TWM632448U - A system of regulating dispensing of intelligent filling - Google Patents

Abstract

The new model provides an adjustment and correction system for intelligent filling and coating. The calculation unit of intelligent filling and coating is used to dynamically detect the fluid filled by the fluid filling and coating unit, judge the filling and coating status of the fluid at any time, and automatically adjust the next fluid filling. The amount of fluid applied. The new model achieves feedback based on the previous fluid state through a closed loop, and adjusts the current fluid volume, which can solve the defects in the prior art due to the difficulty in controlling the fluid state (such as excess glue or insufficient glue) .

Description

Adjustment and correction system for intelligent filling

The new model relates to an adjustment and correction system and method for intelligent filling and coating, especially an adjustment and correction system and method for adjusting the current fluid filling amount according to the state of the previous fluid material by using a closed-loop system.

In recent years of chip packaging technology, in order to be suitable for various electronic products, the substrate to which the chip is bonded is usually a non-ceramic material, so the coefficient of thermal expansion (CTE) between the chip and the substrate is different. It is easy to cause defects in semiconductor products due to thermal stress.

In order to eliminate the above-mentioned thermal stress, the prior art is to fill the underfill between the wafer and the substrate to reduce the defects of semiconductor products; in order to fill the underfill between the wafer and the substrate, the prior art includes a compression molding method (molding) and filling method (dispensing); in the compression molding method, when the thickness of the substrate is extremely small (for example, a thin film substrate), the glue filling pressure of the compression mold easily leads to the displacement of the substrate, so the compression molding method is not suitable for the substrate. Chip packages with extremely small thickness.

In the filling and coating method, the encapsulant is coated on the periphery of the wafer with L-shape, U-shape or I-shape. The encapsulant "penetrates" into the gap between the wafer and the substrate due to capillary action. The occurrence of capillary action depends on the encapsulant. The surface tension of the wafer and the substrate and the heating temperature, so that the encapsulant fills and fills the gap between the wafer and the substrate for sealing; however, the filling process by capillary action takes time, and it is difficult to control the diffusion direction of the encapsulant , resulting in poor filling efficiency and difficult quality control. If the filling time is insufficient to cause uneven diffusion, air bubbles are likely to be generated between the wafer and the substrate, resulting in defects in semiconductor products due to inaccurate encapsulation.

In addition, with the high development of electronic products, the materials such as wafers and substrates used in the current technology are diversified, and the gaps between different wafers and different substrates are different, and in the same wafer, every position in the wafer Each gap between the corresponding substrates is also different. If the glue cannot be adjusted dynamically at any time, it is easy for the excess glue to overflow to other electronic components (such as pads, etc.) due to the overflow of glue. , or uneven spread due to insufficient glue, which can cause product defects.

In addition, the technical application of fluid filling also includes "filling", that is, fluid can be filled in the slits of products, such as semiconductor substrates, panels, or any other products with slits. However, in the existing technology, it is impossible to dynamically adjust the glue, and it is easy to cause unnecessary glue in the slit area due to overflow of glue, or insufficient filling and coating of the slit due to insufficient glue. cause the product to be defective.

In view of the shortcomings of the above-mentioned prior art, the creator of this new type has been eager to improve and innovate, and after years of research and experimentation, he has finally successfully developed the new intelligent filling and painting adjustment and correction system and method.

The present invention discloses an adjustment and correction system and method for intelligent filling and coating. The calculation unit of intelligent filling and coating is used to dynamically detect the fluid filled by the fluid filling and coating unit, so as to judge the filling and coating status of the fluid at any time and automatically adjust the next time. The amount of fluid filled by the fluid can solve the defects in the prior art caused by the difficulty in controlling the state of the fluid (eg, excess glue or insufficient glue).

The new model discloses an adjustment and correction system for intelligent filling and coating, comprising: a fluid filling and coating unit, which fills and coats a fluid material to a target area, and performs the Nth filling and coating, where N is a constant; an optical measuring unit, which dynamically detects the target area The state of the fluid material in the area, and generate the Nth three-dimensional fluid signal; the calculation unit, which is electrically connected to the fluid filling unit and the optical measurement unit, receives the Nth three-dimensional fluid signal, and obtains the state of the fluid material. The calculation unit will The state of the fluid material is compared with the preset value of the fluid state. If the state of the fluid material does not match the preset value of the fluid state, the calculation unit transmits the Nth fluid quantity change signal to the fluid filling and coating unit, so that the fluid filling and coating unit is based on the Nth The fluid volume change signal is used to adjust the filling fluid volume.

In one embodiment of the present invention, the target area is the fluid-filled end of the void between the wafer and the substrate.

In an embodiment of the present invention, the state of the fluid material includes the volume of the fluid, the weight of the fluid, the height of the fluid in the void, the width of the fluid in the void, and the degree to which the fluid fills the void.

In an embodiment of the present invention, the target area is a slit.

In an embodiment of the present invention, the state of the fluid material includes the volume of the fluid, the weight of the fluid, the height of the fluid in the slit, the width of the fluid in the slit, and the degree to which the fluid fills the slit.

In an embodiment of the present invention, the fluid filling and coating unit is a glue dispensing unit; the fluid material is glue; the optical measurement unit is a laser measuring instrument, a confocal laser scanning microscope, a femtosecond infrared laser and a confocal microscope composition, conjugate laser, three-dimensional measuring device, ultrasonic measuring device, interferometer or triangular laser measuring device.

In an embodiment of the present invention, the optical measurement unit includes at least one vision module. The vision module can be a CCD camera, a CCD image sensor, a CMOS image sensor, a CMOS camera, an optical microscope, an electron scanning microscope, or a transmission microscope.

The present invention further discloses an adjustment and correction method for intelligent filling and coating, comprising: an Nth filling and coating step, wherein the fluid filling and coating unit fills the fluid material to the Nth fluid filling end between the wafer and the substrate, and causes the fluid material to face The fluid diffusion end between the wafer and the substrate is diffused to fill the gap between the wafer and the substrate, N is a constant; in the Nth detection step, the optical measurement unit dynamically detects the gap between the wafer and the substrate The state of the fluid material, and the Nth three-dimensional fluid signal is sent to the calculation unit; in the Nth adjustment step, the calculation unit controls the filling fluid amount of the fluid filling and coating unit according to the Nth three-dimensional fluid signal; the N+1th filling In the coating step, by the fluid filling unit adjusted by the arithmetic unit, the fluid material is filled to the N+1 th fluid filling end between the wafer and the substrate.

In an embodiment of the present invention, after the N+1th filling and coating step, the method further includes: an N+1th detection step, wherein the optical measuring unit dynamically detects the fluid in the gap between the wafer and the substrate The state of the material, and the N+1th three-dimensional fluid signal is sent to the calculation unit; in the N+1th adjustment step, the calculation unit controls the filling fluid amount of the fluid filling and coating unit according to the N+1th three-dimensional fluid signal; the Nth In the +2 filling and coating steps, the fluid material is filled to the N+2th fluid filling end between the wafer and the substrate by the fluid filling and coating unit adjusted by the arithmetic unit.

The present invention further discloses an adjustment and correction method for intelligent filling and coating, comprising: the Nth filling and coating step, the fluid filling and coating unit fills the fluid material to the slit, so that the fluid material fills the slit, and N is a constant; In the Nth detection step, the optical measurement unit dynamically detects the state of the fluid material in the slit, and transmits the Nth three-dimensional fluid signal to the calculation unit; in the Nth adjustment step, the calculation unit is based on the Nth three-dimensional fluid signal. To control the amount of filling fluid in the fluid filling unit.

With the above intelligent filling and coating adjustment and correction system and method, the optical measurement unit, the fluid filling and coating unit and the calculation unit are designed as a closed loop, so after each time the fluid material is filled, the calculation unit can be based on the optical quantity The three-dimensional information of the fluid material measured by the measuring unit can be obtained to obtain the state of the fluid material (such as volume or weight), and the amount of the fluid filled by the fluid filling and coating unit can be adjusted at any time. This new model achieves feedback according to the previous filling amount of fluid material through a closed loop, and adjusts the current filling amount of fluid material, so as to solve the problem of the difficulty in controlling the state of the fluid in the prior art (such as overflowing or insufficient glue) the resulting defects.

In order to enable those skilled in the art to fully understand the technical features, contents and advantages of the present invention and the effects that can be achieved, the present invention is described in detail as follows in the form of an embodiment in conjunction with the drawings. The purpose of the drawings used is only for illustration and auxiliary instructions, and may not necessarily be the real scale and precise configuration after the implementation of the new model. Therefore, the proportion and configuration relationship of the attached drawings should not be interpreted or limited to The scope of rights in actual implementation will be described first.

Please refer to FIGS. 1-2 . FIG. 1 is a schematic diagram of an adjustment and correction system for intelligently filling the gap between the chip 5 and the substrate 6 in which the target area is an embodiment of the novel, and FIG. 2 is an embodiment of the novel. The target area is a schematic diagram of the filling result of the gap between the wafer and the substrate; as shown in the figure, the adjustment and correction system for intelligent filling includes a fluid filling and coating unit 1 , an optical measurement unit 2 and an arithmetic unit 3 .

Each element of the adjustment and correction system for intelligent filling and coating of the present invention will be described in detail below, however, the present invention is not limited thereto.

In this embodiment, the gap between the wafer 5 and the substrate 6 can be regarded as a target area, and the fluid filling unit 1 fills the fluid material 4 to the gap between the wafer 5 and the substrate 6; the optical measuring unit 2 detects The state of the fluid material 4 is controlled by the arithmetic unit 3 to control the amount of the filling fluid of the fluid filling and coating unit 1 .

The type and structure of the fluid filling and coating unit 1 are not limited, and may be any type suitable for the application expected by the user, such as a coating valve storing the fluid material 4, a glue dispensing unit, and the like. In one embodiment, the fluid filling and coating unit 1 is a glue dispensing unit, such as a dispensing needle; in addition, the type of the fluid material 4 is not limited, and can be glue, solder paste, underfill material, adhesive, sealant , sealant or other suitable materials; in one embodiment, the fluid material 4 is glue; the gap between the wafer 5 and the substrate 6 can be divided into a fluid filling end 7 and a fluid diffusion end 8, and the fluid filling end 7 It is the inlet of the fluid filling and coating unit 1 to fill the fluid material 4. The fluid material 4 enters the gap between the wafer 5 and the substrate 6 from the fluid filling end 7, and diffuses to the fluid diffusion end 8 by capillary action; an embodiment Among them, the fluid material 4 is a thermosetting insulator, which fills the gap between the wafer 5 and the substrate 6. Usually, the fluid material 4 does not cover the wafer 5. The fluid material 4 has proper fluidity before being thermally cured. When the fluid filling and coating unit 1 is used for filling and coating, proper heating is performed by a heating device (not shown in the figure), which can maintain the good fluidity of the fluid material 4 and fill the gap between the wafer 5 and the substrate 6 under capillary action. .

Regarding the state of the fluid material 4, it may be the diffusion flow rate, diffusion distribution, and thickness of the fluid material 4 filled and coated; The height of the inside, the width of the fluid inside the void, the degree to which the fluid fills the void.

The fluid filling and coating unit 1 is electrically connected to the calculation unit 3 and is controlled by the calculation unit 3. The amount of the fluid filled in the fluid filling and coating unit 1 can be accurately controlled by the calculation unit 3. The fluid filling and coating unit 1 and the calculation unit 3 The way of electrical connection between them is not limited; for example, the calculation unit 3 can control the amount of filling fluid of the fluid filling and coating unit 1 by controlling the control valve (not shown in the figure) of the fluid filling and coating unit 1; the control valve can be located in the fluid In any position of the filling and coating unit 1, the control valve can be a check valve, a solenoid valve or a one-way valve; The amount of filling fluid of the coating unit 1; the calculation unit 3 gives a contraction signal to the control valve of the fluid filling and coating unit 1, which can reduce the amount of the filling fluid of the fluid filling and coating unit 1; As soon as the control valve closes the signal, the filling of the fluid filling and coating unit 1 is stopped.

The optical measurement unit 2 is used to dynamically detect the state of the fluid material 4 in the gap between the wafer 5 and the substrate 6, and to generate the Nth three-dimensional fluid signal and transmit it to the calculation unit 3, where N is a constant; The type and structure of the detection unit 2 are not limited, for example, it may be a proximity switch, a capacitive sensor, a proximity sensor, an optical sensor, or other suitable detection devices.

The optical measurement unit 2 is electrically connected to the calculation unit 3; the installation position and arrangement of the optical measurement unit 2 are not limited, but from the viewpoint of improving packaging efficiency, the optical measurement unit 2 is preferably arranged at the fluid diffusion end 8, and can be moved corresponding to the fluid diffusion end 8 for dynamic detection.

In one embodiment, the optical measuring unit 2 may be a laser measuring instrument, a confocal laser scanning microscope, a combination of a femtosecond infrared laser and a confocal microscope, a conjugate laser, a three-dimensional measuring device, an ultrasonic wave Measuring device, interferometer or triangulation laser measuring device, or may include at least one upper vision module and at least one side vision module, and the upper vision module and the side vision module may be charge-coupled devices (Charge- coupled Device (CCD) camera, CCD image sensor, Complementary Metal Oxide Semiconductor (CMOS) image sensor, CMOS camera, Optical Microscope, Scanning Electron Microscope or Transmission electron microscope: use visual appearance and/or laser to dynamically detect the state of fluid diffusion, and adjust the state of the amount of fluid filled in the fluid filling and coating unit 1 through the calculation unit 3 at any time, which can solve the problem The defects in the prior art are caused by the difficulty of controlling the state of the fluid (eg, overflowing or insufficient glue).

In one embodiment, the optical measurement unit 2 is composed of a confocal laser scanning microscope or a femtosecond infrared laser and a confocal microscope. The principle of confocal laser scanning microscopy (CLSM) is mainly to use a pinhole aperture (Pinhole) to exclude light from the non-focusing surface. The confocal laser scanning microscope technology can remove the non-focal light in the traditional fluorescence microscope image, and the sample can be observed layer by layer, which greatly increases the contrast, resolution and fluorescence detection signal-to-noise ratio of the image.

In one embodiment, the optical measurement unit 2 includes at least one vision module, and the vision module may be a charge-coupled device (CCD) camera or a CCD image sensor, which captures images of the fluid material 4 ; In one embodiment, the visual module can be an upper visual module and a side visual module, the upper visual module captures the image above the fluid material 4 , and the side visual module captures the side image of the fluid material 4 . The upper image and the side image are provided to the calculation unit 3, and the calculation unit 3 obtains the Nth three-dimensional fluid signal according to the upper image and the side image.

The calculation unit 3 controls the amount of the fluid filled and coated by the fluid filling and coating unit 1 according to the Nth three-dimensional fluid signal from the optical measurement unit 2; in one embodiment, the calculation unit 3 obtains the fluid after receiving the Nth three-dimensional fluid signal. The state of the material 4, the calculation unit 3 compares the state of the fluid material 4 with the preset value of the fluid state, if the state of the fluid material 4 does not match the preset value of the fluid state, the calculation unit 3 sends the Nth fluid volume change signal to the fluid filling. The coating unit 1 enables the fluid filling and coating unit 1 to adjust the amount of the filling and coating fluid according to the Nth fluid amount change signal.

The calculation unit 3 also has other functions related to the control process; in one embodiment, the fluid filling and coating unit 1 is further provided with a content sensor (not shown in the figure), and the content sensor is electrically connected to the calculation unit 3. When the fluid content of the filling and coating unit 1 is too low, the content sensor will give a signal of insufficient content to the calculation unit 3, and the calculation unit 3 will send a signal or a warning signal to the relevant staff, so that the staff can replenish or replace the fluid filling and coating Fluid inside unit 1.

The optical measurement unit 2 dynamically detects the state of the fluid material 4 and transmits the Nth three-dimensional fluid signal to the calculation unit 3 at any time. Therefore, the calculation unit 3 dynamically sends a signal to the fluid filling and coating unit based on the Nth three-dimensional fluid signal. 1. Adjust the filling fluid volume of the fluid filling and coating unit 1 at any time; with the above structure, in the process of filling and coating the fluid material 4, the filling state of the fluid material 4 can be controlled at any time and the filling and coating of the fluid filling and coating unit 1 can be adjusted. The amount of fluid can solve the defects in the prior art due to the difficulty in controlling the state of the fluid.

In one embodiment, after the fluid filling and coating unit 1 adjusts the fluid filling amount according to the Nth fluid volume change signal, the volume or weight of the fluid material 4 conforms to or approaches the preset value of the fluid state to perform the N+th 1 filling, for example, the N+1 filling can be carried out in such a way that the volume or weight of the fluid material 4 conforms to or approaches between 95% and 105% of the preset value of the fluid state; The volume or weight of the fluid material 4 provided in N+1 fillings is between 95% and 105% of the preset value of the fluid state, preferably between 97% and 103%, more preferably between 99% and 101%. %, and then more to 100%.

The preset value of the fluid state can be defined using a conventional method. For example, in the case of a specific substrate and a specific wafer, the preset value of the fluid state can be defined using the past experience of filling and coating. In other words, the preset value of the fluid state. The set value is not a fixed value, but will change with the type of substrate, type of wafer, etc. In this embodiment, the preset value of the fluid state can be the volume of the appropriate fluid, the weight of the fluid, the height of the fluid in the gap, The width of the fluid within the void, how well the fluid fills the void, etc.

The substrate 6 applicable to the adjustment and correction system of the new intelligent filling and coating is not limited; the types of substrate 6 can be, for example, glass substrates, silicon substrates, sapphire substrates, substrates with integrated circuits, gallium arsenide substrates, For the substrate of the display, the flexible film substrate composed of polyimide, or any other suitable substrate; the size of the substrate 6 can be, for example, 6 inches, 8 inches or other suitable sizes; the thickness of the substrate 6 can be It has a very small thickness like a thin film substrate, or other suitable thickness.

Various electronic components and circuit distributions may be formed on the substrate 6, such as connection lines (pads), solder pads, or other suitable electronic components; in one embodiment, connection lines are formed on the substrate, and the connection lines may be copper or copper The conductive lines of the alloy are covered by a solder resist to electrically extend and form a bonding wire.

The new type of intelligent filling and coating adjustment and correction system is not limited to five types of chips, which can be LED chips including three colors of RGB; there is a gap between the chip 5 and the substrate 6, and different types of chips There are gaps of different sizes and shapes between the wafer 5 and different types of substrates 6; even if it is the same wafer 5 and the same substrate 6, the shape of the gap between the substrates 6 corresponding to different positions in the wafer 5 and size are not necessarily the same; the shape of the wafer 5 can be any shape such as a rectangle; in one embodiment, the shape of the wafer 5 is a rectangle, and the rectangular wafer and the substrate have a first side, a second side, a The third side and the fourth side; in one embodiment, the first side is the fluid filling end 7, and the second side to the fourth side are the fluid diffusion end 8; in one embodiment, the first side and the second side are It is the fluid filling end 7 , the third side and the fourth side are the fluid diffusion end 8 ; in one embodiment, the first to third sides are the fluid filling end 7 , and the fourth side is the fluid diffusion end 8 .

For example, the installation position and arrangement of the fluid filling and coating unit 1 are not limited, and the fluid filling end 7 between the wafer 5 and the substrate 6 can be filled with the fluid material 4 . From the viewpoint of improving packaging efficiency, the fluid filling and coating unit 1 is preferably disposed on one side of the fluid filling and coating end 7, and can move corresponding to the fluid filling and coating end 7 to perform multiple fillings.

For example, in one embodiment, the wafer 5 is rectangular, the rectangular wafer 5 and the substrate 6 have four sides, the fluid filling end is at least one of the four sides, and the fluid diffusion end is the fluid filling end other sides.

Please refer to FIG. 3 , which is a schematic diagram of the adjustment and correction method of intelligent filling in which the target area is the gap between the chip and the substrate according to an embodiment of the present invention, that is, the first adjustment and correction method of the intelligent filling and painting of the present invention. Example:

The first embodiment includes: the Nth filling and coating step, the Nth detection step, the Nth adjustment step, the N+1th filling and coating step, and N is a constant; and the N+1th detection is included as the case may be. step, the N+1 adjustment step, and the N+2 filling step; the total filling times in the filling step will be determined by the size of the wafer 5 and the substrate 6 and is not limited; The glue is applied three times as an example, that is, N, N+1, and N+2 are respectively 1, 2, and 3, but the present invention is not limited to this, and each step is described in detail below.

In the first filling and coating step, the fluid filling and coating unit 1 fills the first fluid filling end 71 between the wafer 5 and the substrate 6 with glue, and makes the glue face the gap between the wafer 5 and the substrate 6 by capillary action. The fluid diffusion end 8 is diffused to fill the gap between the wafer 5 and the substrate 6; the position of the first fluid filling end 71 is not limited; in this embodiment, the wafer 5 is rectangular, and the first fluid filling The position of the end 71 can be on any side formed between the rectangular wafer 5 and the substrate 6; when the above-mentioned side is divided into the center and two sides, the position of the first fluid filling end 71 can be in the center of the above-mentioned side or Two sides; please refer to FIG. 2 , in this embodiment, the position of the first fluid filling end 71 is located on one side of the above-mentioned sides (one corner side of the wafer).

In the first detection step, the optical measurement unit 2 dynamically detects the state of the glue in the gap between the chip 5 and the substrate 6, and transmits the first three-dimensional fluid signal to the calculation unit 3, the optical measurement unit 2. Detect the volume of the glue, the weight of the glue, the height of the glue in the gap, the width of the glue in the gap, the degree of the glue filling the gap, etc.

It is particularly noted that, in the embodiment of the present invention, the first detection step is performed after the first filling and coating step; however, the number of filling and coating steps and the order of the filling and coating steps and the detection steps are not limited. For example, a detection step can be performed after every 2 fillings, a detection step can be performed after every 3 fillings, a detection step can be performed after every 4 fillings, etc. And so on; in other words, not all coating steps need to be followed by a detection step.

In the first adjustment step, the calculation unit 3 controls the glue amount of the fluid filling and coating unit 1 according to the first three-dimensional fluid signal. When the first three-dimensional fluid signal indicates that the glue is lacking, the calculation unit 3 gives the fluid filling and coating An expansion signal from the unit 1 can increase the glue amount of the fluid filling and coating unit 1; when the first three-dimensional fluid signal indicates that the glue is overflowing, the calculation unit 3 gives a shrinking signal to the fluid filling and coating unit 1, which can reduce the fluid filling and coating. The amount of glue in unit 1; the so-called lack of glue can be the lack of glue volume, the weight of glue is insufficient, the height of glue in the gap is too low, the width of glue in the gap is too small, the degree of glue filling the gap is too high. In the same way, the so-called glue overflow state can be that the volume of glue is too large, the weight of glue is too high, the height of glue in the gap is too high, the width of glue in the gap is too large, the degree of glue filling the gap is too high, etc. .

In the second filling step, the fluid filling unit 1 adjusted by the arithmetic unit 3 fills the second fluid filling end 72 between the wafer 5 and the substrate 6 with glue.

In this embodiment, the filling and coating step is performed twice first, and the third (last) filling is performed after the adjustment step; the positions of the three fillings are not limited, for example, they can be sequentially The first fluid filling end 71 and the second fluid filling end 72 are filled and coated, and after the adjustment step, the third fluid filling end 73 is filled; The third fluid filling end 73 is filled, and after the adjustment step, the second fluid filling end 72 is filled, and so on.

In addition to the above steps, the second detection step, the second adjustment step, and the second filling step may be further included depending on the situation.

In the second detection step, the optical measurement unit 2 dynamically detects the state of the glue in the gap between the chip 5 and the substrate 6, and transmits the second three-dimensional fluid signal to the calculation unit 3, the optical measurement unit 2. Detect the volume of the glue, the weight of the glue, the height of the glue in the gap, the width of the glue in the gap, the degree of the glue filling the gap, etc.

In the second adjustment step, the calculation unit 3 controls the glue amount of the fluid filling and coating unit 1 according to the second three-dimensional fluid signal.

In the third filling step, by the fluid filling unit 1 adjusted by the arithmetic unit 3 , the glue is filled to the third fluid filling end 73 between the wafer 5 and the substrate 6 .

In this embodiment, the filling and coating step is performed once, and after the adjustment step, the second filling is performed, and the third filling is performed after the adjustment again; the positions of the three fillings are not affected by the For example, the first fluid filling end 71 may be filled, the second fluid filling end 72 may be filled after adjustment, and the third fluid filling end 73 may be filled after adjustment; or, The first fluid filling end 71 may be filled and coated, the third fluid filling end 73 may be filled after adjustment, the second fluid filling end 72 may be filled after adjustment, and so on.

In particular, the first fluid filling end 71, the second fluid filling end 72, and the third fluid filling end 73 of the present invention are all located on the same side among the four sides between the rectangular wafer 5 and the substrate 6, However, the present invention is not limited thereto. For example, the first fluid filling end 71 , the second fluid filling end 72 , and the third fluid filling end 73 may be on any two or three sides of the four sides.

In this embodiment, please refer to FIG. 2 for the filling and coating results. The glue can be evenly distributed in the gap between the wafer 5 and the substrate 6, which can solve the problems caused by the difficulty in controlling the state of the fluid (such as excess glue or insufficient glue) in the prior art. Defects.

Please refer to FIGS. 4-7 , which are schematic diagrams of the adjustment and correction method of intelligent filling and coating with the target area being a slit in another embodiment of the present invention, that is, the second implementation of the intelligent filling and coating adjustment and correction method of the present invention For example; the adjustment and correction system of the intelligent filling and coating of the present new type is suitable for filling any slit 10, regardless of the length, width, depth, shape (eg arc), material (eg metal, rubber, glass) of the slit 10, etc. For example, the present invention can be used for caulking of semiconductor substrates, caulking of circuit boards, caulking of panel assembly, caulking of borders, etc., but not limited thereto.

The second embodiment includes: the Nth filling and coating step, the Nth detection step, the Nth adjustment step, the N+1th filling and coating step, and N is a constant; and the N+1th detection is included depending on the situation step, the N+1th adjustment step, the N+2th filling and coating step; the total number of filling and coating in the filling and coating step will be determined according to the state of the slit 10 (eg length, width, depth, shape, position, etc.) , without limitation; in this embodiment, the slit 10 of the target 9 can be regarded as the target area.

In the first filling and coating step, please refer to FIG. 4 , the fluid filling and coating unit 1 fills the fluid material 4 to the slit 10 on the target 9 ; in this embodiment, the fluid filling and coating unit 1 The setting position and setting method are not limited, but in order to allow the fluid material 4 to be easily filled into the slit 10, for example, the fluid filling and coating unit 1 can be movably arranged just above the center of the slit 10. It can be arranged just above both sides of the slit 10 .

In the first detection step, please refer to FIG. 5, the optical measurement unit 2 dynamically detects the state of the fluid material 4 in the slit 10, and transmits the first three-dimensional fluid signal to the calculation unit 3, and the optical measurement unit 2 dynamically detects the state of the fluid material 4 in the slit 10. The unit 2 detects the volume of the fluid material 4, the weight of the fluid material 4, the height of the fluid material 4 within the slit, the width of the fluid material 4 within the slit, the degree to which the fluid material 4 fills the slit, and the like.

In the first adjustment step, the calculation unit 3 obtains the state of the fluid material 4 after receiving the first three-dimensional fluid signal, and the calculation unit 3 compares the state of the fluid material 4 with the preset value of the fluid state. If the state does not match the preset value of the fluid state, the calculation unit 3 transmits the first fluid volume change signal to the fluid filling and coating unit 1, so that the fluid filling and coating unit 1 adjusts the filling and coating fluid volume according to the first fluid volume change signal; in this embodiment In an example, the fluid material 4 can be glue. When the first three-dimensional fluid signal indicates that the glue is lacking, the calculation unit 3 sends an expansion signal to the fluid filling and coating unit 1, which can increase the glue amount of the fluid filling and coating unit 1; When the first three-dimensional fluid signal indicates a state of overflowing glue, the calculation unit 3 gives a shrinkage signal to the fluid filling and coating unit 1, which can reduce the amount of glue in the fluid filling and coating unit 1; wherein, the so-called lack of glue can be the state of glue The volume is insufficient, the weight of the glue is insufficient, the height of the glue in the slit is too low, the width of the glue in the slit is too small, the degree of the glue filling the slit is too low, etc.; similarly, the so-called overflowing state of glue can be glue The volume of the glue is too large, the weight of the glue is too high, the height of the glue in the slot is too high, the width of the glue in the slot is too large, the glue fills the slot too much (the glue seeps out of the slot), etc.

In this embodiment, the preset value of the fluid state can be defined using a conventional method. For example, in the case of a specific target 9 with a slit 10, the preset value of the fluid state can be defined by using the experience of patching in the past. In other words, the preset value of the fluid state is not a fixed value, and the preset value of the fluid state will change with the state of the slit; in this embodiment, the preset value of the fluid state can be the volume of the appropriate fluid, The weight of the fluid, the height of the fluid within the slit, the width of the fluid within the slit, how well the fluid fills the slit, etc.

In the second filling and coating step, please refer to FIG. 6 , by the fluid filling and coating unit 1 adjusted by the arithmetic unit 3 , the glue is filled into the slit 10 .

In addition to the above steps, the second detection step, the second adjustment step, and the second filling step may be further included depending on the situation. .

In this embodiment, please refer to FIG. 7 for the filling result. The fluid material 4 can be uniformly filled in the slit 10, which can solve the defects caused by the difficulty of controlling the state of the fluid (eg, overflowing or insufficient glue) in the prior art.

To sum up, the present invention discloses an adjustment and correction system and method for intelligent filling and coating. The optical measurement unit, the fluid filling and coating unit and the calculation unit are designed as closed loops. The state of the fluid material can be obtained according to the three-dimensional information of the fluid material measured by the optical measuring unit. The calculation unit compares the state of the fluid material with the preset value of the fluid state, and if it does not match the preset value of the fluid state, a fluid quantity change signal is provided to the fluid filling and coating unit, so that the fluid filling and coating unit adjusts the fluid filling quantity. This new model achieves feedback according to the previous filling amount of fluid material through a closed loop, and adjusts the current filling amount of fluid material, so as to solve the problem of the difficulty in controlling the state of the fluid in the prior art (such as overflowing or insufficient glue) the resulting defects.

The above descriptions are only exemplary, and are used to illustrate the practical embodiments of the technical content of the present invention, but are not intended to limit the present invention. Equivalent replacements, modifications or alterations made by those with ordinary knowledge in the technical field of the present invention based on the teachings of the contents disclosed in the specification are included in the scope of the patent application of the present invention and do not depart from the scope of the rights of the present invention.

1: Fluid filling unit 2: Optical measurement unit 3: Calculation unit 4: Fluid material 5: Wafer 6: Substrate 7: Fluid filling end 71: The first fluid filling end 72: The second fluid filling end 73: The third fluid filling end 8: Fluid diffusion end 9: Target 10: Slit

FIG. 1 is a schematic diagram of an adjustment and correction system for intelligently filling the gap between the target area and the substrate according to an embodiment of the novel. FIG. 2 is a schematic diagram of the result of filling and coating the target area between the wafer and the substrate according to an embodiment of the novel. 3 is a schematic diagram of an adjustment and correction method for intelligently filling the gap between the target area and the substrate according to an embodiment of the novel. 4 is a schematic diagram of the first filling and coating step in which the target area is a slit according to another embodiment of the novel. FIG. 5 is a schematic diagram of a detection step in which the target area is a slit according to another embodiment of the novel. 6 is a schematic diagram of the second filling and coating step in which the target area is a slit according to another embodiment of the novel. FIG. 7 is a schematic diagram of the result of filling and coating in which the target area is a slit according to another embodiment of the novel.

1: Fluid filling unit

2: Optical measurement unit

3: Calculation unit

4: Fluid material

5: Wafer

6: Substrate

7: Fluid filling end

8: Fluid diffusion end

Claims (7)

An adjustment and correction system for intelligent filling and coating, including: a fluid filling and coating unit, which fills and coats a fluid material to a target area, and performs an N-th filling and coating, where N is a constant; an optical measurement unit that dynamically detects the state of the fluid material in the target area and generates an Nth three-dimensional fluid signal; an arithmetic unit, electrically connected to the fluid filling unit and the optical measuring unit, receives the Nth three-dimensional fluid signal, and obtains the state of the fluid material, the arithmetic unit calculates the fluid material The state of N is compared with a preset value of a fluid state. If the state of the fluid material does not match the preset value of the fluid state, the calculation unit sends an Nth fluid quantity change signal to the fluid filling and coating unit to The fluid filling and coating unit adjusts the filling and coating fluid volume according to the Nth fluid volume change signal. The adjustment and correction system for intelligent filling according to claim 1, wherein the target area is a fluid filling end of a gap between a wafer and a substrate. The adjustment and correction system for intelligent filling according to claim 2, wherein the state of the fluid material comprises a volume of a fluid, a weight of a fluid, a height of a fluid in the void, and a fluid in the void width, or the extent to which a fluid fills the void. The adjustment and correction system for intelligent filling according to claim 1, wherein the target area is a slit. The adjustment and correction system for intelligent filling according to claim 4, wherein the state of the fluid material includes a volume of a fluid, a weight of a fluid, a height of a fluid in the slit, a fluid in the slit The width of the slit, or the extent to which a fluid fills the slit. The adjustment and correction system for intelligent filling and coating according to claim 1, wherein the fluid filling and coating unit is a glue dispensing unit; the fluid material is a glue; the optical measuring unit is a laser measuring instrument, a total of Focusing laser scanning microscope, the composition of a femtosecond infrared laser and a confocal microscope, a conjugate laser, a three-dimensional measuring device, an ultrasonic measuring device, an interferometer or a triangular laser measuring device. The adjustment and correction system for intelligent filling and coating according to claim 1, wherein the optical measurement unit includes at least one vision module, and the vision module is a CCD camera, a CCD image sensor, and a CMOS image sensor, a CMOS camera, an optical microscope, a scanning electron microscope or a transmission microscope.

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