CN117316803A - Adjustment and correction system and method thereof - Google Patents
Adjustment and correction system and method thereof Download PDFInfo
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- CN117316803A CN117316803A CN202210695435.7A CN202210695435A CN117316803A CN 117316803 A CN117316803 A CN 117316803A CN 202210695435 A CN202210695435 A CN 202210695435A CN 117316803 A CN117316803 A CN 117316803A
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- 238000012937 correction Methods 0.000 title claims abstract description 24
- 238000000034 method Methods 0.000 title claims abstract description 17
- 239000003292 glue Substances 0.000 claims abstract description 313
- 230000003287 optical effect Effects 0.000 claims abstract description 45
- 238000005259 measurement Methods 0.000 claims abstract description 32
- 238000004364 calculation method Methods 0.000 claims abstract description 15
- 230000008859 change Effects 0.000 claims abstract description 15
- 239000000758 substrate Substances 0.000 claims description 70
- 238000005305 interferometry Methods 0.000 claims description 3
- 230000000007 visual effect Effects 0.000 claims description 3
- 238000010586 diagram Methods 0.000 description 12
- 238000007599 discharging Methods 0.000 description 8
- 238000005516 engineering process Methods 0.000 description 5
- 230000008569 process Effects 0.000 description 4
- 238000001218 confocal laser scanning microscopy Methods 0.000 description 3
- 238000013459 approach Methods 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000001917 fluorescence detection Methods 0.000 description 1
- 238000002073 fluorescence micrograph Methods 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000003908 quality control method Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Abstract
The invention provides an adjustment and correction system and a method thereof, wherein the system comprises: an optical measurement unit; a glue outlet control unit; and an arithmetic unit electrically connected with the optical measurement unit and the glue outlet control unit; the optical measurement unit measures a glue and obtains an Nth three-dimensional glue signal, N is a constant, the calculation unit receives the Nth three-dimensional glue signal and obtains the volume or weight of the glue, the calculation unit compares the volume or weight of the glue with a preset glue value, and if the volume or weight of the glue does not accord with the preset glue value, the calculation unit transmits an Nth glue change signal to the glue control unit so that the glue control unit adjusts the provided glue amount according to the Nth glue change signal. The invention can achieve feedback according to the last glue amount through a closed loop and adjust the glue amount of the current time, thereby solving the problem of glue overflow or insufficient glue and further improving the bonding quality.
Description
Technical Field
The invention relates to the technical field of chip bonding, in particular to an adjustment and correction system and a method thereof.
Background
The chip bonding technology or the substrate bonding technology is an important technology or process in the semiconductor industry, the electronic industry or the touch display industry. The existing bonding technology selectively uses a visual unit to visually locate the to-be-bonded position of the substrate, or uses a program to set the to-be-bonded position of the substrate in advance, and then uses a pressing process to bond the two substrates to each other or bond the die to the substrate.
However, the above-mentioned bonding technique still has the problems of glue overflow or insufficient glue, and the amount of glue from the glue point to the place to be bonded can be varied to produce the defect of being unable to be quantified, such as density of glue, viscosity of glue, humidity of environment, temperature of environment, etc. When the glue overflow or the glue shortage occurs, the glue overflow or the glue shortage cannot be found in time when the bonding process is performed, and the Quality inspection (Quality Control) to be continued can not be found, so that the bonded product cannot reach the due Quality, and the cost is lost.
In summary, the current real-time feedback and the adjustment of the glue amount during the bonding process are very important items in the industry.
Disclosure of Invention
In view of the above-mentioned drawbacks of the prior art, the present invention provides an adjustment and correction system and method thereof.
The invention provides an adjustment and correction system, comprising: an optical measurement unit; a glue outlet control unit; and an arithmetic unit electrically connected with the optical measurement unit and the glue outlet control unit; the optical measurement unit measures a glue and obtains an Nth three-dimensional glue signal, N is a constant, the calculation unit receives the Nth three-dimensional glue signal and obtains the volume or weight of the glue, the calculation unit compares the volume or weight of the glue with a preset glue value, and if the volume or weight of the glue does not accord with the preset glue value, the calculation unit transmits an Nth glue change signal to the glue control unit so that the glue control unit adjusts the provided glue amount according to the Nth glue change signal.
In an embodiment, the glue dispensing control unit provides glue to a glue dispensing unit, so that the glue dispensing unit dispenses glue to a to-be-bonded position of an n+1th substrate.
In one embodiment, the optical measurement unit is a laser gauge, a triangular laser ranging, an optical interferometry, a confocal laser scanning microscope, a combination of a femtosecond infrared laser and a confocal microscope, or a conjugate laser.
In an embodiment, the optical measurement unit includes at least one upper vision module and at least one side vision module, and the upper vision module and the side vision module are a charge-coupled device camera or a charge-coupled device image sensor.
In one embodiment, the volume or weight of glue provided is between 99% and 101% of the predetermined value of glue.
The invention also provides an adjustment and correction method, which comprises the following steps:
obtaining an Nth three-dimensional glue signal: a conveying unit conveys an N-th substrate to the lower part of a glue outlet unit, wherein N is a constant; dispensing the to-be-bonded part of the N substrate by the dispensing unit; an optical measuring unit for measuring the glue and obtaining an Nth three-dimensional glue signal;
obtaining the Nth glue quantity change signal: the calculating unit calculates according to the Nth three-dimensional glue signal to obtain the volume or weight of the glue at the position to be bonded of the Nth substrate, compares the volume or weight of the glue with a preset glue value, and if the volume or weight of the glue does not accord with the preset glue value, transmits an Nth glue amount change signal to a glue output control unit; and
dispensing the n+1th substrate: the conveying unit conveys the N-th substrate to leave the lower part of the glue outlet unit, conveys the n+1th substrate to the lower part of the glue outlet unit, the glue outlet control unit adjusts the provided glue amount according to the N-th glue amount change signal, provides the glue to the glue outlet unit, and the glue outlet unit points the glue from the glue outlet control unit to the position to be bonded of the n+1th substrate. And returning to the step of obtaining the Nth three-dimensional glue signal.
In one embodiment, if the optical measurement unit is a confocal laser scanning microscope or a combination of a femtosecond infrared laser and a confocal microscope; the optical measurement unit measures the glue at the to-be-bonded position of the Nth substrate and obtains an Nth three-dimensional glue signal.
In an embodiment, if the optical measurement unit is at least one upper vision module and at least one side vision module; the upper visual unit captures an upper image of the glue at the to-be-bonded position of the N-th substrate; the side vision module captures a side image of the glue at the to-be-bonded position of the Nth substrate; the top image and the side image are provided for the calculating unit, and the calculating unit obtains an Nth three-dimensional glue signal according to the top image and the side image.
The optical measuring unit, the glue outlet control unit and the calculating unit are designed into a closed loop, so that after each glue dispensing, the calculating unit can obtain the volume or the weight of glue according to the three-dimensional information (three-dimensional glue signal) of the glue measured by the optical measuring unit. The calculation unit compares the volume or weight of the glue with a preset glue value, and if the glue does not accord with the preset glue value, a glue amount change signal is provided for the glue control unit so that the glue control unit can adjust the glue amount of the glue providing unit. The invention can achieve feedback according to the last glue amount through a closed loop and adjust the glue amount of the current time, thereby solving the problem of glue overflow or insufficient glue and further improving the bonding quality.
Drawings
Fig. 1 is a schematic operation diagram of an adjustment and correction system according to a first embodiment of the present invention.
Fig. 2 is a schematic diagram illustrating another operation of the adjustment and correction system according to the first embodiment of the present invention.
Fig. 3 is a schematic diagram illustrating still another operation of the adjustment and correction system according to the first embodiment of the present invention.
Fig. 4 is a schematic operation diagram of an adjustment and correction system according to a second embodiment of the present invention.
Fig. 5 is a schematic diagram illustrating another operation of the adjustment and correction system according to the second embodiment of the present invention.
Fig. 6 is a schematic diagram illustrating still another operation of the adjustment and correction system according to the second embodiment of the present invention.
Reference numerals illustrate:
10,20, an optical measurement unit; 11,21, a glue outlet unit; 12,22, a glue outlet control unit; 13,23, an arithmetic unit; 14,24, a conveying unit; 15, a first substrate; 16 a second substrate; 25, a third substrate; a fourth substrate 26; 200, an upper vision module; 201 side vision module.
Detailed Description
So that those skilled in the art can fully understand the technical features, contents and advantages of the present invention and their attained functions, the present invention will now be described in detail with reference to the drawings and in the form of examples, but the drawings used herein are merely illustrative and auxiliary description, and are not necessarily to scale and precise arrangements, so that the scope of the invention is not limited to the scale and arrangement of the drawings and the scope of the claims in actual practice.
Please refer to fig. 1, which is a schematic diagram illustrating an adjustment and correction system according to a first embodiment of the present invention. As shown in fig. 1, the adjustment and correction system includes: an optical measuring unit 10, a glue outlet unit 11, a glue outlet control unit 12, an arithmetic unit 13 and a conveying unit 14.
The optical measurement unit 10 is disposed above the conveying unit 14, and the optical measurement unit 10 is a laser measuring instrument, a triangle laser ranging, an optical interferometry, a confocal laser scanning microscope, a femto-second infrared laser and a confocal microscope or a conjugate laser.
The glue outlet unit 11 is disposed above the conveying unit 14 and adjacent to the optical measuring unit 10. The glue outlet unit 11 may be a glue dispensing needle.
The glue outlet control unit 12 is coupled to the glue outlet unit 11, and the glue outlet control unit 12 is capable of controlling the volume or weight of glue supplied to the glue outlet unit 11.
The calculating unit 13 is electrically coupled to the glue dispensing control unit 12 and the optical measurement unit 10.
The conveying unit 14 conveys a substrate to be bonded (hereinafter referred to as a first substrate 15 for convenience of reading) to the lower side of the glue discharging unit 11, and the glue discharging unit 11 performs dispensing on the to-be-bonded portion of the first substrate 15. The optical measurement unit 10 measures the glue at the to-be-bonded position of the first substrate 15, and obtains a three-dimensional glue signal (hereinafter referred to as a first three-dimensional glue signal for easy reading).
In the present embodiment, the optical measurement unit 10 is a confocal laser scanning microscope or a combination of a femtosecond infrared laser and a confocal microscope. The principle of confocal laser scanning microscopy (Confocal laser scanning microscopy, CLSM) is to use a Pinhole aperture (Pinhole) to exclude light from the unfocused plane. The confocal laser scanning microscope technology can remove light which is not provided with a focal plane in the traditional fluorescence microscope image, and can observe samples layer by layer, thereby greatly increasing the contrast and resolution of the image and the fluorescence detection signal-to-noise ratio.
The first three-dimensional glue signal is transmitted to the calculating unit 13, and the calculating unit 13 calculates according to the first three-dimensional glue signal to obtain the volume or weight of the glue at the position to be bonded of the first substrate 15. The calculating unit 13 compares the volume or weight of the glue obtained by calculation with a preset glue value. If the volume or weight of the glue does not meet the preset glue value, i.e. the volume or weight of the glue exceeds or falls below a preset glue value, the calculating unit 13 sends a glue amount changing signal (hereinafter referred to as a first glue amount changing signal for easy reading) to the glue control unit 12. The glue outlet control unit 12 changes the glue amount provided to the glue unit 11 according to the first glue amount changing signal, so that the volume or weight of the glue at the to-be-bonded position of the substrate accords with or approaches to the preset glue value. The approach is between 99% and 101% of the preset value of the glue. In other words, the volume or weight of glue provided is between 99% and 101% of the preset value of glue.
Fig. 2 is a schematic diagram illustrating another operation of the adjustment and correction system according to the first embodiment of the present invention. As shown in fig. 2, the conveying unit 14 conveys the first substrate 15 away from the lower side of the glue dispensing unit 11, and conveys another substrate to be bonded (hereinafter referred to as a second substrate 16 for convenience of reading) to the lower side of the glue dispensing unit 11. The glue outlet unit 11 directs the glue from the glue outlet control unit 12 to the portion to be bonded of the second substrate 16.
Fig. 3 is a schematic diagram illustrating another operation of the adjustment and correction system according to the first embodiment of the present invention. As shown in fig. 3, the optical measurement unit 10 measures the glue at the portion to be bonded of the second substrate, and obtains a three-dimensional glue signal (hereinafter referred to as a second three-dimensional glue signal for easy reading). The second three-dimensional glue signal is transmitted to the calculating unit 13, and the calculating unit 13 calculates according to the second three-dimensional glue signal to obtain the volume or weight of the glue at the position to be bonded of the second substrate 16. The calculating unit 13 compares the volume or weight of the glue obtained by calculation with a preset glue value. If the volume or weight of the glue does not meet the default value, the algorithm unit 13 sends a glue amount changing signal (hereinafter referred to as a second glue amount changing signal for easy reading) to the glue control unit 12. The glue outlet control unit 12 changes the glue amount provided to the glue unit 11 according to the second glue amount changing signal so as to enable the volume or weight of the glue at the position to be bonded of the substrate to be consistent with or approximate to a preset glue value.
Fig. 4 is a schematic diagram illustrating an adjustment and correction system according to a second embodiment of the invention. As shown in fig. 4, the adjustment and correction system includes: an optical measuring unit 20, a glue outlet unit 21, a glue outlet control unit 22, an arithmetic unit 23 and a conveying unit 24.
The optical measurement unit 20 includes at least one upper vision module 200 and at least one side vision module 201, the upper vision module 200 is disposed above the conveying unit 24, and the side vision module 201 is disposed at one side of the conveying unit 24. In this embodiment, the upper vision module 200 and the side vision module 201 may be a Charge-coupled Device (CCD) camera or a CCD image sensor.
The glue outlet unit 21 is arranged above the conveying unit 24. The glue outlet unit 21 may be a glue dispensing needle.
The glue outlet control unit 22 is coupled to the glue outlet unit 21, and the glue outlet control unit 22 is capable of controlling the volume or weight of glue supplied to the glue outlet unit 21.
The calculating unit 23 is electrically coupled to the glue dispensing control unit 22 and the optical measurement unit 20.
The conveying unit 24 conveys a substrate to be bonded (hereinafter referred to as a third substrate 25 for convenience of reading) to the lower side of the glue discharging unit 21. The glue outlet unit 21 performs glue dispensing on the to-be-bonded position of the third substrate 25. The optical measurement unit 20 captures an image of the glue on the to-be-bonded portion of the third substrate. The upper vision module 200 captures an upper image of the glue on the third substrate 25 at the position to be bonded. The side vision module 201 captures a side image of the glue at the portion to be bonded of the third substrate 25. The top image and the side image are provided to the calculating unit 23, and the calculating unit 23 obtains a three-dimensional glue signal (hereinafter referred to as a third three-dimensional glue signal for facilitating reading) according to the top image and the side image.
The calculating unit 23 calculates according to the third three-dimensional glue signal to obtain the volume or weight of the glue at the position to be bonded of the third substrate 25. The calculating unit 23 compares the volume or weight of the glue obtained by calculation with a preset glue value. If the volume or weight of the glue does not meet the default value, the calculating unit 23 sends a glue amount changing signal (hereinafter referred to as a third glue amount changing signal for easy reading) to the glue control unit 22.
Fig. 5 is a schematic diagram illustrating another operation of the adjustment and correction system according to the second embodiment of the present invention. As shown in fig. 5, the conveying unit 24 conveys the third substrate 25 away from the lower side of the glue discharging unit 21, and conveys another substrate (hereinafter referred to as a fourth substrate 26 for convenience of reading) to the lower side of the glue discharging unit 21. The glue outlet control unit 22 provides the glue amount of the glue unit 21 according to the third glue amount change signal. The glue outlet unit 21 directs the glue from the glue outlet control unit 22 to the fourth substrate 26 to be bonded.
Fig. 6 is a schematic diagram illustrating another operation of the adjustment and correction system according to the second embodiment of the present invention. As shown in fig. 6, the optical measurement unit 20 captures an image of the glue on the fourth substrate 26 to be bonded. The upper vision module 200 captures an upper image of the glue at the portion of the fourth substrate 26 to be bonded. The side vision module 201 captures a side image of the glue at the portion of the fourth substrate 26 to be bonded. The top image and the side image are provided to the calculating unit 23, and the calculating unit 23 obtains a three-dimensional glue signal (hereinafter referred to as a fourth three-dimensional glue signal for facilitating reading) according to the top image and the side image.
The calculating unit 23 calculates according to the fourth three-dimensional glue signal to obtain the volume or weight of the glue at the position to be bonded of the fourth substrate 26. The calculating unit 23 compares the volume or weight of the glue obtained by calculation with a preset glue value. If the volume or weight of the glue does not meet the default value, the calculating unit 23 sends a glue amount changing signal (hereinafter referred to as a fourth glue amount changing signal for easy reading) to the glue control unit 22.
The glue outlet control unit 22 changes the glue amount provided to the glue unit 21 according to the fourth glue amount changing signal so as to enable the volume or weight of the glue at the position to be bonded of the substrate to be consistent with or approximate to the preset glue value.
The invention relates to an adjusting and correcting method, which comprises the following steps:
step A, obtaining an N three-dimensional glue signal: referring to fig. 1 to 3, the conveying unit 14 conveys the nth substrate to the lower portion of the glue discharging unit 11, where N is a constant. The glue outlet unit 11 performs glue dispensing on the to-be-bonded position of the Nth substrate. If the optical measurement unit 10 is a confocal laser scanning microscope or a combination of a femtosecond infrared laser and a confocal microscope. The optical measurement unit 10 measures the glue at the to-be-bonded position of the nth substrate, and obtains an nth three-dimensional glue signal.
Referring to fig. 3 to 6, if the optical measurement unit 20 is an upper vision module 200 and a side vision module 201. The upper vision module 200 captures an upper image of the glue on the N-th substrate to be bonded. The side vision module 201 captures a side image of the glue at the portion to be bonded of the nth substrate. The top image and the side image are provided to the calculating unit 23, and the calculating unit 23 obtains an nth three-dimensional glue signal according to the top image and the side image.
Step B, obtaining the Nth glue quantity changing signal: referring to fig. 1 to 3, the calculating unit 13 calculates according to the nth three-dimensional glue signal to obtain the volume or weight of the glue at the to-be-bonded position of the nth substrate, and the calculating unit 13 compares the calculated volume or weight of the glue with a preset glue value. If the volume or weight of the glue does not meet the default value, the calculating unit 13 sends an nth glue amount changing signal to the glue control unit 12.
And C, dispensing the n+1th substrate: the conveying unit 14 conveys the nth substrate away from the lower side of the glue discharging unit 11, and conveys the n+1th substrate to the lower side of the glue discharging unit 11. The glue outlet control unit 12 adjusts the supplied glue amount according to the nth glue amount change signal, and supplies the glue to the glue outlet unit 11. The glue outlet unit 11 points the glue from the glue outlet control unit 12 to the position to be bonded of the n+1th substrate. And returning to the step A.
In summary, the system and method for adjusting and correcting according to the present invention designs the optical measuring unit, the glue outlet control unit and the calculating unit as a closed loop, so that the calculating unit can obtain the volume or weight of the glue according to the three-dimensional information (three-dimensional glue signal) of the glue measured by the optical measuring unit after each dispensing. The calculation unit compares the volume or weight of the glue with a preset glue value, and if the glue does not accord with the preset glue value, a glue amount change signal is provided for the glue control unit so that the glue control unit can adjust the glue amount of the glue providing unit. The invention can achieve feedback according to the previous glue amount through a closed loop and adjust the current glue amount, thereby solving the problem of glue overflow or insufficient glue and further improving the bonding quality.
The foregoing description is by way of example only and is not intended to limit the invention to the particular embodiments disclosed. Equivalent substitutions, modifications and alterations will be apparent to those skilled in the art based on the teachings disclosed in the specification, and it is intended to cover the present invention as defined in the appended claims without departing from the scope of the claims.
Claims (9)
1. An adjustment and correction system, comprising:
an optical measurement unit;
a glue outlet control unit; and
an arithmetic unit electrically connected with the optical measurement unit and the glue outlet control unit;
the optical measurement unit measures glue and obtains an Nth three-dimensional glue signal, N is a constant, the calculation unit receives the Nth three-dimensional glue signal and obtains the volume or weight of the glue, the calculation unit compares the volume or weight of the glue with a preset glue value, and if the volume or weight of the glue does not accord with the preset glue value, the calculation unit transmits an Nth glue amount change signal to the glue outlet control unit so that the glue outlet control unit adjusts the provided glue amount according to the Nth glue amount change signal.
2. The system of claim 1, wherein the glue dispensing control unit provides glue to a glue dispensing unit to dispense glue to a portion of an n+1th substrate to be bonded.
3. The system of claim 1, wherein the optical measurement unit is a laser gauge, a triangle laser ranging, an optical interferometry, a confocal laser scanning microscope, a combination of a femtosecond infrared laser and a confocal microscope, or a conjugate laser.
4. The system of claim 1, wherein the optical measurement unit comprises at least one upper vision module and at least one side vision module, the upper vision module and the side vision module being a ccd camera or a ccd image sensor.
5. The adjustment correction system of claim 1, wherein the volume or weight of the provided glue is between 99% and 101% of the predetermined glue value.
6. An adjustment and correction method, comprising:
obtaining an Nth three-dimensional glue signal: a conveying unit conveys an N-th substrate to the lower part of a glue outlet unit, wherein N is a constant; the glue outlet unit is used for dispensing glue at the position to be bonded of the Nth substrate; an optical measurement unit for measuring the glue and obtaining an Nth three-dimensional glue signal;
obtaining the Nth glue quantity change signal: the calculating unit calculates according to the Nth three-dimensional glue signal to obtain the volume or weight of the glue at the position to be bonded of the Nth substrate, compares the volume or weight of the glue with a preset glue value, and transmits an Nth glue amount changing signal to a glue output control unit if the volume or weight of the glue does not accord with the preset glue value; and
dispensing the n+1th substrate: the conveying unit conveys the Nth substrate to leave the lower part of the glue outlet unit, conveys an n+1th substrate to the lower part of the glue outlet unit, the glue outlet control unit adjusts the provided glue amount according to the Nth glue amount change signal and provides the glue to the glue outlet unit, and the glue outlet unit sends the glue point from the glue outlet control unit to the to-be-bonded position of the n+1th substrate and returns to the step of obtaining the Nth three-dimensional glue signal.
7. The method according to claim 6, wherein the volume or weight of the glue is between 99% and 101% of the predetermined value.
8. The method according to claim 6, wherein if the optical measuring unit is a confocal laser scanning microscope or a combination of a femtosecond infrared laser and a confocal microscope; the optical measurement unit measures the glue at the to-be-bonded position of the Nth substrate and obtains the Nth three-dimensional glue signal.
9. The method according to claim 6, wherein if the optical measuring unit is at least one upper vision module and at least one side vision module; the upper visual unit captures an upper image of the glue at the to-be-bonded position of the Nth substrate; the side vision module captures a side image of the glue at the to-be-bonded position of the Nth substrate; the upper image and the side image are provided for the arithmetic unit, and the arithmetic unit obtains the Nth three-dimensional glue signal according to the upper image and the side image.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210695435.7A CN117316803A (en) | 2022-06-20 | 2022-06-20 | Adjustment and correction system and method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210695435.7A CN117316803A (en) | 2022-06-20 | 2022-06-20 | Adjustment and correction system and method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN117316803A true CN117316803A (en) | 2023-12-29 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210695435.7A Pending CN117316803A (en) | 2022-06-20 | 2022-06-20 | Adjustment and correction system and method thereof |
Country Status (1)
| Country | Link |
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| CN (1) | CN117316803A (en) |
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- 2022-06-20 CN CN202210695435.7A patent/CN117316803A/en active Pending
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