TWM627326U - Wafer suction arm - Google Patents

Abstract

The new model relates to a wafer suction arm, which includes a main body, the main body includes a connecting part, a suction part and a flow channel part, the connecting part is located at one end of the top surface and penetrates a suction hole, and the suction part is located on the other side of the top surface. One end, and the adsorption part is formed with a plurality of adsorption channels and a plurality of adsorption holes, one end of each adsorption channel is connected, and the other end of each adsorption channel extends toward the outside, each adsorption hole penetrates each adsorption channel, and the flow channel part is located on the bottom surface and At least one drainage channel is concavely provided, one end of the drainage channel is communicated with each adsorption hole, and the other end of the drainage channel is communicated with the suction hole; a bottom cover is fixed on the bottom surface of the main body and covers the drainage channel; When the suction action is performed and the wafer is adsorbed, since the length of each adsorption channel is the same, the average suction force can be achieved to avoid the deformation of the wafer.

Description

Wafer Pickup Arm

The novel system relates to a wafer moving arm, in particular to a wafer suction arm which utilizes the suction method to enable the wafer to be positioned thereon.

A wafer handling device in the prior art, especially a suction arm (FORK) using suction technology, includes a claw-shaped sheet body and a plurality of suction holes, two arms protrude from one end of the claw-shaped sheet body, and each support wall is formed with a plurality of suction holes. Suction holes and multiple flow channels, one end of each flow channel is connected to the suction hole, and the other end is connected to the external suction device, and the suction device is used to perform the suction action, so that the suction arm can use its suction hole to suction the wafer on it , to achieve the effect of handling wafers.

However, when the suction arm of the aforementioned structure is sucking a wafer with an empty basket, because the wafer structure is relatively fragile, it is easy to cause uneven suction force because the suction force is concentrated on the left and right sides, resulting in deformation of the wafer and a decrease in yield. Therefore, the overall structure of the adsorption arm in the prior art has the aforementioned problems and shortcomings, and needs to be improved.

In view of the deficiencies of the prior art, the present invention provides a wafer suction arm, which achieves the purpose of having an average suction force by connecting one end of the suction parts and extending the other end toward the outside.

In order to achieve the above-mentioned new purpose, the technical means adopted in this new model is to design a wafer adsorption arm, which includes: a main body, which has a top surface and a bottom surface, the top surface and the bottom surface are two opposite sides, the main body includes a connecting part, an adsorption part and a flow channel part, and the connecting part is located on the top surface A suction hole runs through one end, the suction portion is located at the other end of the top surface, and the suction portion is formed with a plurality of suction channels and a plurality of suction holes, one end of each suction channel is connected, and the other end of each suction channel is connected. One end extends toward the outside, each of the adsorption holes penetrates each of the adsorption channels, the flow channel portion is located on the bottom surface and is concavely provided with at least one drainage channel, one end of the drainage channel is communicated with each of the adsorption holes, and the drainage channel is The other end is communicated with the suction hole; a bottom cover is fixed on the bottom surface of the main body and covers the drainage channel.

Further, in the wafer suction arm, the suction portion further forms an suction table, the suction table is protruded from the top surface of the main body, and each suction channel is recessed in the suction table.

Further, in the wafer suction arm, each of the suction channels is a curved flow channel, and each of the suction channels has the same length.

Further, in the wafer suction arm, a plurality of abutting blocks are protruded from one end connected to each of the suction channels, and the abutting blocks are arranged at a circumferential interval, and a cross groove is formed at intervals between the abutting blocks slotted.

Further, in the wafer suction arm, the number of the drainage channels is plural, and includes plural wide flow channels and plural narrow flow channels, and one end of each wide flow channel is communicated with the suction hole , one end of each narrow flow channel is communicated with each adsorption hole, and the other end of each narrow flow channel is communicated with the other end of each wide flow channel.

Further, in the wafer suction arm, each of the narrow flow channels is a curved flow channel, the length of each of the narrow flow channels is the same, and the bending direction of each of the narrow flow channels corresponds to that of each of the narrow flow channels. The adsorption channel is bent in the opposite direction.

Further, in the wafer suction arm, the length of each of the narrow flow channels is smaller than the length of each of the suction channels, and each of the narrow flow channels and each of the suction channels are in a divergent shape.

Further, in the wafer suction arm, the inner diameter of the suction hole gradually increases from the top surface to the bottom surface.

Further, in the wafer suction arm, the suction part further includes a plurality of alignment grooves, each of the alignment grooves is an arc-shaped long groove, and each of the alignment grooves is concave and arranged at intervals in each of the between the adsorption channel and the connecting part.

The advantage of the present invention is that when the suction part suctions the wafer, because one end of each suction channel is connected and the other end is divergent, the effect of average suction force can be achieved, and the suction table and the abutting block can be used to reach the top The wafer prevents the central part of the wafer from concave and deformed due to the influence of suction; and the length of each adsorption channel is the same, so the effect of average suction can be achieved; because the length of each narrow flow channel is smaller than the length of each adsorption channel, Therefore, when the gas flows from the adsorption channel to the narrow flow channel through the adsorption hole, a pressure difference can be generated to make the gas flow quickly to avoid the occurrence of turbulent flow.

10: Ontology

11: Connection part

111: suction hole

12: Adsorption part

121: adsorption table

122: Alignment slot

123: Adsorption channel

124: adsorption hole

125: Abutment block

126: Assembly Area

13: runner part

131: Drainage channel

132: Wide runner

133: Narrow runner

134: Confluence area

20: Bottom cover

30: Connector

40: Wafer

Figure 1 is a three-dimensional external view of the new model.

Figure 2 is an exploded view of the new model.

Figure 3 is another perspective exploded view of the present invention.

Figure 4 is a partial top view of the present invention.

Figure 5 is a partial bottom view of the present invention.

Figure 6 is a partial cross-sectional view of the present invention.

Figure 7 is another partial cross-sectional view of the present invention.

Figure 8 is a schematic diagram of the use of the new model.

The technical means adopted by the present invention to achieve the predetermined purpose of the new model are further described below in conjunction with the drawings and the preferred embodiments of the present invention.

Please refer to FIG. 1 and FIG. 2 , the wafer suction arm of the present invention includes a main body 10 and a bottom cover 20 .

Please refer to FIG. 2, FIG. 3 and FIG. 7. The main body 10 is a long strip body with a top surface and a bottom surface. The top surface and the bottom surface are two opposite sides. The main body 10 includes a connecting part 11, an adsorption part 12 and a flow channel part 13, the connecting part 11 is located at one end of the top surface and penetrates a suction hole 111, the inner diameter of the suction hole 111 gradually increases from the top surface to the bottom surface, forming a gradually expanding Shape holes, but not limited to this.

Please refer to FIGS. 2 , 4 and 6 , the adsorption portion 12 is located at the other end of the top surface, and the adsorption portion 12 is formed with an adsorption table 121 , a plurality of alignment grooves 122 , a plurality of adsorption channels 123 , a plurality of adsorption holes 124 and A plurality of abutting blocks 125 , the adsorption table 121 is protruded on the top surface of the main body 10 , and each alignment groove 122 is an arc-shaped long groove, which is recessed in the top surface of the main body 10 and arranged at intervals between the adsorption table 121 and the connecting portion 11 . During the time, each adsorption channel 123 is recessed in the adsorption table 121, and one end of each adsorption channel 123 is connected to form a gathering area 126, and the other end of each adsorption channel 123 extends toward the outside. Specifically, each adsorption channel 123 forms a divergent shape. And each adsorption channel 123 is a curved flow channel, each adsorption hole 124 penetrates each adsorption channel 123 and is adjacent to the outer position. In this embodiment, the length of each adsorption channel 123 is the same, and the aforementioned length refers to the The length of the connection line formed from the inner end face of each adsorption channel 123 to the center point of the gathering area 126, and the connection line is an imaginary line segment formed by extending along the central position of the adsorption channel 123, but not limited to this. The form of the road 123 can be changed according to the needs of the user; each abutment block 125 is protruded from the assembly area 126 , in this embodiment, the number of the abutment blocks 125 is four and they are respectively fan-shaped blocks, spaced apart from each other The surrounding arrangement forms a circular shape, and the interval between the abutting blocks 125 forms a cross groove shape, but it is not limited to this, and the form of the abutting blocks 125 can be changed according to user needs.

Please refer to FIG. 3 , FIG. 5 and FIG. 6 , the flow channel portion 13 is located on the bottom surface of the main body 10 and is recessed with at least one drainage channel 131 . The air holes 111 communicate with each other. In this embodiment, the number of drainage channels 131 is plural, including plural wide channels 132 and plural narrow channels 133. The width of the wide channels 132 is greater than the width of the narrow channels 133. One end of the wide channel 132 is communicated with the adsorption hole 124 , one end of each narrow channel 133 is communicated with each adsorption hole 124 , and the other end of each narrow channel 133 is connected to form a confluence area 134 . The channels 133 are formed in a divergent shape, and each narrow flow channel 133 is a curved flow channel. The bending direction of each narrow flow channel 133 corresponds to the curvature of each corresponding adsorption channel 123 (referring to the upper and lower connected to the same adsorption hole 124). The directions are opposite, and the opposite directions of the aforementioned bending are viewed from above. The adsorption channel 123 and the narrow flow channel 133 are respectively bent in opposite directions. The length of each narrow flow channel 133 is the same. The length of the connecting line formed from the inner end face of the narrow flow channel 133 to the center point of the confluence area 134, and the connecting line is an imaginary line segment formed by extending along the central position of the narrow flow channel 133, and the length of each narrow flow channel 133 is less than The length of each adsorption channel 123, and the other end of each wide channel 132 is connected to the confluence area 134, but not limited thereto, and the form of the channel portion 13 can be changed according to user needs.

Referring to FIG. 3 , the bottom cover 20 is a piece, which is fixed on the bottom surface of the main body 10 and covers the drainage channels 131 , so that the drainage channels 131 are closed to form an inner space.

When the new type is used, please refer to FIG. 3 and FIG. 8 , it can be connected to a mechanical arm (not shown in the figure) through the connecting part 11 , and then a connecting head 30 is arranged on the suction hole 111 , and the connecting head 30 It is connected with the suction pipe (not shown in the figure), when the adsorption part 12 of the present invention moves to one side of a wafer 40, the suction pipe performs the suction action to draw the external air from the suction hole through the suction channel 123 124 is sucked in, and then flows through the narrow flow channel 133 and the wide flow channel 132 and enters the suction pipeline from the suction hole 111, so that the wafer 40 is sucked against the suction table 121, and because each suction channel 123 is in the shape of a Divergent shapes and the same length can achieve the effect of average suction. The suction stage 121 and the abutting block 125 can be used to abut the wafer 40 to prevent the central part of the wafer 40 from being concave and deformed due to the influence of suction.

In the aforementioned process, since the positions of the alignment grooves 122 correspond to wafers 40 of different sizes, when the wafer 40 is positioned on the suction table 121 , the edge of the wafer 40 will be aligned with the alignment grooves 122 . In addition to facilitating the user to quickly identify the size of the wafer 40 , it can also be used to determine whether the position of the suction wafer 40 is centered without deviating from the center.

In the aforementioned process, since the length of each narrow flow channel 133 is smaller than the length of each adsorption channel 123 , when the gas flows from the adsorption channel 123 to the narrow flow channel 133 through the adsorption hole 124 , a pressure difference can be generated to make the gas flow quickly and further. Avoid turbulence.

In the aforementioned process, since the suction hole 111 is a gradually expanding hole, when the gas enters the suction hole 111 from the wide flow channel 132, the inner diameter of the suction hole 111 is gradually reduced, which can produce the effect of increasing the flow rate, so as to increase the flow rate. Improve gas flow efficiency.

The above is only a preferred embodiment of the creation, and does not limit the creation in any form. Although the creation has been disclosed as a preferred embodiment, it is not intended to limit the creation. Those of ordinary knowledge, within the scope of the technical solution of the creation, can make some changes or modifications by using the technical content disclosed above as an equivalent embodiment of equivalent changes, but any content that does not depart from the technical solution of the creation, according to this The technical essence of the creation Any simple modifications, equivalent changes and modifications made to the above embodiments still fall within the scope of the technical solution of the creation.

10: Ontology

11: Connection part

111: suction hole

12: Adsorption part

121: adsorption table

122: Alignment slot

123: Adsorption channel

124: adsorption hole

125: Abutment block

Claims (9)

A wafer suction arm, comprising: a main body, which has a top surface and a bottom surface, the top surface and the bottom surface are two opposite sides up and down, the main body includes a connection part, an adsorption part and a flow channel part , the connecting part is located at one end of the top surface and has a suction hole running through it, the suction part is located at the other end of the top surface, and the suction part is formed with a plurality of adsorption channels and a plurality of adsorption holes, one end of each adsorption channel connected to each other, the other end of each of the adsorption channels extends toward the outside, each of the adsorption holes penetrates through each of the adsorption channels, the flow channel portion is located on the bottom surface and is concavely provided with at least one drainage channel, one end of the drainage channel is connected to each of the The suction hole is communicated with, and the other end of the drainage channel is communicated with the suction hole; a bottom cover is fixed on the bottom surface of the main body and covers the drainage channel. The wafer suction arm of claim 1, wherein the suction part is further formed with a suction table, the suction table is protruded from the top surface of the main body, and each of the suction channels is recessed in the suction table. The wafer suction arm according to claim 1 or 2, wherein each of the suction channels is a curved flow channel, and each of the suction channels has the same length. The wafer suction arm according to claim 3, wherein a plurality of abutment blocks are protruded from one end connected to each of the suction channels, and the abutment blocks are arranged at a circumferential interval, and a cross groove is formed at an interval between the abutment blocks slotted. The wafer suction arm according to claim 4, wherein the number of the drainage channels is plural, and includes plural wide flow channels and plural narrow flow channels, and one end of each of the wide flow channels is communicated with the suction hole , one end of each narrow flow channel is communicated with each adsorption hole, and the other end of each narrow flow channel is communicated with the other end of each wide flow channel. The wafer suction arm according to claim 5, wherein each of the narrow flow channels is a curved flow channel, the length of each of the narrow flow channels is the same, and the bending direction of each of the narrow flow channels corresponds to that of each of the narrow flow channels. The adsorption channel is bent in the opposite direction. The wafer suction arm according to claim 6, wherein the length of each of the narrow flow channels is less than the length of each of the suction channels, and each of the narrow flow channels and each of the suction channels are divergent. The wafer suction arm according to claim 7, wherein the inner diameter of the suction hole gradually increases from the top surface to the bottom surface. The wafer suction arm according to claim 8, wherein the suction part further comprises a plurality of alignment grooves, each of the alignment grooves is an arc-shaped long groove, and each of the alignment grooves is concave and arranged at intervals in each of the between the adsorption channel and the connecting part.

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