TWM609984U - Probe device - Google Patents

Abstract

The present model provides a probe device, which includes a signal transmission element, which includes a first transmission portion and a second transmission portion, and a probe, one end of which is electrically connected and arranged below the second transmission portion. A lower fixing element, which is disposed under one of the signal transmission elements, one end of the lower fixing element has a first through hole and a first groove under one of the ends, and the probe penetrates the lower fixing element In the first through hole, the probe is located in the first groove; the lower fixing element compensates for the mechanical strength of the signal transmission element, so that the width of the signal transmission element can be reduced, and the effect of densely arranged probe devices is achieved.

Description

Probe device

This model relates to a probe device, especially a probe device with a signal transmission element and upper and lower fixing parts.

The inspection items of the integrated circuit can be described as a dazzling array, such as short circuit, open circuit, signal distortion, voltage level, impedance and other electrical characteristics and component functions, etc., because integrated circuits have a large number of contacts, it is impossible to perform the above inspections one by one. Therefore, probe cards have come out; in addition, the array substrate of the display panel is also covered with a large number of transistors, wires and pads, and probe cards are also needed to detect finished and semi-finished products.

The design of the probe card is to set a probe according to the relative position of each of the above-mentioned nodes to be inspected, and set a pair of symbols corresponding to one of the identification symbols on the circuit under test; when using the probe card, first set the probe card The above alignment symbol is aligned with the identification symbol on the tested circuit to complete the alignment, and then various test signals are applied to various electronic components and wires in the integrated circuit through these nodes through the probe, and the response signal is received. The test result is calculated by computer program.

Among them, the cantilever probe card is the first to be developed and has the widest application range. The main length of the probe extends horizontally toward the pad of the circuit to be tested, and the end is turned at an angle or directly connected to the pad in a horizontal position. When the contact pads of the test circuit are in contact, this type of probe card is generally fixed with a plurality of probes such as epoxy resin, and each probe cantilever needs to be calibrated within a specific range of elasticity.

Moreover, when applied to the detection of high-frequency electronic components with high-density pads, in order to prevent the cantilever probe from deforming and affecting the detection result, the cantilever probe must maintain a certain thickness or diameter so that the probe maintains proper rigidity and flexibility. Therefore, it cannot be too densely arranged side by side to correspond to the detection of high-frequency electronic components with high-density pads. Although some companies have developed a high-density arrangement of a large number of probes through the three-dimensional alternating arrangement of probes of different lengths, there will be explorations in this way. The uneven force of the needle causes the problem of puncturing the pad of the component under test.

Benefiting from the advancement of photolithography technology, another industry has developed micro-electromechanical probe cards to produce probes in large quantities. It uses electroplating steps and photolithography technology to achieve high-precision micro-probe production, and combines piezoelectric Material, so that each probe has a pressure feedback design, to ensure that the probe contact force is consistent, to minimize unnecessary influencing factors, and to improve the reliability of test results. However, as the density of the pads of high-frequency electronic components becomes more and more dense, the unevenness of the surface of the circuit under test causes the problem of the height difference of the contact points. The probe must be able to correspond to each contact point of different height and still maintain good Therefore, the design of each probe must be flexible to avoid too much difference in the contact force of the probe, resulting in chip damage or probe damage and inaccurate inspection results. However, this kind of probes that can adapt to height differences must be manufactured by electroplating and photolithography, which is quite difficult to manufacture, so the manufacturing cost remains high. In addition, it is necessary to order expensive special masks. Therefore, the cost has always been too high. The problem.

Based on the above-mentioned problems of the prior art, it can be seen that there is an urgent need in the market for a high-density array probe device that is easy to repair and maintain, is not easy to damage the circuit contacts under test, and has low manufacturing costs and low operating costs. In view of this, the probe device provided by the present invention has both multi-stage elastic buffering and vertical abutment features, which can meet the needs of easy maintenance, no damage to the circuit under test, high-density arrangement, and low cost.

One purpose of the present invention is to provide a probe device, which divides the probe device into: a signal derivation element, a signal transmission element, a lower fixing element and a probe; the signal transmission element is arranged above the lower fixing element to adjust the width The signal transmission element with reduced thickness strengthens the mechanical strength, and a smaller probe can be applied to achieve the purpose of easy maintenance, no damage to the circuit under test, high-density arrangement and low cost.

Another object of the present invention is to provide a probe device which utilizes signal transmission elements including a first transmission portion and a second transmission portion with different widths, so that the flexibility of the first transmission portion is better than that of the second transmission portion. A probe is arranged under the flexible first transmission part to prevent the probe from damaging the circuit under test.

In order to achieve the above objects and effects, an embodiment of the present invention provides a probe device, which includes: a signal transmission element disposed under one of the upper fixing elements, which includes a first transmission part and a second transmission part Part, a first width of the first transmission part is greater than a second width of the second transmission part; a probe, one end of which is electrically connected and arranged under one of the second transmission parts; a fixing element is arranged below Under one of the signal transmission elements, one end of the lower fixing element has a first through hole and one of the ends has a first groove, and the probe passes through the first through hole of the lower fixing element , The probe is located in the first groove.

In an embodiment of the present invention, there is a first groove under one of the ends of the lower fixing element, and the probe is located in the first groove.

In an embodiment of the present invention, a signal derivation element is further included, which is electrically connected and disposed above one of the first transmission parts.

In an embodiment of the present invention, an upper fixing element is further included, which is arranged above one of the signal transmission elements.

In an embodiment of the present invention, it further includes a substrate and a limiting member. The substrate is disposed under one of the lower fixing elements and has an opening. The limiting member is disposed in correspondence with the first groove. In the opening of the substrate, the probe penetrates the limiting member.

In an embodiment of the present invention, wherein the second through hole further has a first aperture portion and a second aperture portion, a first aperture of the first aperture portion is smaller than a second aperture of the second aperture portion Aperture.

In an embodiment of the present invention, the signal deriving element has a first diameter portion and a second diameter portion, a first diameter of the first diameter portion corresponds to the first aperture of the first aperture portion, and A second diameter of the second diameter portion corresponds to the second hole diameter of the second hole portion.

In an embodiment of the present invention, the first through hole further has a third aperture and a fourth aperture, and a third aperture of the third aperture is larger than a fourth aperture of the fourth aperture. Aperture.

In an embodiment of the present invention, the probe has a third diameter portion and a fourth diameter portion, a third diameter of the third diameter portion corresponds to the third aperture of the third aperture portion, and the One of the fourth diameters of the fourth diameter portion corresponds to the fourth diameter of the fourth diameter portion.

In order to enable your reviewer to have a further understanding and understanding of the features of the new model and the effects achieved, I would like to provide examples and supporting instructions. The explanation is as follows:

Hereinafter, various embodiments of the present invention will be described in detail by illustrating various embodiments of the present invention by means of drawings. However, the concept of the present invention may be embodied in many different forms, and should not be construed as being limited to the exemplary embodiments described herein.

Certain words are used in the specification and request items to refer to specific components. However, those with ordinary knowledge in the technical field of the present invention should understand that the manufacturer may use different terms to refer to the same component. Moreover, this specification and The requested item does not use the difference in names as a way of distinguishing components, but uses the difference in the overall technology of the components as the criterion for distinguishing. The "include" mentioned in the entire manual and request items is an open term, so it should be interpreted as "include but not limited to".

In view of the disadvantages of conventional probe cards, such as difficulty in maintenance, easy damage to the circuit contacts under test, high cost, and difficulty in density, the present invention proposes a probe device, which divides the probe device into: Signal derivation element, upper fixing element, signal transmission element, lower fixing element and probe. The above fixing element and the lower fixing element clamp the signal transmission element to strengthen the mechanical strength of the signal transmission element after the width and thickness are reduced, and it is applicable Smaller probes can solve the shortcomings of conventional probe cards such as difficulty in maintenance, easy damage to the circuit contacts under test, high cost, and difficulty in density.

The following will further explain the characteristics and matching structure of the probe device disclosed in the present invention. First, please refer to the first figure, which is an exploded view of an embodiment of the present invention. As shown in the figure, the probe device 1 of this embodiment includes a signal transmission element 30, such as an elastic steel sheet, which includes a first transmission portion 32 having a first width W1, and a first transmission portion 32 relative to the first transmission portion. 32 and the second transmission portion 34 with the second width W2, so that the elasticity and flexibility of the first transmission portion 32 is better than that of the second transmission portion 34; the lower fixing element 40 is, for example, a heat-resistant ceramic material or an insulating engineering plastic material In this embodiment, one end of the lower fixing element 40 has a first through hole 44 and one of the ends has a first groove 42; the probe 50 is, for example, a double-ended solid copper needle with a hollow spring attached. The spring probe has an output part 52, a third diameter part 54, a fourth diameter part 56, and a detection part 58.

In this embodiment, it further includes a signal derivation element 10 and an upper fixing element 20. The signal derivation element 10 is, for example, a copper thimble, which has a lead-out portion 12 for soldering signal lines, a first diameter portion 14, and a second diameter portion 16 and bottom 18; the upper fixing element 20, which is, for example, a heat-resistant ceramic material, insulating engineering plastic material strip, in this embodiment, the upper fixing element 20 has a second groove 22 under one of its ends and another One end has a second through hole 24.

In this embodiment, it further includes a substrate 60 and a limiting member 70. The substrate 60 is, for example, a Teflon sheet or a ceramic sheet, which has an opening 62; the limiting member 70 is, for example, an impact-resistant bump made of ABS engineering plastic. , Ceramic block, the limiting member 70 has a third through hole 72.

Please refer to the second and third figures. The second figure is a schematic front view of an embodiment of the present invention, and the third figure is another schematic front view of an embodiment of the present invention. As shown in the figure, in this embodiment, the first through hole 24 of the upper fixing element 20 has a first aperture portion 242 having a first aperture E1, and a second aperture portion 244 having a second aperture E2; the lower fixing element 40 The second through hole 44 has a third aperture 442 with a third aperture E3, and a fourth aperture 444 with a fourth aperture E4.

The following describes the connection relationship and the effect of each element; the lower fixing element 40 is disposed under one of the signal transmission elements 30, and the first through hole 44 at one end of the lower fixing element 40 is for the probe 50 to pass through and provides additional The supporting force strengthens the mechanical strength of the first transmission portion 32 and the second transmission portion 34, and the first width W1 of the first transmission portion 32 is greater than the second width W2 of the second transmission portion 34, so that the wider second transmission portion At least one point of 34 is fixed to the lower fixing element 40, such as screwing or bonding, so as to avoid the problem of the signal transmission element 30 sliding and loosening.

Following the above, in this embodiment, the other end of the lower fixing element 40 can provide support when the signal deriving element 10 is inserted and disposed above one of the first transmission portions 32, and the upper fixing member 20 and the lower fixing member 40 can be used The signal transmission element 30 is clamped to provide a more stable structure.

The signal derivation element 10 is a second through hole 24 that penetrates the first end of the upper fixing element 20, and is inserted above one of the first transmission portions 32 and is electrically connected to the first transmission portion 32; the signal derivation element The first diameter portion 14 of 10 has a first diameter D1, which corresponds to the first aperture portion 242 of the second through hole 24, and the second diameter portion 16 of the signal-deriving element 10 has a second diameter D2, which corresponds to the second through hole 24 of the second aperture portion 244; the signal transmission element 30 is disposed under one of the upper fixing element 20 and the signal derivation element 10, and the second transmission portion 34 is exposed to the second groove 22 of the upper fixing element 20.

Following the above, because the first diameter D1 is close to the first aperture E1 and the second diameter D2 is close to the second aperture E2. Therefore, the lead-out element 10 is loosely fitted by the first diameter portion 14, the second diameter portion 16 and the first aperture portion 242 and the second aperture portion 244 of the second through hole 24 respectively; and since the first diameter D1 is smaller than the second diameter D2, the first aperture E1 is smaller than the second aperture E2, so the second diameter portion 16 of the signal derivation element 10 abuts against the first aperture portion 242 of the second through hole 24, and at the same time forces the bottom 18 of the signal derivation element 10 to be inserted. Above one of the first transmission parts 32 so as to maintain a firm insertion and good electrical connection with the first transmission part 32.

Similarly, the third diameter portion 54 has a first diameter D3, the fourth diameter portion 56 has a fourth diameter D4, the third diameter D3 is approximately the third aperture E3, and the fourth diameter D4 is approximately the fourth aperture E4. Therefore, the probe 50 is loosely fitted with the third aperture 442 and the fourth aperture 444 of the first through hole 44 through the third diameter portion 54 and the fourth diameter portion 56 respectively; and because the third diameter D3 is larger than the fourth diameter D4, the third aperture E3 is greater than the fourth aperture E4, so the third diameter portion 54 of the signal probe 50 abuts against the fourth aperture portion 444 of the first through hole 44, and at the same time forces the output portion 52 of the signal probe 50 to abut It is connected to the bottom of one of the second transmission parts 34 and kept in the first through hole 44 and is well electrically connected to the first transmission part 32 of the signal transmission element 30.

Finally, the substrate 60 is located under the probe 50 and the lower fixing member 40, and has an opening 62 that is the same as the limiting member 70; the limiting member 70 is fixed on the substrate 60 by embedding in the opening 62, and has a third through hole 72 for the probe 50 to pass.

Please refer to Figure 4, which is another schematic front view of an embodiment of the present invention. As shown in the figure, in this embodiment, when the probe device 1 moves in a direction approaching the pad 82 of a circuit board 80 to be tested, the detection portion 58 of the probe 50 abuts the pad 82, and the probe 50 receives The reaction force of the pad 82 moves toward the second transmission portion 34, and the second transmission portion 34 is bent toward the second groove 22 of the upper fixing element 20, thereby the elasticity of the second transmission portion 34 provides recovery The force ensures that the detection portion 58 is in good electrical connection after abutting the pad 82, and at the same time, the limiting member 70 abuts against the fixing element 40 in the first groove 42, thereby restricting the probe 50 to stop rising to keep the signal transmission element 30 in position. The second transmission part 34 is repeatedly used within the elastic deformation range to avoid damage due to plastic deformation.

Please refer to the fourth figure and the fifth figure again. The fifth figure is another schematic front view of an embodiment of the present invention. As shown in the figure, in this embodiment, after the inspection is completed, the probe device 1 moves away from the pad 82 of the circuit board 80 under test, and the elasticity of the second transmission portion 34 again provides a restoring force to push the probe 50 returns to its original position.

In this example, the signal transmission element is supported by the lower fixing element to reinforce the mechanical strength of the signal transmission element after the width and thickness are reduced, so that the width of the probe device of the present invention can be reduced and it is suitable for smaller probes. The use of a plurality of probe devices of the present invention can realize high-density array of probe cards, which can be applied to the detection of high-frequency electronic components, and the use of lower fixed components further eliminates the welding between signal transmission components and signal output components, and signal transmission The soldering between the component and the probe makes the structure of this embodiment applicable to a high temperature environment higher than the melting point of the soldering point; in addition, the probe of the present invention is limited by the first through hole and the third through hole, so it can be maintained The pads of the circuit under test are not skewed perpendicularly, the probe is not easy to wear and form an acute angle, so it is not easy to pierce or scratch the pads, and the setting of the limiter restricts the pressing stroke of the probe module without overpressure This leads to damage to the circuit components or pads under test; moreover, the circuit of the probe device of the new type is composed of signal derivation components, signal transmission components and probes in series with 3 sections, and each component can be manufactured separately and assembled without using The expensive photolithography process requires only the upper fixing element and the signal transmission element to be separated to replace the faulty ones of the above three elements, and achieve the new purpose of easy maintenance and low cost.

The signal derivation element and the probe both have two ends of solid metal and a hollow middle section, and an elastic body is arranged in the middle section, and one end of the signal transmission element corresponding to the probe is exposed in the second groove, and the limiting element has A through hole protects the probe and keeps it vertical when the needle enters and exits; when the probe device performs detection on a circuit to be tested and presses down, the elastic body in the middle section of the probe provides the first buffer and the middle section of the signal derivation element The elastic body provides the second stage of cushioning, and the signal transmission element is elastically deformed toward the second groove after one end of the corresponding probe abuts on the probe to generate an additional third stage of cushioning; and the limit element solves the problem of sharp angles caused by the wear of the probe The problem of avoiding damage to the circuit under test; and because the elastic deformation of the new type occurs at one end of the signal transmission element corresponding to the probe, the problems such as wear or fatigue deformation mainly occur here, so only the signal transmission element needs to be replaced. The entire probe device can be repaired. The repair is simple and can be completed quickly by the user. No need to purchase spare parts. When replacing the probe device, you only need to replace the probe and not necessarily replace the signal transmission component and signal derivation component. The probe The production also does not need to go through the photomask to carry out the photolithography process, so the purpose of reducing the cost can be achieved.

In summary, the present invention provides a probe device that uses an upper fixing element and a lower fixing element to sandwich the signal transmission element to reinforce the mechanical strength of the signal transmission element, so as to reduce the width of the probe device to achieve easy maintenance and high-density arrangement And the purpose of low cost, in addition, it also controls the signal transmission element to produce controlled elastic deformation during the probe detection process to achieve the purpose of not damaging the circuit under test.

Therefore, this model is really novel, progressive, and available for industrial use. It should meet the patent application requirements of my country's patent law. Undoubtedly, I file a new patent application in accordance with the law. I pray that the Bureau will grant the patent as soon as possible.

However, the above is only an embodiment of the present model, and is not used to limit the scope of implementation of the present model. Therefore, all the equivalent changes and modifications of the shape, structure, characteristics and spirit described in the scope of the patent application of the present model are listed. All should be included in the scope of the patent application for this new model.

1: Probe device 10: Signal export components 12: Export Department 14: The first diameter part 16: second diameter part 18: bottom 20: fixed element 22: second groove 24: second through hole 242: The first aperture 244: second aperture 30: Signal transmission components 32: The first transmission section 34: The second transmission part 40: Lower fixing element 42: first groove 44: The first through hole 442: Third Aperture 444: Fourth Aperture 50: Probe 52: output section 54: third diameter part 56: Fourth diameter part 58: Inspection Department 60: substrate 62: opening 70: limit piece 72: third through hole 80: Test circuit board 82: pad D1: first diameter D2: second diameter D3: third diameter D4: Fourth diameter E1: first aperture E2: second aperture E3: third aperture E4: Fourth aperture W1: first width W2: second width

The first figure: it is an exploded view of an embodiment of the new model; Figure 2: It is a schematic front view of an embodiment of the new model; Figure 3: It is another schematic front view of an embodiment of the new model; Figure 4: It is another schematic front view of an embodiment of the new model; and Figure 5: It is another schematic front view of an embodiment of the new model.

1: Probe device

10: Signal export components

12: Export Department

14: The first diameter part

16: second diameter part

18: bottom

20: fixed element

22: second groove

24: second through hole

30: Signal transmission components

32: The first transmission section

34: The second transmission part

40: Lower fixing element

42: first groove

44: The first through hole

50: Probe

52: output section

54: third diameter part

56: Fourth diameter part

58: Inspection Department

60: substrate

62: opening

70: limit piece

72: third through hole

W1: first width

W2: second width

Claims (10)

A probe device comprising: A signal transmission element, comprising a first transmission portion and a second transmission portion, a first width of the first transmission portion is greater than a second width of the second transmission portion; A probe, one end of which is electrically connected and arranged below the second transmission part; and The lower fixing element is arranged under one of the signal transmission elements, one end of the lower fixing element has a first through hole, and the probe penetrates the first through hole of the lower fixing element. The probe device according to claim 1, wherein a first groove is provided under one of the ends of the lower fixing element, and the probe is located in the first groove. The probe device according to claim 1, further comprising a signal derivation element, which is electrically connected to and disposed above one of the first transmission parts. The probe device according to claim 1, further comprising an upper fixing element disposed above one of the signal transmission elements. The probe device according to claim 3, wherein one end of the upper fixing element has a second groove, and the probe is located under one of the second grooves, and the signal derivation element passes through the upper fixing A second through hole at the other end of the component. The probe device as described in claim 1, further comprising: A substrate, which is disposed under one of the lower fixing elements, and has an opening; and A limiting member is arranged in the opening of the substrate corresponding to the first groove, and the probe penetrates the limiting member. The probe device according to claim 5, wherein the second through hole further has a first aperture portion and a second aperture portion, and a first aperture of the first aperture portion is smaller than that of the second aperture portion A second aperture. The probe device according to claim 7, wherein the signal deriving element has a first diameter portion and a second diameter portion, and a first diameter of the first diameter portion corresponds to the first diameter portion of the first diameter portion. Aperture, and a second diameter of the second diameter portion corresponds to the second aperture of the second aperture portion. The probe device according to claim 1, wherein the first through hole further has a third aperture and a fourth aperture, and a third aperture of the third aperture is larger than that of the fourth aperture. A fourth aperture. The probe device according to claim 9, wherein the probe has a third diameter portion and a fourth diameter portion, and a third diameter of the third diameter portion corresponds to the third aperture of the third aperture portion , And a fourth diameter of the fourth diameter portion corresponds to the fourth diameter of the fourth diameter portion.

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