TW202239492A - Laminated structure of bakelite novolac waste and fiberboards and its manufacturing method easily making up for deficiencies of uneven distribution or poor strength in structure - Google Patents

Abstract

Disclosed are a laminated structure of bakelite novolac waste and fiberboards and its manufacturing method. A multilayer composite panel is formed by interlacing and alternatively connecting bakelite novolac materials and the fiberboards, such that the whole panel has higher structural strength. The bakelite novolac materials are formed by mixing novolac waste powder (i.e. bakelite waste), fiber material powder (discarded fiber is preferred) and resin, and has a uniform structure and high strength. The fiberboards can have perforations to link an upper layer of the bakelite novolac material and a lower layer of the bakelite novolac material to achieve better strength. The laminated structure may easily make up for deficiencies of uneven distribution or poor strength in structure when only the discarded bakelite waste or the discarded fiber is used as a main structure in the prior art, and may be used as a plate used in processes of the printed circuit board industry and the copper foil substrate industry, and used as a novel environmentally-friendly bakelite board, a decoration and construction board, a furniture board, or an exterior wall for insulation.

Description

Layered structure of bakelite phenolic waste and fiberboard and its manufacturing method

The invention relates to the reuse of phenolic waste materials, in particular to a layered structure of bakelite phenolic waste materials and fiber boards and a manufacturing method thereof. It can effectively reuse phenolic type waste materials and reuse other types of fiber waste materials at the same time, so as to achieve the goal of recycling.

For thermosetting plastic products, there are almost only two final disposal methods: landfill and incineration. Numerous manufacturers expect manufacturers to recycle phenolic boards (commonly known as bakelite boards) after use while selling phenolic boards. Because phenolic bakelite is a thermosetting engineering plastic. It is characterized by high incineration temperature, and its high calorific value can easily cause damage to the furnace body of the incinerator, exceeding the designed calorific value of the incinerator. And reduce the willingness of collectors to collect such waste into most incinerators for final disposal.

Phenolic board (commonly known as bakelite board), raw materials are phenols and aldehydes, phenolic resin is made after polymerization, paper or cloth is used as carrier, impregnated with phenolic resin, dried, and hot-pressed. of thermosetting plastics. Phenolic materials (phenolic board or bakelite board) are widely used in the printed circuit board industry as a protective board for the upper and lower pads in the drilling and molding process to protect the product. Phenolic materials (phenolic board or bakelite board) are also widely used in insulation, heat insulation and other industries.

Generally, the used bakelite waste (or phenolic resin type waste) such as drilling, molding, or powder, edge material, etc., has been destroyed because the original geometric shape that can be used has been destroyed, so it can be used directly The way of using to achieve the benefit of reuse is not great. In order to effectively increase the availability of the final stage, if the above-mentioned bakelite waste is pulverized, ground, etc., the powder is refined, and the formed bakelite powder, because the original resin occupies most of the fiber holes in the microcosm, leads to the subsequent direct addition of resin , whether it is suppressed or not, its binding is very weak. It is easy to form giant cracks and cracks under slight force or even during the gluing process, which directly limits the way of reusing the end.

Since the above-mentioned products are easy to form obvious product defects such as cracks, holes, or insufficient strength when they are reshaped, and the deforestation of forests based on the needs of the global wood industry leads to a reduction in carbon dioxide capture, the present invention hopes to propose a method that will be discarded. The method of reusing phenolic waste (bakelite waste) can recycle the recycled phenolic engineering plastic waste, especially the waste phenolic boards after drilling, such as bakelite boards, bakelite strips, and bakelite. At the same time, it is used together with other discarded fiberboards after drilling, and a new type of material can be formed through a new and easy-to-use recycling method, which can obtain multiple benefits, which is different from traditional incineration and landfills. Environmental engineering final disposal method. To widely increase the characteristics of waste fiber recycling, and to achieve the goal of circular economy and the concept of environmental sustainability.

Therefore, the purpose of the present invention is to solve the above-mentioned problems in the conventional technology. The present invention proposes a layered structure of bakelite phenolic waste and fiberboard and its manufacturing method, which is to form a multi-layer structure by interlacing the bakelite phenolic material and fiberboard. Composite panels can make the entire panel have higher structural strength. The bakelite phenolic material is made by mixing phenolic waste powder (bakelite waste), fiber material powder (waste fiber is preferred) and resin, and has a uniform structure and high strength. The fiberboard can have perforations to connect the Bakelite phenolic material of the upper and lower layers to achieve better strength. In this case, acid or alkali can also be added in the manufacturing process of bakelite phenolic materials, so that phenolic waste (or bakelite waste) material) was further destroyed. After the original phenolic waste is eroded, the number of holes increases and it has the effect of dissolving fibers. Additional fiber materials can be added to make the Bakelite phenolic material structure more uniform.

In order to achieve the above object, the present invention proposes a method of reclaiming and reusing phenolic type waste and environmentally friendly bakelite phenolic material, comprising the following steps: Step A: crushing and pulverizing the waste phenolic polymeric material to form a powder; Step B : The wood fiber is crushed and powdered to form a powder; Step C: Then the powder of the waste phenolic polymer material is mixed with the powder of the wood fiber, and the weight ratio of the two mixing is in the range of 0.01 to 0.99; Step D: Then add resin, uniformly mix the powder of the waste phenolic polymer material, the powder of the wood fiber and the resin to obtain a bakelite phenolic material mixture; wherein the resin is mainly used to bond the powder of the waste phenolic polymer material and the wood Fiber powder; step E: Lay the bakelite phenolic material mixture and fiber boards in order in a mould, and then use one of hot pressing, cold pressing or foaming to make the bakelite phenolic material mixture form an electric The wood phenolic material layer, and the fiber board forms the fiber board layer, so as to obtain a flat plate structure in which the bakelite phenolic material layer and the fiber board layer are overlapped in an interlaced manner.

This case still proposes a layered structure of bakelite phenolic waste and fiberboard, which is a flat plate structure with a specific thickness and a specific geometric shape. The flat structure contains multiple layers of bakelite phenolic materials; the bakelite The phenolic material layer is formed by mixing waste phenolic polymer material, wood fiber and resin; in the bakelite phenolic material layer, the weight ratio of the powder of the waste phenolic polymer material and the powder of the wood fiber in the bakelite phenolic material layer It is in the range of 0.01 to 0.99, and the weight ratio of the resin in the bakelite phenolic material layer is greater than 0.01; and a plurality of fiberboard layers; wherein the plurality of bakelite phenolic material layers intersect with the plurality of fiberboard layers in sequence splicing.

The features and advantages of the present invention can be further understood from the following description, please refer to the accompanying drawings when reading.

1: flat structure

10: Bakelite phenolic material layer

11: Bakelite phenolic material agglomeration

20: fiberboard layer

21: perforation

30: Bakelite phenolic material mixture

40: fiber board

41: perforation

Fig. 1 shows the schematic diagram of the plate structure of this case.

Fig. 2 shows a schematic cross-sectional view of the direction A-A' of Fig. 1 .

FIG. 3 shows an exploded view of the components in FIG. 1 .

Fig. 4 shows a schematic diagram of another type of flat structure of the present case.

Fig. 5 shows a schematic diagram of another type of flat plate structure of the present case.

Fig. 6 shows a schematic diagram of another type of flat structure of the present case.

FIG. 7 shows a schematic diagram of another type of flat plate structure of the present case.

FIG. 8 shows a flow chart of the steps of the manufacturing method of the present invention.

FIG. 9 shows a schematic diagram of mold forming in the manufacturing method of the present case.

Fig. 10 shows another schematic diagram of mold forming in the manufacturing method of the present case.

Hereby, with regard to the structural composition of this case, and the effect and advantages that can be produced, in cooperation with the drawings, one of the preferred embodiments of this case is described in detail as follows.

The layered structure of the bakelite phenolic waste and the fiberboard of this case is a flat plate structure 1 with a specific thickness, which has a specific geometric shape, which can be rectangular or square (as shown in Figure 4), round Shape (as shown in Figure 5), rhombus (as shown in Figure 6), triangle (as shown in Figure 7) and other polygons of various shapes. As shown in Figure 1, the plate structure 1 of this case includes:

A plurality of Bakelite phenolic material layers 10 .

A plurality of fiber board layers 20; wherein the fiber board layer 20 can be environmental protection board, bakelite board, melamine board, melamine board, wood fiber board, wood pulp board, urea board and so on.

Wherein the plurality of bakelite phenolic material layers 10 and the plurality of fiber board layers 20 are sequentially cross-stacked.

As shown in Figures 2 and 3, the fiberboard layer 20 forms at least one perforation 21, the perforation 21 is filled with bakelite phenolic material agglomerates 11, and the bakelite phenolic material agglomerates 11 connect the upper and lower layers of the bakelite The phenolic material layer 10 makes the plate structure 1 stronger.

The bakelite phenolic material layer 10 and the bakelite phenolic material agglomerate 11 are both formed by mixing waste phenolic polymer material, wood fiber and resin.

Wherein in the bakelite phenolic material layer 10 and the bakelite phenolic material agglomerate 11, the weight ratio of the powder of the waste phenolic polymer material mixed with the powder of the wood fiber is in the range of 0.01 to 0.99, and the weight ratio of the resin Greater than 0.01.

Wherein the layer 10 of the bakelite phenolic material and the agglomerate 11 of the bakelite phenolic material may still contain a bridging agent.

Under the structure of this case, different pressures can be applied to the overall structure when the mold is formed, and different hardness can be obtained. Therefore, the board of this case can be made into various boards with practical purposes, which can be used in the printed circuit board industry, copper Drilling backing boards, top cover boards, desktop boards, cutting backing boards used in the foil substrate industry manufacturing process, or including but not limited to methods commonly used in bakelite, such as fixtures, jigs, spacers Thermal materials, insulation materials, and are applied as a new type of environmentally friendly bakelite board. It can also include but is not limited to be used as decorative and construction boards, such as plywood, plywood, wood core board, particle board, melamine board, fiberboard, foam board, floor, etc.; or for furniture boards; or for For external wall insulation and other purposes, it is regarded as a new type of phenolic bakelite material or as a recycled wood or material. Or recycled materials after mold, jig, injection, extrusion and other general plastic manufacturing processes. In addition, the characteristic of this recycled material is that it can be repeatedly remanufactured and recycled through the above-mentioned process. In turn, it can effectively reduce the environmental load and increase the service life of incinerators and landfill plants.

Figure 8 shows the manufacturing method of this case, including the following steps:

Step 100: Crushing and pulverizing the waste phenolic polymer material into a powder form. which the The particle size of the powder of the waste phenolic polymeric material can preferably be sieved to pass through a particle size in the range of 1 to 200 mesh, and can also be a combination of specific ratios of the above ranges.

Among them, the waste phenolic polymer material is bakelite waste, which can be taken from the phenolic upper cover, lower backing board, desktop board used in the mechanical drilling process of the printed circuit board manufacturing industry, or used in the cutting process of the copper foil substrate industry Cutting protection pad. However, the waste phenolic polymeric material is not limited to the sources of phenolic type waste mentioned above. It is mainly used as the recycling of phenolic polymer materials after industrial treatment.

Step 110: Crushing and pulverizing the wood fiber (that is, the waste wood pulp board material after the printed circuit board drilling process) into a powder form. The particle size of the wood fiber powder can preferably be sieved to pass through a particle size in the range of 1 to 200 mesh, and can also be a combination of specific ratios of the above ranges.

The wood fiber can be the backing board used in the mechanical drilling process of the printed circuit board manufacturing industry, waste wood pulp board, environmental protection board, or other types of fiber boards. The wood fiber can also be boards used in the decoration industry, construction industry, wood industry, and furniture industry, such as discarded plywood, plywood, wood core board, particle board, melamine board, fiberboard and other boards, but not limited to It can be a waste source, or a fresh fiber source, such as wood powder, sawdust, or agricultural waste, such as rice straw and bagasse. But it is not limited to all the wood fiber sources mentioned above. A more suitable source of wood fiber is waste wood pulp board or environmentally friendly board after the mechanical drilling process, or fresh wood powder.

Step 120: The powder of the waste phenolic polymeric material is then mixed with the powder of the wood fiber. The mixing weight ratio of the two can range from 0.01 to 0.99 (that is, the powder of the waste phenolic polymer material/the powder of the wood fiber ranges from 0.01 to 0.99), but it is not limited to this range.

Step 130: Then add an appropriate amount of resin, and use a homogenizer to uniformly mix the powder of the waste phenolic polymer material, the powder of the wood fiber, and the resin to obtain the mixture 30 of the bakelite phenolic material. Wherein the resin is mainly used to bond the powder of the waste phenolic polymer material and the powder of the wood fiber end. The higher the proportion of the resin, the better the degree of adhesion. For example, 1kg of waste phenolic polymer powder is mixed with 1kg of wood fiber powder and then 1kg of resin is added.

Wherein the resin may be solid or liquid, preferably solid. The resin can be resin types such as phenolic resin, urea-formaldehyde resin, epoxy resin, acrylic resin, polyester resin, melamine resin, or a mixture thereof. Wherein the resin is preferably phenolic resin. When the resin is a phenolic resin, the molar ratio (F/P ratio) of formaldehyde to phenol in the phenolic resin is preferably in the range of 0.1:1 to 3.0:1. More specifically, a solid phenolic resin with a molar ratio of formaldehyde to phenol in the range of 0.1:1 to 1.0:1 is preferred. Or a liquid phenolic resin with a molar ratio of formaldehyde to phenol in the range of 1.0:1 to 3.0:1 is preferred. Or a mixture of the aforementioned two types of resins or states in any combination ratio.

After the resin is added in step 130, a bridging agent can be further added to form a three-dimensional structure.

Step 140: Laying the bakelite phenolic material mixture 30 and the fiber board 40 alternately in the mold 2 in sequence, as shown in FIG. 9 . Then apply hot pressing, cold pressing or foaming wherein a kind of mode makes this bakelite phenolic material mixture 30 form the bakelite phenolic material layer 10, and this fiber plate 40 forms the fiber plate layer 20, and obtains by this bakelite phenolic material layer 10 and the fiber plate layer 20 are interlaced and stacked to form a flat plate structure 1 .

Wherein the fiber board can be environmental protection board, bakelite board, melamine board, melamine board, wood fiber board, wood pulp board, urea board and so on.

Therefore, the application of different molds in this case can make the plate structure 1 have different fixed geometric shapes, such as polygons of various shapes such as rectangle, square, circle, rhombus, and triangle.

Wherein in step 140, perforation 41 can be formed in this fiber board 40, so that bakelite phenolic material The mixture 30 can be filled into the through hole 41 to form a bakelite phenolic material agglomerate 11 to connect the upper and lower layers of the bakelite phenolic material layer 10 , as shown in FIG. 10 .

However, the production process of forming the plate structure 1 in the above-mentioned step 140 is not intended to limit the scope of this case. For example, after applying appropriate pressure, heat press at an appropriate temperature for a period of time to obtain the solidified flat plate structure 1 . Preferably, the surface hardness (Shore D) of the flat structure 1 is between 60 and 92. Generally, the pressure is in the range of 0.01kg/cm2 to 300kg/cm2, and the temperature is higher than room temperature. The longer the hot pressing time, the harder the obtained flat structure 1 is.

Wherein in step 100, after the waste phenolic polymer material is crushed and pulverized, it can be soaked in an acidic or alkaline solution, so that the surface of the waste phenolic polymer material is eroded, or cracked into finer powder, which mainly The purpose is to increase the coagulation force combined with the resin in subsequent steps. Wherein the acidic or alkaline solution includes but not limited to strong acid, strong base, weak acid, weak base and other aqueous solutions, can be but not limited to hydrochloric acid, sulfuric acid, hydrofluoric acid, nitric acid, aqua regia, sodium hydroxide aqueous solution, potassium hydroxide aqueous solution, calcium hydroxide aqueous solution, magnesium hydroxide aqueous solution and other acid-base aqueous solutions. The weight concentration of the acidic or alkaline solution is within the concentration range of 0.1% to 99% aqueous solution. This case can carry out above-mentioned immersion procedure as required, or also can not immerse.

For example, the powder of the waste phenolic polymer material is soaked in an appropriate amount of strong alkali sodium hydroxide solution (concentration is 10%, w/w), and the strong alkali sodium hydroxide solution is flooded over the powder surface of the waste phenolic polymer material, to Perform surface damage. After 2 days, the strong alkali sodium hydroxide solution was leaked, and the waste phenolic polymer material powder was washed with water to a pH range of 7-9, and dried at 100°C.

The advantage of this case is that the laminated bakelite phenolic material and fiber boards are interlaced to form a multi-layer composite board, which can make the whole board have higher structural strength. The bakelite phenolic material is made of phenolic type waste It is made by mixing raw material powder (that is, bakelite waste), fiber material powder (waste fiber is better) and resin, and its structure is uniform and its strength is quite high. The fiberboard can have perforations to connect the Bakelite phenolic material of the upper and lower layers to achieve better strength.

To sum up, the humanized and thoughtful design of this case is quite in line with actual needs. Its specific improvement has existing deficiencies, and compared with the prior art, it has the advantage of breakthrough progress, and indeed has the enhancement of efficacy, and it is not easy to achieve. This case has not been published or disclosed in domestic and foreign literature and market, which is in compliance with the provisions of the patent law.

The above detailed description is a specific description of a feasible embodiment of the present invention, but this embodiment is not used to limit the patent scope of the present invention, and any equivalent implementation or change that does not depart from the technical spirit of the present invention shall be included in In the patent scope of this case.

1: flat structure

10: Bakelite phenolic material layer

20: fiberboard layer

Claims (15)

A kind of manufacture method of the layered structure of bakelite phenolic waste material and fiberboard, comprises the following steps: Step A: crushing and pulverizing waste phenolic polymer materials into powder; Step B: crushing and pulverizing the wood fiber to form a powder; Step C: then mixing the powder of the waste phenolic polymer material with the powder of the wood fiber, and the weight ratio of the two mixed is in the range of 0.01 to 0.99; Step D: Then add resin, uniformly mix the powder of the waste phenolic polymer material, the powder of the wood fiber and the resin to obtain a mixture of bakelite phenolic materials; wherein the resin is mainly used to bond the powder of the waste phenolic polymer material and powder of such wood fibers; Step E: Lay the mixture of bakelite phenolic material and fiber board in order in the mold, and then apply hot pressing, cold pressing or foaming to make the mixture of bakelite phenolic material form a layer of bakelite phenolic material , and the fiber board forms a fiber board layer, so as to obtain a flat plate structure in which the bakelite phenolic material layer and the fiber board layer are interlaced and laminated. The method as described in item 1 of the scope of the patent application, wherein in step E, a perforation is formed in the fiberboard, so that the bakelite phenolic material mixture can be filled into the perforation, and the bakelite phenolic material agglomerates are formed to connect The lower layer is the Bakelite phenolic material layer. The method described in Item 1 of the scope of the patent application, wherein in step A, the waste phenolic polymer material is crushed and powdered, and then soaked in an acidic or alkaline solution, so that the surface of the waste phenolic polymer material is subjected to Erosion, or cracking into finer powder. The method described in item 1 or 2 of the scope of the patent application, wherein in step E, after pressing with an appropriate pressure, heat pressing at an appropriate temperature for a period of time to obtain the solidified flat plate structure; wherein the The pressure is in the range of 0.01kg/cm2 to 300kg/cm2, and the temperature is greater than room temperature; the longer the hot pressing time, the harder the solid material obtained. The method described in item 3 of the scope of the patent application, wherein the acidic or alkaline solution is selected from hydrochloric acid, sulfuric acid, hydrofluoric acid, nitric acid, aqua regia, aqueous sodium hydroxide solution, aqueous potassium hydroxide solution, aqueous calcium hydroxide solution, hydrogen Acid-base aqueous solution such as magnesium oxide aqueous solution. The method described in item 1 or 2 of the scope of application, wherein after adding the resin in step D, a bridging agent is added to form a three-dimensional structure. The method as described in item 1 or 2 of the scope of the patent application, wherein the waste phenolic polymer material is selected from bakelite waste, phenolic upper cover board, lower backing board, desktop board, Or the cutting protection pad used in the cutting process of the copper foil substrate industry. The method as described in item 1 or 2 of the scope of the patent application, wherein the wood fiber is selected from the backing board used in the mechanical drilling process of the printed circuit board manufacturing industry, waste wood pulp board, environmental protection board, or decoration or furniture board , or fresh fiber sources, wood flour, wood chips, or agricultural waste; when the wood fiber is agricultural waste, it is selected from rice straw and bagasse. The method as described in item 1 or 2 of the scope of patent application, wherein the resin is selected from phenolic resin, urea-formaldehyde resin, epoxy resin, acrylic resin, polyester resin, melamine resin, or a mixture of the aforementioned resins. The method described in item 1 of the scope of the patent application, wherein in step E, the fiber board is selected from environmental protection board, bakelite board, melamine board, melamine board, wood fiber board, wood pulp board, and urea board. A layered structure of bakelite phenolic waste and fiberboard is a flat structure with a specific thickness and a specific geometric shape. The flat structure includes: A plurality of bakelite phenolic material layers; wherein the bakelite phenolic material layer is made of waste phenolic polymer material, Wood fiber and resin are mixed; in the bakelite phenolic material layer, the weight ratio of the powder of the waste phenolic polymer material and the powder of the wood fiber in the bakelite phenolic material layer is in the range of 0.01 to 0.99, and the The weight ratio of the resin in the bakelite phenolic material layer is greater than 0.01; and A plurality of fiber board layers; wherein the plurality of bakelite phenolic material layers and the plurality of fiber board layers are sequentially cross-bonded. The layered structure of bakelite phenolic waste and fiberboard as described in item 11 of the patent scope, wherein the fiberboard layer forms at least one perforation, the perforation is filled with bakelite phenolic material agglomerates, and the bakelite phenolic material is agglomerated The bakelite phenolic material layer connecting the upper and lower layers; wherein the bakelite phenolic material agglomerate is mixed with waste phenolic polymer material, wood fiber and resin; wherein in the bakelite phenolic material agglomerate, the bakelite phenolic material The weight ratio of the agglomerated waste phenolic polymer material powder and the wood fiber powder is in the range of 0.01 to 0.99, and the weight ratio of the resin agglomerated by the bakelite phenolic material is greater than 0.01. The layered structure of bakelite phenolic waste and fiberboard as described in item 11 of the scope of patent application, wherein the shape of the flat plate structure is selected from rectangle, square, circle, rhombus, and triangle. The layered structure of bakelite phenolic waste and fiberboard as described in item 11 of the scope of patent application, wherein the fiberboard layer is selected from environmental protection boards, bakelite boards, melamine boards, melamine boards, wood fiber boards, wood pulp boards, Urea plates and more. The layered structure of bakelite phenolic waste and fiberboard as described in item 12 of the scope of application, wherein the layer of bakelite phenolic material and the agglomeration of the bakelite phenolic material still contain a bridging agent.

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