TWM609840U - Protective film device for die - Google Patents

Abstract

A crystal grain protective film device is suitable for protecting a plurality of crystal grains and includes a first and a second protective film unit. The first protective film unit includes a first base layer, a coating layer with an uneven coating surface, and a bearing layer combined with the coating surface and having a bearing surface. The covering mask has a covering face covered by the bearing layer and a surrounding face surrounding the covering face. The bearing surface is flat and used for placing the crystal grains. The second protective film unit is used for protecting the crystal grains together with the carrier layer, and includes a second base layer and an adhesive layer. The adhesive layer can be peeled to bond the surrounding face and the bearing layer. Utilizing the design of the supporting layer and the covering layer, the placed crystal grains are not easy to fall, and the first and second protective film units are also easily torn apart from each other.

Description

Crystal grain protective film device

The new model relates to a protective film device, in particular to a crystal grain protective film device that is easy to tear and can maintain the crystal grains to be flat and not inclined.

It is known that after a wafer is manufactured, in order to facilitate subsequent processing, the wafer is first cut into individual dies, and then a protective film for protecting the dies is placed.

Generally, the protective film mainly includes a supporting base layer for placing the crystal grains, and an adhesive cover layer that can be peelably adhered to the supporting base layer and covering the crystal grains.

Since the size of the crystal grains is very small, usually only about 100 μm, when the supporting base layer is not flat, the crystal grains are easy to skew and fall, which makes it difficult for the crystal grains to be taken out by the clamp during the subsequent processing, or The die is difficult to use automated machines to perform related test items and other problems; but when the bonding surface of the bearing base layer and the bonding cover layer is a flat surface, the bonding cover layer will be tightly bonded On the supporting base layer, it is not easy to tear off from the supporting base layer.

This is because how to make the adhesion-bearing cap layer easy to tear from the load-bearing base layer while keeping the crystal grains neatly arranged and not tilted has become one of the research topics in the art.

Therefore, the object of the present invention is to provide a die film protection device that can at least overcome the shortcomings of the prior art.

Therefore, the new crystal grain protective film device is suitable for protecting a plurality of crystal grains, and includes a first protective film unit and a second protective film unit.

The first protective film unit includes a first base layer, a covering layer bonded to the first base layer and having an uneven covering surface spaced apart from the first base layer, and a covering layer bonded to the covering layer The covering surface is provided with a bearing layer of a bearing surface spaced from the covering surface. The sticking mask of the sticking layer has a covering face covered by the bearing layer, and a surrounding face surrounding the covering face and exposed from the bearing layer. The bearing surface of the bearing layer is flat and suitable for placing the crystal grains.

The second protective film unit is adapted to protect the crystal grains together with the carrier layer of the first protective film unit, and includes a second base layer opposite to the first base layer, and an adhesive bonded to the second base layer Floor. The sticking layer can be peeled to bond the surrounding face of the sticking surface and the bearing layer.

The effect of the present invention is to utilize the design of the bearing surface of the bearing layer and the surrounding surface of the covering surface, so that the crystal grains placed between the first protective film unit and the second protective film unit are not easily skewed It is dumped, and the second protective film unit is easily torn off from the first protective film unit.

Before the present invention is described in detail, it should be noted that in the following description, similar elements are represented by the same numbers.

Referring to FIGS. 1 and 2, a first embodiment of the new type of die film protection device is suitable for protecting a plurality of die 9. The die protective film device includes a first protective film unit 1 and a second protective film unit 2 that can be peelably adhered to the first protective film unit 1.

The first protective film unit 1 includes a first base layer 11 having an outer surface 111 and an inner surface 112 oppositely arranged, and a first base layer 11 bonded to the outer surface 111 of the first base layer 11 and used to support the first base layer 11. The surface layer 12, a coating layer 13 bonded to the inner surface 112 of the first base layer 11, and a carrier layer 14 bonded to a part of the coating layer 13.

The first base layer 11 of the first protective film unit 1 is a paper product. The surface layer 12 of the first protective film unit 1 is a sheet made of polymer. The polymer is selected from polyolefin (PO for short), ethylene-vinyl acetate copolymer (EVA for short), and combinations of the foregoing. The polyolefin can be selected from polyethylene (PE for short) or polypropylene (PP for short).

The covering layer 13 is similar to the surface layer 12, and is a sheet made of polymer. The polymer is selected from polyolefin (PO for short), ethylene-vinyl acetate copolymer (EVA for short), and combinations of the foregoing. The polyolefin can be selected from polyethylene (PE for short) or polypropylene (PP for short). The covering layer 13 is generally square and has a covering surface 131 spaced from the first base layer 11. The covering surface 131 is uneven and has a covering face 132 that is generally square and covered by the carrier layer 14, and a covering face 132 that extends horizontally outward from the edge of the covering face 132 and surrounds the covering face 132 to surround the covering face 132 The "mouth" shape surrounds the face 133. The covering surface 132 of the covering surface 131 has a plurality of concave regions 134 arranged in an array and recessed in a direction opposite to the second protective film unit 2, and a mesh-shaped connection with the concave regions 134的projection area 135. The surrounding surface 133 of the covering surface 131 has a plurality of recessed areas 136 arranged in an array and recessed in a direction opposite to the second protective film unit 2, and a mesh-shaped protrusion connected to the recessed areas 136 From area 137.

In this embodiment, each part of the raised area 137 is substantially equal in height. The recessed areas 134 of the covering face 132 and the recessed areas 136 of the surrounding face 133 together form a plurality of recesses 138 arranged in an array and each being a rectangular parallelepiped. The protruding area 135 of the covering face 132 and the protruding area 137 of the surrounding face 133 together form a grid-shaped protrusion 139. In this embodiment, the covering surface 131 of the covering layer is embossed by a roller having a three-dimensional pattern structure corresponding to the concave portions 138 and the convex portions 139. In other variations of this embodiment, the recessed areas 134 of the covering face 132 and the recessed areas 136 of the surrounding face 133 may also jointly form a plurality of rhombuses or ellipse circles arranged in an array when viewed from above. In other variations of this embodiment, the concavities and convexities surrounding the face 133 can also be reversed, that is, the positions of the concave regions 136 are convex, and the positions of the convex regions 137 are concave.

The carrier layer 14 is made of materials selected from polyethylene terephthalate (PET), polyolefin (PO), and ethylene-vinyl acetate copolymer (ethylene-vinyl acetate, Referred to as EVA), and a group composed of one of these combinations. The polyolefin may be selected from polyethylene (PE) or polypropylene (PP). The carrier layer 14 has a square shape and is combined with the covering face 132 of the covering layer 13, and the surrounding face 133 of the covering layer 13 is exposed. The supporting layer 14 has a supporting surface 141 suitable for placing the dies 9 and spaced apart from the covering surface 131 of the covering layer 13. The bearing surface 141 has a flat surface and a square shape. In other variations of this embodiment, the bearing surface 141 is not limited to the square shape, and can also be other types of square, circular, or elliptical, or the bearing surface 141 of the bearing layer 14 is selected from a circle. One of shape and polygon. As long as it is a flat surface. In this embodiment, the covering layer 13 and the carrier layer 14 are bonded by coating an adhesive (not shown), and the adhesive is made of materials selected from acrylic glue, rubber , Polyurethane glue, epoxy glue, silicone glue, and a combination of these.

The second protective film unit 2 has a square shape and includes a second base layer 21 opposite to the first base layer 11 and an adhesive layer 22 combined with the second base layer 21. The second base layer 21 is made of a polymer selected from polyolefin, polyester, and combinations thereof. The polyolefin may be selected from polyethylene, polypropylene or polyvinyl chloride (PVC for short), and the polyester may be selected from polyethylene terephthalate. The adhesive layer 22 can be peeled to bond the bearing surface 141 of the bearing layer 14 and the surrounding surface 133 of the covering surface 131, and is suitable for protecting the dies 9 together with the bearing layer 14. The adhesive layer 22 is formed by coating on a surface 211 of the second base layer 21 facing the first protective film unit 1, and has a bearing surface 141 that can be peeled to bond the bearing layer 14 to the sticker The adhesive surface 221 surrounding the face 133 of the covering surface 131. The sticking surface 221 is a flat surface. The adhesive layer 22 is made of an adhesive, and the adhesive is specifically an acrylic or rubber pressure sensitive adhesive. The adhesive layer 22 has a lower viscosity than the adhesive between the carrier layer 14 and the adhesive layer 13. Therefore, the adhesive force between the bearing layer 14 and the covering layer 13 is greater than the adhesive force of the adhesive layer 22 to the bearing layer 14.

When the first embodiment is in use, the dies 9 are placed between the bearing surface 141 of the bearing layer 14 and the sticking surface 221 of the sticking layer 22. The adhesive layer 22 adheres to the area of the carrying surface 141 where the dies 9 are not placed, so that the dies 9 are positioned on the carrying surface 141 of the carrying layer 14 and the adhesive surface 221 of the adhesive layer 22 between. In addition, the surrounding surface 133 of the adhesive surface 131 is also adhered and fixed to the adhesive surface 221 of the adhesive layer 22 by using the protruding areas 136.

When the dies 9 are placed on the bearing surface 141 of the bearing layer 14, since the bearing surface 141 is a continuous and flat surface, it is located between the first protective film unit 1 and the second protective film unit 2. The crystal grains 9 in between will not tilt or fall.

When the user wants to take out the dies 9, the first protective film unit 1 and the second protective film unit 2 need to be torn apart. Specifically, in the tearing process, the surrounding surface 133 of the adhesive layer 13 and the adhesive layer 22 are first torn away from the corners, and then the supporting layer 14 on which the dies 9 are placed is further driven. Tear off from the adhesive layer 22. Since the die 9 is placed between the carrier layer 14 and the adhesive layer 22, the carrier layer 14 will not be adhered to the adhesive layer 22 over the entire surface, so that the carrier layer 14 is easily torn from the adhesive layer 22 from.

Referring to Figures 3 and 4, there is a second embodiment of the new die film protection device. The second embodiment is similar to the first embodiment, except that the overlay 131 of the second embodiment The surrounding face 133 is a rough surface, and the height difference range of the surrounding face 133 is 3-40 μm. In this second embodiment, since the covering layer 13 of the second embodiment is made to roughen the covering surface 131 over the whole surface, the covering surface 131 is a continuous and whole surface rough surface.

To sum up, the new type of die protective film device utilizes the supporting surface 141 of the supporting layer 14 to be a continuous and complete plane, so that the die 9 can be placed in the first protective film unit 1 and the first protective film unit 1 and The second protective film unit 2 is not easy to tilt and fall. In combination with the uneven surrounding surface 133 of the covering surface 131, the second protective film unit 2 is easily torn off from the first protective film unit 1. In addition, as long as the carrier layer 14 is combined with the overlay layer 13, it can provide a flat surface on which the dies 9 are placed, and the production is relatively simple and not complicated, so it can indeed achieve the purpose of cost innovation.

However, the above are only examples of the present model, and should not be used to limit the scope of implementation of the present model, all simple equivalent changes and modifications made in accordance with the patent scope of the present model application and the contents of the patent specification still belong to This new patent covers the scope.

1: The first protective film unit 11: The first grassroots 111: Outer surface 112: inner surface 12: Surface 13: Paste the overlay 131: Laminate 132: Cover the face 133: around the face 134: Concave Area 135: protruding area 136: Depressed Area 137: raised area 138: Depressed part 139: Bulge 14: Carrier layer 141: bearing surface 2: The second protective film unit 21: The second grassroots 211: Surface 22: Adhesive layer 221: Adhesive Surface 9: Die

The other features and effects of the present invention will be clearly presented in the embodiments with reference to the drawings, among which: Figure 1 is a three-dimensional exploded view illustrating a first embodiment of the new crystal grain protective film device; 2 is a cross-sectional view taken along the line II-II of FIG. 1, and illustrates that the first embodiment is suitable for protecting a plurality of dies; Figure 3 is a three-dimensional exploded view illustrating a second embodiment of the new type of die protecting film device; and Fig. 4 is a cross-sectional view taken along line IV-IV of Fig. 3 and illustrates that the second embodiment is suitable for protecting the crystal grains.

1: The first protective film unit

11: The first grassroots

111: Outer surface

112: inner surface

12: Surface

13: Paste the overlay

131: Laminate

132: Cover the face

133: around the face

134: Concave Area

135: protruding area

136: Depressed Area

137: raised area

138: Depressed part

139: Bulge

14: Carrier layer

141: bearing surface

2: The second protective film unit

21: The second grassroots

22: Adhesive layer

221: Adhesive Surface

Claims (9)

A crystal grain protective film device is suitable for protecting multiple crystal grains. The crystal grain protective film device includes: A first protective film unit includes a first base layer, a covering layer bonded to the first base layer and having an uneven covering surface spaced from the first base layer, and a covering layer bonded to the covering layer The covering surface has a bearing layer with a bearing surface spaced from the covering surface, the covering face of the covering layer has a covering face covered by the bearing layer, and a covering face surrounding the covering face and exposed from the bearing layer And the surrounding face, the bearing surface of the bearing layer is flat and suitable for placing the dies; and A second protective film unit, adapted to protect the crystal grains together with the carrier layer of the first protective film unit, and includes a second base layer opposite to the first base layer, and a second base layer bonded to the second base layer Adhesive layer, the adhesive layer can be peeled to bond the surrounding face of the overlay surface and the bearing layer. The crystal grain protective film device according to claim 1, wherein the material of the supporting layer of the first protective film unit is selected from polyethylene terephthalate (PET) and polyolefin Polyolefin (PO for short), ethylene-vinyl acetate (EVA for short), and a combination of these. The crystal grain protective film device according to claim 1, wherein the material of the coating layer of the first protective film unit is a sheet made of polymer, and the polymer is selected from polyolefin (polyolefin, abbreviated as polyolefin). PO), ethylene-vinyl acetate (EVA for short), and combinations of the foregoing. The die protective film device according to claim 1, wherein the surrounding surface of the covering surface has a plurality of recessed areas spaced apart and recessed in a direction opposite to the second protective film unit. The die protective film device according to claim 4, wherein the surrounding surface of the covering surface further has a raised area connecting the recessed areas. The crystal grain protective film device according to claim 5, wherein the concave regions surrounding the face are arranged in an array, and the convex regions surrounding the face are in a mesh shape. The die protective film device according to claim 1, wherein the surrounding surface of the covering surface is a rough surface. The die protective film device according to claim 7, wherein the height difference of the surrounding face of the covering surface is 3-40 μm. The die protective film device according to claim 1, wherein the bearing surface of the bearing layer is selected from one of a circular shape and a polygonal shape.

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