TWM620928U - Wafer suspension arm - Google Patents
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- TWM620928U TWM620928U TW110206912U TW110206912U TWM620928U TW M620928 U TWM620928 U TW M620928U TW 110206912 U TW110206912 U TW 110206912U TW 110206912 U TW110206912 U TW 110206912U TW M620928 U TWM620928 U TW M620928U
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Abstract
本新型係一種晶圓懸浮手臂,其包含一本體,本體包含有一連接部、一右支臂及一左支臂,連接部貫穿有複數進氣孔,右支臂及左支臂的形狀及位置相對稱地分別側向凸伸於連接部,右支臂及左支臂分別具有一承載面及一流道面,各承載面形成有複數外斜孔及複數內斜孔,各外斜孔及各內斜孔間隔排列且沿右支臂及左支臂的軸向方向延伸,各流道面凹設有複數相對應的流道且各流道與各進氣孔相連通;一底蓋,其蓋設本體的底面;經由調整各孔吹出之氣體壓力,使得晶圓得以懸浮定位於左支臂與右支臂的上方,達到避免在移動的過程中刮傷晶圓之功效。This model is a wafer suspension arm, which includes a body. The body includes a connecting part, a right arm and a left arm. The connecting part is penetrated with a plurality of air inlets. The shapes and positions of the right arm and the left arm Protruding laterally from the connecting part symmetrically, the right arm and the left arm respectively have a bearing surface and a first-class road surface. Each bearing surface is formed with a plurality of outer inclined holes and a plurality of inner inclined holes, each outer inclined hole and each The inner oblique holes are arranged at intervals and extend along the axial direction of the right arm and the left arm. Each flow channel surface is recessed with a plurality of corresponding flow channels and each flow channel is communicated with each air inlet; a bottom cover, which Cover the bottom surface of the main body; by adjusting the pressure of the gas blown from the holes, the wafer can be suspended and positioned above the left arm and the right arm to avoid scratching the wafer during the movement.
Description
本新型係涉及一種晶圓移動手臂,尤指一種利用吹氣產生負壓使得晶圓可懸浮定位於其上之晶圓懸浮手臂。 The present invention relates to a wafer moving arm, in particular to a wafer levitation arm that uses air blowing to generate negative pressure so that the wafer can be suspended and positioned on it.
現有技術的晶圓搬運設備中,用於抓取及移動晶圓之機構為真空吸盤手臂(FORK),真空吸盤手臂包含一爪形片體及複數吸盤,爪形片體穿設有複數流道,各流道連接於外部抽氣裝置,各吸盤組裝於爪形片體上並且與各流道相連通,藉由抽氣裝置進行抽氣動作,使得真空吸盤手臂可利用其吸盤將晶圓吸附於其上,達到搬運晶圓之功效。 In the prior art wafer handling equipment, the mechanism for grabbing and moving the wafer is a vacuum chuck arm (FORK). The vacuum chuck arm includes a claw-shaped sheet body and a plurality of suction cups, and the claw-shaped sheet body is penetrated with a plurality of flow channels. , Each flow channel is connected to an external suction device, and each suction cup is assembled on the claw-shaped sheet body and communicated with each flow channel. The suction device is used for pumping, so that the vacuum chuck arm can use its suction cup to suck the wafer On top of it, the effect of handling wafers is achieved.
然而,前述採用吸附固定的方式,在晶圓吸附的瞬間及移動的過程中,容易因為些微之移動而導致晶圓與爪形片體之間產生摩擦而刮傷,刮傷將會導致晶圓的良率下降;因此,現有技術的真空吸盤手臂,其整體構造存在有如前述的問題及缺點,實有待加以改良。 However, the aforementioned method of adsorption and fixation is easy to cause friction and scratches between the wafer and the claw-shaped sheet due to slight movements at the moment of wafer adsorption and during the movement process. The scratches will cause the wafer to be scratched. The yield rate of the vacuum chuck is reduced; therefore, the overall structure of the vacuum chuck arm of the prior art has the above-mentioned problems and shortcomings, and it needs to be improved.
有鑒於現有技術的不足,本新型提供一種晶圓懸浮手臂,其藉於左支臂及右支臂穿設有複數外斜孔及複數內斜孔,使得吹出氣體後可將晶圓懸浮定位於其上之目的。 In view of the shortcomings of the prior art, the present invention provides a wafer suspension arm. The left arm and the right arm are provided with a plurality of outer oblique holes and a plurality of inner oblique holes, so that the wafer can be suspended and positioned on the left arm and the right arm. The above purpose.
為達上述之新型目的,本新型所採用的技術手段為設計一種晶圓懸浮手臂,其包含: 一本體,其包含有一連接部、一右支臂及一左支臂,該連接部具有一頂面及一底面,該頂面貫穿有複數進氣孔,該右支臂及該左支臂的形狀及位置相對稱地分別側向凸伸於該連接部,該右支臂及該左支臂相鄰的一側面為內側面,相對於該內側面的另一側面為外側面,該右支臂及該左支臂分別具有一承載面及一流道面,該承載面與該流道面為上下相對的二側面,各該承載面為高度自該外側面朝向該內側面的方向逐漸降低之斜面,各該承載面形成有複數外斜孔及複數內斜孔,各該外斜孔分別貫穿該右支臂及該左支臂,且各該外斜孔貫穿的方向為自該外側面朝向該內側面的方向,各該外斜孔間隔排列且沿該右支臂及該左支臂的軸向方向延伸,各該內斜孔分別貫穿該右支臂及該左支臂,且各該內斜孔貫穿的方向為自該內側面朝向該外側面的方向,各該內斜孔位於各該外斜孔的內側方向,各該內斜孔間隔排列且沿該右支臂及該左支臂的軸向方向延伸,各該流道面凹設有複數內斜流道及複數外斜流道,各該內斜流道與各該內斜孔及各該進氣孔相連通,各該外斜流道與各該外斜孔及各該進氣孔相連通;一底蓋,其固設於該連接部的該底面及各該流道面,且覆蓋各該內斜流道及各該外斜流道。 In order to achieve the above-mentioned new purpose, the technical means adopted by the present invention is to design a wafer suspension arm, which includes: A body comprising a connecting part, a right arm and a left arm. The connecting part has a top surface and a bottom surface. The shape and position respectively protrude laterally on the connecting part symmetrically, the adjacent side of the right arm and the left arm is the inner side, and the other side opposite to the inner side is the outer side, and the right branch The arm and the left support arm respectively have a bearing surface and a flow channel surface. The bearing surface and the flow channel surface are two opposite sides, each of which has a height gradually decreasing from the outer side to the inner side. Inclined surface, each of the bearing surfaces is formed with a plurality of outer oblique holes and a plurality of inner oblique holes, each of the outer oblique holes respectively penetrates the right arm and the left arm, and each of the outer oblique holes penetrates from the outer side surface In the direction of the inner side surface, the outer oblique holes are arranged at intervals and extend along the axial direction of the right arm and the left arm. Each inner oblique hole penetrates the right arm and the left arm, and each The direction in which the inner oblique holes penetrate is the direction from the inner side to the outer side, each of the inner oblique holes is located in the inner direction of each of the outer oblique holes, and the inner oblique holes are arranged at intervals and along the right arm and the left branch. The arm extends in the axial direction, and each of the flow channel surfaces is concavely provided with a plurality of inner oblique flow channels and a plurality of outer oblique flow channels. The outer oblique flow channel communicates with each of the outer oblique holes and each of the air inlet holes; a bottom cover is fixed on the bottom surface and each of the flow channel surfaces of the connecting portion, and covers each of the inner oblique flow channels and each of the flow channels. The external oblique runner.
進一步而言,所述之晶圓懸浮手臂,其中各該承載面進一步內凹形成有複數集氣槽,各該集氣槽分別沿該右支臂及該左支臂的軸向方向間隔排列且鄰近於該外側面,各該集氣槽的內徑自該內側面朝向該外側面的方向逐漸減少形成一漸縮狀。 Furthermore, in the wafer suspension arm, each of the supporting surfaces is further concavely formed with a plurality of gas collecting grooves, and each of the gas collecting grooves is arranged at intervals along the axial direction of the right arm and the left arm. Adjacent to the outer side surface, the inner diameter of each gas collecting groove gradually decreases from the inner side surface toward the outer side surface to form a tapered shape.
進一步而言,所述之晶圓懸浮手臂,其中各該集氣槽具有一入口端及一出口端,該入口端鄰近於該外斜孔,該出口端鄰近於該外側面,各該集氣槽的數量為五個,而位於中間的該集氣槽的該出口端方向為垂直於該外側面,位於二側的各該集氣槽的各出端口的方向朝向位於中間的該集氣槽方向。 Furthermore, in the wafer suspension arm, each of the gas collecting grooves has an inlet end and an outlet end, the inlet end is adjacent to the outer oblique hole, the outlet end is adjacent to the outer side surface, and each gas collecting groove The number of grooves is five, and the direction of the outlet end of the gas collecting groove in the middle is perpendicular to the outer side surface, and the direction of each outlet port of each gas collecting groove on both sides is toward the gas collecting groove in the middle direction.
進一步而言,所述之晶圓懸浮手臂,其中各該流道面凹設有複數內斜槽孔及複數外斜槽孔,各該內斜槽孔為錐形孔且與各該內斜孔相連通,各該外斜槽孔為錐形孔且與各該外斜孔相連通。 Furthermore, in the wafer suspension arm, each of the flow channel surfaces is recessed with a plurality of inner slanted slot holes and a plurality of outer slanted slot holes, and each of the inner slanted slot holes is a tapered hole and is connected to each of the inner slanted holes. Each of the outer oblique slot holes is a tapered hole and communicates with each of the outer oblique holes.
進一步而言,所述之晶圓懸浮手臂,其進一步包含複數第一定位塊及複數第二定位塊,各該第一定位塊凸設於該連接部的該頂面且分別鄰近於該右支臂及該左支臂,各該第二定位塊分別凸設於該右支臂的端部及該左支臂的端部。 Furthermore, the wafer suspension arm further includes a plurality of first positioning blocks and a plurality of second positioning blocks, each of the first positioning blocks is protrudingly provided on the top surface of the connecting portion and is respectively adjacent to the right support For the arm and the left supporting arm, each of the second positioning blocks is respectively protrudingly arranged at the end of the right supporting arm and the end of the left supporting arm.
進一步而言,所述之晶圓懸浮手臂,其中該連接部具有一前側面,該前側面位於該頂面及該底面之間且該前側面為一內凹弧面,各該第一定位塊分別形成有一第一抵靠面,該第一抵靠面相鄰於該前側面且對齊於該前側面。 Furthermore, in the wafer suspension arm, the connecting portion has a front side surface, the front side surface is located between the top surface and the bottom surface, and the front side surface is a concave arc surface, and each of the first positioning blocks A first abutting surface is respectively formed, and the first abutting surface is adjacent to and aligned with the front side surface.
進一步而言,所述之晶圓懸浮手臂,其中各該第二定位塊分別形成有一第二抵靠面,該第二抵靠面為朝向該內側面方向的一弧面且形狀對應於該前側面的形狀。 Furthermore, in the wafer suspension arm, each of the second positioning blocks is respectively formed with a second abutting surface, the second abutting surface is an arc surface facing the inner side surface and the shape corresponds to the front The shape of the side.
進一步而言,所述之晶圓懸浮手臂,其中該右支臂及該左支臂的各該外斜孔及各該內斜孔分別各有二排且呈左右交錯排列,各該外斜孔的內徑及各該內斜孔的內徑自鄰近於該連接部的一端朝向另一端的方向逐漸增加。 Furthermore, in the wafer suspension arm, each of the outer oblique holes and each of the inner oblique holes of the right arm and the left arm has two rows and are arranged in a left-right staggered arrangement, and each of the outer oblique holes The inner diameter of and the inner diameter of each of the oblique holes gradually increase from one end adjacent to the connecting portion toward the other end.
進一步而言,所述之晶圓懸浮手臂,其中各該內斜孔的軸心線及各該外斜孔的軸心線相對於該流道面的夾角的角度範圍為25~50度。 Furthermore, in the wafer suspension arm, the angle between the axis line of each of the inner oblique holes and the axis line of each of the outer oblique holes with respect to the flow channel surface is in an angle range of 25-50 degrees.
進一步而言,所述之晶圓懸浮手臂,其中各該內斜孔及各該外斜孔的內徑範圍為0.1~0.3mm。 Furthermore, in the wafer suspension arm, the inner diameter of each of the inner oblique holes and each of the outer oblique holes ranges from 0.1 mm to 0.3 mm.
本新型的優點在於,藉由調整外斜孔及內斜孔吹出之氣體壓力,使得晶圓得以懸浮定位於左支臂與右支臂的上方,達到以未接觸晶圓的方式即可移動晶圓,並且避免在移動的過程中刮傷晶圓之功效;而設置第一定位 塊及第二定位塊可進一步抵靠晶圓的側邊並將晶圓限位於其中,達到防止晶圓自側邊甩出之功效。 The advantage of this new model is that by adjusting the gas pressure blown by the outer and inner oblique holes, the wafer can be suspended and positioned above the left arm and the right arm, so that the wafer can be moved without touching the wafer. Round, and avoid scratching the wafer during the movement; and set the first positioning The block and the second positioning block can further abut against the side of the wafer and confine the wafer in it, so as to prevent the wafer from being thrown out from the side.
10:本體 10: body
11:連接部 11: Connection part
111:頂面 111: top surface
112:底面 112: Bottom
113:前側面 113: front side
114:進氣孔 114: air inlet
115:第一定位塊 115: first positioning block
116:連接頭 116: connector
117:第一抵靠面 117: The first abutment surface
12:右支臂 12: Right arm
13:左支臂 13: Left arm
14:承載面 14: Bearing surface
141:外斜孔 141: Outer oblique hole
142:內斜孔 142: Internal oblique hole
143:集氣槽 143: Air Gathering Trough
144:第二定位塊 144: second positioning block
145:入口端 145: entrance side
146:出口端 146: Exit
147:第二抵靠面 147: Second abutment surface
15:流道面 15: Runner surface
151:內斜流道 151: Internal oblique flow channel
152:外斜流道 152: External oblique runner
153:內斜槽孔 153: Internal chute hole
154:外斜槽孔 154: Outer chute hole
20:底蓋 20: bottom cover
30:晶圓 30: Wafer
圖1係本新型之立體外觀圖。 Figure 1 is a three-dimensional external view of the present invention.
圖2係本新型之分解圖。 Figure 2 is an exploded view of the present invention.
圖3係本新型之另一角度分解圖。 Figure 3 is another perspective exploded view of the present invention.
圖4係本新型之流道面下視圖。 Figure 4 is a bottom view of the flow channel of the present invention.
圖5係本新型之左支臂局部剖面圖。 Figure 5 is a partial cross-sectional view of the left arm of the present invention.
圖6係本新型之左支臂另一局部剖面圖。 Figure 6 is another partial cross-sectional view of the left arm of the present invention.
圖7係本新型之前視圖。 Figure 7 is a front view of the present invention.
圖8係本新型之局部流場示意圖。 Figure 8 is a schematic diagram of the local flow field of the present invention.
以下配合圖式以及本新型之較佳實施例,進一步闡述本新型為達成預定新型目的所採取的技術手段。 In conjunction with the drawings and the preferred embodiments of the present invention, the following further describes the technical means adopted by the present invention to achieve the intended purpose of the novel.
請參閱圖1及圖2所示,本新型之晶圓懸浮手臂,其包含一本體10及一底蓋20。
Please refer to FIG. 1 and FIG. 2, the wafer suspension arm of the present invention includes a
請參閱圖1、圖2及圖5所示,本體10包含有一連接部11、一右支臂12及一左支臂13,連接部11為一片體且具有一頂面111、一底面112及一前側面113,頂面111及底面112為上下相對的二側面,前側面113位於頂面111及底面112之間且前側面113為一內凹弧面,頂面111貫穿有複數進氣孔114及凸設有複數第一定位塊115,各進氣孔114上分別設置有一連接頭116,連接頭116用以
與外部供氣管路(圖式中未示)連接,各第一定位塊115分別鄰近於右支臂12及左支臂13,且各第一定位塊115形成有一第一抵靠面117,第一抵靠面117相鄰於前側面113且與前側面113對齊。
Please refer to Figures 1, 2 and 5, the
右支臂12及左支臂13形狀及位置相對稱地分別凸伸於連接部11,具體而言為水平間隔凸伸於連接部11的前側面113,右支臂12及左支臂13相鄰的一側面為內側面,相對於內側面的另一側面為外側面,而因為右支臂12及左支臂13結構相同形狀相對稱,故以左支臂13為例說明,左支臂13具有一承載面14及一流道面15,承載面14與流道面15為上下相對的二側面,承載面14為高度自外側面朝向內側面方向逐漸降低之斜面,各承載面14形成有複數外斜孔141、複數內斜孔142、複數集氣槽143及一第二定位塊144,各外斜孔141貫穿左支臂13的承載面14及流道面15並且其貫穿的方向為自外側面朝向內側面的方向,各外斜孔141間隔排列且沿左支臂13的軸向方向延伸,在本實施例中,各外斜孔141共有二排且呈左右交錯排列,各外斜孔141的內徑自鄰近於連接部11的一端朝向左支臂13的端部方向逐漸增加,較佳的內徑範圍為0.1~0.3mm,且各外斜孔141的軸心線相對於流道面15的夾角的角度範圍為25~50度,但不以此為限,各外斜孔141的形式及排列方式可依使用者需求作改變。
The
請參閱圖1、圖4至圖6所示,各內斜孔142貫穿左支臂13的承載面14及流道面15並自內側面朝向外側面的方向,各內斜孔142位於各外斜孔141的內側位置,各內斜孔142間隔排列且沿左支臂13的軸向方向延伸,在本實施例中,各內斜孔142共有二排且呈左右交錯排列,各內斜孔142的內徑自鄰近於連接部11的一端朝向左支臂13的端部方向逐漸增加,較佳的內徑範圍為0.1~0.3mm,且各內斜孔142的軸心線相對於流道面15的夾角的角度範圍為25~50度,但不以此為限,各內斜孔142的形式及排列方式可依使用者需求作改變。
Please refer to Figure 1, Figure 4 to Figure 6, each inner
請參閱圖1所示,各集氣槽143間隔內凹於承載面14且鄰近於外側面,各集氣槽143具有一入口端145及一出口端146,入口端145鄰近於外斜孔141,出口端146鄰近於外側面,集氣槽143的內徑自入口端145朝向出口端146的方向逐漸減少形成一漸縮狀,在本實施例中,左支臂13的集氣槽143的數量為五個,沿左支臂13的軸向方向間隔排列,位於中間的集氣槽143其出口端146方向為垂直外側面,位於二側的集氣槽143其出端口的方向朝向位於中間的集氣槽143方向,但不以此為限,集氣槽143的設置與否及集氣槽143的數量及形式可依使用者需求作改變。
Please refer to FIG. 1, each
第二定位塊144凸設於左支臂13的端部且第二定位塊144形成有一第二抵靠面147,第二抵靠面147為朝向內側面方向的一弧面且形狀對應於前側面113的形狀。
The
請參閱圖3及圖4所示,各流道面15凹設有複數內斜流道151、複數外斜流道152、複數內斜槽孔153及複數外斜槽孔154,各內斜流道151沿左支臂13的軸向方向延伸且與各內斜孔142及各進氣孔114相連通,各外斜流道152沿左支臂13的軸向方向延伸且與各外斜孔141及各進氣孔114相連通,各內斜槽孔153為錐形孔且與各內斜孔142相連通,各外斜槽孔154為錐形孔且與各外斜孔141相連通。
Please refer to Figures 3 and 4, each
底蓋20為一片體,其固設於連接部11的底面112及各流道面15,底蓋20覆蓋各內斜流道151及各外斜流道152,使得各內斜流道151及各外斜流道152封閉形成一內部空間。
The
本新型使用時,請參閱圖1、圖4及圖7所示,可藉由連接部11連接於一機械手臂(圖式中未示)使用,連接頭116與供氣管路(圖式中未示)連接,當本新型移動至晶圓30的一側面時,供氣管路將氣體自進氣孔114輸送至各內斜流道151及各外斜流道152,氣體於各內斜流道151及各外斜流道152中流動
時,會分別自各內斜孔142及各外斜孔141吹出;請參閱圖1、圖7及圖8所示,因左支臂13與右支臂12氣體吹出型態相同,故以右支臂12為例說明氣體流動狀態,經由內斜孔142吹出之氣體撞擊到晶圓30後會反射朝向內側下方方向流出,而經由左支臂13吹出之氣體亦然,故二氣體交會處與晶圓30之間所圍繞的空間會形成一真空帶,此為真空效應,經由外斜孔141吹出之氣體經由右支臂12與晶圓30之間的狹小空間而壓縮並且加速從側向方向流出,而部分氣體因為會流經集氣槽143,集氣槽143的縮口設計會使得氣體再次加速流出,而依據白努力定律可知,流速較快的氣體其壓力較流速慢的氣體低,因為位於晶圓30下方的氣體其流速較於位在晶圓30上方的氣體其流速快,因此經由外斜孔141吹出之氣體其流經晶圓30下方位置的壓力較晶圓30上方位置的壓力低,再加上前述位於左支臂13與右支臂12之間形成有真空帶,使得晶圓30上方之壓力大於下方之壓力而朝向本新型靠近,再藉由使用者調整各內斜孔142及各外斜孔141吹出之氣體壓力,使得晶圓30下方所受氣體吹拂之推力等於晶圓30上方之壓力,而晶圓30得以懸浮定位於左支臂13與右支臂12的上方,達到以未接觸晶圓30的方式即可移動晶圓30,並且避免在移動的過程中刮傷晶圓30之功效。
When the new model is used, please refer to Figure 1, Figure 4 and Figure 7. It can be used by connecting to a robot arm (not shown in the figure) through the connecting
請參閱圖1及圖7所示,前述過程中,由於設置有第一定位塊115及第二定位塊144,因此第一抵靠面117及第二抵靠面147可進一步抵靠晶圓30的側邊並限位於其中,達到防止晶圓30自側邊甩出之功效。
Please refer to FIGS. 1 and 7. In the foregoing process, since the
以上所述僅是本創作之較佳實施例而已,並非對本創作做任何形式上的限制,雖然本創作已以較佳實施例揭露如上,然而並非用以限定本創作,任何所屬技術領域中具有通常知識者,在不脫離本創作技術方案的範圍內,當可利用上述揭示的技術內容作出些許更動或修飾作為等同變化的等效實施例,但凡是未脫離本創作技術方案的內容,依據本創作的技術實質對以上實 施例所做的任何簡單修改、等同變化與修飾,均仍屬於本創作技術方案的範圍內。 The above is only the preferred embodiment of this creation, and does not impose any formal restriction on this creation. Although this creation has been disclosed as above in preferred embodiments, it is not intended to limit this creation. Any technical field has Generally knowledgeable persons, without departing from the scope of this creative technical solution, can use the technical content disclosed above to make some changes or modifications as equivalent embodiments of equivalent changes. However, any content that does not deviate from this creative technical solution shall be based on this The technical essence of the creation Any simple modifications, equivalent changes and modifications made in the embodiments still fall within the scope of the technical solution for creation.
10:本體 10: body
11:連接部 11: Connection part
111:頂面 111: top surface
112:底面 112: Bottom
113:前側面 113: front side
114:進氣孔 114: air inlet
115:第一定位塊 115: first positioning block
116:連接頭 116: connector
117:第一抵靠面 117: The first abutment surface
12:右支臂 12: Right arm
13:左支臂 13: Left arm
14:承載面 14: Bearing surface
141:外斜孔 141: Outer oblique hole
142:內斜孔 142: Internal oblique hole
143:集氣槽 143: Air Gathering Trough
144:第二定位塊 144: second positioning block
145:入口端 145: entrance side
146:出口端 146: Exit
147:第二抵靠面 147: Second abutment surface
Claims (10)
Priority Applications (1)
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TW110206912U TWM620928U (en) | 2021-06-16 | 2021-06-16 | Wafer suspension arm |
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TW110206912U TWM620928U (en) | 2021-06-16 | 2021-06-16 | Wafer suspension arm |
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Family
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI824795B (en) * | 2022-10-26 | 2023-12-01 | 盛詮科技股份有限公司 | Carrier plate suspended arm |
CN118003367A (en) * | 2024-04-09 | 2024-05-10 | 深圳市森美协尔科技有限公司 | Mechanical arm and probe station |
-
2021
- 2021-06-16 TW TW110206912U patent/TWM620928U/en unknown
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI824795B (en) * | 2022-10-26 | 2023-12-01 | 盛詮科技股份有限公司 | Carrier plate suspended arm |
CN118003367A (en) * | 2024-04-09 | 2024-05-10 | 深圳市森美协尔科技有限公司 | Mechanical arm and probe station |
CN118003367B (en) * | 2024-04-09 | 2024-06-04 | 深圳市森美协尔科技有限公司 | Mechanical arm and probe station |
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