TWM611131U - Transparent powder atomic layer deposition device - Google Patents

Abstract

The invention provides a see-through powder atomic layer deposition device, which mainly includes a vacuum chamber, a shaft sealing device and a driving unit, wherein the driving unit is connected through the shaft sealing device and drives the vacuum chamber to rotate. The vacuum chamber includes a cover plate and a cavity, wherein the cavity is made of light-transmitting material, and a reaction space is formed between the cover plate and the cavity for accommodating powder. At least one air extraction line and at least one air intake line are arranged in the shaft sealing device, and are fluidly connected to the reaction space of the vacuum chamber. The cavity of the present invention is made of light-transmitting material. During the atomic layer deposition of powder, the user can clearly see the powder in the reaction space through the light-transmitting cavity and adjust the powder atomic layer deposition device. Operational variables.

Description

See-through powder atomic layer deposition device

The invention relates to a see-through powder atomic layer deposition device, which is convenient for users to observe the state of the powder in the reaction chamber and adjust the powder atomic layer deposition device during the powder atomic layer deposition process.

Nanoparticles are generally defined as particles smaller than 100 nanometers in at least one dimension. Nanoparticles and macroscopic substances have completely different physical and chemical properties. Generally speaking, the physical properties of macroscopic substances have nothing to do with their size, but nano particles are not the case. Nano particles have potential applications in biomedicine, optics, and electronics.

Quantum dots (Quantum Dot) are semiconductor nano-particles. The currently studied semiconductor materials are II-VI materials, such as ZnS, CdS, CdSe, etc., of which CdSe has attracted the most attention. The size of quantum dots is usually between 2 and 50 nanometers. After the quantum dots are irradiated with ultraviolet light, the electrons in the quantum dots will absorb energy and transition from the valence band to the conduction band. When the excited electron returns from the conduction band to the valence band, it releases energy through light emission.

The energy gap of a quantum dot is related to the size. The larger the size of the quantum dot, the smaller the energy gap, and will emit light with a longer wavelength after irradiation. The smaller the size of the quantum dot, the larger the energy gap, and the wavelength will be emitted after irradiation. Shorter light. For example, quantum dots of 5 to 6 nanometers emit orange or red light, while quantum dots of 2 to 3 nanometers emit blue or green light. Of course, the light color depends on the material composition of the quantum dots.

Light-emitting diodes (LEDs) using quantum dots produce light that can be close to a continuous spectrum, have high color rendering properties, and help improve the luminous quality of the light-emitting diodes. In addition, the wavelength of the emitted light can be adjusted by changing the size of the quantum dots, making the quantum dots the development focus of a new generation of light-emitting devices and displays.

Although quantum dots have the above-mentioned advantages and characteristics, they are prone to agglomeration during the application or manufacturing process. In addition, quantum dots have high surface activity, and easily react with air and water vapor, thereby shortening the lifespan of quantum dots.

Specifically, when the quantum dots are made into a sealant for light-emitting diodes, agglomeration effect may occur, which reduces the optical performance of the quantum dots. In addition, after quantum dots are made into the sealant of light-emitting diodes, external oxygen or moisture may still pass through the sealant and contact the surface of the quantum dots, causing the quantum dots to oxidize and affect the quantum dots and light-emitting diodes. The effectiveness or service life of the product. Surface defects and dangling bonds of quantum dots may also cause nonradiative recombination, which also affects the luminous efficiency of quantum dots.

At present, the industry mainly uses atomic layer deposition (ALD) to form a nanometer-thick film on the surface of quantum dots, or form a multilayer film on the surface of quantum dots to form a quantum well structure.

Atomic layer deposition can form a thin film with uniform thickness on the substrate, and can effectively control the thickness of the thin film. In theory, it is also suitable for three-dimensional quantum dots. When the quantum dots are placed on the carrier plate, there will be contact points between adjacent quantum dots, so that the precursor gas deposited by the atomic layer cannot contact these contact points, and it is impossible to form a uniform thickness on the surface of all nano particles.的膜。 The film.

During the powder atomic layer deposition process, users usually cannot clearly see the state of the powder in the reaction space. In order to solve the above-mentioned and the problems faced by the prior art, the present invention proposes a see-through powder atomic layer deposition device, which can fully agitate the powder during the atomic layer deposition process, so that the powder fills the entire reaction space of the vacuum chamber. In addition, the user can observe the state of the powder and the state of stirring through the see-through powder atomic layer deposition device, and adjust the operating variables of the powder atomic layer deposition device to facilitate the formation of a thin film of uniform thickness on the surface of the powder.

An object of the present invention is to provide a see-through powder atomic layer deposition device, which mainly includes a driving unit, a shaft sealing device and a vacuum chamber, wherein the driving unit is connected through the shaft sealing device and drives the vacuum chamber to rotate. The vacuum chamber includes a cover plate and a cavity, wherein the cover plate is used to cover the cavity, and a reaction space is formed between the two to contain the powder. The cavity of the present invention is made of light-transmitting material, and the user can observe the stirring situation and state of the powder in the reaction space through the light-transmitting cavity.

An object of the present invention is to provide a see-through powder atomic layer deposition device, which mainly includes a driving unit, a shaft sealing device and a vacuum chamber, wherein the vacuum chamber includes a cover and a cavity, and the cavity is composed of Made of translucent material. At least one connecting unit passes through the cover plate and is fixed on the shaft sealing device, so that the cavity is fixed between the cover plate and the shaft sealing device, and a reaction space is formed between the cover plate, the cavity and/or the shaft sealing device.

An object of the present invention is to provide a see-through powder atomic layer deposition device, wherein one side of the cavity is fixed on the shaft sealing device, and the cover fixing part is fixed on the other side of the cavity. The cover plate is fixed on the cover plate fixing part via at least one connecting unit, and a closed reaction space is formed between the cover plate, the cavity and/or the shaft sealing device. Through the arrangement of the cover plate fixing part, the connecting unit will not directly contact the cavity, and damage to the cavity can be avoided.

In order to achieve the above purpose, the present invention proposes a see-through powder atomic layer deposition device, including: a vacuum chamber, including a cover plate and a cavity, the cover plate covers the cavity, and is formed between the cover plate and the cavity A reaction space, in which the cavity is made of a light-transmitting material; a shaft sealing device connected to the vacuum chamber; a driving unit connected to the shaft sealing device, wherein the driving unit drives the vacuum chamber to rotate through the shaft sealing device; at least one pump The gas pipeline is fluidly connected to the reaction space of the vacuum chamber and used to extract a gas in the reaction space; and at least one gas inlet pipeline is fluidly connected to the reaction space of the vacuum chamber and used to transport a precursor or a non-reactive gas To the reaction space, the non-reactive gas is used to blow the powder in the reaction space.

In the see-through powder atomic layer deposition apparatus, the gas inlet pipeline includes at least one non-reactive gas delivery pipeline, which is fluidly connected to the reaction space of the vacuum chamber and is used to deliver the non-reactive gas to the reaction space of the vacuum chamber. Blow the powder in the reaction space.

The see-through powder atomic layer deposition device includes a heating device located around the cavity for heating the cavity and the reaction space.

In the see-through powder atomic layer deposition device, the heating device is a heating lamp tube.

The see-through powder atomic layer deposition device includes a cover plate fixing part connected to the cavity, and the cover plate is fixed on the cover plate fixing part through at least one connecting unit.

In the see-through powder atomic layer deposition device, the cavity is made of quartz.

The see-through powder atomic layer deposition device includes at least one connecting unit that passes through at least one perforation on the cover plate and is connected to at least one fixing hole of the shaft sealing device to fix the cavity on the cover plate and the shaft sealing device between.

In the see-through powder atomic layer deposition device, the vacuum chamber includes a fixing plate, the cavity is located between the cover plate and the fixing plate, and at least one connecting unit passes through at least one perforation on the cover plate and is connected to the fixing plate At least one fixing hole on the upper part to fix the cavity between the cover plate and the fixing plate.

In the see-through powder atomic layer deposition device, the fixing plate of the vacuum chamber is connected to the shaft sealing device through at least one fixing unit. When the fixing unit is removed or unlocked, the vacuum chamber is separated from the shaft sealing device.

In the see-through powder atomic layer deposition device, the shaft sealing device includes an outer tube body and an inner tube body, and the outer tube body has an accommodating space for accommodating the inner tube body, the air extraction line and the air inlet line It is located in the inner tube body, and the inner tube body extends from the accommodating space of the outer tube body to the reaction space of the vacuum chamber and forms a protruding tube part.

10: see-through powder atomic layer deposition device

11: Vacuum chamber

111: cover

1111: inner surface

1113: Piercing

112: Monitoring wafer

113: Cavity

115: cover fixing part

117: connection unit

119: fixed plate

1191: fixed hole

1193: connecting hole

12: reaction space

121: powder

13: Shaft seal device

130: protruding tube

131: Outer tube body

132: accommodating space

133: inner tube body

134: Connecting Space

137: fixed unit

139: filter unit

14: Gear

15: drive unit

16: heating device

171: Extraction line

173: intake line

175: Non-reactive gas pipeline

177: heater

179: temperature sensing unit

191: Carrier Board

193: fixed frame

195: connecting shaft

20: see-through powder atomic layer deposition device

21: Connection unit

[Fig. 1] is a three-dimensional schematic diagram of an embodiment of a new type of see-through powder atomic layer deposition apparatus.

[Fig. 2] is a schematic cross-sectional view of an embodiment of the novel transparent powder atomic layer deposition apparatus.

[Figure 3] is a schematic cross-sectional view of an embodiment of the shaft sealing device of the novel transparent powder atomic layer deposition device.

[Figure 4] is a schematic cross-sectional view of another embodiment of the novel transparent powder atomic layer deposition device.

[Fig. 5] is a schematic exploded cross-sectional view of another embodiment of the novel transparent powder atomic layer deposition apparatus.

[Figure 6] is a schematic cross-sectional view of another embodiment of the novel transparent powder atomic layer deposition apparatus.

[Figure 7] is a three-dimensional schematic diagram of an embodiment of the vacuum chamber of the novel see-through powder atomic layer deposition device.

[Fig. 8] is a three-dimensional exploded schematic diagram of an embodiment of the vacuum chamber of the novel see-through powder atomic layer deposition device.

Please refer to FIG. 1, FIG. 2, FIG. 3, and FIG. 4, which are respectively a three-dimensional schematic diagram, a cross-sectional schematic diagram of a partial structure, a cross-sectional schematic diagram, and a cross-sectional exploded schematic diagram of an embodiment of the novel transparent powder atomic layer deposition apparatus. As shown in the figure, the transparent powder atomic layer deposition apparatus 10 mainly includes a vacuum chamber 11, a shaft sealing device 13 and a driving unit 15. The driving unit 15 is connected to the vacuum chamber 11 through the shaft sealing device 13 and drives the vacuum The cavity 11 rotates.

The vacuum cavity 11 has a reaction space 12 for accommodating a plurality of powders 121. The powders 121 may be Quantum Dots, such as II-VI semiconductor materials such as ZnS, CdS, and CdSe, which are formed in the quantum dots. The above film can be aluminum oxide (Al2O3). The vacuum chamber 11 may include a cover 111 and a cavity 113, wherein an inner surface 1111 of the cover 111 is used to cover the cavity 113, and a reaction space 12 is formed between the two. In addition, a monitoring wafer 112 can be provided on the inner surface 1111 of the cover 111.

The cavity 113 of the present invention is made of light-transmitting material, such as quartz material. During the atomic layer deposition of the powder 121, the user can observe the state of the powder 121 in the reaction space 12 and the stirring situation through the light-transmitting cavity 113. Specifically, as shown in Figure 2, one side of the cavity 113 is directly solidified. It is fixed on the shaft sealing device 13, for example, the bottom of the cavity 113 is directly fixed on the shaft sealing device 13 through a fixing glue or ultraviolet curing glue, and the cover plate 111 is directly connected to the other side of the cavity 113 and is placed on the cover. A reaction space 12 is formed between the plate 111 and the cavity 113 and/or the shaft sealing device 13. The cavity 113 of the present invention is made of light-transmitting material, and the cavity 113 and the shaft sealing device 13 can be connected with ultraviolet curing glue.

The shaft sealing device 13 includes an outer tube body 131 and an inner tube body 133. The outer tube body 131 has a accommodating space 132, and the inner tube body 133 has a connecting space 134, such as the outer tube body 131 and the inner tube body. 133 can be a hollow cylinder. The accommodating space 132 of the outer tube body 131 is used for accommodating the inner tube body 133, wherein the outer tube body 131 and the inner tube body 133 are coaxially arranged. The shaft seal device 13 may be a common shaft seal or a magnetic fluid shaft seal, and is mainly used to isolate the reaction space 12 of the vacuum chamber 11 from the external space, so as to maintain the vacuum of the reaction space 12.

The driving unit 15 is connected to the shaft sealing device 13 and drives the vacuum chamber 11 to rotate through the shaft sealing device 13, for example, the vacuum chamber 11 is connected through the outer tube body 131, and the vacuum chamber 11 is driven to rotate through the outer tube body 131. In addition, the driving unit 15 is not connected to the inner tube body 133, so when the driving unit 15 drives the outer tube body 131 and the vacuum chamber 11 to rotate, the inner tube body 133 will not rotate with it.

The driving unit 15 can drive the outer tube body 131 and the vacuum chamber 11 to continuously rotate in the same direction, for example, in a clockwise or counterclockwise direction. In different embodiments, the driving unit 15 can drive the outer tube body 131 and the vacuum chamber 11 to rotate a specific angle in a clockwise direction, and then rotate a specific angle in a counterclockwise direction, for example, the specific angle may be 360 degrees. When the vacuum chamber 11 rotates, it will agitate the powder 121 in the reaction space 12, so that the powder 121 will be evenly heated and contact the precursor gas or non-reactive gas.

In an embodiment of the present invention, the driving unit 15 may be a motor, which is connected to the outer tube body 131 through at least one gear 14 and drives the outer tube body 131 and the vacuum chamber 11 to rotate relative to the inner tube body 133 via the gear 14.

The connecting space 134 of the inner tube body 133 can be provided with at least one gas extraction line 171, at least one gas inlet line 173, at least one non-reactive gas delivery line 175, a heater 177 and/or a temperature sensing unit 179, as shown in FIG. 2 and Figure 3.

The gas extraction line 171 is fluidly connected to the reaction space 12 of the vacuum chamber 11 and is used to extract gas in the reaction space 12 so that the reaction space 12 is in a vacuum state for the atomic layer deposition process. Specifically, the pumping line 171 can be connected to a pump, and the gas in the reaction space 12 can be pumped out through the pump.

The gas inlet line 173 is fluidly connected to the reaction space 12 of the vacuum chamber 11 and is used to transport a precursor gas or a non-reactive gas to the reaction space 12, where the non-reactive gas can be an inert gas such as nitrogen or argon. For example, the gas inlet line 173 may be connected to a precursor gas storage tank and a non-reactive gas storage tank through the valve assembly, and the precursor gas can be transported into the reaction space 12 through the valve assembly, so that the precursor gas deposits on the surface of the powder 121. In practical applications, the gas inlet line 173 may transport a carrier gas and precursor gas into the reaction space 12 together. Then, the non-reactive gas is transported into the reaction space 12 through the valve assembly, and is pumped through the gas extraction line 171 to remove the precursor gas in the reaction space 12. In an embodiment of the present invention, the gas inlet pipeline 173 can be connected to a plurality of branch pipelines, and different precursor gases can be sequentially delivered into the reaction space 12 through each branch pipeline.

In addition, the gas inlet line 173 can increase the flow rate of the non-reactive gas delivered to the reaction space 12, and blow the powder 121 in the reaction space 12 through the non-reactive gas, so that the powder 121 is driven by the non-reactive gas and diffuses into the reaction space. 12 various areas.

In an embodiment of the present invention, the gas inlet pipeline 173 may include at least one non-reactive gas delivery pipeline 175 fluidly connected to the reaction space 12 of the vacuum chamber 11, and is used to deliver a non-reactive gas to the reaction space 12, such as non-reactive gas The delivery line 175 can be connected to a nitrogen storage tank through the valve assembly, and deliver the nitrogen to the reaction space 12 through the valve assembly. The non-reactive gas is used to blow the powder 121 in the reaction space 12 and cooperate with the driving unit 15 to drive the vacuum chamber 11 to rotate, which can effectively and uniformly stir the powder 121 in the reaction space 12 and deposit thickness on the surface of each powder 121 Uniform film.

The gas inlet pipeline 173 and the non-reactive gas delivery pipeline 175 of the see-through powder atomic layer deposition apparatus 10 are both used to deliver the non-reactive gas to the reaction space 12, and the flow rate of the non-reactive gas delivered by the inlet pipeline 173 is relatively small. It is used to remove the precursor gas in the reaction space 12, and the flow of the non-reactive gas delivered by the non-reactive gas delivery line 175 is relatively large, which is mainly used to blow the powder 121 in the reaction space 12.

Specifically, the time points at which the gas inlet line 173 and the non-reactive gas conveying line 175 convey the non-reactive gas to the reaction space 12 are different. Therefore, in actual applications, the non-reactive gas conveying line 175 may not be provided, and the gas inlet line 173 may be adjusted in time. The flow of non-reactive gas delivered at different time points. When the precursor gas in the reaction space 12 is to be removed, the flow rate of the non-reactive gas delivered to the reaction space 12 by the gas inlet line 173 can be reduced, and when the powder 121 in the reaction space 12 is to be blown, the gas inlet line 173 is added. The flow rate of the non-reactive gas delivered to the reaction space 12.

When the driving unit 15 of the present invention drives the outer tube body 131 and the vacuum chamber 11 to rotate, the inner tube body 133 and its internal air extraction pipeline 171, intake pipeline 173 and/or non-reactive gas delivery pipeline 175 will not rotate with it , It is beneficial to improve the stability of the non-reactive gas and/or precursor gas delivered by the gas inlet line 173 and/or the non-reactive gas delivery line 175 to the reaction space 12.

The heater 177 is used to heat the connection space 134 and the inner tube body 133, and heat the air extraction line 171, the air inlet line 173 and/or the non-reactive gas delivery line 175 in the inner tube body 133 through the heater 177 to improve air extraction The temperature of the gas in the pipeline 171, the gas inlet pipeline 173, and/or the non-reactive gas delivery pipeline 175. For example, the temperature of the non-reactive gas and/or the precursor gas delivered by the gas inlet line 173 to the reaction space 12 can be increased, and the temperature of the non-reactive gas delivered by the non-reactive gas delivery line 175 to the reaction space 12 can be increased. When the non-reactive gas and/or precursor gas enters the reaction space 12, the temperature of the reaction space 12 will not drop or change significantly. In addition, the temperature of the heater 177 or the connecting space 134 can be measured through the temperature sensing unit 179 to know the working state of the heater 177. Of course, another heating device 16 is usually arranged inside, outside or around the vacuum cavity 11, wherein the heating device 16 is adjacent to or in contact with the vacuum cavity 11 and is used to heat the vacuum cavity 11 and the reaction space 12.

In the above-mentioned embodiment of the present invention, the cavity 113 is directly connected to and in contact with the cover 111 and the shaft sealing device 13, but when the cover 111 is fixed on the cavity 113, or when the cavity 113 is fixed on the shaft sealing device 13, It is easy to damage the cavity 113 due to improper collision.

In order to avoid the above-mentioned problems, the cavity 113 may not be directly connected to the cover 111 and/or the shaft sealing device 13, and a cover fixing portion 115 is added between the cavity 113 and the cover 111, as shown in FIGS. 4 and 5 Wherein, the cover fixing portion 115 may be metal, and is fixed on one side of the cavity 113 through fixing glue or ultraviolet curing glue.

At least one connecting unit 117 can be provided on the cover 111 and/or the cover fixing portion 115, wherein the cover 111 can be fixed to the cover fixing portion 115 through the connection unit 117. For example, the connecting unit 117 can be the cover 111 and the cover Corresponding threads, cylinder joints, buckle mechanism, tenon, quick release device, etc. on the fixing part 115. Through the setting of the cover plate fixing part 115, the cover plate 111 and the connecting unit 117 will not collide or touch the cavity 113 during the process of connecting the cover plate 111 to the cavity 113, which can avoid damage to the cavity 113 caused by improper contact or collision. .

The other side of the cavity 113 may not directly contact the shaft sealing device 13, and a fixing plate 119 is added between the cavity 113 and the shaft sealing device 13. The cavity 113 can be connected to the fixing plate 119 through a fixing glue, and a reaction space 12 is formed between the cover plate 111, the cavity 113 and the fixing plate 119, and the fixing plate 119 can be fixed to the shaft sealing device 13 through at least one screw.

In an embodiment of the present invention, the cavity 113 may be a hollow cylindrical body, and two bottoms of the cavity 113 are respectively provided with an opening, one of the openings is connected to the cover fixing portion 115, and the other opening is connected to the fixing plate 119. The cover plate fixing portion 115 and the fixing plate 119 may be annular in appearance.

At least one heating device 16 can be arranged around the vacuum cavity 11 and/or the cavity 113, and the vacuum cavity 11, the reaction space 12 and the powder 121 are heated by the heating device 16. Since the cavity 113 of the present invention has light-transmitting characteristics, the heating device 16 can be a heating lamp tube, such as a halogen lamp, and the powder 121 in the reaction space 12 is heated through the light-transmitting cavity 113.

In an embodiment of the present invention, the inner tube body 133 extends from the accommodating space 132 of the outer tube body 131 to the reaction space 12 of the vacuum chamber 11 and forms a protruding tube portion 130, and the reaction space 12 may be a polygonal column A shaped body or a circular wavy cylindrical body to facilitate stirring the powder 121 in the reaction space 12. The arrangement of the protruding pipe 130 can shorten or adjust the distance between the gas inlet pipe 173 and/or the non-reactive gas conveying pipe 175 and the cover 111, and the gas inlet pipe 173 and/or the non-reactive gas conveying pipe 175 can be conveyed. The non-reactive gas to the reaction space 12 can be transferred to the inner surface 1111 of the cover plate 111 and diffuse to various areas of the reaction space 12 through the inner surface 1111 of the cover plate 111 to blow the powder 121 in the reaction space 12.

Please refer to FIG. 6, FIG. 7 and FIG. 8, which are respectively a schematic cross-sectional view of another embodiment of the novel see-through powder atomic layer deposition apparatus, a three-dimensional schematic view of an embodiment of the vacuum chamber of the see-through powder atomic layer deposition apparatus, and Three-dimensional exploded schematic diagram. As shown in the figure, the see-through powder atomic layer deposition apparatus 20 mainly includes a vacuum chamber 11, a shaft sealing device 13 and a driving unit 15. The driving unit 15 is connected to the vacuum chamber 11 through the shaft sealing device 13 and drives the vacuum The cavity 11 rotates.

The vacuum chamber 11 includes a cover 111 and a cavity 113, wherein the cover 111 is used to cover the cavity 113, and a reaction space 12 is formed between the two. The cavity 113 of the present invention is made of light-transmitting material, such as quartz.

In the embodiment of the present invention, the light-transmissive cavity 113 may be a hollow cylindrical body, wherein one end of the cavity 113 is directly connected to the shaft sealing device 13, and the other end of the cavity 113 is connected to the cover plate 111. As shown in FIGS. 7 and 8, at least one perforation 1113 can be provided on the cover 111, and a corresponding fixing hole 1191 is also provided at one end of the shaft sealing device 13 connected to the cavity 113. At least one connecting unit 21 passes through the perforation 1113 on the cover 111. For example, the connecting unit 21 can be a long screw fixed on the fixing hole 1191 of the shaft sealing device 13, thereby fixing the cavity 113 on the cover 111 A reaction space 12 is formed between the shaft sealing device 13 and the cover 111, the cavity 113 and the shaft sealing device 13.

In an embodiment of the present invention, one end of the transparent cavity 113 is connected to the cover plate 111, and the other end of the cavity 113 is connected to the fixing plate 119. At least one perforation 1113 can be provided on the cover 111, and a fixing hole 1191 and a connecting hole 1193 are provided on the fixing plate 119, for example, the fixing hole 1191 is located on the fixing plate Around 119, the connecting hole 1193 is located at the center of the fixing plate 119, wherein the inner tube 133 of the shaft sealing device 13 and/or the filter unit 139 can be disposed in the connecting hole 1193 of the fixing plate 119.

The connecting unit 21 passes through the perforation 1113 of the cover plate 111 and is fixed on the fixing hole 1191 of the fixing plate 119 to fix the cavity 113 between the cover plate 111 and the fixing plate 119. When one end of the screw is locked in the fixing hole 1191 of the fixing plate 119, the screw cap at the other end of the screw will press the cover plate 111, so that the cavity 113 between the cover plate 111 and the fixing plate 119 is pressed tightly, and the cover plate 111, A closed reaction space 12 is formed between the cavity 113 and the fixing plate 119.

In order to improve the sealing degree of the reaction space 12, an O-ring (O-ring) can be further arranged on the cover 111 and the cavity 113, and another O-ring can be arranged between the cavity 113 and the shaft sealing device 13 and/or the fixing plate 119. An O-ring.

In an embodiment of the present invention, the cover 111 and the fixing plate 119 can be connected through the connecting unit 21, so that the cover 111, the cavity 113 and the fixing plate 119 form the vacuum chamber 11. The fixing plate 119 of the vacuum chamber 11 can be fixed on the shaft sealing device 13 through at least one fixing unit 137, and can be removed by the shaft sealing device 13, for example, the fixing unit 137 can be screwed, or set on the fixing plate 119 and the shaft sealing device 13 Corresponding cylinder joints and connecting holes, tenon and mortise, external thread and internal thread, etc. In actual application, the fixing unit 137 can be removed or unlocked, so that the vacuum chamber 11 formed by the cover 111, the cavity 113 and the fixing plate 119 is separated from the shaft sealing device 13. At this time, the connecting unit 21 is still fixed on the cover plate 111 and the fixing plate 119 so that the powder 121 is confined in the reaction space 12. The connecting unit 21 is removed until the cover 111, the cavity 113, and the fixing plate 119 are moved to a specific position, so that the user can take out the powder 121 in the vacuum cavity 11 conveniently.

In addition, the design of the vacuum chamber 11 to be detachable from the shaft sealing device 13 is also beneficial to improve the process efficiency of atomic layer deposition. Specifically, multiple vacuum chambers 11 can be prepared and placed in Powder 121 is placed in each vacuum cavity 11. One of the vacuum chambers 11 is locked on the shaft sealing device 13, and the powder 121 in the vacuum chamber 11 is subjected to atomic layer deposition. After the atomic layer deposition of the powder 121 is completed, the vacuum chamber 11 and the powder 121 are removed from the shaft sealing device 13, and the other vacuum chamber 11 is fixed on the shaft sealing device 13, and the pressure in the vacuum chamber 11 The powder 121 undergoes an atomic layer deposition process. The unloaded vacuum chamber 11 can be placed in the cooling zone. After the temperature of the vacuum chamber 11 and the powder 121 drops, the powder 121 is taken out of the vacuum chamber 11.

In an embodiment of the present invention, the filter unit 139 can be fixed on the fixing plate 119. When the vacuum chamber 11 is connected to the shaft seal device 13, the filter unit 139 on the vacuum chamber 11 will align with or cover the shaft seal device 13 The inner tube body 133 makes the suction line 171, the gas inlet line 173 and/or the non-reactive gas delivery line 175 in the inner tube body 133 fluidly connected to the reaction space 12 of the vacuum chamber 11 via the filter unit 139. In addition, the filter unit 139 is arranged on the vacuum chamber 11 instead of the shaft sealing device 13, which can also prevent the powder 121 from being removed from the reaction space of the vacuum chamber 11 when the vacuum chamber 11 is removed from the shaft sealing device 13. 12 scattered to the outside.

In an embodiment of the present invention, the see-through powder atomic layer deposition apparatus 10 may also include a carrying plate 191 and at least one fixing frame 193, wherein the carrying plate 191 may be a plate for carrying the driving unit 15 and the vacuum chamber体11和轴封装置13。 Body 11 and shaft sealing device 13. For example, the carrier board 191 is connected to the driving unit 15, and the shaft sealing device 13 and the vacuum chamber 11 are connected through the driving unit 15. In addition, the shaft sealing device 13 and/or the vacuum chamber 11 can also be connected to the carrying plate 191 through at least one support frame to improve the stability of the connection.

The carrying plate 191 can be connected to the fixing frame 193 through at least one connecting shaft 195, wherein the number of the fixing frame 193 can be two, and the fixing frames 193 can be respectively arranged on both sides of the carrying plate 191. The bearing plate 191 can rotate relative to the fixing frame 193 with the shaft 195 as the axis to change the elevation angle of the driving unit 15, the shaft sealing device 13, and the vacuum chamber 11, so as to facilitate the formation of a thin film of uniform thickness on the surface of each powder 121.

The above is only one of the preferred embodiments of the present invention, and is not intended to limit the scope of implementation of the present invention, that is, all the equivalent changes and changes in the shape, structure, characteristics and spirit described in the scope of the patent application of the present invention Modifications should be included in the scope of the patent application for this new model.

10: see-through powder atomic layer deposition device

11: Vacuum chamber

111: cover

1111: inner surface

112: Monitoring wafer

113: Cavity

12: reaction space

121: powder

13: Shaft seal device

131: Outer tube body

132: accommodating space

133: inner tube body

134: Connecting Space

139: filter unit

14: Gear

15: drive unit

171: Extraction line

175: Non-reactive gas pipeline

177: heater

191: Carrier Board

193: fixed frame

195: connecting shaft

Claims (10)

A see-through powder atomic layer deposition device includes: a vacuum chamber, including a cover plate and a cavity, the cover plate covers the cavity, and a reaction space is formed between the cover plate and the cavity, wherein The cavity is made of a light-transmitting material; a shaft sealing device connected to the vacuum chamber; a driving unit connected to the shaft sealing device, wherein the driving unit drives the vacuum chamber to rotate through the shaft sealing device; at least one An air extraction line, fluidly connected to the reaction space of the vacuum chamber, and used to extract a gas in the reaction space; and at least one gas inlet line, fluidly connected to the reaction space of the vacuum chamber, and used to transfer a precursor Or a non-reactive gas is delivered to the reaction space, wherein the non-reactive gas is used to blow the powder in the reaction space. The see-through powder atomic layer deposition apparatus according to claim 1, wherein the gas inlet line includes at least one non-reactive gas delivery line, fluidly connected to the reaction space of the vacuum chamber, and used to deliver the non-reactive gas to the The reaction space of the vacuum cavity is used to blow the powder in the reaction space. The see-through powder atomic layer deposition apparatus according to claim 1, including a heating device located around the cavity for heating the cavity and the reaction space. The see-through powder atomic layer deposition device according to claim 3, wherein the heating device is a heating lamp tube. The see-through powder atomic layer deposition apparatus according to claim 1, comprising a cover plate fixing part connected to the cavity, and the cover plate is fixed on the cover plate fixing part through at least one connecting unit. The see-through powder atomic layer deposition apparatus according to claim 1, wherein the cavity is made of a quartz material. The see-through powder atomic layer deposition device according to claim 1, comprising at least one connecting unit passing through at least one perforation on the cover plate and connecting with at least one fixing hole of the shaft sealing device to fix the cavity Between the cover plate and the shaft sealing device. The see-through powder atomic layer deposition apparatus according to claim 1, wherein the vacuum chamber includes a fixing plate, the cavity is located between the cover plate and the fixing plate, and at least one connecting unit passes through the cover plate At least one perforation of the fixing plate is connected to at least one fixing hole on the fixing plate to fix the cavity between the cover plate and the fixing plate. The see-through powder atomic layer deposition apparatus according to claim 1, wherein the fixing plate of the vacuum chamber is connected to the shaft sealing device through at least one fixing unit, and when the fixing unit is removed or unlocked, the vacuum chamber will Separate from the shaft sealing device. The see-through powder atomic layer deposition device according to claim 1, wherein the shaft sealing device includes an outer tube body and an inner tube body, the outer tube body has an accommodating space for accommodating the inner tube body, The air extraction pipeline and the air inlet pipeline are located in the inner tube body, and the inner tube body extends from the accommodating space of the outer tube body to the reaction space of the vacuum chamber and forms a protruding tube part.

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