TWM630151U - Circuit board having heat dissipation structure of built-in element - Google Patents

Abstract

The disclosure discloses a circuit board having a heat dissipation structure of a built-in element, comprising a circuit board dissipation element, at least one electronic component, and a circuit element. The circuit board dissipation element comprises at least one through hole and at least one heat dissipation lump. The heat dissipation lump is disposed in the through hole, and has a first surface and a second surface. The electronic component is disposed on the heat dissipation lump and contacts the first surface of the heat dissipation lump. The circuit element is disposed on the circuit board dissipation element and covers the electronic component, wherein the second surface of the heat dissipation lump is exposed in the through hole.

Description

Circuit board with embedded component heat dissipation structure

This work is about a heat dissipation structure, especially a circuit board with a heat dissipation structure with embedded components.

Please refer to FIG. 3A to FIG. 3N , which are flow charts of steps of a conventional circuit board embedded component structure. As shown in FIG. 3A , first, a copper foil substrate 20 is provided. The copper foil substrate 20 has an upper surface 201 and a lower surface 202 . As shown in FIG. 3B , a first upper wiring layer 21A and a first lower wiring layer 21B are respectively disposed on the upper surface 201 and the lower surface 202 of the copper foil substrate 20 . As shown in FIG. 3C , an opening H is provided in the copper foil substrate 20 . As shown in FIG. 3D , an adhesive layer 22 is disposed on the lower surface 202 of the copper foil substrate 20 and covers one end of the opening H, so that the opening H forms a groove S. As shown in FIG. 3E , an electronic component C is arranged in the groove S. As shown in FIG. 3F , a first upper dielectric layer 23A is disposed on the upper surface 201 of the copper foil substrate 20 to cover the first upper circuit layer 21A and cover the electronic components C. As shown in FIG. As shown in FIG. 3G, the adhesive layer 22 is removed. As shown in FIG. 3H , the first lower dielectric layer 23B is disposed on the lower surface 202 of the copper foil substrate 20 . As shown in FIG. 31 , at least one first upper blind hole 23A1 and at least one first lower blind hole 23B1 are formed on the surfaces of the first upper dielectric layer 23A and the first lower dielectric layer 23B, respectively, and the exposed part of the first The upper wiring layer 21A and the first lower wiring layer 21B. As shown in FIG. 3J , a second upper layer is formed in at least one first upper blind via 23A1 and at least one first lower blind via 23B1 , and on the surfaces of the first upper dielectric layer 23A and the first lower dielectric layer 23B, respectively. The wiring layer 24A and the second lower wiring layer 24B. As shown in FIG. 3K , a second upper dielectric layer 25A and a second lower dielectric layer 25B are formed on the surfaces of the first upper dielectric layer 23A and the first lower dielectric layer 23B, respectively. As shown in Figure 3L, respectively At least one second upper blind via 25A1 and at least one second lower blind via 25B1 are formed on the surfaces of the second upper dielectric layer 25A and the second lower dielectric layer 25B, exposing parts of the second upper wiring layer 24A and the second lower via Line layer 24B. As shown in FIG. 3M , a third upper layer is formed in at least one second upper blind hole 25A1 and at least one second lower blind hole 25B1 , and on the surfaces of the second upper dielectric layer 25A and the second lower dielectric layer 25B, respectively. The wiring layer 26A and the third lower wiring layer 26B. As shown in FIG. 3N , a first insulating protection layer 27A and a second insulating protection layer 27B are formed on the surfaces of the second upper dielectric layer 25A and the second lower dielectric layer 25B, respectively, and the third upper wiring layer 26A is exposed. and the third lower wiring layer 26B. Accordingly, the embedded component structure 2 in the circuit board is completed.

Please refer to FIG. 3O , which is a schematic diagram of heat dissipation of the embedded component structure on the circuit board of FIG. 3N . It can be seen from the finally completed structure diagram of the embedded components in the circuit board in Fig. 3N that since the electronic component C is completely covered by the embedded component structure 2 in the circuit board, it is wrapped in the embedded component structure 2 in the circuit board, and is directly connected to the surface of the electronic component C. The materials of the contacted copper foil substrate 20 , the first upper dielectric layer 23A and the first lower dielectric layer 23B do not have high thermal conductivity, so that the heat energy generated by the electronic component C cannot be smoothly discharged from the circuit board embedded component structure 2 , and its heat dissipation direction is shown by the arrow, which is wrapped in the embedded component structure 2 of the circuit board.

Furthermore, although the electrical connection points of the electronic component C are connected to the first upper circuit layer 21A, the second upper circuit layer 24A and the third upper circuit layer 26A, and part of the third upper circuit layer 26A is exposed to the first insulating protective layer 27A, but because the path of its circuit connection is tortuous and the contact area with the surface of the electronic component C is too small, it cannot achieve a good heat dissipation effect.

Accordingly, how to provide a circuit board with a heat dissipation structure with embedded components to solve the above problems has become an urgent research topic.

In view of the above problems, the present invention provides a circuit board with a heat dissipation structure of embedded components, including a circuit board heat dissipation structure, at least one electronic component and a circuit board circuit structure. The heat dissipation structure of the circuit board includes at least one opening and at least one heat dissipation block, the heat dissipation block is arranged in the opening, and the heat dissipation block has first surface and second surface. The electronic components are arranged on the heat dissipation block and are in contact with the first surface of the heat dissipation block. The circuit board circuit structure is arranged on the heat dissipation structure of the circuit board and covers the electronic components; wherein the second surface of the heat dissipation block is exposed in the opening.

Based on the above, the circuit board with the heat dissipation structure of the embedded components conducts and dissipates the heat energy generated by the electronic components through the heat dissipation block whose surface is in contact with the electronic components and the other surface is exposed in the opening, so as to further achieve the effect of rapid heat dissipation. . Furthermore, in addition to dissipating heat through the heat dissipation block, the circuit board with the heat dissipation structure of the embedded element can also conduct and dissipate the heat energy generated by the electronic element through the protruding portion protruding from the side surface. Furthermore, even if a plurality of electronic components need to be installed at the same time, the effect of simultaneous heat dissipation can be achieved through the arrangement of the circuit board with the heat dissipation structure embedded in the invention.

1: Circuit board with embedded component heat dissipation structure

10: Copper foil substrate

101: Release layer

102: Copper foil layer

11: The first circuit layer

12: The first dielectric layer

13: Second circuit layer

14: Second Dielectric Layer

15: The third circuit layer

16: Insulation protective layer

17: Isolation layer

18: Adhesive layer

19: Projection

A: Circuit board structure

A1: Circuit board structure

A2: Circuit board heat dissipation structure

11A1: The first upper circuit layer

12A1: first upper dielectric layer

13A1: Second upper circuit layer

14A1: Second upper dielectric layer

15A1: The third upper circuit layer

16A1: Upper insulating protective layer

18A1: Upper Adhesive Layer

102A1: Upper copper foil layer

11A2: The first lower circuit layer

12A2: First Lower Dielectric Layer

13A2: Second lower circuit layer

14A2: Second Lower Dielectric Layer

15A2: The third lower circuit layer

16A2: Lower insulating protective layer

18A2: Lower Adhesive Layer

102A2: Lower copper foil layer

C: electronic components

D: heat sink

D1: first surface

D2: Second surface

H: opening

O: copper foil opening

P: Anchor point

S: groove

2: The structure of embedded components in the circuit board

20: Copper foil substrate

201: Upper surface

202: Lower Surface

21A: The first upper circuit layer

21B: The first lower circuit layer

22: Adhesive layer

23A: first upper dielectric layer

23A1: The first upper blind hole

23B: first lower dielectric layer

23B1: The first blind hole

24A: Second upper circuit layer

24B: The second lower circuit layer

25A: Second upper dielectric layer

25A1: Second upper blind hole

25B: Second Lower Dielectric Layer

25B1: The second lower blind hole

26A: The third upper circuit layer

26B: The third lower circuit layer

27A: The first insulating protective layer

27B: Second insulating protective layer

1A to 1L are flow charts of the steps of manufacturing a circuit board with a heat dissipation structure for embedded components; FIGS. 2A and 2B are cross-sectional views and top views of the circuit board with a heat dissipation structure for embedded components; 3A to 3N are flow charts of steps of the conventional circuit board embedded component structure; and FIG. 3O is a schematic diagram of heat dissipation of the circuit board embedded component structure of FIG. 3N.

Please refer to FIG. 1A to FIG. 1L , which are flow charts of steps of fabricating a circuit board with a heat dissipation structure with embedded components for the present invention. As shown in FIG. 1A , a copper foil substrate 10 is provided first. The copper foil substrate 10 includes a first surface and a second surface opposite to each other, the first surface is located above the second surface, and the first surface and the second surface are in sequence. A release layer 101 and a copper foil layer 102 are provided. As shown in Figure 1B, on the copper foil substrate The first circuit layer 11 is disposed on the copper foil layer 102 of 10, and a part of the first circuit layer 11 is etched to form at least one groove S. It should be noted that, in the embodiment of the present invention, corresponding circuit structures are formed on the first surface and the second surface of the copper foil substrate 10, respectively. Therefore, the corresponding structures are still drawn in the drawings. However, in order to simplify the description, only the circuit structure formed on the first surface of the copper foil substrate 10 will be described and marked with symbols in the subsequent steps. As shown in FIG. 1C , at least one electronic component C is disposed in at least one groove S. In an embodiment of the present invention, the electronic component C is a chip component. As shown in FIG. 1D , a first dielectric layer 12 is disposed on the copper foil layer 102 and covers the first circuit layer 11 and at least one electronic component C, wherein the first circuit layer 11 and the first dielectric layer 12 are formed The first circuit layer structure. As shown in FIG. 1E , a second circuit layer structure and a third circuit layer 15 are sequentially formed on the first circuit layer structure to form a circuit board structure A, wherein the second circuit layer structure includes a second circuit layer 13 and a second circuit layer The dielectric layer 14, and an insulating protective layer 16 is disposed on the second most dielectric layer 14. The insulating protective layer 16 covers a part of the third circuit layer 15 and exposes another part of the third circuit layer 15. Material contains solder mask ink. The steps of forming the second wiring layer structure and the third wiring layer 15 are as described in the prior art, and will not be repeated here. As shown in FIG. 1F , the circuit board structure A is separated from the release layer 101 of the copper foil substrate 10 . As shown in FIG. 1G , patterning the circuit layer on the lower surface of the circuit board structure A includes disposing the isolation layer 17 on the lower surface of the circuit board structure A, that is, disposing the isolation layer 17 on the copper foil of the circuit board structure A on layer 102. As shown in FIG. 1H , the lower surface of the circuit board structure A is etched to remove part of the copper foil layer 102 , and after forming at least one copper foil opening O, the isolation layer 17 is removed. As shown in FIG. 1I, an adhesive layer 18 is provided in the opening O of the copper foil. As shown in FIG. 1J , a predetermined depth of cutting is performed on a positioning point P of the circuit board structure A to form a positioning groove, wherein the positioning groove is cut by laser, and each layer of components in the positioning groove is cut off. The copper foil layer 102 is left at the bottom of the circuit board, so that the circuit board structure A is separated into the circuit board circuit structure A1 and the circuit board heat dissipation structure A2 through the positioning groove. As shown in FIG. 1K , using the copper foil layer 102 at the bottom of the positioning groove as a turning point, the circuit board heat dissipation structure A2 is turned over so that the circuit board heat dissipation structure A2 is located below the circuit board circuit structure A1 . As shown in Figure 1L, after flipping the heat dissipation structure A2 of the circuit board, through the circuit docking technology and The adhesive layer 18 makes the lower surface of the circuit board heat dissipation structure A2 butt and covers the lower surface of the circuit board circuit structure A1, and makes the electronic component C embedded in the circuit board structure A, that is, the electronic component C is embedded in the circuit In the board circuit structure A1 and the circuit board heat dissipation structure A2, the circuit board 1 with the embedded element heat dissipation structure is completed accordingly, wherein the circuit board 1 with the embedded element heat dissipation structure includes the circuit board circuit structure A1 and the circuit board heat dissipation structure A2, The circuit board heat dissipation structure A2 includes a heat dissipation block D. The heat dissipation block D is composed of a first circuit layer 11, a second circuit layer 13 and a third circuit layer 15. The heat dissipation block D has a first surface D1 and a second surface D2. The electronic component C It is disposed on the first surface D1 of the heat dissipation block D and is in contact with the first surface D1, and the second surface D2 of the heat dissipation block D is exposed in the opening H of the circuit board heat dissipation structure A2.

In addition, in the step of FIG. 1J , the positioning points of the first circuit board structure A are cut, and the ductility of the first circuit layer 11 is utilized to facilitate positioning when the circuit board heat dissipation structure A2 is flipped later. In another embodiment of the present invention, it is also possible to directly cut from the positioning point, after the circuit board circuit structure A1 and the circuit board heat dissipation structure A2 are completely separated, and then the docking and positioning actions are performed, which is not limited in this invention. .

Furthermore, in the step of FIG. 1J , since the heat dissipation structure A2 of the circuit board is reversed and connected to the circuit structure A1 of the circuit board through the ductility of the first circuit layer 11 , after the heat dissipation structure A2 of the circuit board is reversed and connected to the circuit structure A1 of the circuit board , the first circuit layer 11 will protrude from the entire side surface of the circuit board 1 with the embedded component heat dissipation structure to form a protruding portion 19 , as shown in FIG. 1L .

In addition, in the step of FIG. 1J , since the circuit board heat dissipation structure A2 is connected to the circuit board circuit structure A1 in a reversed manner, the design of the entire circuit board 1 with the embedded element heat dissipation structure is pre-configured in the structure in advance. A positioning point P is set, and the left and right positions are arranged for the connection points (circuit layers) to be connected, so that after the circuit board heat dissipation structure A2 is turned over, the circuit board circuit structure A1 forms a corresponding relationship between the upper and lower positions. Alternatively, if it is not necessary to connect the circuit layer of the circuit board structure A1 and the circuit layer of the circuit board heat dissipation structure A2 up and down, the adhesive layer 18 is used to separate the circuit layer of the circuit board circuit structure A1 and the circuit layer of the circuit board heat dissipation structure A2 .

Continuing from the above, in the step of disposing the adhesive layer 18 in FIG. 1I, if the first circuit layer 11 preset in the circuit board heat dissipation structure A2 does not need to be docked with the first circuit layer 11 of the circuit board circuit structure A1, then Through the arrangement of the adhesive layer 18, it is arranged and bonded between the circuit board heat dissipation structure A2 and the circuit board circuit structure A1 to isolate the first circuit layer 11 of the circuit board heat dissipation structure A2 and the first circuit layer of the circuit board circuit structure A1 11.

In the step of FIG. 1J , if the first circuit layer 11 preset in the circuit board heat dissipation structure A2 needs to be docked with the first circuit layer 11 of the circuit board circuit structure A1 , the adhesive layer 18 is disposed on the circuit board heat dissipation structure A2 In the copper foil opening O around the first circuit layer 11, and in the copper foil opening O around the first circuit layer 11 of the circuit board circuit structure A1, so as to be electrically connected to the first circuit layer 11 of the circuit board heat dissipation structure A2 and the first circuit layer 11 of the circuit board circuit structure A1.

In addition, in the step of FIG. 1L, the area of the second surface D2 of the heat dissipation block D is larger than the surface area of the electronic component C, so that when the electronic component C is in contact with the first surface D1 of the heat dissipation block D, the first circuit layer 11 can pass through The second circuit layer 13 and the third circuit layer 15 conduct the heat energy generated by the electronic components C to the outside of the circuit board 1 with the embedded component heat dissipation structure.

As mentioned above, the heat dissipation block D is formed by stacking the first circuit layer 11 , the second circuit layer 13 and the third circuit layer 15 in the circuit board structure A, and is in contact with the surface of the electronic component C to achieve the effect of heat dissipation . However, in other embodiments of the present invention, the heat dissipation block D can also be formed by a single circuit layer, as a heat dissipation block D in contact with the surface of the electronic component C, in the embodiment of the present invention, it is not limited to be the circuit layer of the heat dissipation block D number.

Please refer to FIG. 2A , which is a cross-sectional view of a circuit board having a heat dissipation structure with embedded components in the present invention. The circuit board 1 with the heat dissipation structure of embedded components includes a circuit board circuit structure A1 , a circuit board heat dissipation structure A2 and an electronic component C. The circuit board circuit structure A1 is disposed on the circuit board heat dissipation structure A2, and covers the electronic component C with the circuit board heat dissipation structure A2. The circuit board heat dissipation structure A2 includes at least one opening H and at least one heat dissipation block D. The heat dissipation block D is disposed in the opening H and has a first surface D1 and a second surface D2, so that the heat energy generated by the electronic component C is conducted from the first surface D1 to the second surface D2 through the heat dissipation block D, and is conducted to the outside of the opening H, that is, to the outside of the circuit board 1 with the embedded component heat dissipation structure, such as direction of the arrow.

The circuit board circuit structure A1 includes a first upper circuit layer 11A1, a first upper dielectric layer 12A1, a second upper circuit layer 13A1, a second upper dielectric layer 14A1, a third upper circuit layer 15A1, an upper insulating protection layer 16A1, a An upper copper foil layer 102A1 and an upper adhesive layer 18A1. The upper adhesive layer 18A1 is disposed in the upper copper foil layer 102A1. The upper adhesive layer 18A1 and the upper copper foil layer 102A1 are disposed on the heat dissipation structure A2 of the circuit board. The electronic component C is disposed on the upper copper foil layer 102A1 and is in contact with the upper copper foil layer 102A1. The first upper wiring layer 11A1 and the first upper dielectric layer 12A1 are disposed on the upper copper foil layer 102A1 , and the first upper dielectric layer 12A1 covers the first upper wiring layer 11A1 and the electronic element C. As shown in FIG. The second upper dielectric layer 14A1 is disposed on the first upper dielectric layer 12A1 and covers the second upper wiring layer 13A1. The third upper wiring layer 15A1 is disposed on the second upper dielectric layer 14A1. The upper insulating protection layer 16A1 is disposed on the second upper dielectric layer 14A1, covers part of the third upper wiring layer 15A1, and exposes part of the third upper wiring layer 15A1.

The circuit board heat dissipation structure A2 further includes a first lower wiring layer 11A2, a first lower dielectric layer 12A2, a second lower wiring layer 13A2, a second lower dielectric layer 14A2, a third lower wiring layer 15A2, a lower insulating protection layer 16A2, A lower copper foil layer 102A2 and a lower adhesive layer 18A2. The lower adhesive layer 18A2 is disposed in the lower copper foil layer 102A2. The lower copper foil layer 102A2 is in contact with the upper copper foil layer 102A1. The lower adhesive layer 18A2 and the lower copper foil layer 102A2 are disposed under the circuit board circuit structure A1. The first lower wiring layer 11A2 and the first lower dielectric layer 12A2 are disposed under the lower copper foil layer 102A2, the first lower wiring layer 11A2 is in contact with the lower copper foil layer 102A2, and the first lower dielectric layer 12A2 covers the first lower wiring layer 102A2. Line layer 11A2. The second lower dielectric layer 14A2 is disposed under the first lower dielectric layer 12A2 and covers the second lower wiring layer 13A2, and the second lower wiring layer 13A2 is in contact with the first lower wiring layer 11A2. The third lower wiring layer 15A2 is disposed under the second lower dielectric layer 14A2 and is in contact with the second lower wiring layer 13A2. The lower insulating protection layer 16A2 is disposed under the second lower dielectric layer 14A2, and covers a part of the first There are three lower wiring layers 15A2, and part of the third lower wiring layer 15A2 is exposed, wherein the lower insulating protection layer 16A2 forms the opening H of the heat dissipation structure A2 of the circuit board.

The heat dissipation block D includes the first lower circuit layer 11A2, the second lower circuit layer 13A2 and the third lower circuit layer 15A2 in the circuit board heat dissipation structure A2. The upper copper foil layer 102A1, the lower copper foil layer 102A2, the first lower circuit layer 11A2, the second lower circuit layer 13A2 and the third lower circuit layer 15A2 are arranged in the same positional relationship as above, and are stacked in sequence, so that the thermal energy generated by the electronic component C From the upper copper foil layer 102A1, the lower copper foil layer 102A2, the first lower wiring layer 11A2, the second lower wiring layer 13A2 and the third lower wiring layer 15A2 to the outside of the opening H, that is, to the outside of the opening H, that is, to the heat dissipation structure of the embedded element. Outside of circuit board 1, as shown in the direction of the arrow. In addition, each circuit layer uses metal copper material, which has high thermal conductivity. However, in other embodiments of the present invention, other materials with high thermal conductivity can also be used to increase the thermal conductivity, which is not limited in the present invention. Furthermore, in the structure of FIG. 2A , the heat dissipation block D is disposed in the opening H, but in order to improve the heat dissipation effect, in other embodiments, the heat dissipation block D can also be disposed in a structure protruding from the surface of the opening H.

As mentioned above, since the thermal conductivity of the electronic component C is actually conducted to the opening via the upper copper foil layer 102A1, the lower copper foil layer 102A2, the first lower wiring layer 11A2, the second lower wiring layer 13A2 and the third lower wiring layer 15A2 Externally H, therefore, in a broad sense, the heat sink D further includes a lower copper foil layer 102A2, and even further includes an upper copper foil layer 102A1.

The circuit board 1 with the heat dissipation structure of embedded components further includes a protruding portion 19, the protruding portion 19 includes a part of the upper copper foil layer 102A1 and a part of the lower copper foil layer 102A2, protruding from the heat dissipation structure A2 of the circuit board and the circuit structure of the circuit board Side surface of A1. Since the surface of the electronic component C is in direct contact with a part of the upper copper foil layer 102A1 and indirectly in contact with a part of the lower copper foil layer 102A2 , the heat energy generated by the electronic component C can also be conducted to the embedded component through the protruding portion 19 . The outside of the circuit board 1 of the heat dissipation structure is shown by the arrows in the horizontal direction. In addition, in order to increase the effect of heat dissipation, the first contact with the surface of the electronic component C indirectly The area of the lower wiring layer 11A2 , the second lower wiring layer 13A2 and the third lower wiring layer 15A2 is larger than the surface area of the electronic element C. As shown in FIG.

The upper adhesive layer 18A1 and the lower adhesive layer 18A2 are respectively disposed around the first upper circuit layer 11A1 of the circuit board circuit structure A1 and the first lower circuit layer 11A2 of the circuit board heat dissipation structure A2 according to whether the circuit layers need to be electrically connected. The first upper wiring layer 11A1 is electrically connected to the first lower wiring layer 11A2. Alternatively, the lower adhesive layer 18A2 is bonded by the upper adhesive layer 18A1 to separate the first upper wiring layer 11A1 and the first lower wiring layer 11A2. In the embodiment of the present invention, the upper adhesive layer 18A1 and the lower adhesive layer 18A2 are insulating adhesive materials.

Please refer to FIG. 2B , which is a top view of the circuit board with the heat dissipation structure of the embedded components of the present invention. As shown in the figure, through the circuit board 1 with the heat dissipation structure of embedded components, in the heat dissipation direction, in addition to conducting heat energy outward through the direction perpendicular to the surface of the heat dissipation block D, it also includes a heat dissipation structure with embedded components. The heat is dissipated in all directions on the side of the circuit board 1, as indicated by the arrows.

To sum up, the circuit board with the heat dissipation structure of embedded components in this creation conducts and dissipates the heat energy generated by the electronic components through the heat dissipation block whose one surface is in contact with the electronic components and the other surface is exposed in the opening, so as to further achieve the effect of rapid heat dissipation. . Furthermore, in addition to dissipating heat through the heat dissipation block, the circuit board with the heat dissipation structure of the embedded element can also conduct and dissipate the heat energy generated by the electronic element through the protruding portion protruding from the side surface. Furthermore, even if a plurality of electronic components need to be installed at the same time, the effect of simultaneous heat dissipation can be achieved through the arrangement of the circuit board with the heat dissipation structure embedded in the invention.

1: Circuit board with embedded component heat dissipation structure

A: Circuit board structure

A1: Circuit board structure

A2: Circuit board heat dissipation structure

11A1: The first upper circuit layer

12A1: first upper dielectric layer

13A1: Second upper circuit layer

14A1: Second upper dielectric layer

15A1: The third upper circuit layer

16A1: Upper insulating protective layer

18A1: Upper Adhesive Layer

102A1: Upper copper foil layer

11A2: The first lower circuit layer

12A2: First Lower Dielectric Layer

13A2: Second lower circuit layer

14A2: Second Lower Dielectric Layer

15A2: The third lower circuit layer

16A2: Lower insulating protective layer

18A2: Lower Adhesive Layer

102A2: Lower copper foil layer

C: electronic components

D: heat sink

D1: first surface

D2: Second surface

H: opening

Claims (9)

A circuit board with a heat dissipation structure of embedded components, comprising: a circuit board heat dissipation structure, comprising at least one opening and at least one heat dissipation block, the at least one heat dissipation block is disposed in the at least one opening, and the at least one heat dissipation block has a first surface and a second surface; at least one electronic component disposed on the at least one heat dissipation block and in contact with the first surface of the at least one heat dissipation block; and a circuit board circuit structure disposed on the circuit board heat dissipation structure and covering the at least one electronic component; The second surface of the at least one heat dissipation block is exposed in the at least one opening. The circuit board with a heat dissipation structure of embedded components as described in claim 1, wherein the heat dissipation structure of the circuit board further comprises: The lower copper foil layer is arranged under the circuit structure of the circuit board and is in contact with the circuit structure of the circuit board; a lower dielectric layer, disposed under the lower copper foil layer; a lower wiring layer disposed in the lower dielectric layer; and a lower insulating protective layer, disposed under the lower dielectric layer, covering part of the lower circuit layer and exposing part of the lower circuit layer; The at least one opening is disposed in the lower insulating protection layer, and the at least one heat dissipation block includes the lower circuit layer exposed in the opening. The circuit board with a heat dissipation structure of embedded components as described in claim 2, wherein the circuit structure of the circuit board comprises: an upper copper foil layer disposed on the heat dissipation structure of the circuit board and in contact with the heat dissipation structure of the circuit board; an upper dielectric layer disposed on the upper copper foil layer; an upper circuit layer disposed in the upper dielectric layer and on the circuit board circuit structure, and in contact with a portion of the lower circuit layer; and An upper insulating protection layer is disposed on the upper dielectric layer, covers part of the upper circuit layer, and exposes part of the upper circuit layer. The circuit board with the heat dissipation structure of embedded components as claimed in claim 3 further includes a lower adhesive layer disposed in the lower copper foil layer. The circuit board with the heat dissipation structure of embedded components as claimed in claim 4 further comprises an upper adhesive layer disposed in the upper copper foil layer and in contact with the lower adhesive layer. The circuit board with the heat dissipation structure of embedded components as claimed in claim 3, wherein a part of the upper copper foil layer and the lower copper foil layer forms a protruding part, and the protruding part protrudes from the heat dissipation structure of the circuit board side surface. The circuit board with a heat dissipation structure of embedded components as claimed in claim 1, wherein the first surface area of the at least one heat dissipation block is larger than a surface area of the at least one electronic component. The circuit board with a heat dissipation structure of embedded components as claimed in claim 3, wherein the at least one heat dissipation block further includes the lower copper foil layer. The circuit board with a heat dissipation structure of embedded components as claimed in claim 8, wherein the at least one heat dissipation block further includes the upper copper foil layer.

Images