TWM622708U - Laser apparatus - Google Patents
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- TWM622708U TWM622708U TW110212677U TW110212677U TWM622708U TW M622708 U TWM622708 U TW M622708U TW 110212677 U TW110212677 U TW 110212677U TW 110212677 U TW110212677 U TW 110212677U TW M622708 U TWM622708 U TW M622708U
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/02—Constructional details
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
- B23K26/382—Removing material by boring or cutting by boring
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/42—Printed circuits
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- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Electromagnetism (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Lasers (AREA)
- Laser Beam Processing (AREA)
Abstract
[課題]本新型提供一種雷射裝置,其能夠維持穩定之光束輪廓。 [解決手段]在雷射光束所通過之光束路徑配置有光學零件。送風機使在內部包含光學零件之空間產生大氣流動。 [Subject] The present invention provides a laser device capable of maintaining a stable beam profile. [Solution] Optical parts are arranged in the beam path through which the laser beam passes. The blower creates an atmospheric flow in the space containing the optical components inside.
Description
本新型有關雷射裝置。This new type relates to a laser device.
公知有在具有氣密性之雷射光束傳送通路本體內充滿非吸收性氣體之雷射光束傳送通路(專利文獻1)。專利文獻1中所揭示之傳送通路本體具有沿著雷射光束的傳播路徑之形狀,且具有氣密性。傳送通路本體的靠近起點處設置有非吸收性氣體的入口,靠近終點處設置有出口。 [先前技術文獻] [專利文獻] There is known a laser beam transmission channel in which a non-absorptive gas is filled in an airtight laser beam transmission channel main body (Patent Document 1). The transmission path body disclosed in Patent Document 1 has a shape along the propagation path of the laser beam and is airtight. An inlet of the non-absorbable gas is arranged near the starting point of the conveying passage body, and an outlet is arranged near the end point. [Prior Art Literature] [Patent Literature]
[專利文獻1]日本特開昭59-206804號專利公報[Patent Document 1] Japanese Patent Laid-Open No. 59-206804
[新型欲解決之課題][The new problem to be solved]
通常將雷射光束用於印刷配線基板的鑽孔加工等時,在雷射光束的路徑配置有透鏡、孔口等光束輪廓調整機構。在氣密性高的傳送通路本體的內部難以將該等光束輪廓調整機構進行光軸調整而配置。依據基於本申請的新型人等之實驗,判明出在把雷射光束的傳播路徑作為不具有氣密性之開放的空間的情況下,有時無法得到穩定之光束輪廓。Generally, when a laser beam is used for drilling processing of printed wiring boards, etc., a beam profile adjustment mechanism such as a lens and an aperture is arranged in the path of the laser beam. It is difficult to arrange these beam profile adjustment mechanisms to adjust the optical axis inside the airtight transmission channel main body. According to the experiments of the present inventors and others, it has been found that a stable beam profile may not be obtained when the propagation path of the laser beam is an open space without airtightness.
本新型的目的為提供一種能夠維持穩定之光束輪廓之雷射裝置。 [解決課題之手段] The purpose of the present invention is to provide a laser device capable of maintaining a stable beam profile. [Means of Solving Problems]
依據本新型的一觀點,提供一種雷射裝置,具有: 光學零件,其係配置於雷射光束所通過之光束路徑;以及 送風機,其係使在內部包含前述光學零件之空間產生大氣流動。 [新型效果] According to an aspect of the present invention, a laser device is provided, which has: Optical components disposed in the beam path through which the laser beam passes; and The blower generates air flow in the space containing the optical components. [new effect]
藉由將包含於光學零件的內部之空間設為大氣狀態,由於無需維持氣密性,故能夠輕易地進行光學零件的光軸調整。又,藉由使產生大氣流動,能夠使光束輪廓時間性穩定化。By setting the space included in the inside of the optical component into an atmospheric state, since it is not necessary to maintain airtightness, the optical axis adjustment of the optical component can be easily performed. In addition, by generating atmospheric flow, the beam profile can be stabilized temporally.
參閱圖1~圖3B,對基於實施例之雷射裝置進行說明。
圖1是基於實施例之雷射裝置的概略圖。雷射振盪器10輸出雷射光束。作為雷射振盪器10,能夠使用輸出實質上不被大氣吸收之波長區域的雷射光束之雷射振盪器,例如二氧化碳雷射振盪器等。
Referring to FIGS. 1 to 3B , the laser device according to the embodiment will be described.
FIG. 1 is a schematic diagram of a laser device according to an embodiment. The
從雷射振盪器10輸出之雷射光束的光束路徑上配置有光束擴展器11、反射鏡12、14、16、孔口13、分支光學系統15等的光學零件。光束擴展器11使從雷射振盪器10輸出之雷射光束的光束直徑及發散角產生變化。通過了光束擴展器11之雷射光束,被反射鏡12反射而射入到孔口13。孔口13對雷射光束的光束剖面進行整形。通過了孔口13之雷射光束,被反射鏡14反射而射入到分支光學系統15。自雷射振盪器10至分支光學系統15的光束路徑與水平面幾乎平行。Optical components such as a beam expander 11 ,
分支光學系統15使經射入之雷射光束分支成2條光束路徑。作為分支光學系統15,能夠使用半透明反射鏡、偏光分束器等。The branch
射入到反射鏡12之雷射光束的一部分,透過反射鏡12而射入到光檢測器19。光檢測器19輸出與射入之雷射光束的光強度對應之電訊號。利用光檢測器19檢測出的檢測結果例如用於向雷射振盪器10的回饋、雷射振盪器10的動作的正常性的確認等。A part of the laser beam incident on the
利用分支光學系統15分支而傳播其中一個光束路徑(朝向下方之光束路徑)之雷射光束,經由光束掃描器17A及透鏡18A,而射入到加工對象物20A。傳播另一個光束路徑(朝向水平方向之光束路徑)之雷射光束,被反射鏡16朝向下方反射之後,經由光束掃描器17B及透鏡18B,而射入到加工對象物20B。光束掃描器17A、17B例如包含一對電流計鏡,具有沿2維方向掃描脈衝雷射光束之功能。透鏡18A、18B分別將脈衝雷射光束聚光到加工對象物20A、20B的表面。另外,亦可以構成為將孔口13成像於加工對象物20A、20B的表面。The laser beam branched by the branch
加工對象物20A、20B例如是印刷配線基板,且被保持於載臺21的保持面。例如,藉由將脈衝雷射光束射入到印刷配線基板,進行鑽孔加工。載臺21的保持面例如為水平。載臺21能夠使加工對象物20A、20B沿水平面內的兩方向移動。作為載臺21,例如能夠使用XY載臺。The objects to be processed 20A and 20B are, for example, printed wiring boards, and are held on the holding surface of the
送風機30使在內部包含有光束擴展器11、反射鏡12、14、16、孔口13、分支光學系統15、光檢測器19等光學零件之空間,產生大氣流動。作為送風機30,例如能夠使用風扇。藉此,在光束路徑及包含光學零件之空間產生大氣流動。The
圖2A及圖2B分別是基於本實施例之雷射裝置的概略前視圖及概略俯視圖。2A and 2B are a schematic front view and a schematic plan view of the laser device according to the present embodiment, respectively.
光學座25及載臺21被支撐在基座26。在光學座25上支撐有光束擴展器11、反射鏡12、14、16、孔口13、分支光學系統15、光檢測器19等光學零件。在光學座25的下方支撐有光束掃描器17A、17B、透鏡18A、18B。送風機30使在光學座25上的配置有光學零件之空間產生大氣流動。The
接著,對藉由採用基於上述實施例之雷射裝置的構成而得到之優異之效果進行說明。Next, the excellent effect obtained by using the structure of the laser apparatus based on the said Example is demonstrated.
上述實施例中,光束擴展器11、反射鏡12、14、16、孔口13、分支光學系統15、光檢測器19等光學零件配置於光學座25(圖2A、圖2B)上的空間。該空間在大氣中開放,而並非確保氣密性。是故,與在氣密性高的空間配置光學零件之構造相比,能夠輕易地進行各種光學零件的光軸調整等。In the above embodiment, optical components such as beam expander 11,
接著,參閱圖3A及圖3B,對藉由使產生大氣流動而得到之優異之效果進行說明。Next, with reference to FIGS. 3A and 3B , the excellent effect obtained by generating the air flow will be described.
圖3A是表示基於本實施例之雷射裝置的光檢測器19的位置中的光束輪廓的測量結果之灰度圖及圖形。灰度圖的左側及下側的圖形表示分別沿著通過光束剖面的中心之縱方向及横方向的直線之光束輪廓。本實施例中,示於圖3A之光束輪廓時間性穩定而得到。FIG. 3A is a grayscale diagram and a graph showing the measurement result of the beam profile at the position of the
圖3B是表示在不產生大氣流動而將配置有光學零件之空間的大氣幾乎靜止之狀態下測量之光束輪廓之灰度圖及圖形。示於圖3B的左側之光束輪廓與示於右側之光束輪廓之間,光束輪廓與時間的結果一同產生變動。FIG. 3B is a grayscale diagram and a graph showing the beam profile measured in a state where no atmospheric flow is generated and the atmosphere in the space where the optical components are arranged is almost still. Between the beam profile shown on the left side of FIG. 3B and the beam profile shown on the right side, the beam profile varies with the time results.
從示於圖3A及圖3B之測量結果可知,藉由在配置有光學零件之空間產生大氣流動,能夠使光束輪廓穩定化。藉由本申請新型人等的各種評價實驗,可知風速係0.2m/s以下時無法得到使光束輪廓穩定化之充分的效果。另外,可知為了得到使光束輪廓穩定化之充分的效果,將風速設為0.5m/s以上為較佳。As can be seen from the measurement results shown in FIGS. 3A and 3B , the beam profile can be stabilized by generating atmospheric flow in the space where the optical components are arranged. According to various evaluation experiments by the inventors of the present application, it has been found that a sufficient effect of stabilizing the beam profile cannot be obtained when the wind speed is 0.2 m/s or less. In addition, it was found that in order to obtain a sufficient effect of stabilizing the beam profile, it is preferable to set the wind speed to 0.5 m/s or more.
接著,藉由產生大氣流動,對能夠使光束輪廓穩定化之理由進行研究。光束路徑上的大氣藉由雷射光束稍微被加熱。此時,若大氣被停滯,則光束路徑的溫度上升顯著,在大氣中產生密度波動。隨之,光的折射率亦產生變動。光束輪廓由於受到遍及全光束路徑之折射率分布的影響,故認為光束輪廓在時間上、空間上變得不穩定。若本實施例中產生大氣流動,則認為因光束路徑的局部溫度上升而引起之大氣的波動會消失,光束輪廓的時間穩定性提高。Next, the reason why the beam profile can be stabilized by generating atmospheric flow is studied. The atmosphere in the beam path is slightly heated by the laser beam. At this time, when the atmosphere is stagnant, the temperature of the beam path rises significantly, and density fluctuations occur in the atmosphere. Along with this, the refractive index of light also changes. The beam profile is considered to be temporally and spatially unstable due to the influence of the refractive index distribution throughout the entire beam path. If the atmospheric flow is generated in this embodiment, it is considered that the fluctuation of the atmosphere caused by the local temperature rise of the beam path will disappear, and the temporal stability of the beam profile will be improved.
接著,參閱圖4,對基於另一實施例之雷射裝置進行說明。以下,對與基於示於圖1~圖2B之實施例之雷射裝置的構成共同的構成省略說明。Next, referring to FIG. 4 , a laser device based on another embodiment will be described. Hereinafter, the description of the configuration common to the configuration of the laser device based on the embodiment shown in FIGS. 1 to 2B is omitted.
圖4是基於本實施例之雷射裝置的光學室的立體圖。蓋殼27覆蓋光學座25上的光學零件被收容之空間。例如,在俯視下,蓋殼27包括:側壁,其係環繞光學零件被收容之空間;以及頂板,其係堵住側壁的上方。在蓋殼27的側壁安裝有送風機30。在送風機30的大氣進入口安裝有過濾器。在與安裝有送風機30之側壁對置位置之側壁,設置有開口31。FIG. 4 is a perspective view of an optical chamber of the laser device according to the present embodiment. The
送風機30將外部的大氣導入到被蓋殼27圍繞之光學室內。導入到光學室內之大氣在光學室內流動而通過開口31向外部流出。如上所述,送風機30具有對被蓋殼27圍繞之光學室的內部進行換氣之功能。The
接著,對藉由採用基於示於圖4之實施例之雷射裝置的構成而得到之優異之效果進行說明。示於圖4之實施例中,藉由從光學座25拆卸蓋殼27,能夠輕易地進行光學零件的光軸調整。另外,能夠抑制塵屑向配置有光學零件之光學室的侵襲。Next, the excellent effect obtained by using the structure of the laser apparatus based on the Example shown in FIG. 4 is demonstrated. In the embodiment shown in FIG. 4 , by removing the
上述各實施例為例示,能夠進行在不同之實施例中表示之構成的局部替換或組合是不言而喻的。對基於複數個實施例的相同的構成之相同的作用效果未在每個實施例中一一說明。另外,本新型並不限制於上述實施例。例如,能夠進行各種變更、改良、組合等,這對本案新型所屬技術領域中具有通常知識者來講是顯而易見的。The above-described embodiments are examples, and it goes without saying that partial replacement or combination of the configurations shown in different embodiments can be performed. The same functions and effects of the same configuration based on a plurality of embodiments are not described in each embodiment. In addition, the present invention is not limited to the above-mentioned embodiments. For example, it is obvious to those having ordinary knowledge in the technical field to which the present invention pertains that various changes, improvements, combinations and the like can be made.
10:雷射振盪器
11:光束擴展器
12:反射鏡
13:孔口
14:反射鏡
15:分支光學系統
16:反射鏡
17A、17B:光束掃描器
18A、18B:透鏡
19:光檢測器
20A、20B:加工對象物
21:載臺
25:光學座
26:基座
27:蓋殼
30:送風機
31:開口
10: Laser oscillator
11: Beam Expander
12: Reflector
13: Orifice
14: Reflector
15: Branch Optical System
16:
[圖1]圖1是基於實施例之雷射裝置的概略圖。 [圖2]圖2A及圖2B是分別基於示於圖1之實施例之雷射裝置的概略前視圖及概略俯視圖。 [圖3]圖3A是表示基於示於圖1之實施例之雷射裝置的光檢測器的位置中的光束輪廓的測量結果之灰度圖及圖形,圖3B是表示在未產生大氣流動之狀態下測量之光束輪廓的測量結果之灰度圖及圖形。 [圖4]圖4是基於另一實施例之雷射裝置的光學室的立體圖。 [ Fig. 1] Fig. 1 is a schematic diagram of a laser device according to an embodiment. 2A and 2B are a schematic front view and a schematic plan view of the laser device based on the embodiment shown in FIG. 1 , respectively. [ Fig. 3] Fig. 3A is a grayscale diagram and a graph showing a measurement result based on the beam profile in the position of the photodetector of the laser device of the embodiment shown in Fig. 1 , and Fig. 3B is a graph showing a situation where no atmospheric flow is generated. Grayscale images and graphs of the measurement results of the beam profile measured in the state. [ Fig. 4] Fig. 4 is a perspective view of an optical chamber of a laser device according to another embodiment.
10:雷射振盪器 10: Laser oscillator
11:光束擴展器 11: Beam Expander
12:反射鏡 12: Reflector
13:孔口 13: Orifice
14:反射鏡 14: Reflector
15:分支光學系統 15: Branch Optical System
16:反射鏡 16: Reflector
17A,17B:光束掃描器 17A, 17B: Beam Scanner
18A,18B:透鏡 18A, 18B: Lens
19:光檢測器 19: Photodetector
20A,20B:加工對象物 20A, 20B: Object to be processed
21:載臺 21: Carrier
30:送風機 30: Blower
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JP2018-013268 | 2018-01-30 | ||
JP2018013268A JP7309322B2 (en) | 2018-01-30 | 2018-01-30 | laser device |
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TWM622708U true TWM622708U (en) | 2022-01-21 |
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TW107146135A TW201932223A (en) | 2018-01-30 | 2018-12-20 | Laser device using a blower to create an atmospheric flow in the space that contains therein the optical components |
TW110212677U TWM622708U (en) | 2018-01-30 | 2018-12-20 | Laser apparatus |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW107146135A TW201932223A (en) | 2018-01-30 | 2018-12-20 | Laser device using a blower to create an atmospheric flow in the space that contains therein the optical components |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP7309322B2 (en) |
KR (1) | KR20190092253A (en) |
CN (1) | CN110091079A (en) |
TW (2) | TW201932223A (en) |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS55100523A (en) * | 1979-01-29 | 1980-07-31 | Nec Corp | Laser working optical device |
JPS5977585U (en) * | 1982-11-16 | 1984-05-25 | 株式会社東芝 | Laser light transmission equipment |
JPS59206804A (en) * | 1983-05-10 | 1984-11-22 | Mitsubishi Electric Corp | Laser beam transmission line |
JPH057034A (en) * | 1991-06-27 | 1993-01-14 | Komatsu Ltd | Laser equipment |
JP2006032584A (en) * | 2004-07-15 | 2006-02-02 | Fuji Photo Film Co Ltd | Light source and method for fixing the same |
KR100837116B1 (en) * | 2007-05-25 | 2008-06-11 | 주식회사 프로텍 | Handheld laser marking device |
GB0823084D0 (en) * | 2008-12-18 | 2009-01-28 | Renishaw Plc | Laser Apparatus |
CN201677135U (en) * | 2010-04-23 | 2010-12-22 | 包头高源激光科技发展有限公司 | Laser focal head with gas protection device |
JP5506646B2 (en) | 2010-12-03 | 2014-05-28 | 住友重機械工業株式会社 | Laser processing apparatus and optical axis adjustment method |
JP5977585B2 (en) | 2012-05-31 | 2016-08-24 | 任天堂株式会社 | GAME SYSTEM, CONTROL METHOD, PROGRAM, AND TERMINAL DEVICE |
CN104511691B (en) * | 2013-09-29 | 2016-03-30 | 宝山钢铁股份有限公司 | A kind of laser beam outside optical system of laser-beam welding machine |
CN105583518B (en) * | 2016-03-21 | 2017-06-16 | 浙江泰禾激光设备有限公司 | A kind of laser aid and laser processing device |
-
2018
- 2018-01-30 JP JP2018013268A patent/JP7309322B2/en active Active
- 2018-12-20 TW TW107146135A patent/TW201932223A/en unknown
- 2018-12-20 TW TW110212677U patent/TWM622708U/en unknown
- 2018-12-24 KR KR1020180168325A patent/KR20190092253A/en not_active Application Discontinuation
- 2018-12-28 CN CN201811621000.8A patent/CN110091079A/en active Pending
Also Published As
Publication number | Publication date |
---|---|
JP7309322B2 (en) | 2023-07-18 |
KR20190092253A (en) | 2019-08-07 |
TW201932223A (en) | 2019-08-16 |
CN110091079A (en) | 2019-08-06 |
JP2019134008A (en) | 2019-08-08 |
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