TWM615551U - Layered structure of Bakelite phenolic waste and fiber board - Google Patents

Abstract

A layered structure of bakelite phenolic waste and fiber boards is formed by interlacing bakelite phenolic materials and fiber boards to form a multi-layer composite board, which can make the whole board have higher structural strength. The bakelite phenolic material is formed by mixing phenolic waste powder (that is, bakelite waste), fiber material powder (waste fiber is preferable), and resin, and has a uniform structure and a relatively high strength. The fiber board may have perforations to connect the bakelite phenolic material of the upper and lower layers to achieve better strength. This case can make up for the traditionally used waste bakelite waste or waste fiber as the main structure, the structure is easy to be unevenly distributed or insufficient strength. It can be applied to the printed circuit board industry and the copper foil substrate industry. Board, as a new type of environmentally friendly bakelite, board for decoration and construction, board for furniture, or for external wall insulation.

Description

Layered structure of Bakelite phenolic waste and fiber board

The present invention relates to the reuse of phenolic waste materials, especially a layered structure of bakelite phenolic waste materials and fiber boards. It can effectively reuse phenolic waste materials and at the same time reuse other types of fiber waste materials to achieve the goal of recycling.

For thermosetting plastic products, there are almost only two final disposal methods: burying and incineration. Numerous manufacturers expect that while selling phenolic boards, they can also recycle phenolic boards (commonly known as bakelite boards) after use. Because phenolic bakelite is a thermosetting engineering plastic. Its characteristic is that the incineration temperature is high, and its high calorific value can easily cause the destruction of the incinerator body, exceeding the designed calorific value of the incinerator. And it reduces the willingness of cleaners to collect such waste into most incinerators for final treatment.

Phenolic board (commonly known as bakelite board), raw materials are phenols and aldehydes. After polymerization, it is made into phenolic resin. It is formed by impregnating phenolic resin, drying and hot pressing with paper or cloth as a carrier. The thermosetting plastic. Phenolic materials (phenolic board or bakelite board) are widely used in the printed circuit board industry as a protective sheet for the upper and lower pads in the drilling and molding process. Phenolic materials (phenolic board or bakelite) are also widely used in insulation and heat insulation industries.

Generally, after drilling, molding, or powder, edge material and other types of bakelite waste (or phenolic resin type waste) after use, the original geometric shape that can be used has been destroyed, so it is directly The use of the method to achieve the benefit of reuse is not big. In order to effectively increase the availability of the final stage, the above-mentioned bakelite waste material is crushed and ground to refine the powder to form bakelite powder. Because the original resin occupies most of the fiber holes under the microscopic view, the subsequent resin is directly added. , Regardless of whether it is pressed or not, its combination is very weak. It is easy to form giant cracks under slight force or even in the process of gluing, which directly restricts the way the end can be reused.

Since the above-mentioned products are prone to form cracks, holes, or insufficient strength when they are reshaped, obvious product defects such as cracks, holes, or insufficient strength, and the deforestation based on the demand of the global wood industry will reduce the carbon dioxide capture, so this new model hopes to propose a waste Phenolic waste (bakelite waste) can be reused to recycle the recycled phenolic engineering plastic waste, especially the waste phenolic board after drilling, such as bakelite, bakelite, and bakelite. At the same time, it is used in combination with other fiber boards discarded after drilling. A new type of material can be formed through a new and easy-to-use reuse method, which can obtain a variety of benefits, which is different from traditional incineration and burying. Final treatment of environmental engineering. In order to widely increase the characteristics of waste fiber recycling and reuse, and achieve the goal of circular economy and the concept of environmental sustainability.

Therefore, the purpose of the present invention is to solve the above-mentioned conventional technical problems. The present invention proposes a layered structure of bakelite phenolic waste and fiber board, which is to form a multi-layer composite board by interlacing bakelite phenolic material and fiber board. Make the whole board have higher structural strength. The bakelite phenolic material is formed by mixing phenolic waste powder (that is, bakelite waste), fiber material powder (waste fiber is preferable), and resin, and has a uniform structure and a relatively high strength. The fiber board may have perforations to connect the bakelite phenolic material of the upper and lower layers to achieve better strength. In this case, acid or alkali can also be added in the process of bakelite phenolic material, so that phenolic waste (or bakelite waste) can be further Destruction treatment. After the original phenolic waste material is eroded, the number of holes increases and it has the effect of dissolving fibers. Additional fiber materials can be added to make the bakelite phenolic material structure more uniform.

In order to achieve the above objective, this new model proposes a layered structure of bakelite phenolic waste and fiber board, which is a flat structure with a specific thickness and a specific geometric shape. The flat structure includes a plurality of bakelite phenolic material layers. Wherein the bakelite phenolic material layer is made of waste phenolic polymer material, wood fiber and resin; in the bakelite phenolic material layer, the powder of the bakelite phenolic material layer of the waste phenolic polymer material and the wood fiber The weight ratio of powder mixing is in the range of 0.01 to 0.99, and the weight ratio of the resin of the bakelite phenolic material layer is greater than 0.01; and a plurality of fiber sheet layers; wherein the plurality of bakelite phenolic material layers and the plurality of fiber sheets The layers are overlapped in order.

The features and advantages of the present invention can be further understood from the following description. Please refer to the accompanying drawings when reading.

1: Flat structure

10: Bakelite phenolic material layer

11: Bakelite phenolic material agglomerates

20: Fibre board layer

21: Piercing

30: Bakelite phenolic material mixture

40: Fibre board

41: Piercing

Figure 1 shows a schematic diagram of the flat panel structure of this case.

Fig. 2 shows a schematic cross-sectional view taken along the A-A' direction of Fig. 1.

Fig. 3 shows an exploded schematic diagram of the components of Fig. 1.

Figure 4 shows a schematic diagram of another form of the flat panel structure of this case.

Figure 5 shows a schematic diagram of another form of the flat panel structure of this case.

Fig. 6 shows a schematic diagram of another type of the flat panel structure of this case.

Fig. 7 shows a schematic diagram of another type of the flat panel structure of this case.

Figure 8 shows a flow chart of the manufacturing method of this case.

Figure 9 shows a schematic diagram of the manufacturing method of this case in the mold forming.

Figure 10 shows another schematic diagram of the manufacturing method of this case in the mold forming.

With regard to the structural composition of this case, and the effects and advantages that can be produced, in conjunction with the drawings, a preferred embodiment of this case is described in detail as follows.

The layered structure of Bakelite phenolic waste and fiber board in this case is a flat plate structure 1 with a specific thickness, which has a specific geometric shape, which can be rectangular or square (as shown in Figure 4), round Polygons of various shapes, such as a shape (as shown in Figure 5), a rhombus (as shown in Figure 6), and a triangle (as shown in Figure 7). As shown in Figure 1, the flat structure 1 of this case includes:

A plurality of bakelite phenolic material layers 10.

Multiple fiber board layers 20; wherein the fiber board layer 20 can be environmental protection board, bakelite board, melamine board, Meina board, wood fiber board, wood pulp board, urea board, etc.

The plurality of bakelite phenolic material layers 10 and the plurality of fiber board layers 20 are sequentially and cross-stacked.

As shown in Figures 2 and 3, the fiber sheet layer 20 forms at least one perforation 21, the perforation 21 is filled with bakelite phenolic material agglomerates 11, and the bakelite phenolic material agglomerates 11 connect the upper and lower layers of the bakelite The phenolic material layer 10 makes the flat structure 1 stronger.

The bakelite phenolic material layer 10 and the bakelite phenolic material agglomerates 11 are all mixed with waste phenolic polymer materials, wood fibers and resin.

Wherein in the bakelite phenolic material layer 10 and the bakelite phenolic material agglomerate 11, the weight ratio of the waste phenolic polymer material powder and the wood fiber powder is in the range of 0.01 to 0.99, and the weight ratio of the resin Greater than 0.01.

Wherein, the bakelite phenolic material layer 10 and the bakelite phenolic material agglomerates 11 may still contain a bridging agent.

Under the structure of this case, different pressures can be applied to the overall structure during mold forming to obtain different hardness. Therefore, the plates of this case can be made into various plates with practical purposes. Can be used in the printed circuit board industry, the copper foil substrate industry used in the process of drilling lower backing board, upper cover board, desktop board, cutting backing board, or including but not limited to the general use of bakelite , Such as fixtures, jigs, heat insulation materials, insulation materials, and is applied as a new type of environmental protection bakelite. It can also include, but is not limited to, panels that are used as decoration and construction, such as plywood, plywood, wood core board, chipboard, Meinair board, fiberboard, foam board, floor, etc.; or furniture board; or External wall insulation and other purposes are regarded as new phenolic bakelite materials or recycled wood or materials. Or recycled materials after molding through general plastic manufacturing processes such as molds, fixtures, injection, and extrusion. In addition, the characteristic of this recycled material is that it can be reproduced and recycled continuously through the above-mentioned process. This effectively reduces the environmental load and increases the life of incinerators and landfills.

Figure 8 shows the manufacturing method of this case, including the following steps:

Step 100: The waste phenolic polymer material is crushed and powdered to form a powder. The particle size of the waste phenolic polymer material powder may preferably be a particle size that passes through the range of 1 to 200 mesh through a sieve, or it may be a combination of specific ratios in the above range.

Among them, the waste phenolic polymer material is bakelite waste, which can be taken from the phenolic top cover, bottom pad, desktop board used in the mechanical drilling process of the printed circuit board manufacturing industry, or used in the cutting process of the copper foil substrate industry The cutting protection pad. However, the waste phenolic polymer material is not limited to the source of the above-mentioned phenolic type waste. It is mainly used for the recycling of phenolic polymer materials after industrial treatment.

Step 110: The wood fiber (that is, the waste wood pulp board material after the drilling process of the printed circuit board) is crushed and powdered to form a powder. The particle size of the wood fiber powder can preferably be a particle size that passes through the range of 1 to 200 mesh through a sieve, or it can be a combination of specific ratios in the above range.

The wood fiber can be a backing board, discarded wood pulp board, environmental protection board, or other types of fiber board used in the mechanical drilling process of the printed circuit board manufacturing industry. The wood fiber can also be used in the decoration industry, business Panels used by Jianye, wood industry, and furniture industry, such as discarded plywood, plywood, wood core board, chipboard, Meinair board, fiberboard, etc., but not limited to waste sources, and can be fresh Fiber sources, such as wood flour, sawdust, or agricultural waste, such as rice straw, bagasse. But it does not limit all the wood fiber sources mentioned above. A more appropriate source of wood fiber is waste wood pulp board or environmental protection board after mechanical drilling process, or fresh wood flour.

Step 120: then mix the waste phenolic polymer material powder with the wood fiber powder. The weight ratio of the two mixtures can be in the range of 0.01 to 0.99 (that is, the range of the waste phenolic polymer material powder/the wood fiber powder is between 0.01 and 0.99), but it is not completely limited to this range.

Step 130: Then add an appropriate amount of resin, and use a homogenizer to uniformly mix the waste phenolic polymer powder, the wood fiber powder, and the resin to obtain a Bakelite phenolic material mixture 30. The resin is mainly used to bond the waste phenolic polymer material powder and the wood fiber powder. The higher the proportion of the resin, the better the degree of adhesion. For example, 1kg of waste phenolic polymer powder is mixed with 1kg of wood fiber powder and then 1kg of resin is added.

Among them, the resin can be solid or liquid resin, preferably solid. The resin can be phenolic resin, urea-formaldehyde resin, epoxy resin, acrylic resin, polyester resin, melamine resin and other resin types, or a mixture thereof. Among them, the resin is preferably a phenolic resin. When the resin is a phenolic resin, the molar ratio (F/P ratio) of formaldehyde to phenol in the phenolic resin is preferably in the range of 0.1:1 to 3.0:1. More specifically, a solid phenolic resin with a molar ratio of formaldehyde to phenol ranging from 0.1:1 to 1.0:1 is preferred. Or a liquid phenolic resin with a molar ratio of formaldehyde to phenol between 1.0:1 and 3.0:1 is preferred. Or a mixture of the aforementioned two types of resins or states in any combination ratio.

After the resin is added in step 130, a bridging agent can be further added to form a three-dimensional stand 体结构。 Body structure.

Step 140: The bakelite phenolic material mixture 30 and the fiber board 40 are sequentially staggered and placed in the mold 2 as shown in FIG. 9. Then apply one of hot pressing, cold pressing or foaming to make the bakelite phenolic material mixture 30 form the bakelite phenolic material layer 10, and the fiber board 40 forms the fiber board layer 20 to obtain the bakelite phenolic material layer A flat structure 1 in which 10 and the fiber sheet layer 20 are overlapped in a staggered manner.

Among them, the fiber board can be environmental protection board, bakelite board, melamine board, Meina board, wood fiber board, wood pulp board, urea board and so on.

Therefore, the application of different molds in this case can make the flat structure 1 have different fixed geometric appearances, such as rectangles, squares, circles, rhombuses, triangles, and other polygons with different shapes.

Wherein in step 140, a perforation 41 may be formed in the fiber board 40, so that the bakelite phenolic material mixture 30 can be filled into the perforation 41 to form bakelite phenolic material agglomerates 11 to connect the upper and lower layers of the bakelite phenolic material. The material layer 10 is shown in FIG. 10.

However, the production process of forming the flat panel structure 1 in the above step 140 is not intended to limit the scope of the present case. For example, after applying appropriate pressure, the flat plate structure 1 can be cured by hot pressing at an appropriate temperature for a period of time. Preferably, the surface hardness (Shore D hardness) of the flat structure 1 is between 60 and 92. Generally, the pressure is in the range of 0.01kg/cm2 to 300kg/cm2, and the temperature is higher than room temperature. The longer the hot pressing time, the harder the obtained flat structure 1 is.

In step 100, the waste phenolic polymer material can be immersed in an acid or alkaline solution after being crushed and powdered, so that the surface of the waste phenolic polymer material is corroded or cracked into finer powder. The purpose is to increase the coagulation force combined with the resin in the subsequent steps. Wherein the acidic or alkaline solution includes, but is not limited to, strong acid, strong base, weak acid, weak base and other water The solution may be, but is not limited to, an acid-base aqueous solution such as hydrochloric acid, sulfuric acid, hydrofluoric acid, nitric acid, aqua regia, sodium hydroxide aqueous solution, potassium hydroxide aqueous solution, calcium hydroxide aqueous solution, magnesium hydroxide aqueous solution, and the like. The weight concentration of the acidic or alkaline solution is in the range of 0.1% to 99% aqueous solution. In this case, the above-mentioned soaking procedure can be carried out as needed, or not soaked.

For example, the powder of the waste phenolic polymer material is immersed in an appropriate amount of strong alkali sodium hydroxide solution (concentration of 10%, w/w), and the strong alkali sodium hydroxide solution floods the powder surface of the waste phenolic polymer material to Perform surface destruction. After 2 days, the strong alkali sodium hydroxide solution was leaked out, and the waste phenolic polymer material powder was washed with water to a pH range of 7-9, and then dried at a temperature of 100°C.

The advantage of this case is that the bakelite phenolic material and the fiber board are alternately stacked to form a multi-layer composite board, which can make the entire board have a higher structural strength. The bakelite phenolic material is formed by mixing phenolic waste powder (that is, bakelite waste), fiber material powder (waste fiber is preferable), and resin, and has a uniform structure and a relatively high strength. The fiber board may have perforations to connect the bakelite phenolic material of the upper and lower layers to achieve better strength.

In summary, the humanized and considerate design of this case is quite in line with actual needs. Compared with the conventional technology, the specific improvement of the existing defects is obviously a breakthrough advantage, and it does have an increase in efficacy, and it is not easy to achieve. This case has not been disclosed or disclosed in domestic and foreign documents and markets, and it has complied with the provisions of the Patent Law.

The above detailed description is a specific description of a feasible embodiment of the present model, but the embodiment is not intended to limit the scope of the patent of the present model. Any equivalent implementation or modification that does not deviate from the technical spirit of the present model shall be included in In the scope of the patent in this case.

1: Flat structure

10: Bakelite phenolic material layer

20: Fibre board layer

Claims (12)

A layered structure of bakelite phenolic waste and fiber board is a flat structure with a specific thickness and a specific geometric appearance. The flat structure includes: A plurality of bakelite phenolic material layers; wherein the bakelite phenolic material layer is formed by mixing waste phenolic polymer materials, wood fibers and resin; in the bakelite phenolic material layer, the waste phenolic polymer material of the bakelite phenolic material layer The mixing weight ratio of the powder and the wood fiber powder is in the range of 0.01 to 0.99, and the weight ratio of the resin of the bakelite phenolic material layer is greater than 0.01; and A plurality of fiber sheet layers; wherein the plurality of bakelite phenolic material layers and the plurality of fiber sheet layers are sequentially cross-overlaid. The layered structure of bakelite phenolic waste and fiber board as described in item 1 of the scope of patent application, wherein the fiber board layer forms at least one perforation, the perforation is filled with bakelite phenolic material agglomerates, and the bakelite phenolic material agglomerates Blocks connect the upper and lower layers of the bakelite phenolic material layer; wherein the bakelite phenolic material is agglomerated by waste phenolic polymer materials, wood fibers and resin; wherein in the bakelite phenolic material agglomerates, the bakelite phenolic material The weight ratio of the agglomerated waste phenolic polymer material powder and the wood fiber powder is in the range of 0.01 to 0.99, and the weight ratio of the resin agglomerated by the bakelite phenolic material is greater than 0.01. The layered structure of bakelite phenolic waste and fiber board as described in item 1 of the scope of patent application, wherein the fiber board layer is selected from environmental protection board, bakelite board, melamine board, Meina board, wood fiber board, wood pulp board, Urea board. The layered structure of Bakelite phenolic waste and fiber board as described in item 1 of the scope of patent application, wherein the shape of the flat structure is selected from the group consisting of rectangle, square, circle, rhombus, and triangle. Such as the layered structure of Bakelite phenolic waste and fiber board described in item 2 of the scope of patent application, Wherein, the bakelite phenolic material layer and the bakelite phenolic material agglomerates further contain a bridging agent. For example, the layered structure of bakelite phenolic waste and fiber board as described in item 1 or 5 of the scope of patent application, wherein the waste phenolic polymer material of the bakelite phenolic material layer is crushed and powdered to form a powder, and the electrical The wood fiber of the wood phenolic material layer is crushed and powdered to form a powder, and the waste phenolic polymer material powder and the wood fiber powder are mixed, and resin is added to the bakelite phenolic material layer. The powder of waste phenolic polymer material, the powder of wood fiber and the resin are uniformly mixed to form a bakelite phenolic material mixture, wherein the resin of the bakelite phenolic material layer is used for bonding the waste phenolic polymer of the bakelite phenolic material layer The powder of the material and the powder of the wood fiber; the bakelite phenolic material mixture and the fiber board are sequentially interlaced and laid in the mold, and the bakelite phenolic material mixture is formed by one of hot pressing, cold pressing or foaming The bakelite phenolic material layer, and the fiber board forms the fiber board layer to form the flat structure in which the bakelite phenolic material layer and the fiber board layer are alternately stacked. The layered structure of Bakelite phenolic waste and fiber board as described in item 6 of the scope of patent application, wherein the waste phenolic polymer material is crushed and powdered, and then immersed in an acid or alkaline solution to make the waste phenolic material The surface of the polymer material is eroded or cracked into finer powder. For example, the layered structure of Bakelite phenolic waste and fiber board as described in item 6 of the scope of patent application, where the flat structure is formed by applying pressure in a mold and then hot pressing at a proper temperature for a period of time. The flat structure is formed by curing; the pressure is in the range of 0.01 kg/cm2 to 300 kg/cm2, and the temperature is greater than room temperature; the longer the hot pressing time is, the harder the flat structure is. The layered structure of Bakelite phenolic waste and fiber board as described in item 7 of the scope of patent application, wherein the acidic or alkaline solution is selected from hydrochloric acid, sulfuric acid, hydrofluoric acid, nitric acid, aqua regia, sodium hydroxide aqueous solution, hydrogen Potassium oxide aqueous solution, calcium hydroxide aqueous solution, magnesium hydroxide aqueous solution and other acid and alkali water soluble liquid. The layered structure of Bakelite phenolic waste and fiber board as described in item 1 or 2 of the scope of patent application, wherein the waste phenolic polymer material is selected from Bakelite waste, phenolic used in the mechanical drilling process of the printed circuit board manufacturing industry Cover plate, bottom plate, desktop plate, or copper foil substrate industry used in the cutting process of cutting protection pad. The layered structure of bakelite phenolic waste and fiber board as described in item 1 or 2 of the scope of patent application, wherein the wood fiber is selected from the backing board and waste wood pulp used in the mechanical drilling process of the printed circuit board manufacturing industry Board, environmental protection board, or decoration or furniture board, or fresh fiber source, wood flour, wood chips, or agricultural waste; when the wood fiber is agricultural waste, it is selected from rice straw and bagasse. The layered structure of bakelite phenolic waste and fiber board as described in item 1 or 2 of the scope of patent application, wherein the resin of the bakelite phenolic material layer is selected from phenolic resin, urea-formaldehyde resin, epoxy resin, acrylic Resin, polyester resin, melamine resin, or a mixture of the foregoing resins.

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