TWM632019U - Adjustment and correction system - Google Patents

Abstract

The new model is an adjustment and correction system, which is: an optical measuring unit measures a glue, and obtains an Nth three-dimensional glue signal, where N is a constant, and an arithmetic unit receives the Nth three-dimensional glue signal, and obtains the glue For volume or weight, the calculation unit compares the volume or weight of the glue with a preset value of the glue. If the volume or weight of the glue does not match the preset value of the glue, the calculation unit sends an N-th glue quantity change signal to a glue dispensing control unit , so that the glue dispensing control unit adjusts the supplied glue quantity according to the Nth glue quantity change signal. This new model achieves feedback based on the previous glue amount through a closed loop, and adjusts the current amount of glue, so as to solve the problem of overflowing glue or insufficient glue, thereby improving the quality of bonding.

Description

Adjustment and correction system

The new model relates to an adjustment and correction system, especially an adjustment and correction system that uses a closed-loop system and adjusts the current amount of glue according to the previous amount of glue.

Chip bonding technology or substrate bonding technology is a very important technology or process in the semiconductor industry, electronic industry or touch display industry. The existing bonding technology selectively uses a visual unit to visually locate the desired bonding position of the substrate, or pre-programs the desired bonding position of the substrate, and applies glue to the desired bonding position, and then performs the lamination process to make the bonding process. The two substrates are bonded to each other or die bonded to the substrate.

However, the above-mentioned bonding technology still has the problem of overflowing glue or insufficient glue, because the amount of glue from the glue point to the place to be glued will have unquantifiable shortcomings due to many variables, such as glue density, glue viscosity, environmental humidity, etc. ambient temperature, etc. When there is excess glue or insufficient glue, it cannot be detected in time during the bonding process, and the above-mentioned excess glue or insufficient glue can only be found by the subsequent quality control, so the bonded products cannot meet the expected requirements. quality leads to loss of cost.

To sum up the above, the existing real-time feedback and adjusting the glue amount in the bonding process are extremely important items in the industry at present.

In view of the shortcomings of the above-mentioned prior art, the creator of this new type has been thinking about improving and innovating, and after years of research and experimentation, he has finally successfully developed and completed the adjustment and correction system of this new type.

The present invention discloses an adjustment and correction system, comprising: an optical measurement unit; a glue discharge control unit; and a calculation unit, which is electrically connected to the optical measurement unit and the glue discharge control unit; wherein the optical measurement unit measures Measure a glue, and obtain an Nth three-dimensional glue signal, N is a constant, the calculation unit receives the Nth three-dimensional glue signal, and obtains the volume or weight of the glue, and the calculation unit compares the volume or weight of the glue with a glue preset value By comparison, if the volume or weight of the glue does not match the preset value of the glue, the calculation unit sends an Nth glue quantity change signal to the glue control unit, so that the glue control unit adjusts the provided glue according to the Nth glue quantity change signal. water volume.

In one embodiment, the glue dispensing control unit provides glue to a glue dispensing unit, so that the glue dispensing unit dispenses glue to a place to be bonded on an N+1th substrate.

In one embodiment, the optical measurement unit is a laser measuring instrument, a triangular laser ranging, an optical interference measurement, a confocal laser scanning microscope, a femtosecond infrared laser, and a confocal microscope, or A conjugate laser.

In one embodiment, the optical measurement unit includes at least one upper vision module and at least one side vision module, and the upper vision module and the side vision module are a CCD camera or a CCD image sensor.

In one embodiment, the volume or weight of the provided glue is between 99% and 101% of the predetermined value of the glue.

With the above-mentioned adjustment and correction system of the present invention, the optical measurement unit, the glue control unit and the calculation unit are designed as a closed loop, so after each dispensing, the calculation unit can measure according to the measurement of the optical measurement unit. The three-dimensional information of the glue (three-dimensional glue signal), and the volume or weight of the glue is obtained. The calculation unit compares the volume or weight of the glue with a preset value of the glue, and if it does not match the preset value of the glue, it will provide a glue quantity change signal to the glue control unit, so that the glue control unit can adjust and provide the glue. The amount of glue for the unit. This new model achieves feedback based on the previous glue amount through a closed loop, and adjusts the current amount of glue, so as to solve the problem of overflowing glue or insufficient glue, thereby improving the quality of bonding.

In order to enable those skilled in the art to fully understand the technical features, contents and advantages of the present invention and the effects that can be achieved, the present invention is described in detail as follows in the form of an embodiment in conjunction with the drawings. The purpose of the drawings used is only for illustration and auxiliary instructions, and may not necessarily be the real scale and precise configuration after the implementation of the new model. Therefore, the proportion and configuration relationship of the attached drawings should not be interpreted or limited to The scope of rights in actual implementation will be described first.

Please refer to FIG. 1 , which is a schematic diagram of the operation of the adjustment and correction system according to the first embodiment of the present invention. As shown in the figure, the adjustment and correction system includes: an optical measurement unit 10 , a glue discharge unit 11 , a glue discharge control unit 12 , a calculation unit 13 and a conveying unit 14 .

The optical measurement unit 10 is arranged above the conveying unit 14 , and the optical measurement unit 10 is a laser measuring instrument, a triangular laser ranging, an optical interference measurement, a confocal laser scanning microscope, and a femtosecond infrared laser. A combination of a laser and a confocal microscope or a conjugate laser.

The glue discharging unit 11 is disposed above the conveying unit 14 and adjacent to the optical measuring unit 10 . The glue dispensing unit 11 can be a dispensing needle.

The gluing control unit 12 is coupled to the gluing unit 11 , and the gluing control unit 12 can control the volume or weight of the glue supplied to the gluing unit 11 .

The calculation unit 13 is electrically coupled to the glue dispensing control unit 12 and the optical measurement unit 10 .

The conveying unit 14 conveys a substrate to be bonded (hereinafter referred to as the first substrate 15 for ease of reading) to the lower part of the glue dispensing unit 11 , and the glue dispensing unit 11 dispenses glue to the first substrate 15 to be glued. The optical measuring unit 10 measures the glue at the place where the first substrate 15 is to be bonded, and obtains a three-dimensional glue signal (for ease of reading, hereinafter referred to as the first three-dimensional glue signal).

In this embodiment, the optical measurement unit 10 is composed of a confocal laser scanning microscope or a femtosecond infrared laser and a confocal microscope. The principle of confocal laser scanning microscopy (CLSM) is mainly to use a pinhole aperture (Pinhole) to exclude light from the non-focusing surface. The confocal laser scanning microscope technology can remove the non-focal light in the traditional fluorescence microscope image, and the sample can be observed layer by layer, which greatly increases the contrast, resolution and fluorescence detection signal-to-noise ratio of the image.

The first three-dimensional glue signal is sent to the calculation unit 13 , and the calculation unit 13 performs calculation according to the first three-dimensional glue signal to obtain the volume or weight of the glue at the place to be bonded on the first substrate 15 . The calculating unit 13 compares the calculated volume or weight of the glue with a predetermined value of the glue. If the volume or weight of the glue does not meet the preset glue value, that is, when the volume or weight of the glue exceeds or falls below a predetermined glue value, the calculation unit 13 sends a glue amount change signal (for ease of reading, hereinafter referred to as the first glue The water quantity change signal) is given to the glue control unit 12. The glue output control unit 12 changes the glue amount to the glue unit 11 according to the first glue amount change signal, so that the volume or weight of the glue at the place where the substrates are to be bonded conforms to or approaches the glue preset value. This approach is between 99% and 101% of the default value of the glue. In other words, the volume or weight of the glue provided is between 99% and 101% of the default value of the glue.

Please refer to FIG. 2 , which is a schematic diagram of another action of the adjustment and correction system according to the first embodiment of the present invention. As shown in the figure, the conveying unit 14 conveys the first substrate 15 away from the lower part of the gluing unit 11 , and conveys another substrate to be bonded (hereinafter referred to as the second substrate 16 for ease of reading) to the lower part of the gluing unit 11 . The glue dispensing unit 11 dispenses the glue from the glue dispensing control unit 12 to the place where the second substrate 16 is to be bonded.

Please refer to FIG. 3 , which is a schematic diagram of another action of the adjustment and correction system according to the first embodiment of the present invention. As shown in the figure, the optical measuring unit 10 measures the glue at the place where the second substrate is to be bonded, and obtains a three-dimensional glue signal (hereinafter referred to as the second three-dimensional glue signal for ease of reading). The second three-dimensional glue signal is sent to the calculation unit 13 , and the calculation unit 13 performs calculation according to the second three-dimensional glue signal to obtain the volume or weight of the glue at the place to be bonded on the second substrate 16 . The calculating unit 13 compares the calculated volume or weight of the glue with a predetermined value of the glue. If the volume or weight of the glue does not meet the preset glue value, the calculation unit 13 sends a glue quantity change signal (hereinafter referred to as the second glue quantity change signal for ease of reading) to the glue control unit 12 . The glue output control unit 12 changes the glue quantity to the glue unit 11 according to the second glue quantity change signal, so that the volume or weight of the glue at the place where the substrates are to be bonded conforms to or approaches the glue preset value.

Please refer to FIG. 4 , which is a schematic diagram of the operation of the adjustment and correction system of the second embodiment of the present invention. As shown in the figure, the adjustment and correction system includes: an optical measurement unit 20 , a glue discharge unit 21 , a glue discharge control unit 22 , a calculation unit 23 and a conveying unit 24 .

The optical measurement unit 20 includes at least one upper vision module 200 and at least one side vision module 201 . The upper vision module 200 is arranged above the conveying unit 24 , and the side vision module 201 is arranged at one side of the conveying unit 24 . In this embodiment, the upper vision module 200 and the side vision module 201 may be a charge-coupled device (CCD) camera or a CCD image sensor.

The glue discharging unit 21 is arranged above the conveying unit 24 . The glue dispensing unit 21 can be a dispensing needle.

The gluing control unit 22 is coupled to the gluing unit 21 , and the gluing control unit 22 can control the volume or weight of the glue supplied to the gluing unit 21 .

The calculation unit 23 is electrically coupled to the glue dispensing control unit 22 and the optical measurement unit 20 .

The conveying unit 24 conveys a substrate to be bonded (hereinafter referred to as the third substrate 25 for ease of reading) to the lower part of the gluing unit 21 . The glue dispensing unit 21 dispenses glue on the part to be bonded on the third substrate 25 . The optical measurement unit 20 captures images of the glue at the place where the third substrate is to be bonded. The upper vision module 200 captures an upper image of the glue at the place where the third substrate 25 is to be bonded. The side vision module 201 captures a side image of the glue at the place where the third substrate 25 is to be bonded. The upper image and the side image are provided to the calculation unit 23, and the calculation unit 23 obtains a 3D glue signal (hereinafter referred to as the third 3D glue signal) according to the upper image and the side image.

The calculation unit 23 performs calculation according to the third three-dimensional glue signal, and obtains the volume or weight of the glue at the place to be bonded on the third substrate 25 . The calculating unit 23 compares the calculated volume or weight of the glue with a predetermined value of the glue. If the volume or weight of the glue does not meet the preset glue value, the calculation unit 23 sends a glue quantity change signal (hereinafter referred to as the third glue quantity change signal for ease of reading) to the glue control unit 22 .

Please refer to FIG. 5 , which is a schematic diagram of another action of the adjustment and correction system of the second embodiment of the present invention. As shown in the figure, the conveying unit 24 conveys the third substrate 25 away from the glue dispensing unit 21 , and conveys another substrate (hereinafter referred to as the fourth substrate 26 for ease of reading) under the glue dispensing unit 21 . The glue dispensing control unit 22 changes the amount of glue to be supplied to the glue unit 21 according to the third glue amount change signal. The glue dispensing unit 21 dispenses the glue from the glue dispensing control unit 22 to the place where the fourth substrate 26 is to be bonded.

Please refer to FIG. 6 , which is a schematic diagram of another action of the adjustment and correction system of the second embodiment of the present invention. As shown in the figure, the optical measurement unit 20 captures images of the glue at the place where the fourth substrate 26 is to be bonded. The upper vision module 200 captures an upper image of the glue at the place where the fourth substrate 26 is to be bonded. The side vision module 201 captures a side image of the glue at the place where the fourth substrate 26 is to be bonded. The upper image and the side image are provided to the calculation unit 23, and the calculation unit 23 obtains a 3D glue signal (hereinafter referred to as the fourth 3D glue signal) according to the upper image and the side image.

The calculation unit 23 performs calculation according to the fourth three-dimensional glue signal to obtain the volume or weight of the glue at the place to be bonded on the fourth substrate 26 . The calculating unit 23 compares the calculated volume or weight of the glue with a predetermined value of the glue. If the volume or weight of the glue does not meet the preset glue value, the calculation unit 23 transmits a glue quantity change signal (hereinafter referred to as the fourth glue quantity change signal for ease of reading) to the glue control unit 22 .

The glue output control unit 22 changes the glue quantity to the glue unit 21 according to the fourth glue quantity change signal, so that the volume or weight of the glue at the place where the substrates are to be bonded conforms to or approaches the glue preset value.

The new adjustment and correction system is applied to an adjustment and correction method, and the steps include:

Step A. Obtaining the Nth three-dimensional glue signal: Please refer to FIGS. 1 to 3 again. The conveying unit 14 conveys the Nth substrate to the lower part of the glue discharging unit 11 , and N is a constant. The glue dispensing unit 11 dispenses glue on the part to be bonded on the Nth substrate. If the optical measurement unit 10 is a confocal laser scanning microscope or a femtosecond infrared laser and a confocal microscope. The optical measuring unit 10 measures the glue at the place where the Nth substrate is to be bonded, and obtains an Nth three-dimensional glue signal.

Please refer to FIGS. 3 to 6 again, if the optical measurement unit 20 is an upper vision module 200 and a side vision module 201 . The upper vision unit 200 captures an upper image of the glue at the place where the Nth substrate is to be bonded. The side vision module 201 captures a side image of the glue at the place where the Nth substrate is to be bonded. The upper image and the side image are provided to the calculation unit 23, and the calculation unit 23 obtains an Nth three-dimensional glue signal according to the upper image and the side image.

Step B. Obtaining the N-th glue quantity change signal: Please refer to FIGS. 1 to 3 again, the calculation unit 13 performs calculation according to the N-th three-dimensional glue signal, and obtains the volume or weight of the glue located at the N-th substrate to be bonded, and calculates The unit 13 compares the calculated volume or weight of the glue with a predetermined glue value. If the volume or weight of the glue does not meet the predetermined value of the glue, the calculation unit 13 sends an N-th glue quantity change signal to the glue control unit 12 .

Step C. Dispensing the N+1 th substrate: the conveying unit 14 conveys the N th substrate away from the glue dispensing unit 11 and transports the N+1 th substrate below the glue dispensing unit 11 . The glue output control unit 12 adjusts the supplied glue amount according to the Nth glue amount change signal, and supplies the glue to the glue unit 11 . The glue dispensing unit 11 dispenses the glue from the glue dispensing control unit 12 to the place where the N+1th substrate is to be bonded. Go back to step A again.

To sum up, the adjustment and correction system of the new type is designed to be a closed loop of the optical measurement unit, the glue control unit and the calculation unit. Therefore, after each dispensing, the calculation unit can measure according to the measurement of the optical measurement unit. The three-dimensional information (three-dimensional glue signal) of the measured glue is obtained, and the volume or weight of the glue is obtained. The calculation unit compares the volume or weight of the glue with a preset value of the glue, and if it does not match the preset value of the glue, it will provide a glue quantity change signal to the glue control unit, so that the glue control unit can adjust and provide the glue. The amount of glue for the unit. This new model achieves feedback based on the previous glue amount through a closed loop, and adjusts the current amount of glue, so as to solve the problem of overflowing glue or insufficient glue, thereby improving the quality of bonding.

The above descriptions are only exemplary, and are used to illustrate the practical embodiments of the technical content of the present invention, but are not intended to limit the present invention. Equivalent replacements, modifications or alterations made by those with ordinary knowledge in the technical field of the present invention based on the teachings of the contents disclosed in the specification are included in the scope of the patent application of the present invention and do not depart from the scope of the rights of the present invention.

10,20: Optical measurement unit 11,21: glue unit 12,22: glue control unit 13,23: Calculation Unit 14,24: Conveyor unit 15: The first substrate 16: Second substrate 25: Third substrate 26: Fourth substrate 200: Go to the visual module 201: Side Vision Module

FIG. 1 is a schematic diagram of the operation of the adjustment and correction system according to the first embodiment of the new type. FIG. 2 is a schematic diagram of another operation of the adjustment and correction system according to the first embodiment of the novel. FIG. 3 is a schematic diagram of another operation of the adjustment and correction system according to the first embodiment of the novel. FIG. 4 is a schematic diagram of the operation of the adjustment and correction system according to the second embodiment of the novel. FIG. 5 is a schematic diagram of another operation of the adjustment and correction system according to the second embodiment of the novel. FIG. 6 is a schematic diagram of another operation of the adjustment and correction system according to the second embodiment of the novel.

10: Optical measurement unit

11: glue unit

12: glue control unit

13: Calculation Unit

14: Conveyor unit

15: The first substrate

Claims (5)

An adjustment and correction system, including: an optical measurement unit; a glue dispensing control unit; and a calculation unit, electrically connected to the optical measuring unit and the glue dispensing control unit; Wherein, the optical measuring unit measures a glue, and obtains an Nth three-dimensional glue signal, where N is a constant, the calculation unit receives the Nth three-dimensional glue signal, and obtains the volume or weight of the glue, the calculation unit Comparing the volume or weight of the glue with a preset value of glue, if the volume or weight of the glue does not match the preset value of the glue, the calculation unit sends an N-th glue quantity change signal to the glue output control unit to The glue output control unit adjusts the supplied glue quantity according to the Nth glue quantity change signal. The adjustment and correction system as claimed in claim 1, wherein the glue dispensing control unit provides glue to a glue dispensing unit, so that the glue dispensing unit dispenses glue to an N+1th substrate to be bonded. The adjustment and correction system according to claim 1, wherein the optical measurement unit is a laser measuring instrument, a triangular laser ranging, an optical interference measurement, a confocal laser scanning microscope, and a femtosecond infrared laser The device is composed of a confocal microscope or a conjugate laser. The adjustment and correction system according to claim 1, wherein the optical measurement unit comprises at least one upper vision module and at least one side vision module, and the upper vision module and the side vision module are a charge-coupled device camera or a CCD image sensor. The adjustment and correction system as claimed in claim 1, wherein the volume or weight of the provided glue is between 99% and 101% of the predetermined value of the glue.

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