TWM622511U - Protective device - Google Patents

Protective device Download PDF

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Publication number
TWM622511U
TWM622511U TW110210497U TW110210497U TWM622511U TW M622511 U TWM622511 U TW M622511U TW 110210497 U TW110210497 U TW 110210497U TW 110210497 U TW110210497 U TW 110210497U TW M622511 U TWM622511 U TW M622511U
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Taiwan
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adhesive
protection
image capturing
image capture
curing process
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TW110210497U
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Chinese (zh)
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潘駿豪
李文樞
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廣達電腦股份有限公司
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Priority to TW110210497U priority Critical patent/TWM622511U/en
Publication of TWM622511U publication Critical patent/TWM622511U/en

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Abstract

A protective device is provided. The protective device is used for a protection device. The protective device includes a strengthening element and a protective element. The strengthening element surrounds at least part of the protection device. The protective element is disposed between the protection element and the strengthening element.

Description

保護裝置protective device

本揭露之一些實施例是有關於保護裝置,特別是有關於影像擷取系統的保護裝置。Some embodiments of the present disclosure relate to protection devices, particularly to protection devices for image capture systems.

隨著科技的發展,影像擷取系統被普遍應用於許多情形。例如,駕駛可在車輛內部或車輛外部安裝影像擷取系統,以擷取影像,進而得知路況。車輛之使用期間通常長達數年甚至十數年,故裝設在車輛的影像擷取系統之可靠度相當重要。然而,車輛在行進過程中可能會產生震動、車輛在進行清潔時可能受到高壓水柱衝擊、車輛之周圍環境之溫度可能有大幅變化等而對影像擷取系統產生不利影響。為了降低影像擷取系統脫落、損壞、失效等之可能性,需要提升影像擷取系統之可靠度。With the development of technology, image capture systems are commonly used in many situations. For example, a driver can install an image capture system inside or outside the vehicle to capture images and then learn the road conditions. The use period of a vehicle is usually several years or even ten years, so the reliability of the image capture system installed in the vehicle is very important. However, the vehicle may vibrate during traveling, the vehicle may be impacted by high-pressure water jets during cleaning, and the temperature of the surrounding environment of the vehicle may change significantly, which may adversely affect the image capture system. In order to reduce the possibility of falling off, damage, and failure of the image capture system, it is necessary to improve the reliability of the image capture system.

本揭露之一些實施例提供一種保護裝置。保護裝置用於一受保護裝置。保護裝置包括一強化元件以及一保護元件。強化元件圍繞受保護裝置之至少一部分設置。保護元件設置於受保護裝置與強化元件之間。Some embodiments of the present disclosure provide a protection device. The protection device is used for a protected device. The protection device includes a strengthening element and a protection element. The reinforcing element is disposed around at least a portion of the protected device. The protection element is arranged between the protected device and the reinforcement element.

在一些實施例中,強化元件為一套筒。在一些實施例中,保護元件為一熱固化膠。在一些實施例中,強化元件之至少部分以及受保護裝置包括相互對應的形狀。在一些實施例中,受保護裝置包括一殼體、一影像擷取元件、一黏著元件,且影像擷取元件透過黏著元件設置於殼體。在一些實施例中,黏著元件被密封在強化元件以及保護元件之內。在一些實施例中,黏著元件為一紫外線固化膠。在一些實施例中,黏著元件經歷一預固化製程以及一固化製程,且保護元件經歷一固化製程,黏著元件之預固化製程包括一光固化製程,而黏著元件之固化製程以及保護元件之固化製程包括一熱固化製程。在一些實施例中,保護元件與影像擷取元件之接觸面積大於黏著元件與影像擷取元件之接觸面積。在一些實施例中,保護元件與影像擷取元件之接觸面積為黏著元件與影像擷取元件之接觸面積之約2倍至約4倍。In some embodiments, the reinforcing element is a sleeve. In some embodiments, the protective element is a thermosetting glue. In some embodiments, at least a portion of the reinforcing element and the protected device comprise mutually corresponding shapes. In some embodiments, the protected device includes a casing, an image capturing element, and an adhesive element, and the image capturing element is disposed on the casing through the adhesive element. In some embodiments, the adhesive element is sealed within the reinforcing element and the protective element. In some embodiments, the adhesive element is a UV-curable glue. In some embodiments, the adhesive element undergoes a pre-curing process and a curing process, and the protective element undergoes a curing process, the pre-curing process of the adhesive element includes a photo-curing process, and the curing process of the adhesive element and the curing process of the protective element Including a thermal curing process. In some embodiments, the contact area between the protection element and the image capturing element is larger than the contact area between the adhesive element and the image capturing element. In some embodiments, the contact area between the protective element and the image capture element is about 2 times to about 4 times the contact area between the adhesive element and the image capture element.

在本說明書中,提供許多不同的實施例或範例,並可能使用相對性的空間相關用語敘述各個構件以及排列方式的特定範例,以實施本揭露的不同特徵。例如,若本說明書敘述了第一特徵形成於第二特徵「之上」,即表示可包括第一特徵與第二特徵直接接觸的實施例,亦可包括有附加特徵形成於第一特徵與第二特徵之間,而使第一特徵與第二特徵未直接接觸的實施例。相對性的空間相關用語是為了便於描述圖式中元件或特徵與其他元件或特徵之間的關係。除了在圖式中繪示的方位外,這些空間相關用語意欲包含使用中或操作中的裝置之不同方位。裝置可被轉向不同方位(旋轉90度或其他方位),則在此使用的相對性的空間相關用語亦可依此相同解釋。除此之外,在本揭露的不同範例中,可能使用相同或類似的符號或字母。In this specification, many different embodiments or examples are provided, and relative space-relative terms may be used to describe specific examples of various components and arrangements to implement various features of the present disclosure. For example, if this specification recites that a first feature is formed "on" a second feature, that may include embodiments in which the first feature and the second feature are in direct contact, as well as embodiments in which additional features are formed on the first feature and the second feature. An embodiment in which the first feature and the second feature are not in direct contact between the two features. Relative space-relative terms are used to facilitate describing the relationship of elements or features to other elements or features in the drawings. These spatially relative terms are intended to encompass different orientations of the device in use or operation other than the orientation depicted in the figures. The device may be turned in different orientations (rotated 90 degrees or otherwise), and relative spatially relative terms used herein are to be interpreted in the same way. Otherwise, in different examples of the present disclosure, the same or similar symbols or letters may be used.

在本說明書中,「包括」及/或「具有」等詞為開放式詞語,因此其應被解釋為「含有但不限定為…」。因此,當本揭露的敘述中使用術語「包括」及/或「具有」時,其指定了相應的特徵、區域、步驟、操作及/或元件的存在,但不排除一個或多個相應的特徵、區域、步驟、操作及/或元件的存在。In this specification, words such as "including" and/or "having" are open-ended words, so they should be interpreted as "including but not limited to...". Accordingly, when the terms "comprising" and/or "having" are used in the description of the present disclosure, they designate the presence of corresponding features, regions, steps, operations and/or elements, but do not exclude one or more corresponding features , regions, steps, operations and/or elements.

在本說明書中,「約」、「實質上」的用語通常表示在一給定值或範圍的10%內,或5%內、或3%內、或2%內、或1%內、或0.5%內。此外,用語「範圍介於第一數值至第二數值之間」表示所述範圍包括第一數值、第二數值以及它們之間的其它數值。In this specification, the terms "about" and "substantially" generally mean within 10%, or within 5%, or within 3%, or within 2%, or within 1% of a given value or range, or within 0.5%. Furthermore, the phrase "a range between a first value and a second value" means that the range includes the first value, the second value, and other values in between.

請先參考第1圖至第3圖。第1圖是一些實施例中的影像擷取系統10的立體圖。第2圖是一些實施例中的影像擷取系統10的分解圖。第3圖是一些實施例中的影像擷取系統10的剖面圖。影像擷取系統10包括保護裝置100以及受保護裝置200。在一些實施例中,保護裝置100包括保護元件110以及強化元件120。在一些實施例中,受保護裝置200包括影像擷取元件210、黏著元件220、殼體230、電路板240、底座250、感光元件260、鎖固元件270。可依實際需求增加或刪減元件。Please refer to Figure 1 to Figure 3 first. FIG. 1 is a perspective view of an image capture system 10 in some embodiments. FIG. 2 is an exploded view of the image capture system 10 in some embodiments. FIG. 3 is a cross-sectional view of the image capture system 10 in some embodiments. The image capture system 10 includes a protection device 100 and a protected device 200 . In some embodiments, protective device 100 includes protective element 110 and reinforcement element 120 . In some embodiments, the protected device 200 includes an image capturing element 210 , an adhesive element 220 , a casing 230 , a circuit board 240 , a base 250 , a photosensitive element 260 , and a locking element 270 . Components can be added or deleted according to actual needs.

保護元件110設置於受保護裝置200與強化元件120之間。例如,保護元件110可設置於影像擷取元件210之受保護表面215之上。在一些實施例中,保護元件110為熱固化膠(thermal curing adhesive),即,保護元件110可經歷熱固化製程而被固化,但不限於此。在一些實施例中,保護元件110具有防水功能,以增加影像擷取系統10之防水性。The protection element 110 is disposed between the protected device 200 and the reinforcement element 120 . For example, the protection element 110 may be disposed on the protected surface 215 of the image capture element 210 . In some embodiments, the protection element 110 is a thermal curing adhesive, that is, the protection element 110 can be cured through a thermal curing process, but is not limited thereto. In some embodiments, the protection element 110 has a waterproof function to increase the waterproofness of the image capture system 10 .

強化元件120可圍繞受保護裝置200之至少一部分設置。例如,強化元件120可圍繞殼體230之受保護表面235設置。在一些實施例中,強化元件120為套筒。在一些實施例中,強化元件120可包括金屬或塑膠,但不限於此。在一些實施例中,可根據鏡頭擷取元件210及/或殼體230之材料來決定強化元件120之材料,但不限於此。例如,殼體230以及強化元件120可由相同材料製成,但不限於此。The reinforcement element 120 may be disposed around at least a portion of the protected device 200 . For example, the reinforcement element 120 may be disposed around the protected surface 235 of the housing 230 . In some embodiments, the reinforcing element 120 is a sleeve. In some embodiments, the reinforcing element 120 may include metal or plastic, but is not limited thereto. In some embodiments, the material of the reinforcing element 120 may be determined according to the material of the lens capturing element 210 and/or the housing 230 , but is not limited thereto. For example, the housing 230 and the reinforcing element 120 may be made of the same material, but not limited thereto.

影像擷取元件210設置於殼體230。影像擷取元件210可包括金屬材料或塑膠材料,但不限於此。影像擷取元件210可包括一個或多個鏡片等,鏡片可包括玻璃材料或塑膠材料,但不限於此。影像擷取元件210可擷取影像。在一些實施例中,影像擷取元件210可進一步達到對焦、變焦等功能。The image capturing element 210 is disposed in the casing 230 . The image capturing element 210 may include metal material or plastic material, but is not limited thereto. The image capturing element 210 may include one or more lenses, etc. The lenses may include glass material or plastic material, but not limited thereto. The image capture element 210 can capture images. In some embodiments, the image capturing element 210 can further achieve functions such as focusing and zooming.

黏著元件220設置於影像擷取元件210與殼體230之間。例如,黏著元件220可設置於殼體230之頂表面231之上。換句話說,影像擷取元件210透過黏著元件220而設置於殼體230,使得殼體230可容納影像擷取元件210。黏著元件220具有承載以及緩衝的作用。The adhesive element 220 is disposed between the image capturing element 210 and the casing 230 . For example, the adhesive element 220 may be disposed on the top surface 231 of the housing 230 . In other words, the image capturing element 210 is disposed on the casing 230 through the adhesive element 220 , so that the casing 230 can accommodate the image capturing element 210 . The adhesive element 220 has the functions of bearing and buffering.

在一些實施例中,黏著元件220是主動對準(active alignment,AA)固化膠(AA adhesive,或稱為AA glue),但不限於此。主動對準固化膠可應用於主動對準製程。主動對準固化膠可在不需要溶劑的情形下經由照射紫外線而預固化,並經由烘烤而固化,且具有高結構強度等特性。在一些實施例中,黏著元件220是紫外線固化膠(UV curing adhesive)。紫外線固化膠可在不需要溶劑的情形下經由照射紫外線而固化。In some embodiments, the adhesive element 220 is an active alignment (AA) adhesive (AA adhesive, or AA glue), but not limited thereto. Active alignment curing glue can be applied to the active alignment process. The active alignment curing adhesive can be pre-cured by irradiating ultraviolet light without solvent, and cured by baking, and has the characteristics of high structural strength and so on. In some embodiments, the adhesive element 220 is a UV curing adhesive. UV-curable adhesives can be cured by irradiating UV light without the need for solvents.

殼體230連接於底座250。殼體230與底座250連接之後內部的空間可容納電路板240等元件。殼體230以及底座250可包括金屬材料或塑膠材料,但不限於此。在一些實施例中,殼體230以及底座250可包括一些設計,以將影像擷取系統10固定在所要應用的設備(例如:車輛)上。例如,殼體230可包括安裝孔232,以將影像擷取系統10安裝至所要應用的設備上。又,例如,底座250可包括連接器252,以將影像擷取系統10連接至所要應用的設備上。在一些實施例中,連接器252是 FAKRA連接器。FAKRA連接器可滿足車輛之周遭環境要求。The casing 230 is connected to the base 250 . After the casing 230 is connected to the base 250 , the inner space can accommodate components such as the circuit board 240 . The casing 230 and the base 250 may include metal materials or plastic materials, but are not limited thereto. In some embodiments, the housing 230 and the base 250 may include some design to fix the image capture system 10 on the device (eg, vehicle) to be used. For example, the housing 230 may include mounting holes 232 for mounting the image capture system 10 on the device to be used. Also, for example, the base 250 may include a connector 252 to connect the image capture system 10 to the device to be used. In some embodiments, connector 252 is a FAKRA connector. FAKRA connectors meet the requirements of the surrounding environment of the vehicle.

電路板240設置於殼體230與底座250之間。電路板240可包括硬板、軟板(flex board)、軟硬複合板(rigid-flex board)等,但不限於此。The circuit board 240 is disposed between the casing 230 and the base 250 . The circuit board 240 may include a rigid board, a flex board, a rigid-flex board, etc., but is not limited thereto.

感光元件260可設置於電路板240之上。在一些實施例中,感光元件260以表面黏著技術(surface mount technology,SMT)設置於電路板240之上。當光線進入影像擷取系統10之後,可先通過影像擷取元件210,並隨後在感光元件260上成像。The photosensitive element 260 may be disposed on the circuit board 240 . In some embodiments, the photosensitive element 260 is disposed on the circuit board 240 by surface mount technology (SMT). After the light enters the image capturing system 10 , it may first pass through the image capturing element 210 , and then image the image on the photosensitive element 260 .

鎖固元件270可固定不同元件。例如,可將殼體230固定於底座250。在一些實施例中,鎖固元件270為螺絲或螺栓等。The locking element 270 can secure various elements. For example, the housing 230 may be fixed to the base 250 . In some embodiments, the locking element 270 is a screw or bolt or the like.

保護裝置100用於保護受保護裝置200。例如,保護裝置100可保護影像擷取元件210、在影像擷取元件210與殼體230之間的黏著元件220、殼體230等,以降低影像擷取元件210從殼體230脫落之可能性。在一些實施例中,強化元件120以及受保護裝置200可包括相互對應的形狀,以加強強化元件120與受保護裝置200之間的連接。例如,如第2圖以及第3圖所示,強化元件120之內側表面125以及殼體230之受保護表面235可包括相互對應的螺紋,以加強強化元件120與殼體230之間的連接。此外,若強化元件120之內側表面125具有不平坦的形狀,可增加保護元件110與強化元件120之間的接觸面積,進而加強保護元件110與強化元件120之間的連接。The protection device 100 is used to protect the protected device 200 . For example, the protection device 100 can protect the image capture element 210 , the adhesive element 220 between the image capture element 210 and the casing 230 , the casing 230 , etc., so as to reduce the possibility of the image capture element 210 falling off the casing 230 . In some embodiments, the reinforcing element 120 and the protected device 200 may include mutually corresponding shapes to strengthen the connection between the reinforcing element 120 and the protected device 200 . For example, as shown in FIGS. 2 and 3 , the inner surface 125 of the reinforcing element 120 and the protected surface 235 of the housing 230 may include corresponding threads to strengthen the connection between the reinforcing element 120 and the housing 230 . In addition, if the inner surface 125 of the reinforcement element 120 has an uneven shape, the contact area between the protection element 110 and the reinforcement element 120 can be increased, thereby strengthening the connection between the protection element 110 and the reinforcement element 120 .

又,保護裝置100可增加影像擷取元件210之固定面積(即,影像擷取元件210與保護元件110之接觸面積),亦可降低影像擷取元件210從殼體230脫落之可能性。在一些實施例中,影像擷取元件210與保護元件110之接觸面積可大於影像擷取元件210與黏著元件220之接觸面積,以加強固定影像擷取元件210。在一些實施例中,影像擷取元件210與保護元件110之接觸面積可為影像擷取元件210與黏著元件220之接觸面積之約2倍至約4倍,例如,約3倍,但不限於此。例如,影像擷取元件210與保護元件110之接觸面積可為約360平方毫米(mm 2),而影像擷取元件210與黏著元件220之接觸面積可為約125平方毫米。 In addition, the protection device 100 can increase the fixed area of the image capture element 210 (ie, the contact area between the image capture element 210 and the protection element 110 ), and can also reduce the possibility of the image capture element 210 falling off the housing 230 . In some embodiments, the contact area between the image capturing element 210 and the protection element 110 may be larger than the contact area between the image capturing element 210 and the adhesive element 220 , so as to strengthen the fixing of the image capturing element 210 . In some embodiments, the contact area between the image capture element 210 and the protection element 110 may be about 2 times to about 4 times the contact area between the image capture element 210 and the adhesive element 220 , for example, about 3 times, but not limited to this. For example, the contact area between the image capturing element 210 and the protection element 110 may be about 360 square millimeters (mm 2 ), and the contact area between the image capturing element 210 and the adhesive element 220 may be about 125 square millimeters.

此外,保護裝置100可降低在影像擷取元件210與殼體230之間的黏著元件220與影像擷取系統10之周遭環境中的水氣、空氣、灰塵等之接觸,以維持黏著元件220之黏著度,進而協助降低影像擷取元件210從殼體230脫落之可能性。在一些實施例中,黏著元件220實質上被密封在影像擷取系統10之內部。即,黏著元件220實質上被密封在保護元件110以及強化元件120之內。In addition, the protection device 100 can reduce the contact between the adhesive element 220 between the image capture element 210 and the housing 230 and moisture, air, dust, etc. in the surrounding environment of the image capture system 10, so as to maintain the adhesive element 220 Adhesion, thereby helping to reduce the possibility of the image capturing element 210 falling off from the casing 230 . In some embodiments, the adhesive element 220 is substantially sealed within the image capture system 10 . That is, the adhesive member 220 is substantially sealed within the protection member 110 and the reinforcement member 120 .

綜上所述,藉由保護元件110以及強化元件120,保護裝置100具有結構強化、增加固定面積、阻隔等作用,可降低影像擷取元件210從殼體230脫落之可能性,故可達到保護受保護裝置200的效果,並因此增進了影像擷取系統10之可靠度。在一些實施例中,影像擷取系統10可通過IP69防塵防水等級測試。To sum up, with the protection element 110 and the strengthening element 120, the protection device 100 has the functions of structural strengthening, increasing the fixed area, blocking, etc., which can reduce the possibility of the image capturing element 210 falling off from the housing 230, so that protection can be achieved. The effect of the protected device 200, and thus the reliability of the image capture system 10, is enhanced. In some embodiments, the image capture system 10 can pass the IP69 dustproof and waterproof rating test.

接下來,請一併參考第4圖以及第5A圖至第5I圖,以了解如何完成影像擷取系統10。第4圖是一些實施例中用於完成影像擷取系統10的方法400。第5A圖至第5I圖是一些實施例中用於完成影像擷取系統10的流程。第4圖之方法400包括步驟401至步驟409。可依實際需求增加或刪減步驟。在一些實施例中,可透過相關的自動化設備執行相關步驟,以簡化製程並降低成本。Next, please refer to FIG. 4 and FIGS. 5A to 5I together to understand how to complete the image capturing system 10 . FIG. 4 is a method 400 for implementing the image capture system 10 in some embodiments. FIGS. 5A to 5I are flowcharts for completing the image capture system 10 in some embodiments. The method 400 of FIG. 4 includes steps 401 to 409 . Steps can be added or deleted according to actual needs. In some embodiments, related steps can be performed by related automation equipment to simplify the process and reduce costs.

在步驟401中(可參考第5A圖),對影像擷取元件210及/或殼體230進行預處理,以確保影像擷取元件210與殼體230之間的連接。為了簡化,在第5A圖中並未繪示影像擷取元件210。在一些實施例中,可透過氧離子對包括塑膠材料的影像擷取元件210及/或殼體230進行表面活化,以達到濕潤之效果。在一些實施例中,可透過惰性氣體之粒子轟擊對包括金屬材料的影像擷取元件210及/或殼體230進行表面活化,以達到去除氧化物之效果。In step 401 (refer to FIG. 5A ), the image capturing element 210 and/or the casing 230 are preprocessed to ensure the connection between the image capturing element 210 and the casing 230 . For simplicity, the image capturing element 210 is not shown in FIG. 5A. In some embodiments, the image capturing element 210 and/or the housing 230 including the plastic material can be surface activated by oxygen ions to achieve the effect of wetting. In some embodiments, the image capturing element 210 and/or the housing 230 including metal materials can be surface activated by particle bombardment of an inert gas, so as to achieve the effect of removing oxides.

在步驟402中(可參考第5B圖),將黏著元件220設置於殼體230。例如,將黏著元件220設置於殼體230之頂表面231之上。在一些實施例中,在設置黏著元件220之前,可計算黏著元件220之期望用量以及期望位置,以避免黏著元件220之用量過多或過少及/或位置產生偏移等問題。若黏著元件220之用量過多或過少及/或位置產生偏移,可能導致後續將設置於殼體230的影像擷取元件210之位置產生偏移。In step 402 (refer to FIG. 5B ), the adhesive element 220 is disposed on the casing 230 . For example, the adhesive element 220 is disposed on the top surface 231 of the housing 230 . In some embodiments, before disposing the adhesive element 220 , the desired amount and desired position of the adhesive element 220 can be calculated to avoid problems such as excessive or too little amount of the adhesive element 220 and/or position deviation. If the amount of the adhesive element 220 is too much or too little and/or the position is shifted, the position of the image capturing element 210 to be disposed in the casing 230 may be shifted later.

事先計算出的結果可編程至自動化設備中,使得自動化設備可根據所編程的內容而執行步驟402。在一些實施例中,在步驟402中可採用包括自動化點膠機及/或感光耦合裝置(charge coupled device,CCD)的自動化設備。在一些實施例中,自動化點膠機可達到兩軸調整。在一些實施例中,自動化點膠機之點膠頭可達到三百六十度之旋轉,以從任意的初始角度設置黏著元件220。在一些實施例中,感光耦合裝置可協助偵測黏著元件220之設置情形,以即時地修正黏著元件220之設置用量以及設置位置。在一些實施例中,黏著元件220之設置用量以及設置位置與黏著元件220之期望用量以及期望位置之間的誤差實質上趨近於零。在一些實施例中,可連續不斷地設置黏著元件220,以節省黏著元件220之用量,進而降低成本。The results calculated in advance can be programmed into the automation device, so that the automation device can perform step 402 according to the programmed content. In some embodiments, automated equipment including an automated glue dispenser and/or a charge coupled device (CCD) may be employed in step 402 . In some embodiments, the automated dispenser can achieve two-axis adjustment. In some embodiments, the dispensing head of the automated dispensing machine can rotate up to three hundred and sixty degrees to position the adhesive element 220 from any initial angle. In some embodiments, the photosensitive coupling device can assist in detecting the setting situation of the adhesive element 220 , so as to correct the setting amount and the setting position of the adhesive element 220 in real time. In some embodiments, the error between the amount and the placement position of the adhesive element 220 and the desired amount and desired position of the adhesive element 220 is substantially close to zero. In some embodiments, the adhesive elements 220 can be provided continuously, so as to save the amount of the adhesive elements 220, thereby reducing the cost.

在步驟403中(可參考第5C圖),將影像擷取元件210透過黏著元件220設置於殼體230。在一些實施例中,在步驟403中可採用包括自動化夾爪的自動化設備。In step 403 (refer to FIG. 5C ), the image capturing element 210 is disposed on the casing 230 through the adhesive element 220 . In some embodiments, automated equipment including automated grippers may be employed in step 403 .

在步驟404中(可參考第5D圖),以主動對準製程定位影像擷取元件210,以確保影像擷取元件210相對於感光元件260之位置。為了顯示影像擷取元件210與感光元件260之位置關係,第5D圖之繪示角度與第5A圖至第5C圖之繪示角度不同。具體地,在步驟404中,影像擷取元件210之中心軸被調整成實質上與感光元件260之中心軸重合。In step 404 (refer to FIG. 5D ), the image capturing element 210 is positioned by an active alignment process to ensure the position of the image capturing element 210 relative to the photosensitive element 260 . In order to show the positional relationship between the image capturing element 210 and the photosensitive element 260 , the drawing angle of FIG. 5D is different from the drawing angles of FIGS. 5A to 5C . Specifically, in step 404 , the central axis of the image capturing element 210 is adjusted to be substantially coincident with the central axis of the photosensitive element 260 .

值得注意的是,影像擷取元件210與感光元件260之相對位置會對影像擷取系統10所擷取的影像之品質產生影響。例如,在一些先前技術中,並未利用主動對準製程定位影像擷取元件,而是直接地將影像擷取元件固定於殼體。在這樣的先前技術中,在設置影像擷取元件時並無法改變影像擷取元件與感光元件之位置關係,使得影像擷取元件之中心軸與感光元件之中心軸可能不重合,並導致所擷取的影像產生模糊、失焦等。It should be noted that the relative position of the image capturing element 210 and the photosensitive element 260 will affect the quality of the image captured by the image capturing system 10 . For example, in some prior art, the image capture element is not positioned using an active alignment process, but the image capture element is directly fixed to the housing. In such a prior art, the positional relationship between the image capturing element and the photosensitive element cannot be changed during the setting of the image capturing element, so that the central axis of the image capturing element and the central axis of the photosensitive element may not coincide, resulting in the captured image The captured image is blurred, out of focus, etc.

相對地,在主動對準製程中,可根據組裝過程的實際情形修正下一個被組裝的元件的設置位置,以消除先前所累積的公差。此外,主動對準製程可確定被組裝的元件之間的相對位置,並可達到三個自由度、甚至六個自由度的調整,故可達到精準定位。因此,透過在步驟404中以主動對準製程定位影像擷取元件210可提升影像擷取系統10所擷取的影像之品質。In contrast, in the active alignment process, the setting position of the next component to be assembled can be corrected according to the actual situation of the assembly process, so as to eliminate the tolerance accumulated previously. In addition, the active alignment process can determine the relative positions between the assembled components, and can achieve three degrees of freedom, or even six degrees of freedom adjustment, so accurate positioning can be achieved. Therefore, the quality of the image captured by the image capture system 10 can be improved by positioning the image capture element 210 in the active alignment process in step 404 .

因為在步驟404中已完成影像擷取元件210之定位,在步驟405中(可參考第5E圖),對黏著元件220進行預固化,以暫時地固定影像擷取元件210之位置。在一些實施例中,在步驟405中,黏著元件220僅一部分(例如:表面)被固化。在一些實施例中,步驟405中的預固化製程為光固化製程,並可採用包括紫外線燈的自動化設備。在一些實施例中,紫外線燈可以是高功率紫外線燈,以加速預固化黏著元件220。在一些實施例中,為了確保黏著元件220之預固化,可從不同方位照射黏著元件220。紫外線燈之數量可為三個至六個,例如,四個,但不限於此。在一些實施例中,步驟405中的預固化製程的期間可為二十秒內,例如,三秒至九秒,但不限於此。Since the positioning of the image capture element 210 has been completed in step 404 , in step 405 (refer to FIG. 5E ), the adhesive element 220 is pre-cured to temporarily fix the position of the image capture element 210 . In some embodiments, in step 405, only a portion (eg, the surface) of the adhesive element 220 is cured. In some embodiments, the pre-curing process in step 405 is a photo-curing process, and automated equipment including ultraviolet lamps may be used. In some embodiments, the UV lamp may be a high power UV lamp to accelerate pre-curing of the adhesive element 220 . In some embodiments, in order to ensure pre-curing of the adhesive element 220, the adhesive element 220 may be irradiated from different directions. The number of UV lamps may be three to six, for example, four, but not limited thereto. In some embodiments, the duration of the pre-curing process in step 405 may be within twenty seconds, for example, three to nine seconds, but not limited thereto.

在步驟406中(可參考第5F圖),對黏著元件220進行固化,以固定影像擷取元件210之位置。為了簡化,在第5F圖中,僅繪示固化設備500,而未繪示影像擷取系統10及其所包括的保護裝置100以及受保護裝置200。在一些實施例中,在步驟406中,黏著元件220之整體被固化。在一些實施例中,步驟406中的固化製程為熱固化製程,且可採用烘箱(drying chamber)作為固化設備500。在一些實施例中,步驟406中的固化製程的期間可為約二個小時,但不限於此。在一些實施例中,步驟406中的固化製程的溫度可介於約80℃(攝氏溫度)至約90℃之間,例如,約85℃,但不限於此。In step 406 (refer to FIG. 5F ), the adhesive element 220 is cured to fix the position of the image capturing element 210 . For simplicity, in FIG. 5F , only the curing device 500 is shown, and the image capturing system 10 and the protection device 100 and the protected device 200 included therein are not shown. In some embodiments, in step 406, the entirety of the adhesive element 220 is cured. In some embodiments, the curing process in step 406 is a thermal curing process, and a drying chamber can be used as the curing device 500 . In some embodiments, the duration of the curing process in step 406 may be about two hours, but is not limited thereto. In some embodiments, the temperature of the curing process in step 406 may be between about 80° C. (Celsius temperature) to about 90° C., for example, about 85° C., but not limited thereto.

在步驟407中(可參考第5G圖),設置強化元件120。在一些實施例中,當強化元件120之內側表面125以及殼體230之受保護表面235包括相互對應的形狀(例如:螺紋)時,可透過人工或機械化的方式將強化元件120旋入殼體230。In step 407 (refer to FIG. 5G ), the reinforcing element 120 is provided. In some embodiments, when the inner side surface 125 of the reinforcement element 120 and the protected surface 235 of the housing 230 include mutually corresponding shapes (eg, threads), the reinforcement element 120 can be manually or mechanically screwed into the housing 230.

在步驟408中(可參考第5H圖),設置保護元件110。例如,將保護元件110設置於影像擷取元件210之受保護表面215(可參考第5G圖)之上,並使得在影像擷取元件210與殼體230之間的黏著元件220被密封在影像擷取系統10之內部。在一些實施例中,在步驟408中可採用包括自動化點膠機的自動化設備。In step 408 (refer to FIG. 5H ), the protection element 110 is provided. For example, the protection element 110 is disposed on the protected surface 215 of the image capture element 210 (refer to FIG. 5G ), and the adhesive element 220 between the image capture element 210 and the housing 230 is sealed in the image Capture the inside of the system 10 . In some embodiments, automated equipment including an automated glue dispenser may be employed in step 408 .

在步驟409中(可參考第5I圖),對保護元件110進行固化,以固化保護元件110,進而完成影像擷取系統10。為了簡化,在第5F圖中,僅繪示固化設備600,而未繪示影像擷取系統10及其所包括的保護裝置100以及受保護裝置200。在一些實施例中,步驟409中的固化製程為熱固化製程,並可採用烘箱作為固化設備600。在一些實施例中,步驟409中的固化設備600與步驟406中的固化設備500實質上相同。在一些實施例中,步驟409中的固化製程的期間可為約二個小時,但不限於此。在一些實施例中,步驟409中的固化製程的溫度可介於約80℃(攝氏溫度)至約90℃之間,例如,約85℃,但不限於此。In step 409 (refer to FIG. 5I ), the protection element 110 is cured to cure the protection element 110 , thereby completing the image capture system 10 . For simplicity, in FIG. 5F , only the curing apparatus 600 is shown, and the image capturing system 10 and the protection device 100 and the protected device 200 included therein are not shown. In some embodiments, the curing process in step 409 is a thermal curing process, and an oven can be used as the curing device 600 . In some embodiments, the curing apparatus 600 in step 409 is substantially the same as the curing apparatus 500 in step 406 . In some embodiments, the duration of the curing process in step 409 may be about two hours, but is not limited thereto. In some embodiments, the temperature of the curing process in step 409 may be between about 80° C. (Celsius temperature) to about 90° C., for example, about 85° C., but not limited thereto.

如前所述,本揭露之一些實施例提供了一種保護裝置以及裝置之保護方法。保護裝置以及受保護裝置被包括在一種影像擷取系統中。保護裝置可強化受保護裝置之結構。保護裝置可增加受保護裝置中的一或多個元件之固定面積。保護裝置可降低受保護裝置中的一或多個元件與周遭環境中的水氣、空氣、灰塵等之接觸。As mentioned above, some embodiments of the present disclosure provide a protection device and a protection method for the device. The protection device and the protected device are included in an image capture system. The protective device strengthens the structure of the protected device. The protective device can increase the fixed area of one or more components in the protected device. The protective device may reduce the exposure of one or more components in the protected device to moisture, air, dust, etc. in the surrounding environment.

透過保護裝置之結構強化、增加固定面積、阻隔等作用,保護裝置可降低受保護裝置中的一或多個元件脫落之可能性,故可達到保護受保護裝置的效果,並因此增進了影像擷取系統之整體之可靠度。此外,可透過相關的自動化設備完成影像擷取系統,以簡化製程並降低成本。而且,在製程中利用主動對準製程可消除先前所累積的公差,並可提升影像擷取系統所擷取的影像之品質。By strengthening the structure of the protective device, increasing the fixed area, blocking and other functions, the protective device can reduce the possibility of one or more components in the protected device falling off, so the effect of protecting the protected device can be achieved, and thus the image capture can be improved. Take the overall reliability of the system. In addition, the image capture system can be completed through related automation equipment to simplify the process and reduce the cost. Furthermore, using an active alignment process in the process can eliminate previously accumulated tolerances and improve the quality of images captured by the image capture system.

前面概述數個實施例的特徵,使得本技術領域中具有通常知識者可更好地理解本揭露的各方面。本技術領域中具有通常知識者應理解的是,可輕易地使用本揭露作為設計或修改其他製程以及結構的基礎,以實現在此介紹的實施例的相同目的或達到相同優點。本技術領域中具有通常知識者應理解的是,這樣的等同配置並不背離本揭露的精神以及範圍,且在不背離本揭露的精神以及範圍的情況下,可對本揭露進行各種改變、替換以及更改。此外,各實施例間特徵只要不違背本揭露的精神或與本揭露的精神相衝突,均可任意混合搭配使用。The foregoing outlines the features of several embodiments to enable those of ordinary skill in the art to better understand various aspects of the present disclosure. Those of ordinary skill in the art should appreciate that the present disclosure may be readily utilized as a basis for designing or modifying other processes and structures for carrying out the same purposes or achieving the same advantages of the embodiments described herein. It should be understood by those skilled in the art that such equivalent configurations do not depart from the spirit and scope of the present disclosure, and without departing from the spirit and scope of the present disclosure, various changes, substitutions and alterations may be made to the present disclosure. Change. In addition, the features among the various embodiments can be arbitrarily mixed and matched as long as they do not violate the spirit of the present disclosure or conflict with the spirit of the present disclosure.

10:影像擷取系統 100:保護裝置 110:保護元件 120:強化元件 125:強化元件之內側表面 200:受保護裝置 210:影像擷取元件 215:影像擷取元件之受保護表面 220:黏著元件 230:殼體 231:殼體之頂表面 232:安裝孔 235:殼體之受保護表面 240:電路板 250:底座 252:連接器 260:感光元件 270:鎖固元件 400:方法 401,402,403,404,405,406,407,408,409:步驟 500,600:固化設備10: Image capture system 100: Protective device 110: Protection components 120: Reinforcing elements 125: The inner surface of the reinforcement element 200: Protected device 210: Image Capture Components 215: Protected surface of image capture element 220: Adhesive Components 230: Shell 231: Top surface of shell 232: Mounting holes 235: Protected surface of the shell 240: circuit board 250: base 252: Connector 260: photosensitive element 270: Locking element 400: Method 401, 402, 403, 404, 405, 406, 407, 408, 409: Steps 500,600: Curing Equipment

為讓本揭露的特徵或優點能更明顯易懂,特舉出一些實施例,並配合所附圖式,作詳細說明如下。應注意的是,各種特徵並不一定按照比例繪製。事實上,可能任意地放大或縮小各種特徵的尺寸,並可能示意性地繪製。 第1圖是一些實施例中的影像擷取系統的立體圖。 第2圖是一些實施例中的影像擷取系統的分解圖。 第3圖是一些實施例中的影像擷取系統的剖面圖。 第4圖是一些實施例中用於完成影像擷取系統的方法。 第5A圖至第5I圖是一些實施例中用於完成影像擷取系統的流程。 In order to make the features or advantages of the present disclosure more obvious and easy to understand, some embodiments are given and described in detail as follows in conjunction with the accompanying drawings. It should be noted that the various features are not necessarily drawn to scale. In fact, the various features may be arbitrarily enlarged or reduced in size and may be drawn schematically. FIG. 1 is a perspective view of an image capture system in some embodiments. FIG. 2 is an exploded view of an image capture system in some embodiments. FIG. 3 is a cross-sectional view of an image capture system in some embodiments. FIG. 4 is a method for implementing an image capture system in some embodiments. FIGS. 5A to 5I are flowcharts for completing the image capture system in some embodiments.

10:影像擷取系統 10: Image capture system

100:保護裝置 100: Protective device

110:保護元件 110: Protection components

120:強化元件 120: Reinforcing elements

200:受保護裝置 200: Protected device

Claims (10)

一種保護裝置,用於一受保護裝置,包括: 一強化元件,圍繞該受保護裝置之至少一部分設置;以及 一保護元件,設置於該受保護裝置與該強化元件之間。 A protective device for a protected device, comprising: a reinforcement element disposed around at least a portion of the protected device; and A protection element is arranged between the protected device and the strengthening element. 如請求項1所述之保護裝置,其中該強化元件為一套筒。The protective device of claim 1, wherein the reinforcing element is a sleeve. 如請求項1所述之保護裝置,其中該保護元件為一熱固化膠。The protection device as claimed in claim 1, wherein the protection element is a heat-curable adhesive. 如請求項1所述之保護裝置,其中該強化元件之至少該部分以及該受保護裝置包括相互對應的形狀。The protective device of claim 1, wherein at least the portion of the reinforcing element and the protected device comprise mutually corresponding shapes. 如請求項1所述之保護裝置,其中該受保護裝置包括一殼體、一影像擷取元件、一黏著元件,且該影像擷取元件透過該黏著元件設置於該殼體。The protection device of claim 1, wherein the protected device comprises a casing, an image capturing element, and an adhesive element, and the image capturing element is disposed on the casing through the adhesive element. 如請求項5所述之保護裝置,其中該黏著元件被密封在該強化元件以及該保護元件之內。The protective device of claim 5, wherein the adhesive element is sealed within the reinforcing element and the protective element. 如請求項5所述之保護裝置,其中該黏著元件為一紫外線固化膠。The protection device according to claim 5, wherein the adhesive element is an ultraviolet curing adhesive. 如請求項5所述之保護裝置,其中該黏著元件經歷一預固化製程以及一固化製程,且該保護元件經歷一固化製程,該黏著元件之該預固化製程包括一光固化製程,而該黏著元件之該固化製程以及該保護元件之該固化製程包括一熱固化製程。The protection device of claim 5, wherein the adhesive element undergoes a pre-curing process and a curing process, and the protective element undergoes a curing process, the pre-curing process of the adhesive element includes a photo-curing process, and the adhesive The curing process of the device and the curing process of the protection device include a thermal curing process. 如請求項5所述之保護裝置,其中該保護元件與該影像擷取元件之接觸面積大於該黏著元件與該影像擷取元件之接觸面積。The protection device of claim 5, wherein a contact area between the protection element and the image capturing element is larger than a contact area between the adhesive element and the image capturing element. 如請求項9所述之保護裝置,其中該保護元件與該影像擷取元件之接觸面積為該黏著元件與該影像擷取元件之接觸面積之2倍至4倍。The protection device as claimed in claim 9, wherein the contact area between the protection element and the image capturing element is 2 to 4 times the contact area between the adhesive element and the image capturing element.
TW110210497U 2021-09-06 2021-09-06 Protective device TWM622511U (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI814616B (en) * 2022-10-17 2023-09-01 廣達電腦股份有限公司 Method of assemblying optical apparatus and optical apparatus

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI814616B (en) * 2022-10-17 2023-09-01 廣達電腦股份有限公司 Method of assemblying optical apparatus and optical apparatus

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