TWM611086U - Eco-friendly lightweight Bakelite phenolic structure made by recycling and reusing phenolic waste material - Google Patents

Eco-friendly lightweight Bakelite phenolic structure made by recycling and reusing phenolic waste material Download PDF

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TWM611086U
TWM611086U TW109210267U TW109210267U TWM611086U TW M611086 U TWM611086 U TW M611086U TW 109210267 U TW109210267 U TW 109210267U TW 109210267 U TW109210267 U TW 109210267U TW M611086 U TWM611086 U TW M611086U
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phenolic
waste
powder
bakelite
hot pressing
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蘇峙銘
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蘇峙銘
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一種回收並再利用酚醛類型廢料所製造之環保輕質電木酚醛結構,係為一具有特定幾何外型的平板結構,該環保輕質電木酚醛結構為一厚度的平板,其具有固定的幾何外型,該外型選自矩形、方形、圓形、菱形、三角形等各種不同形狀的多邊形;該環保輕質電木酚醛結構是應用廢棄酚醛聚合材料、木纖維、多孔性材料及樹脂經過混合而成的平板結構。其中多孔性材料可使得整體材質密度降低,因此重量較輕,並具有防火及防水功能。本案可以應用在裝潢營建用板材、家具用板材、或為外牆保溫等用途、或應用在印刷電路板業、銅箔基板業製程中所使用之板材、或應用在電木一般使用之方式,而作為新型的環保電木板或環保木材。本案之再生材料可持續重複性再製與循環利用,有效降低環境負荷,增加焚化爐、掩埋廠之壽命。 An environmentally friendly lightweight bakelite phenolic structure manufactured by recycling and reusing phenolic waste materials is a flat plate structure with a specific geometric appearance. The environmentally friendly lightweight bakelite phenolic structure is a thick flat plate with a fixed geometry Shape, the shape is selected from various shapes of polygons such as rectangles, squares, circles, diamonds, triangles, etc.; the environmentally friendly light-weight bakelite phenolic structure is the use of waste phenolic polymer materials, wood fibers, porous materials and resins after mixing The flat structure is made. Among them, the porous material can reduce the density of the overall material, so the weight is lighter, and it has fireproof and waterproof functions. This case can be applied to panels for decoration and construction, panels for furniture, or for external wall insulation, or panels used in the printed circuit board industry and copper foil substrate industry, or in the general use of bakelite. And as a new type of environmentally friendly bakelite or environmentally friendly wood. The recycled materials in this case can be reproduced and recycled continuously, effectively reducing the environmental load and increasing the life of incinerators and landfills.

Description

回收並再利用酚醛類型廢料所製造之環保輕質電木酚醛結構 Environmentally friendly lightweight Bakelite phenolic structure made by recycling and reusing phenolic waste materials

本新型係有關於酚醛類型廢料之再利用,尤其是一種回收並再利用酚醛類型廢料所製造之環保輕質電木酚醛結構。其能有效再利用酚醛類型廢料,並同時再利用其他類型纖維廢料及多孔性材料(如廢棄的活性碳或經發泡後的輕質材料),以達循環利用之目標。 This new model relates to the reuse of phenolic waste, especially an environmentally friendly lightweight bakelite phenolic structure made by recycling and reusing phenolic waste. It can effectively reuse phenolic waste, and at the same time reuse other types of fiber waste and porous materials (such as waste activated carbon or foamed lightweight materials) to achieve the goal of recycling.

以環境工程角度,廢棄物是放錯地方的資源。如何以適當的方式將資源透過循環再利用,再製做成可用、堪用的產品是非常困難的。尤其是熱固性塑膠製品。幾乎只有掩埋與焚燒兩種最終處理的方式。不勝枚舉的廠商,期望廠商在販售酚醛板材的同時,能將酚醛板(俗稱電木板)在使用過後進行回收再利用。由於酚醛類電木板是熱固性工程塑膠。其特性為焚燒溫度高,其熱值過高的特性極易造成焚化爐爐體的破壞,超過焚化爐所設計的熱值。而降低清運業者收取此類廢棄物進入多數焚化爐進入最終處理的意願。 From an environmental engineering perspective, waste is a misplaced resource. It is very difficult to recycle resources in an appropriate way and reproduce them into usable and usable products. Especially thermosetting plastic products. There are almost only two final disposal methods: burying and incineration. Numerous manufacturers expect that while selling phenolic boards, they can also recycle phenolic boards (commonly known as bakelite boards) after use. Because phenolic bakelite is a thermosetting engineering plastic. Its characteristic is that the incineration temperature is high, and its high calorific value can easily cause the destruction of the incinerator body, exceeding the designed calorific value of the incinerator. And it reduces the willingness of cleaners to collect such waste into most incinerators for final treatment.

酚醛板(俗稱電木板),原料為酚類與醛類,經聚合反應後製成酚醛樹脂,以紙類或布類為載體,經含浸酚醛樹脂、烘乾乾燥、熱壓成型後,所形成之熱固性塑膠。酚醛材料(酚醛板或電木板)廣泛被應用於印刷電路板業,作為鑽孔及成型製程內,保護產品時在上下墊用作保護板材。墊板 類型之使用方式的電木板,經機械性鑽孔後,其實仍符合原材質特性,只是幾何立體形狀經鑽孔、成型等印刷電路板製程後而改變,其材料本身並未改變。酚醛材料(酚醛板或電木板)亦被廣泛應用於絕緣、隔熱等產業。 Phenolic board (commonly known as bakelite board), raw materials are phenols and aldehydes. After polymerization, it is made into phenolic resin. It is formed by impregnating phenolic resin, drying and hot pressing with paper or cloth as a carrier. The thermosetting plastic. Phenolic materials (phenolic board or bakelite board) are widely used in the printed circuit board industry as a protection board for the upper and lower pads in the drilling and molding process. Pad The type of use of bakelite boards, after being mechanically drilled, still conforms to the original material characteristics, but the geometric three-dimensional shape is changed after the printed circuit board manufacturing process such as drilling and molding, and the material itself has not changed. Phenolic materials (phenolic board or bakelite) are also widely used in insulation and heat insulation industries.

一般經使用過後的鑽孔、成型、或粉料、邊料等型式的電木廢料(或酚醛樹脂類型之廢料),由於原有可被應用的幾何形狀已被破壞,故以直接使用之方式達到再利用的效益不大。為了有效增加末段可利用性,前述電木廢料如經過粉碎、研磨等過程,將粉末細緻化後,形成的電木粉末,由於微觀下原先樹脂佔據大部份纖維孔洞,導致後續直接添加樹脂,不論是否進行壓合,其結合性十分薄弱。容易在受輕微施力甚至在膠黏過程中形成巨型裂縫裂痕,直接限制了末端再利用的方式。 Generally used after drilling, molding, or powder, edge material and other types of bakelite waste (or phenolic resin type waste), because the original geometric shape that can be used has been destroyed, it is used directly There is little benefit to reuse. In order to effectively increase the availability of the final stage, the above-mentioned bakelite waste material is crushed and ground to refine the powder to form bakelite powder. Because the original resin occupies most of the fiber holes under the microscopic view, the subsequent resin is directly added. , Whether it is pressed or not, its combination is very weak. It is easy to form giant cracks under slight force or even in the process of gluing, which directly restricts the way in which the end can be reused.

由於上述產品在重新塑形時,容易形成裂紋、孔洞、或強度不足等明顯之產品缺陷,以及基於全球木業的需求而砍伐林地導致二氧化碳捕捉量降低的情況,因此本新型希望提出一種將廢棄酚醛類型廢料(電木廢料)再利用的方式,可將回收後之酚醛類工程塑膠型廢棄物,尤其是鑽孔後的廢棄酚醛板材,如電木板、電木條、電木鑽孔時生成的粉屑等,同時與其他鑽孔後廢棄的纖維板材搭配使用,藉由一種新型且能簡易施作的再利用方式形成一種新型的材料,可獲得多種效益,有別於傳統焚燒、掩埋之環境工程最終處理法。以廣泛增加廢棄纖維循環再利用的特性,並達到循環經濟的目標及環境永續性的概念。 Since the above-mentioned products are prone to form cracks, holes, or insufficient strength when they are reshaped, obvious product defects such as cracks, holes, or insufficient strength, and the deforestation based on the demand of the global wood industry will reduce the carbon dioxide capture, so this new model hopes to propose a waste Phenolic waste (bakelite waste) can be reused to recycle the recycled phenolic engineering plastic waste, especially the waste phenolic board after drilling, such as bakelite, bakelite, and bakelite. At the same time, it is used in combination with other fiber boards discarded after drilling. A new type of material can be formed through a new and easy-to-use reuse method, which can obtain a variety of benefits, which is different from traditional incineration and burying. Final treatment of environmental engineering. In order to widely increase the characteristics of waste fiber recycling and reuse, and achieve the goal of circular economy and the concept of environmental sustainability.

所以本新型的目的係為解決上述習知技術上的問題,本新型提出一種回收並再利用酚醛類型廢料所製造之環保輕質電木酚醛結構,係將酚醛類 型廢料(即為電木廢料)、木纖維類材質(廢棄纖維為佳)與多孔性材料(如廢棄的活性碳或經發泡後的輕質材料)均經適度破碎及研磨至特定顆粒大小後,以特定粉末混合比例,進行共混合均勻,輔以樹脂的添加,以特定樹脂混合比例,補足單以廢棄電木廢料作為新成品主要原料時,容易在加入新樹脂後,產生分配不均、結構不強、且密度過高重量過重所造成的多種缺陷問題。其中多孔性材料可使得整體材質密度降低,因此重量較輕,並具有防火及防水功能。也可避開單以廢棄纖維為主要結構時,產品強度不足的情形。再續以傳統塑膠材料之製程方式,製成最終環保電木酚醛材料成品。 Therefore, the purpose of the present invention is to solve the above-mentioned conventional technical problems. The present invention proposes an environmentally friendly light-weight Bakelite phenolic structure manufactured by recycling and reusing phenolic waste materials. Type waste (that is, bakelite waste), wood fiber materials (waste fiber is better) and porous materials (such as waste activated carbon or foamed lightweight materials) are appropriately crushed and ground to a specific particle size Then, use a specific powder mixing ratio to mix uniformly, supplemented by the addition of resin, use a specific resin mixing ratio, and make up the waste bakelite waste as the main raw material of the new product. It is easy to cause uneven distribution after adding new resin. , The structure is not strong, and the density is too high and the weight is too heavy. Among them, the porous material can reduce the density of the overall material, so the weight is lighter, and it has fireproof and waterproof functions. It can also avoid the insufficient strength of the product when the waste fiber is the main structure. Then, the traditional plastic material manufacturing method is used to produce the final environmentally friendly bakelite phenolic material.

本案也可以將前述酚醛類型廢料(或為電木廢料)、木纖維類材質與多孔性材料(如廢棄的活性碳或經發泡後的輕質材料),經適度破碎及研磨至特定顆粒大小後,以特定混合比例,可加入酸或鹼,讓酚醛類型廢料(或為電木廢料)被進一步破壞處理。使原有酚醛類型廢料被侵蝕後,孔洞數增加及具解纖維效果。可再額外添加前述纖維類材質與多孔性材料,而使樹脂結合性不佳與不均勻之問題導致之裂痕獲得改善。並在混合均勻後,以特定樹脂混合比例加入新樹脂,續以傳統塑膠材料之製程方式,製成環保電木酚醛材料成品。 In this case, the aforementioned phenolic waste (or bakelite waste), wood fiber materials and porous materials (such as waste activated carbon or foamed lightweight materials) can also be appropriately crushed and ground to a specific particle size. Later, in a specific mixing ratio, acid or alkali can be added to allow phenolic waste (or bakelite waste) to be further destroyed. After the original phenolic waste is eroded, the number of holes is increased and the effect of fiber defibration is increased. The aforementioned fiber materials and porous materials can be additionally added to improve the cracks caused by poor resin bonding and unevenness. After the mixing is uniform, new resin is added in a specific resin mixing ratio, and the traditional plastic material manufacturing process is continued to make an environmentally friendly bakelite phenolic material product.

該特定樹脂混合比例,指酚醛類型廢料(或為電木廢料)粉末、木纖維類材質(廢棄纖維為佳)粉末與多孔性材料粉末,三者粉末量之重量總和,與新添入樹脂重量之重量比,可為0.01至0.99範圍,但不完全僅限於此範圍。 The specific resin mixing ratio refers to the weight of phenolic waste (or bakelite waste) powder, wood fiber material (waste fiber is better) powder and porous material powder, the total weight of the three powders, and the weight of the newly added resin The weight ratio can be in the range of 0.01 to 0.99, but it is not completely limited to this range.

其中該樹脂的添加,可為防火樹脂、防水樹脂、且質量輕者。該樹脂 也可為酚醛樹脂、尿素甲醛樹脂、環氧樹脂、壓克力樹脂等樹脂類型。亦可為架橋劑。但不限定於前述樹脂或架橋劑類型或其混和物。可為固態樹脂或液態樹脂。其中前述樹脂又以酚醛樹脂為佳。 The addition of the resin can be fireproof resin, waterproof resin, and light weight. The resin It can also be phenolic resin, urea-formaldehyde resin, epoxy resin, acrylic resin and other resin types. It can also be a bridging agent. However, it is not limited to the aforementioned resins or bridging agent types or their mixtures. It can be solid resin or liquid resin. Among them, the aforementioned resin is preferably phenolic resin.

該傳統塑膠材料之製程方式,包括將研磨後之混合過篩粉料,進行固態樹脂的混合,或為研磨後之混合過篩粉料以液態樹脂浸泡、相分離、乾燥後,可輔以模具但不限定,再經批次式熱壓或冷壓成型,或為連續式熱壓或冷壓成型。若為熱壓或冷壓製程,其壓力可為0.001kg/cm2至300kg/cm2範圍。或經射出機射出材料,或經押出機押出材料。或經發泡作為發泡材料。可為但不僅限定為前述之塑膠生產工藝。 The traditional plastic material manufacturing process includes mixing the ground mixed and sieved powder with solid resin, or after the ground mixed sieved powder is soaked with liquid resin, phase separated, and dried, it can be supplemented with a mold But it is not limited, and then batch-type hot-pressing or cold-pressing, or continuous hot-pressing or cold-pressing. If it is hot or cold pressing process, the pressure may be in the range of 0.001kg / cm 2 to 300kg / cm 2. Either the material is injected by the injection machine, or the material is extruded by the extruder. Or foamed as a foaming material. It can be but not limited to the aforementioned plastic production process.

該環保電木酚醛材料成品,包括但不限定於被應用在印刷電路板業、銅箔基板業製程中所使用之鑽孔下墊板、上蓋板、桌面板、裁切墊板,或包括但不限定於被應用在電木一般使用之方式,如作為夾具、治具、隔熱材、絕緣材,而被應用成新型的環保電木板或環保木材。亦可包括但不限定於被應用在作為裝潢營建用板材,如合板、夾板、木心板、粒片板、美耐板、纖維板、發泡板、地板等;或為家具用板材;或為外牆保溫等用途,視為新型酚醛電木材料或為再生木材或材料。或經過模具、治具、射出、押出等一般塑膠製作工藝,成型後之再生材料。另外,此再生材料之特性為經上述工藝,可持續重複性再製與循環利用。進而有效降低環境負荷,與增加焚化爐、掩埋廠之壽命。 The environmentally-friendly bakelite phenolic material products include, but are not limited to, drilled lower backing boards, upper cover boards, desktop boards, cutting backing boards used in the printed circuit board industry and copper foil substrate industry processes, or include However, it is not limited to the general use of bakelite, such as fixtures, jigs, heat insulation materials, and insulation materials, but is used as a new type of environmentally friendly bakelite or environmentally friendly wood. It can also include, but is not limited to, panels that are used as decoration and construction, such as plywood, plywood, wood core board, chipboard, Meinair board, fiberboard, foam board, floor, etc.; or furniture board; or External wall insulation and other purposes are regarded as new phenolic bakelite materials or recycled wood or materials. Or recycled materials after molding through general plastic manufacturing processes such as molds, fixtures, injection, and extrusion. In addition, the characteristic of this recycled material is that it can be reproduced and recycled continuously through the above-mentioned process. This effectively reduces the environmental load and increases the life of incinerators and landfills.

為達到上述目的本新型中提出一種環保輕質電木酚醛結構,係為一具有特定幾何外型的平板結構,其中該環保輕質電木酚醛結構為一厚度的平板,其具有固定的幾何外型,該外型選自矩形、方形、圓形、菱形、三角 形等各種不同形狀的多邊形;該環保輕質電木酚醛結構是應用廢棄酚醛聚合材料、木纖維、多孔性材料及樹脂經過混合而成的平板結構;其中設上述四種成分的重量總合為1,則該廢棄酚醛聚合材料、該木纖維與該多孔性材料之重量比介於0.01至0.99之範圍;且該廢棄酚醛聚合材料、該木纖維及該多孔性材料的總合重量比不大於0.99;其中該樹脂的重量比例大於或等於0.01。其中該廢棄酚醛聚合材料係經破碎、粉末化而形成粉末狀,該木纖維係經破碎、粉末化而形成粉末狀,該多孔性材料係經破碎、粉末化而形成粉末狀,並將該廢棄酚醛聚合材料之粉末、該木纖維之粉末及該多孔性材料之粉末進行混合,然後添加樹脂,再將該廢棄酚醛聚合材料之粉末、該木纖維之粉末、該多孔性材料之粉末及該樹脂進行均勻混合而形成混合物,其中該樹脂主要是用於黏合該廢棄酚醛聚合材料之粉末、該木纖維之粉末及該多孔性材料之粉末;並將得到的該混合物應用熱壓、冷壓、射出機射出、押出機押出、或發泡其中之一種方式形成該平板結構。其中該廢棄酚醛聚合材料經破碎、粉末化後,係再浸泡於酸性或鹼性溶液中,使得該廢棄酚醛聚合材料的表面受到侵蝕,或者裂解為更細之粉末。其中該平板結構的形成,係將混合後之該混合物鋪放於模具內,以適當壓力施壓後,在適當溫度下熱壓一段時間使其固化至表面硬度(Shore D蕭式硬度)分佈範圍在60至95間,而形成該平板結構;其中該壓力在0.001kg/cm2至300kg/cm2範圍,而溫度大於室溫;其中當熱壓時間越長則所得到的平板結構越堅硬。 In order to achieve the above objective, this new model proposes an environmentally friendly lightweight bakelite phenolic structure, which is a flat panel structure with a specific geometric shape, wherein the environmentally friendly lightweight bakelite phenolic structure is a thick flat plate with a fixed geometric shape. The shape is selected from various shapes of polygons such as rectangles, squares, circles, rhombuses, triangles, etc.; the environmentally friendly light-weight Bakelite phenolic structure is made by mixing waste phenolic polymer materials, wood fibers, porous materials and resins. The weight ratio of the waste phenolic polymer material, the wood fiber, and the porous material is in the range of 0.01 to 0.99; and the weight ratio of the waste phenolic polymer material, the wood fiber, and the porous material is in the range of 0.01 to 0.99; and the waste phenolic polymer material The total weight ratio of the wood fiber and the porous material is not greater than 0.99; wherein the weight ratio of the resin is greater than or equal to 0.01. The waste phenolic polymer material is crushed and powdered to form a powder, the wood fiber is crushed and powdered to form a powder, the porous material is crushed and powdered to form a powder, and the waste Mix the powder of phenolic polymer material, the powder of wood fiber and the powder of the porous material, and then add resin, and then the powder of waste phenolic polymer material, the powder of wood fiber, the powder of porous material and the resin Perform uniform mixing to form a mixture, where the resin is mainly used to bond the waste phenolic polymer material powder, the wood fiber powder and the porous material powder; and the obtained mixture is applied hot pressing, cold pressing, and injection One of machine injection, extrusion machine extrusion, or foaming forms the flat structure. The waste phenolic polymer material is crushed and powdered, and then immersed in an acid or alkaline solution, so that the surface of the waste phenolic polymer material is corroded or cracked into finer powder. The formation of the flat plate structure is to place the mixed mixture in a mold, apply pressure with appropriate pressure, and heat and press at an appropriate temperature for a period of time to solidify to the surface hardness (Shore D hardness) distribution range Between 60 and 95, the flat structure is formed; the pressure is in the range of 0.001 kg/cm 2 to 300 kg/cm 2 and the temperature is greater than room temperature; the longer the hot pressing time is, the harder the obtained flat structure is.

由下文的說明可更進一步瞭解本新型的特徵及其優點,閱讀時並請參考附圖。 The features and advantages of the present invention can be further understood from the following description. Please refer to the accompanying drawings when reading.

1:平板結構 1: Flat structure

圖1顯示本案之製造方法之步驟流程圖。 Figure 1 shows a flow chart of the manufacturing method of this case.

圖2顯示本案之平板結構之示意圖。 Figure 2 shows a schematic diagram of the flat panel structure of this case.

圖3顯示本案之平板結構之另一型態之示意圖。 Fig. 3 shows a schematic diagram of another form of the flat panel structure of this case.

圖4顯示本案之平板結構之另一型態之示意圖。 Figure 4 shows a schematic diagram of another form of the flat panel structure of this case.

圖5顯示本案之平板結構之另一型態之示意圖。 Figure 5 shows a schematic diagram of another form of the flat panel structure of this case.

茲謹就本案的結構組成,及所能產生的功效與優點,配合圖式,舉本案之一較佳實施例詳細說明如下。 With regard to the structural composition of this case, and the effects and advantages that can be produced, in conjunction with the drawings, a detailed description of a preferred embodiment of this case is given as follows.

請參考圖1所示,顯示本新型之回收並再利用酚醛類型廢料所製造之環保輕質電木酚醛結構的製造方法,包含下列步驟: Please refer to Figure 1, which shows the manufacturing method of the environmentally friendly light-weight Bakelite phenolic structure manufactured by recycling and reusing phenolic waste materials of the present invention, including the following steps:

步驟100:將廢棄酚醛聚合材料經破碎、粉末化而形成粉末狀。其中該廢棄酚醛聚合材料之粉末之顆粒大小可為過篩通過1至200目的顆粒大小,較佳者該廢棄酚醛聚合材料之粉末之顆粒大小為過篩可通過200目以上之細小粉末顆粒。但本案並不限定該廢棄酚醛聚合材料之粉末之顆粒大小皆為某特定範圍,該廢棄酚醛聚合材料之粉末的顆粒大小也可以為上述這些範圍的特定比例之組合。 Step 100: The waste phenolic polymer material is crushed and powdered to form a powder. The particle size of the waste phenolic polymer material powder can be a particle size of 1 to 200 meshes through a sieve. Preferably, the particle size of the waste phenolic polymer material powder is fine powder particles that can pass through a sieve of 200 mesh or more. However, the present case does not limit the particle size of the waste phenolic polymer material powder to a specific range, and the particle size of the waste phenolic polymer material powder can also be a combination of the above-mentioned ranges in specific ratios.

其中該廢棄酚醛聚合材料即為電木廢料,可取自印刷電路板製造業於機械鑽孔製程使用之酚醛上蓋板、下墊板、桌面板、或為銅箔基板業於裁切製程使用之裁切保護墊板。但該廢棄酚醛聚合材料並不限定於上述酚醛類型廢料來源。主要是作為工業處理後的酚醛聚合材料的再生利用。 Among them, the waste phenolic polymer material is bakelite waste, which can be taken from the phenolic top cover, bottom pad, desktop board used in the mechanical drilling process of the printed circuit board manufacturing industry, or used in the cutting process of the copper foil substrate industry The cutting protection pad. However, the waste phenolic polymer material is not limited to the source of the aforementioned phenolic waste material. It is mainly used for the recycling of phenolic polymer materials after industrial treatment.

步驟110:將木纖維(即為在印刷電路板鑽孔製程後之廢棄木漿板材料)經破碎、粉末化而形成粉末狀。其中該木纖維之粉末之顆粒大小可為過篩 通過1至200目的顆粒大小,較佳者該木纖維之粉末之顆粒大小為過篩可通過200目以上之細小粉末顆粒。但本案不限定該木纖維之粉末之顆粒大小全為某特定範圍,該木纖維之粉末之顆粒大小也可以為上述這些範圍的特定比例之組合。 Step 110: The wood fiber (that is, the waste wood pulp board material after the drilling process of the printed circuit board) is crushed and powdered to form a powder. The particle size of the wood fiber powder can be sieved Through the particle size of 1 to 200 mesh, preferably the particle size of the wood fiber powder is fine powder particles that can pass through a sieve of 200 mesh or more. However, the present case does not limit the particle size of the wood fiber powder to a specific range, and the particle size of the wood fiber powder can also be a combination of specific ratios in the above-mentioned ranges.

其中該木纖維可為印刷電路板製造業於機械鑽孔製程使用之下墊板、廢棄之木漿板、環保板,或其他類型纖維板。該木纖維亦可為裝潢業、營建業、木業、家具業所使用之板材,如廢棄之合板、夾板、木心板、粒片板、美耐板、纖維板等板材,但不限定於須為廢棄來源,亦可為新鮮之纖維來源,如木粉、木屑,或為農業廢棄物,如稻稈、蔗渣。但不限定前述所有提及之木纖維來源。更適當的木纖維來源,為機械鑽孔製程後之廢棄木漿板或環保板、或新鮮木粉。 The wood fiber can be a backing board, discarded wood pulp board, environmental protection board, or other types of fiber board used in the mechanical drilling process of the printed circuit board manufacturing industry. The wood fiber can also be used in the decoration industry, construction industry, wood industry, and furniture industry, such as discarded plywood, plywood, wood core board, particle board, meinite board, fiberboard and other boards, but it is not limited to It is a waste source, it can also be a fresh fiber source, such as wood flour, sawdust, or agricultural waste, such as rice straw, bagasse. But it does not limit all the wood fiber sources mentioned above. A more appropriate source of wood fiber is waste wood pulp board or environmental protection board after mechanical drilling process, or fresh wood flour.

步驟120:取多孔性材料,該多孔性材料如廢棄的活性碳,或經發泡後的輕質材料(如發泡的酚醛板);將該多孔性材料經破碎、粉末化而形成粉末狀。其中該多孔性材料之粉末之顆粒大小可為過篩通過1至200目的顆粒大小,較佳者該多孔性材料之粉末之顆粒大小為過篩可通過200目以上之細小粉末顆粒。但本案不限定該多孔性材料之粉末之顆粒大小全為某特定範圍。 Step 120: Take porous material, such as waste activated carbon, or foamed light material (such as foamed phenolic board); crush and pulverize the porous material to form a powder . The particle size of the powder of the porous material can be a particle size of 1 to 200 meshes through a sieve. Preferably, the particle size of the powder of the porous material is a fine powder particle that can be passed through a sieve of 200 mesh or more. However, this case does not limit the particle size of the porous material powder to a specific range.

步驟130:然後將該廢棄酚醛聚合材料之粉末、該木纖維之粉末與該多孔性材料之粉末混合。其中設三者的重量總合為1,該廢棄酚醛聚合材料之粉末佔混合物之重量比介於0.01至0.99之範圍;該木纖維之粉末佔混合物之重量比介於0.01至0.99之範圍。但不完全僅限於此範圍。比如可將三者以等量之方式應用均質機進行均勻混合。 Step 130: Then mix the powder of the waste phenolic polymer material, the powder of the wood fiber and the powder of the porous material. The total weight of the three is set to 1, the weight ratio of the waste phenolic polymer material powder to the mixture is in the range of 0.01 to 0.99; the weight ratio of the wood fiber powder to the mixture is in the range of 0.01 to 0.99. But it is not limited to this range. For example, the three can be uniformly mixed with a homogenizer in an equal amount.

步驟140:然後添加適量樹脂,應用均質機將該廢棄酚醛聚合材料之粉 末、該木纖維之粉末、該多孔性材料之粉末及該樹脂進行均勻混合。其中該樹脂主要是用於黏合該廢棄酚醛聚合材料之粉末、該木纖維之粉末、及該多孔性材料之粉末。當該樹脂的比例越高,則黏合的程度越好,可是成本也越高,而且廢物利用的回收率越低。本案中較佳者該樹脂為防火樹脂、防水樹脂、且質量輕者。 Step 140: Then add an appropriate amount of resin, and apply a homogenizer to the waste phenolic polymer material powder Finally, the wood fiber powder, the porous material powder and the resin are uniformly mixed. The resin is mainly used to bond the waste phenolic polymer material powder, the wood fiber powder, and the porous material powder. When the proportion of the resin is higher, the degree of adhesion is better, but the cost is higher, and the recycling rate of waste utilization is lower. In this case, the preferred resin is fireproof resin, waterproof resin, and light weight.

其中該樹脂可為固態或液態之樹脂,以固態者為佳。該樹脂可為酚醛樹脂、尿素甲醛樹脂、環氧樹脂、壓克力樹脂等樹脂類型,或其混合物。其中該樹脂以酚醛樹脂為佳。 Among them, the resin can be solid or liquid resin, preferably solid. The resin can be phenolic resin, urea-formaldehyde resin, epoxy resin, acrylic resin and other resin types, or a mixture thereof. Among them, the resin is preferably a phenolic resin.

其中在步驟140中加入樹脂後,可更進一步加入架橋劑以形成三維之立體結構。 Wherein, after the resin is added in step 140, a bridging agent can be further added to form a three-dimensional structure.

步驟150:將得到的混合物應用熱壓、冷壓、射出機射出、押出機押出、或發泡其中之一種方式形成所需要的固體材料。惟上述將該混合物形成該固體材料的生產工藝方式並不用於限制本案的範圍。 Step 150: Apply the obtained mixture to one of hot pressing, cold pressing, injection by an injection machine, extrusion by an extruder, or foaming to form the required solid material. However, the above-mentioned production process of forming the mixture into the solid material is not intended to limit the scope of this case.

一般該廢棄酚醛聚合材料的密度約為1.4,該木纖維的密度約為0.6至0.8。所以如果僅用廢棄酚醛聚合材料及木纖維合成時,將會使得密度過大,所以整體重量較重,而不適合於工業上的應用。而該多孔性材料(如廢棄的活性碳或經發泡後的輕質材料)其密度介於0.1至0.6。所以在本案中進一步加入多孔性材料可以降低整個材料密度,因此可以達到很多的應用。 Generally, the density of the waste phenolic polymer material is about 1.4, and the density of the wood fiber is about 0.6 to 0.8. Therefore, if only waste phenolic polymer materials and wood fiber are used for synthesis, the density will be too high, so the overall weight is heavier, which is not suitable for industrial applications. The density of the porous material (such as waste activated carbon or foamed lightweight material) is between 0.1 and 0.6. Therefore, in this case, further adding porous materials can reduce the density of the entire material, so many applications can be achieved.

該固體材料比如可為平板材料,其具有固定的幾何外型,如矩形、方形、圓形、菱形、三角形等各種不同形狀的多邊形。 The solid material can be, for example, a flat plate material, which has a fixed geometric shape, such as a rectangle, a square, a circle, a rhombus, a triangle, and other polygons of various shapes.

比如將混合後之混合物鋪放於模具內,以適當壓力施壓後,在適當溫度下熱壓一段時間使其固化至表面硬度(Shore D蕭式硬度)分佈範圍在60 至95間,而形成該固體材料。一般該壓力在0.001kg/cm2至300kg/cm2範圍,而溫度大於室溫即可。至於熱壓時間越長則所得到的固體材料越堅硬。 For example, place the mixed mixture in a mold, apply pressure with appropriate pressure, and heat and press at an appropriate temperature for a period of time to solidify until the surface hardness (Shore D hardness) is distributed in the range of 60 to 95. The solid material. Generally, the pressure is in the range of 0.001 kg/cm 2 to 300 kg/cm 2 and the temperature is higher than room temperature. As for the longer the hot pressing time, the harder the solid material obtained.

其中在步驟100中,該廢棄酚醛聚合材料經破碎、粉末化後,可再浸泡於酸性或鹼性溶液中,使得該廢棄酚醛聚合材料的表面受到侵蝕,或者裂解為更細之粉末,其主要目的在於增加後續步驟中與該樹脂結合的凝固力。其中該酸性或鹼性溶液包含但不限定為強酸、強鹼、弱酸、弱鹼等水溶液,可為但不限定鹽酸、硫酸、氫氟酸、硝酸、王水、氫氧化鈉水溶液、氫氧化鉀水溶液、氫氧化鈣水溶液、氫氧化鎂水溶液等酸鹼水溶液。該酸性或鹼性溶液之重量濃度在0.1%至99%水溶液之濃度範圍內。 In step 100, the waste phenolic polymer material can be immersed in an acid or alkaline solution after being crushed and powdered, so that the surface of the waste phenolic polymer material is corroded or cracked into finer powder. The purpose is to increase the coagulation force combined with the resin in the subsequent steps. The acidic or alkaline solution includes, but is not limited to, strong acid, strong base, weak acid, weak base and other aqueous solutions, and can be, but is not limited to, hydrochloric acid, sulfuric acid, hydrofluoric acid, nitric acid, aqua regia, aqueous sodium hydroxide, and potassium hydroxide. Acid-base aqueous solutions such as aqueous solutions, calcium hydroxide aqueous solutions, and magnesium hydroxide aqueous solutions. The weight concentration of the acidic or alkaline solution is in the range of 0.1% to 99% aqueous solution.

比如將該廢棄酚醛聚合材料之粉末浸泡於適量之強鹼氫氧化鈉溶液(濃度為10%,w/w),且該強鹼氫氧化鈉溶液淹過該廢棄酚醛聚合材料的粉末面,以進行表面破壞。待2天後,將強鹼氫氧化鈉溶液漏出,並用水洗淨該廢棄酚醛聚合材料粉末至pH:7-9範圍之間以後,於100℃的溫度下進行烘乾乾燥。 For example, the powder of the waste phenolic polymer material is immersed in an appropriate amount of strong alkali sodium hydroxide solution (concentration of 10%, w/w), and the strong alkali sodium hydroxide solution floods the powder surface of the waste phenolic polymer material to Perform surface destruction. After 2 days, the strong alkali sodium hydroxide solution was leaked out, and the waste phenolic polymer material powder was washed with water to a pH range of 7-9, and then dried at a temperature of 100°C.

所以本案係為一具有特定幾何外型的平板結構1,主要是應用廢棄酚醛聚合材料、木纖維、多孔性材料(如廢棄的活性碳或經發泡後的輕質材料)及樹脂經過混合而成的平板結構1。其中設上述四種成分的重量總合為1,則該廢棄酚醛聚合材料、該木纖維及該多孔性材料之重量比介於0.01至0.99之範圍,且該廢棄酚醛聚合材料、該木纖維及該多孔性材料的總合重量比不大於0.99;而該樹脂的重量比大於或等於0.01。該平板結構1尚可包含架橋劑。其中各材料的成分如上所述者。該平板結構1具有固定的幾何外型,如矩形或方形(如圖2所示)、圓形(如圖3所示)、菱形(如圖4所示)、三角形(如圖 5所示)等各種不同形狀的多邊形。 Therefore, this case is a flat-plate structure with a specific geometric shape. It mainly uses waste phenolic polymer materials, wood fibers, porous materials (such as waste activated carbon or foamed lightweight materials) and resins through mixing. Into the flat structure1. Wherein, supposing that the total weight of the above four components is 1, the weight ratio of the waste phenolic polymer material, the wood fiber and the porous material is in the range of 0.01 to 0.99, and the waste phenolic polymer material, the wood fiber and The total weight ratio of the porous material is not greater than 0.99; and the weight ratio of the resin is greater than or equal to 0.01. The flat structure 1 can still contain a bridging agent. The composition of each material is as described above. The flat structure 1 has a fixed geometric shape, such as a rectangle or a square (as shown in Figure 2), a circle (as shown in Figure 3), a rhombus (as shown in Figure 4), and a triangle (as shown in Figure 4). Shown in 5) and other different shapes of polygons.

在本應用例的第一實施例中,在上述步驟140中該廢棄酚醛聚合材料(即為電木廢料)之粉末、該木纖維之粉末、該多孔性材料之粉末與該樹脂(如酚醛樹脂)的混合之重量比為1:1:1:1,並在上述步驟150中應用熱壓方式形成該固體材料,其中熱壓壓力為40kgf/cm2,熱壓溫度為150℃,熱壓時間為1小時。因此可得到特定厚度之該固體材料,以作為環保電木酚醛材料。其中該固體材料的表面硬度(Shore D蕭式硬度)分佈範圍可在60至92間。該固體材料可做成厚度為2.5mm的平板,其具有固定的幾何外型,如矩形、方形、圓形、菱形、三角形等各種不同形狀的多邊形。該固體材料可作為印刷電路板業鑽孔板,視為一款低階環保鑽孔板,或為銅箔基板業裁切時之裁切保護板材。 In the first embodiment of this application example, in the above step 140, the waste phenolic polymer material (i.e. bakelite waste) powder, the wood fiber powder, the porous material powder and the resin (such as phenolic resin) The mixing weight ratio of) is 1:1:1:1, and the solid material is formed by hot pressing in the above step 150, wherein the hot pressing pressure is 40kgf/cm 2 , the hot pressing temperature is 150°C, and the hot pressing time For 1 hour. Therefore, the solid material with a specific thickness can be obtained as an environmentally friendly bakelite phenolic material. The distribution range of the surface hardness (Shore D hardness) of the solid material can be between 60 and 92. The solid material can be made into a flat plate with a thickness of 2.5 mm, which has a fixed geometric appearance, such as a rectangle, a square, a circle, a rhombus, a triangle, and other polygons of various shapes. The solid material can be used as a drilling board for the printed circuit board industry, as a low-level environmentally friendly drilling board, or as a cutting protection board for the copper foil substrate industry.

在本應用例的第二實施例中,在上述步驟140中該廢棄酚醛聚合材料(即為電木廢料)之粉末、該木纖維之粉末、該多孔性材料之粉末與該樹脂(如酚醛樹脂)的混合條件與上述第一實施例相同(即混合之重量比為1:1:1:1),並且在上述步驟150中也應用熱壓方式形成該固體材料。但其中熱壓壓力為50kgf/cm2,熱壓溫度為150℃,熱壓時間為1小時。因此可得到特定厚度之固體材料,以做為環保電木酚醛材料。其中該固體材料之表面硬度(Shore D蕭式硬度)分佈範圍可在70至90間。該固體材料可做成厚度為1.5mm的平板,其具有固定的幾何外型,如矩形、方形、圓形、菱形、三角形等各種不同形狀的多邊形。該固體材料可作為印刷電路板業鑽孔板,視為一款中階環保鑽孔板,或為銅箔基板業裁切時之裁切保護板材。 In the second embodiment of this application example, in the above step 140, the waste phenolic polymer material (i.e. bakelite waste) powder, the wood fiber powder, the porous material powder and the resin (such as phenolic resin) The mixing conditions of) are the same as in the first embodiment (that is, the mixing weight ratio is 1:1:1:1), and the solid material is also formed by hot pressing in the above step 150. However, the hot pressing pressure is 50kgf/cm 2 , the hot pressing temperature is 150°C, and the hot pressing time is 1 hour. Therefore, a solid material with a specific thickness can be obtained as an environmentally friendly bakelite phenolic material. The distribution range of the surface hardness (Shore D hardness) of the solid material can be between 70 and 90. The solid material can be made into a flat plate with a thickness of 1.5 mm, which has a fixed geometric appearance, such as a rectangle, a square, a circle, a rhombus, a triangle, and other polygons of various shapes. The solid material can be used as a drilling board for the printed circuit board industry, as a middle-level environmentally friendly drilling board, or as a cutting protection board for the copper foil substrate industry.

在本應用例的第三實施例中,在上述步驟140中該廢棄酚醛聚合材料 (即為電木廢料)之粉末、該木纖維之粉末、該多孔性材料之粉末與該樹脂(如酚醛樹脂)的混合條件與上述第一實施例相同(即混合之重量比為1:1:1:1)。而在上述步驟150中,係將得到的混合物係鋪放於模具內,應用熱壓方式形成該固體材料,其中經混合後之混合物鋪放於模具中時,該模具之底面及表面分別放置含膠面紙(或俗稱面紙膠片)。其中熱壓壓力為60kgf/cm2,熱壓溫度為150℃,熱壓時間為1小時。因此可得到特定厚度之固體材料,以作為環保電木酚醛材料。其中該固體材料的表面硬度(Shore D蕭式硬度)分佈範圍可在85至95間。該固體材料可做成厚度為1.5mm的平板,其具有固定的幾何外型,如矩形、方形、圓形、菱形、三角形等各種不同形狀的多邊形。該固體材料可作為印刷電路板業鑽孔板,視為一款高階環保鑽孔板。 In the third embodiment of this application example, in the above step 140, the waste phenolic polymer material (i.e. bakelite waste) powder, the wood fiber powder, the porous material powder and the resin (such as phenolic resin) The mixing conditions of) are the same as in the first embodiment (that is, the mixing weight ratio is 1:1:1:1). In the above step 150, the obtained mixture is placed in a mold, and the solid material is formed by hot pressing. When the mixed mixture is placed in the mold, the bottom and surface of the mold are placed on the bottom surface and the surface of the mold. Glue paper (or commonly known as paper film). The hot pressing pressure is 60kgf/cm 2 , the hot pressing temperature is 150°C, and the hot pressing time is 1 hour. Therefore, a solid material with a specific thickness can be obtained as an environmentally friendly bakelite phenolic material. The distribution range of the surface hardness (Shore D hardness) of the solid material can be between 85 and 95. The solid material can be made into a flat plate with a thickness of 1.5 mm, which has a fixed geometric appearance, such as a rectangle, a square, a circle, a rhombus, a triangle, and other polygons of various shapes. The solid material can be used as a drilling board for the printed circuit board industry, and it is regarded as a high-end environmentally friendly drilling board.

在本應用例的第四實施例中,在上述步驟140中該廢棄酚醛聚合材料(即為電木廢料)之粉末、該木纖維之粉末、該多孔性材料之粉末與該樹脂(如酚醛樹脂)的混合條件與上述第三實施例相同(即混合之重量比為1:1:1:1),並且在上述步驟150中應用熱壓方式形成該固體材料。其中熱壓壓力為60kgf/cm2,熱壓溫度為150℃,熱壓時間為1小時。因此可得到特定厚度之固體材料,以作為環保電木酚醛材料。該固體材料的表面硬度(Shore D蕭式硬度)分佈範圍可在85至95間。該固體材料可做成厚度為3mm的平板,其具有固定的幾何外型,如矩形、方形、圓形、菱形、三角形等各種不同形狀的多邊形。該固體材料可作為一般行業使用之電木板,應用於治具、夾具。 In the fourth embodiment of this application example, in the above step 140, the waste phenolic polymer material (i.e. bakelite waste) powder, the wood fiber powder, the porous material powder and the resin (such as phenolic resin) The mixing conditions of) are the same as the third embodiment (that is, the mixing weight ratio is 1:1:1:1), and the solid material is formed by hot pressing in the above step 150. The hot pressing pressure is 60kgf/cm 2 , the hot pressing temperature is 150°C, and the hot pressing time is 1 hour. Therefore, a solid material with a specific thickness can be obtained as an environmentally friendly bakelite phenolic material. The surface hardness (Shore D hardness) of the solid material can range from 85 to 95. The solid material can be made into a flat plate with a thickness of 3mm, which has a fixed geometric appearance, such as a rectangle, a square, a circle, a rhombus, a triangle, and other polygons of various shapes. The solid material can be used as a bakelite board used in general industries and used in jigs and fixtures.

在本應用例的第五實施例中,在上述步驟140中係將上述第一實施例中 的該廢棄酚醛聚合材料(即為電木廢料)之粉末、該木纖維之粉末、該多孔性材料之粉末與該樹脂(如酚醛樹脂)的混合之重量比改為1:3:10:2。其中未改變上述第一實施例之該廢棄酚醛聚合材料之粉末、該木纖維之粉末及該多孔性材料之粉末的粒徑分佈,但改變該廢棄酚醛聚合材料之粉末、該木纖維之粉末及該多孔性材料之粉末之用量比例。該廢棄酚醛聚合材料(即為電木廢料)之粉末、該木纖維之粉末、該多孔性材料之粉末與該樹脂(如酚醛樹脂)再以均質機均勻混合。而在上述步驟150中,係將得到的混合物係鋪放於模具內,應用熱壓方式形成該固體材料。其中熱壓壓力為30kgf/cm2,熱壓溫度為150℃,熱壓時間為1小時。因此可得到特定厚度之固體材料,以作為環保電木酚醛材料。其中該固體材料的表面硬度(Shore D蕭式硬度)分佈範圍可在60至70間。該固體材料可做成厚度為3mm的平板,其具有固定的幾何外型,如矩形、方形、圓形、菱形、三角形等各種不同形狀的多邊形。該固體材料可作為裝潢用材料之纖維板。 In the fifth embodiment of this application example, in the above step 140, the waste phenolic polymer material (that is, bakelite waste) powder, the wood fiber powder, and the porous material in the first embodiment are combined The mixing weight ratio of the powder and the resin (such as phenolic resin) is changed to 1:3:10:2. The particle size distribution of the waste phenolic polymer material powder, the wood fiber powder, and the porous material powder of the above-mentioned first embodiment is not changed, but the waste phenolic polymer material powder, the wood fiber powder and the powder of the porous material are changed. The proportion of the powder of the porous material. The waste phenolic polymer material (ie, bakelite waste) powder, the wood fiber powder, the porous material powder, and the resin (such as phenol resin) are uniformly mixed with a homogenizer. In the above step 150, the obtained mixture is placed in a mold, and the solid material is formed by hot pressing. The hot pressing pressure is 30kgf/cm 2 , the hot pressing temperature is 150°C, and the hot pressing time is 1 hour. Therefore, a solid material with a specific thickness can be obtained as an environmentally friendly bakelite phenolic material. The distribution range of the surface hardness (Shore D hardness) of the solid material can be between 60 and 70. The solid material can be made into a flat plate with a thickness of 3mm, which has a fixed geometric appearance, such as a rectangle, a square, a circle, a rhombus, a triangle, and other polygons of various shapes. The solid material can be used as a fiberboard for decoration materials.

在本應用例的第六實施例中,在上述步驟140中該廢棄酚醛聚合材料(即為電木廢料)之粉末、該木纖維之粉末、該多孔性材料之粉末與該樹脂(如酚醛樹脂)的混合條件與上述第四實施例相同(即混合之重量比為1:1:1:1)。而在上述步驟150中,係將得到的混合物係鋪放於模具內,應用熱壓方式形成該固體材料,其中經混合後之混合物鋪放於模具中時,該模具之底面及表面分別放置含膠面紙(或俗稱面紙膠片)。其中熱壓壓力為60kgf/cm2,熱壓溫度為150℃,熱壓時間為1小時。因此可得到特定厚度之固體材料,以作為環保電木酚醛材料。其中該固體材料的表面硬度(Shore D蕭式硬度)分佈範圍可在70至92間。該固體材料可做成厚度為3mm的平 板,其具有固定的幾何外型,如矩形、方形、圓形、菱形、三角形等各種不同形狀的多邊形。該固體材料可作為含化妝面,室內裝潢用材料之裝飾板。 In the sixth embodiment of this application example, in the above step 140, the waste phenolic polymer material (i.e. bakelite waste) powder, the wood fiber powder, the porous material powder and the resin (such as phenolic resin) The mixing conditions of) are the same as the fourth embodiment (that is, the mixing weight ratio is 1:1:1:1). In the above step 150, the obtained mixture is placed in a mold, and the solid material is formed by hot pressing. When the mixed mixture is placed in the mold, the bottom and surface of the mold are placed on the bottom surface and the surface of the mold. Glue paper (or commonly known as paper film). The hot pressing pressure is 60kgf/cm 2 , the hot pressing temperature is 150°C, and the hot pressing time is 1 hour. Therefore, a solid material with a specific thickness can be obtained as an environmentally friendly bakelite phenolic material. The distribution range of the surface hardness (Shore D hardness) of the solid material can be between 70 and 92. The solid material can be made into a flat plate with a thickness of 3mm, which has a fixed geometric appearance, such as a rectangle, a square, a circle, a rhombus, a triangle, and other polygons of various shapes. The solid material can be used as a decorative board containing makeup surface and interior decoration materials.

上列各製程中應用模具熱壓的方式也可以改成以塑膠押出之製程方式進行廢棄酚醛聚合材料之押出。可得一板狀之地板類型產品。 The method of applying mold hot pressing in the above-listed processes can also be changed to a plastic extrusion process for the extrusion of waste phenolic polymer materials. A slab floor type product is available.

本案的優點在於將酚醛類型廢料(即為電木廢料)、木纖維類材質(廢棄纖維為佳)與多孔性材料(如廢棄的活性碳或經發泡後的輕質材料),三者均經適度破碎及研磨至特定顆粒大小後,以特定粉末混合比例,進行共混合均勻,並輔以樹脂的添加,以特定樹脂混合比例,可以補足傳統上單以廢棄電木廢料作為新成品主要原料時,在加入新樹脂後容易產生分配不均、結構不強、且密度過高重量過重而導致的多種缺陷問題。也可避開傳統上單以廢棄纖維為主要結構時,產品強度不足的情形。其中多孔性材料可使得整體材質密度降低,因此重量較輕,並具有防火及防水功能。並且本案再續以傳統塑膠材料之製程方式,製成最終環保電木酚醛材料成品,可以應用在印刷電路板業、銅箔基板業製程中所使用之鑽孔下墊板、上蓋板、桌面板、裁切墊板,或包括但不限定於被應用在電木一般使用之方式,如作為夾具、治具、隔熱材、絕緣材,而被應用成新型的環保電木板或環保木材。亦可包括但不限定於被應用在作為裝潢營建用板材,如合板、夾板、木心板、粒片板、美耐板、纖維板、發泡板、地板等;或為家具用板材;或為外牆保溫等用途,視為新型酚醛電木材料或為再生木材或材料。或經過模具、治具、射出、押出等一般塑膠製作工藝,成型後之再生材料。另外,此再生材料之特性為經上述工藝,可持續重複性再製與循環利用。 進而有效降低環境負荷,與增加焚化爐、掩埋廠之壽命。 The advantage of this case is to combine phenolic waste materials (that is, bakelite waste), wood fiber materials (waste fibers are better), and porous materials (such as waste activated carbon or foamed lightweight materials). After being appropriately crushed and ground to a specific particle size, the mixture is uniformly mixed with a specific powder mixing ratio, supplemented by the addition of resin, and the specific resin mixing ratio can make up the traditional single waste bakelite waste as the main raw material of the new product. When adding new resin, it is easy to produce a variety of defects caused by uneven distribution, weak structure, and high density and heavy weight. It can also avoid the situation of insufficient product strength when traditionally only waste fibers are used as the main structure. Among them, the porous material can reduce the density of the overall material, so the weight is lighter, and it has fireproof and waterproof functions. And this case continues to use the traditional plastic material manufacturing process to make the final environmentally friendly bakelite phenolic material product, which can be used in the printed circuit board industry and the copper foil substrate industry for the drilling lower backing board, upper cover board, and desktop Plates, cutting pads, or including but not limited to the general use of bakelite, such as fixtures, jigs, heat insulation materials, insulation materials, and are applied to new environmentally friendly bakelite or environmentally friendly wood. It can also include, but is not limited to, panels that are used as decoration and construction, such as plywood, plywood, wood core board, particle board, Meinair board, fiberboard, foam board, floor, etc.; or board for furniture; or External wall insulation and other purposes are regarded as new phenolic bakelite materials or recycled wood or materials. Or recycled materials after molding through general plastic manufacturing processes such as molds, fixtures, injection, and extrusion. In addition, the characteristic of this recycled material is that it can be reproduced and recycled continuously through the above-mentioned process. This effectively reduces the environmental load and increases the life of incinerators and landfills.

綜上所述,本案人性化之體貼設計,相當符合實際需求。其具體改進現有缺失,相較於習知技術明顯具有突破性之進步優點,確實具有功效之增進,且非易於達成。本案未曾公開或揭露於國內與國外之文獻與市場上,已符合專利法規定。 In summary, the humanized and considerate design of this case is quite in line with actual needs. Compared with the conventional technology, the specific improvement of the existing defects is obviously a breakthrough and the advantage is indeed an improvement in efficacy, and it is not easy to achieve. This case has not been disclosed or disclosed in domestic and foreign documents and markets, and it has complied with the provisions of the Patent Law.

上列詳細說明係針對本新型之一可行實施例之具體說明,惟該實施例並非用以限制本新型之專利範圍,凡未脫離本新型技藝精神所為之等效實施或變更,均應包含於本案之專利範圍中。 The above detailed description is a specific description of a feasible embodiment of the present model, but the embodiment is not intended to limit the scope of the patent of the present model. Any equivalent implementation or modification that does not deviate from the technical spirit of the present model shall be included in In the scope of the patent in this case.

1:平板結構 1: Flat structure

Claims (16)

一種環保輕質電木酚醛結構,係為一具有特定幾何外型的平板結構,其中該環保輕質電木酚醛結構為一厚度的平板,其具有固定的幾何外型,該外型為矩形;該環保輕質電木酚醛結構是應用廢棄酚醛聚合材料、木纖維、多孔性材料及樹脂經過混合而成的平板結構;其中設上述四種成分的重量總合為1,則該廢棄酚醛聚合材料、該木纖維與該多孔性材料之重量比介於0.01至0.99之範圍;且該廢棄酚醛聚合材料、該木纖維及該多孔性材料的總合重量比不大於0.99;其中該樹脂的重量比例大於或等於0.01。 An environmentally-friendly light-weight bakelite phenolic structure is a flat plate structure with a specific geometric shape, wherein the environmentally-friendly light-weight bakelite phenolic structure is a thick flat plate with a fixed geometric shape, and the shape is rectangular; The environmentally friendly lightweight Bakelite phenolic structure is a flat structure that uses waste phenolic polymer materials, wood fibers, porous materials and resins to be mixed; where the total weight of the above four components is 1, then the waste phenolic polymer material The weight ratio of the wood fiber to the porous material is in the range of 0.01 to 0.99; and the total weight ratio of the waste phenolic polymer material, the wood fiber and the porous material is not more than 0.99; wherein the weight ratio of the resin Greater than or equal to 0.01. 如申請專利範圍第1項所述之環保輕質電木酚醛結構,其中該平板結構中尚包含架橋劑。 The environmentally friendly light-weight Bakelite phenolic structure as described in item 1 of the scope of patent application, wherein the plate structure further contains a bridging agent. 如申請專利範圍第1或2項所述之環保輕質電木酚醛結構,其中該廢棄酚醛聚合材料係經破碎、粉末化而形成粉末狀,該木纖維係經破碎、粉末化而形成粉末狀,該多孔性材料係經破碎、粉末化而形成粉末狀,並將該廢棄酚醛聚合材料之粉末、該木纖維之粉末及該多孔性材料之粉末進行混合,然後添加樹脂,再將該廢棄酚醛聚合材料之粉末、該木纖維之粉末、該多孔性材料之粉末及該樹脂進行均勻混合而形成混合物,其中該樹脂主要是用於黏合該廢棄酚醛聚合材料之粉末、該木纖維之粉末及該多孔性材料之粉末;並將得到的該混合物應用熱壓、冷壓、射出機射出、押出機押出、或發泡其中之一種方式形成該平板結構。 The environmentally friendly lightweight Bakelite phenolic structure as described in item 1 or 2 of the scope of patent application, wherein the waste phenolic polymer material is crushed and powdered to form a powder, and the wood fiber is crushed and powdered to form a powder The porous material is crushed and powdered to form a powder, and the waste phenolic polymer material powder, the wood fiber powder and the porous material powder are mixed, and then resin is added, and then the waste phenolic material The powder of the polymer material, the powder of the wood fiber, the powder of the porous material and the resin are uniformly mixed to form a mixture, wherein the resin is mainly used to bond the powder of the waste phenolic polymer material, the powder of the wood fiber and the Porous material powder; and applying the obtained mixture to hot pressing, cold pressing, injection molding machine, extrusion molding machine, or foaming to form the flat structure. 如申請專利範圍第3項所述之環保輕質電木酚醛結構,其中該廢棄酚醛聚合材料經破碎、粉末化後,係再浸泡於酸性或鹼性溶液中,使得該廢棄酚醛聚合材料的表面受到侵蝕,或者裂解為更細之粉末。 The environmentally friendly lightweight Bakelite phenolic structure described in item 3 of the scope of patent application, wherein the waste phenolic polymer material is crushed and powdered, and then immersed in an acid or alkaline solution to make the surface of the waste phenolic polymer material Corroded, or cracked into finer powder. 如申請專利範圍第3項所述之環保輕質電木酚醛結構,其中該平板結構的形成,係將混合後之該混合物鋪放於模具內,以適當壓力施壓後,在適當溫度下熱壓一段時間使其固化至表面硬度(Shore D蕭式硬度)分佈範圍在60至95間,而形成該平板結構;其中該壓力在0.001kg/cm2至300kg/cm2範圍,而溫度大於室溫;其中當熱壓時間越長則所得到的平板結構越堅硬。 The environmentally friendly lightweight Bakelite phenolic structure described in item 3 of the scope of patent application, wherein the formation of the flat structure is to place the mixed mixture in a mold, apply pressure with appropriate pressure, and heat it at an appropriate temperature cured pressure period to a surface hardness (Shore D hardness Xiao) distributed in the range of 60 to 95, the plate structure is formed; wherein the pressure at 0.001kg / cm 2 to 300kg / range cm 2, and greater than room temperature Temperature; Among them, the longer the hot pressing time, the harder the resulting flat structure. 如申請專利範圍第4項所述之環保輕質電木酚醛結構,其中該酸性或鹼性溶液選自鹽酸、硫酸、氫氟酸、硝酸、王水、氫氧化鈉水溶液、氫氧化鉀水溶液、氫氧化鈣水溶液、氫氧化鎂水溶液等酸鹼水溶液。 As described in item 4 of the scope of patent application, the environmentally friendly light bakelite phenolic structure, wherein the acidic or alkaline solution is selected from hydrochloric acid, sulfuric acid, hydrofluoric acid, nitric acid, aqua regia, sodium hydroxide aqueous solution, potassium hydroxide aqueous solution, Acid-base aqueous solutions such as calcium hydroxide aqueous solution and magnesium hydroxide aqueous solution. 如申請專利範圍第1項所述之環保輕質電木酚醛結構,其中該廢棄酚醛聚合材料選自電木廢料、印刷電路板製造業於機械鑽孔製程使用之酚醛上蓋板、下墊板、桌面板、或銅箔基板業於裁切製程使用之裁切保護墊板。 The environmentally friendly light-weight Bakelite phenolic structure as described in item 1 of the scope of patent application, wherein the waste phenolic polymer material is selected from Bakelite waste, phenolic top and bottom plates used in the mechanical drilling process of the printed circuit board manufacturing industry , Desktop board, or copper foil substrate industry used in the cutting process of cutting protection pad. 如申請專利範圍第1項所述之環保輕質電木酚醛結構,其中該木纖維選自印刷電路板製造業於機械鑽孔製程使用之下墊板、廢棄之木漿板、環保板、或裝滿或家具板材、或新鮮之纖維來源、木粉、木屑、或農業廢棄物;當該木纖維為農業廢棄物時,係選自稻稈、蔗渣。 The environmentally friendly light-weight Bakelite phenolic structure as described in item 1 of the scope of patent application, wherein the wood fiber is selected from the backing board used in the mechanical drilling process of the printed circuit board manufacturing industry, waste wood pulp board, environmental protection board, or It is filled with furniture boards, or fresh fiber sources, wood flour, wood chips, or agricultural waste; when the wood fiber is agricultural waste, it is selected from rice straw and bagasse. 如申請專利範圍第1項所述之環保輕質電木酚醛結構,其中該多孔性材料係選自廢棄的活性碳或經發泡後的輕質材料。 The environmentally friendly lightweight Bakelite phenolic structure as described in item 1 of the scope of patent application, wherein the porous material is selected from waste activated carbon or foamed lightweight materials. 如申請專利範圍第1項所述之環保輕質電木酚醛結構,其中該樹脂選自防火樹脂、防水樹脂、酚醛樹脂、尿素甲醛樹脂、環氧樹脂、壓克力樹脂、或前述樹脂之混合物。 The environmentally friendly lightweight Bakelite phenolic structure as described in item 1 of the scope of patent application, wherein the resin is selected from fire-retardant resins, waterproof resins, phenolic resins, urea-formaldehyde resins, epoxy resins, acrylic resins, or mixtures of the foregoing resins . 如申請專利範圍第3項所述之環保輕質電木酚醛結構,其中該廢棄酚醛聚合材料之粉末、該木纖維之粉末、該多孔性材料之粉末與該樹脂的混 合之重量比為1:1:1:1;其中該混合物係應用熱壓方式形成該平板結構;其中熱壓壓力為40kgf/cm2,熱壓溫度為150℃,熱壓時間為1小時;其中該平板結構的表面硬度(Shore D蕭式硬度)分佈範圍在60至92間;該平板結構用於作為印刷電路板業鑽孔板,視為一低階環保鑽孔板,或為銅箔基板業裁切時之裁切保護板材。 The environmentally friendly lightweight Bakelite phenolic structure described in item 3 of the scope of patent application, wherein the weight ratio of the waste phenolic polymer material powder, the wood fiber powder, the porous material powder and the resin is 1: 1:1:1; wherein the mixture is formed by hot pressing to form the flat structure; wherein the hot pressing pressure is 40kgf/cm 2 , the hot pressing temperature is 150°C, and the hot pressing time is 1 hour; wherein the surface hardness of the flat structure (Shore D Shore Hardness) The distribution range is between 60 and 92; the flat structure is used as a drilling board for the printed circuit board industry, regarded as a low-level environmentally friendly drilling board, or for cutting in the copper foil substrate industry Cut the protective sheet. 如申請專利範圍第3項所述之環保輕質電木酚醛結構,其中該廢棄酚醛聚合材料之粉末、該木纖維之粉末、該多孔性材料之粉末與該樹脂的混合之重量比為1:1:1:1;其中該混合物係應用熱壓方式形成該平板結構;其中熱壓壓力為50kgf/cm2,熱壓溫度為150℃,熱壓時間為1小時;其中該平板結構之表面硬度(Shore D蕭式硬度)分佈範圍在70至90間;該平板結構用於作為印刷電路板業鑽孔板,視為一中階環保鑽孔板,或為銅箔基板業裁切時之裁切保護板材。 The environmentally friendly lightweight Bakelite phenolic structure described in item 3 of the scope of patent application, wherein the weight ratio of the waste phenolic polymer material powder, the wood fiber powder, the porous material powder and the resin is 1: 1:1:1; wherein the mixture is formed by hot pressing to form the flat structure; wherein the hot pressing pressure is 50kgf/cm 2 , the hot pressing temperature is 150°C, and the hot pressing time is 1 hour; wherein the surface hardness of the flat structure (Shore D Shore Hardness) The distribution range is between 70 and 90; the flat structure is used as a drilling board for the printed circuit board industry, regarded as a middle-level environmentally friendly drilling board, or for the cutting of the copper foil substrate industry Cut the protective sheet. 如申請專利範圍第3項所述之環保輕質電木酚醛結構,其中該廢棄酚醛聚合材料之粉末、該木纖維之粉末、該多孔性材料之粉末與該樹脂的混合之重量比為1:1:1:1;其中該混合物係鋪放於模具內並應用熱壓方式形成該平板結構,其中該混合物鋪放於模具中時,該模具之底面及表面分別放置含膠面紙;其中熱壓壓力為60kgf/cm2,熱壓溫度為150℃,熱壓時間為1小時;其中該平板結構的表面硬度(Shore D蕭式硬度)分佈範圍在85至95間;該平板結構用於作為印刷電路板業鑽孔板,視為一高階環保鑽孔板。 The environmentally friendly lightweight Bakelite phenolic structure described in item 3 of the scope of patent application, wherein the weight ratio of the waste phenolic polymer material powder, the wood fiber powder, the porous material powder and the resin is 1: 1:1:1; wherein the mixture is placed in a mold and hot pressing is used to form the flat structure, wherein when the mixture is placed in the mold, the bottom surface and the surface of the mold are respectively placed on the bottom surface and the surface of the mold; wherein the hot The pressing pressure is 60kgf/cm 2 , the hot pressing temperature is 150°C, and the hot pressing time is 1 hour; the surface hardness (Shore D hardness) of the flat structure ranges from 85 to 95; the flat structure is used as The printed circuit board industry drilled board is regarded as a high-end environmentally friendly drilled board. 如申請專利範圍第3項所述之環保輕質電木酚醛結構,其中該廢棄酚醛聚合材料之粉末、該木纖維之粉末、該多孔性材料之粉末與該樹脂的混合之重量比為1:1:1:1;其中該混合物係應用熱壓方式形成該平板結構; 其中熱壓壓力為60kgf/cm2,熱壓溫度為150℃,熱壓時間為1小時;該平板結構的表面硬度(Shore D蕭式硬度)分佈範圍在85至95間;該平板結構用於作為電木板,應用於治具及夾具。 The environmentally friendly lightweight Bakelite phenolic structure described in item 3 of the scope of patent application, wherein the weight ratio of the waste phenolic polymer material powder, the wood fiber powder, the porous material powder and the resin is 1: 1:1:1; wherein the mixture is applied with hot pressing to form the flat structure; wherein the hot pressing pressure is 60kgf/cm 2 , the hot pressing temperature is 150°C, and the hot pressing time is 1 hour; the surface hardness of the flat structure ( Shore D hardness) distribution range is between 85 to 95; the flat structure is used as a bakelite board, used in jigs and fixtures. 如申請專利範圍第3項所述之環保輕質電木酚醛結構,其中該廢棄酚醛聚合材料之粉末、該木纖維之粉末、該多孔性材料之粉末與該樹脂的混合之重量比為1:3:10:2;其中該混合物係鋪放於模具內並應用熱壓方式形成該平板結構;其中熱壓壓力為30kgf/cm2,熱壓溫度為150℃,熱壓時間為1小時;其中該平板結構的表面硬度(Shore D蕭式硬度)分佈範圍在60至70間;該平板結構用於作為裝潢用材料之纖維板。 The environmentally friendly lightweight Bakelite phenolic structure described in item 3 of the scope of patent application, wherein the weight ratio of the waste phenolic polymer material powder, the wood fiber powder, the porous material powder and the resin is 1: 3:10:2; where the mixture is placed in a mold and hot pressing is used to form the flat structure; where the hot pressing pressure is 30kgf/cm 2 , the hot pressing temperature is 150°C, and the hot pressing time is 1 hour; The surface hardness (Shore D hardness) of the flat structure ranges from 60 to 70; the flat structure is used as a fiberboard for decoration materials. 如申請專利範圍第3項所述之環保輕質電木酚醛結構,其中該廢棄酚醛聚合材料之粉末、該木纖維之粉末、該多孔性材料之粉末與該樹脂的混合之重量比為1:1:1:1;其中該混合物係鋪放於模具內並應用熱壓方式形成該平板結構;其中該混合物鋪放於模具中時,該模具之底面及表面分別放置含膠面紙;其中熱壓壓力為60kgf/cm2,熱壓溫度為150℃,熱壓時間為1小時;其中該平板結構的表面硬度(Shore D蕭式硬度)分佈範圍在70至92間;該平板結構作為含化妝面,室內裝滿用材料之裝飾板。 The environmentally friendly lightweight Bakelite phenolic structure described in item 3 of the scope of patent application, wherein the weight ratio of the waste phenolic polymer material powder, the wood fiber powder, the porous material powder and the resin is 1: 1:1:1; where the mixture is placed in the mold and hot pressing is used to form the flat structure; where the mixture is placed in the mold, the bottom and the surface of the mold are respectively placed on the bottom surface and the surface of the mold; where the hot The pressing pressure is 60kgf/cm 2 , the hot pressing temperature is 150°C, and the hot pressing time is 1 hour; the surface hardness (Shore D hardness) of the flat structure ranges from 70 to 92; the flat structure is used for makeup The interior is filled with decorative panels made of materials.
TW109210267U 2020-08-07 2020-08-07 Eco-friendly lightweight Bakelite phenolic structure made by recycling and reusing phenolic waste material TWM611086U (en)

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