JPH0753543B2 - Plate-shaped transfer device - Google Patents
Plate-shaped transfer deviceInfo
- Publication number
- JPH0753543B2 JPH0753543B2 JP61094517A JP9451786A JPH0753543B2 JP H0753543 B2 JPH0753543 B2 JP H0753543B2 JP 61094517 A JP61094517 A JP 61094517A JP 9451786 A JP9451786 A JP 9451786A JP H0753543 B2 JPH0753543 B2 JP H0753543B2
- Authority
- JP
- Japan
- Prior art keywords
- plate
- fluid
- holding
- shaped body
- pressure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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- Delivering By Means Of Belts And Rollers (AREA)
- Feeding Of Articles By Means Other Than Belts Or Rollers (AREA)
Description
【発明の詳細な説明】 〔産業上の利用分野〕 本発明は半導体基板等の板状体の移送装置に係り、特
に、汚れた空気、塵埃等を嫌うクリーンルーム内で、人
手によつて、ウエハ等の基板を傷つけず清浄に保つてハ
ンドリングするのに使用するに好適な板状体の移送装置
に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a transfer device for a plate-like body such as a semiconductor substrate, and more particularly, to a wafer by hand in a clean room where dirty air, dust and the like are disliked. The present invention relates to a transfer device for a plate-like body suitable for use in handling a substrate while keeping it clean without damaging it.
半導体構造工程においては、平面あるいはくぼみ付トレ
イに処理面を上にしてウエハを置いて処理を行う工程が
多数である。このようなトレイからウエハを保持、搬入
出する装置として、例えば特開昭59−161290号公報に示
されているように、負圧が供給される吸着パッドによつ
てウエハを真空吸着する装置が知られている。特に人手
によつてハンドリングを行う真空吸着装置は真空ピンセ
ツトと呼ばれ、半導体製造工程の各所で使用されてい
る。In the semiconductor structure process, there are many processes in which a wafer is placed on a flat surface or a tray with depressions with the processing surface facing upward and processing is performed. As an apparatus for holding and loading / unloading a wafer from such a tray, for example, as shown in Japanese Patent Laid-Open No. 59-161290, an apparatus for vacuum-sucking a wafer by a suction pad to which a negative pressure is supplied is available. Are known. In particular, a vacuum suction device that is manually handled is called a vacuum pinset and is used in various places in the semiconductor manufacturing process.
上記従来技術は、前述のように平面やくぼみに置かれた
ウエハを容易につかむことができるという利点を有する
反面、ウエハの処理面側を吸着した場合、吸着された部
分の処理面にゴミや傷がつくという問題点があつた。ま
たウエハが置かれたトレイに真空ピンセツトをウエハ裏
面側にさし込むための溝を設け、ウエハ裏面を吸着する
場合でも、吸着した裏面が汚れる。現在では、ウエハ裏
面に付着したゴミがそのウエハあるいは他のウエハの処
理面側にまわり込むことが問題とされるぐらいウエハ処
理面側には高い清浄度が要求されている。The above-mentioned conventional technique has an advantage that a wafer placed on a flat surface or a hollow can be easily grasped as described above, but when the processing surface side of the wafer is sucked, dust or the like is generated on the processing surface of the sucked portion. There was a problem of being hurt. In addition, even when a groove for inserting the vacuum pinset into the back surface of the wafer is provided in the tray on which the wafer is placed and the back surface of the wafer is sucked, the sucked back surface becomes dirty. At present, a high degree of cleanliness is required on the wafer processing surface side so that it becomes a problem that dust attached to the back surface of the wafer enters the processing surface side of the wafer or another wafer.
本発明の目的は、ウエハ等の板状体を非接触に保持して
他の場所へ移送でき、その場所で保持を解除することが
できる板状体の移送装置を提供することにある。An object of the present invention is to provide a plate-shaped body transfer device that can hold a plate-shaped body such as a wafer in a non-contact manner and transfer it to another place and release the holding at that place.
上記目的を達成するために、本発明の板状体の搬送装置
は、流体によって板状体を非接触で保持し、他の場所に
移送する装置において、板状体との間に平面的なすきま
を形成するための保持面を備える保持体と、この保持体
に供給される大気圧以上の圧力を有する流体を、この保
持体の保持面に設けられ、この保持面に対向する板状体
に対して供給する絞りを備えた複数の流体噴出部と、該
流体噴出部の周囲を取り囲むように保持体の保持面に設
けられ、板状体に対して大気圧以下の圧力を発生する流
体吸引部と、前記保持体に設けられた握り部と、前記流
体噴出部および流体吸引部にそれぞれ通じる通路を開閉
する弁装置とを備えたことを特徴とするものである。In order to achieve the above-mentioned object, a plate-shaped body conveying device of the present invention is a device for holding a plate-shaped body in a non-contact state by a fluid and transferring it to another place, in a plane between the plate-shaped body. A holding body having a holding surface for forming a gap, and a plate-like body provided on the holding surface of the holding body with a fluid supplied to the holding body and having a pressure equal to or higher than the atmospheric pressure, and facing the holding surface. A plurality of fluid ejection portions each having a throttle for supplying the fluid, and a fluid that is provided on the holding surface of the holding body so as to surround the fluid ejection portions and that generates a pressure below atmospheric pressure with respect to the plate-shaped body. It is characterized in that it is provided with a suction portion, a grip portion provided on the holding body, and a valve device that opens and closes passages that respectively communicate with the fluid ejection portion and the fluid suction portion.
流体吸引部からの流体の吸引により、保持面と板状体の
表面とのすきま内の平均圧力を大気圧以下にする。この
負圧により板状体の重量を支持する。このとき、絞りを
通して流体噴出部から加圧流体をすきま内に導くことに
より、すきま内の圧力は、すきま間かくが大きくなれば
減少し、小さくなれば増加する。したがつて、板状体は
ある一定のすき間かくを保つて安全に非接触支持され
る。またこのとき、流体吸引部は圧力が大気圧以下であ
ることから、流体が周囲に噴出して、周辺のごみをまき
上げたり周囲に置かれた板状体を移動させてしまうこと
がない。また、握り部を人手により把持することによ
り、板状体を所定の場所に移送し、弁装置の操作により
その場所へ板状体を非接触で移送させることができる。By sucking the fluid from the fluid sucking portion, the average pressure in the clearance between the holding surface and the surface of the plate-shaped body is set to the atmospheric pressure or less. The negative pressure supports the weight of the plate-shaped body. At this time, by introducing the pressurized fluid into the clearance from the fluid ejection portion through the restrictor, the pressure in the clearance decreases as the clearance between the clearances increases and increases as the clearance becomes smaller. Therefore, the plate-like body is safely supported in a non-contact manner while maintaining a certain gap. Further, at this time, since the pressure of the fluid suction portion is equal to or lower than the atmospheric pressure, the fluid is not ejected to the surroundings, so that the surrounding dust is not lifted up and the plate-shaped body placed around is not moved. In addition, by manually gripping the grip portion, the plate-shaped body can be transferred to a predetermined place, and the plate-shaped body can be transferred to that place without contact by operating the valve device.
以下、本発明の実施例を図面により説明する。 Embodiments of the present invention will be described below with reference to the drawings.
第１図および第２図は本発明の板状体の移送装置の一実
施例を示すもので、これらの図において１は非接触に保
持すべき例えば半導体ウエハのような板状体を示す。２
は板状体１の保持体である。保持体２には３つの保持面
2Aが形成されており、それぞれの保持面2Aと板状体１の
上面1Aとの間には、すきま間かくｈをへだててすきま３
が形成されている。３つの保持面2Aは同じ構成となつて
おり、それぞれ保持面2Aには、すきま３内の気体を吸引
してすきま３内の平均圧力を外気圧以下に保つ流体吸引
部と、すきま３へ加圧流体を導入する流体噴出部とが備
えられている。前記流体吸引部は、保持面2Aの外周部に
設けられる環状の溝４を備え、また流体噴出部は保持面
2Aの中央部に設けた開口部５および絞り６を備えてい
る。前述した環状の溝４は保持体２およびこれに設けた
握り部７内の流体吸引通路８および管路９を通して流体
吸引源10に連結している。また前述した絞り６は保持体
２および握り部７内の流体供給通路11および管12を通し
て流体供給源13に連結している。前述した握り部７は装
置全体を人手で携帯、移動させるために用いられる。こ
の握り部７には装置を携帯した状態で保持体１の開口部
５に供給される流体および保持体１の溝４から吸引され
る流体をオンオフするための弁14が設けられている。保
持体１には、装置の保持面2Aを平面に対面させて装置を
平面に置くとき、保持面2Aと平面との間に所定のすきま
が形成されるように設けられた６個の棒状のストツパ15
が固定されている。この６個のストツパ15の内側面に内
接する円の直径は、板状体１の直径より大きくなつてお
り、板状体１を非接触支持した状態では、このストツパ
15の先端は、板状体１の端面より第１図において下側ま
で延びる長さがとつてある。FIGS. 1 and 2 show an embodiment of a plate-shaped body transferring apparatus according to the present invention. In these figures, 1 shows a plate-shaped body such as a semiconductor wafer to be held in a non-contact manner. Two
Is a holder for the plate-shaped body 1. The holding body 2 has three holding surfaces
2A are formed, and between each holding surface 2A and the upper surface 1A of the plate-shaped body 1, a clearance gap h is formed and a clearance 3 is formed.
Are formed. The three holding surfaces 2A have the same structure. The holding surface 2A has a fluid suction portion that sucks the gas in the clearance 3 to keep the average pressure in the clearance 3 at the atmospheric pressure or less, and the holding surface 2A is applied to the clearance 3. And a fluid jetting portion for introducing a pressurized fluid. The fluid suction portion has an annular groove 4 provided on the outer peripheral portion of the holding surface 2A, and the fluid ejection portion has a holding surface.
It has an aperture 5 and a diaphragm 6 provided at the center of 2A. The above-mentioned annular groove 4 is connected to the fluid suction source 10 through the fluid suction passage 8 and the conduit 9 in the holding body 2 and the grip portion 7 provided therein. Further, the throttle 6 described above is connected to the fluid supply source 13 through the fluid supply passage 11 and the pipe 12 in the holding body 2 and the grip portion 7. The grip portion 7 described above is used for manually carrying and moving the entire apparatus. The grip 7 is provided with a valve 14 for turning on and off the fluid supplied to the opening 5 of the holder 1 and the fluid sucked from the groove 4 of the holder 1 while the apparatus is carried. The holding body 1 has six rod-like members provided so that a predetermined clearance is formed between the holding surface 2A and the flat surface when the holding surface 2A of the device is placed on the flat surface with the holding surface 2A facing the flat surface. Stopper 15
Is fixed. The diameter of the circle inscribed on the inner side surfaces of the six stoppers 15 is larger than the diameter of the plate-like body 1, and when the plate-like body 1 is supported in a non-contact manner, the stoppers are in contact with each other.
The tip of 15 has a length extending from the end face of the plate-shaped body 1 to the lower side in FIG.
前述した弁装置14の一例を第３図を用いて説明する。こ
の図において第１図と同符号のものは同一部分である。
弁装置14はそれぞれ通路8,11を開閉するための弁孔16,1
7を有する弁体18と、この弁体18に設けた操作ボタン19
と、通路8,11を閉じるように弁体18を付勢するばね20と
を備えている。この弁装置14はその操作ボタン19をばね
20に抗して押し込むことにより通路8,11を開状態にする
ことができる。An example of the valve device 14 described above will be described with reference to FIG. In this figure, the same parts as those in FIG. 1 are the same parts.
The valve device 14 includes valve holes 16 and 1 for opening and closing the passages 8 and 11, respectively.
Valve body 18 having 7 and operation button 19 provided on this valve body 18
And a spring 20 for urging the valve body 18 to close the passages 8 and 11. This valve device 14 has its operating button 19 spring-loaded.
The passages 8 and 11 can be opened by pushing them against 20.
次に前述した流体供給源13および流体吸引源10の一例の
構成をそれぞれ第４図および第５図を用いて説明する。
流体供給源13は第４図に示すように加圧ポンプ13Aと、
その駆動モータ13Bと、加圧ポンプ13Aによつて加圧され
た流体の圧力を調整する圧力レギユレータ13Cと、ごみ
を除去するフイルタ13Dとで構成されている。また流体
吸引源10は第５図に示すように、真空ポンプ10Aと、そ
の駆動モータ10Bと、管路９を大気に開放する可変形絞
り弁10Cで構成され、可変形絞り弁10Cの絞りを調整する
ことにより負圧を調整することができる。Next, the configurations of the fluid supply source 13 and the fluid suction source 10 described above will be described with reference to FIGS. 4 and 5, respectively.
The fluid supply source 13 is a pressurizing pump 13A as shown in FIG.
The drive motor 13B, a pressure regulator 13C for adjusting the pressure of the fluid pressurized by the pressure pump 13A, and a filter 13D for removing dust. As shown in FIG. 5, the fluid suction source 10 is composed of a vacuum pump 10A, a drive motor 10B for the vacuum pump, and a variable throttle valve 10C that opens the pipe 9 to the atmosphere. The negative pressure can be adjusted by adjusting.
次に、上述した本発明の装置の一実施例の動作を説明す
る。Next, the operation of the above-described embodiment of the apparatus of the present invention will be described.
動作の説明に先立つて、板状体１を非接触で保持するた
めの原理を説明する。Prior to the description of the operation, the principle for holding the plate-shaped body 1 in a non-contact manner will be described.
第６図において、流体吸引源10を駆動すると、これによ
つて管路９、通路８を通して溝４から流体が吸引され、
この溝４内の圧力が外気以下に減圧される。一方、溝４
内の圧力より高い圧力に保たれている流体供給源13は、
加圧流体を管路12、通路11から絞り６を通してすきま３
に供給し、この部分に大気圧以下の圧力を与える。この
とき、すきま３内の圧力、またこの圧力から計算される
板状体１に働く力は、理論的に以下のようになる。In FIG. 6, when the fluid suction source 10 is driven, the fluid is sucked from the groove 4 through the conduit 9 and the passage 8 by this.
The pressure in the groove 4 is reduced to below the outside air. On the other hand, groove 4
The fluid source 13, which is maintained at a pressure higher than the pressure inside,
Pressurized fluid is passed through conduit 12 and passage 11 through throttle 6 and clearance 3
Is supplied to this portion, and a pressure below atmospheric pressure is applied to this portion. At this time, the pressure in the clearance 3 and the force acting on the plate-shaped body 1 calculated from this pressure are theoretically as follows.
いま、すきま３内の流れは、すきま３の間かくｈを十分
小さくとるとき、等温，層流で、慣性力と比較して粘性
力が支配的な流れであると仮定できる。このとき、すき
ま３内の流れに対し、第７図に示す座標系および記号を
用いて、次の方程式および境界条件が成立する。Now, it can be assumed that the flow in the clearance 3 is isothermal and laminar, and the viscous force is dominant as compared with the inertial force when h is made sufficiently small in the clearance 3. At this time, for the flow in the clearance 3, the following equations and boundary conditions are established using the coordinate system and symbols shown in FIG.
r1≦ｒ≦r0のすきまに対し、 Ｐ＝Pc at r＝r1,P＝Pv at r＝r0 …（２） ra≦ｒ≦rbのすきまに対し、 Ｐ＝Pv at r＝ra,P＝Pa at r＝rb …（３） ここで、 r :保持面２の中心０からすきまのひろがり方向に測つ
た座票 h :すきま３間かく P :すきま３内の圧力 r1：開口部５の半径 r0：溝４に囲まれた保持面2Aの外半径、あるいは溝４の
内半径 ra：溝４の外半径 rb：保持面2Aの半径 Pc：開口部５内の圧力 Pv：溝４内の圧力 Pa：外気圧 このすきま３内の流れ（圧力）の式に対し、通路11に介
設された絞り６を通る気体質量流量Rは ここで、 CD：オリフイス絞り流量係数（空気に対してはCD〜0.8
5） R :ガス定数 T :気体の絶対温度 Ps:通路11に供給される気体の圧力 K :気体の比熱比 また、r1≦ｒ≦r0のすきま３内を流れる気体質量流量
hは、 ここで μ：気体の粘性係数 と表わされ、これらの気体質量流量R，hには次の連
続条件が課せられる。R ＝h …（６） 以上、式（１）〜（６）がすきま３内の流れに対する基
礎式であり、これらを解くことにより、すきま３内の圧
力が求まる。そして求まつたすきま３内の圧力より、板
状体１に働く吸引力Ｆ（上向き正）は次式のように表わ
される。 For the clearance of r 1 ≤ r ≤ r 0 , P = P c at r = r 1 , P = P v at r = r 0 (2) For the clearance of r a ≤ r ≤ r b , P = P v at r ＝ r a , P ＝ P a at r ＝ r b … (3) Where, r is a seat measured from the center 0 of the holding surface 2 in the direction of the spread of the clearance h: The gap between the clearances 3 P: the clearance Pressure in 3 r 1 : radius of opening 5 r 0 : outer radius of holding surface 2A surrounded by groove 4, or inner radius of groove r a : outer radius of groove r b : radius of holding surface 2A P c : Pressure in the opening 5 P v : Pressure in the groove 4 P a : External pressure For the flow (pressure) formula in this clearance 3, the gas mass flow rate through the throttle 6 provided in the passage 11 R is Where: C D : Olihus throttle flow coefficient (C D ~ 0.8 for air)
5) R: Gas constant T: Absolute temperature of gas Ps: Pressure of gas supplied to passage 11 K: Specific heat ratio of gas Also, mass flow rate of gas flowing in the clearance 3 where r1 ≦ r ≦ r0
h is Here, μ is expressed as the viscosity coefficient of gas, and the following continuous conditions are imposed on these gas mass flow rates R and h . R = h (6) As described above, the equations (1) to (6) are basic equations for the flow in the clearance 3, and the pressure in the clearance 3 is obtained by solving these. Then, the suction force F (positive upward) acting on the plate-shaped body 1 based on the pressure in the determined clearance 3 is expressed by the following equation.
ここで圧力Ｐについての式（１）〜（３）の解は ただしここでPcは未知であり、このPcは式（４）〜
（６）より定まる。 Here, the solution of equations (1) to (3) for the pressure P is However, Pc is unknown here, and this Pc is expressed by equation (4)-
Determined from (6).
以上の式（１）〜（７）より、すきま３の間かくｈを変
えて板状体１に働く吸引力Ｆを計算した結果を第８図に
示す。この第８図より本発明の装置の動作を説明すると
以下の通りである。FIG. 8 shows the result of calculation of the suction force F acting on the plate-shaped body 1 by changing the gap h between the clearances 3 from the above equations (1) to (7). The operation of the apparatus of the present invention will be described below with reference to FIG.
いま、すきま３の間かくｈが間かくha、すなわち第６図
において板状体１が実線で示す位置にあるときに吸引力
と板状体１の重量とがつり合うように装置を設計したと
する。このとき、板状体１が第６図において実線で示す
位置に移動してすきま３の間かくｈが間かくhbに増加す
ると、第８図に示すように吸引力Ｆは板状体１の重量よ
り大きくなる。したがつて、板状体１には、設計点であ
る間かくhaの位置に引きもどす方向に復元力が働く。同
様にして、すきま３間かくｈが設計点すきま間かくhaよ
り小さくなつた場合にも、板状体１には間かくhaより小
さくなった場合にも、板状体１には間かくhaの位置にも
どる方向に復元力が働く。これより板状体１は、保持体
２の保持面2Aとすきま３の間かくｈをへだてて非接触に
安定浮上支持されることになる。加圧流体を通路11に供
給する場合には、保持面2Aの下方に板状体１を懸垂する
だけでなく、保持面2Aの上方に板状体１を浮上させるこ
とも可能である。またこのとき、負圧に保たれる溝４
は、通路11のすきま３への開口部５を取囲むように環状
に設けられているので、通路11からすきま３内へ流入し
た気体はすべて溝４内へ吸引回収され、外部に噴出する
ことはない。逆に保持面2Aの外周部から外気が溝４内に
流入するが、溝４内の負圧の大きさは200〜300mm水柱程
度であり、流入する気体の流量は少ない。また噴出する
場合と異なり、流入する場合は周囲に対する影響は小さ
い。Now, it is assumed that the device is designed so that the suction force and the weight of the plate-shaped body 1 are balanced when the gap 3 is h and the gap h is ha, that is, when the plate-shaped body 1 is at the position shown by the solid line in FIG. To do. At this time, when the plate-shaped body 1 moves to the position shown by the solid line in FIG. 6 and the gap h between the clearances 3 increases to hb, the suction force F is increased by the plate-shaped body 1 as shown in FIG. Greater than weight. Therefore, the restoring force acts on the plate 1 in the direction of returning it to the position of ha at the design point. Similarly, even if the clearance 3 is smaller than the design point clearance ha, or is smaller than the plate-shaped body 1 than ha, the plate-shaped body 1 is spaced apart from the space ha. The restoring force works in the direction of returning to the position. As a result, the plate-like body 1 is stably floated and supported in a non-contact manner with a gap h between the holding surface 2A of the holding body 2 and the clearance 3. When supplying the pressurized fluid to the passage 11, it is possible not only to suspend the plate-shaped body 1 below the holding surface 2A but also to float the plate-shaped body 1 above the holding surface 2A. Also, at this time, the groove 4 which is kept at a negative pressure
Is annularly provided so as to surround the opening 5 of the passage 11 to the clearance 3, so that all the gas flowing from the passage 11 into the clearance 3 is sucked and collected into the groove 4 and ejected to the outside. There is no. On the contrary, outside air flows into the groove 4 from the outer peripheral portion of the holding surface 2A, but the negative pressure in the groove 4 is about 200 to 300 mm of water column, and the flow rate of the inflowing gas is small. Also, unlike the case of jetting, the case of flowing in has little effect on the surroundings.
次に第９図および第10図を用いて、本発明の装置によ
り、板状体１を保持し、移送する動作を説明する。Next, the operation of holding and transferring the plate-shaped body 1 by the apparatus of the present invention will be described with reference to FIGS. 9 and 10.
まず、第９図に示すように人手によつて把持された本発
明の装置を板状体１上に設置する。このとき、弁装置14
は閉になつており、保持機構の作動は停止した状態であ
る。次に人手によつて本発明の装置を下降させると、第
10図に示すように保持体２の外周に設けたストツパ15に
よつて、保持面2Aが板状体１の上面1Aに接触することは
なく、かつ非接触支持を開始するに十分なだけ保持面2A
と板状体１の上面1Aとが近づいた状態が設定される。こ
の状態で弁装置14の操作ボタン19を操作して弁を開にす
ると、前述した保持原理にもとづいて、板状体１は装置
に非接触支持され、人手によつて装置を移動させること
によつて装置とともに、板状体１を搬送することができ
る。板状体の移送時、板状体１が支持された状態におい
ては、ストツパ15は、保持された板状体１が板状体１の
面方向に大きく移動するのを防ぐためのガイドとして機
能する。次に、保持した板状体１を他の場所に載置する
場合には、板状体１を保持した場合と同様に装置を所定
の場所に置き、弁装置14を閉にして保持の作動を停止す
る。これにより、板状体１は装置から離脱しその所定場
所に移動させることができる。First, as shown in FIG. 9, the apparatus of the present invention held by a human hand is set on the plate-shaped body 1. At this time, the valve device 14
Is closed, and the operation of the holding mechanism is stopped. Next, when the apparatus of the present invention is lowered manually,
As shown in FIG. 10, the stopper 15 provided on the outer periphery of the holder 2 prevents the holding surface 2A from contacting the upper surface 1A of the plate-shaped body 1 and holds the holding surface 2A sufficiently to start non-contact support. Surface 2A
The state in which the upper surface 1A of the plate-shaped body 1 and the plate-shaped body 1 are close to each other is set. When the operation button 19 of the valve device 14 is operated in this state to open the valve, the plate-shaped body 1 is supported by the device in a non-contact manner based on the above-mentioned holding principle, and the device can be manually moved. Therefore, the plate-shaped body 1 can be transported together with the device. When the plate-shaped body 1 is supported during transfer of the plate-shaped body, the stopper 15 functions as a guide for preventing the held plate-shaped body 1 from largely moving in the plane direction of the plate-shaped body 1. To do. Next, when placing the held plate-shaped body 1 in another place, the device is placed in a predetermined place as in the case where the plate-shaped body 1 is held, and the valve device 14 is closed to operate the holding. To stop. As a result, the plate-shaped body 1 can be detached from the device and moved to the predetermined place.
以上に述べたように、本発明の実施例においては、人手
によつて平面あるいはくぼみに置かれたウエハ等の操作
体を容易に保持し、移動させることができ、その際、板
状体は非接触に保持されるので、板状体が汚れたり傷つ
いたりすることがない。As described above, in the embodiment of the present invention, an operating body such as a wafer placed on a flat surface or a depression can be easily held and moved by hand, and at that time, the plate-shaped body is Since it is held in a non-contact manner, the plate-like body will not get dirty or damaged.
第11図は本発明の装置に用いられる弁装置の他の実施例
を示すもので、この図において第３図と同符号のものは
同一部分である。この実施例は弁体18の部分に通路8,11
に通じる。フレキシブルな管21,22を弁体18に設けた停
止バー23によつてつぶしたり開放したりすることによつ
て、通路8,11を同時に開閉するように構成したものであ
る。すなわち停止バー23はばね20によつて通常は図面上
左方向に移動し管21,22をつぶして閉状態に停止してい
る。そして、操作ボタン19をばね20に抗して押すことに
より、管21,22を開き弁が開放する。FIG. 11 shows another embodiment of the valve device used in the device of the present invention, in which the same reference numerals as in FIG. 3 represent the same parts. In this embodiment, the passages 8 and 11 are provided in the valve body 18.
Lead to The flexible pipes 21 and 22 are configured to open and close the passages 8 and 11 at the same time by crushing and opening the flexible pipes 21 and 22 by a stop bar 23 provided on the valve body 18. That is, the stop bar 23 is normally moved leftward in the drawing by the spring 20 and crushes the tubes 21 and 22 to stop in the closed state. Then, by pushing the operation button 19 against the spring 20, the pipes 21 and 22 are opened and the valve is opened.
以上述べた例では、通常閉となつており、操作ボタン19
を押した時のみ開となる構成としたが、操作ボタン19を
押して開放するという動作により、弁が開閉動をくり返
す機構でもかまわない。In the example described above, it is normally closed and the operation button 19
Although it is configured to open only when is pressed, a mechanism in which the valve repeats opening and closing by the operation of pressing the operation button 19 to open may be used.
第12図は、本発明の装置を構成する流体供給源と流体吸
引源10との他の実施例を示すもので、この図において第
４図および第５図と同符号のものは同一部分である。こ
の実施例は１台のポンプ24をモータ25によつて駆動し、
ポンプ24の吐出側に絞り弁26、圧力レギユレータ13Cお
よびフイルタを接続し、吸込側に可変形絞り弁10Cを接
続して構成したものである。このように構成したことに
より、流体源の構成を簡略にすることができる。FIG. 12 shows another embodiment of the fluid supply source and the fluid suction source 10 constituting the device of the present invention. In this figure, the same reference numerals as those in FIGS. 4 and 5 represent the same parts. is there. In this embodiment, one pump 24 is driven by a motor 25,
A throttle valve 26, a pressure regulator 13C and a filter are connected to the discharge side of the pump 24, and a variable throttle valve 10C is connected to the suction side. With this structure, the structure of the fluid source can be simplified.
第13図および第14図はそれぞれ流体供給源13および流体
吸引源10のさらに他の実施例を示すもので、これらの図
において第４図および第５図と同符号のものは同一部分
である。この実施例は流体源としてそれぞれ圧力容器3
0,31によつて構成したものである。このように圧力容器
30,31を用いることにより、動力源のない場所で装置を
作動させることが可能となる。また本発明の装置におい
ては気体の使用量が少ないので、圧力容器を小型にし、
携帯可能とすることもできる。FIGS. 13 and 14 show further other embodiments of the fluid supply source 13 and the fluid suction source 10, respectively. In these figures, the same symbols as those in FIGS. 4 and 5 are the same parts. . In this example, pressure vessels 3 are used as fluid sources.
It is configured by 0,31. Thus pressure vessel
By using 30,31, it becomes possible to operate the device in a place where there is no power source. Further, in the device of the present invention, since the amount of gas used is small, the pressure vessel is downsized,
It can also be portable.
なお、上述の実施例は弁装置を握り部に設けたが、この
握り部に設けなくても良い。Although the valve device is provided in the grip portion in the above-described embodiment, it may not be provided in the grip portion.
上記のとおり、本発明によれば、人手によって平面ある
いはくぼみに置かれた板状体を容易に保持し、他の場所
へ移送させることができ、その際、気体の流量が少なく
ても板状体を安定に非接触に支持されるので、板状体が
汚れたり傷ついたりすることを防ぐことができる。As described above, according to the present invention, it is possible to easily hold a plate-shaped body placed on a flat surface or a hollow by hand and transfer it to another place, and at that time, even if the gas flow rate is small, the plate-shaped body can be transferred. Since the body is supported in a stable and non-contact manner, it is possible to prevent the plate-shaped body from getting dirty or damaged.
第１図は本発明の装置の一実施例の縦断正面図、第２図
はその底面図、第３図は本発明に用いられる弁装置の一
例の縦断正面図、第４図は本発明に用いられる流体供給
源の一例の構成を示す図、第５図は本発明に用いられる
流体吸引源の一例の構成を示す図、第６図は本発明の装
置による板状体の保持動作を説明するために供した保持
面付近の部分断面図、第７図はその寸法関係を示す説明
図、第８図は本発明の装置による板状体の保持動作特性
図、第９図は本発明の装置の操作動作を示す説明図、第
10図は本発明の装置の保持面およびストツパ付近の動作
を示す部分断面図、第11図は本発明に用いられる弁装置
の他の例を示す横断面図、第12図ないし第14図は本発明
に用いられる流体供給源および流体吸引源の他の実施例
を示す図である。 １……板状体、２……保持体,2A……保持面、４……
溝、５……開口部、６……絞り、７……握り部、10……
流体吸引源、13……流体供給源、14……弁装置、15……
ストツパ。FIG. 1 is a vertical sectional front view of an embodiment of the device of the present invention, FIG. 2 is a bottom view thereof, FIG. 3 is a vertical sectional front view of an example of a valve device used in the present invention, and FIG. The figure which shows the structure of an example of the fluid supply source used, FIG. 5 is a figure which shows the structure of an example of the fluid suction source used for this invention, FIG. 6 demonstrates the holding operation of the plate-shaped body by the apparatus of this invention. FIG. 7 is a partial sectional view in the vicinity of a holding surface provided for that purpose, FIG. 7 is an explanatory view showing the dimensional relationship thereof, FIG. 8 is a holding operation characteristic diagram of a plate-like body by the device of the present invention, and FIG. Explanatory diagram showing the operation operation of the device,
FIG. 10 is a partial sectional view showing the operation of the device of the present invention in the vicinity of the holding surface and the stopper, FIG. 11 is a transverse sectional view showing another example of the valve device used in the present invention, and FIGS. 12 to 14 are It is a figure which shows the other Example of the fluid supply source and fluid suction source used for this invention. 1 ... plate-like body, 2 ... holding body, 2A ... holding surface, 4 ...
Grooves, 5 ... Aperture, 6 ... Aperture, 7 ... Grip, 10 ...
Fluid suction source, 13 ... Fluid supply source, 14 ... Valve device, 15 ...
Stuppa.
───────────────────────────────────────────────────── フロントページの続き (72)発明者 井上 滉 茨城県土浦市神立町502番地 株式会社日 立製作所機械研究所内 (56)参考文献 特開 昭62−211236（ＪＰ，Ａ) 特開 昭49−58777（ＪＰ，Ａ) 特開 昭58−141536（ＪＰ，Ａ) 実開 昭49−148375（ＪＰ，Ｕ) 実開 昭61−95740（ＪＰ，Ｕ) 実開 昭61−92650（ＪＰ，Ｕ) 実開 昭59−46692（ＪＰ，Ｕ) 実開 昭52−103481（ＪＰ，Ｕ) 実開 昭52−35471（ＪＰ，Ｕ) 実開 昭59−18435（ＪＰ，Ｕ) 実開 昭57−170990（ＪＰ，Ｕ) 特公 昭47−20034（ＪＰ，Ｂ１) 特公 昭55−25037（ＪＰ，Ｂ２) ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inoue, Akira Inoue, 502 Jinritsucho, Tsuchiura, Ibaraki Prefecture, Institute of Mechanical Research, Hiritsu Manufacturing Co., Ltd. (56) References JP 62-211236 (JP, A) JP 49 -58777 (JP, A) JP-A-58-141536 (JP, A) Actually opened 49-148375 (JP, U) Actually opened 61-95740 (JP, U) Actually opened 61-92650 (JP, U) ) Actually open 59-46692 (JP, U) Actually open 52-103481 (JP, U) Actually open 52-35471 (JP, U) Actually open 59-18435 (JP, U) Actually open 57- 170990 (JP, U) JP47-20034 (JP, B1) JP55-25037 (JP, B2)
Claims (6)
の場所に移送する装置において、板状体との間に平面的
なすきまを形成するための保持面を備える保持体と、こ
の保持体に供給される大気圧以上の圧力を有する流体
を、この保持体の保持面に設けられ、この保持面に対向
する板状体に対して供給する絞りを備えた複数の流体噴
出部と、該流体噴出部の周囲を取り囲むように保持体の
保持面に設けられ、板状体に対して大気圧以下の圧力を
発生する流体吸引部と、前記保持体に設けられた握り部
と、前記流体噴出部および流体吸引部にそれぞれ通じる
通路を開閉する弁装置とを備えたことを特徴とする板状
体の移送装置。1. A device for holding a plate-shaped body in a non-contact manner by a fluid and transferring it to another place, the holding body having a holding surface for forming a planar clearance between the plate-shaped body and the plate-shaped body. A plurality of fluid ejecting parts provided with restrictors, which are provided on the holding surface of the holding body and supply the fluid having a pressure equal to or higher than the atmospheric pressure, which is supplied to the holding body, to the plate-like body facing the holding surface. A fluid suction part which is provided on the holding surface of the holding body so as to surround the fluid ejection part, and which generates a pressure below atmospheric pressure with respect to the plate-like body, and a grip part provided on the holding body. And a valve device that opens and closes passages that respectively communicate with the fluid ejection portion and the fluid suction portion.
部に、前記弁装置を設けたことを特徴とする特許請求の
範囲第１項記載の板状体の移送装置。2. The transfer device for a plate-like body according to claim 1, wherein the passage is provided in the grip portion, and the valve device is provided in the grip portion.
体供給源を、前記流体吸引部に通じる通路の他端側に流
体吸引源をそれぞれ設けたことを特徴とする特許請求の
範囲第２項記載の板状体の移送装置。3. A fluid supply source is provided at the other end of the passage leading to the fluid ejecting portion, and a fluid suction source is provided at the other end of the passage leading to the fluid suction portion. A transfer device for a plate-like body according to item 2.
体吸引源を真空ポンプとしたことを特徴とする特許請求
の範囲第３項に記載の板状体の移送装置。4. The plate-shaped member transfer device according to claim 3, wherein the fluid supply source is a pressure pump and the fluid suction source is a vacuum pump.
１つのポンプで構成したことを特徴とする特許請求の範
囲第３項記載の板状体の移送装置。5. The plate-shaped member transfer device according to claim 3, wherein the fluid supply source and the fluid suction source are constituted by one common pump.
れ加圧容器で構成したことを特徴とする特許請求の範囲
第３項記載の板状体の移送装置。6. The plate-shaped member transfer device according to claim 3, wherein each of the fluid supply source and the fluid suction source is constituted by a pressure vessel.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61094517A JPH0753543B2 (en) | 1986-04-25 | 1986-04-25 | Plate-shaped transfer device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61094517A JPH0753543B2 (en) | 1986-04-25 | 1986-04-25 | Plate-shaped transfer device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62255335A JPS62255335A (en) | 1987-11-07 |
| JPH0753543B2 true JPH0753543B2 (en) | 1995-06-07 |
Family
ID=14112517
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61094517A Expired - Lifetime JPH0753543B2 (en) | 1986-04-25 | 1986-04-25 | Plate-shaped transfer device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0753543B2 (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2619436B2 (en) * | 1987-11-30 | 1997-06-11 | 株式会社日立製作所 | Plate-like holding device |
| JP2880035B2 (en) * | 1993-02-02 | 1999-04-05 | 本田技研工業株式会社 | Parts suction device |
| WO1999064209A1 (en) * | 1998-06-08 | 1999-12-16 | Kuraitekku Co., Ltd. | Chuck and suction cup for platy material |
| JP7015131B2 (en) * | 2017-09-21 | 2022-02-02 | 株式会社ディスコ | Ring frame transport mechanism |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5314350B2 (en) * | 1972-10-04 | 1978-05-17 | ||
| JPS5235471U (en) * | 1975-09-05 | 1977-03-12 | ||
| JPS52103481U (en) * | 1976-02-04 | 1977-08-05 | ||
| JPS58141536A (en) * | 1982-02-17 | 1983-08-22 | Sanyo Electric Co Ltd | Attracting head of semiconductor wafer |
| JPS5946692U (en) * | 1982-09-21 | 1984-03-28 | 村松 雷太郎 | air tweezers |
-
1986
- 1986-04-25 JP JP61094517A patent/JPH0753543B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPS62255335A (en) | 1987-11-07 |
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