TWM615147U - Automated machine for disassembly type powder atomic layer deposition device - Google Patents

Abstract

The present model provides an automated machine for a detachable powder atomic layer deposition device, which mainly includes an atomic layer deposition operation area, a detachable powder atomic layer deposition device, a vacuum chamber placement area and a conveying device. The vacuum chamber of the type powder atomic layer deposition device can be detached or connected to the shaft sealing device. The conveying device can convey the vacuum cavity from the vacuum cavity placement area to the atomic layer deposition operation area, and fix the vacuum cavity on the shaft seal device to perform atomic layer deposition on the powder in the vacuum cavity. The vacuum chamber after the deposition can be removed by the shaft sealing device, and the vacuum chamber can be transported to the vacuum chamber placement area through the conveying device to perform the automated powder atomic layer deposition process.

Description

Automated machine platform of detachable powder atomic layer deposition device

This model relates to an automated machine for a detachable powder atomic layer deposition device. The vacuum chamber is moved between the atomic layer deposition operation area and the vacuum chamber placement area through a conveying device, and the powder atomization can be carried out in an automated manner. Layer deposition process.

Nanoparticles are generally defined as particles smaller than 100 nanometers in at least one dimension. Nanoparticles and macroscopic substances have completely different physical and chemical properties. Generally speaking, the physical properties of macroscopic matter have nothing to do with its size, but nanoparticle is not the case. Nanoparticles have potential applications in the fields of biomedicine, optics, and electronics.

Quantum dots (Quantum Dot) are semiconductor nano-particles. The currently studied semiconductor materials are II-VI materials, such as ZnS, CdS, CdSe, etc., of which CdSe has attracted the most attention. The size of quantum dots is usually between 2 and 50 nanometers. After the quantum dots are irradiated with ultraviolet light, the electrons in the quantum dots absorb energy and transition from the valence band to the conduction band. When the excited electron returns from the conduction band to the valence band, it releases energy through light emission.

The energy gap of a quantum dot is related to the size. The larger the size of the quantum dot, the smaller the energy gap, and will emit light with a longer wavelength after irradiation. The smaller the size of the quantum dot, the larger the energy gap, and the wavelength will be emitted after irradiation. Shorter light. For example, quantum dots of 5 to 6 nanometers will emit orange or red light, while quantum dots of 2 to 3 nanometers will emit blue or green light. Of course, the light color depends on the material composition of the quantum dots.

Light-emitting diodes (LEDs) using quantum dots can produce light close to a continuous spectrum, and at the same time have high color rendering properties, and help to improve the luminous quality of the light-emitting diodes. In addition, the wavelength of the emitted light can be adjusted by changing the size of the quantum dots, making the quantum dots the focus of the development of a new generation of light-emitting devices and displays.

Although quantum dots have the above-mentioned advantages and characteristics, they are prone to agglomeration during the application or manufacturing process. In addition, quantum dots have high surface activity and are easy to react with air and moisture, thereby shortening the lifespan of quantum dots.

Specifically, when the quantum dots are made into a sealant for light-emitting diodes, agglomeration effect may occur, which reduces the optical performance of the quantum dots. In addition, after quantum dots are made into the sealant of light-emitting diodes, external oxygen or moisture may still pass through the sealant and contact the surface of the quantum dots, causing the quantum dots to oxidize and affect the quantum dots and light-emitting diodes. The effectiveness or service life of the product. Surface defects and dangling bonds of quantum dots may also cause nonradiative recombination, which also affects the luminous efficiency of quantum dots.

At present, the industry mainly uses atomic layer deposition (ALD) to form a nano-thick film on the surface of quantum dots, or form multiple layers of thin films on the surface of quantum dots to form a quantum well structure.

Atomic layer deposition can form a thin film with uniform thickness on the substrate, and can effectively control the thickness of the thin film. In theory, it is also suitable for three-dimensional quantum dots. When the quantum dots are placed on the carrier plate, there will be contact points between adjacent quantum dots, so that the precursor gas deposited by the atomic layer cannot contact these contact points, and it is impossible to form a uniform thickness on the surface of all nano particles.的膜。 The film.

In order to solve the above-mentioned problems faced by the prior art, the present invention proposes an automated machine for a detachable powder atomic layer deposition device, which can move the vacuum chamber between the atomic layer deposition operation area and the vacuum chamber placement area through the conveying device, and The powder atomic layer deposition process can be carried out in an automated manner.

An object of the present invention is to provide an automated machine for a detachable powder atomic layer deposition device, which mainly includes at least one atomic layer deposition operation area, at least one vacuum chamber placement area, a detachable powder atomic layer deposition device, and At least one conveying device. The detachable powder atomic layer deposition device includes a driving unit, a shaft sealing device and a vacuum chamber, wherein the driving unit is connected to the shaft sealing device and is located in the atomic layer deposition operation area.

The vacuum chamber can be fixed on the shaft sealing device or removed from the shaft sealing device, and the removed vacuum chamber can be transported between the atomic layer deposition operation area and the vacuum chamber placement area through the conveying device. The conveying device can convey the vacuum chamber to the atomic layer deposition operation area, and fix the vacuum chamber on the shaft sealing device. Then the driving unit can drive the vacuum chamber to rotate through the shaft sealing device, and perform atomic layer deposition on the powder in the vacuum chamber. In addition, the vacuum chamber that completes the atomic layer deposition process can be unloaded from the shaft sealing device, and the unloaded vacuum chamber can be transported to the vacuum chamber placement area through the conveying device.

An object of the present invention is to provide an automated machine for a detachable powder atomic layer deposition device, which mainly uses a robotic arm to transport a vacuum chamber between at least one atomic layer deposition operation area and at least one vacuum chamber placement area to Improve the efficiency and convenience of the powder atomic layer deposition process.

An object of the present invention is to provide an automated machine for a detachable powder atomic layer deposition device, which mainly surrounds a transport area with a plurality of operating areas, wherein the operating area includes at least one atomic layer deposition operating area and at least one The vacuum chamber is placed in the area, and the robotic arm is placed in the conveying area. The robot arm located in the conveying area can rotate relative to each work area to align it In one operation area, it is used to transport the vacuum chamber between the atomic layer deposition operation area and the vacuum chamber placement area of each operation area, which is beneficial to reduce and increase the volume of the automatic machine of the detachable powder atomic layer deposition device. Work efficiency.

In order to achieve the above purpose, the present invention proposes an automated machine for a detachable powder atomic layer deposition device, which includes: at least one atomic layer deposition operation area; at least one detachable powder atomic layer deposition device, including: a shaft seal device; A driving unit connected to the shaft sealing device, wherein the shaft sealing device and the driving unit are located in the atomic layer deposition operation area; a vacuum chamber is fixed on the shaft sealing device through at least one connecting unit, and the vacuum chamber includes a cover plate and a cavity The cover plate is used to cover the cavity, and a reaction space is formed between the two to contain a plurality of powders. The driving unit drives the vacuum cavity to rotate through the shaft sealing device. After the connection unit is unlocked, the vacuum cavity The body is unloaded by the shaft sealing device; at least one air extraction pipeline is located in the shaft sealing device, fluidly connected to the reaction space of the vacuum chamber, and used to extract a gas in the reaction space; at least one air inlet pipeline is located in the shaft sealing device , Fluidly connected to the reaction space of the vacuum chamber and used to transport a precursor gas or a non-reactive gas to the reaction space; and at least one vacuum chamber placement area for placing the vacuum chamber; and at least one transport device for To transport the vacuum chamber between the vacuum chamber placement area and the atomic layer deposition operation area.

In the automated machine of the detachable powder atomic layer deposition device, the vacuum chamber placement area includes a vacuum chamber feed placement area and a vacuum chamber discharge placement area, and the conveying device is used for placing in the vacuum chamber The vacuum chamber is transported between the feed placement area, the vacuum chamber discharge placement area and the atomic layer deposition operation area.

The automatic machine of the detachable powder atomic layer deposition apparatus includes a disassembly device for unlocking the connection unit, so that the vacuum chamber is separated from the shaft seal device, or for fastening the connection unit to make the vacuum The cavity is fixed on the shaft sealing device.

In the automatic machine platform of the detachable powder atomic layer deposition device, the disassembly device is arranged on the conveying device.

In the automatic machine of the detachable powder atomic layer deposition device, the shaft sealing device includes an outer tube body and an inner tube body, the outer tube body includes an accommodating space for accommodating the inner tube body, and the inner tube The body includes at least one connecting space for accommodating an air extraction line and an air intake line, and the driving unit is connected to the vacuum chamber through the outer tube body and drives the vacuum chamber to rotate.

In the automated machine of the detachable powder atomic layer deposition device, a bottom of the vacuum chamber includes a recess, and the recess extends from the bottom of the vacuum chamber to the reaction space for accommodating the inner part of the protruding shaft seal device. A tube body and a protruding tube part is formed in the reaction space.

The automated machine of the detachable powder atomic layer deposition apparatus includes a filter unit located in the recess of the vacuum chamber, and the air suction line and the air inlet line are fluidly connected to the reaction space of the vacuum chamber through the filter unit.

The automatic machine platform of the detachable powder atomic layer deposition device includes a conveying area and a plurality of work areas, and the plural work areas are arranged around the conveying area, wherein the work area includes the atomic layer deposition work area and the vacuum chamber Placement area, and the conveying device is set in the conveying area.

The automatic machine platform of the detachable powder atomic layer deposition device includes at least one feeding and discharging zone adjacent to the conveying zone, and a conveying device in the conveying zone is used for conveying the vacuum chamber between the feeding and discharging zone and the operation zone.

The automatic machine of the detachable powder atomic layer deposition device includes a plurality of operation areas, a carrier and at least one slide rail, wherein the operation area includes an atomic layer deposition operation area and a vacuum chamber placement area, and a plurality of operations The zones are arranged along the guide rails, and the conveying device is connected to the guide rails through the carrier, and is displaced along the guide rails to convey the vacuum chamber between the plurality of work zones.

1: Automated machine for detachable powder atomic layer deposition device

10: Detachable powder atomic layer deposition device

100: Automated machine for detachable powder atomic layer deposition device

101: Atomic layer deposition operation area

102: work area

103: Vacuum chamber placement area

1031: Vacuum chamber feed placement area

1033: Vacuum chamber discharge placement area

105: Conveyor

107: Conveying area

109: In and out of the material area

11: Vacuum chamber

111: cover

1111: inner surface

112: connection unit

113: Cavity

115: monitor wafer

117: bottom

119: Concave

12: reaction space

121: powder

13: Shaft seal device

130: protruding tube

131: Outer tube body

132: accommodating space

133: inner tube body

134: Connecting Space

14: Gear

15: drive unit

16: Disassemble the device

171: Extraction line

173: intake line

175: Stirred gas pipeline

177: heater

179: temperature sensing unit

181: Stage

183: Rail

[Figure 1] is a schematic side view of an embodiment of an automatic machine of the new detachable powder atomic layer deposition device.

[Figure 2] is a three-dimensional schematic diagram of an embodiment of the new detachable powder atomic layer deposition apparatus.

[Figure 3] is a schematic cross-sectional view of an embodiment of the new detachable powder atomic layer deposition device.

[Figure 4] is an exploded cross-sectional schematic diagram of an embodiment of the new detachable powder atomic layer deposition device.

[Figure 5] is a schematic cross-sectional view of an embodiment of the shaft sealing device of the novel detachable powder atomic layer deposition device.

[Fig. 6] is a schematic diagram of the action of an embodiment of the automatic machine of the new detachable powder atomic layer deposition apparatus.

[Fig. 7] is a schematic diagram of the action of another embodiment of the automatic machine of the new detachable powder atomic layer deposition apparatus.

[Fig. 8] is a schematic diagram of the action of another embodiment of the automatic machine of the new detachable powder atomic layer deposition apparatus.

[Figure 9] is a schematic cross-sectional exploded view of another embodiment of the new detachable powder atomic layer deposition device.

[Figure 10] is a top view of another embodiment of the automated machine of the new detachable powder atomic layer deposition device.

[Figure 11] is a top view of another embodiment of the automated machine of the new detachable powder atomic layer deposition device.

Please refer to Figure 1, which is a side view of an embodiment of the automatic machine of the new detachable powder atomic layer deposition device. Figures 2, 3, 4 and 5 are respectively the new detachable powder atomic layer deposition device The three-dimensional schematic diagram, the cross-sectional schematic diagram, the cross-sectional exploded schematic diagram and the cross-sectional schematic diagram of the shaft sealing device of the detachable powder atomic layer deposition device.

The automated machine 100 of the detachable powder atomic layer deposition apparatus mainly includes at least one atomic layer deposition operation area 101, at least one detachable powder atomic layer deposition apparatus 10, at least one vacuum chamber placement area 103, and at least one conveying device 105 , Wherein the conveying device 105 can be a robotic arm, and is used to move between the atomic layer deposition operation area 101 and the vacuum chamber placement area 103, for example, the atomic layer deposition operation area 101 and the vacuum chamber placement area 103 can be left and right or up and down Adjacent, of course, the neighbourhood here is not immediately adjacent, and there may be gaps or other components between the atomic layer deposition operation area 101 and the vacuum chamber placement area 103.

Please refer to FIGS. 2 to 5 together. The detachable powder atomic layer deposition apparatus 10 mainly includes a vacuum chamber 11, a shaft sealing device 13 and a driving unit 15. The driving unit 15 is connected to the vacuum chamber 11 through the shaft sealing device 13 , And drive the vacuum chamber 11 to rotate.

The vacuum cavity 11 has a reaction space 12 for accommodating a plurality of powders 121. The powders 121 may be Quantum Dots, such as II-VI semiconductor materials such as ZnS, CdS, and CdSe, which are formed in the quantum dots. The above film can be aluminum oxide (Al2O3). In an embodiment of the present invention, the vacuum chamber 11 may include a cover 111 and a cavity 113, wherein an inner portion of the cover 111 The surface 1111 is used to cover the cavity 113 and form a reaction space 12 therebetween. Of course, the vacuum chamber 11 including the cover 111 and the cavity 113 is only an embodiment of the present invention, and is not a limitation of the scope of rights of the present invention.

In an embodiment of the present invention, a monitoring wafer 115 may be disposed on the inner surface 1111 of the cover 111, and when the cover 111 covers the cavity 113, the monitoring wafer 115 will be located in the reaction space 12. When atomic layer deposition is performed in the reaction space 12, a thin film is formed on the surface of the monitoring wafer 115. In actual application, the film thickness on the surface of the monitoring wafer 115 and the film thickness on the surface of the powder 121 can be further measured, and the relationship between the two can be calculated. Then, the film thickness on the surface of the monitoring wafer 115 can be measured to calculate the film thickness on the surface of the powder 121.

In an embodiment of the present invention, the shaft sealing device 13 includes an outer tube body 131 and an inner tube body 133, wherein the outer tube body 131 has a accommodating space 132, and the inner tube body 133 has a connecting space 134, for example The outer tube body 131 and the inner tube body 133 may be hollow cylindrical bodies. The accommodating space 132 of the outer tube body 131 is used for accommodating the inner tube body 133, wherein the outer tube body 131 and the inner tube body 133 are coaxially arranged.

The shaft sealing device 13 may be a common shaft seal or a magnetic fluid shaft seal, and is mainly used to isolate the reaction space 12 of the vacuum chamber 11 from the external space, so as to maintain the vacuum of the reaction space 12.

The driving unit 15 is dynamically connected to the vacuum chamber 11 through the outer tube body 131, and drives the vacuum chamber 11 to rotate through the outer tube body 131. In addition, the driving unit 15 is not connected to the inner tube body 133, so when the driving unit 15 drives the outer tube body 131 and the vacuum chamber 11 to rotate, the inner tube body 133 will not rotate with it.

The driving unit 15 can drive the outer tube 131 and the vacuum chamber 11 to continuously rotate in the same direction, for example, to continuously rotate clockwise or counterclockwise. In different embodiments, the driving unit 15 can drive the outer tube body 131 and the vacuum chamber 11 to rotate a specific angle in a clockwise direction, and then rotate in a counter-clockwise direction. The direction of the needle rotates by a specific angle, for example, the specific angle may be 360 degrees. When the vacuum chamber 11 rotates, it will agitate the powder 121 in the reaction space 12 to facilitate contact between the powder 121 and the precursor gas.

In an embodiment of the present invention, the driving unit 15 may be a motor, which is connected to the outer tube body 131 through at least one gear 14 and drives the outer tube body 131 and the vacuum chamber 11 to rotate relative to the inner tube body 133 via the gear 14.

At least one gas extraction pipeline 171, at least one gas inlet pipeline 173, at least one stirring gas delivery pipeline 175, a heater 177 and/or a temperature sensing unit 179 are fluidly connected to the reaction space 12 of the vacuum chamber 11, as shown in FIGS. 3 to Shown in Figure 5. In an embodiment of the present invention, the air extraction line 171, the air intake line 173, the stirring gas delivery line 175, the heater 177 and/or the temperature sensing unit 179 may be provided in the shaft sealing device 13, for example, in the shaft sealing device 13 of the inner tube body 133 in the connecting space 134.

The gas extraction line 171 is fluidly connected to the reaction space 12 of the vacuum chamber 11 and is used to extract gas in the reaction space 12 so that the reaction space 12 is in a vacuum state for subsequent atomic layer deposition processes. Specifically, the pumping line 171 can be connected to a pump, and the gas in the reaction space 12 can be pumped out through the pump.

The gas inlet line 173 is fluidly connected to the reaction space 12 of the vacuum chamber 11, and is used to transport a precursor or a non-reactive gas to the reaction space 12, where the non-reactive gas can be an inert gas such as nitrogen or argon. For example, the gas inlet line 173 may be connected to a precursor storage tank and a non-reactive gas storage tank through the valve assembly, and the precursor gas can be transported into the reaction space 12 through the valve assembly, so that the precursor gas is deposited on the surface of the powder 121. In practical applications, the gas inlet line 173 may transport a carrier gas and precursor gas into the reaction space 12 together. Then the non-reactive gas is delivered into the reaction space 12 through the valve assembly to remove the precursor gas in the reaction space 12 body. In an embodiment of the present invention, the gas inlet pipeline 173 can be connected to a plurality of branch pipelines, and different precursor gases can be sequentially delivered into the reaction space 12 through each branch pipeline.

In addition, the flow rate of the non-reactive gas delivered by the gas inlet line 173 to the reaction space 12 can be increased, and the powder 121 in the reaction space 12 can be blown through the non-reactive gas, so that the powder 121 is driven by the non-reactive gas and diffuses into the reaction space. 12 various areas.

In an embodiment of the present invention, the gas inlet line 173 may include at least one agitated gas delivery line 175 fluidly connected to the reaction space 12 of the vacuum chamber 11, and is used to deliver non-reactive gases to the reaction space 12, for example, the agitated gas delivery line 175 A nitrogen storage tank can be connected through the valve assembly, and nitrogen can be delivered to the reaction space 12 through the valve assembly. The non-reactive gas is used to blow the powder 121 in the reaction space 12, and cooperate with the driving unit 15 to drive the vacuum chamber 11 to rotate, which can effectively and uniformly stir the powder 121 in the reaction space 12, and is beneficial to the powder 121 in each powder 121. A thin film of uniform thickness is deposited on the surface.

The gas inlet pipeline 173 and the agitated gas delivery pipeline 175 of the detachable powder atomic layer deposition apparatus 10 are both used to deliver the non-reactive gas to the reaction space 12, and the flow rate of the non-reactive gas delivered by the inlet pipeline 173 is relatively small. It is used to remove the precursor gas in the reaction space 12, and the flow rate of the non-reactive gas delivered by the agitating gas delivery line 175 is relatively large, and it is mainly used to blow the powder 121 in the reaction space 12.

Specifically, the time points at which the gas inlet line 173 and the agitated gas delivery line 175 transport the non-reactive gas to the reaction space 12 are different. Therefore, in practical applications, the agitated gas delivery line 175 may not be provided, and the inlet line 173 can be adjusted at different times. The flow rate of non-reactive gas delivered at a point. When removing the precursor gas in the reaction space 12, the gas inlet line 173 can be reduced to be transported to the reaction space 12 When the powder 121 in the reaction space 12 is to be blown, the flow rate of the non-reactive gas delivered to the reaction space 12 by the gas inlet line 173 is increased.

In an embodiment of the present invention, a filter unit 139 may be provided at one end of the inner tube 133 connected to the reaction space 12, wherein the suction line 171, the inlet line 173 and/or the agitated gas delivery line 175 are fluidly connected to the reaction space via the filter unit 139. The space 12, and the gas in the reaction space 12 is extracted through the filter unit 139. The filtering unit 139 is mainly used to filter the powder 121 in the reaction space 12 to prevent the powder 121 from entering the air extraction line 171 during the air extraction process, which would cause the loss of the powder 121.

The heater 177 is used to heat the connection space 134 and the inner tube body 133, and heat the air extraction line 171, the air inlet line 173 and/or the agitated gas delivery line 175 in the inner tube body 133 through the heater 177 to improve the air extraction line 171. The temperature of the gas in the gas inlet pipeline 173 and/or the agitated gas delivery pipeline 175. For example, the temperature of the non-reactive gas and/or the precursor gas delivered by the gas inlet line 173 to the reaction space 12 can be increased, and the temperature of the non-reactive gas delivered by the agitated gas delivery line 175 to the reaction space 12 can be increased. When non-reactive gases and/or precursor gases enter the reaction space 12, the temperature of the reaction space 12 will not drop or change significantly. In addition, the temperature of the heater 177 or the connecting space 134 can be measured by the temperature sensing unit 179 to know the working state of the heater 177. Of course, another heating device is usually arranged inside, outside or around the vacuum cavity 11, wherein the heating device is adjacent to or in contact with the vacuum cavity 11 and is used to heat the vacuum cavity 11 and the reaction space 12.

When the driving unit 15 drives the outer tube body 131 and the vacuum chamber 11 to rotate, the inner tube body 133 and the internal air suction line 171, the air inlet line 173 and/or the agitated gas delivery line 175 will not rotate with it, and is beneficial to The non-reactive gas and precursor gas are stably delivered to the reaction space 12.

The vacuum chamber 11 and the shaft sealing device 13 of the detachable powder atomic layer deposition apparatus 10 of the present invention are two independent components, wherein the vacuum chamber 11 is connected through at least one connecting unit 112 And fixed on one end of the shaft sealing device 13, for example, the connecting unit 112 can be a screw, a cylinder joint, a buckle mechanism, a tenon, a quick release device, a thread, and other components with detachable and fixed functions, and can be used to connect the vacuum chamber 11 and shaft sealing device 13. After the locking of the connecting unit 112 is released, the vacuum chamber 11 can be removed from the shaft sealing device 13.

In an embodiment of the present invention, a detaching device 16 can be used to release the locking of the connecting unit 112, so that the vacuum chamber 11 is separated from the shaft sealing device 13, or the connecting unit 112 is fastened so that the vacuum chamber 11 is locked in轴封装置13上。 Shaft sealing device 13 on. For example, when the connecting unit 112 is a screw, the disassembling device 16 may be a screwdriver that is automatically disassembled. The screwdriver is connected to a motor, and the screwdriver is driven by the motor to remove or lock the screw. In practical applications, the disassembly device 13 can be set on the conveying device 105. For example, the conveying device 105 can be a robotic arm and a screwdriver can be set on the robotic arm. The robotic arm can use the screwdriver to transport the vacuum chamber 11 Remove or tighten the screws.

In the embodiment of the present invention, the shaft sealing device 13 and/or the driving unit 15 are fixed in the atomic layer deposition operation area 101, and the conveying device 105 can drive the unloaded vacuum chamber 11 in the atomic layer deposition operation area 101 and the vacuum chamber. Displacement between the body placement areas 103. In an embodiment of the present invention, the atomic layer deposition work area 101 and the vacuum chamber placement area 103 are not adjacent. For example, a plurality of deposition work areas 101 may be placed in the same area, and a plurality of vacuum chamber placement areas 103 may be placed in the same area. Placed centrally in another area. The above two areas can be arranged up and down, and the vacuum chamber 11 is transported between the deposition operation area 101 and the vacuum chamber placement area 103 of the two areas through the transport device 105 to reduce the footprint of the machine.

Please refer to Fig. 1 and Fig. 6 to Fig. 8. The actions of Fig. 1 and Fig. 6 to Fig. 8 do not have a certain sequence. In an embodiment of the present invention, the conveying device 105 is used to clamp the vacuum The vacuum cavity 11 in the cavity placement area 103, wherein the vacuum cavity 11 has not undergone an atomic layer deposition process, as shown in FIG. 6.

The conveying device 105 conveys the vacuum chamber 11 from the vacuum chamber placement area 103 to the atomic layer deposition operation area 101, and connects the vacuum chamber 11 and the shaft sealing device 13 in the atomic layer deposition operation area 101 through the connecting unit 112. The driving unit 15 can drive the vacuum chamber 11 to rotate via the shaft sealing device 13 to perform atomic layer deposition on the powder in the vacuum chamber 11, as shown in FIG. 7.

After the atomic layer deposition of the powder is completed, the vacuum chamber 11 can be removed from the shaft sealing device 13, for example, the connection unit 112 is unlocked, and the atomic layer deposition of the vacuum chamber 11 is removed from the atomic layer through the conveying device 105. The layer deposition operation area 101 is transported to the vacuum chamber placement area 103, as shown in FIG. 8.

In an embodiment of the present invention, the number of the vacuum chamber placement area 103 may be plural. For example, the vacuum chamber placement area 103 may include at least one vacuum chamber feed placement area 1031 and at least one vacuum chamber discharge placement area 1033, and the conveying device 105 is used to convey the vacuum chamber 11 between the vacuum chamber feed placement area 1031, the vacuum chamber discharge placement area 1033, and the atomic layer deposition operation area 101, as shown in FIGS. 1 and 7. The conveying device 105 can convey the vacuum chamber 11 that has completed the atomic layer deposition from the atomic layer deposition operation area 101 to one of the vacuum chamber placement areas 103, such as the vacuum chamber discharge placement area 1033, and then place the other vacuum chamber. The vacuum chamber 11 in the area 103 (for example, the vacuum chamber feeding and placing area 1031) that has not been subjected to the atomic layer deposition operation moves to the atomic layer deposition operation area 101.

In actual application, the powder 121 in the vacuum chamber 11 needs a process time for atomic layer deposition, and the conveying device 105 can transport another vacuum chamber 11 that has not undergone atomic layer deposition to the vacuum chamber during this process time. The placement area 103 is, for example, a vacuum chamber feeding placement area 1031. When the conveying device 105 takes the vacuum chamber 11 that has completed the atomic layer deposition from the atomic layer deposition operation area 101 After exiting, the vacuum chamber 11 in the vacuum chamber placement area 103 or the vacuum chamber feed placement area 1031 can be transported to the atomic layer deposition operation area 101, and the vacuum chamber 11 can be connected to the shaft sealing device 13.

In another embodiment of the present invention, as shown in FIG. 9, the bottom 117 of the vacuum chamber 11 may be provided with a recess 119, wherein the recess 119 extends from the bottom 117 of the vacuum chamber 11 into the reaction space 12, and the shaft sealing device The inner tube 133 of the 13 extends from the accommodating space 132 of the outer tube 131 to the outside, and protrudes from the shaft sealing device 13 and the outer tube 131. When connecting the vacuum chamber 11 and the shaft sealing device 13, the inner tube 133 protruding from the shaft sealing device 13 can be inserted into the recess 119, and the vacuum chamber 11 and the shaft sealing device 13 are connected through the connecting unit 112, so that the inner tube 133 and The concave portion 119 forms a protruding pipe portion 130 in the reaction space 12. In addition, the filter unit 139 may be disposed in the recess 119 of the vacuum chamber 11.

The arrangement of the protruding pipe 130 can shorten or adjust the distance between the gas inlet pipe 173 and/or the stirring gas delivery pipe 175 and the cover 111, so that the gas inlet pipe 173 and/or the stirring gas delivery pipe 175 can be transported to the reaction space. The non-reactive gas 12 can be transferred to the inner surface 1111 of the cover plate 111 and diffuse to various areas of the reaction space 12 through the inner surface 1111 of the cover plate 111 to facilitate blowing the powder 121 in the reaction space 12.

In an embodiment of the present invention, as shown in FIG. 10, the automated machine 1 of the detachable powder atomic layer deposition apparatus may include a conveying area 107, a plurality of atomic layer deposition operation areas 101, and a plurality of vacuum chamber placement areas 103, wherein the conveying device 105 is arranged in the conveying area 107, and a plurality of atomic layer deposition operation areas 101 and a plurality of vacuum chamber placement areas 103 are arranged around the conveying area 107 so as to pass through a single conveying device 105 in multiple The vacuum chamber 11 is transported between one atomic layer deposition operation area 101 and a plurality of vacuum chamber placement areas 103.

Specifically, the adjacent atomic layer deposition operation area 101 and the vacuum chamber placement area 103 can be defined as the operation area 102, and a plurality of operation areas 102 are arranged around the conveying area 107. lose The conveying device 105 can rotate in the conveying area 107 and face each work area 102 to convey the vacuum chamber 11 between the atomic layer deposition work area 101 and the vacuum chamber placement area 103 of each work area 102, or in each work area 102. The vacuum chamber 11 is transported between the work areas 102.

In another embodiment of the present invention, as shown in FIG. 10, the automated machine 1 of the detachable powder atomic layer deposition apparatus may include at least one feeding and discharging zone 109, wherein the feeding and discharging zone 109 is adjacent to the conveying zone 107. The conveying device 105 can convey the vacuum chamber 11 in the feeding and discharging area 109 to the atomic layer deposition operation area 101 or the vacuum chamber placement area 103 in one of the operation areas 102, or to deposit the atomic layer in any operation area 102 The vacuum chamber 11 in the work area 101 or the vacuum chamber placement area 103 is transported to the material feeding and discharging area 109.

In another embodiment of the present invention, as shown in FIG. 11, a plurality of work areas 102 can be connected in series, and the conveying device 105 is arranged on at least one guide rail 183 via a carrier 181. Specifically, a plurality of work areas 102 can be arranged along the guide rails 183, wherein the conveying device 105 can be displaced along the guide rails 183 and used to clamp and transport the vacuum chambers 11 in each work area 102, for example, in each work area 102 The vacuum chamber 11 is transported between the atomic layer deposition work area 101 and the vacuum chamber placement area 103, or the vacuum chamber 11 is transported between each work area 102. In different embodiments, the working areas 102 in series can be provided on both sides of the guide rail 183, and the conveying device 105 is connected to the carrier 181 through a rotating shaft and can rotate relative to the carrier 181 to take the two sides of the guide rail 183. The vacuum chamber 11 in the work area 102.

The above is only one of the preferred embodiments of the present invention, and is not intended to limit the scope of implementation of the present invention, that is, all the equivalent changes and changes in the shape, structure, characteristics and spirit described in the scope of the patent application of the present invention Modifications should be included in the scope of the patent application for this new model.

10: Detachable powder atomic layer deposition device

100: Automated machine for detachable powder atomic layer deposition device

101: Atomic layer deposition operation area

103: Vacuum chamber placement area

105: Conveyor

11: Vacuum chamber

13: Shaft seal device

Claims (10)

An automated machine for a detachable powder atomic layer deposition device, including: at least one atomic layer deposition operation area; at least one detachable powder atomic layer deposition device, including: a shaft sealing device; a driving unit connected to the shaft sealing device , Wherein the shaft sealing device and the driving unit are located in the atomic layer deposition operation area; a vacuum chamber is fixed on the shaft sealing device through at least one connecting unit, the vacuum chamber includes a cover plate and a cavity, the The cover plate is used to cover the cavity and form a reaction space between the two to contain a plurality of powders. The drive unit drives the vacuum cavity to rotate through the shaft sealing device. After the connection unit is unlocked , The vacuum chamber is unloaded by the shaft sealing device; at least one gas extraction pipeline located in the shaft sealing device, fluidly connected to the reaction space of the vacuum chamber, and used to extract a gas in the reaction space; at least one The gas inlet line is located in the shaft seal device, is fluidly connected to the reaction space of the vacuum chamber, and is used to deliver a precursor gas or a non-reactive gas to the reaction space; and at least one vacuum chamber placement area is used To place the vacuum cavity; and at least one conveying device for conveying the vacuum cavity between the vacuum cavity placement area and the atomic layer deposition operation area. The automated machine of the detachable powder atomic layer deposition apparatus according to claim 1, wherein the vacuum chamber placement area includes a vacuum chamber feed placement area and a vacuum chamber discharge placement area, and the conveying device It is used to transport the vacuum cavity between the vacuum cavity feeding and placing area, the vacuum cavity discharging and placing area and the atomic layer deposition operation area. The automated machine of the detachable powder atomic layer deposition apparatus according to claim 1, including a detaching device for unlocking the connecting unit, so that the vacuum chamber is separated from the shaft sealing device, or for Fasten the connection unit so that the vacuum chamber is fixed on the shaft sealing device. The automated machine of the detachable powder atomic layer deposition apparatus according to claim 3, wherein the disassembling device is provided on the conveying device. The automated machine of the detachable powder atomic layer deposition apparatus according to claim 1, wherein the shaft sealing device includes an outer tube body and an inner tube body, and the outer tube body includes an accommodating space for accommodating the The inner tube body includes at least one connecting space for accommodating the suction line and the air inlet line. The driving unit connects to the vacuum chamber through the outer tube body and drives the vacuum chamber to rotate . The automated machine of the detachable powder atomic layer deposition apparatus according to claim 5, wherein a bottom of the vacuum chamber includes a recess, and the recess extends from the bottom of the vacuum chamber to the reaction space for The inner tube body protruding from the shaft sealing device is accommodated, and a protruding tube part is formed in the reaction space. The automated machine of the detachable powder atomic layer deposition apparatus according to claim 6, including a filter unit located in the recess of the vacuum chamber, and the air suction line and the air inlet line are fluidly connected through the filter unit The reaction space of the vacuum chamber. The automated machine of the detachable powder atomic layer deposition apparatus according to claim 1, including a conveying area and a plurality of working areas, the plurality of working areas are arranged around the conveying area, wherein the working area includes the atom The layer deposition operation area and the vacuum chamber placement area, and the conveying device is arranged in the conveying area. The automated machine of the detachable powder atomic layer deposition apparatus according to claim 8, including at least one feeding and discharging zone adjacent to the conveying zone, and the conveying device in the conveying zone is used for moving in the feeding and discharging zone and the conveying zone. The vacuum chamber is transported between work areas. The automated machine of the detachable powder atomic layer deposition apparatus according to claim 1, including a plurality of work areas, a carrier and at least one slide rail, wherein the work area includes the atomic layer deposition work area and the vacuum chamber In the body placement area, the plurality of work areas are arranged along the guide rail, and the conveying device is connected to the guide rail through the carrier, and is displaced along the guide rail to transport the vacuum cavity between the plurality of work areas.

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