JP2619436B2 - Plate-like holding device - Google Patents
Plate-like holding deviceInfo
- Publication number
- JP2619436B2 JP2619436B2 JP62300238A JP30023887A JP2619436B2 JP 2619436 B2 JP2619436 B2 JP 2619436B2 JP 62300238 A JP62300238 A JP 62300238A JP 30023887 A JP30023887 A JP 30023887A JP 2619436 B2 JP2619436 B2 JP 2619436B2
- Authority
- JP
- Japan
- Prior art keywords
- plate
- holding
- fluid
- gas
- suction
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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- Manipulator (AREA)
- Sheets, Magazines, And Separation Thereof (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Description
【発明の詳細な説明】 〔産業上の利用分野〕 本発明は、流体を用いて例えば半導体ウエハのような
板状体を非接触で保持する装置に関する。Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an apparatus for holding a plate-like body such as a semiconductor wafer in a non-contact manner using a fluid.
〔従来の技術〕 従来、吸込管と吐出管とを組み合わせ、吸込管による
流体の吸引力と、吐出管よりの流体の噴出力を板状体の
表面に作用させて、板状体を非接触で保持することは一
般に知られており、例えば特公昭51−40343号公報によ
り開示されている。[Prior art] Conventionally, a suction pipe and a discharge pipe are combined, and the suction force of the fluid by the suction pipe and the ejection power of the fluid from the discharge pipe act on the surface of the plate-like body, so that the plate-like body does not contact. Is generally known, and is disclosed, for example, in Japanese Patent Publication No. 51-40343.
吸込管および吐出管から流体を流入および流出させ
て、板状体を管の先端部に非接触で保持する従来技術で
は、板状体の面に対して垂直方向の変位に対する吐出管
内流量の変化が小さいことから、板状体に対する保持
力、特に保持復元力が小さい。また、板状体の流体力が
作用する領域は吸込管入口および吐出管出口の局所に限
定されるため保持力の安定性に欠けるという問題があつ
た。In the related art in which fluid flows in and out of the suction pipe and the discharge pipe to hold the plate body in a non-contact state at the tip of the pipe, the change in the flow rate in the discharge pipe with respect to the displacement in the direction perpendicular to the plane of the plate body is known. , The holding force on the plate-like body, particularly the holding / restoring force, is small. Further, since the region of the plate-like body where the fluid force acts is limited to the local portions of the inlet of the suction pipe and the outlet of the discharge pipe, there is a problem that the stability of the holding force is lacking.
さらに、より大きい保持力を得ようとすれば、吸込管
および吐出管の出口面積を拡大し、管先端部と板状体と
の間のすきま間隔を小さく設定する必要があるが、非接
触の状態を維持して、確実で、かつ安定したハンドリン
グを行なうためには、板状体をつかむときおよび解放し
所定の場所に置くとき、管先端部と板状体との間のすき
まが平行、かつ適切な間隔となるように保持装置を精度
良く位置決めする必要があつた。例えば、板状体をつか
むときに保持装置の位置決め精度が悪いと、板状態が管
先端部に接触したり、あるいは反対に両者が離れ過ぎて
吊り上げることができなくなるといつた不具合が生じ
る。Further, in order to obtain a larger holding force, it is necessary to increase the outlet area of the suction pipe and the discharge pipe and to set a small clearance between the pipe tip and the plate-like body. In order to maintain a state and perform reliable and stable handling, the gap between the pipe tip and the plate is parallel when the plate is gripped and released and put in place. In addition, it is necessary to accurately position the holding device so as to have an appropriate interval. For example, if the positioning accuracy of the holding device is poor when the plate-like body is gripped, a problem occurs when the plate is in contact with the tube tip or when the two are too far apart to be lifted.
本発明の目的は、気体を吹き出す気体噴出部と、気体
を吸引する気体吸引部とを有する保持ユニットと、この
保持ユニットと一体に形成され板状体を保持する保持盤
と、この保持盤の前記気体噴出部と気体吸引部とを備え
た面の裏側に設けられた保持盤支持部とを備えた板状体
の保持装置において、誤動作等で保持ユニットが過渡に
板状体に近づくようなことがあっても、保持ユニットと
板状体表面との隙間を適正に保ち、保持ユニットと板状
体とが接触することがない板状体の保持装置を提供する
ことにある。SUMMARY OF THE INVENTION An object of the present invention is to provide a holding unit having a gas ejection unit for blowing gas, a gas suction unit for sucking gas, a holding plate formed integrally with the holding unit and holding a plate-like body, and a holding plate for the holding plate. In a holding device for a plate-shaped body provided with a holding plate supporting portion provided on the back side of a surface provided with the gas ejection portion and the gas suction portion, the holding unit may transiently approach the plate-shaped body due to malfunction or the like. Even if there is a case, an object of the present invention is to provide a plate-like body holding device in which a gap between the holding unit and the plate-like body is appropriately maintained, and the holding unit and the plate-like body do not come into contact with each other.
上記目的を達成するため本発明による板状体の保持装
置は、気体を吹き出す気体噴出部と、気体を吸引する気
体吸引部とを有する保持ユニットと、この保持ユニット
と一体に形成され板状態を保持する保持盤と、この保持
盤上に、前記保持ユニットの前記気体噴出部と気体吸引
部とを備えた面の裏側に設けられた保持盤支持部とを備
えた板状体の保持装置において、前記保持盤支持部と前
記保持モジュールとの間に設けられ、この保持盤と前記
保持ユニットとを前記保持盤支持部に対してスライド自
在に支持する緩衝手段を備えた構成とするものである。In order to achieve the above object, a holding device for a plate-like body according to the present invention includes a holding unit having a gas ejection unit for blowing gas and a gas suction unit for sucking gas, and a plate state formed integrally with the holding unit. A holding device for a plate-like body comprising: a holding plate for holding; and a holding plate supporting portion provided on a back side of a surface provided with the gas ejection portion and the gas suction portion of the holding unit on the holding plate. And a buffer provided between the holding plate support portion and the holding module, and configured to support the holding plate and the holding unit slidably with respect to the holding plate support portion. .
本発明では緩衝手段により保持盤支持部に対しスライ
ド自在に支持される保持盤と一体に形成された保持ユニ
ツトに流体噴出部と流体吸引部とを設け、液体級陰部は
保持ユニツト下面と板状体との間に形成されるすきま内
の平均圧力を外気圧以下にして、負圧により板状体の重
量を支持する一方、流体噴出部は絞り機構を通して外気
圧以上に加圧した流体を上記すきま内に供給する。すき
ま内の流体の圧力はすきまの間隔が大きくなければ減少
し、反対にすきまの間隔が小さくなければ増加する。こ
のため、板状体は流体吸引部の負圧力との相互作用によ
り一定の微小なすきま間隔を保つて非接触で保持され
る。In the present invention, the holding unit integrally formed with the holding plate slidably supported by the holding plate supporting portion by the buffer means is provided with a fluid ejection portion and a fluid suction portion, and the liquid-grade negative portion is formed in a plate-like shape with the lower surface of the holding unit. The average pressure in the gap formed between the body and the body is made equal to or less than the outside pressure, and the weight of the plate-like body is supported by negative pressure. Supply in the gap. The pressure of the fluid in the gap decreases if the gap is not large, and increases if the gap is not small. For this reason, the plate-shaped body is held in a non-contact manner while maintaining a constant small clearance by interaction with the negative pressure of the fluid suction unit.
また、保持ユニットは緩衝手段により支持部に対して
スライド自在に支持されるので、板状体をつかむときお
よび解放して台の上に置くとき、板状体と保持ユニット
下面とが適正な隙間間隔を越えて接近し過ぎた場合で
も、発生する流体による反発力により保持ユニットが板
状体表面に対してスライドして浮き上がり、両者の隙間
を適正に保ち接触を回避できる。Also, since the holding unit is slidably supported by the supporting portion by the buffer means, when the plate-like body is gripped and released and placed on the table, an appropriate gap is formed between the plate-like body and the lower surface of the holding unit. Even in the case of approaching too far beyond the interval, the holding unit slides and floats on the surface of the plate-like body due to the repulsive force of the generated fluid, and the gap between the two can be properly maintained to avoid contact.
以下、図面を参照して本発明の一実施例について説明
する。Hereinafter, an embodiment of the present invention will be described with reference to the drawings.
第１図は本発明の参考例による板状体の保持装置の縦
断面図、第２図は第１図の保持装置の下面図である。第
１図および第２図において、１は非接触で保持される例
えば半導体ウエハ等の板状体、２は板状体１を保持する
ための保持盤、３は保持盤２の盤面に等間隔に配設され
た３個の保持ユニツトで、その下面3Aは保持盤２の底面
より突出している。４は保持ユニツト下面3Aと板状体１
との間に形成されるすきま、５は板状体１の水平方向の
移動を阻止するため保持盤２の外周端面に取り付けられ
たガイドである。３個の保持ユニツト３はいずれも同じ
構成になつており、各保持ユニツトには外気圧以外に加
圧して流体をすきま４へ流出させる流体噴出部31と、流
体を吸引してすきま４内の平均圧力を外気圧以下に保つ
流体吸引部32とが設けられている。流体噴出部31は保持
ユニツト下面3Aの中央に設けた開口部311と、絞り機構3
12および流体供給孔313よりなり、流体吸引部32は保持
ユニツト下面3Aの外周に設けた環状溝321と、それに通
ずる流体吸引孔322とで構成されている。６は流体供給
源、７は流体供給源６と流体供給孔313を結ぶ管路、８
は流体吸引源、９は流体吸引源８と流体吸引孔322を結
ぶ管路、10は球面軸受、11は取付部で、保持盤２および
これに配設されている保持ユニツト３は球面軸受11を介
して取付部11により懸垂，支持され、回動自在となつて
いる。FIG. 1 is a longitudinal sectional view of a plate-like body holding device according to a reference example of the present invention, and FIG. 2 is a bottom view of the holding device of FIG. 1 and 2, reference numeral 1 denotes a plate-like body, such as a semiconductor wafer, which is held in a non-contact manner; 2, a holding plate for holding the plate-like body 1; The lower surface 3A protrudes from the bottom surface of the holding plate 2. 4 is the holding unit lower surface 3A and the plate 1
And a guide 5 attached to the outer peripheral end surface of the holding plate 2 for preventing the plate-like body 1 from moving in the horizontal direction. Each of the three holding units 3 has the same structure. Each holding unit 3 has a fluid ejection part 31 for applying a fluid other than an external pressure to the gap 4 and a fluid ejecting part 31 for sucking the fluid to the inside of the gap 4. A fluid suction unit 32 for keeping the average pressure at or below the external pressure is provided. The fluid ejection part 31 has an opening 311 provided at the center of the lower surface 3A of the holding unit,
The fluid suction portion 32 is composed of an annular groove 321 provided on the outer periphery of the lower surface 3A of the holding unit and a fluid suction hole 322 communicating therewith. 6 is a fluid supply source, 7 is a conduit connecting the fluid supply source 6 and the fluid supply hole 313, 8
Is a fluid suction source, 9 is a conduit connecting the fluid suction source 8 and the fluid suction hole 322, 10 is a spherical bearing, 11 is a mounting portion, and the holding plate 2 and the holding unit 3 provided on the holding plate 2 are spherical bearings 11. And is suspended and supported by the mounting portion 11 through the shaft, and is rotatable.
第３図は流体供給源６の機器構成を示す供給系統図
で、加圧ポンプ61と、その駆動モータ62と、加圧ポンプ
61によつて加圧された流体の圧力を調整する圧力レギユ
レータ63と、流体の供給をオン−オフする弁装置64と、
塵埃を除去するフイルタ65とで構成されている。FIG. 3 is a supply system diagram showing a device configuration of the fluid supply source 6, and includes a pressurizing pump 61, a driving motor 62 thereof, and a pressurizing pump.
A pressure regulator 63 for adjusting the pressure of the fluid pressurized by 61, a valve device 64 for turning on and off the supply of the fluid,
And a filter 65 for removing dust.
第４図は流体吸引源８の機器構成を示す吸引系統図
で、真空ポンプ81と、その駆動モータ82と、管路９を大
気に解放する可変絞り弁83と、流体の吸引をオン−オフ
する弁装置84とで構成されており、可変絞り弁83の絞り
を調節することにより負圧を調整することができる。FIG. 4 is a suction system diagram showing the device configuration of the fluid suction source 8, which includes a vacuum pump 81, a drive motor 82 thereof, a variable throttle valve 83 for releasing the pipe 9 to the atmosphere, and turning on and off the suction of the fluid. The negative pressure can be adjusted by adjusting the throttle of the variable throttle valve 83.
次に、上記構成による板状体の保持装置の動作を説明
するが、まず、保持ユニツト３により板状体１を非接触
で保持する作動の原理を示すと下記のとおりである。Next, the operation of the plate-like body holding device having the above configuration will be described. First, the principle of the operation of holding the plate-like body 1 in a non-contact manner by the holding unit 3 is as follows.
第５図は板状体１の保持動作を説明するための部分断
面図で、流体吸引源８を作動させると、これによつて管
路9,流体吸引孔322を通して環状溝321から流体が吸引さ
れ、この環状溝32内の圧力が外気圧以下に減圧される。
一方、環状溝321内の圧力により高い圧力に保たれてい
る流体供給源６は、加圧流体を管路7,流体供給孔313か
ら絞り機構312を通してすきま４に供給し、この部分に
外気圧以上の圧力を与えている。このとき、すきま４内
の圧力およびこの圧力から計算される板状体１に働く力
は、理論的に以下のようになる。FIG. 5 is a partial sectional view for explaining the holding operation of the plate-like body 1. When the fluid suction source 8 is operated, the fluid is sucked from the annular groove 321 through the pipe 9 and the fluid suction hole 322. Then, the pressure in the annular groove 32 is reduced to the external pressure or less.
On the other hand, the fluid supply source 6 maintained at a high pressure by the pressure in the annular groove 321 supplies the pressurized fluid from the conduit 7 and the fluid supply hole 313 to the clearance 4 through the throttle mechanism 312, and the external pressure is applied to this portion. The above pressure is given. At this time, the pressure in the gap 4 and the force acting on the plate-like body 1 calculated from this pressure are theoretically as follows.
いま、すきま４内の流れは、すきま４の間隔ｈを十分
小さくとるとき、等温，層流で、慣性力と比較して粘性
力が支配的な流れであると仮定できる。第６図は第５図
の寸法関係を示す説明図で、この場合、すきま４内の流
れに対し、第６図に示す座標系および記号を用いて、次
の方程式および境界条件が成立する。Now, it can be assumed that the flow in the gap 4 is an isothermal and laminar flow and the viscous force is dominant as compared with the inertial force when the interval h between the gaps 4 is sufficiently small. FIG. 6 is an explanatory diagram showing the dimensional relationship of FIG. 5. In this case, the following equations and boundary conditions are established for the flow in the gap 4 using the coordinate system and symbols shown in FIG.
r,h≧ｒ≧r0のすきまに対し、 Ｐ＝Pc at r＝r1,P＝Pr at r＝r0 …（２） ra≦ｒ≦rbのすきまに対し、 Ｐ＝Pr at r＝ra,P＝Pa at r＝rb …（３） ここで、 r:保持ユニツト３の中心からすきま４のひろがり方向に
測つた座標 h:すきま４の間隔 P:すきま４内の圧力 r1:開口部311の半径 r0:環状溝321に囲まれた保持ユニツト下面3Aの外半径，
環状溝321の内半径 ra:環状溝321の外半径 rb:保持ユニツト下面3Aの半径 Pc:開口部311内の圧力 Pr:環状溝321の圧力 Pa:外気圧 このすきま４内の流れ（圧力）の式に対し、流対供給
孔313に介設された絞り機構312を通る気体質量流量Ｒ
は、 ここで、 CD:オリフイス絞り流量係数 （空気に対してはCD0.85） R:ガス定数 T:気体の絶対温度 PS:流体供給孔313に供給される気体の圧力 K:気体の比熱比 また、r1≦ｒ≦r0のすきま４内を流れる気体質量流量
ｈは、 ここで、 μ：気体の粘性係数 と表わされ、これらの気体質流量R,ｈには、次の連
続条件が課せられる。Ｒ ＝ｈ …（６） 以上、式（１）〜（６）がすきま４内の流れに対する
基礎式であり、これらを解くことにより、すきま４内の
圧力が求まる。そして求まつたすきま４内の圧力より、
板状対１に働く吸引力Ｆ（上向き正）は次式のように表
わされる。 r, with respect to a gap of h ≧ r ≧ r 0, to the gap of P = P c at r = r 1, P = P r at r = r 0 ... (2) r a ≦ r ≦ r b, P = P r at r = r a , P = P a at r = r b (3) where, r: coordinates measured from the center of the holding unit 3 in the direction of spread of the clearance 4 h: interval of the clearance 4 P: clearance Pressure inside r 1 : radius of opening 311 r 0 : outer radius of lower surface 3A of holding unit surrounded by annular groove 321,
Inner radius r a of the annular groove 321: outer radius r b of the annular groove 321: radius P c of the holding Yunitsuto lower surface 3A: pressure P r in the opening 311: Pressure of the annular groove 321 P a: outside air pressure within the gap 4 Of the gas flow rate (pressure), the gas mass flow rate R through the throttle mechanism 312 provided in the flow supply hole 313
Is Where, C D : orifice throttle flow coefficient (C D 0.85 for air) R: gas constant T: absolute temperature of gas P S : pressure of gas supplied to fluid supply hole 313 K: specific heat ratio of gas Also, the mass flow rate of gas flowing in the gap 4 where r 1 ≦ r ≦ r 0
h is Here, μ is expressed as the viscosity coefficient of gas, and the following continuous conditions are imposed on these gas mass flow rates R and h . R = h (6) As described above, the equations (1) to (6) are the basic equations for the flow in the gap 4, and the pressure in the gap 4 can be obtained by solving them. And from the pressure in the clearance 4
The suction force F (upward positive) acting on the plate-like pair 1 is expressed by the following equation.
ここで圧力Ｐについての式（１）〜（３）の解は ただしここでPcは未知であり、このPcは式（４）〜
（６）より定まる。 Here, the solutions of the equations (1) to (3) for the pressure P are Here, P c is unknown, and this P c is calculated according to equations (4) to (4).
Determined from (6).
第７図は以上の式（１）〜（７）より、すきま４の間
隔を変えて板状体１に働く吸引力Ｆを計算した結果を示
す板状体１の保持動作特性図で、以下第５図および第７
図により保持装置の動作を説明する。FIG. 7 is a holding operation characteristic diagram of the plate-like body 1 showing a result of calculating the suction force F acting on the plate-like body 1 by changing the interval of the gap 4 from the above equations (1) to (7). FIG. 5 and FIG.
The operation of the holding device will be described with reference to the drawings.
いま、すきま４の間隔が設計すきま間隔haで、板状体
１が第５図の実線で示す位置にあるときに吸引力と板状
体１の重量とが釣り合うように設定されているものとす
る。このとき、板状体１が第５図の破線で示す位置に移
動して、すきま４の間隔がhbに増加すると、板状体１に
働く吸引力は、第７図に示す如く板状体１の重量より大
きくなり、板状体１には、設計すきま間隔haの位置に引
き戻す復元力が働く。同様にして、すきま４の間隔が設
計すきま間隔hbより小さくなつた場合にも、板状体１に
はその位置を設計すきま間隔haの位置に戻す方向に復元
力が働く。これにより、板状体１は保持ユニツト3Aとす
きま４の間隔haを隔てて非接触に保持され、保持盤２の
姿勢が変つても安定して、この状態を維持することがで
きる。Now, at intervals designed gap distance h a gap 4, which the weight of the suction force and the plate-like body 1 is set so as to balance when the plate-like body 1 is in the position shown in solid lines in Figure 5 And In this case, the plate-like body 1 is moved to the position indicated by the broken line in FIG. 5, the width of the gap 4 is increased to h b, the suction force acting on the plate-like body 1, as shown in Figure 7 the plate The weight becomes larger than the weight of the body 1 and a restoring force acts on the plate-shaped body 1 to return the plate-shaped body 1 to the position of the design clearance ha. Similarly, even when the distance of the gap 4 has decreased less than the design clearance distance h b, the restoring force acts in a direction to return the position to the position of the design clearance distance h a in the plate-like body 1. Thus, the plate-like body 1 is held by the holding Yunitsuto 3A and spacing h a a separated by non-contact gap 4, varying the attitude of the holding plate 2 connexion stable, it is possible to maintain this state.
また、このとき負圧に保たれる環状溝321は、開口部3
11を取り囲むように環状に設けられているので、開口部
311からすきま４内へ流入した流体はすべて環状溝321内
へ吸引回収され、外部に噴出することはない。逆に、保
持盤２の外周から外気が環状溝321内に流入するが、環
状溝321内の負圧の大きさは200〜300mm水柱程度であ
り、すきま４の間隔ｈも従来のベルヌイ原理を利用した
保持装置と異なつて小さく設定できるので、すきま４内
へ流入させる流体の流量は少なくてよい。At this time, the annular groove 321 maintained at the negative pressure has the opening 3
Because it is provided in an annular shape so as to surround 11
All of the fluid that has flowed into the gap 4 from 311 is sucked and collected into the annular groove 321 and does not jet out. Conversely, outside air flows from the outer periphery of the holding plate 2 into the annular groove 321. The magnitude of the negative pressure in the annular groove 321 is about 200 to 300 mm water column, and the interval h between the gaps 4 is based on the conventional Bernoulli principle. Since the holding device can be set differently from the used holding device, the flow rate of the fluid flowing into the clearance 4 may be small.
第８図は第１図に示す板状体の保持装置の部分断面図
で、以下この図により板状体をつかむときおよび解放し
て台12の上に置くときの動作について説明する。なお、
板状体１が載置される台12と保持盤２のガイド５が接触
するのを避けるため、台12には凹部121が形成されてい
る。FIG. 8 is a partial cross-sectional view of the plate-like body holding device shown in FIG. 1. The operation when the plate-like body is gripped and released and placed on the table 12 will be described below with reference to FIG. In addition,
A recess 121 is formed in the table 12 in order to avoid contact between the table 12 on which the plate-shaped body 1 is placed and the guide 5 of the holding plate 2.
まず、流体供給源６の弁装置64および流体吸引源８の
弁装置84を開にして保持機構を作動させる。但し、ここ
で保持盤２を板状体１に近づけると、十分近づかないう
ちに、板状体１が台12を離れて飛び上り、保持盤２に保
持され、そのとき片当りによつて板状体１が保持ユニツ
ト下面3Aに接触することがある。これを避けるには、ま
ず流体供給源６による流体の供給のみを作動させ、流体
吸引源８による流体の吸引は停止させた状態で保持盤２
を板状体１に近づけ、保持ユニツト下面3Aと板状体１の
間に十分小さなすきまが形成された後、流体の吸引を作
動させるようにすればよい。First, the valve mechanism 64 of the fluid supply source 6 and the valve mechanism 84 of the fluid suction source 8 are opened to operate the holding mechanism. However, when the holding plate 2 is brought closer to the plate member 1, the plate member 1 jumps away from the base 12 and is held by the holding plate 2 before approaching sufficiently. The shape 1 may come into contact with the lower surface 3A of the holding unit. In order to avoid this, first, only the supply of the fluid by the fluid supply source 6 is operated, and the suction of the fluid by the fluid suction source 8 is stopped.
May be brought close to the plate-like body 1 and after a sufficiently small clearance is formed between the lower surface 3A of the holding unit and the plate-like body 1, the suction of the fluid may be activated.
このようにして、保持機構を作動させた状態で保持盤
２を加工させ板状体１に十分近づけると、３個の保持ユ
ニツト３は相互に均衡を保つ方向に働き、保持ユニツト
下面3Aと板状体１のすきま４が所定の間隔になるように
作動して、板状体１は非接触で安定保持される。In this way, when the holding plate 2 is processed and brought sufficiently close to the plate-like body 1 in a state where the holding mechanism is operated, the three holding units 3 work in a direction to keep balance with each other, and the holding unit lower surface 3A and the plate The plate 1 is stably held in a non-contact manner by operating so that the gap 4 of the plate 1 is at a predetermined interval.
次に、保持した状態から板状体１を解放し、台12の上
に置く場合は、保持盤２を台12に近づけ板状体１が台12
に接触する状態にし、まず流体吸引源８の弁装置84を操
作して流体の吸引のみを停止し保持盤２を持ち上げる
が、板状体１は非接触状態のままである。そして、この
間板状体１と保持ユニツト下面3Aの非節所状態を維持す
るために流体供給源６より加圧流体の供給を継続する
が、板状体１が完全に保持盤２から離脱した段階で流体
供給源６の弁装置64を操作して加圧流体の供給を停止す
る。Next, when releasing the plate 1 from the held state and placing it on the table 12, the holding plate 2 is brought close to the table 12 and the plate 1 is
First, only the suction of the fluid is stopped by operating the valve device 84 of the fluid suction source 8 and the holding plate 2 is lifted, but the plate 1 remains in the non-contact state. Then, the pressurized fluid is continuously supplied from the fluid supply source 6 in order to maintain the non-joint state between the plate-like body 1 and the holding unit lower surface 3A, but the plate-like body 1 is completely separated from the holding plate 2. At this stage, the supply of the pressurized fluid is stopped by operating the valve device 64 of the fluid supply source 6.
かくて、本発明の参考例によれば保持ユニツト３は球
面軸受10を介して取付部11により懸垂，支持されて傾斜
角を自由に変えることができるので、板状体１に対する
保持盤２の位置決め精度が悪い場合、または台12が水平
面に対して傾斜の異なる複数の平面よりなつている場合
でも、平衡を保持することができ、板状体１が保持ユニ
ツト下面3Aに接触したり、またはすきま４の間隔が広く
なり過ぎて板状体１をつかめなくなるといつた不具合を
解消することができる。Thus, according to the reference example of the present invention, the holding unit 3 is suspended and supported by the mounting portion 11 via the spherical bearing 10 so that the inclination angle can be freely changed. Even when the positioning accuracy is poor, or when the table 12 is formed of a plurality of planes having different inclinations with respect to the horizontal plane, the balance can be maintained, and the plate-shaped body 1 contacts the holding unit lower surface 3A, or If the gap between the gaps 4 becomes too wide and the plate-like body 1 cannot be grasped, it is possible to solve the problem that may occur.
第９図は本発明の実施例を示す板状体の保持装置の縦
断面図で、この実施例では軸受支持機構として球面軸受
10の代りに直動軸受13を用いるようにしている。直動軸
受13は取付部11に嵌着され、その軸13Aの移動により保
持盤２を上，下動が可能なように支持している。軸13A
の上端にはフランジ13Bが形成され、保持盤２が板状体
１を非接触で保持し、これを持ち上げるとき自重により
軸13Aが下降するがフランジ13Bが直動軸受13の上端に当
接する。FIG. 9 is a longitudinal sectional view of a plate-like body holding device showing an embodiment of the present invention. In this embodiment, a spherical bearing is used as a bearing support mechanism.
The linear motion bearing 13 is used in place of 10. The linear motion bearing 13 is fitted to the mounting portion 11, and supports the holding plate 2 so that the holding plate 2 can move up and down by movement of the shaft 13A. Shaft 13A
A flange 13B is formed at the upper end of the plate 1 and the holding plate 2 holds the plate 1 in a non-contact manner. When the plate 1 is lifted, the shaft 13A descends by its own weight, but the flange 13B contacts the upper end of the linear motion bearing 13.
この実施例によれば、保持盤２の移動は上，下方向の
みに限定され、しかも誤操作等で取付部11が過渡に板状
体１に近づくようなことがあつても保持盤２と板状体１
とが接触することがないので確実なハンドリングが可能
である。According to this embodiment, the movement of the holding plate 2 is limited only to the upward and downward directions, and even if the mounting portion 11 approaches the plate 1 transiently due to erroneous operation, etc. Shape 1
Since it does not come into contact with, reliable handling is possible.
第10図は本発明の参考例を示す板状体の保持装置の縦
断面図で、この実施例ではこれまでの例で保持盤２と一
体にして保持盤２上に配設されていた保持ユニツト３を
保持盤２から切り離し、個別の保持ユニツト３を球面軸
受10を介して保持盤２に取り付ける一方、保持盤２と取
付部11を保持盤２の中心部において固着させるようにし
たものである。FIG. 10 is a longitudinal sectional view of a holding device for a plate-like body showing a reference example of the present invention. In this embodiment, the holding device provided on the holding plate 2 integrally with the holding plate 2 in the previous examples. The unit 3 is separated from the holding plate 2 and the individual holding units 3 are attached to the holding plate 2 via the spherical bearings 10, while the holding plate 2 and the mounting portion 11 are fixed at the center of the holding plate 2. is there.
この参考例によれば、保持ユニツト３が他の２個の保
持ユニツト３の制約を受けることなく、個別に自由に傾
斜することができ、各保持ユニツト下面3Aと板状体１の
間のすきま４が平行，等間隔となる。これまでの例の如
く、３個の保持ユニツト３が保持盤２に固定されている
と、すきま４は必ずしも平行とならず、またすきま４の
間隔も不揃いとなるおそれがあるが、すきま４が平行で
ないときは板状体１の接触の原因となり、また各保持ユ
ニツト３のすきま４の間隔が不揃いの場合、荷重負荷の
片寄り、従つて全体としての負荷容量の低下を招くの
で、この保持機構によればさらに優れた性能を期待する
ことができる。According to this reference example, the holding units 3 can be individually and freely inclined without being restricted by the other two holding units 3, and the clearance between each holding unit lower surface 3A and the plate-like body 1 is provided. 4 are parallel and equally spaced. If the three holding units 3 are fixed to the holding plate 2 as in the examples up to now, the gaps 4 are not always parallel and the gaps between the gaps 4 may not be uniform. If they are not parallel, it may cause contact of the plate-like body 1, and if the gaps between the gaps 4 of the holding units 3 are not uniform, the load may be biased and the load capacity as a whole may be reduced. According to the mechanism, even better performance can be expected.
また、この参考例によれば例えば板状体１が光学レン
ズのように外面形状が平面でない場合でもその面曲率が
それ程大きくないときは、それを非接触で保持すること
が可能である。Further, according to this reference example, even when the outer shape of the plate-like body 1 is not flat like an optical lens, if the surface curvature is not so large, it can be held in a non-contact manner.
本発明によれば、気体を吹き出す気体噴出部及び気体
を吸引する気体吸引部を保持対象となる板状体に対向す
る面に有する保持ユニットと、この保持ユニットの前記
気体噴出部及び気体吸引部を有する面の裏面に設けられ
た保持盤支持部とを備えた板状体保持装置において、誤
操作等で保持ユニットが過度に板状体に近づくようなこ
とがあっても、保持ユニットと板状体表面との隙間を適
正に保ち、保持ユニットと板状体とが接触することがな
い板状体の保持装置を提供することができる。ADVANTAGE OF THE INVENTION According to this invention, the holding | maintenance unit which has the gas ejection part which blows off gas, and the gas suction part which sucks gas in the surface facing the plate-shaped body to be hold | maintained, and the said gas ejection part and gas suction part of this holding unit In a plate-shaped body holding device provided with a holding plate supporting portion provided on the back side of the surface having a plate, even if the holding unit excessively approaches the plate-shaped body due to erroneous operation or the like, the holding unit and the plate-shaped It is possible to provide a plate-like body holding device in which a gap with a body surface is appropriately maintained and a holding unit does not come into contact with the plate-like body.
第１図は本発明の参考例を示す板状体の保持装置の縦断
面図、第２図は第１図の保持装置の下面図、第３図は流
体供給源の機器構成を示す供給系統図、第４図は流体吸
引源の機器構成を示す吸引系統図、第５図は板状体の保
持動作を説明するための保持ユニットの部分断面図、第
６図は第５図の寸法関係を示す説明図、第７図は板状体
の保持装置の保持動作特性図、第８図は図１に示す保持
装置の部分断面図、第９図は本発明の実施例を示す板状
体の保持装置の縦断面図、第10図は本発明の参考例を示
す板状体の保持装置の縦断面図である。 １……板状体、２……保持盤、３……保持ユニツト、3A
……保持ユニツト下面、31……流体噴出部、312……絞
り機構、32……流体吸引部、４……すきま、５……ガイ
ド、６……流体供給源、7,9……管路、８……流体吸引
源、10……球面軸受、11……取付部、13……直動軸受。FIG. 1 is a longitudinal sectional view of a holding device of a plate-like body showing a reference example of the present invention, FIG. 2 is a bottom view of the holding device of FIG. 1, and FIG. 3 is a supply system showing a device configuration of a fluid supply source. FIG. 4 is a suction system diagram showing a device configuration of a fluid suction source, FIG. 5 is a partial cross-sectional view of a holding unit for explaining a holding operation of a plate-like body, and FIG. 6 is a dimensional relationship of FIG. FIG. 7 is a diagram showing a holding operation characteristic of the holding device for a plate-like body, FIG. 8 is a partial sectional view of the holding device shown in FIG. 1, and FIG. 9 is a plate-like body showing an embodiment of the present invention. FIG. 10 is a longitudinal sectional view of a holding device for a plate-like body showing a reference example of the present invention. 1 ... plate-like body, 2 ... holding plate, 3 ... holding unit, 3A
... Lower surface of holding unit, 31 ... Fluid ejection part, 312 ... Throttle mechanism, 32 ... Fluid suction part, 4 ... Clearance, 5 ... Guide, 6 ... Fluid supply source, 7, 9 ... Pipe line , 8 ... fluid suction source, 10 ... spherical bearing, 11 ... mounting part, 13 ... linear motion bearing.
───────────────────────────────────────────────────── フロントページの続き (72)発明者 橋本 泰造 群馬県高崎市西横手町111番地 株式会 社日立製作所高崎工場内 (56)参考文献 特開 昭62−255335（ＪＰ，Ａ) ──────────────────────────────────────────────────続 き Continuation of front page (72) Inventor Taizo Hashimoto 111 Nishiyokote-cho, Takasaki City, Gunma Prefecture Inside the Takasaki Plant of Hitachi, Ltd. (56) References JP-A-62-255335 (JP, A)
Claims (1)
する気体吸引部とを有する保持ユニットと、この保持ユ
ニットと一体に形成された保持盤と、この保持盤の前記
気体噴出部と気体吸引部とを有する面の裏側に設けられ
た保持盤支持部とを備えた板状体の保持装置において、
前記保持盤支持部と前記保持盤との間に設けられ、この
保持盤と前記保持ユニットとを前記保持盤支持部に対し
てスライド自在に支持する緩衝手段を備えた板状体の保
持装置。1. A holding unit having a gas ejection unit for blowing gas, a gas suction unit for sucking gas, a holding plate formed integrally with the holding unit, and the gas ejection unit of the holding plate and a gas A holding device for a plate-like body including a holding plate supporting portion provided on the back side of a surface having a suction portion,
A plate-like body holding device provided between the holding plate support portion and the holding plate, and provided with buffer means for slidably supporting the holding plate and the holding unit with respect to the holding plate support portion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62300238A JP2619436B2 (en) | 1987-11-30 | 1987-11-30 | Plate-like holding device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62300238A JP2619436B2 (en) | 1987-11-30 | 1987-11-30 | Plate-like holding device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01143336A JPH01143336A (en) | 1989-06-05 |
| JP2619436B2 true JP2619436B2 (en) | 1997-06-11 |
Family
ID=17882374
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62300238A Expired - Lifetime JP2619436B2 (en) | 1987-11-30 | 1987-11-30 | Plate-like holding device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2619436B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101253058B1 (en) * | 2004-11-24 | 2013-04-11 | 씨케이디 가부시키 가이샤 | Surfacing Unit and Surface Apparatus having Gradient Function |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4021747B2 (en) * | 2002-11-20 | 2007-12-12 | カワサキプラントシステムズ株式会社 | Vertical conveying device for plate material |
| JP4590570B2 (en) * | 2007-05-28 | 2010-12-01 | カワサキプラントシステムズ株式会社 | Vertical conveying device for plate material |
| TWI571418B (en) * | 2009-07-22 | 2017-02-21 | 契摩曼＆許爾波運用技術有限公司 | Vakuum-greifer |
| JP5948790B2 (en) * | 2011-10-21 | 2016-07-06 | 株式会社Ihi | Chuck device |
| WO2013124964A1 (en) * | 2012-02-21 | 2013-08-29 | 富士機械製造株式会社 | Suction nozzle |
| JP6771405B2 (en) * | 2017-02-27 | 2020-10-21 | 株式会社東京精密 | Wafer transfer holding device |
| US20230163018A1 (en) * | 2020-05-25 | 2023-05-25 | Hitachi High-Tech Corporation | Substrate holding apparatus and substrate processing apparatus |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0753543B2 (en) * | 1986-04-25 | 1995-06-07 | 株式会社日立製作所 | Plate-shaped transfer device |
-
1987
- 1987-11-30 JP JP62300238A patent/JP2619436B2/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101253058B1 (en) * | 2004-11-24 | 2013-04-11 | 씨케이디 가부시키 가이샤 | Surfacing Unit and Surface Apparatus having Gradient Function |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH01143336A (en) | 1989-06-05 |
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