TWI778650B - Heating elements for welding - Google Patents

Abstract

The present invention provides a heating device for welding, which includes a heating main body, a nozzle part and a diverter. The heating body is adapted to generate a high temperature air flow which can bring the solder joints on the circuit board to a soldering temperature. The nozzle part is arranged at the bottom of the heating main body, and the nozzle part has a jet flow channel which is communicated with the heating main body to circulate high-temperature airflow. The flow dividing element includes a flow dividing body assembled in the jet flow channel. The shunt body has a plurality of shunt channels, and each shunt channel has an inlet toward the inside of the jet runner and an outlet close to at least one of the solder joints. Thereby, the solder joints can be heated by the high temperature airflow to reach the soldering temperature. In addition, the present invention also provides a heating assembly for welding.

Description

Heating elements for welding

The present invention provides a heating device and a heating assembly for welding, especially a heating device and a heating assembly for welding by heating solder joints with high temperature airflow.

Surface Mount Technology is a soldering technology that combines electronic components on circuit boards. Specifically, surface mount technology prints solder paste on the pads of a circuit board, and then uses a mounter to mount surface-attached components, such as resistors, capacitors, inductors, diodes, transistors, or integrated circuits (ICs), and then The circuit board and the surface-attached components are sent into the soldering furnace, and the solder paste is melted by reflow soldering. After the solder paste is cooled, the surface-attached parts can be combined with the pads of the circuit board to complete the assembly.

However, since the circuit board is sent into the soldering furnace together with the surface-attached components, the surface-attached parts must have a certain high temperature resistance. For the surface-attached parts that are less resistant to high temperature, the surface-attached technology cannot be applied, and traditional methods must be used. Time-consuming wave soldering or less stable manual soldering.

The inventor then exhausted his mind and research, and then developed a heating device and a heating assembly for soldering, in order to achieve the purpose of making most of the electronic components can be quickly and stably installed on the circuit board by automated technology.

A first aspect of the present invention is to provide a heating device for soldering, which is suitable for heating a plurality of solder contacts on a circuit board. The heating device for welding includes a heating body, a nozzle part, and shunt. The heating body is adapted to generate a high temperature air flow which can bring the solder joints on the circuit board to a soldering temperature. The nozzle part is arranged at the bottom of the heating body, and the nozzle part has a jet flow channel which is communicated with the heating body to circulate high temperature airflow. The flow dividing member includes a flow dividing body assembled in the jet flow channel of the nozzle part. The shunt body has a plurality of shunt channels, and each shunt channel has an inlet and an outlet. The inlet faces the inside of the air jet flow channel, and the outlet is adapted to be close to at least one of the solder joints of the circuit board, so that the solder joints are heated by the high-temperature airflow to reach the soldering temperature.

A second aspect of the present invention is to provide a heating element for welding, which includes a mold cavity and the above-mentioned heating device. The mold cavity is arranged below the nozzle portion and is used for accommodating the circuit board. Electronic assemblies include circuit boards and electronic components mounted on the circuit boards. After the solder joint reaches the soldering temperature and cools, the electronic component is electrically connected to the circuit board.

In one embodiment, the shunt element further includes an abutting portion, the abutting portion protrudes from the shunt body and is suitable for abutting against the circuit board, and the shunt channel is disposed around the abutting portion.

In one embodiment, the number of runners corresponds to the number of solder joints, and the runners are located above the solder joints, respectively.

In one embodiment, the jet flow channel has an end, and the bottom of the flow distribution body of the flow divider has a depth distance from the end.

In one embodiment, the inside of the heating body has a first air passage, a second air passage and a through hole. The through hole is communicated with the jet flow channel of the nozzle part and the first air channel, and the heating device for welding may further comprise at least one heating element assembled on the heating body.

In one embodiment, the heating body has at least one heating hole adjacent to the first air passage, and the at least one heating element is disposed in the at least one heating hole.

In one embodiment, the heating device for welding may further include an air inlet joint and an exhaust joint. The intake joint and the exhaust joint are arranged on the top side of the heating body opposite to the nozzle portion. The intake joint is communicated with the first air passage, and the exhaust joint is communicated with the second air passage.

In one embodiment, the heating device for welding may further include a heat insulating casing, a heat insulating member and a fixing table. The heat insulating shell covers the heating main body, and the heat insulating member covers the nozzle part and is located under the heat insulating shell. The fixing table is arranged between the heat insulating casing and the heat insulating member for fixing the heat insulating casing, the heat insulating member and the heating body.

In one embodiment, a gap communicated with the second air passage is formed between the heat insulating member and the nozzle portion.

Thereby, the heating device for soldering and the heating assembly of the present invention can concentrate the high-temperature airflow on the solder joints on the circuit board, so as to reduce the influence on the electronic components mounted on the circuit board, so that most electronic components All can be quickly and stably mounted on the circuit board by automated technology.

10: Heating device for welding

100: Insulated shell

101: Supporting table

110: Fixed table

111: Recess

200: Heating the main body

220: Nozzle part

230: Diverter

231: Shunt Ontology

232: shunt channel

232a: Entrance

232b: Export

233: Abutment

30: Electronic Components

31: circuit board

310: Solder pad

320: Guide feet

32: Electronic Components

33: Solder Contacts

300: Thermal insulation

400: heating element

500: Intake connector

600: Exhaust joint

700: Lock firmware

C: gap

D1: depth distance

G: Heating hole

H: conductive via

P1: first airway

P11: Main airway

P12: Bronchi

P2: Second Airway

T: through hole

T1: Jet runner

T2: end

FIG. 1 is a schematic perspective view of a heating device for welding according to a specific embodiment of the present invention.

FIG. 2 is a partial enlarged schematic view of the heating device for welding according to the specific embodiment of the present invention of FIG. 1 .

FIG. 3 is an exploded schematic view 1 of the flow dividing member and the nozzle part according to the specific embodiment of the present invention.

FIG. 4 is a second exploded schematic view of the flow dividing member and the nozzle part according to the specific embodiment of the present invention.

5 is a schematic exploded perspective view of a heating device for welding according to a specific embodiment of the present invention.

6 is a schematic top view of a heating device for welding according to a specific embodiment of the present invention.

FIG. 7 is a schematic cross-sectional view taken along line A-A of FIG. 6 .

FIG. 8 is a schematic cross-sectional view taken along line B-B of FIG. 7 .

FIG. 9 is a schematic cross-sectional view of the welding heating assembly for welding according to an embodiment of the present invention.

FIG. 10 is a schematic diagram of a combination of a circuit board and an electronic component applied to a heating assembly for welding according to an embodiment of the present invention.

In order to fully understand the purpose, features and effects of the present invention, hereby, the present invention is described in detail by the following specific embodiments and in conjunction with the accompanying drawings, and the description is as follows: Referring to FIGS. 1 to 7 , a first aspect of the present invention provides a heating device 10 for welding. The heating device 10 for welding includes a heating main body 200 , a nozzle part 220 and a shunt 230 . The heating body 200 is adapted to generate high temperature airflow. The nozzle part 220 is disposed at the bottom of the heating body 200 , and the nozzle part 220 has an air jet flow channel T1 which is communicated with the heating body 200 to flow high-temperature airflow. The diverter member 230 includes a diverter body 231 assembled in the jet flow channel T1 of the nozzle portion 220 . The branch body 231 has a plurality of branch channels 232, and each branch channel 232 has an inlet 232a facing the inside of the jetting flow channel T1 and an outlet 232b facing the outside of the jetting flow channel T1. The diverting member 230 can be detachably assembled on the nozzle portion 220 by screwing, but is not limited to this. In addition, according to different welding requirements, the nozzle portion 220 can be assembled with different diverting members 230 .

Please refer to FIG. 7 , FIG. 9 and FIG. 10 , a second aspect of the present invention provides a heating element 1 for welding. The heating assembly 1 for welding includes a heating device 10 for welding and a cavity 20 . The mold cavity 20 is disposed below the nozzle portion 220 and is used for accommodating the electronic component 30 . The electronic assembly 30 includes a circuit board 31 and electronic components 32 mounted on the circuit board 31 . The circuit board 31 is provided with a plurality of solder joints 33 , and the outlet 232 b of each runner 232 is close to at least one of the solder joints 33 . The high-temperature air flow generated by heating the main body 10 passes through the air jet runner T1 of the nozzle part 220 and the runner 232 of the shunt member 230 and shoots toward the solder joint 33 to heat the solder joint 33. When the solder joint 33 reaches the soldering temperature After cooling, the electronic components 32 can be electrically connected to the circuit board 31 . As shown in FIG. 10 , the circuit board 31 may have a plurality of conductive vias H, each of which is conductive Solder pads 310 may be disposed around the through holes H, and solder contacts 33 may be disposed on each of the solder pads 310 through a glue dispenser (not shown) and flow into the conductive through holes H. As shown in FIG. The electronic component 32 is, for example, a laser diode, and is provided with a plurality of lead pins 320 for penetrating the conductive through holes H. As shown in FIG. The solder contacts 33 are used for soldering the lead pins 320 to the conductive vias H. As shown in FIG.

Thereby, the heating device 10 for soldering and the heating assembly 1 of the present invention can concentrate the high-temperature airflow on the solder joints 33 on the circuit board 31 to reduce the influence on the electronic components 32 mounted on the circuit board 31 , thereby Most electronic components can be quickly and stably mounted on circuit boards by automated technology.

As shown in FIG. 3 , FIG. 7 and FIG. 9 , in one embodiment, the diverting member 230 may further include an abutting portion 233 . The abutting portion 233 protrudes from the shunt body 230 and is suitable for abutting against the circuit board 31 , so that the outlet 232b of the shunt 232 can be kept at a proper distance from the solder contacts 33 , and the shunt 232 can be arranged around the abutting portion 233 . In addition, the air jet runner T1 has an end T2, and a depth distance D1 may be provided between the bottom of the shunt body 231 of the shunt 230 and the end T2, so that the high temperature airflow can be concentrated on the solder joint 33 before reaching the solder joint 33 above the area to increase the efficiency of heating. The number of the runners 232 may correspond to the number of solder joints 33 , and each runner 232 may be located above each solder joint 33 , but not limited to this. In other not-shown embodiments, one runner 232 may also correspond to two solder joints 33 or other numbers of solder joints 33 .

As shown in FIG. 5 and FIG. 6 , in one embodiment, the heating body 200 is a cylindrical member with high thermal conductivity, and its material can be metal, ceramic, graphite or a composite material doped with metal or alloy. The nozzle part 220 may be a pipe body extending from the bottom of the heating body 200 as a whole, but is not limited thereto. The heating device 10 for welding may further include a heat insulating casing 100 , a heat insulating member 300 and a fixing table 110 . The heat insulating housing 100 covers the heating main body 200, and the heat insulating member 300 covers the nozzle portion 230 and is located below the heat insulating housing 100, and is fixed The stage 110 is disposed between the heat insulating case 100 and the heat insulating member for fixing the heat insulating case 100 , the heat insulating member 300 and the heating body 200 .

As shown in FIGS. 7 and 9 , and with reference to FIGS. 5 and 6 , in one embodiment, the heating body 200 has a first air passage P1 , a second air passage P2 and a through hole T inside. The through hole T communicates with the air jet flow passage T1 of the nozzle portion 230 and the first air passage P1. The heating device 10 for welding of the present invention may further include an air inlet joint 500 and an exhaust joint 600 . The intake joint 500 and the exhaust joint 600 are disposed on the top side of the heating body 200 opposite to the nozzle part 220 . The intake joint 500 is communicated with the first air passage P1, and the exhaust joint 600 is communicated with the second air passage P2. There is a gap C between the heat insulator 300 and the nozzle portion, and the gap C communicates with the second air passage P2. In addition, the heating device 10 for welding may further include at least one heating element 400 assembled on the heating body 200 . In this embodiment, there are two groups of heating elements 400 , which are respectively disposed in the two heating holes G of the heating body 200 adjacent to the air inlet joint 500 , but not limited to this. The heating element 400 can be a metal rod, such as a copper rod, or can be a metal wire such as copper wire or steel wire. The heating element 400 can be heated to rapidly conduct thermal energy to the heating body 200 having high thermal conductivity and the nozzle portion 220 extending from the heating body 200 . In this embodiment, the air inlet joint 500 , the exhaust joint 600 and the heating element 400 mentioned above are all locked on the top side of the heating main body 200 and protruding into the heating main body 200 to exert their respective functions. But it doesn't stop there. Similarly, a temperature sensor (not shown) extending into the through hole T can be installed to monitor the temperature of the high-temperature airflow.

As shown in FIG. 7 and FIG. 9 , when the air inlet joint 500 introduces air into the first air passage P1, the heating element 400 can be heated at the same time, and the air flowing through the first air passage P1 can be heated by the heating body 200 to generate a high-temperature airflow. The air flow can flow through the through hole T to the air jet flow channel T1 of the nozzle part 220 , and then be ejected from the plurality of branch flow channels 232 of the flow divider 230 to heat the solder joints 33 . The pressure of the mold cavity 20 will increase when it continuously receives the high-temperature air flow, and the air in the mold cavity 20 can flow back to the second air passage P2 in the heating body 200 through the gap C, and finally be discharged to the heating body 200 through the exhaust joint 600, so as to achieve Circulation of hot and cold air convection. In order to further improve the heat conduction efficiency of the heating body 200 , the first air passage P1 may include a main air passage P11 directly connected to the intake joint 500 , and a branch air passage P12 connected between the main air passage P11 and the through hole T. The bronchi P12 can be bent to increase the heated area. Both the main airway P11 and the branch airway P12 may be provided with heat-conducting members (not shown), such as metal with a spiral structure or a spring structure, or other high heat-conducting materials, which are fastened to the top side of the heating body 200 and protrude.

As shown in FIG. 5 and FIG. 7 to FIG. 9 , in one embodiment, the heat insulating housing 100 and the heat insulating member 300 may both be cylindrical bodies made of heat insulating material, so as to keep the heat energy in the heating body 200 and the nozzle portion 220. The heat insulating shell 100 can be tightly fitted outside the heating body 200 , and the bottom of the heat insulating shell 100 can be provided with a supporting platform 101 to support the heating body 200 , and the fixing platform 110 can have a recess corresponding to the configuration of the supporting platform 101 . 111. The heating device 10 for welding of the present invention may further include a plurality of fasteners 700 . In FIG. 8 , a part of the fasteners 700 pass through the heating main body 200 and the support table 101 of the heat insulating housing 100 from the top side of the heating main body 200 , And locked in the concave portion 111 of the fixing table 110 . In FIG. 7 , a part of the locking member 700 passes through the heat insulating member from the bottom of the heat insulating member 300 and is locked to the concave portion 111 of the fixing table 110 . In addition, the fixing table 110 can be fixed to a moving mechanism (not shown) such as a lift table, so that the heating device 10 for welding can be moved as a whole.

It is worth noting that, the heating device and heating assembly for welding of the present invention are to concentrate heat energy in a limited area in the mold cavity for welding, which is different from the technology of heating the entire mold cavity, such as the applicant's announcement Although the heating mechanism of the heating module disclosed in the new patent No. M601900 is slightly similar to the heating device used for welding of the present invention, the purpose of the new patent No. M601900 is to heat the entire mold cavity quickly and uniformly. to thermoform printed circuit boards. Therefore, on the basis of the prior art such as the new patent No. M601000, there is no motivation to consider the following patentable scope of the present invention.

The present invention has been disclosed above with preferred embodiments, but those skilled in the art should understand that the embodiments are only used to describe the present invention, and should not be construed as limiting the scope of the present invention. It should be noted that all changes and substitutions equivalent to this embodiment should be considered to be included within the scope of the present invention. Therefore, the protection scope of the present invention should be defined by the scope of the patent application.

10: Heating device for welding

100: Insulated shell

110: Fixed table

200: Heating the main body

220: Nozzle part

230: Diverter

300: Thermal insulation

400: heating element

500: Intake connector

600: Exhaust joint

Claims (8)

A heating element for soldering, suitable for heating a plurality of solder contacts on a circuit board, the heating element comprises a heating device and a mold cavity: wherein the heating device comprises: a heating body, suitable for generating a circuit that can make the circuit The solder joints on the board reach a high-temperature airflow at a soldering temperature; a nozzle part is disposed on a bottom of the heating body, and the nozzle part has a jet flow channel that communicates with the heating body to circulate the high-temperature airflow; And a splitting piece, including a splitting body assembled in the jetting flow channel of the nozzle portion, the splitting body has a plurality of splitting flow channels, each of the splitting channels has an inlet and an outlet, the inlet is facing the inside of the jetting flow channel, the The outlet is adapted to be close to at least one of the solder joints of the circuit board, so that the solder joints are heated by the high-temperature airflow to reach the soldering temperature, wherein the jet flow channel has an end, and the flow divider There is a depth distance between the bottom of the shunt body and the end; wherein the cavity is arranged below the nozzle portion and is used to accommodate an electronic component, the electronic component includes the circuit board and an electronic component mounted on the circuit board After the solder joints reach the soldering temperature and cool down, the electronic component is electrically connected to the circuit board. The heating assembly for welding according to claim 1, wherein the shunt further comprises an abutting portion, the abutting portion protrudes from the shunt body and is suitable for abutting against the circuit board, and the shunt channels are around the abutting portion. The heating element for welding according to claim 1, wherein the number of the runners corresponds to the number of the solder joints, and the runners are located above the solder joints, respectively. The heating assembly for welding as claimed in claim 1, wherein the inside of the heating body has a first air passage, a second air passage and a through hole, and the through hole communicates with the air jet flow passage of the nozzle portion and the first air passage. an air channel, and the heating device for welding further comprises at least one heating element assembled on the heating body. The heating assembly for welding according to claim 4, wherein the heating body has at least one heating hole adjacent to the first air passage, and the at least one heating element is disposed in the at least one heating hole. The heating assembly for welding as claimed in claim 4, further comprising an air inlet joint and an exhaust joint, the air inlet joint and the exhaust joint are arranged on a top side opposite to the nozzle portion, the air inlet joint The joint is communicated with the first air passage, and the exhaust joint is communicated with the second air passage. The heating assembly for welding as claimed in claim 4, further comprising a heat insulating housing, a heat insulating member and a fixing table, the heat insulating housing covering the heating main body, the heat insulating member covering the nozzle portion and located at Below the heat insulating housing, the fixing table is disposed between the heat insulating housing and the heat insulating member for fixing the heat insulating housing, the heat insulating member and the heating body. The heating assembly for welding according to claim 4, wherein a gap is formed between the heat insulating member and the nozzle portion, and the gap is communicated with the second air passage.

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