having a first characteristic function; and a second induction part corresponding to the second coil and having a second characteristic function; When viewed along the main axis, the first sensing portion overlaps at least a portion of the first coil; When viewed along the main axis, the second sensing portion overlaps at least a portion of the second coil; Corresponding to an electromagnetic wave of a first frequency, the first and second characteristic functions are different; The base component further includes a second magnetic conductive part made of a different material from the first magnetic conductive part; When viewed along the main axis, the second magnetic conductive portion overlaps with at least one of the first coil or the second coil; The first sensing part covers a part of the first magnetic conductive part; The second induction part covers a part of the second magnetic conductive part; When viewed along the main axis, the second magnetically conductive portion overlaps at least a portion of the first magnetically conductive portion; When viewed along the direction perpendicular to the main axis, the second magnetic conductive part does not overlap with the first magnetic conductive part; On the main shaft, the maximum size of the first sensing part is different from the maximum size of the second sensing part; An external circuit includes a receiving space configured to receive at least a portion of the base component; The accommodation space has an opening structure; The external circuit overlaps at least a portion of the base component when viewed along a direction perpendicular to the main axis; The external circuit overlaps at least a portion of the base component when viewed along the direction of the main axis. 如請求項7所述之無線傳輸模組,其中 當沿著垂直於該主軸之方向觀察時,該外部電路與第一導磁部之至少一部分重疊; 當沿著垂直於該主軸之方向觀察時,該外部電路與該第一線圈之至少一部分重疊; 當沿著垂直於該主軸之方向觀察時,該外部電路與該第二線圈之至少一部分重疊; 該基底組件定義有一第一重疊部,並且當沿著垂直於該主軸之方向觀察時,該外部電路與該第一重疊部重疊; 當沿著該主軸觀察時,該外部電路與該第一重疊部不重疊; 當沿著該主軸觀察時,該第一重疊部與該外部電路之間具有間隙。 The wireless transmission module as described in claim 7, wherein When viewed along a direction perpendicular to the main axis, the external circuit overlaps at least a portion of the first magnetic conductive portion; The external circuit overlaps at least a portion of the first coil when viewed along a direction perpendicular to the main axis; The external circuit overlaps at least a portion of the second coil when viewed along a direction perpendicular to the main axis; The base component defines a first overlapping portion, and the external circuit overlaps the first overlapping portion when viewed along a direction perpendicular to the main axis; The external circuit does not overlap the first overlapping portion when viewed along the main axis; When viewed along the main axis, there is a gap between the first overlapping portion and the external circuit. 如請求項7所述之無線傳輸模組,其中 當沿著垂直於該主軸之方向觀察時,該外部電路與該第一線圈不重疊; 當沿著該主軸觀察時,該外部電路與該第一線圈不重疊; 當沿著該主軸觀察時,該外部電路與該第二線圈之至少一部分重疊; 當沿著垂直於該主軸之方向觀察時,該外部電路與該第二導磁部之至少一部分重疊。 The wireless transmission module as described in claim 7, wherein The external circuit does not overlap the first coil when viewed along a direction perpendicular to the main axis; The external circuit does not overlap the first coil when viewed along the main axis; The external circuit overlaps at least a portion of the second coil when viewed along the main axis; When viewed along a direction perpendicular to the main axis, the external circuit overlaps at least a portion of the second magnetic conductive portion. 如請求項7所述之無線傳輸模組,其中 該基底組件定義有一第一重疊部、一第二重疊部以及一第三重疊部; 當沿著垂直於該主軸之方向觀察時,該外部電路與該第一重疊部重疊; 當沿著該主軸觀察時,該外部電路與該第一重疊部不重疊; 當沿著該主軸觀察時,該外部電路與該第二重疊部重疊; 當沿著垂直於該主軸之方向觀察時,該外部電路與該第二重疊部不重疊; 當沿著該主軸觀察時,該外部電路與該第三重疊部重疊; 當沿著垂直於該主軸之方向觀察時,該外部電路與該第三重疊部不重疊; 當沿著垂直於該主軸之方向觀察時,該外部電路位於該第二重疊部與該第三重疊部之間; 該第一重疊部、該第二重疊部以及該第三重疊部具有一體成型結構; 該第一重疊部接觸該外部電路。 The wireless transmission module as described in claim 7, wherein The base component defines a first overlapping portion, a second overlapping portion and a third overlapping portion; The external circuit overlaps the first overlapping portion when viewed along a direction perpendicular to the main axis; The external circuit does not overlap the first overlapping portion when viewed along the main axis; The external circuit overlaps the second overlap when viewed along the main axis; When viewed along a direction perpendicular to the main axis, the external circuit does not overlap with the second overlapping portion; The external circuit overlaps the third overlap portion when viewed along the main axis; When viewed along a direction perpendicular to the main axis, the external circuit does not overlap with the third overlapping portion; When viewed along a direction perpendicular to the main axis, the external circuit is located between the second overlapping portion and the third overlapping portion; The first overlapping part, the second overlapping part and the third overlapping part have an integrally formed structure; The first overlapping portion contacts the external circuit.
TW111121942A 2022-06-14 2022-06-14 Wireless transmission module TW202349829A (en)

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