TWM621975U - Memory and module thereof - Google Patents

Abstract

A memory is suitable for connecting with an electrical connection part of a light source module. The memory includes a circuit board, a chip, a signal transmission layer, a first light-emitting element, a second light-emitting element and a signal connection part. The circuit board includes a first panel portion and a second panel portion opposite to each other, and the upper and lower sides of the first panel portion and the second panel portion respectively define a spaced light emitting area and a conductive area. The chip is located between the light emitting area and the conductive area of the first panel portion. The two signal transmission layers are respectively located in the two conductive regions. The plurality of first light emitting elements are distributed in the light emitting area of the first panel portion. The plurality of second light emitting elements are distributed in the light emitting area of the second panel portion. The signal connection part is used for connecting with the electrical connection part, and the signal connection part is located in a part of the circuit board. The present invention further proposes a memory module of an embodiment, which includes the aforementioned memory.

Description

Memory and its modules

A memory, especially a memory with external connections that can expand its functions.

With the development of technology, the development of electronic devices tends to be more diversified. In the past, memory components were generally installed in the computer case to enhance the computing speed of the computer. However, with the rise of the e-sports field, the use of light-emitting memory is becoming more and more popular. In addition to requiring the memory to meet the high-frequency specifications, it is also important for the optical visual effects it produces.

In general, the light-emitting elements of the memory are mostly disposed on both sides of the memory body. Therefore, the problem of insufficient brightness occurs above the memory body. Generally, the above-mentioned problems are solved by increasing the number of light-emitting elements in the lateral direction of the memory body.

However, with the advancement of technology in the specifications of the memory, many electronic components are added, the space for the light-emitting element to be installed is limited, and the brightness above the memory body cannot be supplemented by adding the light-emitting element.

In view of this, the present invention proposes a memory according to an embodiment, which is suitable for connecting with the electrical connection part of the light source module. The memory includes a circuit board, a chip, a signal transmission layer, a plurality of first light-emitting elements, a plurality of second light-emitting elements. Light-emitting element and signal connection part.

The circuit board includes a first panel portion and a second panel portion opposite to each other, and the upper and lower sides of the first panel portion and the second panel portion respectively define a spaced light emitting area and a conductive area. The chip is connected to the circuit board, and is located between the light-emitting area and the conductive area of the first panel portion. The signal transmission layer is located in one of the two conductive regions. The plurality of first light emitting elements are distributed in the light emitting area of the first panel portion. The plurality of second light emitting elements are distributed in the light emitting area of the second panel portion. The signal connection part is used for connecting with the electrical connection part, and the signal connection part is located in a part of the circuit board.

In some embodiments, the memory further includes a light guide element located above the circuit board to diffuse the light emitted by the first light emitting element and the second light emitting element.

In some embodiments, the signal connection portion is a conductive layer that spans and connects the first panel portion and the second panel portion.

In some embodiments, the signal connections include sockets.

In some embodiments, the signal connection portion includes a plug-in structure.

Another embodiment of the present invention provides a memory module including a memory and a light bar. The memory includes a circuit board, a chip, a signal transmission layer, a plurality of first light-emitting elements, a plurality of second light-emitting elements and a signal connection portion. The circuit board includes a first panel portion and a second panel portion opposite to each other, and the upper and lower sides of the first panel portion and the second panel portion respectively define a spaced light emitting area and a conductive area. The chip is connected to the circuit board, and is located between the light-emitting area and the conductive area of the first panel portion. The signal transmission layer is located in one of the two conductive regions. The plurality of first light emitting elements are distributed in the light emitting area of the first panel portion. The plurality of second light emitting elements are distributed in the light emitting area of the second panel portion. The signal connection part is used for connecting with the electrical connection part, and the signal connection part is located in a part of the circuit board. The light bar is located above the memory, the light bar includes an electrical substrate, a plurality of light-emitting sources and electrical connection parts, and the light-emitting source is located on the top of one of the electrical substrates. The electrical connecting portion is located on the electrical substrate and is used for connecting with the signal connecting portion.

In some embodiments, the memory module further includes a light guide element located above the light emitting source for diffusing the light emitted by the first light emitting element, the second light emitting element and the light emitting source.

In some embodiments, the signal connection portion is a conductive layer that spans and connects the first panel portion and the second panel portion. The electrical connection parts are conductive bumps or conductive lines.

In some embodiments, the signal connections include sockets. The electrical connection includes plug connectors.

In some embodiments, the signal connection portion includes a plug connector. The electrical connection includes a slot.

According to some embodiments, the memory has a signal connection portion, which can be signal-connected to the light source module, so as to enhance the luminous brightness above the memory. According to some embodiments, the light source module is a light bar, and the memory can exert the effect of emitting light on three sides. According to some embodiments, the memory includes light-guiding elements that enhance the diffusion of light from the top and side of the memory. According to some embodiments, the memory has a signal connection portion, and the signal connection portion is connected to the electrical connection portion of the light source module, and the light source module is used to enhance the brightness above the memory. The settings on the memory allow more design freedom. In other words, the arrangement of the light-emitting elements and electronic components of the memory is less limited by the areas of the first panel portion and the second panel portion.

According to some embodiments, the memory module includes memory with signal connections, and thus has the same benefits as these embodiments.

Please refer to FIG. 1A and FIG. 1B. FIG. 1A is a front view of a memory according to an embodiment of the present invention. FIG. 1B is a rear view of the embodiment shown in FIG. 1A . The memory 1 is suitable for connecting with the electrical connection portion 23 of the light source module, and the light source module is a module with light-emitting elements, such as a light bar. The electrical connection portion 23 may be, but not limited to, a conductive layer (eg, gold finger), a conductive wire, or a conductive plug or connector.

As shown in FIG. 1A , the memory 1 includes a circuit board 11 , a chip 113 , a signal transmission layer 114 , a plurality of first light-emitting elements 115 and a signal connection portion 116 . The circuit board 11 includes a first panel portion 111 and a second panel portion 112 opposite to each other (see FIG. 1B ). The upper and lower sides of the first panel portion 111 and the second panel portion 112 respectively define a spaced light-emitting area A and a conductive area. B. The circuit board 11 is, for example, a screen printed circuit board 11 (PCB). The chip 113 is connected to the circuit board 11 and is located between the light emitting area A and the conductive area B of the first panel portion 111 . According to some embodiments, the wafer 113 is one, and according to the embodiment shown in FIG. 1A , there are multiple wafers 113 . The signal transmission layer 114 is located in the conductive area B of the first panel portion 111 or the conductive area B of the second panel portion 112 . In some embodiments, the memory 1 includes two signal transmission layers 114 , which are respectively located in the conductive area B of the first panel portion 111 and the conductive area B of the second panel portion 112 (see FIG. 1B ). In other words, the memory 1 includes at least one signal transmission layer 114 , and the signal transmission layer 114 is a gold finger in some embodiments. The plurality of first light emitting elements 115 are distributed in the light emitting area A. The first light emitting element 115 and the second light emitting element 119 may be, but are not limited to, light emitting diodes (LEDs), and adjacent first light emitting elements 115 have a space therebetween. The trajectory of the arrangement of the first light-emitting elements 115 may be straight, curved, wavy or irregular, which is not limited in the present invention. The signal connection part 116 is used for connecting with the electrical connection part 23 (to be described in detail later). The signal connection part 116 is located at a part of the circuit board 11 , that is, the signal connection part 116 can be located at any position on the circuit board 11 . In some implementations In an example, the signal connection portion 116 is located on the side of the circuit board 11 (ie, the left or right side of the first panel portion 111 , see FIG. 8 ). In some embodiments, the signal connection portion 116 is located on the upper side of the circuit board 11 (as shown in FIG. 1A ). However, the present invention is not limited to this. It depends on the design and circuit planning of the manufacturer. In other embodiments, The signal connection portion 116 is located on the lower side of the circuit board 11 .

FIG. 1B shows the second panel portion 112 of the circuit board 11 . The second panel portion 112 is opposite to the first panel portion 111 . The second panel portion 112 may or may not be provided with a chip. According to this embodiment, the wafer 113 ′ is disposed on the second panel portion 112 , the second light-emitting elements 119 of the second panel portion 112 , the traces of which are distributed and arranged can be symmetrical to the first light-emitting elements 115 of the first panel portion 111 , Or different from the locus in which the first light-emitting elements 115 of the first panel portion 111 are distributed and arranged.

Please refer to FIG. 2 to FIG. 3 , and also refer to FIG. 1A . FIG. 2 shows a front view of the memory according to an embodiment of the present invention. FIG. 3 is a front view of a memory according to an embodiment of the present invention. In the embodiment shown in FIG. 1A , the signal connecting portion 116 is a gold finger. However, the present creation is not limited to this. As shown in FIG. 2 , the signal connection portion 116 includes a slot 116a. As shown in FIG. 3 , the signal connection portion 116 includes a plug connector 116b, which is a conductive plug. The structural end of the signal connection portion 116 depends on the type of the electrical connection portion 23 (as shown in FIG. 6 ) of the light source module 2 to which the memory 1 is correspondingly connected.

Please refer to FIG. 4 , which is a three-dimensional schematic diagram of the memory 1 according to an embodiment of the present invention. According to the embodiment of FIG. 4 , the conductive layer 116 c of the signal connection portion 116 spans and connects the first panel portion 111 and the second panel portion 112 . According to the embodiment shown in FIG. 4 , the first light-emitting element 115 and the second light-emitting element 119 are respectively disposed on both sides of the memory 1 , so that the memory 1 can emit light laterally in the side-up state (see FIG. 5 ). .

Please refer to FIG. 5 , which is a side view of the memory 1 according to an embodiment of the present invention. Here, the memory 1 further includes a light guide element 117 . The light guide element 117 is located above the circuit board 11 for diffusing the light emitted by the first light emitting element 115 and the second light emitting element 119 . The light guide element 117 may be a light pipe or a light guide cover. In the embodiment shown in FIG. 5 , the light guide element 117 is a light guide cover. Since the memory 1 has the light guide element 117 , the brightness of the upward and lateral light emitted by the memory 1 can be enhanced when the memory 1 is standing on its side.

Among the aforementioned plurality of first light-emitting elements 115, the light colors emitted by them may be the same or different. For example, the first light-emitting elements 115 of the first panel portion 111 can be distinguished into different light colors along their arranged tracks. . The light colors of the second light-emitting elements 119 of the second panel portion 112 may be the same or different. The second light-emitting element 119 can also be the same as or different from the light color emitted by the first light-emitting element 115 . The present invention does not limit the number of first light-emitting elements 115 , the number of second light-emitting elements 119 and the number of light colors the memory 1 has. , depending on the manufacturer's design and the circuit planning of the circuit board 11 .

Please refer to FIG. 6 and FIG. 7 . FIG. 6 is a front view of the memory module 100 according to an embodiment of the present invention. FIG. 7 is an exploded schematic view of the memory module 100 of the embodiment shown in FIG. 6 . The memory module 100 includes a memory 1 and a light bar 2 . For the description of the memory 1, please refer to FIG. 1A to FIG. 5 and related descriptions, and details are not repeated here. The light bar 2 is located above the memory 1 . The light bar 2 includes an electrical substrate 21 , a plurality of light emitting sources 22 and an electrical connection portion 23 . The light emitting source 22 is located on the top 211 of the electrical substrate 21 . The light source 22 may be, but is not limited to, light emitting diodes. The electrical connection portion 23 is located on the electrical substrate 21 for connecting with the signal connection portion 116 . According to the embodiment shown in FIG. 6 and FIG. 7 , the signal connecting portion 116 is a conductive layer 116 c that spans and connects the first panel portion 111 and the second panel portion 112 . The electrical connection portion 23 is a conductive bump. Here, in addition to the lateral light source, the memory 1 can also emit light above the memory 1 by arranging the light bar 2, that is to say, the light bar 2 can increase or strengthen the brightness above the memory 1, so that , when the memory module 100 is in use, it can exert the effect of emitting light on three sides. In some embodiments, the electrical connection portion 23 is a conductive wire, which is connected to the signal connection portion 116 , and this structure can also exert the benefit of the three-sided light-emitting of the memory module 100 . In addition, in the embodiments shown in FIGS. 6 and 7 , a support portion 118 is disposed between the light bar 2 and the memory 1 , and the support portion 118 is used to stabilize the light bar 2 disposed above the memory 1 . In some embodiments, the support portion 118 is a soft pad. In other embodiments, the support portion 118 is an adhesive layer (block). In some embodiments, the support portion 118 is a part of the circuit board 11 .

Please refer to FIG. 8 and FIG. 9 . FIG. 8 is a front view of the memory module 100 according to an embodiment of the present invention. FIG. 9 is an exploded schematic view of the memory module 100 of the embodiment shown in FIG. 8 . According to this embodiment, the signal connection portion 116 is located on one side of the circuit board 11 . In this embodiment, the signal connection portion 116 is a conductive layer 116c that connects the first panel portion 111 and the second panel portion 112 across. The electrical connection portion 23 is a conductive bump, and is electrically connected to the signal connection portion 116 on the side of the circuit board 11 . Here, the light bar 2 can also be used to enhance the brightness above the memory 1 .

Please refer to FIG. 10 , which shows a side view of the memory module 100 according to an embodiment of the present invention. According to this embodiment, the memory module 100 further includes the light guide element 3 . The light guide element 3 may be, but not limited to, a light guide. According to the embodiment shown in FIG. 10 , the light guide element 3 is a light guide lampshade. The light guide element 3 is located above the light emitting source 22 . With this structure, the light guide element 3 can diffuse the light emitted by the first light emitting element 115 , the second light emitting element 119 and the light emitting source 22 , so as to strengthen the lateral and lateral directions of the memory 1 . Brightness above.

Please refer to FIG. 11 to FIG. 13 , which are exploded schematic views of the memory module 100 according to an embodiment of the present invention, respectively. As shown in FIG. 11 , the signal connecting portion 116 of the memory 1 includes a slot 116d having a hole, and here, the plug 23a of the electrical connecting portion 23 of the light bar 2 is a corresponding conductive column. As shown in FIG. 12 , the signal connection portion 116 of the memory 1 is a socket 116a, and the electrical connection portion 23 of the light bar 2 is a plug connector 23b suitable for being inserted into the socket 116a. As shown in FIG. 13 , different from the embodiment shown in FIG. 12 , here, the signal connection portion 116 of the memory 1 includes a plug connector 116 b. The electrical connection portion 23 of the light bar 2 is the socket 23c corresponding to the plug. In other words, the present invention does not limit the structure of the signal connection between the signal connection portion 116 and the electrical connection portion 23 .

According to some embodiments, the light color of the light source 22 of the light bar 2 may be the same as or different from the light color of the first light emitting element 115 and the second light emitting element 119 . In addition, the present invention does not limit the number of light-emitting sources 22 . As mentioned above, it depends on the design of the light bar 2 and the circuit board 11 of the memory 1 used by the manufacturer.

According to some embodiments, the memory has a signal connection portion that can be signal-connected to the light source module to expand the brightness above the memory. According to some embodiments, the light source module is a light bar, which is located above the memory, so that the memory can exert the effect of emitting light on three sides. According to some embodiments, the memory includes light-guiding elements that enhance the diffusion of light from the top and side of the memory. According to some embodiments, the memory has a signal connection portion, the signal connection portion is connected to the electrical connection portion of the light source module, and the light source module is used to enhance the brightness above the memory, so that the number of light-emitting elements of the memory is not limited The area of the first panel portion and the second panel portion (for example, the number of light-emitting elements imposed on the first panel portion and the second panel portion). In other words, the light-emitting elements and electronic components of the memory have more room for adjustment.

According to some embodiments, the memory module includes memory with signal connections, and thus has the same benefits as these embodiments.

100: Memory module 1: memory 11: circuit board 111: The first panel part 112: Second panel part 113,113': Wafer 114: Signal transmission layer 115: The first light-emitting element 116: Signal connection 116a: Slot 116b: plug connector 116c: Conductive layer 116d: Slot 117: Light guide element 118: Support Department 119: Second light-emitting element 2: light source module, light bar 21: Electrical substrate 211: Top 22: Light source 23: Electrical connection part 23a: plug connector 23b: plug connector 23c: Slot 3: Light guide element A: Light-emitting area B: Conductive area

[FIG. 1A] shows a front view of the memory of an embodiment of the present invention. [ FIG. 1B ] A rear view of the embodiment shown in FIG. 1A is shown. [FIG. 2] shows a front view of the memory of an embodiment of the present invention. [FIG. 3] shows a front view of the memory of an embodiment of the present invention. [FIG. 4] is a three-dimensional schematic diagram of a memory according to an embodiment of the present invention. [FIG. 5] shows a side view of the memory of an embodiment of the present invention. [FIG. 6] is a front view of a memory module according to an embodiment of the present invention. FIG. 7 is an exploded schematic view of the memory module of the embodiment shown in FIG. 6 . [ FIG. 8 ] is a front view of a memory module according to an embodiment of the present invention. [FIG. 9] is an exploded schematic view of the memory module of the embodiment shown in FIG. 8. [FIG. [FIG. 10] is a side view of a memory module according to an embodiment of the present invention. [FIG. 11] is an exploded schematic diagram of a memory module according to an embodiment of the present invention. [FIG. 12] An exploded schematic diagram of a memory module according to an embodiment of the present invention. FIG. 13 is an exploded schematic view of the memory module according to an embodiment of the present invention.

1: memory

11: circuit board

111: The first panel part

113: Wafer

114: Signal transmission layer

115: The first light-emitting element

116: Signal connection

A: Light-emitting area

B: Conductive area

Claims (11)

A memory suitable for connecting with an electrical connection part of a light source module, the memory comprising: a circuit board, comprising a first panel portion and a second panel portion opposite to each other, the upper and lower sides of the first panel portion and the second panel portion respectively define a light-emitting area and a conductive area with an interval; a chip, connected to the circuit board, located between the light-emitting area and the conductive area of the first panel portion; a signal transmission layer located in one of the conductive regions; a plurality of first light-emitting elements distributed in the light-emitting area of the first panel portion; a plurality of second light-emitting elements distributed in the light-emitting region of the second panel portion; and A signal connection part is used for connecting with the electrical connection part, and the signal connection part is located at a part of the circuit board. The memory of claim 1, wherein the signal connection portion is located on an upper side of the circuit board. The memory according to claim 1, further comprising a light guide element located above the circuit board to diffuse the light emitted by the first light emitting elements and the second light emitting elements. The memory of claim 1, wherein the signal connection portion is a conductive layer that spans and connects the first panel portion and the second panel portion. The memory of claim 1, wherein the signal connection portion includes a socket. The memory of claim 1, wherein the signal connection portion includes a plug connector. A memory module comprising: a memory, containing: a circuit board, comprising a first panel portion and a second panel portion opposite to each other, the upper and lower sides of the first panel portion and the second panel portion respectively define a light-emitting area and a conductive area with an interval; a chip, connected to the circuit board, located between the light-emitting area and the conductive area of the first panel portion; a signal transmission layer located in one of the conductive regions; a plurality of first light-emitting elements distributed in the light-emitting area of the first panel portion; a plurality of second light-emitting elements distributed in the light-emitting region of the second panel portion; and a signal connection part for connecting with an electrical connection part, the signal connection part is located in a part of the circuit board; and A light bar is located above the memory, the light bar includes an electrical substrate, a plurality of light-emitting sources and the electrical connection portion, the light-emitting sources are located on a top of the electrical substrate; the electrical connection portion is located on the electrical substrate , used to connect with the signal connection part. The memory module of claim 7, further comprising a light-guiding element located above the light-emitting sources for diffusing the light emitted by the first light-emitting elements, the second light-emitting elements and the light-emitting sources light. The memory module of claim 7, wherein the signal connection portion is a conductive layer that spans across the connection between the first panel portion and the second panel portion; the electrical connection portion is a conductive bump or a conductive layer String. The memory module of claim 7, wherein the signal connection portion includes a slot; and the electrical connection portion includes a plug connector. The memory module of claim 7, wherein the signal connection portion includes a plug connector; the electrical connection portion includes a slot.

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