TWM629638U - Cabinet and heat-dissipating door panel thereof - Google Patents

Abstract

The present application relates to a cabinet and its cooling door panel. The heat dissipation door panel is arranged on the main body of the cabinet and includes a first plate body, a plurality of heat dissipation fins and a heat dissipation coil assembly. A plurality of heat dissipation fins are disposed on one side of the first plate body adjacent to the cabinet body and have a heat dissipation surface. The heat dissipation coil assembly is arranged on one side of the first plate body adjacent to the cabinet main body and includes a water inlet, a water outlet and a plurality of heat dissipation coils. One end of the water inlet and one end of the water outlet are respectively in fluid communication with the cooling system. Two ends of each of the plurality of heat dissipation coils are in fluid communication with the water inlet and the water outlet respectively, and have a plurality of extension sections and at least one connection section. The plurality of extension segments pass through the plurality of heat dissipation surfaces in sequence. At least one connecting segment is connected to one end located on the same side of two adjacent extending segments.

Description

Cabinet and its cooling door panel

The present application relates to a cabinet and a heat-dissipating door panel thereof, in particular to a heat-dissipating door panel that can effectively dissipate heat and is applied to a cabinet.

In order to provide users with more convenient services, the number of central processing units (Central Processing Units, CPUs) disposed in the server is increasing, or at least the computing power is getting better and better. In addition, the number and/or performance of components such as Graphics Processing Unit (GPU), hard disk, power supply, memory, etc. in the server is also increasing day by day. However, an increase in the number of components and/or an increase in performance also results in a large amount of waste heat. In order to allow a large number of servers stacked in a rack to operate in a normal working environment, a water cooling system is generally used today to quickly remove the heat generated by the servers (especially the central processing unit (CPU)) during operation. For example, a part of the water cooling system is inserted into the cooling door of the cabinet to exchange heat with the central processing unit in the server. However, the current water cooling system only exchanges heat with the central processing unit through the cold water pipe disposed in the cooling door panel, and the contact area thereof is small, resulting in low heat exchange efficiency. In addition, the single-path cold water pipe will also cause the heat transfer carrier (ie, the fluid in the pipeline) to absorb a large amount of heat and increase the temperature near the water inlet, so that it is difficult to absorb heat near the water outlet due to insufficient temperature difference. As a result, the cooling process of the entire cabinet is not stable, and also produces a situation of zonal cooling (for example, showing a significant temperature gradient). Therefore, how to provide a heat dissipation door panel capable of reducing the temperature difference between various areas of the cabinet and having excellent heat dissipation efficiency has become an urgent problem to be solved in the art.

Embodiments of the present application provide a cabinet and a heat dissipation door panel thereof, which solve the problem that the current cabinet is difficult to effectively dissipate heat and generates a temperature gradient.

In order to solve the above technical problems, this application is implemented as follows:

In a first aspect, a heat dissipation door panel of a cabinet is provided, which is disposed on a cabinet body and includes a first plate body, a plurality of heat sinks, and a heat dissipation coil assembly. A plurality of heat sinks are disposed on one side of the first plate body adjacent to the cabinet body, and each of the plurality of heat sinks has a heat dissipation surface. The heat dissipation coil assembly is arranged on one side of the first plate body adjacent to the cabinet main body, and the heat dissipation coil assembly includes a water inlet, a water outlet and a plurality of heat dissipation coils. One end of the water inlet is in fluid communication with the heat dissipation system; one end of the water outlet is in fluid communication with the heat dissipation system. The two ends of each of the plurality of heat dissipation coils are respectively in fluid communication with the water inlet and the water outlet, and each of the plurality of heat dissipation coils has a plurality of extension sections and at least one connecting section, and the plurality of extension sections pass through in sequence. Through the plurality of heat dissipation surfaces, at least one connecting segment is connected to one end located on the same side of two adjacent extending segments.

In some embodiments, the heat dissipation surface is orthogonal to the plurality of extensions.

In some embodiments, the plurality of cooling fins directly contact the plurality of cooling coils.

In some embodiments, a plurality of heat dissipation coils are sequentially arranged on the first plate body along a vertical direction.

In some embodiments, the water outlet and the water inlet are located on a side of the first plate body adjacent to the ground or a side away from the ground.

In some embodiments, the heat dissipation door panel of the cabinet further includes a plurality of fans, and the plurality of fans are disposed between the heat sink and the cabinet body or outside the first plate body, and correspond to the plurality of heat sinks.

In some embodiments, the heat dissipation door panel of the cabinet further includes a roller, and the roller is disposed on a side of the first panel body adjacent to the ground.

In some embodiments, the heat dissipation door panel of the cabinet further includes a second panel body, the second panel body is located between the cabinet body and the first panel body, and an accommodating space is formed between the second panel body and the first panel body, a plurality of A heat dissipation coil and a plurality of heat dissipation fins are located in the accommodating space.

In some embodiments, the first plate body and the second plate body respectively have a plurality of air holes.

In a second aspect, a cabinet is provided, which includes a cabinet body and the heat dissipation door panel of the cabinet according to the first aspect, and the heat dissipation door panel is disposed on the cabinet body.

In the present application, by passing the heat dissipation coils of the heat dissipation coil assembly through a plurality of heat sinks in sequence, the present application changes the heat dissipation path from the existing "central processing unit (CPU) directly connected to the heat dissipation coil" to "central processing unit (CPU) directly connected to the heat dissipation coil". The unit (CPU) is connected to the cooling coil through a plurality of cooling fins.” In this way, the present application can greatly increase the heat dissipation area by means of a plurality of heat dissipation fins, thereby obtaining an excellent heat dissipation effect. In addition, due to the provision of a plurality of heat dissipation coils, the present application can divide the entire heat dissipation door panel into a plurality of sections and perform heat exchange with the corresponding central processing unit (CPU). In this way, the present application also solves the problem that the cold water pipe with a single path in the prior art has a significant temperature gradient. Based on the above arrangement, the present application realizes a heat dissipation door panel for a cabinet with excellent heat dissipation effect and no obvious temperature gradient.

In order to facilitate the understanding of the technical features, content and advantages of the present application and the effects that can be achieved, the present application is described in detail as follows with the accompanying drawings and in the form of embodiments, and the drawings used therein are only for the purpose For the purpose of illustrating and assisting the description, it may not necessarily be the actual scale and exact configuration after the application is implemented. Therefore, the proportion and configuration relationship of the attached drawings should not be interpreted or limited to the scope of the right of the application in actual implementation. Say Ming.

Unless otherwise defined, all terms (including technical and scientific terms) used herein have the meaning as commonly understood by one of ordinary skill in the art to which this application belongs. It will be further understood that terms such as those defined in commonly used dictionaries should be construed as having meanings consistent with their meanings in the context of the related art and this application, and are not to be construed as idealized or excessive Formal meaning unless expressly so defined herein.

Please refer to FIG. 1 , which is a schematic diagram of a cabinet and a heat dissipation door panel thereof according to an embodiment of the present application. As shown in the figure, the cabinet includes a heat dissipation door panel 1 and a cabinet body 2 , and the heat dissipation door panel 1 is disposed on the cabinet body 2 . In this application, the term "cabinet" refers to a carrier device in which servers are disposed. For example, the cabinet may be a server carrying device located in a computer room, and the server may include but not limited to components such as central processing units, graphics processing units, hard disks, power supplies, and memory. However, the present application is not limited to the installation location of the cabinet. By arranging the heat dissipation door panel 1 on the cabinet body 2 , each heat dissipation component in the heat dissipation door panel 1 can effectively dissipate the heat outside the heat dissipation door panel 1 , so that the cabinet body 2 can maintain a stable working temperature. In order to make the technical features of the present application clearer and easier to understand, the operation of the heat dissipation door panel 1 and the details of each element in the heat dissipation door panel 1 will be explained in detail below.

Please refer to FIG. 2 , which is an exploded view of a heat dissipation door panel according to an embodiment of the present application. As shown in the figure, the heat dissipation door panel 1 includes a first plate body 10 , a plurality of heat dissipation fins 11 and a heat dissipation coil assembly 12 . In some embodiments, the first plate body 10 may be a flat door plate on which a plurality of cooling fins 11 and a cooling coil assembly 12 are disposed. However, the present application is not limited thereto. In some embodiments, the first plate body 10 may also have a concave accommodating space S, and a plurality of heat sinks 11 , the cooling coil assembly 12 and other components mentioned later are disposed in the accommodating space S middle.

In some embodiments, the heat dissipation door panel 1 may further include a second panel body 13 , and the second panel body 13 is located between the cabinet body 2 and the first panel body 10 (as shown in FIG. 1 ). An accommodating space S is formed between the second plate body 13 and the first plate body 10 , and the heat dissipation coil assembly 12 and the plurality of radiating fins 11 are disposed in the accommodating space S. With the first plate body 10 and the second plate body 13 covering the heat dissipation coil assembly 12 and the plurality of heat dissipation fins 11 , these heat dissipation assemblies can be effectively protected to prolong the service life of the device.

It is worth mentioning that the heat dissipation door panel 1 of the present application is composed of a door panel for carrying heat dissipation components (eg, the heat sink 11 and the heat dissipation coil assembly 12 , etc.) and the heat dissipation components therein. Therefore, door panels (for example, the above-mentioned first panel body 10 or the combination of the first panel body 10 and the second panel body 13 ) well-known to those skilled in the art can be applied in the present application . In the following, the heat dissipation door panel 1 including the first plate body 10 and the second plate body 13 will be used as an example for description, but the present application is not limited to this.

A plurality of heat sinks 11 are disposed on a side of the first plate body 10 adjacent to the cabinet body 2 , and each of the plurality of heat sinks 11 has a heat dissipation surface 110 . More specifically, each heat sink 11 has two heat dissipation surfaces 110 corresponding to each other, and the distance between the two heat dissipation surfaces 110 is the thickness T of the heat sink 11 . Wherein, the thickness T of the heat sink 11 may be determined according to actual use requirements. When the thickness T of the heat sink 11 is large, the heat capacity of the heat sink 11 is increased and the heat dissipation effect can be improved. On the contrary, when the thickness T of the heat sink 11 is smaller, the volume occupied by the heat sink 11 decreases, so that more heat sinks 11 can be accommodated in the first plate body 10 .

In some embodiments, the length of each heat sink 11 in the vertical direction is the height H of the heat sink 11 . Wherein, the height H of the heat sink 11 can be determined according to actual use requirements. When the height H of the heat sink 11 is large, the heat capacity of the heat sink 11 is increased, and the heat dissipation effect can be improved. It is worth mentioning that the height H of the heat sink 11 is preferably less than or equal to the length of the first plate body 10 in the vertical direction, so as to avoid being exposed by the first plate body 10 .

In some embodiments, the length of each heat sink 11 in a direction away from the first plate body 10 is the width W of the heat sink 11 . Wherein, the width W of the heat sink 11 can be determined according to actual use requirements. When the width W of the heat sink 11 is larger, the heat capacity of the heat sink 11 is increased and the heat dissipation effect can be improved. It is worth mentioning that when the heat dissipation door panel 1 has the first plate body 10 and the second plate body 13 at the same time, the width W of the heat sink 11 is less than or equal to the inner surface of the first plate body 10 (the surface away from the external environment) and the The distance between the inner side surfaces of the second plate body 13 (the surface away from the cabinet main body 2 ).

In some embodiments, the plurality of cooling fins 11 are orthogonal to the inner surface of the first plate body 10 and are sequentially arranged on the first plate body 10 along the horizontal direction. Besides, the plurality of heat sinks 11 may also be orthogonal to the ground. It is worth mentioning that the term "orthogonal" used in this application means that two elements (for example, the plurality of heat sinks 11 and the first plate body 10) are substantially perpendicular to each other, which covers two elements. Unexpected situations such as small angles (eg, 0.1 degrees to 5 degrees) of components are generated due to tolerances or the assembly process.

In some embodiments, the plurality of heat dissipation fins 11 may form a specific angle other than 0 degrees with the inner surface of the first plate body 10, and/or the plurality of heat dissipation fins 11 may be along a specific angle different from the horizontal direction The directions are sequentially arranged on the first plate body 10 . By arranging a plurality of heat sinks 11 with specific angles and/or specific directions, the heat dissipation door panel 1 of the present application can have more diverse configurations, so as to be applied to cabinet bodies 2 of different types, shapes and sizes, and realize The same excellent cooling effect. It is worth mentioning that the plurality of heat sinks 11 may have two or more specific angles or two or more specific directions at the same time, and should not be limited to one specific angle or one specific direction.

In some embodiments, there may be a specific separation distance D between two adjacent heat sinks 11 . Wherein, the distance D between two adjacent heat sinks 11 in each group may be the same or different. In the present application, the term "separation distance D" refers to the distance between one side surface of the heat sink 11 and the side surface of the adjacent heat sink 11 on the same side. For example, the separation distance D between two adjacent heat sinks 11 in each group may be the first length. By setting the distance D between two adjacent radiating fins 11 in each group to be the same, it is possible to prevent the cabinet body 2 from having a significant temperature gradient in the horizontal direction. However, the present application is not limited to the above-mentioned manner. In other embodiments, when more central processing units (CPUs) are stacked in the central area of the cabinet body 2, the distance D between the two adjacent heat sinks 11 in each group of the present application may be the first length or second length. Wherein, the first length is smaller than the second length. Further, the distance D between the two adjacent heat sinks 11 located in the central area of the first plate body 10 is the first length, and the distance D between the two adjacent heat sinks located in the peripheral area of the first plate body 10 is the first length. The separation distance D between 11 is the second length. In this way, the heat dissipation effect of the central area of the first plate body 10 can be effectively enhanced by arranging the heat dissipation fins 11 with higher density in the central area.

In some embodiments, the plurality of heat sinks 11 may be fixed on the inner surface of the first plate body 10 by means of bonding, fitting, locking, etc., which are well known to those skilled in the art. For example, the inner surface of the first plate body 10 may be recessed with a plurality of engaging grooves, and the thickness T of the engaging grooves may be similar to the thickness T of the heat sink 11 (for example, it may be the same as or slightly smaller than that of the heat sink 11 ). ). The heat sink 11 can be stably fixed on the first plate body 10 by means of clamping or interference fit. It is worth mentioning that the above-mentioned manners are only examples, and other setting manners may also be adopted in the present application, or two setting manners may be combined to obtain a more excellent fixing effect.

In some embodiments, when the heat dissipation door panel 1 has both the first plate body 10 and the second plate body 13 , the plurality of heat sinks 11 can be simultaneously fixed to the first plate body by the above-mentioned method or other suitable methods. 10 and the second plate body 13 to obtain an excellent fixing effect. For example, a plurality of heat sinks 11 can be connected to the first plate body 10 and the second plate body 13 in a clamping manner at the same time. Alternatively, the plurality of heat sinks 11 may be connected to the first plate body 10 by means of clamping, and connected to the second plate body 13 by means of adhesion.

In some embodiments, a plurality of heat sinks 11 may be provided with thermally conductive coatings. For example, pure metals, alloys, ceramics, or composite materials containing the above-mentioned materials can be provided on the heat dissipation surfaces 110 of the plurality of heat sinks 11 by means of electroplating, sputtering, evaporation, coating, etc. or other suitable materials to further improve the thermal conductivity of the plurality of heat sinks 11 .

Please refer to FIG. 2 and FIG. 3 together. FIG. 3 is a schematic diagram of a fluid path according to an embodiment of the present application. As shown in the figure, the heat dissipation coil assembly 12 is disposed on the side of the first plate body 10 adjacent to the cabinet body 2 , and the heat dissipation coil assembly 12 includes a water inlet 120 , a water outlet 121 and a plurality of heat dissipation coils 122 . One end of the water inlet 120 is in fluid communication with the heat dissipation system. One end of the water outlet 121 is in fluid communication with the heat dissipation system. In the present application, the cooling system may be the cooling system of the building (eg, cooling water tower), or may be an independent cooling main unit (Cooling Distribution Unit, CDU), which is used to drive the heat transfer fluid to circulate in the cooling coil assembly 12 flow. However, the present application is not limited to the above-mentioned devices, and cooling devices and cooling systems known to those with ordinary knowledge in the technical field can be applied to the present application.

In the present application, the positions of the water outlet 121 and the water inlet 120 may be determined according to the position of the cooling door panel 1 . In order to reduce the length/volume of the connecting pipeline in the cooling system, the water outlet 121 and the water inlet 120 are preferably arranged on the side of the cooling door panel 1 adjacent to the ceiling or the ground, so that the pipes in the cooling system are arranged along the ceiling or the ground. The pipeline can be as close to the water outlet 121 and the water inlet 120 as possible.

In some embodiments, the water outlet 121 and the water inlet 120 are located on a side of the first plate body 10 adjacent to the ground. More specifically, the openings of the water outlet 121 and the water inlet 120 may be orthogonal to the ground. By arranging the water outlet 121 and the water inlet 120 adjacent to the ground and orthogonal to the ground, the total length of the connecting pipeline connected to the cooling coil assembly 12 can be effectively reduced. Based on the above configuration, the present application can further improve the space utilization of the entire device.

In some embodiments, the water outlet 121 and the water inlet 120 are located on a side of the first plate body 10 away from the ground. More specifically, the openings of the water outlet 121 and the water inlet 120 may be adjacent to the ceiling of the equipment room, so that the connecting pipeline connected to the cooling coil assembly 12 extends from the ceiling to the cooling system.

The two ends of each of the plurality of heat dissipation coils 122 are respectively in fluid communication with the water inlet 120 and the water outlet 121, and each of the plurality of heat dissipation coils 122 has a plurality of extension sections 1220 and at least one connecting section 1221, a plurality of The extending sections 1220 pass through the plurality of heat dissipation surfaces 110 in sequence, and at least one connecting section 1221 is connected to one end located on the same side of two adjacent extending sections 1220 . More specifically, the number of the plurality of extension segments 1220 may be N, and the number of the connecting segments 1221 may be N−1. For example, the number of the plurality of extension segments 1220 may be three, and the number of the connecting segments 1221 may be two. Alternatively, the number of the plurality of extension segments 1220 may be five, and the number of the connecting segments 1221 may be four. It is worth mentioning that the two ends of each extending section 1220 are respectively connected to a connecting section 1221/water inlet 120/water outlet 121, so that the entire cooling coil 122 has only one flow path.

In some embodiments, the thermally conductive fluid flowing in the cooling coil assembly 12 may be water, an aqueous glycol solution, or a compatible coolant. Preferably, the heat transfer fluid may be ionized water. More preferably, the heat transfer fluid is deionized water added with anti-corrosion inhibitors and bactericides to reduce corrosion, scaling and microbial growth of pipelines, thereby reducing heat dissipation capacity and reliability. Still more preferably, the heat transfer fluid is deionized water that can satisfy the following conditions: Conductivity＜1 uS/cm Aluminum＜0.05 mg/L Potassium＜0.01 mg/L pH pH 6‐8 Antimony＜0.1 mg/L Magnesium＜0.01 mg/L Evaporation residue＜10 mg/L Arsenic＜0.1 mg/L Manganese＜0.01 mg/L Turbidity＜=1.0 NTU Boron＜0.05 mg/L Molybdenum＜0.01 mg/L Chloride such as chlorine <1.0 mg/L Barium＜0.01 mg/L Sodium＜0.02 mg/L Sulfates such as calcium carbonate <0.5 mg/L Calcium＜0.01 mg/L Nickel＜0.01 mg/L Heavy metal (lead) <0.1 ppm Cadmium＜0.01 mg/L Tin＜0.1 mg/L Silica <0.01 ppm Chromium＜0.01 mg/L Zinc＜0.01 mg/L Nitrate＜0.5 mg/L Copper＜0.01 mg/L Nitrite＜0.5 mg/L Iron＜0.01 mg/L

In some embodiments, the temperature of the thermally conductive fluid is in the range of 10°C to 45°C, which needs to be above the ambient dew point. For example, the temperature of the heat transfer fluid can be 10°C, 15°C, 20°C, 25°C, 30°C, 35°C, 40°C, 45°C, or any range of the above values. In practical applications, the temperature of the heat transfer fluid can be adjusted according to the ambient temperature, the condition of the central processing unit (CPU) and/or the properties of the heat transfer fluid.

In some embodiments, the heat dissipation surface 110 is orthogonal to the plurality of extensions 1220 . In other words, the plurality of extension sections 1220 and the heat dissipation surface 110 all form an angle of 90 degrees. However, the present application is not limited thereto. In other embodiments, the plurality of extension sections 1220 and the heat dissipation surface 110 may also have a specific angle other than 90 degrees.

In some embodiments, the plurality of cooling fins 11 directly contact the plurality of cooling coils 122 . In the case where the plurality of heat sinks 11 and the plurality of heat dissipation coils 122 are in contact with each other, the rate of heat conduction can be made faster. In some embodiments, each heat sink 11 may be provided with a plurality of through holes 111 in advance, and each through hole 111 corresponds to an extension 1220 in the heat dissipation coil 122 . Further, the periphery of the through hole 111 and the extension 1220 are in contact with each other, and the contact area between the heat sink 11 and the extension 1220 is proportional to the thickness T of the heat sink 11 (ie, the thickness of the periphery). Therefore, by increasing the thickness T of the heat sink 11 to increase the area of the periphery of the through hole 111 that is in contact with the extending section 1220, the heat conduction rate can be improved more effectively.

In some embodiments, a plurality of heat dissipation coils 122 are sequentially disposed on the first plate body 10 along a vertical direction. By arranging a plurality of heat dissipation coils 122 in sequence, the heat dissipation door panel 1 can be divided into a plurality of heat dissipation areas A. When more heat dissipation sections A are formed, the temperature of the entire heat dissipation door panel 1 will exhibit frequent periodic changes. For example, low temperature (the extension section 1220 of the first heat dissipation coil 122 close to the water inlet 120 ), medium temperature (the extension section 1220 of the first heat dissipation coil 122 close to the water outlet 121 ), low temperature (the extension section 1220 of the first heat dissipation coil 122 close to the water outlet 121 ), The extension section 1220 of the two cooling coils 122 close to the water inlet 120), the middle temperature (the extension section 1220 of the second cooling coil 122 being close to the water outlet 121) . . . In contrast, in the prior art, the entire heat dissipation door panel 1 has only one heat dissipation area A, which will generate a significant temperature gradient. For example, low temperature (the extension section 1220 of the cooling coil 122 close to the water inlet 120 ), medium temperature (the extension section 1220 of the cooling coil 122 secondary to the water inlet 120 ), high temperature (the second extension section 1220 of the cooling coil 122 is close to the water inlet 120 ), The extension section 1220 of the water outlet 121) and the ultra-high temperature (the extension section 1220 of the cooling coil 122 close to the water outlet 121). In contrast, the heat dissipation door panel 1 with a plurality of heat dissipation sections A of the present application can effectively slow down the obvious temperature gradient.

In some embodiments, the heat dissipation door panel 1 further includes a plurality of fans 14 , and the plurality of fans 14 are disposed between the heat sink 11 and the cabinet body 2 and correspond to the plurality of heat sinks 11 . That is, a plurality of fans 14 may be provided in the interior of the cabinet. Specifically, the fan 14 is configured to draw the hot gas in the cabinet body 2 to the outside of the heat dissipation door panel 1 . In this way, the hot gas in the cabinet will be cooled when passing through the heat dissipation coil 122 and the heat dissipation fins 11 , so as to leave the heat dissipation door panel 1 in a low temperature state. Further, the gas outside the heat dissipation door panel 1 will be pushed to move in a direction away from the heat dissipation door panel 1 . In addition, after the air in the cabinet leaves the heat dissipation door panel 1 and moves in a direction away from the heat dissipation door panel 1, the air in the external environment can enter the cabinet body 2 from the side of the cabinet body 2 away from the heat dissipation door panel 1. , to form a good cooling cycle.

In some embodiments, the plurality of fans 14 are disposed outside the first plate body 10 and correspond to the plurality of heat sinks 11 . That is, the plurality of fans 14 may also be externally mounted on the cabinet. In other embodiments, a plurality of fans 14 may also be disposed between the heat sink 11 and the cabinet body 2 and outside the first plate body 10 at the same time, so as to obtain a better suction effect. The operation modes of the plurality of fans 14 are similar or the same as those described above, and will not be repeated here.

In some embodiments, when the heat dissipation door panel 1 of the cabinet further includes a plurality of fans 14 , the first plate body 10 and the second plate body 13 respectively have a plurality of air holes. By arranging the air holes, the hot air in the cabinet is more easily driven by the fan 14 and leaves the cabinet through the heat dissipation door panel 1 . In some embodiments, in order to improve the stability of the intake air, the plurality of air holes are spaced apart from each other by a fixed distance. In some embodiments, in order to improve the local heat dissipation effect, the plurality of air holes are spaced apart from each other at different distances. For example, the area that needs to improve the heat dissipation effect may have more air holes correspondingly.

In some embodiments, the cooling door panel 1 of the cabinet further includes a roller 15 , and the roller 15 is disposed on a side of the first panel body 10 adjacent to the ground. Since a large number of heat dissipation components such as heat dissipation coils 122 and heat dissipation fins 11 are provided in the heat dissipation door panel 1 of the present application, it is bound to have a certain weight. Therefore, by providing the rollers 15, the heat dissipation door panel 1 of the present application can be easily opened or closed. It is worth mentioning that although one roller 15 is shown in the drawings of the present application, the present application is not limited thereto. In other embodiments, the number of the rollers 15 can be two, three or more than three, which can be determined according to the actual usage.

To sum up, by passing the heat dissipation coils of the heat dissipation coil assembly through a plurality of heat sinks in sequence, the present application changes the heat dissipation path from the existing "central processing unit (CPU) directly connected to the heat dissipation coil" to "central processing unit (CPU) directly connected to the heat dissipation coil". The unit (CPU) is connected to the cooling coil through a plurality of cooling fins.” In this way, the present application can greatly increase the heat dissipation area by means of a plurality of heat dissipation fins, thereby obtaining an excellent heat dissipation effect. In addition, due to the provision of a plurality of heat dissipation coils, the present application can divide the entire heat dissipation door panel into a plurality of sections and perform heat exchange with the corresponding central processing unit (CPU). In this way, the present application also solves the problem that the cold water pipe with a single path in the prior art has a significant temperature gradient. Based on the above arrangement, the present application realizes a heat dissipation door panel for a cabinet with excellent heat dissipation effect and no obvious temperature gradient.

However, the above descriptions are only examples of the present application, and are not intended to limit the scope of implementation of the present application. For example, all equivalent changes and modifications made according to the shape, structure, characteristics and spirit described in the scope of the patent application of the present application, All should be included in the scope of the patent application of this application.

1: Cooling door panel 10: The first board body 11: heat sink 110: heat dissipation surface 111: Perforation 12: Cooling coil assembly 120: water inlet 121: water outlet 122: cooling coil 1220: Extension 1221: Connection segment 13: Second board body 14: Fan 15: Roller 2: Cabinet body A: Heat dissipation area D: separation distance H: height S: accommodating space T: Thickness W: width

FIG. 1 is a schematic diagram of a cabinet and a heat dissipation door panel thereof according to an embodiment of the application; FIG. 2 is an exploded view of a heat dissipation door panel according to an embodiment of the application; and FIG. 3 is a schematic diagram of a fluid path according to an embodiment of the present application.

10: The first board body

11: heat sink

110: heat dissipation surface

111: Perforation

12: Cooling coil assembly

13: Second board body

14: Fan

15: Roller

D: separation distance

H: height

S: accommodating space

T: Thickness

W: width

Claims (10)

A cooling door panel of a cabinet, which is arranged on a cabinet main body and includes: a first plate body; a plurality of heat sinks disposed on a side of the first plate body adjacent to the cabinet body, and each of the plurality of heat sinks has a heat dissipation surface; and A heat dissipation coil assembly is disposed on one side of the first plate body adjacent to the cabinet body, and the heat dissipation coil assembly includes: a water inlet, one end of which is fluidly connected to a cooling system; a water outlet, one end of which is in fluid communication with the cooling system; and A plurality of heat dissipation coils, the two ends of each of the plurality of heat dissipation coils are respectively in fluid communication with the water inlet and the water outlet, and each of the plurality of heat dissipation coils has a plurality of extension sections and at least one A connecting section, the plurality of extension sections pass through the plurality of the heat dissipation surfaces in sequence, and the at least one connecting section is connected to one end of two adjacent extension sections located on the same side. The heat dissipation door panel of a cabinet as claimed in claim 1, wherein the heat dissipation surface is orthogonal to the plurality of extension sections. The heat dissipation door panel of the cabinet according to claim 1, wherein the plurality of heat dissipation fins directly contact the plurality of heat dissipation coils. The heat dissipation door panel of a cabinet according to claim 1, wherein the plurality of heat dissipation coils are sequentially arranged on the first panel body along a vertical direction. The cooling door panel of a cabinet according to claim 1, wherein the water outlet and the water inlet are located on a side of the first panel body that is adjacent to the ground or a side away from the ground. The heat dissipation door panel of the cabinet according to claim 1, further comprising a plurality of fans, the plurality of fans are arranged between the plurality of heat sinks and the cabinet body or outside the first plate body, and correspond to the a plurality of heat sinks. The cooling door panel of the cabinet according to claim 1, further comprises a roller, and the roller is disposed on one side of the first panel body adjacent to the ground. The cooling door panel of a cabinet according to claim 1, further comprising a second panel body, the second panel body is located between the cabinet body and the first panel body, and the second panel body and the first panel body are located between the cabinet body and the first panel body. An accommodating space is formed therebetween, and the plurality of cooling coils and the plurality of cooling fins are located in the accommodating space. The cooling door panel of a cabinet as claimed in claim 8, wherein the first panel body and the second panel body respectively have a plurality of air holes. A cabinet comprising: a cabinet body; and The cooling door panel of the cabinet according to any one of claims 1 to 9, which is arranged on the cabinet body.

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