TW202030752A - Wireless module - Google Patents

Abstract

A wireless module includes a coil assembly and an inductive substrate. The coil assembly has a coil body and a lead wire. The lead wire is electrically connected to the coil body at an exiting section. When viewed along a winding axis, the coil body partially overlaps the lead wire. The inductive substrate has a lead wire receiving portion and an exiting section receiving portion. The lead wire receiving portion is configured to receive a portion of the lead wire. The exiting section receiving portion is configured to receive a portion of the exiting section. The exiting section and the lead wire are arranged along a first direction, the size of the exiting section receiving portion is larger than the size of the lead wire receiving portion along a second direction, and the second direction is not parallel to the first direction and the winding axis.

Description

Wireless module

The present invention relates to a wireless module, in particular to a wireless module applied to miniaturized electronic devices.

With the development of technology, many electronic devices (such as tablet computers or smart phones) now have wireless charging capabilities. The user can place the electronic device on a wireless charging transmitter, so that the wireless charging receiver in the electronic device uses electromagnetic induction or electromagnetic resonance to generate current to charge the battery. Due to the convenience of wireless charging, electronic devices with wireless charging modules are gradually becoming popular among the public.

Generally speaking, a wireless charging module will include a magnetically permeable substrate to carry a coil. Wherein, when the coil is energized and operated in a wireless charging mode or a wireless communication mode, the magnetically permeable substrate can make the magnetic lines of force emitted by the coil more concentrated to obtain better performance. However, the structure of the existing wireless charging (or communication) module and the winding method of the coil cannot meet various requirements for the wireless module, such as the need for better charging, communication performance and more miniaturized size.

Therefore, how to design a wireless module that can meet the various needs of users is a topic worthy of discussion and solution.

According to some embodiments of the present disclosure, the present disclosure provides a wireless module that can be used to transmit energy or signals, including a coil component and an induction substrate. The coil assembly has a coil body and a lead wire. The coil body is configured to be wound around a spool. The lead wire is electrically connected to the coil body to an outlet wire section, wherein when viewed from the direction of the winding axis, the coil body and the lead wire partially overlap. The induction substrate is arranged adjacent to the coil assembly, the induction substrate is configured to change the electromagnetic field distribution near the coil assembly, and the induction substrate has a lead-out line accommodating part and an out-line segment accommodating part. The lead-out accommodating part is the lead-out line of the accommodating part, and when viewed along one direction of the vertical winding axis, the lead-out accommodating part and the lead-out part overlap. The outlet-segment accommodating part is configured to accommodate part of the outlet-segment, wherein the outlet-segment accommodating part and the outlet-segment partly overlap when viewed along the direction perpendicular to the winding axis. The outlet section and the outlet line are arranged along a first direction, the size of the outlet section accommodating part is larger than the size of the outlet line accommodating part in a second direction, and the second direction is not parallel to the first direction and the winding axis.

According to some embodiments of the present disclosure, the bobbin does not pass through the winding of the coil body, and the bobbin does not pass through the wire outlet receiving portion.

According to some embodiments of the present disclosure, the lead wire further includes a first insulating layer and a second insulating layer, and the second insulating layer covers the first insulating layer.

According to some embodiments of the present disclosure, the outlet segment accommodating portion is further configured to accommodate one of a positioning structure, an electronic component, and a circuit board.

According to some embodiments of the present disclosure, when viewed from a section parallel to the winding axis, the coil assembly has a hollow center portion, a first layer of winding and a second layer of winding, the first layer of winding and the second layer of winding The second layer of winding is parallel to the center, the distance between the first layer of winding and the center is different from the distance between the second layer of winding and the center, the first layer of winding includes a first section arranged along a third direction Section and a second section, the second layer line includes a third section and a fourth section arranged along a fourth direction, the third direction is parallel and opposite to the fourth direction, and the third section passes through The second section is connected to the first section.

According to some embodiments of the present disclosure, the second layer of winding further includes a fifth section, the first layer of winding further includes a sixth section, and the fifth and sixth sections are substantially perpendicular to the winding. One of the spools is arranged in the fifth direction, and the sixth segment is connected to the fourth segment via the fifth segment.

According to some embodiments of the present disclosure, the wireless module further includes a first inner adhesive layer and an adhesive. The first inner adhesive layer is disposed between the induction substrate and the coil assembly. The adhesive is arranged between the coil component and the first inner adhesive layer, and the adhesive and the first inner adhesive layer have different materials.

According to some embodiments of the present disclosure, the coil assembly includes a plurality of winding wires, and when viewed along a direction perpendicular to the winding axis, the winding wires partially overlap the adhesive, and a part of the adhesive is located between the winding wires.

According to some embodiments of the present disclosure, the first inner adhesive layer has an adhesive accommodating portion configured to accommodate part of the adhesive, and when viewed in a direction perpendicular to the winding axis, the first inner adhesive layer and the adhesive partially overlap.

According to some embodiments of the present disclosure, the wireless module further includes a first elastic substrate. The first elastic substrate is flexible and configured to enhance the mechanical strength of the wireless module. The coil component is disposed on the first elastic substrate and the sensing substrate. between.

According to some embodiments of the present disclosure, the wireless module further includes a first outer bonding layer and a first peeling layer. The first outer adhesive layer is arranged on the coil assembly. The first peeling layer is arranged on the first outer adhesive layer. The first peeling layer is configured to peel off the first outer adhesive layer when the wireless module is installed in an electronic device, so that the wireless module is directly fixed to the electronic device through the first outer adhesive layer.

According to some embodiments of the present disclosure, the first peeling layer includes a covering portion and a protruding portion. The shape of the covering part corresponds to the shape of the first outer adhesive layer. The protruding part extends outward from the edge of the covering part. When viewed along the direction of the winding axis, the protruding part does not overlap with the coil component part.

According to some embodiments of the present disclosure, when viewed along the direction of the winding axis, the protruding portion does not overlap with the first outer adhesive layer portion.

According to some embodiments of the present disclosure, when viewed along the direction of the winding axis, the protruding portion protrudes outward from the edge of the sensing substrate.

According to some embodiments of the present disclosure, the coil body is electrically connected to an external circuit via a lead wire, and the protrusion corresponds to the junction of the coil body and the lead wire, and when viewed along the direction of the winding axis, the protrusion and The lead wires partially overlap.

According to some embodiments of the present disclosure, when viewed along the direction of the winding axis, the protruding portion partially overlaps an edge of the sensing substrate, and the protruding portion protrudes from the edge along the extension direction of the lead wire.

The present disclosure proposes a wireless module for transmitting energy or signals, including a coil assembly and an induction substrate. The induction substrate may have a lead-out line accommodating part and an outlet-segment accommodating part, configured to accommodate the lead-out line and the outgoing line of the coil assembly. Line segment. Through the structural design of the induction substrate, the goals of miniaturizing the wireless module, increasing the number of coils of the coil assembly, improving assembly convenience and assembly yield can be achieved at the same time.

In order to make the purpose, features, and advantages of the present disclosure more obvious and understandable, the following embodiments are specially cited and are illustrated in detail with accompanying drawings. Wherein, the configuration of each element in the embodiment is for illustrative purposes, and is not intended to limit the disclosure. In addition, part of the repetition of the drawing symbols in the embodiments is for simplifying the description, and does not mean the relevance between different embodiments. The directional terms mentioned in the following embodiments, for example: up, down, left, right, front or back, etc., are only directions for referring to the attached drawings. Therefore, the directional terms used are used to illustrate and not to limit the disclosure.

It must be understood that the elements specifically described or illustrated can exist in various forms well known to those skilled in the art. In addition, when a layer is "on" other layers or substrates, it may mean "directly" on other layers or substrates, or that a layer is on other layers or substrates, or that it is sandwiched between other layers or substrates. Other layers.

In addition, the embodiments may use relative terms, such as “lower” or “bottom” and “higher” or “top” to describe the relative relationship between one element of the illustration and another element. It can be understood that if the illustrated device is turned upside down, the elements described on the "lower" side will become elements on the "higher" side.

Here, the terms "about" and "approximately" usually mean within 20% of a given value or range, preferably within 10%, and more preferably within 5%. The quantity given here is an approximate quantity, which means that the meaning of "about" and "approximately" can still be implied without specific instructions.

Please refer to Figure 1. Figure 1 is an exploded view of a wireless device 100 according to an embodiment of the disclosure. As shown in Figure 1, the wireless module 100 is a wireless module that can be used to transmit energy or signals. The wireless module 100 may include a coil component 102, a first adhesive layer 104, a sensing substrate 106, and a second adhesive layer 107. In this embodiment, the coil component 102 is disposed on the induction substrate 106, and the coil component 102 can be connected to the induction substrate 106 by using the first adhesive layer 104. Furthermore, the sensing substrate 106 can be connected to a circuit board or a bottom plate (not shown in the figure) of the wireless module 100 through the second adhesive layer 107. Wherein, the first adhesive layer 104 and the second adhesive layer 107 can be tapes or any other materials that can be used for connection.

Please refer to FIG. 1 and FIG. 2 at the same time. FIG. 2 is a bottom view of the wireless module 100 according to this embodiment of the disclosure after being assembled (for clarity, the second adhesive layer 107 is omitted in FIG. 2). As shown in the figure, the coil assembly 102 has a coil body 1020 and a lead wire 1021. The coil body 1020 is configured to be wound around a bobbin AX, and the lead wire 1021 is electrically connected to the coil body 1020 and a lead wire 1023. . As shown in FIG. 2, when viewed in the direction of the winding axis AX, the coil body 1020 and the lead wire 1021 partially overlap.

In this embodiment, the induction substrate 106 is disposed adjacent to the coil assembly 102, and the coil assembly 102 is configured to change the electromagnetic field distribution near the coil assembly 102. Wherein, the sensing substrate 106 can be a ferrite, but it is not limited thereto. For example, in other embodiments, the sensing substrate 106 may also include nanocrystalline materials. The induction substrate 106 may have a magnetic permeability corresponding to the coil assembly 102, so that the electromagnetic waves of the coil assembly 102 are more concentrated.

Please refer to FIG. 3 at the same time. FIG. 3 is a schematic diagram of the wireless module 100 according to this embodiment of the disclosure viewed along the Y axis after being assembled. As shown in FIGS. 2 and 3, the sensing substrate 106 has an accommodating space, and the accommodating space defines a lead-out line accommodating portion 1061 and an exit-line segment accommodating portion 1063. The lead wire accommodating part 1061 is the lead wire 1021 of the accommodating part (Figure 2), and the lead wire accommodating part 1063 is configured to accommodate the part of the lead wire 1023. In addition, the first adhesive layer 104 may also have an opening 1041 (Figure 1) corresponding to the aforementioned accommodating space, and the size of the opening 1041 may be slightly larger than the accommodating space to avoid assembly tolerance problems.

As shown in FIG. 3, when viewed along the direction perpendicular to the winding axis AX, the lead wire accommodating portion 1061 and the lead wire 1021 partially overlap. Furthermore, the outlet segment accommodating portion 1063 and the outlet segment 1023 partially overlap.

In addition, as shown in Figure 2, the outlet segment 1023 and the outlet wire 1021 can be arranged along a first direction A1, and the size of the outlet segment accommodating portion 1063 in a second direction A2 is larger than that of the outlet accommodating portion 1061 Size, so it can improve assembly convenience and assembly yield. Wherein, the second direction A2 is not parallel to the first direction A1 and the winding axis AX. In this embodiment, the first direction A1 is parallel to the Y-axis direction, and the second direction A2 is parallel to the X-axis direction, but it is not limited to this. In other embodiments, the first direction A1 and the second direction A2 may not be parallel In the Y-axis direction and the X-axis direction.

Furthermore, it is worth noting that, as shown in FIGS. 1 and 2, the bobbin AX does not pass through the winding of the coil body 1020, and the bobbin AX does not pass through the wire outlet accommodating portion 1063.

In this embodiment, the coil assembly 102 can be used as a charging coil for wireless charging by an external charging device. For example, the coil assembly 102 can be used as a resonant charging coil based on the Alliance for Wireless Power (A4WP) standard, but is not limited to this. In addition, the coil assembly 102 can be based on a Wireless Power Consortium (WPC) standard, such as the Qi standard, to serve as an inductive charging coil. Therefore, in this embodiment, the coil assembly 102 can simultaneously correspond to different charging methods, so as to increase the applicable range. For example, at short distances (for example, less than 1cm), use induction operation; at long distances, use resonance operation.

Please refer to FIG. 4, which is a schematic cross-sectional view along the line A-A' of FIG. 2 according to this embodiment of the disclosure. As shown in Figure 4, when viewed from a section (XZ plane) parallel to the winding axis AX, the coil assembly 102 is formed with a hollow center portion HP, a first layer winding LW1, and a second layer winding LW2 to the Nth layer winding LWN. The first layer winding LW1, the second layer winding LW2 to the Nth layer winding LWN are respectively substantially parallel to the central portion HP (or the winding axis AX).

The distance between the first-layer winding LW1 and the central part HP is different from the distance between the second-layer winding LW2 and the central part HP. For example, as shown in FIG. 4, the distance between the second-layer winding LW2 and the central part HP is greater than the distance between the first-layer winding LW1 and the central part HP.

Next, the winding method of the coil assembly 102 will be described. For the sake of clarity, only the first layer of winding LW1 and the second layer of winding LW2 are used to illustrate the winding method, and the rest can be deduced by analogy. As shown in Figure 4, the first layer winding LW1 includes a first section S1 and a second section S2 arranged along a third direction A3, and the second section S2 is connected to the first section S1. This means that the first layer of winding LW1 starts to be wound from the first section S1 to form a circle and then is wound to the second section S2.

Next, after winding the second section S2, the second layer of winding LW2 is continuously wound. The second layer winding LW2 includes a third section S3 and a fourth section S4 arranged along a fourth direction A4. The third section S3 is connected to the first section S1 via the second section S2, And the third stage part S3 is connected to the fourth stage part S4. This means that the second layer of winding LW2 starts to be wound from the third section S3 to form a circle before being wound to the fourth section S4. Among them, the third direction A3 and the fourth direction A4 are parallel and opposite.

In addition, the second layer of winding LW2 may further include a fifth section S5, and the first layer of winding LW1 may further include a sixth section S6. The fifth stage part S5 and the sixth stage part S6 are arranged in sequence along a fifth direction A5, which is substantially perpendicular to the winding axis AX, and the sixth stage part S6 is connected to the fourth stage part S4 via the fifth stage part S5 . That is, after winding the fourth section S4, the fifth section S5 is continuously wound, and finally the sixth section S6 is wound.

Please refer to FIG. 5, which is an exploded view of a wireless module 200 according to another embodiment of the disclosure. In this embodiment, the wireless module 200 includes a coil component 202, an adhesive layer 204, and a sensing substrate 206. The coil assembly 202 is connected to the sensing substrate 206 by the adhesive layer 204. The difference between the wireless module 200 and the wireless module 100 is that the outlet section 2023 of the coil assembly 202 is located above the coil body 2020, and the sensing substrate 206 does not have an opening for accommodating the outlet section 2023.

Furthermore, the lead wire 2021 of the coil assembly 202 may further include a first insulating layer PL1 and a second insulating layer PL2, and the second insulating layer PL2 is covered outside the first insulating layer PL1. In this embodiment, the first insulating layer PL1 may be insulating varnish, and the second insulating layer PL2 may be an insulating plastic sleeve, but it is not limited thereto.

With the configuration of the first insulating layer PL1 and the second insulating layer PL2, when the wireless module 200 is installed inside an electronic device, it can further prevent the lead wire 2021 and other electronic components inside the electronic device from generating unnecessary electrical properties. connection. It should be noted that the configuration of the first insulating layer PL1 and the second insulating layer PL2 can also be applied to other embodiments of the disclosure.

Please refer to FIG. 5A. FIG. 5A is an exploded view of a wireless module 200A according to another embodiment of the disclosure. The wireless module 200A is similar to the wireless module 200, and the difference between the wireless module 200A and the wireless module 200 is that a magnetic element 2061 can be further provided on the sensing substrate 206A, which is configured to pass through the adhesive layer 204A and the coil assembly 202A .

In this embodiment, the magnetic element 2061 can be used to adjust the magnetic flux path of the wireless module 200A, or can be used as an identification element. For example, an external wireless charging device (not shown in the figure) is configured to charge or communicate with the wireless module 200A when the magnetic element 2061 is sensed.

Please refer to FIG. 6, which is an exploded view of a wireless module 300 according to another embodiment of the disclosure. Similar to the wireless module 100, the wireless module 300 may include a coil component 302, a first adhesive layer 304, a sensing substrate 306, and a second adhesive layer 307. The difference between the wireless module 300 and the wireless module 100 is that the wireless module 300 further includes a first inner adhesive layer 309 disposed on the first adhesive layer 304 and located between the sensing substrate 306 and the coil assembly 302. In addition, the wireless module 300 may further include an adhesive 310 disposed between the coil component 302 and the first inner adhesive layer 309, and the adhesive 310 and the first inner adhesive layer 309 have different materials. For example, the adhesive 310 may be glue, and the first inner adhesive layer 309 is a double-sided tape, but it is not limited thereto.

Please refer to FIG. 7, which is a schematic cross-sectional view along the line B-B' in FIG. 6 according to this embodiment of the disclosure. As shown in Figure 7, when viewed along the direction perpendicular to the winding axis AX of Figure 6, the plurality of windings in the coil assembly 302 partially overlap the adhesive 310, and a part of the adhesive 310 is located on these windings. Between the lines.

By further disposing the adhesive 310 on the first inner adhesive layer 309, a part of the adhesive 310 can enter between the multiple windings of the coil assembly 302, thereby enhancing the coil assembly 302 and the first inner adhesive layer 309 The bonding ability can also achieve the purpose of improving the overall mechanical strength of the wireless module 300.

Furthermore, in other embodiments, the sensing substrate 306 may also have a structure similar to the lead-out line accommodating portion 1061 and the lead-out segment accommodating portion 1063 in FIG. 1, and configured to accommodate the lead-out line and the lead-out segment. The structure of the sensing substrate 306 can be designed according to actual requirements.

Please refer to FIG. 8, which is a schematic cross-sectional view of the first inner adhesive layer 309, the coil component 302, and the adhesive 310 according to another embodiment of the present disclosure. In this embodiment, the first inner adhesive layer 309 may have an adhesive containing portion 3091 configured to contain part of the adhesive 310. As shown in FIG. 8, when viewed along the direction perpendicular to the winding axis AX, the first inner adhesive layer 309 and the adhesive 310 partially overlap.

Please refer to FIG. 9, which is an exploded view of a wireless module 400 according to another embodiment of the disclosure. Similar to the wireless module 100, the wireless module 400 may include a coil component 402, an adhesive layer 404, and a sensing substrate 406. The wireless module 400 is similar to the wireless module 100, and the difference between the wireless module 400 and the wireless module 100 is that the sensing substrate 406 has an accommodating space 406S (including the lead-out accommodating portion 4061 and the outlet-segment accommodating portion 4063). The accommodating space 406S can be further configured to accommodate one of a positioning structure, an electronic component, and a circuit board.

For example, when the wireless module 400 is installed on a circuit board, a positioning post (not shown in the figure) on the circuit board can pass through the wire-out accommodating portion 4063 and the adhesive layer 404 in sequence along the winding axis AX. An opening 4041 of, and the coil assembly 402 enable the wireless module 400 to be accurately positioned on the circuit board. Wherein, the size of the opening 4041 can be larger than the size of the outlet section accommodating portion 4063, and the height of the positioning column along the Z-axis direction is smaller than the height of the wireless module 400 after assembly.

In addition, in this embodiment, the wireless module 400 may further include a covering layer 412 configured to cover the coil assembly 402, so as to prevent the coil assembly 402 from interacting with the inside of the electronic device when the wireless module 400 is installed in an electronic device. The other electronic components of the company create unnecessary electrical connections.

Please refer to FIG. 10, which is an exploded view of a wireless module 500 according to another embodiment of the disclosure. Similar to the wireless module 100, the wireless module 500 may include a coil component 502, a first adhesive layer 504, a sensing substrate 506, and a second adhesive layer 507. The difference between the wireless module 500 and the wireless module 100 is that the wireless module 500 may further include a third adhesive layer 508 and a first elastic substrate 512. The coil component 502 is disposed between the first flexible substrate 512 and the sensing substrate 506, the third adhesive layer 508 is disposed between the first flexible substrate 512 and the coil component 502, and the first flexible substrate 512 is formed by the third adhesive The layer 508 is connected to the coil assembly 502.

In this embodiment, the first elastic substrate 512 has flexibility, and may be made of polyethylene terephthalate (PET), for example. By providing the first elastic substrate 512, the coil assembly 502 and the sensing substrate 506 can be protected, the overall mechanical strength of the wireless module 500 can be strengthened, and dust can also be prevented from falling into the wireless module 500.

Furthermore, the second adhesive layer 507 of this embodiment is configured to adhere the sensing substrate 506 to a circuit board or an electronic device, but it is not limited thereto. For example, in other embodiments, the second adhesive layer 507 can also be replaced by a second elastic substrate, thereby increasing the overall structural strength of the wireless module 500. Wherein, the bottom of the second elastic substrate may be provided with an adhesive layer (such as double-sided tape), which is configured to adhere to the aforementioned circuit board or electronic device.

Please also refer to FIG. 10 and FIG. 11. FIG. 11 is a schematic cross-sectional view of the wireless module 500 according to this embodiment of the disclosure along the line C-C' in FIG. 10 after being assembled. As shown in FIG. 10, the first adhesive layer 504 does not have an opening corresponding to the lead-out line accommodating portion 5061 or the lead-out segment accommodating portion 5063. Therefore, as shown in FIG. 11, the lead wire 5021 pushes the first adhesive layer 504 toward the -Z axis, so that the lead wire 5021 and part of the first adhesive layer 504 can be accommodated in the lead wire receiving portion 5061.

Please refer to FIG. 12, which is an exploded view of a wireless module 600 according to another embodiment of the disclosure. Similar to the wireless module 500, the wireless module 600 can include a coil component 602, a first adhesive layer 604, a sensing substrate 606 (with a lead-out line receiving portion 6061 and a lead-out section receiving portion 6063), and a second adhesive layer 607 , A first outer adhesive layer 608 and a first peeling layer 612. Among them, the first outer adhesive layer 608 is disposed on the coil component 602, and the first peeling layer 612 is disposed on the first outer adhesive layer 608. The first outer adhesive layer 608 can be a double-sided adhesive, and the first peeling layer 612 is configured to peel off the first outer adhesive layer 608 when the wireless module 600 is installed in an electronic device, so that the wireless module 600 can pass through The first outer adhesive layer 608 is directly fixed to the aforementioned electronic device.

In other embodiments, the first peeling layer 612 may also be disposed under the bottom of the second adhesive layer 607, and the first peeling layer 612 is configured to be peeled off from the second adhesive layer when the wireless module 600 is installed on an electronic device 607, so that the wireless module 600 is directly fixed to the aforementioned electronic device through the second adhesive layer 607.

Please refer to FIG. 12 and FIG. 13. FIG. 13 is a top view of the wireless module 600 according to this embodiment of the disclosure. As shown in the figure, the first peeling layer 612 includes a covering portion 6121 and a protruding portion 6123. The shape of the covering portion 6121 corresponds to the first outer adhesive layer 608. The protruding portion 6123 extends outward from the edge of the covering portion 6121.

As shown in FIG. 13, in this embodiment, when viewed in the direction of the winding axis AX, the protruding portion 6123 and the first outer adhesive layer 608 partially do not overlap. In addition, the protruding portion 6123 and the coil component 602 do not partially overlap. That is, the protrusion 6123 does not overlap the coil body 6020 but overlaps the lead wire 6021. However, in other embodiments, the protrusion 6123 and the first outer adhesive layer 608 do not overlap at all.

Next, please refer to FIG. 14, which is a bottom view of the wireless module 600 according to this embodiment of the disclosure. For the sake of clarity, FIG. 14 only shows the induction substrate 606, the coil assembly 602, and the first peeling layer 612. As shown in FIG. 14, when viewed in the direction of the winding axis AX, the protruding portion 6123 substantially protrudes from the edge 6065 of the sensing substrate 606.

Furthermore, the coil body 6020 can be electrically connected to an external circuit or device via the lead wire 6021, and the protruding portion 6123 corresponds to the junction between an outer edge 6022 of the coil body 6020 and the lead wire 6021. As shown in FIG. 14, when viewed in the direction of the winding axis AX, the protruding portion 6123 partially overlaps the lead wire 6021. In addition, in this embodiment, the protruding portion 6123 is substantially partially overlapped with the edge 6065 of the sensing substrate 606, and the protruding portion 6123 protrudes from the edge 6065 along the extension direction of the lead line 6021. However, in other embodiments, the protrusion 6123 and the edge 6065 of the sensing substrate 606 do not overlap at all.

The present disclosure proposes a wireless module for transmitting energy or signals, including a coil assembly and an induction substrate. The induction substrate may have a lead-out line accommodating part and an outlet-segment accommodating part, configured to accommodate the lead-out line and the outgoing line of the coil assembly. Line segment. Through the structural design of the induction substrate, the goals of miniaturizing the wireless module, increasing the number of coils of the coil assembly, improving assembly convenience and assembly yield can be achieved at the same time.

The ordinal numbers in this specification and the scope of the patent application, such as "first", "second", "third", etc., do not have a sequential relationship between each other, and they are only used to distinguish two having the same Different components of the name.

Although the embodiments and advantages of the present disclosure have been disclosed as above, it should be understood that any person with ordinary knowledge in the relevant technical field can make changes, substitutions and modifications without departing from the spirit and scope of the present disclosure. In addition, the scope of protection of the present disclosure is not limited to the manufacturing process, machinery, manufacturing, material composition, device, method, and steps in the specific embodiments described in the specification. Anyone with ordinary knowledge in the technical field can disclose the content from this disclosure. It is understood that the current or future developed processes, machines, manufacturing, material composition, devices, methods, and steps can be used according to the present disclosure as long as they can implement substantially the same functions or obtain substantially the same results in the embodiments described herein. Therefore, the protection scope of this disclosure includes the above-mentioned manufacturing processes, machines, manufacturing, material composition, devices, methods and steps. In addition, each patent application scope constitutes an individual embodiment, and the protection scope of the present disclosure also includes each patent application scope and a combination of embodiments.

100, 200, 300, 400, 500, 600: wireless module 102, 202, 202A, 302, 402, 502, 602: coil assembly 1020, 2020, 6020: coil body 1021: lead wire 1023: lead wire 104: section An adhesive layer 1041: openings 106, 206, 206A, 306, 406, 506, 606: sensing substrate 1061: lead-out line receiving part 1063: lead-out line holding part 107: second adhesive layer 2021: lead-out line 2023: lead line 204, 204A: Adhesive layer 2061: Magnetic element 304: First adhesive layer 307: Second adhesive layer 309: First inner adhesive layer 3091: Adhesive accommodating part 310: Adhesive 404: Adhesive layer 4041: Opening 4061: Lead-out line accommodating part 4063: Outgoing wire accommodating part 406S: accommodating space 406S: accommodating space 412: Covering layer 5021: Leading wire 5023: Outgoing wire section 504: First adhesive layer 5061: Leading wire accommodating part 5063: Outgoing wire accommodating part 507: Second Adhesive layer 508: third adhesive layer 508: a third adhesive layer 512: first elastic substrate 6021: lead line 6022: outer edge 604: first adhesive layer 6061: lead line accommodating part 6063: outlet segment accommodating part 6065: edge 607: second adhesive layer 608: first outer adhesive layer 612: first peeling layer 6121: covering part 6123: protruding part A1: first direction A2: second direction A3: third direction A4: fourth direction A5: Fifth direction AX: bobbin HP: central part LW1: first layer winding LW2: second layer winding LWN: Nth layer winding PL1: first insulating layer PL2: second insulating layer S1: first segment S2: The second section S3: The third section S4: The fourth section S5: The fifth section S6: The sixth section

Figure 1 is an exploded view of a wireless device according to an embodiment of the disclosure. Figure 2 is a bottom view of the wireless module according to this embodiment of the disclosure after being assembled. FIG. 3 is a schematic diagram of the wireless module according to this embodiment of the disclosure viewed along the Y axis after being assembled. Figure 4 is a schematic cross-sectional view along the line A-A' of Figure 2 according to this embodiment of the disclosure. Figure 5 is an exploded view of a wireless module according to another embodiment of the disclosure. FIG. 5A is an exploded view of a wireless module according to another embodiment of the disclosure. Figure 6 is an exploded view of a wireless module according to another embodiment of the disclosure. Fig. 7 is a schematic cross-sectional view along the line B-B' in Fig. 6 according to this embodiment of the disclosure. FIG. 8 is a schematic cross-sectional view of the first inner adhesive layer, the coil component, and the adhesive according to another embodiment of the disclosure. Figure 9 is an exploded view of a wireless module according to another embodiment of the disclosure. FIG. 10 is an exploded view of a wireless module according to another embodiment of the disclosure. FIG. 11 is a schematic cross-sectional view along the line C-C' in FIG. 10 after the wireless module is assembled according to this embodiment of the disclosure. Figure 12 is an exploded view of a wireless module according to another embodiment of the disclosure. FIG. 13 is a top view of the wireless module according to this embodiment of the disclosure. Figure 14 is a bottom view of the wireless module according to this embodiment of the disclosure.

100: wireless module

102: Coil assembly

1020: Coil body

104: The first adhesive layer

1041: opening

106: Sensing substrate

1061: Lead wire receiving part

1063: Outgoing wire section receiving part

107: second adhesive layer

AX: winding shaft

Claims (16)

A wireless module, which can be used to transmit energy or signals, includes: a coil assembly having: a coil body configured to be wound around a bobbin; and a lead wire electrically connected to the coil body to an outlet section , Wherein when viewed along the winding axis, the coil body partially overlaps the lead wire; and an induction substrate is arranged adjacent to the coil assembly, the induction substrate is configured to change the electromagnetic field distribution near the coil assembly, and the The sensing substrate has: a lead-out line receiving part, the lead-out line of the holding part, wherein the lead-out line receiving part partially overlaps the lead-out line when viewed in a direction perpendicular to the winding axis; and a lead-out line holding part configured Take the outlet section of the accommodating part, wherein when viewed along the direction perpendicular to the winding axis, the outlet section accommodating portion partially overlaps the outlet section; wherein the outlet section and the outlet line are arranged along a first direction, the The size of the outlet section accommodating part is larger than the size of the outlet accommodating part in a second direction, and the second direction is not parallel to the first direction and the winding axis. In the wireless module described in item 1 of the scope of patent application, the bobbin does not pass through the winding of the coil body, and the bobbin does not pass through the outlet section receiving part. According to the wireless module described in claim 1, wherein the lead wire further includes a first insulating layer and a second insulating layer, and the second insulating layer covers the first insulating layer. As for the wireless module described in claim 1, wherein the outlet section accommodating part is further configured to accommodate one of a positioning structure, an electronic component and a circuit board. The wireless module described in item 1 of the scope of patent application, wherein when viewed from a section parallel to the winding axis, the coil assembly has a hollow center portion, a first layer of winding, and a second layer of winding The first layer of winding and the second layer of winding are parallel to the central part, the distance between the first layer of winding and the central part is different from the distance between the second layer of winding and the central part, the first A layer of winding includes a first section and a second section arranged along a third direction, and the second layer of wiring includes a third section and a fourth section arranged along a fourth direction The third direction is parallel and opposite to the fourth direction, and the third section is connected to the first section via the second section. As for the wireless module described in claim 5, the second layer of winding further includes a fifth section, the first layer of winding further includes a sixth section, the fifth section and the The sixth segment is arranged along a fifth direction substantially perpendicular to the winding axis, and the sixth segment is connected to the fourth segment via the fifth segment. The wireless module described in item 1 of the scope of patent application further includes: a first inner adhesive layer disposed between the inductive substrate and the coil assembly; and an adhesive disposed on the coil assembly and the first Between the inner adhesive layers, and the adhesive is different from the first inner adhesive layer. The wireless module described in item 7 of the scope of patent application, wherein the coil component includes a plurality of winding wires, and when viewed along the direction perpendicular to the winding axis, the winding wires partially overlap with the adhesive, and A part of the adhesive is located between the winding wires. The wireless module described in item 8 of the scope of patent application, wherein the first inner adhesive layer has an adhesive accommodating portion configured to accommodate part of the adhesive, and when viewed along the direction perpendicular to the winding axis, The first inner adhesive layer partially overlaps the adhesive. The wireless module described in claim 1 further includes a first elastic substrate. The first elastic substrate is flexible and configured to enhance the mechanical strength of the wireless module, wherein the coil assembly is disposed on the Between the first elastic substrate and the sensing substrate. The wireless module described in item 1 of the scope of patent application further includes: a first outer adhesive layer disposed on the coil assembly; and a first peeling layer disposed on the first outer adhesive layer, wherein the The first peeling layer is configured to be peeled off the first outer adhesive layer when the wireless module is installed in an electronic device, so that the wireless module is directly fixed to the electronic device through the first outer adhesive layer. According to the wireless module described in claim 11, the first peeling layer includes: a covering portion whose shape corresponds to the shape of the first outer adhesive layer; and a protruding portion formed by the The edge of the covering portion extends outward; wherein when viewed along the direction of the winding axis, the protruding portion does not overlap with the coil component part. For the wireless module described in item 12 of the scope of patent application, when viewed along the direction of the winding axis, the protruding portion does not overlap with the first outer adhesive layer portion. As for the wireless module described in item 13 of the scope of patent application, when viewed along the direction of the winding axis, the protruding portion protrudes outward from the edge of the sensing substrate. The wireless module described in item 12 of the scope of patent application, wherein the coil body is electrically connected to an external circuit via the lead wire, and the protruding portion corresponds to the junction of the coil body and the lead wire and runs along When viewed in the direction of the bobbin, the protruding portion partially overlaps the lead wire. For the wireless module described in item 15 of the scope of patent application, when viewed along the direction of the winding axis, the protruding part overlaps with an edge of the sensing substrate, and the protruding part is along the lead line The direction of extension protrudes from the edge.

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