TWI775543B - Powder atomic layer deposition equipment with quick release function - Google Patents

Abstract

The invention provides a powder atomic layer deposition equipment with quick release function, which includes a vacuum chamber, a shaft sealing device and a driving unit, wherein the driving unit is connected to the shaft sealing device. The vacuum chamber is connected to the shaft sealing device, and a enclosed space is formed between the vacuum chamber and the shaft sealing device. At least one air extraction pipeline is located in the shaft sealing device and is fluidly connected to the enclosed space. The air extraction pipeline is used to extract gas from the enclosed space to fix the vacuum chamber on the shaft sealing device so that the drive unit drive the vacuum chamber rotating via the shaft sealing device to facilitate the formation of a thin film of uniform thickness on the surface of the powder. After the air extraction pipeline stops pumping, the vacuum chamber can be quickly unloaded from the shaft seal device to improve the process efficiency and convenience in use.

Description

Powder atomic layer deposition equipment with quick release function

The present invention relates to a powder atomic layer deposition equipment with quick-release function, which can quickly remove the vacuum chamber from the shaft sealing device, or fix the vacuum chamber on the shaft sealing device.

Nanoparticles are generally defined as particles smaller than 100 nanometers in at least one dimension that are physically and chemically distinct from macroscopic substances. In general, the physical properties of macroscopic substances are independent of their size, but this is not the case for nanoparticles, which have potential applications in fields such as biomedicine, optics, and electronics.

Quantum Dot (Quantum Dot) is a nanoparticle of semiconductor material. The currently studied semiconductor materials are II-VI materials, such as ZnS, CdS, CdSe, etc. Among them, CdSe has attracted the most attention. The size of quantum dots is usually between 2 and 50 nanometers. When the quantum dots are irradiated with ultraviolet light, the electrons in the quantum dots absorb energy and transition from the valence band to the conduction band. Excited electrons release energy by emitting light as they travel from the conduction band back to the valence band.

The energy gap of quantum dots is related to the size. The larger the size of the quantum dot, the smaller the energy gap, and it will emit light with a longer wavelength after irradiation. The smaller the size of the quantum dot, the larger the energy gap, and the wavelength will be emitted after irradiation. shorter light. For example, quantum dots of 5 to 6 nanometers will emit orange or red light, while quantum dots of 2 to 3 nanometers will emit blue or green light. Of course, the light color depends on the material composition of the quantum dots.

Light emitting diodes (LEDs) using quantum dots produce light close to a continuous spectrum, and at the same time have high color rendering properties, which are beneficial to improve the luminous quality of light emitting diodes. In addition, the wavelength of the emitted light can be adjusted by changing the size of the quantum dots, making the quantum dots become the focus of the development of the new generation of light-emitting devices and displays.

Although quantum dots have the above-mentioned advantages and characteristics, they are prone to agglomeration in the process of application or manufacture. In addition, quantum dots have high surface activity and easily react with air and water vapor, thereby shortening the life of quantum dots.

Specifically, when quantum dots are used as sealants for light-emitting diodes, agglomeration effects may occur, reducing the optical properties of quantum dots. In addition, after the quantum dots are made into the sealant of the light-emitting diodes, the external oxygen or moisture may still pass through the sealant and contact the surface of the quantum dots, resulting in oxidation of the quantum dots and affecting the quantum dots and light-emitting diodes. performance or service life. Defects and dangling bonds on the surface of quantum dots may also cause non-radiative recombination, which also affects the luminous efficiency of quantum dots.

At present, the industry mainly uses atomic layer deposition (ALD) to form a nanometer-thick film on the surface of the quantum dot, or to form a multi-layer film on the surface of the quantum dot to form a quantum well structure.

Atomic layer deposition can form a thin film with uniform thickness on the substrate, and can effectively control the thickness of the thin film. It is also suitable for three-dimensional quantum dots in theory. When the quantum dots are placed on the carrier plate, there will be contact points between adjacent quantum dots, so that the precursor gas of atomic layer deposition cannot contact these contact points, and it is impossible to form uniform thickness on the surface of all nanoparticles. film.

Generally speaking, the atomic layer deposition usually needs to be performed in a vacuum environment, so the structure of the atomic layer deposition apparatus is usually relatively thick and has a certain weight, which is not convenient for users to carry and operate. To this end, the present invention provides a powder atomic layer deposition equipment with a quick-release function. After the powder atomic layer deposition process is completed, the vacuum chamber can be quickly removed from the shaft sealing device and/or the drive unit, which is convenient for users to take out. Powder inside the vacuum chamber and clean the vacuum chamber.

An object of the present invention is to provide a powder atomic layer deposition equipment with quick release function, which mainly includes a driving unit, a shaft sealing device and a vacuum chamber, wherein the driving unit can be connected to the shaft sealing device, or can be connected by the shaft sealing device Remove on top. After the atomic layer deposition process is completed, the vacuum chamber can be detached from the shaft sealing device, so that the user can take out the powder in the vacuum chamber and clean the vacuum chamber, so as to improve the convenience in use.

An object of the present invention is to provide a powder atomic layer deposition equipment with quick release function, which mainly controls the connection state between the shaft seal device and the vacuum chamber by pumping or venting through a pumping line, eliminating the need for screw locks. The trouble of fixing the vacuum chamber and the shaft sealing device is eliminated, and the convenience of disassembling or installing the vacuum chamber on the shaft sealing device can be greatly improved.

An object of the present invention is to provide a powder atomic layer deposition equipment with a quick-release function, which can remove the vacuum chamber and powder after the atomic layer deposition process is completed from the shaft sealing device, and install another vacuum chamber loaded with powder from the shaft sealing device. The body is locked on the shaft sealing device, and the atomic layer deposition of powder is carried out, which is beneficial to improve the efficiency of the process.

In order to achieve the above-mentioned purpose, the present invention provides a powder atomic layer deposition equipment with a quick-release function, comprising: a driving unit; a shaft sealing device connected to the driving unit; a vacuum chamber connected to the shaft sealing device and connected to the shaft sealing device A closed space is formed between the vacuum chamber and the vacuum chamber, wherein the vacuum chamber includes a reaction space for accommodating a plurality of powders, and the drive unit drives the shaft through the shaft sealing device The vacuum chamber rotates; at least one first sealing ring and at least one second sealing ring are located between the shaft sealing device and the vacuum chamber, and the closed space is located between the first sealing ring and the second sealing ring; at least one first sealing ring An air extraction line is located in the shaft sealing device and is fluidly connected to the closed space, wherein the air extraction line is used to extract a gas in the closed space and fix the vacuum cavity on the shaft sealing device; and at least one air intake line is located in the closed space. In the shaft sealing device, the reaction space of the vacuum chamber is fluidly connected and used for delivering a precursor gas to the reaction space.

The powder atomic layer deposition equipment with quick-release function includes a second exhaust line located in the shaft sealing device and fluidly connected to the reaction space of the vacuum chamber.

The powder atomic layer deposition equipment with quick-release function, wherein the shaft sealing device includes an outer tube body and an inner tube body, the outer tube body includes an accommodating space for accommodating the inner tube body, and the inner tube body is At least one connecting space is included for accommodating the first air suction line and the air intake line.

The powder atomic layer deposition equipment with quick-release function, wherein the first sealing ring is located between the inner pipe body and the vacuum chamber, the second sealing ring is located between the outer pipe body and the vacuum chamber, and the first sealing ring is A dynamic seal ring, and the second seal ring is a static seal ring.

In the powder atomic layer deposition equipment with quick-release function, the driving unit is connected to the vacuum chamber through the outer tube body, and drives the vacuum chamber to rotate.

The powder atomic layer deposition equipment with quick-release function, wherein a bottom of the vacuum chamber includes a concave portion for accommodating the inner tube body of the protruding shaft seal device, and the inner tube body of the protruding shaft seal device is located at the bottom of the vacuum chamber body. A closed space is formed between it and the concave part of the vacuum chamber.

In the powder atomic layer deposition equipment with quick release function, the concave portion extends from the bottom of the vacuum chamber to the reaction space, and forms a protruding tube portion.

The powder atomic layer deposition equipment with quick-release function further includes a filter unit located in the concave portion of the vacuum chamber, and the inlet line is fluidly connected to the reaction space of the vacuum chamber through the filter unit.

In the powder atomic layer deposition equipment with quick-release function, the air inlet pipeline is used for conveying a non-reactive gas to the reaction space, and blowing the powder in the reaction space through the non-reactive gas.

The powder atomic layer deposition equipment with quick-release function, wherein the gas inlet pipeline includes at least one non-reactive gas delivery pipeline located in the shaft sealing device, fluidly connected to the reaction space of the vacuum chamber, and used to deliver the non-reactive gas to the vacuum The reaction space of the cavity to blow the powder in the reaction space.

10: Powder atomic layer deposition equipment with quick release function

11: Vacuum chamber

111: Cover

1111: inner surface

112: Bottom

113: Cavity

114: Recess

115: Monitor Wafers

12: Reaction Space

121: Powder

13: Shaft seal device

130: protruding pipe

131: outer tube body

132: accommodating space

133: inner tube body

134: Connect Space

139: Filter unit

14: Gear

15: Drive unit

16: Confined space

161: The first sealing ring

163: Second sealing ring

171: First pumping line

172: Extension tube body

1721: Air vent

173: Intake line

175: Non-reactive gas delivery line

177: Heater

179: Second pumping line

FIG. 1 is a three-dimensional schematic diagram of an embodiment of the powder atomic layer deposition apparatus with quick release function of the present invention.

2 is a schematic cross-sectional view of an embodiment of the powder atomic layer deposition apparatus with quick release function of the present invention.

3 is an exploded cross-sectional schematic diagram of an embodiment of the powder atomic layer deposition apparatus with quick release function of the present invention.

4 is a schematic cross-sectional view of an embodiment of the shaft sealing device of the powder atomic layer deposition equipment with quick release function of the present invention.

5 is a schematic cross-sectional view of another embodiment of the powder atomic layer deposition apparatus with quick release function of the present invention.

6 is a schematic cross-sectional view of another embodiment of the powder atomic layer deposition apparatus with quick release function of the present invention.

FIG. 7 is a cross-sectional exploded schematic diagram of another embodiment of the powder atomic layer deposition apparatus with quick-release function of the present invention.

Please refer to FIG. 1 , FIG. 2 , FIG. 3 and FIG. 4 , which are a three-dimensional schematic diagram, a cross-sectional schematic diagram, a cross-sectional exploded schematic diagram, and a powder atomic layer deposition device with a quick-release function of an embodiment of the present invention, respectively. Schematic cross-section of the shaft sealing device of the deposition apparatus. As shown in the figure, the powder atomic layer deposition apparatus 10 with quick release function mainly includes a vacuum chamber 11 , a shaft sealing device 13 and a driving unit 15 , wherein the driving unit 15 is connected through the shaft sealing device 13 and drives the vacuum chamber 11 turn.

The vacuum chamber 11 has a reaction space 12 for accommodating a plurality of powders 121, wherein the powders 121 can be quantum dots (Quantum Dot), such as ZnS, CdS, CdSe and other II-VI semiconductor materials, and formed in the quantum dots The film on the top can be aluminum oxide (Al2O3). The vacuum chamber 11 may include a cover plate 111 and a cavity 113 , wherein an inner surface 1111 of the cover plate 111 is used to cover the cavity 113 and form the reaction space 12 therebetween.

In an embodiment of the present invention, a monitoring wafer 115 may be disposed on the inner surface 1111 of the cover plate 111 . When the cover plate 111 covers the cavity 113 , the monitoring wafer 115 will be located in the reaction space 12 . During the atomic layer deposition in the reaction space 12 , a thin film is formed on the surface of the monitoring wafer 115 . In practical applications, the film thickness on the surface of the monitoring wafer 115 and the film thickness on the surface of the powder 121 can be further measured and monitored degree, and calculate the relationship between the two. Then, the film thickness on the surface of the wafer 115 can be monitored and measured, and the film thickness on the surface of the powder 121 can be converted.

The shaft sealing device 13 includes an outer tube body 131 and an inner tube body 133, wherein the outer tube body 131 has an accommodating space 132, and the inner tube body 133 has a connecting space 134, such as the outer tube body 131 and the inner tube body 133 can be a hollow cylinder. The accommodating space 132 of the outer tube body 131 is used for accommodating the inner tube body 133 , wherein the outer tube body 131 and the inner tube body 133 are coaxially arranged. The shaft seal device 13 may be a common shaft seal or a magnetic fluid shaft seal, and is mainly used to isolate the reaction space 12 of the vacuum chamber 11 from the external space, so as to maintain the vacuum of the reaction space 12 .

The driving unit 15 is connected to one end of the shaft sealing device 13 , and drives the vacuum chamber 11 to rotate through the shaft sealing device 13 .

The driving unit 15 can be connected to and drive the outer tube body 131 and the vacuum chamber 11 to continuously rotate in the same direction, for example, clockwise or counterclockwise. In different embodiments, the driving unit 15 can drive the outer tube 131 and the vacuum chamber 11 to rotate clockwise by a specific angle, and then rotate counterclockwise by a specific angle, for example, the specific angle can be 360 degrees. When the vacuum chamber 11 rotates, the powder 121 in the reaction space 12 is stirred, so that the powder 121 is heated uniformly and contacts with the precursor gas or the non-reactive gas.

In an embodiment of the present invention, the driving unit 15 can be a motor, connected to the outer tube body 131 through at least one gear 14 , and drives the outer tube body 131 and the vacuum chamber 11 to rotate relative to the inner tube body 133 through the gear 14 .

The connecting space 134 of the inner pipe body 133 may be provided with at least one first gas extraction line 171 , at least one inlet gas pipeline 173 , at least one non-reactive gas delivery line 175 , a heater 177 and/or a second gas extraction line 179 , as shown in Figure 2 and Figure 4.

The vacuum chamber 11 and the shaft sealing device 13 of the present invention are two independent components, wherein the vacuum chamber 11 can be removed from the shaft sealing device 13 , or the vacuum chamber 11 can be fixed on the shaft sealing device 13 . When the vacuum chamber 11 is connected to the shaft sealing device 13 , a sealed space 16 is formed between the two. For example, the sealed space 16 can be an annular body and surround the shaft sealing device 13 . The first exhaust line 171 is fluidly connected to the closed space 16 and is used to extract the gas in the closed space 16 , or to transport the gas to the closed space 16 .

The second pumping line 179 is fluidly connected to the reaction space 12 of the vacuum chamber 11, and is used for pumping out the gas in the reaction space 12, so that the reaction space 12 is in a vacuum state, so that the atomic layer deposition process can be performed. Specifically, the second pumping line 179 can be connected to a pump, and the gas in the reaction space 12 can be pumped out through the pump.

The gas inlet line 173 is fluidly connected to the reaction space 12 of the vacuum chamber 11, and is used for delivering a precursor gas or a non-reactive gas to the reaction space 12, wherein the non-reactive gas can be an inert gas such as nitrogen or argon. For example, the inlet line 173 can be connected to a precursor gas storage tank and a non-reactive gas storage tank through the valve assembly, and the precursor gas can be transported into the reaction space 12 through the valve assembly, so that the precursor gas is deposited on the surface of the powder 121 . In practical applications, the gas inlet line 173 may transport a carrier gas and the precursor gas into the reaction space 12 together. Then, the non-reactive gas is transported into the reaction space 12 through the valve assembly, and is evacuated through the second exhaust line 179 to remove the precursor gas in the reaction space 12 . In an embodiment of the present invention, the intake line 173 can be connected to a plurality of branch pipelines, and different precursor gases can be sequentially transported into the reaction space 12 through each branch pipeline.

In addition, the inlet line 173 can increase the flow rate of the non-reactive gas delivered to the reaction space 12, and blow the powder 121 in the reaction space 12 through the non-reactive gas, so that the powder 121 is driven by the non-reactive gas and diffuses into the reaction space 12 of the various areas.

In an embodiment of the present invention, the gas inlet line 173 may include at least one non-reactive gas delivery line 175 that is fluidly connected to the reaction space 12 of the vacuum chamber 11 and used to deliver a non-reactive gas to the reaction space 12 , such as a non-reactive gas The delivery line 175 can be connected to a nitrogen storage tank through the valve assembly, and the nitrogen is conveyed to the reaction space 12 through the valve assembly. The non-reactive gas is used to blow the powder 121 in the reaction space 12 , and cooperates with the driving unit 15 to drive the vacuum chamber 11 to rotate, which can effectively and uniformly stir the powder 121 in the reaction space 12 and deposit thickness on the surface of each powder 121 uniform film.

Both the air inlet line 173 and the non-reactive gas delivery line 175 of the powder atomic layer deposition apparatus 10 with the quick-release function are used to deliver the non-reactive gas to the reaction space 12 , wherein the flow rate of the non-reactive gas delivered by the inlet line 173 is relatively small. , which is mainly used to remove the precursor gas in the reaction space 12 , and the flow rate of the non-reactive gas conveyed by the non-reactive gas transmission line 175 is relatively large, which is mainly used to blow the powder 121 in the reaction space 12 .

Specifically, the time points at which the gas inlet line 173 and the non-reactive gas delivery line 175 deliver the non-reactive gas to the reaction space 12 are different. Therefore, in practical applications, the non-reactive gas delivery line 175 may not be provided, and the gas inlet line 173 may be adjusted at The flow of non-reactive gas delivered at different time points. When the precursor gas in the reaction space 12 is to be removed, the gas inlet line 173 can be lowered to be transported to the reaction chamber When the powder 121 in the reaction space 12 is to be blown in response to the flow rate of the non-reactive gas in the space 12 , the flow rate of the non-reactive gas delivered to the reaction space 12 by the inlet line 173 is increased.

When the driving unit 15 of the present invention drives the outer tube body 131 and the vacuum chamber 11 to rotate, the inner tube body 133 and the first air extraction line 171 , the second air extraction line 179 , the air intake line 173 and/or the non-reaction The gas delivery line 175 does not rotate along with it, which is beneficial to improve the stability of the unreacted gas and/or the precursor gas delivered by the gas inlet line 173 and/or the non-reactive gas delivery line 175 to the reaction space 12 .

The heater 177 is used for heating the connecting space 134 and the inner pipe body 133, and through the heater 177 to heat the second exhaust line 179, the gas inlet line 173 and/or the non-reactive gas transmission line 175 in the inner pipe body 133, so as to improve the The temperature of the gas in the second evacuation line 179 , the inlet line 173 and/or the non-reactive gas delivery line 175 . When the non-reactive gas and/or the precursor gas is allowed to enter the reaction space 12 , the temperature of the reaction space 12 will not be greatly decreased or changed. In addition, a temperature sensing unit can also be arranged in the connection space 134 to measure the temperature of the heater 177 or the connection space 134 so as to know the working state of the heater 177 . Of course, another heating device is usually disposed inside, outside or around the vacuum chamber 11 , wherein the heating device is adjacent to or in contact with the vacuum chamber 11 and used to heat the vacuum chamber 11 and the reaction space 12 .

During the atomic layer deposition process, the reaction space 12 of the vacuum chamber 11 needs to maintain a vacuum state, so the structure of the vacuum chamber 11 is generally thicker and heavier. The shaft sealing device 13 is used to carry and drive the vacuum chamber 11 , and is also relatively thick and heavy. During operation, the user needs to remove the vacuum chamber 11 and the shaft sealing device 13 from the driving unit 15 together, so as to take out the powder 121 in the vacuum chamber 11 and clean the vacuum chamber 11 . As a result, not only will the user's It may also cause collisions during operation and cleaning, resulting in injury to the user or damage to the device.

In order to improve the above problems, the present invention designs the vacuum chamber 11 and the shaft sealing device 13 as two independent components. During atomic layer deposition, the vacuum chamber 11 can be connected to the shaft sealing device 13 , as shown in FIG. 2 , and a closed space 16 is formed between the vacuum chamber 11 and the shaft sealing device 13 . Then, the gas in the closed space 16 is extracted through the first exhaust line 171 , so that the closed space 16 is evacuated, so as to fix the vacuum chamber 11 on the shaft sealing device 13 , and the driving unit 15 can drive the vacuum chamber through the shaft sealing device 13 The body 11 rotates. When the vacuum chamber 11 is connected to the shaft sealing device 13 , the second evacuation line 179 , the gas inlet line 173 and/or the non-reactive gas delivery line 175 in the shaft sealing device 13 are fluidly connected to the reaction space 12 of the vacuum chamber 11 .

After the atomic layer deposition is completed, the vacuum of the sealed space 16 can be removed through the first evacuation line 171, for example, the gas is transported to the sealed space 16 through the first evacuation line 171, and then the vacuum chamber 11 can be removed from the shaft sealing device 13 to remove.

Through the powder atomic layer deposition apparatus 10 with quick release function of the present invention, the vacuum chamber 11 can be quickly removed from the shaft sealing device 13 , and another vacuum chamber 11 can be installed on the shaft sealing device 13 . In the process of disassembling and installing the vacuum chamber 11 , it is only necessary to extract the gas in the closed space 16 through the first pumping line 171 through the pump, or transport the gas to the closed space 16 through the first pumping line 171 , and The vacuum chamber 11 and the shaft sealing device 13 do not need to be locked by screws, which can greatly improve the speed and convenience of replacing the vacuum chamber 11 .

In an embodiment of the present invention, a plurality of sealing rings may be arranged between the shaft sealing device 13 and/or the vacuum chamber 11, wherein the sealed space 16 is located between the two sealing rings, and the sealed space 16 and the outside are isolated through the sealing ring surroundings. Specifically, the sealing ring includes a first sealing ring 161 and a second sealing ring 161 The sealing ring 163, when the vacuum chamber 11 is connected to the shaft sealing device 13, the vacuum chamber 11 and the shaft sealing device 13 will press the first sealing ring 161 and the second sealing ring 163 between them, and the first sealing ring A closed space 16 is formed between 161 and the second sealing ring 163 . As shown in FIG. 3 , the first sealing ring 161 is arranged on the vacuum chamber 11 , and the second sealing ring 163 is arranged on the shaft sealing device 13 .

In practical application, the first sealing ring 161 is located between the inner pipe body 133 and the vacuum chamber 11 , and the second sealing ring 163 is located between the outer pipe body 131 and the vacuum chamber 11 , wherein the first sealing ring 161 is a dynamic sealing ring, and the second sealing ring 163 is a static sealing ring. For example, the first sealing ring 161 can be sleeved on the inner tube body 133, and is a Teflon O-ring (Teflonoring), and the second sealing ring 163 is a rubber O-ring.

In an embodiment of the present invention, as shown in FIG. 3 , a concave portion 114 may be disposed on the bottom 112 of the vacuum chamber 11 , and a first sealing ring 161 is disposed in the concave portion 114 . The inner tube body 133 of the shaft sealing device 13 partially protrudes from the outer tube body 131 , and a second sealing ring 163 is provided on the side of the shaft sealing device 13 connected to the bottom 112 of the vacuum chamber 11 , or a protruding inner tube body 133 is provided. A second sealing ring 163 is sleeved thereon.

The cross-sectional area of the inner tube body 133 of the protruding shaft seal device 13 in the radial direction is slightly smaller than that of the concave portion 114 of the vacuum chamber 11 . The tube body 133 presses the first sealing ring 161 in the concave portion 114 , and the bottom 112 or the concave portion 114 of the vacuum chamber 11 presses the second sealing ring 163 provided on the shaft sealing device 13 to seal the protruding inner tube A closed space 16 is formed between the body 133 , the recess 114 , the first sealing ring 161 and/or the second sealing ring 163 . The above-mentioned number and arrangement position of the first sealing ring 161 , the second sealing ring 163 and/or the concave portion 114 are only a specific embodiment of the present invention, and are not intended to limit the scope of the present invention.

The first air extraction line 171 of the present invention is generally arranged along the axial direction of the shaft sealing device 13 and has branches or bends along the radial direction of the shaft sealing device 13 to protrude inside the shaft sealing device 13 . Tube An opening is formed on the side wall of the body 133 , so that the first exhaust line 171 is fluidly connected to the closed space 16 through the opening on the side wall of the inner pipe body 133 .

The powder atomic layer deposition apparatus 10 with quick release function of the present invention is also beneficial to improve the process efficiency of atomic layer deposition. Specifically, a plurality of vacuum chambers 11 may be prepared, and powders 121 may be placed in each of the vacuum chambers 11 . One of the vacuum chambers 11 is fixed on the shaft sealing device 13 , and atomic layer deposition is performed on the powder 121 in the vacuum chamber 11 . After the atomic layer deposition of the powder 121 is completed, the vacuum chamber 11 and the powder 121 are removed from the shaft sealing device 13 , and another vacuum chamber 11 is fixed on the shaft sealing device 13 . The powder 121 is subjected to an atomic layer deposition process. The removed vacuum chamber 11 can be placed in a cooling area, and after the temperature of the vacuum chamber 11 and the powder 121 drops, the powder 121 is taken out from the vacuum chamber 11 .

In an embodiment of the present invention, a filter unit 139 may be disposed at the bottom 112 of the vacuum chamber 11 , for example, the filter unit 139 may be disposed in the concave portion 114 of the vacuum chamber 11 . When the vacuum chamber 11 is connected to the shaft sealing device 13 , the filter unit 139 on the vacuum chamber 11 will cover the inner pipe body 133 of the shaft sealing device 13 , so that the second exhaust line 179 and the air intake line in the inner pipe body 133 173 and/or the non-reactive gas delivery line 175 is fluidly connected to the reaction space 12 of the vacuum chamber 11 via the filter unit 139 .

The arrangement of the filter unit 139 can prevent the powder 121 in the reaction space 12 from being sucked out together when the gas in the reaction space 12 is extracted by the second gas extraction line 179 , resulting in the loss of the powder 121 . In addition, arranging the filter unit 139 on the vacuum chamber 11 instead of on the shaft sealing device 13 can prevent the powder 121 from passing through the reaction space of the vacuum chamber 11 when the vacuum chamber 11 is removed from the shaft sealing device 13 . 12 scattered to the outside.

In an embodiment of the present invention, as shown in FIG. 5 , the gas inlet line 173 and/or the non-reactive gas delivery line 175 can extend from the connection space 134 of the inner pipe body 133 to the reaction space of the vacuum chamber 11 . The space 12 is formed, and an extension pipe 172 is formed in the reaction space 12 of the vacuum chamber 11 . At least one air outlet 1721 may be disposed on the end and/or the tube wall of the extension tube body 172 , and the extension tube body 172 may deliver the non-reactive gas to the reaction space 12 through the air outlet hole 1721 and blow the powder 121 in the reaction space 12 .

In an embodiment of the present invention, the concave portion 114 can extend from the bottom 112 of the vacuum chamber 11 into the reaction space 12 , and the inner tube 133 of the shaft sealing device 13 extends from the accommodating space 132 of the outer tube 131 to the outside. And the shaft sealing device 13 and the outer tube body 131 are protruded, as shown in FIG. 7 . When connecting the vacuum chamber 11 and the shaft sealing device 13, the inner tube body 133 protruding from the shaft sealing device 13 can be inserted into the recess 114, and a sealed space 16 is formed between the inner tube body 133 and the recess 114 of the vacuum chamber 11, As shown in Figure 6. In addition, the inner tube body 133 of the shaft sealing device 13 will extend from the accommodating space 132 of the outer tube body 131 to the concave portion 114 and/or the reaction space 12 of the vacuum chamber 11 , so that the inner tube body 133 and the concave portion 114 are in the reaction space 12 . A protruding pipe portion 130 is formed therein.

The distance between the inlet line 173 and/or the non-reactive gas delivery line 175 and the cover plate 111 can be shortened or adjusted through the arrangement of the protruding pipe portion 130, and the inlet line 173 and/or the non-reaction gas delivery line 175 are delivered to the reaction The non-reactive gas in the space 12 can be transmitted to the inner surface 1111 of the cover plate 111 and diffused to various regions of the reaction space 12 through the inner surface 1111 of the cover plate 111 to facilitate blowing the powder 121 in the reaction space 12 .

The above description is only a preferred embodiment of the present invention, and is not intended to limit the scope of the present invention. Modifications should be included within the scope of the patent application of the present invention.

10: Powder atomic layer deposition equipment with quick release function

11: Vacuum chamber

111: Cover

1111: inner surface

113: Cavity

115: Monitor Wafers

12: Reaction Space

121: Powder

13: Shaft seal device

131: outer tube body

132: accommodating space

133: inner tube body

134: Connect Space

14: Gear

15: Drive unit

16: Confined space

161: The first sealing ring

163: Second sealing ring

171: First pumping line

177: Heater

Claims (8)

A powder atomic layer deposition equipment with quick-release function, comprising: a driving unit; a shaft sealing device connected with the driving unit; a vacuum chamber body connected with the shaft sealing device and between the shaft sealing device and the vacuum chamber body A closed space is formed between, wherein the vacuum chamber includes a reaction space for accommodating a plurality of powders, and the driving unit drives the vacuum chamber to rotate through the shaft sealing device; at least one first sealing ring and at least one second A sealing ring is located between the shaft sealing device and the vacuum cavity, wherein the closed space is located between the first sealing ring and the second sealing ring; at least one first air suction line is located in the shaft sealing device, and fluidly connected to the closed space, wherein the first suction line is used to extract a gas in the closed space to fix the vacuum cavity on the shaft seal device; a second suction line is located in the shaft seal in the device, and fluidly connected to the reaction space of the vacuum chamber; and at least one inlet line, located in the shaft seal device, fluidly connected to the reaction space of the vacuum chamber, and used to deliver a precursor gas to the reaction space. The powder atomic layer deposition apparatus with quick-release function as claimed in claim 1, wherein the gas inlet line is used for delivering a non-reactive gas to the reaction space, and blowing the powder in the reaction space through the non-reactive gas . The powder atomic layer deposition equipment with quick release function as claimed in claim 2, wherein the gas inlet line comprises at least one non-reactive gas delivery line located in the shaft sealing device, fluidly connected to the reaction space of the vacuum chamber, and used for so as to deliver the non-reactive gas to the reaction space of the vacuum chamber to blow the powder in the reaction space. A powder atomic layer deposition equipment with quick-release function, comprising: a driving unit; a shaft sealing device connected with the driving unit; a vacuum chamber body connected with the shaft sealing device and between the shaft sealing device and the vacuum chamber body A closed space is formed between, wherein the vacuum chamber includes a reaction space for accommodating a plurality of powders, and the driving unit drives the vacuum chamber to rotate through the shaft sealing device; at least one first sealing ring and at least one second A sealing ring is located between the shaft sealing device and the vacuum chamber, wherein the closed space is located between the first sealing ring and the second sealing ring, wherein the first sealing ring is located between the inner tube and the vacuum chamber the second sealing ring is located between the outer tube body and the vacuum chamber, the first sealing ring is a dynamic sealing ring, and the second sealing ring is a static sealing ring; at least one first pump a gas line, located in the shaft sealing device, and fluidly connected to the closed space, wherein the first air suction line is used to extract a gas in the closed space to fix the vacuum chamber on the shaft sealing device; and At least one intake line is located in the shaft sealing device, fluidly connected to the reaction space of the vacuum chamber, and used to deliver a precursor gas to the reaction space, wherein the shaft sealing device includes an outer tube body and an inner tube body A pipe body, the outer pipe body includes an accommodating space for accommodating the inner pipe body, and the inner pipe body includes at least one connecting space for accommodating the first suction line and the air intake line. The powder atomic layer deposition device with quick release function as claimed in claim 4, wherein the driving unit is connected to the vacuum chamber through the outer tube, and drives the vacuum chamber to rotate. The powder atomic layer deposition equipment with quick release function as claimed in claim 4, wherein a bottom of the vacuum chamber includes a concave portion for accommodating the inner tube body protruding from the shaft sealing device, and when the protruding part is The sealed space is formed between the inner tube body of the shaft sealing device and the concave portion of the vacuum chamber. The powder atomic layer deposition apparatus with quick release function as claimed in claim 6, wherein the concave portion extends from the bottom of the vacuum chamber to the reaction space, and forms a protruding tube portion. The powder atomic layer deposition apparatus with quick release function as claimed in claim 6, further comprising a filter unit located in the recess of the vacuum chamber, and the intake line is fluidly connected to the vacuum chamber through the filter unit reaction space.

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