TWM615115U - Electronic component having oblique-surfaced pins - Google Patents
Electronic component having oblique-surfaced pins Download PDFInfo
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- TWM615115U TWM615115U TW110202898U TW110202898U TWM615115U TW M615115 U TWM615115 U TW M615115U TW 110202898 U TW110202898 U TW 110202898U TW 110202898 U TW110202898 U TW 110202898U TW M615115 U TWM615115 U TW M615115U
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- bearing surface
- assembly
- beveled
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- 238000010586 diagram Methods 0.000 description 9
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- 239000000463 material Substances 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 1
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Abstract
本新型創作提供一種具有斜面針腳之電子元件,包括一本體以及複數個針腳,其中本體具有一承載面;這些針腳分別具有一第一端以及一第二端,各第一端相對於承載面固定,各第二端具有一端面,且各端面相對於承載面傾斜。 The present invention provides an electronic component with beveled pins, including a body and a plurality of pins, wherein the body has a bearing surface; the pins have a first end and a second end, and each first end is fixed relative to the bearing surface , Each second end has an end surface, and each end surface is inclined with respect to the bearing surface.
Description
本新型創作提供一種電子元件,且特別是關於一種具有斜面針腳的電子元件。 The present invention provides an electronic component, and particularly relates to an electronic component with beveled pins.
隨著科技的日新月異,通訊產業的技術不斷地突破,尤其是近年來熱門的第五代行動通訊技術(5th generation mobile networks,5G)即將在各國成為主流的資料傳輸媒介。在上述產業中,經常需要使用到二極體、電晶體等精密電子元件,這些電子元件具有細長的針腳,且在組裝過程時需要將針腳穿過可撓式電路板或硬式電路板上預先設置的孔洞,將針腳以及電路板進行焊接以使彼此結合。然而,基於產品設計公規以及產品整體體積的需求,孔洞與針腳之間的間隙相當微小,需要透過人力進行組裝作業,不僅曠日廢時且成本昂貴,且當單一電子元件的針腳數量增加時,組裝作業的困難度將更為提昇。 As technology advances, communication technology industries continue to break, especially popular in recent years, the fifth generation of mobile communications technology (5 th generation mobile networks, 5G ) will soon become the mainstream data transmission medium in each country. In the above industries, it is often necessary to use precision electronic components such as diodes and transistors. These electronic components have slender pins and need to pass the pins through the flexible circuit board or the rigid circuit board in advance during the assembly process. The holes are soldered to the pins and the circuit board to bond them together. However, due to the requirements of product design regulations and the overall volume of the product, the gap between the holes and the pins is quite small, requiring manual assembly operations, which is time-consuming and expensive, and when the number of pins for a single electronic component increases , The difficulty of assembly operations will be even more improved.
創作人遂竭其心智悉心研究,進而研發出一種具有斜面針腳的電子元件,以期達到提高組裝效率及節省人力的功效。 The creator then exhausted his mind to study carefully, and then developed an electronic component with beveled stitches, in order to achieve the effect of improving assembly efficiency and saving manpower.
本新型創作提供一種具有斜面針腳之電子元件,包括一本體以及複數個針腳,其中本體具有一承載面;這些針腳分別具有一第一端以及一第二端,各第一端相對於承載面固定,各第二端具有一端面,且各端面相對於承載面傾斜。 The present invention provides an electronic component with beveled pins, including a body and a plurality of pins, wherein the body has a bearing surface; the pins have a first end and a second end, and each first end is fixed relative to the bearing surface , Each second end has an end surface, and each end surface is inclined with respect to the bearing surface.
在一實施例中,上述的各端面相對於承載面具有一近端以及一遠端,各近端與承載面間具有一第一距離,各遠端與承載面間具有一第二距離,且各第二距離大於對應的各第一距離。 In an embodiment, each of the above-mentioned end faces has a proximal end and a distal end relative to the bearing surface, each proximal end has a first distance from the bearing surface, and each distal end has a second distance between the bearing surface, and Each second distance is greater than each corresponding first distance.
在一實施例中,上述的各第一距離彼此相等,且各第二距離彼此相等。 In an embodiment, the above-mentioned first distances are equal to each other, and the second distances are equal to each other.
在一實施例中,上述針腳的延伸方向互相平行。 In one embodiment, the extension directions of the aforementioned stitches are parallel to each other.
在一實施例中,上述的各端面透過一模具切削形成。 In one embodiment, each of the aforementioned end faces is formed by cutting through a mold.
在一實施例中,上述針腳的外徑為0.30~0.40mm。 In one embodiment, the outer diameter of the aforementioned pins is 0.30~0.40 mm.
在一實施例中,上述的各端面相對於承載面的傾斜角度為10~45度。 In an embodiment, the inclination angle of each of the above-mentioned end faces relative to the bearing surface is 10 to 45 degrees.
藉此,本新型創作提供的具有斜面針腳之電子元件由於針腳的第二端的端面相對於承載面傾斜,因此可增加針腳與穿孔之間的間隙,在組裝時針腳較容易進入組裝的孔洞內,不僅可提高組裝效率且能降低組裝作業的難度,使得組裝作業自動化得以實現,從而達到節省人力以及降低成本的效果。 As a result, the electronic component with beveled pins provided by the present invention can increase the gap between the pins and the through holes because the end surface of the second end of the pins is inclined relative to the load-bearing surface, and the pins can easily enter the assembly holes during assembly. Not only can the assembly efficiency be improved, but the difficulty of the assembly operation can be reduced, so that the assembly operation can be automated, thereby achieving the effects of saving manpower and reducing costs.
為讓本新型創作的上述特徵和優點能更明顯易懂,下文特舉實施例,並配合所附圖式作詳細說明如下。 In order to make the above-mentioned features and advantages of the new creation more obvious and understandable, the following specific examples are given in conjunction with the accompanying drawings to describe in detail as follows.
1:電子元件 1: Electronic components
100:本體 100: body
110:承載面 110: bearing surface
120:固持座 120: Holder
122:固持部 122: Holding Department
200:針腳 200: pin
210:第一端 210: first end
220:第二端 220: second end
222:端面 222: end face
2:組裝件 2: Assembled parts
3:載具 3: Vehicle
D:遠端 D: remote
D1、D2:距離 D1, D2: distance
H:穿孔 H: Piercing
P:近端 P: Proximal
S:容置空間 S: accommodating space
S01、S02:步驟 S01, S02: steps
T:貫孔 T: Through hole
圖1為本新型創作的具有斜面針腳之電子元件的一實施例的立體示意圖。 FIG. 1 is a three-dimensional schematic diagram of an embodiment of an electronic component with beveled pins created by the new type.
圖2為圖1的右側視示意圖。 Fig. 2 is a schematic view of the right side of Fig. 1.
圖3為應用於圖1的電子元件的一組裝方法的一實施例的步驟流程示意圖。 FIG. 3 is a schematic flowchart of steps of an embodiment of an assembling method applied to the electronic component of FIG. 1.
圖4為應用於圖3的組裝方法的一組裝件的立體示意圖。 FIG. 4 is a three-dimensional schematic diagram of an assembly used in the assembly method of FIG. 3.
圖5為圖1的電子元件以及圖4的組裝件應用圖3的組裝方法的第一狀態示意圖。 5 is a first state schematic diagram of the electronic component of FIG. 1 and the assembly of FIG. 4 applying the assembling method of FIG. 3.
圖6為圖1的電子元件以及圖4的組裝件應用圖3的組裝方法的第二狀態示意圖。 6 is a schematic diagram of a second state in which the electronic component of FIG. 1 and the assembly of FIG. 4 are applied to the assembly method of FIG. 3.
圖7為圖1的電子元件以及圖4的組裝件組裝完成時的立體示意圖。 Fig. 7 is a perspective schematic view of the electronic component of Fig. 1 and the assembly of Fig. 4 when assembled.
圖8為圖1的電子元件以及圖4的組裝件配置於一載具的立體示意圖。 FIG. 8 is a three-dimensional schematic diagram of the electronic component of FIG. 1 and the assembly of FIG. 4 disposed on a carrier.
有關本新型創作之前述及其它技術內容、特點與功效,在以下配合參考圖式之較佳實施例的詳細說明中,將可清楚地呈現。值得一提的是,以下實施例所提到的方向用語,例如:上、下、左、右、前或後等,僅是參考附加圖式的方向。因此,使用的方向用語是用以說明,而非對本新型創作加以限制。此外,在下列的實施例中,相同或相似的元件將採用相同或相似的標號。 The aforementioned and other technical content, features, and effects of the creation of the new model will be clearly presented in the following detailed description of the preferred embodiment with reference to the drawings. It is worth mentioning that the directional terms mentioned in the following embodiments, for example: up, down, left, right, front or back, etc., only refer to the directions of the attached drawings. Therefore, the directional terms used are used to illustrate, not to limit the creation of the new model. In addition, in the following embodiments, the same or similar elements will use the same or similar reference numerals.
請參考圖1及圖2,其中圖1為本新型創作的具有斜面針腳之電子元件的一實施例的立體示意圖,而圖2為圖1的右側視示意圖。本實施例的電子元件1例如是一電晶體,包括一本體100以及複數個針腳200,其中針腳200的材質例如是金屬,用以接收電性訊號通入本體100後進行運算或產生物理現象後再傳遞出去。
Please refer to FIGS. 1 and 2. FIG. 1 is a three-dimensional schematic diagram of an embodiment of an electronic component with beveled pins created by the new model, and FIG. 2 is a schematic right side view of FIG. The
詳細而言,本體100具有一承載面110,而這些針腳200分別具有一第一端210以及一第二端220,其中各第一端210相對於承載面110固定。較佳地,各第一端210直接固設於承載面110上或穿設於本體100。另一方面,各第二端220具有一端面222,且各端面222相對於承載面110傾斜。
In detail, the
更進一步而言,在本實施例中,這些針腳200的各端面222透過一模具切削形成,使用者可先將安裝有未切削針腳200的電子元件1配置於一上模的容置槽內,使得第二端220的一部份相對於上模的下緣突出,接著再將對應上模形狀的一下模沿著上模的下緣側向移動,藉此切削針腳200的第二端220並形成傾斜的端面222。在本實施例中,這些針腳200的延伸方向互相平行,較佳地,這些針腳200的延伸方向均垂直於承載面110,藉此,可簡化切削模具的設計以及後續的組裝作業。
Furthermore, in this embodiment, the end faces 222 of the
值得一提的是,在本實施例中,本體100還包括一固持座120,固持座120固設於承載面110上,且固持座120的周緣上形成有至少一固持部122,其中固持部122例如是相對於固持座120凹陷的凹部,而針腳200穿設於貫通固持座120的複數個貫孔T。透過這樣的配置,當使用者欲使用機械手臂或夾爪等提取工具提取電子元件1時,可將機械手臂或夾爪嵌入固持部122以固持電子元件1。而在其它的實施例中,固持部122也可以設計成對應上述提取工具外形的凸點、凸塊或提把,本新型創作對此並不加以限制。
It is worth mentioning that, in this embodiment, the
另一方面,如圖2所示,各端面222相對於承載面110具有一近端P以及一遠端D,其中各近端P與承載面110間具有一第一距離D1,各遠端D與承載面110間具有一第二距離D2,且各第二距離D2大於對應的各第一距離D1,換言之,同一根針腳200的遠端D相較於近端P更加遠離承載面110。較佳地,各第一距離D1彼此相等,且各第二距離D2彼此相等。藉此,在組裝作業中,能夠較為容易判斷電子元件1的針腳200是否全數穿入組裝元件的孔洞內,這部份將於後文中詳述。
On the other hand, as shown in FIG. 2, each
請參考圖3至圖7,其中圖3為應用於圖1的電子元件的一組裝方法的一實施例的步驟流程示意圖,圖4為應用於圖3的組裝方法的一組裝件的立體示意圖,圖5及圖6分別為圖1的電子元件以及圖4的組裝件應用圖3的組裝方法的第一狀態以及第二狀態示意圖,而圖7為圖1的電子元件以及圖4的組裝件組裝完成時的立體示意圖。如圖4所示,組裝件2例如是一電路板且形成有複數個穿孔H,這些穿孔H的數量大於等於針腳200的數量,在本實施例中針腳200以及穿孔H的數量均為7個。另一方面,本實施例的組裝方法包括:將各第二端220對位於穿孔H(步驟S01),以及將針腳200穿設於穿孔H(步驟S02)。
Please refer to FIGS. 3 to 7, where FIG. 3 is a schematic diagram of the steps of an embodiment of an assembly method applied to the electronic component of FIG. 1, and FIG. 4 is a perspective schematic view of an assembly piece applied to the assembly method of FIG. 3. 5 and 6 are respectively the first state and the second state schematic diagram of the electronic component of FIG. 1 and the assembly of FIG. 4 applying the assembly method of FIG. 3, and FIG. 7 is the electronic component of FIG. 1 and the assembly of FIG. 4 Three-dimensional schematic diagram when completed. As shown in FIG. 4, the
詳細而言,如圖5所示,針腳200的外徑為0.30~0.40mm,在本實施例中以0.35mm為例,而穿孔H的內徑為0.45mm,由於兩者間的間隙僅有微小的0.10mm,難以藉由自動化將全數的針腳200穿入穿孔H內。因此,在組裝時,首先需將各個針腳200的第二端220對位於穿孔H,並使電子元件1以及組裝件2彼此相對接近。由於針腳200的遠端D在承載面110上的正投影面積小於整根針腳200在承載面110上的正投影面積,當組裝件2與承載面110間的距離如圖6所示小於第二距離D2時,使用者可輕易地將各遠端D的至少一部份穿設於這些穿孔H,且由於各第二距離D2彼此相等,因此當其中一根針腳200的遠端D穿設於穿孔H時,使用者即可確定全部針腳200的遠端D均穿設於穿孔H。在確保全部針腳200的遠端D均穿設於穿孔H後,電子元件1以及組裝件2即可繼續相對接近,使全部的針腳200穿設於穿孔H,進而讓使組裝件2套設於全部針腳200的第一端210,形成如圖7所示的狀態。
In detail, as shown in Figure 5, the outer diameter of the
值得一提的是,雖然增加端面222相對於承載面110的傾斜角度可使得遠端D更加尖銳且更容易穿入穿孔H,但也代表在切削時需要削去更多的針
腳200材料,有可能導致針腳200結構強度不足甚至斷裂。因此,各端面222相對於承載面110的傾斜角度較佳地為10~45度,在本實施例中以20度為例。
It is worth mentioning that although increasing the inclination angle of the
當組裝件2套設於全部針腳200的第一端210後,使用者可將各第二端220相對於組裝件2突出的一部份甚至是全部部份切除。藉此,這些針腳200的傾斜端面222降低了電子元件1以及組裝件2的組裝作業難度,且由於帶有傾斜端面222的第二端220已被切除,因此在後續的作業(例如焊接)中將與平整端面的針腳200相同,而不會有刺傷操作人員或磨損其它元件的風險。
After the
請參考圖8,圖8為圖1的電子元件以及圖4的組裝件配置於一載具的立體示意圖。除了如上所述的單一組裝作業外,本實施例的電子元件1也可應用於大量批次化的組裝作業或自動化組裝作業,如圖8所示,使用者可藉由夾爪等提取工具將電子元件1置放於一載具3的容置空間S內,並同樣透過提取工具,應用上述的組裝方法將組裝件2對位並使其穿孔H套設於電子元件1具有斜面針腳200的第二端220上。透過上述的電子元件1以及組裝方法,可有效增加針腳200的第二端220與穿孔H之間的間隙,降低組裝的難度且使組裝的自動化得以實現。
Please refer to FIG. 8. FIG. 8 is a perspective view of the electronic component of FIG. 1 and the assembly of FIG. 4 disposed on a carrier. In addition to the single assembly operation described above, the
本新型創作在上文中已以較佳實施例揭露,然熟習本項技術者應理解的是,上述實施例僅用於描繪本新型創作,而不應解讀為限制本新型創作之範圍。應注意的是,舉凡與上述實施例等效之變化與置換,均應設為涵蓋於本新型創作之範疇內。因此,本新型創作之保護範圍當以申請專利範圍所界定者為準。 The creation of the present invention has been disclosed in the above preferred embodiments. However, those familiar with the technology should understand that the above-mentioned embodiments are only used to describe the creation of the present invention, and should not be interpreted as limiting the scope of the creation of the present invention. It should be noted that all changes and replacements equivalent to the above-mentioned embodiments should be included in the scope of the creation of the new type. Therefore, the scope of protection for the creation of this new model shall be determined by the scope of the patent application.
1:電子元件 1: Electronic components
100:本體 100: body
110:承載面 110: bearing surface
120:固持座 120: Holder
122:固持部 122: Holding Department
200:針腳 200: pin
T:貫孔 T: Through hole
Claims (7)
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TW110202898U TWM615115U (en) | 2021-03-18 | 2021-03-18 | Electronic component having oblique-surfaced pins |
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TW110202898U TWM615115U (en) | 2021-03-18 | 2021-03-18 | Electronic component having oblique-surfaced pins |
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