TWM618227U - Heater for welding and heating component - Google Patents

Abstract

The present invention provides a heating device for welding, which includes a heating main body, a nozzle part and a diverter. The heating body is suitable for generating a high-temperature air flow that can make the solder joints on the circuit board reach the soldering temperature. The nozzle part is arranged at the bottom of the heating body, and the nozzle part also has a jet flow channel communicating with the heating body to circulate a high-temperature air flow. The flow divider includes a flow divider body assembled in the jet flow channel. The branch body has a plurality of branch runners, and each branch runner has an inlet toward the inside of the jet runner and an outlet close to at least one of the solder joints. In this way, the solder joints can be heated by the high-temperature air flow to reach the soldering temperature. In addition, this creation also provides a heating assembly for welding.

Description

Heating device and heating component for welding

This creation provides a heating device and heating component for welding, especially a heating device and heating component that uses high-temperature airflow to heat solder joints for soldering.

Surface Mount Technology (Surface Mount Technology) is a soldering technology that combines electronic components on a circuit board. Specifically, the surface mount technology is to print solder paste on the solder pads of the circuit board, and then use the mounting machine to install surface bonding components, such as resistors, capacitors, inductors, diodes, transistors or integrated circuits (IC), and then The circuit board and the surface bonding components are sent into the soldering furnace together, and the solder paste is melted by reflow soldering. After the solder paste is cooled, the surface bonding parts can be combined with the solder pads of the circuit board to complete the assembly.

However, since the circuit board is sent into the soldering furnace together with the surface bonding components, the surface bonding parts must have a certain high temperature resistance. For the surface bonding parts that are less resistant to high temperatures, they cannot be applied to the surface bonding technology, and traditional methods must be used. Time-consuming wave soldering or less stable manual soldering.

The creator then exhausted his mind and painstaking research, and then developed a heating device and heating element for soldering, in order to achieve the purpose of making most of the electronic components can be quickly and stably mounted on the circuit board by automated technology.

The first aspect of this creation is to provide a heating device for soldering, which is suitable for heating a plurality of solder joints on a circuit board. The heating device for welding includes a heating body, a nozzle part, and Shunt pieces. The heating body is suitable for generating a high-temperature air flow that can make the solder joints on the circuit board reach the soldering temperature. The nozzle part is arranged at the bottom of the heating body, and the nozzle part has a jet flow channel communicating with the heating body to circulate a high-temperature air flow. The flow divider includes a flow divider body assembled in the jet flow channel of the nozzle part. The shunt body has a plurality of shunt channels, and each shunt tool has an inlet and an outlet. The inlet faces the inside of the air jet flow channel, and the outlet is adapted to be close to at least one of the solder joints of the circuit board, so that the solder joints are heated by the high-temperature air flow to reach the soldering temperature.

The second aspect of the present creation is to provide a heating assembly for welding, which includes a mold cavity and the above-mentioned heating device. The mold cavity is arranged under the nozzle part and used for accommodating the circuit board. The electronic component includes a circuit board and electronic components mounted on the circuit board. After the solder joint reaches the soldering temperature and is cooled, the electronic component is electrically connected to the circuit board.

In one embodiment, the shunt member further includes an abutment portion, which protrudes from the shunt body and is suitable for abutting against the circuit board, and the shunt is arranged around the abutment portion.

In one embodiment, the number of runners corresponds to the number of solder joints, and the runners are located above the solder joints.

In one embodiment, the air jet has an end, and there is a deep distance between the bottom and the end of the split body of the splitter.

In one embodiment, the heating body has a first air passage, a second air passage, and a through hole. The through hole communicates with the jet flow channel of the nozzle part and the first air channel, and the heating device used for welding may further include at least one heating element arranged on the heating body.

In an embodiment, the heating body has at least one heating hole adjacent to the first air passage, and the at least one heating element is disposed in the at least one heating hole.

In one embodiment, the heating device used for welding may further include an air inlet joint and an exhaust joint. The intake joint and the exhaust joint are arranged on the top side of the heating body opposite to the nozzle part. The intake joint is connected to the first air passage, and the exhaust joint is connected to the second air passage.

In an embodiment, the heating device used for welding may further include a heat-insulating shell, a heat-insulating member, and a fixing table. The heat-insulating shell covers the heating main body, and the heat-insulating member covers the nozzle part and is located below the heat-insulating shell. The fixing table is arranged between the heat-insulating shell and the heat-insulating element for fixing the heat-insulating shell, the heat-insulating element and the heating body.

In an embodiment, there is a gap between the heat insulating member and the nozzle part communicating with the second air passage.

In this way, the heating device and heating assembly for soldering created by this invention can concentrate the high-temperature airflow on the solder joints on the circuit board to reduce the impact on the electronic components mounted on the circuit board, thereby making most of the electronic components All can be quickly and stably installed on the circuit board by automated technology.

10: Heating device for welding

100: Insulated shell

101: pallet

110: fixed table

111: recess

200: heating body

220: Nozzle

230: shunt

231: Shunt Body

232: shunt channel

232a: entrance

232b: Exit

233: Abutment Department

30: Electronic components

31: circuit board

310: Pad

320: guide foot

32: Electronic components

33: Solder joint

300: Thermal insulation

400: heating element

500: air inlet connector

600: Exhaust connector

700: lock firmware

C: gap

D1: Depth distance

G: heating hole

H: Conductive via

P1: First airway

P11: Main airway

P12: Bronchus

P2: second airway

T: Through hole

T1: Jet runner

T2: end

Fig. 1 is a three-dimensional schematic diagram of a heating device used for welding in a specific embodiment of the invention.

Fig. 2 is a partial enlarged schematic diagram of the heating device used for welding in the specific embodiment of the invention in Fig. 1.

Fig. 3 is the first exploded schematic diagram of the splitter and the nozzle part of the specific embodiment of the creation.

Fig. 4 is the second exploded schematic diagram of the splitter and the nozzle part of the specific embodiment of the creation.

Fig. 5 is a three-dimensional exploded schematic diagram of the heating device used for welding in the specific embodiment of the invention.

Fig. 6 is a schematic top view of the heating device used for welding in the specific embodiment of the invention.

Fig. 7 is a schematic cross-sectional view taken along the line A-A of Fig. 6.

Fig. 8 is a schematic cross-sectional view taken along line B-B of Fig. 6.

Fig. 9 is a schematic cross-sectional view of the welding of the heating assembly used for welding in the specific embodiment of the invention.

Fig. 10 is a schematic diagram of the combination of the circuit board and the electronic components of the heating assembly for welding used in the specific embodiment of the creation.

In order to fully understand the purpose, features and effects of this creation, we will use the following specific examples and accompanying drawings to give a detailed description of this creation. The description is as follows: please refer to Figures 1 to 7. The first aspect of creation is to provide a heating device 10 for welding. The heating device 10 for welding includes a heating main body 200, a nozzle portion 220 and a diverter 230. The heating body 200 is suitable for generating high-temperature airflow. The nozzle portion 220 is provided at the bottom of the heating body 200, and the nozzle portion 220 has a jet flow channel T1 communicating with the heating body 200 to circulate a high-temperature air flow. The flow dividing member 230 includes a flow dividing body 231 assembled in the air jet flow channel T1 of the nozzle portion 220. The split body 231 has a plurality of split runners 232, and each split runner 232 has an inlet 232a facing the inside of the air jet flow channel T1 and an outlet 232b facing the outside of the air jet flow channel T1. The splitter 230 can be detachably assembled on the nozzle part 220 by screwing, but it is not limited to this. In addition, for different welding requirements, the nozzle part 220 can be assembled with different shunts 230.

Please refer to FIG. 7, FIG. 9 and FIG. 10. The second aspect of this creation is to provide a heating assembly 1 for welding. The heating assembly 1 for welding includes a heating device 10 for welding and a mold cavity 20. The cavity 20 is disposed under the nozzle portion 220 and is used for accommodating the electronic component 30. The electronic component 30 includes a circuit board 31 and electronic components 32 mounted on the circuit board 31. The circuit board 31 is provided with a plurality of solder contacts 33, and the outlet 232 b of each runner 232 is close to at least one of the solder contacts 33. The high-temperature air flow generated by the heating body 10 penetrates the air jet flow channel T1 of the nozzle 220 and the branch flow channel 232 of the shunt 230 and shoots toward the solder joint 33 to heat the solder joint 33. When the solder joint 33 reaches the soldering temperature After cooling, the electronic component 32 can be electrically connected to the circuit board 31. As shown in FIG. 10, the circuit board 31 may have a plurality of conductive through holes H, and each conductive A solder pad 310 may be provided around the through hole H, and the solder joint 33 may be provided on each solder pad 310 through a dispenser (not shown) and flow into the conductive through hole H. The electronic component 32 is, for example, a laser diode (Laser Diode), and is provided with a plurality of lead pins 320 for penetrating the conductive via H. The solder joint 33 is used to solder the lead 320 to the conductive via H.

Thereby, the heating device 10 for soldering and the heating assembly 1 of the present invention can concentrate the high-temperature airflow on the solder joints 33 on the circuit board 31, so as to reduce the influence on the electronic components 32 mounted on the circuit board 31, thereby So that most of the electronic components can be quickly and stably mounted on the circuit board by automated technology.

As shown in FIG. 3, FIG. 7 and FIG. 9, in one embodiment, the shunt 230 may further include an abutting portion 233. The abutting portion 233 protrudes from the shunt body 230 and is suitable for abutting against the circuit board 31, so that the outlet 232b of the shunt 232 can be kept at a proper distance from the solder joint 33, and the shunt 232 can be arranged around the abutting portion 233 . In addition, the air jet flow channel T1 has an end T2, and there may be a depth distance D1 between the bottom of the shunt body 231 of the shunt 230 and the end T2, so that the high-temperature air flow can be concentrated on the solder joint 33 before reaching the solder joint 33 Above the area to improve heating efficiency. The number of the runners 232 can correspond to the number of the solder joints 33, and each runner 232 can be located above each of the solder joints 33, but it is not limited to this. In other non-illustrated embodiments, one shunt 232 can also correspond to two solder contacts 33 or another number of solder contacts 33.

As shown in FIGS. 5 and 6, in one embodiment, the heating body 200 is a cylindrical member with high thermal conductivity, and its material can be metal, ceramic, graphite, or a composite material doped with metal or alloy. The nozzle part 220 may be a pipe body integrally extending at the bottom of the heating body 200, but is not limited thereto. The heating device 10 used for welding may further include a heat-insulating casing 100, a heat-insulating member 300 and a fixing table 110. The heat-insulating shell 100 covers the heating main body 200, and the heat-insulating member 300 covers the nozzle part 230 and is located below the heat-insulating shell 100 to fix The stand 110 is disposed between the heat insulation shell 100 and the heat insulation member for fixing the heat insulation shell 100, the heat insulation member 300 and the heating body 200.

As shown in FIGS. 7 and 9, and with reference to FIGS. 5 and 6, in one embodiment, the heating body 200 has a first air passage P1, a second air passage P2 and a through hole T inside. The through hole T communicates with the jet flow passage T1 and the first air passage P1 of the nozzle part 230. The heating device 10 used for welding in the present invention may further include an air inlet joint 500 and an exhaust joint 600. The intake joint 500 and the exhaust joint 600 are arranged on the top side of the heating body 200 opposite to the nozzle part 220. The intake connector 500 is connected to the first air passage P1, and the exhaust connector 600 is connected to the second air passage P2. There is a gap C between the heat insulator 300 and the nozzle part, and the gap C is connected to the second air passage P2. In addition, the heating device 10 for welding may further include at least one heating element 400 assembled on the heating body 200. In this embodiment, there are two sets of heating elements 400, which are respectively arranged in the two heating holes G of the heating body 200 adjacent to the air inlet connector 500, but it is not limited to this. The heating element 400 may be a metal rod, such as a copper rod, or may be a metal wire such as copper wire or steel wire. The heating element 400 can be heated to quickly conduct thermal energy to the heating body 200 with high thermal conductivity and the nozzle portion 220 extending from the heating body 200. In this embodiment, the above-mentioned air inlet connector 500, exhaust connector 600, heating element 400, etc. are all locked on the top side of the heating body 200 and extend into the heating body 200 to perform their respective functions. But it is not limited to this. Similarly, a temperature sensor (not shown) extending into the through hole T can be installed to monitor the temperature of the high-temperature airflow.

As shown in Figures 7 and 9, when the air inlet connector 500 introduces air into the first air passage P1, the heating element 400 can be heated at the same time. The air flowing through the first air passage P1 can be heated by the heating body 200 to generate a high temperature air flow The air flow can circulate through the through hole T to the air jet flow channel T1 of the nozzle portion 220, and then is ejected from the plurality of branch flow channels 232 of the branch 230 to heat the solder joint 33. The pressure of the mold cavity 20 will rise under continuous high-temperature airflow, and the air in the cavity 20 can flow back to the second air passage P2 in the heating body 200 through the gap C, and finally discharged to the heating body 200 by the exhaust connector 600, thereby achieving The circulation of hot and cold air convection. In order to further improve the heat conduction efficiency of the heating body 200, the first air passage P1 may include a main air passage P11 directly connected to the air inlet connector 500, and a branch air passage P12 connected between the main air passage P11 and the through hole T. The bronchus P12 can be bent to increase the heated area. Both the main airway P11 and the bronchial airway P12 can be provided with a heat-conducting member (not shown) that is locked to the top side of the heating body 200 and extends in, such as a metal with a spiral structure or a spring structure or other high thermal conductivity materials.

As shown in FIGS. 5 and 7-9, in one embodiment, the heat-insulating shell 100 and the heat-insulating member 300 may both be cylindrical bodies made of heat-insulating materials to maintain thermal energy in the heating body 200 and the nozzle portion 220 in. The heat-insulating shell 100 can be tightly fitted outside the heating body 200, and the bottom of the heat-insulating shell 100 can be provided with a supporting table 101 to support the heating body 200, and the fixing table 110 can have a recess corresponding to the configuration of the supporting table 101 111. The heating device 10 used for welding of the present invention may further include a plurality of fasteners 700. In FIG. 8, a part of the fasteners 700 pass through the heating body 200 and the support platform 101 of the insulating shell 100 from the top side of the heating body 200. And it is locked to the recess 111 of the fixed platform 110. In FIG. 7, a part of the locking member 700 passes through the insulating member from the bottom of the insulating member 300 and is locked to the recess 111 of the fixing table 110. In addition, the fixing table 110 can be fixed to a moving mechanism (not shown) such as an elevator table, so that the heating device 10 for welding can be moved as a whole.

It is worth noting that the heating device and heating component used for welding in this creation are to concentrate heat energy in a limited area in the mold cavity for welding, which is different from the technology of heating the entire mold cavity, such as the applicant’s announcement Although the heating mechanism of the heating module disclosed in the new patent No. M601900 is slightly similar to the heating device used for welding in this creation, the purpose of the creation of the new patent No. M601900 is to heat the entire cavity quickly and evenly. In order to make the printed circuit board thermoformed. Therefore, based on the prior art, such as the M601000 model patent, there is no motivation to think about the scope of the patent application for the following creation.

This creation has been disclosed in a preferred embodiment above, but those familiar with this technology should understand that this embodiment is only used to describe the creation, and should not be interpreted as limiting the scope of this creation. It should be noted that all changes and replacements equivalent to this embodiment should be included in the scope of this creation. Therefore, the scope of protection of this creation shall be subject to the scope of the patent application.

10: Heating device for welding

100: Insulated shell

110: fixed table

200: heating body

220: Nozzle

230: shunt

300: Thermal insulation

400: heating element

500: air inlet connector

600: Exhaust connector

Claims (10)

A heating device for soldering, suitable for heating a plurality of solder joints on a circuit board, the heating device includes: a heating body, suitable for generating a solder joints on the circuit board to a soldering temperature A high-temperature air flow; a nozzle portion disposed at a bottom of the heating body, the nozzle portion and a jet flow channel connected to the heating body to circulate the high-temperature air flow; and a flow divider, including the nozzle portion assembled A shunt body in the jet runner, the shunt body has a plurality of runners, each of the splitters has an inlet and an outlet, the inlet faces the inside of the jet runner, and the outlet is suitable for being close to the solder connections of the circuit board At least one of the dots, so that the solder joints are heated by the high-temperature airflow to reach the soldering temperature. The heating device for welding according to claim 1, wherein the shunt member further includes an abutting portion, the abutting portion protrudes from the shunt body and is suitable for abutting against the circuit board, and the shunts are It is arranged around the abutting part. The heating device for soldering according to claim 1, wherein the number of the runners corresponds to the number of solder joints, and the runners are respectively located above the solder joints. The heating device for welding according to claim 1, wherein the air jet has an end, and there is a deep distance between the bottom of the shunt body of the shunt body and the end. The heating device for welding according to claim 1, wherein the inside of the heating body has a first air passage, a second air passage and a through hole, and the through hole communicates with the jet flow passage of the nozzle part and the first air passage. And the heating device for welding further includes at least one heating element arranged on the heating main body. The heating device for welding according to claim 5, wherein the heating body has at least one heating hole adjacent to the first air passage, and the at least one heating element is disposed in the at least one heating hole. The heating device for welding according to claim 5, which further includes an intake joint and an exhaust joint, the intake joint and the exhaust joint are arranged on a top side opposite to the nozzle part, the intake The joint is communicated with the first air passage, and the exhaust joint is communicated with the second air passage. The heating device for welding according to claim 5, which further includes a heat-insulating shell, a heat-insulating member, and a fixing table, the heat-insulating shell covering the heating body, and the heat-insulating member covering the nozzle part and located at Below the heat-insulating shell, the fixing table is arranged between the heat-insulating shell and the heat-insulating element for fixing the heat-insulating shell, the heat-insulating element and the heating body. The heating device for welding according to claim 8, wherein there is a gap between the heat insulating member and the nozzle portion, and the gap is connected to the second air passage. A heating assembly, comprising: a heating device according to any one of claims 1-9; and a mold cavity, arranged under the nozzle part and used for accommodating an electronic assembly, the electronic assembly including the circuit board And an electronic component mounted on the circuit board, After the solder joints reach the soldering temperature and are cooled, the electronic component is electrically connected to the circuit board.

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