CN216287589U - Memory and module thereof - Google Patents
Memory and module thereof Download PDFInfo
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- CN216287589U CN216287589U CN202122996302.7U CN202122996302U CN216287589U CN 216287589 U CN216287589 U CN 216287589U CN 202122996302 U CN202122996302 U CN 202122996302U CN 216287589 U CN216287589 U CN 216287589U
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- 230000015654 memory Effects 0.000 title claims abstract description 116
- 230000008054 signal transmission Effects 0.000 claims abstract description 12
- 239000000758 substrate Substances 0.000 claims description 10
- 239000003086 colorant Substances 0.000 description 5
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 3
- 239000010931 gold Substances 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
- 238000009792 diffusion process Methods 0.000 description 2
- 230000001965 increasing effect Effects 0.000 description 2
- 230000000295 complement effect Effects 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
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Abstract
The utility model provides a memory and a module thereof. The memory is suitable for being connected with the electric connection part of the light source module and comprises a circuit board, a chip, a signal transmission layer, a first light-emitting element, a second light-emitting element and a signal connection part. The circuit board comprises a first panel part and a second panel part which are opposite, and the upper side and the lower side of the first panel part and the second panel part respectively define a light-emitting area and a conductive area with intervals. The chip is located between the light-emitting area and the conductive area of the first panel portion. The two signal transmission layers are respectively positioned in the two conductive areas. The plurality of first light-emitting elements are distributed in the light-emitting region of the first panel portion. The second light-emitting elements are distributed in the light-emitting area of the second panel part. The signal connecting part is used for being connected with the electric connecting part and is positioned at one part of the circuit board.
Description
Technical Field
The present invention relates to a memory, and more particularly, to a memory having an external connection terminal to expand its functions.
Background
With the development of technology, the development of electronic devices tends to be diversified. In the past, memory devices were generally installed in computer housings to enhance the computing speed of computers. However, with the rise of the field of electronic competitions, the use of light emitting memories is becoming more popular, and in addition to the requirement of the memories to meet the high frequency specifications, the optical visual effect generated by the memories is also more interesting.
Since the light emitting elements of a general memory are mostly disposed on both sides of the memory body, there is a problem that the luminance is insufficient above the memory body. The above problem is generally solved by increasing the number of light emitting elements in the lateral direction of the memory body.
However, as the technology of the memory advances, the number of additional electronic components is increased, the space available for the light-emitting device is limited, and the additional light-emitting device cannot complement the brightness above the memory body.
SUMMERY OF THE UTILITY MODEL
In view of this, the utility model provides a memory according to an embodiment, which is suitable for being connected to an electrical connection portion of a light source module, and the memory includes a circuit board, a chip, a signal transmission layer, a plurality of first light emitting elements, a plurality of second light emitting elements, and a signal connection portion.
The circuit board comprises a first panel part and a second panel part which are opposite, and the upper side and the lower side of the first panel part and the second panel part respectively define a light-emitting area and a conductive area with intervals. And the chip connecting circuit board is positioned between the light-emitting area and the conductive area of the first panel part. The signal transmission layer is located in one of the two conductive regions. The plurality of first light-emitting elements are distributed in the light-emitting region of the first panel portion. The second light-emitting elements are distributed in the light-emitting area of the second panel part. The signal connecting part is used for being connected with the electric connecting part and is positioned at one part of the circuit board.
In some embodiments, the memory further includes a light guide element located above the circuit board to diffuse light emitted by the first light emitting element and the second light emitting element.
In some embodiments, the signal connection portion is a conductive layer, and the signal connection portion connects the first panel portion and the second panel portion in a crossing manner.
In some embodiments, the signal connection includes a socket.
In some embodiments, the signal connection includes a plug-in structure.
The utility model further provides an embodiment of a memory module, which includes a memory and a light bar. The memory comprises a circuit board, a chip, a signal transmission layer, a plurality of first light-emitting elements, a plurality of second light-emitting elements and a signal connecting part. The circuit board comprises a first panel part and a second panel part which are opposite, and the upper side and the lower side of the first panel part and the second panel part respectively define a light-emitting area and a conductive area with intervals. And the chip connecting circuit board is positioned between the light-emitting area and the conductive area of the first panel part. The signal transmission layer is located in one of the two conductive regions. The plurality of first light-emitting elements are distributed in the light-emitting region of the first panel portion. The second light-emitting elements are distributed in the light-emitting area of the second panel part. The signal connecting part is used for being connected with the electric connecting part and is positioned at one part of the circuit board. The light bar is arranged above the memory and comprises an electric substrate, a plurality of luminous sources and an electric connection part, wherein the luminous sources are arranged at the top of the electric substrate. The electric connection part is positioned on the electric substrate and is used for being connected with the signal connection part.
In some embodiments, the memory module further includes a light guide element disposed above the light source for diffusing the light emitted from the first light emitting element, the second light emitting element and the light source.
In some embodiments, the signal connection portion is a conductive layer, and the signal connection portion connects the first panel portion and the second panel portion in a crossing manner. The electric connection part is a conductive bump or a conductive wire.
In some embodiments, the signal connection includes a socket. The electrical connection portion includes a plug.
In some embodiments, the signal connection comprises a plug. The electrical connection portion includes a socket.
According to some embodiments, the memory has a signal connection portion, which can be connected to the light source module by a signal to enhance the light emitting brightness above the memory. According to some embodiments, the light source module is a light bar, and the memory can exert the efficiency of three-side light emission. According to some embodiments, the memory includes a light guide element to enhance the light emission from the top and side of the diffusion memory. According to some embodiments, the memory has a signal connection portion connected to the electrical connection portion of the light source module, and the light source module is used to enhance the brightness above the memory, so that the number of light emitting elements and other components of the memory are more freely designed on the memory. In other words, the arrangement of the light emitting element and the electronic component of the memory is not limited by the areas of the first panel portion and the second panel portion.
According to some embodiments, the memory module comprises a memory having signal connections, and therefore, the benefits of a plurality of the described embodiments are also achieved.
Drawings
FIG. 1A shows a front view of a memory according to an embodiment of the utility model.
FIG. 1B shows a rear view of the embodiment shown in FIG. 1A.
FIG. 2 illustrates a front view of a memory according to an embodiment of the utility model.
FIG. 3 illustrates a front view of a memory according to an embodiment of the utility model.
FIG. 4 is a schematic perspective view of a memory according to an embodiment of the utility model.
FIG. 5 illustrates a side view of a memory according to an embodiment of the utility model.
FIG. 6 illustrates a front view of a memory module of an embodiment of the present invention.
FIG. 7 illustrates an exploded view of the memory module of the embodiment shown in FIG. 6.
FIG. 8 illustrates a front view of a memory module according to an embodiment of the utility model.
FIG. 9 illustrates an exploded view of the memory module of the embodiment shown in FIG. 8.
FIG. 10 illustrates a side view of a memory module of an embodiment of the utility model.
FIG. 11 is an exploded view of a memory module according to an embodiment of the utility model.
FIG. 12 is an exploded view of a memory module according to an embodiment of the utility model.
FIG. 13 is an exploded view of a memory module according to an embodiment of the utility model.
The reference numbers are as follows:
100 memory module
1 memory
11: circuit board
111 first panel part
112 the second panel part
113, 113' chip
114 signal transfer layer
115 first light emitting element
116 signal connection part
116a slot
116b plug-in connector
116c conductive layer
116d slot
117 light guide element
118 supporting part
119 second light emitting element
2 light source module and lamp strip
21: electric substrate
211, top part
22 light emitting source
23a plug connector
23b plug-in connector
23c, a slot
3: light guide element
A is a light emitting region
B conductive region
Detailed Description
Referring to fig. 1A and 1B, fig. 1A is a front view of a memory according to an embodiment of the utility model. FIG. 1B shows a rear view of the embodiment shown in FIG. 1A. The memory 1 is adapted to be connected to an electrical connection portion 23 of a light source module, which is a module having a light emitting element, such as a light bar. The electrical connection 23 may be, but is not limited to, a conductive layer (e.g., a gold finger), a conductive wire or plug, or a connector.
As shown in fig. 1A, the memory 1 includes a circuit board 11, a chip 113, a signal transmission layer 114, a plurality of first light emitting elements 115, and a signal connection portion 116. The circuit board 11 includes a first panel portion 111 and a second panel portion 112 (see fig. 1B) opposite to each other, and light-emitting regions a and conductive regions B having a space are defined on upper and lower sides of the first panel portion 111 and the second panel portion 112, respectively. The circuit board 11 is a printed circuit board 11(PCB), and the chip 113 is connected to the circuit board 11 and located between the light-emitting area a and the conductive area B of the first panel 111. According to some embodiments, there is one chip 113, and according to the embodiment shown in fig. 1A, there are multiple chips 113. The signal transfer layer 114 is located in the conductive region B of the first panel section 111 or the conductive region B of the second panel section 112. In some embodiments, the memory 1 includes two signal transmission layers 114 respectively located in the conductive region B of the first panel portion 111 and the conductive region B of the second panel portion 112 (see fig. 1B). In other words, the memory 1 includes at least one signal transmission layer 114, and the signal transmission layer 114 is a gold finger in some embodiments. The plurality of first light emitting elements 115 are distributed in the light emitting region a. The first light emitting elements 115 and the second light emitting elements 119 may be, but are not limited to, Light Emitting Diodes (LEDs), and adjacent first light emitting elements 115 have a space therebetween. The track of the first light emitting element 115 may be straight, curved, wavy or irregular, and the present invention is not limited thereto. The signal connection portion 116 is used to connect with the electrical connection portion 23 (detailed later), the signal connection portion 116 is located on a portion of the circuit board 11, that is, the signal connection portion 116 may be located at any position on the circuit board 11, and in some embodiments, the signal connection portion 116 is located on a lateral side of the circuit board 11 (i.e., on a left side or a right side of the first panel portion 111, see fig. 8). In some embodiments, the signal connection 116 is located on the upper side of the circuit board 11 (as shown in fig. 1A), however, the present invention is not limited thereto, depending on the design and circuit layout of the manufacturer, and in other embodiments, the signal connection 116 is located on the lower side of the circuit board 11.
Fig. 1B shows the second panel section 112 of the circuit board 11. The second panel section 112 is opposed to the first panel section 111. The second panel portion 112 may or may not have a chip disposed thereon. According to this embodiment, the second panel part 112 is provided with the chip 113', and the second light emitting elements 119 of the second panel part 112 are distributed and arranged in a track which is symmetrical to the first light emitting elements 115 of the first panel part 111 or different from the track of the first light emitting elements 115 of the first panel part 111.
Referring to fig. 2 to 3 and also to fig. 1A, fig. 2 shows a front view of a memory according to an embodiment of the utility model. FIG. 3 illustrates a front view of a memory according to an embodiment of the utility model. In the embodiment shown in fig. 1A, the signal connection 116 is a gold finger. However, the present invention is not limited thereto. As shown in fig. 2, the signal connection portion 116 includes a slot 116 a. As shown in fig. 3, the signal connection portion 116 includes a plug 116b, which is a conductive plug. The structure of the signal connection portion 116 depends on the type of the electrical connection portion 23 (see fig. 6) of the light source module 2 correspondingly connected to the memory 1.
Referring to fig. 4, a schematic perspective view of a memory 1 according to an embodiment of the utility model is shown. According to the embodiment of fig. 4, the conductive layer 116c of the signal connection portion 116 crosses over and connects the first panel portion 111 and the second panel portion 112. According to the embodiment shown in fig. 4, the first light emitting element 115 and the second light emitting element 119 are respectively disposed on two sides of the memory 1, so that the memory 1 can emit light laterally in a side-up state (see fig. 5).
Referring to fig. 5, a side view of the memory 1 according to an embodiment of the utility model is shown. Here, the memory 1 further includes a light guide element 117. The light guide element 117 is located above the circuit board 11 and is used for diffusing light emitted by the first light emitting element 115 and the second light emitting element 119. The Light guide element 117 may be a Light guide (Light Pipe) or a Light guide mask, and in the embodiment shown in fig. 5, the Light guide element 117 is a Light guide mask. Because the memory 1 has the light guide element 117, the brightness of the memory 1 emitting light upwards and laterally when standing on side can be enhanced.
The light colors emitted by the first light-emitting elements 115 may be the same or different, for example, the first light-emitting elements 115 of the first panel portion 111 are differentiated into different light colors along the arrangement track thereof. The lamp colors of the second light emitting elements 119 of the second panel part 112 may be the same or different. The second light emitting device 119 may also have the same or different color from the first light emitting device 115, and the present invention does not limit how many first light emitting devices 115, how many second light emitting devices 119 and how many light colors the memory 1 has, depending on the design of the manufacturer and the circuit layout of the circuit board 11.
Referring to fig. 6 and 7, fig. 6 is a front view of a memory module 100 according to an embodiment of the utility model. FIG. 7 illustrates an exploded view of the memory module 100 of the embodiment shown in FIG. 6. The memory module 100 includes a memory 1 and a light bar 2. For the description of the memory 1, please refer to fig. 1A to fig. 5 and the related description, which are not repeated herein. The light bar 2 is disposed above the memory 1, the light bar 2 includes an electrical substrate 21, a plurality of light sources 22 and an electrical connection portion 23, and the light sources 22 are disposed on a top 211 of the electrical substrate 21. The light emitting sources 22 may be, but are not limited to, light emitting diodes. The electrical connection portion 23 is located on the electrical substrate 21 for connecting with the signal connection portion 116. According to the embodiment shown in fig. 6 and 7, the signal connecting portion 116 is a conductive layer 116c, which connects the first panel portion 111 and the second panel portion 112 in a crossing manner. The electrical connection portions 23 are conductive bumps. In this case, the memory 1 has a lateral light source, and the light bar 2 is disposed above the memory 1 to emit light, that is, the light bar 2 can increase or enhance the brightness above the memory 1, so that the memory module 100 can emit light from three sides when in use. In some embodiments, the electrical connection portion 23 is a conductive wire connected to the signal connection portion 116, so that the memory module 100 can emit light on three sides. In addition, in the embodiment shown in fig. 6 and 7, a supporting portion 118 is disposed between the light bar 2 and the memory 1, and the supporting portion 118 is used to fix the light bar 2 above the memory 1. In some embodiments, the support 118 is a cushion. In other embodiments, the support portion 118 is a glue layer (block). In some embodiments, the support portion 118 is a portion of the circuit board 11.
Referring to fig. 8 and 9, fig. 8 is a front view of a memory module 100 according to an embodiment of the utility model. FIG. 9 illustrates an exploded view of the memory module 100 of the embodiment shown in FIG. 8. According to this embodiment, the signal connection portion 116 is located on one side of the circuit board 11, and in this embodiment, the signal connection portion 116 is a conductive layer 116c, which connects the first panel portion 111 and the second panel portion 112 in a crossing manner. The electrical connection portion 23 is a conductive bump, and is electrically connected to the signal connection portion 116 at the side of the circuit board 11, so as to achieve the purpose of enhancing the brightness above the memory 1 by using the light bar 2.
Referring to fig. 10, a side view of a memory module 100 according to an embodiment of the utility model is shown. According to this embodiment, the memory module 100 further includes a light guide element 3. The light guiding element 3 may be, but is not limited to, a light pipe. In the embodiment shown in fig. 10, the light guide element 3 is a light guide lampshade. The light guide element 3 is located above the light source 22, so that the light guide element 3 can diffuse the light emitted from the first light emitting element 115, the second light emitting element 119 and the light source 22 to enhance the side and top brightness of the memory 1.
Referring to fig. 11 to 13, an exploded view of a memory module 100 according to an embodiment of the utility model is shown. As shown in fig. 11, the signal connection portion 116 of the memory 1 includes a slot 116d having a hole, and herein, the plug 23a of the electrical connection portion 23 of the light bar 2 is a corresponding conductive pillar. As shown in fig. 12, the signal connection portion 116 of the memory 1 is a slot 116a, and the electrical connection portion 23 of the light bar 2 is a plug 23b adapted to be inserted into the slot 116 a. As shown in fig. 13, unlike the embodiment shown in fig. 12, the signal connection portion 116 of the memory 1 includes a plug 116 b. The electrical connection portion 23 of the light bar 2 is a slot 23c corresponding to the plug. In other words, the present invention does not limit the signal connection structure between the signal connection portion 116 and the electrical connection portion 23.
According to some embodiments, the light color of the light sources 22 of the light bar 2 can be the same as or different from the light colors of the first light emitting element 115 and the second light emitting element 119. The number of light sources 22 is not limited in the present invention, and as mentioned above, the number depends on the layout of the circuit board 11 of the memory 1 and the light bar 2 used by the manufacturer.
According to some embodiments, the memory has a signal connection part which can be connected with the light source module by a signal to expand the brightness above the memory. According to some embodiments, the light source module is a light bar and is located above the memory, so that the memory can achieve the efficiency of three-sided light emission. According to some embodiments, the memory includes a light guide element that enhances the light emission from the top and side of the diffusion memory. According to some embodiments, the memory has a signal connection portion connected to the electrical connection portion of the light source module, and the brightness above the memory is enhanced by the light source module, so that the number of the light emitting elements of the memory is not limited by the areas of the first panel portion and the second panel portion (e.g., the number of the light emitting elements is imposed on the first panel portion and the second panel portion). In other words, the light emitting device and the electronic components of the memory have more adjustment space.
According to some embodiments, the memory module comprises a memory having signal connections, and therefore, the benefits of a plurality of the described embodiments are also achieved.
Claims (11)
1. A memory adapted to be connected to an electrical connection portion of a light source module, the memory comprising:
the circuit board comprises a first panel part and a second panel part which are opposite, and a light-emitting area and a conductive area which are separated from each other are respectively defined on the upper side and the lower side of the first panel part and the second panel part;
a chip connected with the circuit board and positioned between the light-emitting area and the conductive area of the first panel part;
a signal transmission layer located in one of the conductive regions;
a plurality of first light emitting elements distributed in the light emitting region of the first panel portion;
a plurality of second light-emitting elements distributed in the light-emitting region of the second panel part; and
and the signal connecting part is used for being connected with the electric connecting part and is positioned at one part of the circuit board.
2. The memory of claim 1, wherein the signal connection is located on an upper side of the circuit board.
3. The memory of claim 1, further comprising a light guide element disposed above the circuit board for diffusing light emitted from the first and second light emitting elements.
4. The memory of claim 1, wherein the signal connection is a conductive layer that connects the first panel portion and the second panel portion across.
5. The memory of claim 1, wherein the signal connection comprises a socket.
6. The memory of claim 1, wherein the signal connection comprises a plug.
7. A memory module, comprising:
a memory, comprising:
the circuit board comprises a first panel part and a second panel part which are opposite, and a light-emitting area and a conductive area which are separated from each other are respectively defined on the upper side and the lower side of the first panel part and the second panel part;
a chip connected with the circuit board and positioned between the light-emitting area and the conductive area of the first panel part;
a signal transmission layer located in one of the conductive regions;
a plurality of first light emitting elements distributed in the light emitting region of the first panel portion;
a plurality of second light-emitting elements distributed in the light-emitting region of the second panel part; and
a signal connection part for connecting with an electric connection part, the signal connection part is positioned at one part of the circuit board; and
the light bar is positioned above the memory and comprises an electric substrate, a plurality of luminous sources and the electric connection part, wherein the plurality of luminous sources are positioned at the top of the electric substrate; the electric connection part is positioned on the electric substrate and is used for being connected with the signal connection part.
8. The memory module of claim 7, further comprising a light guide element disposed above the plurality of light sources for diffusing light emitted by the plurality of first light emitting elements, the plurality of second light emitting elements, and the plurality of light sources.
9. The memory module of claim 7 wherein the signal connection is a conductive layer that spans across the first panel portion and the second panel portion; the electrical connection part is a conductive bump or a conductive wire.
10. The memory module of claim 7, wherein the signal connection comprises a slot; the electrical connection portion includes a plug.
11. The memory module of claim 7 wherein the signal connection comprises a plug; the electrical connection portion includes a socket.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW110212036 | 2021-10-13 | ||
| TW110212036U TWM621975U (en) | 2021-10-13 | 2021-10-13 | Memory and module thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216287589U true CN216287589U (en) | 2022-04-12 |
Family
ID=80784913
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202122996302.7U Active CN216287589U (en) | 2021-10-13 | 2021-12-01 | Memory and module thereof |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN216287589U (en) |
| TW (1) | TWM621975U (en) |
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2021
- 2021-10-13 TW TW110212036U patent/TWM621975U/en unknown
- 2021-12-01 CN CN202122996302.7U patent/CN216287589U/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| TWM621975U (en) | 2022-01-01 |
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