CN215145484U - Heating device and heating assembly for welding - Google Patents

Abstract

The utility model provides a be used for welded heating device, it contains heating main part, nozzle portion and reposition of redundant personnel piece. The heating body is adapted to generate a high temperature air flow that brings the solder joints on the circuit board to a soldering temperature. The nozzle part is arranged at the bottom of the heating body and is provided with a jet flow channel communicated with the heating body for circulating high-temperature air flow. The flow dividing element comprises a flow dividing body assembled in the jet flow channel. The diverter body has a plurality of diverter channels, each diverter channel having an inlet facing the interior of the jet channel and an outlet proximate at least one of the solder joints. Thereby the soldering tin joint can be heated by high-temperature air flow to reach the soldering temperature. Additionally, the utility model discloses also provide a heating element for welding.

Description

Heating device and heating assembly for welding

Technical Field

The present invention relates to a heating device and a heating assembly for welding, and more particularly to a heating device and a heating assembly for welding by heating soldering tin joints with high temperature air flow.

Background

Surface Mount Technology (Surface Mount Technology) is a soldering technique for bonding electronic components to a circuit board. Specifically, the surface mount technology is to print solder paste on the pads of the circuit board, mount a surface mount component such as a resistor, a capacitor, an inductor, a diode, a transistor, or an Integrated Circuit (IC) using a mounter, feed the circuit board and the surface mount component together into a soldering furnace, melt the solder paste by reflow soldering, and bond the surface mount component to the pads of the circuit board after the solder paste is cooled, thereby completing the assembly.

However, since the circuit board is fed into the soldering furnace together with the surface mount component, the surface mount component must have a certain temperature resistance, and the surface mount component which is less resistant to high temperature cannot be applied to the surface mount technology, and conventional wave soldering, which is time consuming, or manual soldering, which is less stable, must be used.

SUMMERY OF THE UTILITY MODEL

Based on the technical scheme of at least one embodiment of the utility model, the utility model is used for welded heating device and heating element can realize making most electronic component all accessible automatic technique install the purpose on the circuit board fast and steadily.

A first aspect of the present invention is to provide a heating device for welding, which is suitable for heating a plurality of soldering tin contacts on a circuit board. The heating device for welding comprises a heating body, a nozzle part and a shunt. The heating body is adapted to generate a high temperature air flow that brings the solder joints on the circuit board to a soldering temperature. The nozzle part is arranged at the bottom of the heating body and is provided with a jet flow channel communicated with the heating body for circulating high-temperature air flow. The flow dividing member includes a flow dividing body assembled in the air flow passage of the nozzle portion. The flow distribution body is provided with a plurality of flow distribution channels, and each flow distribution channel is provided with an inlet and an outlet. The inlet faces the inside of the air jet channel, and the outlet is suitable for being close to at least one of the soldering tin joints of the circuit board, so that the soldering tin joints are heated by high-temperature air flow to reach soldering temperature.

A second aspect of the present invention is to provide a heating assembly for welding, which comprises a mold cavity and the above-mentioned heating device. The mold cavity is arranged below the nozzle part and used for accommodating the circuit board. The electronic assembly includes a circuit board and an electronic component mounted on the circuit board. And after the soldering tin joint reaches the soldering temperature and is cooled, the electronic element is electrically connected with the circuit board.

In an embodiment, the shunt further includes an abutting portion protruding from the shunt body and adapted to abut against the circuit board, and the shunt passage is disposed around the abutting portion.

In one embodiment, the number of the runners corresponds to the number of the solder joints, and the runners are respectively located above the solder joints.

In one embodiment, the jet stream channel has a distal end, and the splitter body of the splitter has a depth distance between the bottom and the distal end.

In one embodiment, the heating body has a first air passage, a second air passage and a through hole inside. The through hole is communicated with the jet flow channel and the first air channel of the nozzle part, and the heating device for welding can further comprise at least one heating element assembled on the heating body.

In one embodiment, the heating body has at least one heating hole adjacent to the first air channel, and the at least one heating element is disposed in the at least one heating hole.

In an embodiment, the heating device for welding may further comprise an air inlet joint and an air outlet joint. The air inlet joint and the air outlet joint are arranged on the top side of the heating body opposite to the nozzle part. The air inlet joint is communicated with the first air passage, and the air outlet joint is communicated with the second air passage.

In one embodiment, the heating device for welding may further include an insulation case, an insulation member, and a fixing table. The heat insulation shell covers the heating body, and the heat insulation piece covers the nozzle part and is positioned below the heat insulation shell. The fixing table is provided between the heat insulating case and the heat insulating member to fix the heat insulating case, the heat insulating member, and the heating body.

In one embodiment, the thermal insulator and the nozzle portion have a gap therebetween communicating with the second air passage.

Therefore, the utility model discloses a soldering tin contact that is used for welded heating device and heating element can concentrate on the circuit board with the high temperature air current to reduce the influence to installing the electronic component on the circuit board, thereby make most electronic component all accessible automatic technique install on the circuit board fast and steadily.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without inventive exercise.

Fig. 1 is a perspective view of a heating device for welding according to an embodiment of the present invention.

Fig. 2 is a partial enlarged view of the heating device for welding according to the embodiment of the present invention shown in fig. 1.

Fig. 3 is an exploded view of the nozzle portion and the flow divider according to the embodiment of the present invention.

Fig. 4 is an exploded view of the flow divider and the nozzle portion according to the embodiment of the present invention.

Fig. 5 is a perspective exploded view of a heating device for welding according to an embodiment of the present invention.

Fig. 6 is a top view of a heating device for welding according to an embodiment of the present invention.

Fig. 7 is a sectional view taken along line a-a of fig. 6.

Fig. 8 is a sectional view taken along line B-B of fig. 6.

Fig. 9 is a cross-sectional view of a heating assembly for welding according to an embodiment of the present invention.

Fig. 10 is a combination diagram of a circuit board and an electronic component of a heating assembly for soldering according to an embodiment of the present invention.

Reference numerals:

10 heating device for welding

100 heat insulating shell

101 bearing platform

110 fixed table

111 recess

200 heating body

220 nozzle part

230 shunt

231 diverter body

232 flow dividing channel

232a inlet

232b outlet

233 abutting part

30 electronic assembly

31 circuit board

310 pad

320 guide pin

32 electronic component

33 solder joint

300 thermal insulation

400 heating element

500 air inlet joint

600 exhaust joint

700 locking part

C gap

Distance of depth D1

G heating hole

H conductive via

P1 first airway

P11 main air passage

P12 branch airway

P2 second air passage

T-shaped through hole

T1 jet channel

End of T2

Detailed Description

The foregoing and other technical and other features and advantages of the invention will be apparent from the following detailed description of preferred embodiments, which proceeds with reference to the accompanying drawings. It is worth mentioning directional terms as mentioned in the following examples, such as: up, down, left, right, front or rear, etc., are referred to only in the direction of the attached drawings. Accordingly, the directional terminology is used for purposes of illustration and is in no way limiting. Further, in the following embodiments, the same or similar components will be given the same or similar reference numerals.

The heating device and the heating assembly for welding according to the embodiments of the present invention will be further described with reference to the accompanying drawings.

Referring to fig. 1 to 7, a first aspect of the present invention is to provide a heating device 10 for welding. The heating apparatus 10 for welding includes a heating body 200, a nozzle portion 220, and a flow divider 230. The heating body 200 is adapted to generate a high temperature air flow. The nozzle part 220 is disposed at the bottom of the heating body 200, and the nozzle part 220 has an air jet passage T1 communicating with the heating body 200 to flow a high temperature air flow. The flow dividing member 230 includes a flow dividing body 231 assembled in the air jet passage T1 of the nozzle portion 220. The flow dividing body 231 has a plurality of flow dividing passages 232, and each flow dividing passage 232 has an inlet 232a facing the inside of the flow dividing passage T1 and an outlet 232b facing the outside of the flow dividing passage T1. The flow dividing member 230 may be detachably assembled to the nozzle part 220 by a screw connection, but is not limited thereto. In addition, different flow splitters 230 may be incorporated into the nozzle portion 220 for different welding requirements.

Referring to fig. 7, 9 and 10, a second aspect of the present invention is to provide a heating assembly 1 for welding. The heating element for welding 1 comprises a heating device for welding 10 and a moulding cavity 20. The mold cavity 20 is disposed below the nozzle portion 220 and is used for accommodating the electronic component 30. The electronic component 30 includes a circuit board 31 and an electronic component 32 mounted on the circuit board 31. The circuit board 31 is provided with a plurality of solder contacts 33, and the outlet 232b of each shunt channel 232 is close to at least one of the solder contacts 33. The high temperature air flow generated by the heating body 10 is emitted to the solder joint 33 through the air channel T1 of the nozzle part 220 and the branch channel 232 of the branch member 230 to heat the solder joint 33, and when the solder joint 33 reaches the soldering temperature and is cooled, the electronic component 32 can be electrically connected to the circuit board 31. As shown in fig. 10, the circuit board 31 may have a plurality of conductive vias H, a solder pad 310 may be disposed around each conductive via H, and the solder joint 33 may be disposed on each solder pad 310 by a dispenser (not shown) and flow into the conductive via H. The electronic component 32 is, for example, a Laser Diode (Laser Diode), and is provided with a plurality of leads 320 for penetrating the conductive through holes H. The solder joints 33 are used to solder the leads 320 to the conductive vias H.

Therefore, the utility model discloses a be used for welded heating device 10 and heating element 1 can concentrate the soldering tin contact 33 on circuit board 31 with the high temperature air current to reduce the influence to installing electronic component 32 on circuit board 31, thereby make most electronic component all can install on the circuit board fast and steadily through automatic technique.

As shown in fig. 3, 7 and 9, in an embodiment, the shunt member 230 may further include an abutting portion 233. The abutting portion 233 protrudes from the shunt body 230 and is adapted to abut against the circuit board 31, so that the outlet 232b of the shunt channel 232 can be kept at a proper distance from the solder joint 33, and the shunt channel 232 can be disposed around the abutting portion 233. In addition, the gas injection channel T1 has a terminal T2, and a depth distance D1 may be provided between the bottom of the shunt body 231 of the shunt 230 and the terminal T2, so that the high temperature gas flow can be concentrated above the area of the solder joint 33 before reaching the solder joint 33, thereby improving the heating efficiency. The number of runners 232 may correspond to the number of solder joints 33, and each runner 232 may be located above each solder joint 33, but is not limited thereto. In other embodiments, not shown, one shunt 232 may correspond to two solder joints 33 or other numbers of solder joints 33.

As shown in fig. 5 and 6, in one embodiment, the heating body 200 is a cylindrical member with high thermal conductivity, and the material thereof may be metal, ceramic, graphite or a composite material doped with metal or alloy. The nozzle portion 220 may be a tube integrally extended from the bottom of the heating body 200, but is not limited thereto. The heating apparatus for welding 10 may further include an insulation case 100, an insulation 300, and a fixing table 110. The insulation case 100 covers the heating body 200, the insulation member 300 covers the nozzle portion 230 and is located below the insulation case 100, and the fixing base 110 is provided between the insulation case 100 and the insulation member to fix the insulation case 100, the insulation member 300, and the heating body 200.

As shown in fig. 7 and 9 and referring to fig. 5 and 6, in an embodiment, the heating body 200 has a first air passage P1, a second air passage P2 and a through hole T inside. The through hole T is connected to the gas injection passage T1 of the nozzle 230 and the first gas passage P1. The heating device 10 for welding of the present invention may further comprise an air inlet connector 500 and an air outlet connector 600. The air inlet joint 500 and the air outlet joint 600 are provided on the top side of the heating body 200 opposite to the nozzle part 220. The intake joint 500 is communicated with the first air passage P1, and the exhaust joint 600 is communicated with the second air passage P2. The heat insulator 300 and the nozzle portion have a gap C therebetween, and the gap C communicates with the second gas passage P2. In addition, the heating apparatus 10 for welding may further include at least one heating member 400 assembled to the heating body 200. In the present embodiment, the heating members 400 are provided in two groups, respectively, in the two heating holes G of the heating body 200 adjacent to the air inlet connector 500, but not limited thereto. The heating element 400 may be a metal rod, such as a copper rod, or may be a metal wire, such as a copper wire or steel wire. The heating member 400 is heated to rapidly transfer heat energy to the heating body 200 having a high thermal conductive property and the nozzle portion 220 extended to the heating body 200. In the present embodiment, the air inlet connector 500, the air outlet connector 600, the heating member 400, etc. mentioned above are locked to the top side of the heating body 200 and extend into the heating body 200 to perform their respective functions, but are not limited thereto. Similarly, a temperature sensor (not shown) extending into the through hole T may be further installed to monitor the temperature of the high temperature gas flow.

As shown in fig. 7 and 9, when the air inlet connector 500 introduces air into the first air passage P1, the heating element 400 is heated at the same time, the air flowing through the first air passage P1 can be heated by the heating body 200 to generate a high temperature air flow, and the high temperature air flow can flow through the through hole T to the air injection passage T1 of the nozzle portion 220 and then be emitted from the plurality of branch passages 232 of the flow divider 230 to heat the solder joints 33. The mold cavity 20 is pressurized when continuously receiving the high temperature air flow, and the air in the mold cavity 20 can flow back to the second air passage P2 in the heating body 200 through the clearance C and finally be discharged out of the heating body 200 through the air discharge joint 600, thereby achieving the circulation of hot and cold air convection. In order to further improve the heat conduction efficiency of the heating body 200, the first air passage P1 may include a main air passage P11 directly connected to the air inlet connector 500, and a branch air passage P12 connected between the main air passage P11 and the through hole T. The branch passage P12 may be curved to increase the heated area. Both the main passage P11 and the branch passage P12 may be provided with a heat conductive member (not shown) such as metal or other high heat conductive material having a spiral structure or a spring structure, which is fastened to the top side of the heating body 200 and extends thereinto.

As shown in fig. 5 and 7 to 9, in one embodiment, the thermal insulation casing 100 and the thermal insulation member 300 may be both cylinders made of thermal insulation material to maintain thermal energy in the heating body 200 and the nozzle portion 220. The heat insulation housing 100 may be closely fitted outside the heating body 200, and the bottom of the heat insulation housing 100 may be provided with a supporting platform 101 for supporting the heating body 200, and the fixing platform 110 may have a recess 111 corresponding to the configuration of the supporting platform 101. The heating apparatus 10 for welding of the present invention may further include a plurality of locking members 700, and in fig. 8, a portion of the locking members 700 passes through the heating main body 200 and the supporting platform 101 of the heat insulating housing 100 from the top side of the heating main body 200 and is locked to the concave portion 111 of the fixing platform 110. In fig. 7, a part of the locking member 700 passes through the heat insulating member 300 from the bottom thereof and is locked to the recess 111 of the fixing table 110. In addition, the fixing table 110 may be fixed to a moving mechanism (not shown) such as an elevator table so that the heating apparatus 10 for welding may be integrally moved.

It should be noted that the heating device and the heating element for welding of the present invention are different from the technique of heating the whole mold cavity by concentrating the heat energy in a limited area in the mold cavity, such as the heating module disclosed in the applicant's publication number TWM601900, the heating mechanism of which is slightly similar to the heating device for welding of the present invention, however, the invention of the TWM601900 is to heat the whole mold cavity quickly and uniformly so as to form the printed circuit board by heat molding. There is therefore no motivation to think of the scope of protection claimed by the present invention on the basis of the prior art, for example, the TWM601900 patent.

The above description is only an embodiment of the present invention, and it is not intended to limit the scope of the present invention.

Claims (10)

1. A heating device for soldering, adapted to heat a plurality of solder joints on a circuit board, the heating device comprising:

a heating body adapted to generate a high temperature air flow that brings the solder joints on the circuit board to a soldering temperature;

the nozzle part is arranged at the bottom of the heating main body and is provided with a jet flow channel which is communicated with the heating main body to circulate the high-temperature air flow; and

a splitter including a splitter body assembled in the air flow channel of the nozzle, the splitter body having a plurality of splitter channels, each splitter channel having an inlet facing the interior of the air flow channel and an outlet adapted to be proximate to at least one of the solder joints of the circuit board such that the solder joint is heated by the high temperature air flow to the soldering temperature.

2. The heating device for welding as claimed in claim 1, wherein the shunt member further comprises an abutting portion protruding from the shunt body and adapted to abut against the circuit board, and the shunt passage is disposed around the abutting portion.

3. The heating device for welding as defined in claim 1, wherein the number of said runners corresponds to the number of said solder joints, and said runners are respectively located above said solder joints.

4. The heating apparatus for welding of claim 1, wherein said jet channel has a distal end, and a depth distance is provided between a bottom of a diverter body of said diverter and said distal end.

5. The heating apparatus for welding as defined in claim 1, wherein the heating body has a first air passage, a second air passage and a through hole therein, the through hole communicating with the air injection passage of the nozzle portion and the first air passage, and the heating apparatus for welding further comprises at least one heating member assembled to the heating body.

6. The heating device for welding as defined in claim 5, wherein said heating body has at least one heating hole adjacent to said first gas channel, said at least one heating element being disposed in said at least one heating hole.

7. The heating apparatus for welding as defined in claim 5, further comprising an air inlet connector and an air outlet connector, said air inlet connector and said air outlet connector being disposed on a top side of said nozzle portion, said air inlet connector being in communication with said first air passage, said air outlet connector being in communication with said second air passage.

8. The heating apparatus for welding according to claim 5, further comprising an insulating case covering the heating body, an insulating member covering the nozzle portion and located below the insulating case, and a fixing table provided between the insulating case and the insulating member for fixing the insulating case, the insulating member, and the heating body.

9. The heating apparatus for welding as set forth in claim 8, wherein a gap is provided between said heat insulator and said nozzle portion, said gap communicating with said second air passage.

10. A heating assembly, comprising:

a heating device according to any one of claims 1-9; and

and the die cavity is arranged below the nozzle part and used for accommodating an electronic component, the electronic component comprises the circuit board and an electronic element arranged on the circuit board, and the electronic element is electrically connected with the circuit board after the soldering tin joint reaches the soldering temperature and is cooled.

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