CN210113229U - Non-contact silicon chip conveyer - Google Patents

Abstract

The utility model discloses a non-contact silicon wafer transportation device, which comprises a support frame, a belt transmission component and a plurality of air floatation modules, wherein the belt transmission component is symmetrically arranged and comprises a belt and a stop block arranged on the belt, and the silicon wafers can be embedded in two adjacent stop blocks; all the air floatation modules are positioned between the two belt transmission assemblies, each air floatation module comprises an air chamber capable of being connected with an air source and a plurality of air outlet holes communicated with the air chamber, and the air floatation modules are positioned below the silicon wafers so as to push the silicon wafers to be suspended on the air floatation modules. The utility model discloses can reduce the damage to the silicon chip at the in-process of transportation.

Description

Non-contact silicon chip conveyer

Technical Field

The utility model relates to a silicon chip transportation equipment field, concretely relates to non-contact silicon chip conveyer.

Background

In the process of processing and producing silicon wafers, in order to meet different application requirements, the silicon wafers need to be subjected to various chemical treatments according to specific process requirements. With the increasing automation degree of processing production, the silicon wafers are generally transported through a production line among various processes. In the prior art, the silicon wafers are generally transported by using transmission modes such as roller transmission and the like, but the surface of the silicon wafers is easily abraded or polluted due to improper operation in the transportation process of the existing conveying, so that the normal use of the silicon wafers is influenced.

Disclosure of Invention

The to-be-solved technical problem of the utility model is to provide a non-contact silicon chip conveyer, it can reduce the damage to the silicon chip at the in-process of transportation.

In order to solve the technical problem, the utility model provides a non-contact silicon wafer transportation device, which comprises a support frame, a belt transmission assembly and a plurality of air floatation modules, wherein the belt transmission assembly is symmetrically arranged and comprises a belt and stop blocks arranged on the belt, and the silicon wafers can be embedded in the two adjacent stop blocks; all the air floatation modules are positioned between the two belt transmission assemblies, each air floatation module comprises an air chamber capable of being connected with an air source and a plurality of air outlet holes communicated with the air chamber, and the air floatation modules are positioned below the silicon wafers so as to push the silicon wafers to be suspended on the air floatation modules.

Furthermore, a pressure reducing valve is arranged on the air floatation module to regulate and control the gas pressure at the air outlet.

Furthermore, one end of the supporting frame is provided with a receiving hopper, and the receiving hopper comprises a bottom plate and a side plate, wherein the bottom plate is obliquely arranged, and the side plate surrounds the bottom plate.

Furthermore, a groove body is formed in the bottom plate, so that the silicon wafer can be conveniently taken out.

Furthermore, the receiving hopper is fixed with the support frame through a fixing frame, and reinforcing ribs are arranged between the fixing frame and the support frame.

Furthermore, one end of the supporting frame is provided with a manipulator, and the material receiving hopper and the manipulator are oppositely arranged; the manipulator is connected with a movement module so as to place the silicon wafer between the two stop blocks.

Further, the belt transmission assembly further comprises a limiting plate, and the limiting plate can be in contact with the belt on the inner side.

Furthermore, the outer wall of the stop block is coated with a protective layer.

The utility model has the advantages that:

the silicon wafers are transported by using the belts and the stop blocks in the belt transmission assemblies which are symmetrically arranged, so that the contact area between the upper surface and the lower surface of the silicon wafers and the belt transmission assemblies is reduced, and the abrasion of the surfaces of the silicon wafers in the transportation process is reduced; and meanwhile, the air floatation assembly is positioned between the two belt transmission assemblies, and the air floatation assembly positioned below the silicon wafer can utilize the pressure of gas flowing out through the air outlet to apply upward supporting force to the silicon wafer, so that the silicon wafer can be suspended above the air floatation assembly, and the deformation of the silicon wafer caused by self gravity when the stop block and the silicon wafer are clamped and embedded and fixed is reduced.

Drawings

Fig. 1 is an overall schematic view of the present invention;

fig. 2 is an enlarged view of a portion a in fig. 1.

The reference numbers in the figures illustrate: 1. a support frame; 2. a belt; 21. a stopper; 3. a limiting plate; 4. an air flotation module; 5. a material receiving hopper; 51. a base plate; 511. a trough body; 52. a side plate; 53. a fixed mount; 6. and (3) a silicon wafer.

Detailed Description

The present invention is further described with reference to the following drawings and specific embodiments so that those skilled in the art can better understand the present invention and can implement the present invention, but the embodiments are not to be construed as limiting the present invention.

Referring to fig. 1, the utility model discloses an embodiment of non-contact silicon chip conveyer, including the belt drive assembly that support frame 1, air supporting module 4 and two symmetries set up, two belt drive assemblies all are located the upper end of support frame 1, utilize support frame 1 to realize the holding power to belt drive assembly to stability when increasing silicon chip 6 and transporting.

Referring to fig. 1, the belt driving assembly includes a belt 2 and a belt pulley engaged with the belt 2, the belt 2 is sleeved on the belt pulley and can drive the belt 2 to move by using the rotation of the belt pulley. The outer wall of the belt 2 far away from the belt pulley is fixedly provided with a plurality of stop blocks 21, and the adjacent stop blocks 21 can be embedded with silicon wafers to realize the relative fixation of the silicon wafers 6 and the belt 2. In order to improve the stability of the silicon wafers 6 during transportation, the belt pulleys in the two belt transmission assemblies move synchronously, and the stop blocks 21 fixed on the belts 2 are uniformly distributed at the same intervals so as to realize the transportation of the silicon wafers by utilizing the synchronous movement of the two belts 2. In order to ensure the accuracy of the movement of the two belts 2, the belts 2 are toothed belts in this embodiment.

Referring to fig. 1, the outer wall of the stopper 21 is covered with a protective layer (not shown), and the material of the protective layer is preferably rubber in this embodiment. When the stop block 21 and the silicon wafer are fixedly embedded, the protective layer can reduce the deformation and abrasion of the silicon wafer 6 and the stop block 21 when in contact, and can increase the static friction force between the stop block 21 and the silicon wafer 6, so that the stability of the stop block 21 and the silicon wafer 6 when being fixed is increased.

Referring to fig. 1 and 2, the belt driving assembly further includes a limiting plate 3, and the limiting plate 3 is fixedly connected to the upper surface of the supporting frame 1. Limiting plate 3 is located between two belt 2 wheels to limiting plate 3 and the inboard belt 2 contact, and the one side that two belt 2 are close to each other is equallyd divide and is do not contact with the lateral wall of limiting plate 3 promptly. When silicon chip 6 inlays to be established between adjacent dog 21, silicon chip 6 can apply for dog 21 thrust for belt 2 takes place elastic deformation under the effect of thrust reversal, therefore when limiting plate 3 and belt 2 contact, limiting plate 3 can reduce belt 2's elastic deformation, thereby stability when increasing silicon chip 6 and transporting.

Referring to fig. 1 and 2, the air flotation module 4 includes an air chamber and an air outlet (not shown) provided on an upper surface thereof and communicated with the air chamber (not shown), the air chamber can be communicated with an air source through an air inlet pipe, and the air source can be an air pump or the like. The gas in the gas chamber is discharged through the gas outlet hole communicated with the gas chamber, and upward thrust can be applied to the silicon wafer 6 when the gas is discharged, so that the silicon wafer 6 can be suspended at a position away from the air flotation module 4 by a certain distance under the action of the thrust. When the silicon wafer is embedded between the stoppers 21, the pushing force acting below the silicon wafer can reduce the elastic deformation of the silicon wafer 6 under the action of its own gravity. In addition, the air flotation module 4 further comprises a pressure reducing valve, and the pressure reducing valve can be adjusted to regulate and control the gas pressure at the gas outlet, so that the thrust applied to the silicon wafer 6 and the suspension height of the silicon wafer 6 under the action of the thrust can be changed.

Referring to fig. 1, a receiving hopper 5 is arranged at one side of the supporting frame 1, and the receiving hopper 5 is positioned at the moving terminal end of the belt 2 along the moving direction of the belt 2 when viewed from the upper side of the supporting frame 1. The receiving hopper 5 includes a bottom plate 51 disposed obliquely and a side plate 52 disposed around the bottom plate 51, and an opening of the receiving hopper 5 is disposed toward the supporting frame 1. Because the material receiving hopper 5 is located at the end of the supporting frame 1, when the belt 2 rotates to a position close to the belt 2 wheel of the material receiving hopper, the belt 2 can bend and drive the stopper 21 fixed thereon to deflect, so that the distance between the two stoppers 21 on the same belt 2 is increased, and the clamping force between the silicon wafer 6 and the stopper 21 is reduced. Meanwhile, when the silicon wafer 6 moves to the end of the support frame 1, the silicon wafer 6 gradually moves away from the air flotation module 4, so that the thrust acting on the silicon wafer 6 is gradually reduced until the thrust disappears. Thus, when the silicon wafer 6 moves to the end of the holding frame 1, the silicon wafer 6 embedded between the stoppers 21 can slide down into the receiving hopper 5.

Referring to fig. 1, a slot 511 is formed through the bottom plate 51, and when the silicon wafer 6 slides into the receiving material, the silicon wafer can be blown out or pushed out through the slot 511. The hopper 5 is fixed to the support frame 1 by a fixing frame 53, and reinforcing ribs are provided between the fixing frame 53 and the bottom plate 51 of the support frame 1 to increase the stability of the hopper 5.

Referring to fig. 1, a manipulator and a motion module driving the manipulator to work are arranged at the end of a support frame 1, and the manipulator is arranged at the side opposite to a material receiving hopper 5. The movement module can realize the multi-degree-of-freedom movement of the manipulator, so that the silicon wafer 6 is embedded between the stop blocks 21. Since the specific structure of the manipulator belongs to the prior art in the field, it is not described herein in detail.

The above-mentioned embodiments are merely preferred embodiments for fully illustrating the present invention, and the scope of the present invention is not limited thereto. Equivalent substitutes or changes made by the technical personnel in the technical field on the basis of the utility model are all within the protection scope of the utility model. The protection scope of the present invention is subject to the claims.

Claims (8)

1. A non-contact silicon wafer conveying device is characterized by comprising a support frame, symmetrically arranged belt transmission assemblies and a plurality of air floatation modules, wherein each belt transmission assembly comprises a belt and stop blocks arranged on the belt, and silicon wafers can be embedded in two adjacent stop blocks;

all the air floatation modules are positioned between the two belt transmission assemblies, each air floatation module comprises an air chamber capable of being connected with an air source and a plurality of air outlet holes communicated with the air chamber, and the air floatation modules are positioned below the silicon wafers so as to push the silicon wafers to be suspended on the air floatation modules.

2. The non-contact silicon wafer transportation device according to claim 1, wherein a pressure reducing valve is arranged on the air flotation module to regulate and control the gas pressure at the gas outlet.

3. The non-contact silicon wafer transportation device according to claim 1, wherein a receiving hopper is arranged at one end of the support frame, and the receiving hopper comprises a bottom plate and side plates, the bottom plate is arranged in an inclined mode, and the side plates surround the bottom plate.

4. The non-contact silicon wafer transportation device of claim 3, wherein the bottom plate is provided with a groove body to facilitate taking out the silicon wafer.

5. The non-contact silicon wafer conveying device according to claim 3, wherein the receiving hopper is fixed with the supporting frame through a fixing frame, and reinforcing ribs are arranged between the fixing frame and the supporting frame.

6. The non-contact silicon wafer conveying device according to claim 3, wherein a manipulator is arranged at one end of the supporting frame, and the receiving hopper and the manipulator are arranged oppositely; the manipulator is connected with a movement module so as to place the silicon wafer between the two stop blocks.

7. The non-contact silicon wafer transportation apparatus of claim 1, wherein the belt driving assembly further comprises a stopper plate capable of contacting the belt inside.

8. The non-contact silicon wafer transport apparatus according to claim 1, wherein the outer wall of the stopper is coated with a protective layer.

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