JP3269491B2 - Semiconductor device, fuse structure used therefor, and method of manufacturing the same - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a semiconductor device, a fuse structure used therefor, and a method of manufacturing the same, and more particularly to a method of manufacturing a semiconductor device using a fuse for switching a defective circuit to a redundant circuit.

[0002]

2. Description of the Related Art Conventionally, in this type of semiconductor device,
As shown in FIG. 7, a fuse structure in which the upper wiring 9 is connected to the lower wiring 10 via the conductor portion 11 is adopted.
The conductor portion 12, which is the laser irradiation position, is arranged on the same coordinate axis in the plane direction, and the passivation film is opened for laser irradiation (fuse opening 1).

When the conductor portion 12 is broken by laser irradiation and cut, as shown in FIG. 8, the broken residue 13 scatters on the cut surface and in the vicinity thereof, and the residue 13 Is electrically connected to the wiring. In order to prevent the above-mentioned state, it is necessary to provide a certain interval between fuses.

As shown in FIG. 9, in a fuse structure in which the upper wiring is only a single layer, when the upper wiring 14 is cut by laser irradiation while aiming at a laser irradiation focal point 16 with a laser, a laser irradiation apparatus is used. Is different from the energy suitable for cutting the metal wiring, it is difficult to completely cut the upper wiring 15 to be cut, and the yield is reduced.

Further, even if the upper wiring 15 is cut, the scattered residue remains as shown in FIG.
Residue 17 remains in the same manner as described above, and a problem occurs. When the above phenomenon occurs, as shown in FIG. 10 (1 after cutting), the upper wiring 15 to be cut remains electrically connected by the residue 17.

Furthermore, the upper wiring 15 to be cut is
When the laser irradiation is intensified to completely cut the upper layer wiring 1, the upper layer wiring 15 scatters widely around the cut portion, as shown in FIG. 11 (after cutting 2) and FIG. 12 (after cutting 3).
5 is electrically connected to the adjacent upper wiring 19 by the residue 18.

[0007]

In the conventional semiconductor device described above, in the case of the conventional method, the residue after cutting remains as described above, and the upper wiring to be cut is completely cut. Or a problem that the upper wiring to be cut is scattered widely in the vicinity of the cut surface and is electrically connected to the adjacent upper wiring. In order to avoid the above-mentioned problem, it is essential to increase the interval between the fuses in consideration of the above situation.

However, securing a wide fuse interval requires a correspondingly large area, which is not preferable at present as semiconductors become more highly integrated and miniaturized.

SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to solve the above-mentioned problems and to improve the success rate of cutting by laser irradiation without securing a wide fuse interval, a fuse structure used therefor, and a fuse structure therefor. It is to provide a manufacturing method.

[0010]

A semiconductor device according to the present invention is a semiconductor device including a fuse wiring, wherein a first-layer wiring forming the fuse wiring and a fuse wiring are provided.
As a second layer formed on a layer different from the first layer wiring
Wiring, the wiring of the first layer and the wiring of the second layer intersect.
Mutually adjacent, and a, and at least one layer of the interlayer insulating film is formed between the wiring lines and the second layer of the first layer.

Another semiconductor device according to the present invention comprises a fuse
A semiconductor device including wiring, wherein the fuse wiring is formed.
The upper layer wiring to be formed and the hue below the upper layer wiring.
A different layer wiring formed as a closed wiring, and the upper layer wiring
And at least one or more layers formed between
And an upper interlayer insulating film, wherein the fuse wiring is
The layer wiring and the wiring of the different layer are formed so as to be alternately arranged .

[0012] A method of manufacturing a semiconductor device according to the present invention, the ratio
A method of manufacturing a semiconductor device including a Yuzu wiring layers
Forming a first layer wiring as the fuse wiring on an insulating film;
A first step of performing
A second step of forming at least one layer of a film;
The second layer is formed on at least one interlayer insulating film.
A third step of forming a line as the fuse wiring , wherein the first step and the third step
The wiring of the first layer and the wiring of the second layer are alternately adjacent to each other.
I'm trying .

That is, the semiconductor device of the present invention is formed so as to have a lower wiring formed on a semiconductor substrate and a region on the lower wiring overlapping with a part of the lower wiring via an interlayer insulating film. In a semiconductor device having a three-dimensional structure in which a conductor is electrically connected to an upper layer wiring and including a fuse for switching a defective circuit due to the upper layer wiring to a redundant circuit, adjacent fuse wiring is replaced by an upper layer wiring and an upper layer wiring And a different-layer wiring formed with at least one or more interlayer insulating films therebetween.

As a result, the interval between the fuses can be reduced, and the area of the fuse can be reduced. Therefore, the success rate of cutting by laser irradiation can be improved without securing a wide interval between the fuses. It is possible to do.

[0015]

Next, an embodiment of the present invention will be described with reference to the drawings. FIG. 1A is a plan view of a semiconductor device according to one embodiment of the present invention, and FIG.
It is sectional drawing which follows the AA line of (a). In FIG. 1, in the semiconductor device according to one embodiment of the present invention, a fuse wiring for switching a defective circuit to a redundant circuit is formed between the upper wiring 2 and the upper wiring 2 via one interlayer insulating film 4. And the wiring 3 of a different layer. Further, the semiconductor device according to the embodiment of the present invention has a fuse opening 1 for irradiating a laser beam for cutting to a fuse wiring.
Is provided.

In this case, the upper layer wiring 2 and the different layer wiring 3 are formed adjacent to each other, and the different layer wiring 3 is formed with the interlayer insulating film 4 interposed between the adjacent upper layer wiring 2. ing. That is, when viewed from the fuse opening 1, upper wirings 2 and wirings 3 of different layers are alternately arranged as fuse wirings.

When manufacturing the above-described semiconductor device, first, a different-layer wiring 3 is formed on the interlayer insulating film 4, and one interlayer insulating film 4 is formed on the different-layer wiring 3, and then the upper layer is formed. Wiring 2
Is formed, and the fuse opening 1 is formed on the upper wiring 2.

FIG. 2A is a plan view of a semiconductor device having a fuse before cutting according to an embodiment of the present invention.
FIG. 2B is a sectional view taken along the line BB of FIG. FIG.
In this case, the lower wiring 6 is formed on an element (not shown) or a wiring layer (not shown) formed on a semiconductor substrate (not shown).
And an upper layer wiring 5 having one interlayer insulating film 4.

In this case, in the semiconductor device having the above structure, laser irradiation is performed by aiming a laser at the laser irradiation focal point 8 of the upper wiring 5 or the lower wiring 6 from the fuse opening 1 to irradiate the upper wiring 5 or the lower wiring 6. The fuse is switched by cutting.

FIG. 3A shows a laser irradiation focus 8 shown in FIG.
FIG. 3B is a plan view of the semiconductor device after cutting by irradiating the semiconductor device with a laser beam, and FIG. 3B is a cross-sectional view taken along the line CC in FIG. In FIG. 3, one interlayer insulating film 4 is sandwiched between adjacent fuse wirings, that is, the upper wiring 5 and the lower wiring 6, so that one interlayer insulating film 4 serves as a wall, Irradiation has less influence on adjacent wirings (upper wiring 5 and lower wiring 6) than when adjacent wirings of the same layer are arranged adjacently (FIGS. 9 and 10).

Therefore, the laser irradiation can be intensified, and the wiring to be cut (the upper wiring 5 or the lower wiring 6) can be completely cut without leaving it on the interlayer insulating film 4.

Further, even if the laser irradiation is intensified, the interlayer insulating film 4 serves as a protective wall, so that the scattered wiring (upper wiring 5 or lower wiring 6) after cutting is minimized.
There is no possibility of being electrically connected to the adjacent wiring (the upper wiring 5 and the lower wiring 6).

Therefore, it is possible to reduce the interval between the fuse wires (the interval between the upper interconnect 5 and the lower interconnect 6) as compared with the case where the wires of the same layer are arranged adjacently (FIGS. 11 and 12). And the area required for the fuse is also reduced.

FIG. 4A is a plan view of a semiconductor device according to another embodiment of the present invention, and FIG.
It is sectional drawing which follows the D line. In FIG. 4, in a semiconductor device according to another embodiment of the present invention, a fuse wiring for switching a defective circuit to a redundant circuit includes an upper wiring 2 and an upper wiring 2.
And two different layers of wiring 3 formed with two interlayer insulating films 4 interposed therebetween. A semiconductor device according to another embodiment of the present invention is provided with a fuse opening 1 for irradiating a fuse wiring with a laser beam for cutting.

In this case, the upper wiring 2 and the different wiring 3 are formed adjacent to each other, and the different wiring 3 sandwiches two interlayer insulating films 4 between the adjacent upper wiring 2. It is formed with. That is, when viewed from the fuse opening 1, upper wirings 2 and wirings 3 of different layers are alternately arranged as fuse wirings.

In manufacturing the above-described semiconductor device, first, a different-layer wiring 3 is formed on the interlayer insulating film 4, and two interlayer insulating films 4 are formed on the different-layer wiring 3, and then the upper layer is formed. Wiring 2
Is formed, and the fuse opening 1 is formed on the upper wiring 2.

FIG. 5A is a plan view of a semiconductor device having a fuse before cutting according to another embodiment of the present invention, and FIG. 5B is a sectional view taken along line EE in FIG. 5A. is there. 5, an upper wiring 5 having a lower wiring 6 and two interlayer insulating films 4 on an element (not shown) or a wiring layer (not shown) formed on a semiconductor substrate (not shown). Are formed.

In this case, in the semiconductor device having the above-described structure, laser irradiation is performed by aiming a laser at the laser irradiation focal point 8 of the upper wiring 5 or the lower wiring 6 from the fuse opening 1 to irradiate the upper wiring 5 or the lower wiring 6. The fuse is switched by cutting.

FIG. 6A shows a laser irradiation focus 8 shown in FIG.
FIG. 6B is a plan view of the semiconductor device after being cut by irradiating the semiconductor device with a laser, and FIG. 6B is a cross-sectional view taken along the line FF of FIG. In FIG. 6, two interlayer insulating films 4 are sandwiched between adjacent fuse wires, that is, an upper layer wire 5 and a lower layer wire 6, so that the two interlayer insulating films 4 serve as walls and the laser Irradiation has less influence on adjacent wirings (upper wiring 5 and lower wiring 6) than when adjacent wirings of the same layer are arranged adjacently (FIGS. 9 and 10).

Therefore, the laser irradiation can be intensified, and the wiring to be cut (the upper wiring 5 or the lower wiring 6) can be completely cut without leaving it on the interlayer insulating film 4.

Further, even if the laser irradiation is intensified, the two interlayer insulating films 4 serve as a protective wall, so that the scattered wiring (upper wiring 5 or lower wiring 6) after cutting is minimized. There is no possibility of being electrically connected to the adjacent wiring (the upper wiring 5 and the lower wiring 6). In this case, in the other embodiment of the present invention, since the two interlayer insulating films 4 are used as the protective walls, these effects can be more easily obtained than in the embodiment of the present invention.

Therefore, it is possible to make the interval between the fuse wires (the interval between the upper interconnect 5 and the lower interconnect 6) narrower than the case where the wires of the same layer are arranged adjacently (FIGS. 11 and 12). And the area required for the fuse is also reduced.

As described above, the adjacent fuse wiring, that is, between the upper wiring 2 and the wiring 3 of the different layer, or the upper wiring 5
By interposing one or more interlayer insulating films 4 between the semiconductor device and the lower wiring 6, the interval between the fuses can be reduced,
Since the area of the fuse can be reduced,
The success rate of cutting by laser irradiation can be improved without securing a wide fuse interval.

[0034]

As described above, according to the present invention, in a semiconductor device including a fuse wiring for switching a defective circuit to a redundant circuit, the fuse wiring is replaced by an upper wiring.
By using a different layer of wiring formed below the upper layer wiring with one or more interlayer insulating films interposed therebetween, the success rate of cutting by laser irradiation can be improved without securing a wide fuse interval. There is an effect that can be.

[Brief description of the drawings]

FIG. 1A is a plan view of a semiconductor device according to one embodiment of the present invention, and FIG. 1B is a cross-sectional view taken along line AA in FIG.

FIG. 2A is a plan view of a semiconductor device having a fuse before cutting according to an embodiment of the present invention, and FIG.
It is sectional drawing which follows the B line.

3A is a plan view of the semiconductor device after cutting by irradiating a laser to a laser irradiation focus shown in FIG. 2, and FIG. 3B is a cross-sectional view taken along line CC of FIG.

4A is a plan view of a semiconductor device according to another embodiment of the present invention, and FIG. 4B is a cross-sectional view taken along the line DD in FIG.

FIG. 5A is a plan view of a semiconductor device having a fuse before cutting according to another embodiment of the present invention, and FIG. 5B is a cross-sectional view taken along line EE of FIG.

6A is a plan view of the semiconductor device after the laser irradiation focus shown in FIG. 5 is cut by irradiating the laser irradiation focus, and FIG. 6B is a cross-sectional view taken along the FF line of FIG.

FIG. 7 is a plan view of a conventional semiconductor device having a fuse before cutting.

FIG. 8 is a plan view of a conventional semiconductor device after a fuse is cut.

FIG. 9A is a plan view of a conventional semiconductor device having a fuse before cutting, and FIG. 9B is a cross-sectional view taken along line GG of FIG. 9A.

10A is a plan view of a conventional semiconductor device after a fuse is cut, and FIG. 10B is a cross-sectional view taken along line HH in FIG. 10A.

11A is a plan view of a conventional semiconductor device after a fuse is cut, and FIG. 11B is a cross-sectional view taken along line II of FIG.

FIG. 12A is a plan view of a conventional semiconductor device after a fuse is cut, and FIG. 12B is a cross-sectional view taken along the line JJ of FIG.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Fuse opening part 2, 5 Upper layer wiring 3 Different layer wiring 4 Interlayer insulating film 6 Lower layer wiring 8 Laser irradiation focus

Claims (6)

(57) [Claims] 1. A semiconductor device including a fuse wiring.
Te, the wiring of the first layer to form the fuse wire, wherein
The wiring of the second layer which is formed on the wiring different from the layer of the first layer as a fuse wire, the second layer and the wiring of the first layer
Are alternately adjacent to each other, and the wiring of the first layer and the second
Wherein a has an, at least one or more layers of an interlayer insulating film formed between the layer of wires. 2. A semiconductor device including a fuse wiring.
An upper wiring for forming the fuse wiring;
An error formed as the fuse wiring below the wiring
Between the upper layer wiring and the different layer wiring.
A semiconductor device having at least one or more interlayer insulating films formed, wherein the fuse wiring is formed such that the upper wiring and the wiring of the different layer are alternately arranged. 3. A fuse opening for irradiating a laser beam for cutting to the fuse wiring, wherein the upper wiring and the wiring of the different layer are alternately arranged when viewed from the fuse opening side. 3. The semiconductor device according to claim 2 , wherein the semiconductor device is formed as described above. 4. A method of manufacturing a semiconductor device including a fuse wiring.
A wiring of a first layer on the interlayer insulating film as the fuse wiring
Forming a first step, and forming the interlayer on the wiring of the first layer.
A second step of forming at least one or more insulating films;
A second layer on the interlayer insulating film formed on at least one layer of
Forming a third wiring as the fuse wiring;
And in the first step and the third step, the first step
So that the wiring of the layer and the wiring of the second layer are alternately adjacent to each other.
A method of manufacturing a semiconductor device, comprising: 5. A method of manufacturing a semiconductor device including a fuse wiring.
A first wiring layer on the interlayer insulating film as the fuse wiring
Forming a first step, and forming the interlayer on the first wiring layer;
A second step of forming at least one or more insulating films;
A second layer formed on at least one layer of the interlayer insulating film.
A third step of forming a wiring layer as the fuse wiring;
Having the first and third steps in the first and third steps.
The second wiring layer is to be formed in parallel dance alternately
A method for manufacturing a semiconductor device, comprising: 6. A fuse for cutting a fuse wiring,
Fourth forming a fuse opening for irradiating the light
And wherein in the first and third steps,
The first and second arrangements as viewed from the fuse opening side.
The feature is that the line layers are formed alternately.
The method for manufacturing a semiconductor device according to claim 7, wherein