TWM607729U - Bonding pad structure for electronic device - Google Patents

Abstract

A bonding pad structure for electronic device includes a substrate and a flexible printed circuit board. Aplurality of first pins are disposed on the substrate. Aplurality of second pins are disposed on the flexible printed circuit board. The first pins and the second pins are bonding to each other to form a plurality of bonding pins. The bonding pins include at least one central bonding pin and at least two first bonding pins. The at least one central bonding pin is located at the center of the bonding pins. The at least two first bonding pins are far from the at least one central bonding pin and are mirror-symmetrical on the basis of the at least one central bonding pin. The at least one central bonding pin includes a first end and a second end. The first width a of the first end and the second width b of the second end satisfy the relation 0＜a/b≦1. One of the at least two first bonding pins between one of the side of the substrate includes a tilt angle θ, the tilt angle θ satisfy the relation 0＜θ≦90。

Description

Bonding pad structure for electronic device

This case involves an electronic device. In detail, this case relates to a bonding pad structure for electronic devices.

Existing display panels are developing towards ultra-thin flexible substrate technology, and in order to increase the screen-to-body ratio of the panel, the bonding area around the panel is constantly compressed.

In addition, during the manufacturing process, the pin material expands and shrinks due to heat, which causes the problem of offset during bonding. According to the prior art CN201571253U, it is known that the traditional two mutually superimposed circuit substrates have to face the problem of increased tolerances when they are superimposed and aligned, and the resistance to expansion and contraction of the rigid board material itself is often used to reduce the misalignment; however, in the face With the development of the next generation of ultra-thin flexible substrate technology, the problem of thermal expansion and contraction of the laminated film substrate itself will be more serious. The traditional laminating method can no longer effectively suppress the ectopic laminating; therefore, it is necessary for practitioners in the field to develop the rest It is suitable for the design method that can resist the out-of-position pressing.

One aspect of this case relates to a bonding pad structure for electronic devices. The bonding pad structure for electronic devices includes a substrate and a flexible circuit board. The substrate includes a plurality of first pins. The plurality of first pins are arranged on the substrate. The flexible circuit board contains a plurality of second pins. The plurality of second pins are arranged on the flexible circuit board. The plurality of first pins and the plurality of second pins are connected to each other to form a plurality of bonding pins. The plurality of bonding pins includes at least one central bonding pin and at least two first bonding pins. At least one central bonding pin is located at the center of the plurality of bonding pins. The at least two first bonding pins are farthest away from the at least one central bonding pin, and the at least one central bonding pin is mirror-symmetrical. The at least one central bonding pin includes a first end and a second end. The first width of the first end is set to a. The second width of the second end is set to b. a and b satisfy the relationship 0<a/b≦1. One of the at least two first bonding pins has an inclination angle with one side of the substrate. The tilt angle is set to θ. θ satisfies the relational expression 0<θ≦90.

In some embodiments, the plurality of bonding pins further includes at least two second bonding pins. The at least two second bonding pins are located between the at least one central bonding pin and the at least two first bonding pins and are mirror-symmetrical with the at least one central bonding pin. One of the at least two second bonding pins includes a third end and a fourth end. The third width at the third end is set to c, and the fourth width at the fourth end is set to d, and c and d satisfy the relationship 0<c/d≦1.

In some embodiments, the first width of the first end of the at least one central bonding pin is the same as the third width of the third end of one of the at least two second bonding pins.

In some embodiments, the second width of the second end of the at least one central bonding pin is the same as the fourth width of the fourth end of one of the at least two second bonding pins.

In some embodiments, a first distance is included between the first end of the at least one central bonding pin and the third end of one of the at least two second bonding pins. The first pitch, the first width of the first end, and the third width of the third end are all the same.

In some embodiments, a second distance is included between the second end of the at least one central bonding pin and the fourth end of one of the at least two second bonding pins. The second pitch, the second width of the second end, and the fourth width of the fourth end are all the same. The first distance is smaller than the second distance.

In some embodiments, the plurality of bonding pins are located in the bonding area of the electronic device. The relationship between the second pitch, the second width at the second end, and the fourth width at the fourth end, and the length of the joining area are as follows: b=d=f=L/(x+y) Where b is the second width of the second end, d is the fourth width of the fourth end, f is the second pitch, L is the length of the bonding area, x is the number of bonding pins, and y is the bonding connection The number of spaces between the feet.

In some embodiments, at least one central bonding pin includes a trapezoid shape, at least two first bonding pins include a trapezoid shape, and at least two second bonding pins include a trapezoid shape.

In some embodiments, at least one central joint pin, at least two first joint pins and at least two second joint pins are arranged on the same straight line.

In some embodiments, the plurality of bonding pins further includes at least two third bonding pins. The at least two third bonding pins are located between the at least two first bonding pins and the at least two second bonding pins and are mirror-symmetrical with the at least one central bonding pin. One of the at least two third bonding pins includes a fifth end and a sixth end. The fifth width of the fifth end is less than g, and the sixth width of the sixth end is h, and g and h satisfy the relationship 0<g/h≦1.

In some embodiments, the third end of one of the at least two second bonding pins and the fifth end of one of the at least two third bonding pins comprise a three pitch. The fourth end of one of the at least two second bonding pins and the sixth end of one of the at least two third bonding pins include a fourth pitch. The third distance is smaller than the fourth distance.

In some embodiments, the first pitch, the third pitch, the first width, the third width, and the fifth width are equal, and the second pitch, the fourth pitch, the second width, the fourth width, and the sixth width are equal.

In some embodiments, at least one central joint pin, at least two first joint pins, at least two second joint pins, and at least two third joint pins are arranged on the same straight line.

In some embodiments, during the pre-bonding process of the plurality of bonding pins, one of the plurality of first pins and the plurality of second pins has an amount of expansion and contraction.

Another aspect of this case relates to the bonding pad structure for electronic devices. The bonding pad structure for electronic devices includes a bonding pad structure for electronic devices including a substrate and a flexible circuit board. The substrate includes a plurality of first pins. The plurality of first pins are arranged on the substrate. The flexible circuit board contains a plurality of second pins. The plurality of second pins are arranged on the flexible circuit board. The plurality of first pins and the plurality of second pins are connected to each other to form a plurality of bonding pins. The plurality of bonding pins includes at least one central bonding pin and at least two first bonding pins. At least one central bonding pin is located at the center of the plurality of bonding pins. The at least two first bonding pins are farthest away from the at least one central bonding pin, and the at least one central bonding pin is mirror-symmetrical. The at least one central bonding pin includes a first end and a second end. The first width of the first end is set to a'. The second width of the second end is set to b'. a'and b'satisfy the relationship a'/b'≧1. One of the at least two first bonding pins has an inclination angle with one side of the substrate. The tilt angle is set to φ. φ satisfies the relationship 0<φ≦90.

In some embodiments, the at least two second bonding pins are located between the at least one central bonding pin and the at least two first bonding pins and are mirror-symmetrical with the at least one central bonding pin. The at least two second bonding pins include a third end and a fourth end. The third width at the third end is set to c'. The fourth width of the fourth end is set as d'. c'and d'satisfy the relation c'/d'≧1.

In some embodiments, the first width of the first end of the at least one central bonding pin is the same as the third width of the third end of one of the at least two second bonding pins.

In some embodiments, the second width of the second end of the at least one central bonding pin is the same as the fourth width of the fourth end of one of the at least two second bonding pins.

In some embodiments, a first distance is included between the first end of the at least one central bonding pin and the third end of one of the at least two second bonding pins. The first pitch, the first width of the first end, and the third width of the third end are all the same.

In summary, the present application provides a bonding pad structure for an electronic device, so as to improve the problem of the offset of the pin material due to thermal expansion and contraction during bonding.

The above description is only used to explain the problem to be solved in this case, the technical means to solve the problem, and the effects produced by it, etc. The specific details of this case will be described in detail in the following embodiments and related drawings.

The following will clearly illustrate the spirit of this case with diagrams and detailed descriptions. Anyone with ordinary knowledge in the technical field who understands the embodiments of this case can change and modify the technology taught in this case without departing from the scope of this case. Spirit and scope.

The terms used herein are only to describe specific embodiments, and are not intended to limit the present application. Singular forms such as "a", "this", "this", "本" and "this", as used herein, also include plural forms.

Regarding the "include", "include", "have", "contain", etc. used in this article, they are all open terms, which means including but not limited to.

Regarding the terms used in this article, unless otherwise specified, each term usually has the usual meaning when used in this field, in the content of this case, and in the special content. Some terms used to describe the case will be discussed below or elsewhere in this specification to provide those skilled in the art with additional guidance on the description of the case.

In some embodiments, in order to make the structure of the electronic device 100 of the present invention easy to understand, please refer to FIGS. 1A to 1B together. FIG. 1A is a schematic diagram of expected pins drawn according to some embodiments of the present invention. FIG. 1B is a schematic diagram of actual pins according to some embodiments of the present application. Please refer to FIGS. 1A to 1B. The electronic device 100 includes a substrate 120 and a flexible circuit board 220. In some embodiments, the electronic device 100 may be a panel and a display device.

In some embodiments, referring to FIGS. 1A and 1B, the substrate 120 includes pins 10. The flexible circuit board 220 includes pins 20. In simulation, it is expected that the pin 10 and the pin 20 overlap completely as shown in Fig. 1A. However, in practice, the pin 10 and the pin 20 will expand and contract due to the connection of the body material, resulting in a misalignment as shown in Figure 1B.

In some embodiments, in order to make the bonding pad structure of the electronic device 100 of the present application easy to understand, please refer to FIGS. 2 to 4 together. FIG. 2 is a schematic diagram of the pins of the substrate drawn according to some embodiments of the present application. FIG. 3 is a schematic diagram of the pins of the flexible circuit board according to some embodiments of the present application. FIG. 4 is a schematic diagram of bonding pins according to some embodiments of the present application.

In some embodiments, please refer to FIG. 2, which is a schematic diagram of the substrate pins in the electronic device 100. The substrate 120 includes a plurality of first pins 110. The internal error of the width a1 at the upper end of the first pin 110 is within ±50 μm. The internal error of the width b1 of the lower end of the first pin 110 is within ±50 μm.

In some embodiments, please refer to FIG. 3, which is a schematic diagram of the pins of the flexible circuit board in the electronic device 100. The flexible circuit board 220 includes a plurality of second pins 210. The internal error of the width a2 of the upper end of the second pin 210 is within ±50 μm. The internal error of the width b2 of the lower end of the second pin 210 is within ±50 μm.

In some embodiments, referring to FIGS. 2 to 4, the plurality of first pins 110 and the plurality of second pins 210 are connected to each other to form a plurality of bonding pins 310. In some embodiments, Z is the width of the bonding area where the plurality of first pins 110 and the plurality of second pins 210 are actually bonded.

FIG. 5 is a schematic diagram of bonding pins according to some embodiments of the present application. In some embodiments, the plurality of bonding pins 310 in FIG. 4 are actually bonded to form bonding pins 410, 420, and 430 as shown in FIG. 5. The electronic device 100 includes a first side M1 and a second side M2. It should be noted that in Figure 5, although the first side M1 and the second side M2 are shown as the left side and the right side in the figure, in practice, , The first side M1 and the second side M2 are not limited to the left and right sides.

In addition, the plurality of bonding pins includes at least one central bonding pin 410 and at least two first bonding pins 450. At least one central bonding pin 410 is located at the center of the plurality of bonding pins. The at least two first bonding pins 450 are farthest away from the at least one central bonding pin 410 and exhibit mirror symmetry based on the at least one central bonding 410 pin. The first bonding pin 450 is closest to the first side M1 and the second side M2, and the included angle between the first bonding pin 450 and one side of the substrate 120 (the lower side as shown in the figure) is an inclination angle θ. When the bonding pin is closer to the center position, the tilt angle θ is closer to 90˚.

In addition, the first width of the first end is set to a. The second width of the second end is set to b. a and b satisfy the relationship 0<a/b≦1. One of the at least two first bonding pins 450 and one side of the substrate 120 (the lower side as shown in the figure) includes an inclination angle θ. θ satisfies the relational expression 0<θ≦90.

In some embodiments, the plurality of bonding pins further includes at least two second bonding pins 420 located between at least one central bonding pin 410 and at least two first bonding pins 450 and having at least one central bonding pin 410 Mirror symmetry. The at least two second bonding pins 420 include a third end and a fourth end. The third width of the third end is set to c. The fourth width of the fourth end is set to d. c and d satisfy the relational expression 0<c/d≦1.

In addition, at least one central bonding pin 410 includes a first end (upper end in the figure) and a second end (lower end in the figure). In some embodiments, at least one central bonding pin 410 may be trapezoidal.

In addition, one of the at least two second bonding pins 420 (the second bonding pin 420 on the right side in the figure) includes a third end (upper end in the figure) and a fourth end (lower end in the figure). In some embodiments, each of the second bonding pins 420 in the figure may be trapezoidal.

Furthermore, the at least two first bonding pins 450 closest to the two sides of the first side M1 and the second side M2 can all be trapezoidal.

In some embodiments, please refer to FIG. 5, the first width a of the first end of the at least one central bonding pin 410 is the same as the third width c of the third end of one of the at least two second bonding pins 420 .

In some embodiments, the second width b of the second end of the at least one central bonding pin 410 is the same as the fourth width d of the fourth end of one of the at least two second bonding pins 420.

In some embodiments, the first end of the at least one central joint pin 410 and the third end of one of the at least two second joint pins 420 (the second joint pin 420 on the right side in the figure) include The first distance e. The first distance e, the first width a of the first end, and the third width c of the third end are all the same.

In some embodiments, the second end of the at least one central joint pin 410 and the fourth end of one of the at least two second joint pins 420 (the second joint pin 420 on the right side in the figure) includes The second distance f. The second pitch f, the second width b at the second end, and the fourth width d at the fourth end are all the same. The first distance e is smaller than the second distance f. It should be noted that since the boundary line P1 of the at least one central bonding pin 410 and the boundary line P2 of one of the at least two second bonding pins 420 (the second bonding pin 420 on the right side in the figure) are not parallel, The interval gradually shrinks from the second interval f to the first interval e along the boundary line P1 and the boundary line P2.

In some embodiments, a plurality of bonding pins are located in the bonding area of the electronic device 100. The relationship between the second distance f, the second width b at the second end, and the fourth width d at the fourth end, and the length L of the joining area are as follows: b=d=f=L/(x+y)…Equation 1

In Equation 1, x is the number of bonding pins, and y is the number of intervals between the bonding pins. For example, the interval can be the number of bonding pins 410 and bonding 2 pins 420 in Figure 4 The distance between f.

Then, the relationship between the first distance e, the first width a at the first end, and the third width c at the third end, and the design length L1 of the joining area are as follows: a=c=e=L1/(x+y)…Equation 2

In Formula 2, L1 is the design length of the bonding area that makes the bonding pins appear in the shape of an "eight", and the above-mentioned relational expression of L and L1 satisfies 0<L1/L≦1.

In some embodiments, referring to FIG. 4, at least one central joint pin 410 is an isosceles trapezoid. It should be noted that when the number of joint pins on both sides of the at least one central pin 410 increases, The pattern of the bonding pins tends to be parallelograms.

In some embodiments, at least one central bonding pin 410, at least two second bonding pins 420, and at least two first bonding pins 450 are arranged on the same line.

In some embodiments, the plurality of bonding pins further includes at least two third bonding pins 430. The at least two third bonding pins 430 are located between the at least two second bonding pins 420 and the at least two first bonding pins 450 and exhibit mirror symmetry based on the at least one central bonding pin 410. One of the at least two third bonding pins 430 (the third bonding pin 430 on the right side in the figure) includes a fifth end (upper end in the figure) and a sixth end (lower end in the figure). The fifth width of the fifth end is set to g. The sixth width of one of the sixth ends is set to h. g and h satisfy the relational expression 0<g/h≦1.

In some embodiments, please refer to FIG. 4, the first end of one of the at least two second bonding pins 420 (the second bonding pin 420 on the right side in the figure) and the at least two third bonding pins 430 The third end of one of them (the third bonding pin 430 on the right side in the figure) includes a third spacing i.

In addition, the second end of one of the at least two second bonding pins 420 and the fourth end of one of the at least two third bonding pins 430 include a fourth pitch j. The third distance i is smaller than the fourth distance j. It should be noted that at least two second bonding pins 420 may be trapezoidal, and at least two third bonding pins 430 may be trapezoidal.

In some embodiments, the first distance e, the third distance i, the first width a at the first end, the third width c at the third end, and the fifth width g at the fifth end are equal. The second pitch f, the fourth pitch j, the second width b at the second end, the fourth width d at the fourth end, and the sixth width h at the sixth end are equal.

In some embodiments, at least one central bonding pin 410, at least two second bonding pins 420, at least two third bonding pins 430, and at least two first bonding pins 450 are arranged on the same line.

In some embodiments, referring to FIG. 5, it can be seen from the foregoing embodiments that the fourth bonding pin 440, the third bonding pin 430 and the first bonding pin 450 include an upper spacing o and an upper spacing t, respectively. The fourth bonding pin 440 includes an upper end width r and a lower end width s.

In some embodiments, the fourth bonding pin 440 and the third bonding pin 430 and the first bonding pin 450 include a lower spacing q and a lower spacing u, respectively. The first bonding pin 450 includes an upper end width v and a lower end width w.

In some embodiments, the first distance e, the third distance i, the first width a at the first end, the third width c at the third end, the fifth width g at the fifth end, the upper end width r, the upper end width v , The upper spacing o and the upper spacing t are equal.

In addition, the second pitch f, the fourth pitch j, the second width b at the second end, the fourth width d at the fourth end, and the sixth width h at the sixth end, the lower end width s, the lower end width w, and the lower pitch q And the lower distance u is equal.

In some embodiments, in order to make it easy to understand the difference of the bonding pins due to material expansion and contraction and adjusting the bonding difference, please refer to FIGS. 6A to 6F and FIG. 7 together. FIGS. 6A to 6F are schematic diagrams illustrating the pre-compression, expansion and contraction of the bonding pins and the adjustment of bonding according to some embodiments of the present application. FIG. 7 is a flowchart of steps of a method of manufacturing a bonding pad structure for an electronic device according to some embodiments of the present application. In some embodiments, the method 700 for manufacturing the bonding pad structure for electronic devices is used to bond the substrate 120 in FIG. 2 and the flexible circuit board 220 in FIG. 3 to each other to form a plurality of bonds as shown in FIG. 4 Pin 310.

In step 710, a plurality of first pins are arranged on the substrate.

For example, referring to FIG. 2, a plurality of first pins 110 are provided on the substrate 120.

In step 720, a plurality of second pins are set on the flexible circuit board.

For example, referring to FIG. 3, a plurality of second pins 210 are provided on the flexible circuit board 220.

In step 730, the plurality of first pins and the plurality of second pins are joined to form at least one central joint pin at the center of the joint area in the electronic device, and form at least one central joint pin farthest from the at least one central joint pin At least two first bonding pins are mirror-symmetrical with at least one central bonding pin. The at least one central bonding pin includes a first end and a second end. The first width of the first end is set to a. The second width of the second end is set to b. a and b satisfy the relationship 0<a/b≦1. One of the at least two first bonding pins has an inclination angle with one side of the substrate. The tilt angle is set to θ. θ satisfies the relational expression 0<θ≦90.

For example, referring to FIGS. 2-7, the plurality of first pins 110 and the plurality of second pins 220 are connected to form at least one central bonding pin 410 at the center of the bonding area in the electronic device 100 , And at least two first bonding pins 450 with at least one center bonding pin 410 mirror-symmetrical are formed at the furthest away from the at least one center bonding pin 410. At least one central bonding pin 410 includes a first end (upper end in the figure) and a second end (lower end in the figure). The first width of the first end is set to a. The second width of the second end is set to b. a and b satisfy the relationship 0<a/b≦1. One of the at least two first bonding pins 450 and one side of the substrate 120 (the lower side as shown in the figure) includes an inclination angle θ. θ satisfies the relational expression 0<θ≦90.

In some embodiments, the above step 730 includes the following operations: pre-connecting a plurality of first pins and a plurality of second pins. The plurality of second pins expand and contract during the pre-joining process.

For example, please refer to Fig. 6A, Fig. 6C and Fig. 6E. A plurality of first pins and a plurality of second pins respectively produce expansion and contraction amount α1 as shown in Fig. 6A or as shown in Fig. 6C during the pre-bonding process. The amount of expansion and contraction α2 or the amount of expansion and contraction α3 as shown in Figure 6E.

In some embodiments, the above step 730 further includes the following operations: adjusting the plurality of first pins and the plurality of second pins according to the amount of expansion and contraction to form at least one central bonding pin and at least two first bonding pins.

For example, please refer to Figures 6A to 6F, use the Y-direction adjustment translation technique, and adjust the displacement β1 in the Y-direction according to the expansion and contraction amount α1 in Figure 6A as shown in Figure 6B. According to the expansion and contraction amount α2 in the figure 6C, the displacement β2 in the figure 6D is adjusted through the Y direction adjustment. According to the expansion and contraction amount α3 in the figure 6E, adjust the displacement β3 in the figure 6F through the Y direction adjustment.

In some embodiments, the amount of expansion and contraction α1 is 0.5‰, and the adjustment displacement β1 is 17 μm. In still other embodiments, the amount of expansion and contraction α2 is 1‰, and the adjustment displacement β2 is 35 μm. In other embodiments, the amount of expansion and contraction α3 is 2‰, and the adjustment displacement β3 is 70 μm. The above is the practice of specific Y-direction translation adjustment skills.

In some embodiments, the above step 730 includes the following operations: bonding a plurality of first pins and a plurality of second pins to form at least one central bonding pin at the center of the bonding area in the electronic device, which is farthest away from at least At least two first joint pins that are mirror-symmetrical with at least one central joint pin are formed at a central joint pin, and at least one central joint pin is formed between at least one central joint pin and at least two first joint pins At least two second joint pins whose feet are mirror-symmetrical. One of the at least two second bonding pins includes a third end and a fourth end. The third width at the third end is set to c, and the fourth width at the fourth end is set to d, and c and d satisfy the relationship 0<c/d≦1.

For example, referring to FIGS. 2-7, the plurality of first pins 110 and the plurality of second pins 210 are connected to form at least one central bonding pin 410 at the center of the bonding area in the electronic device 100 , Forming at least two first bonding pins 450 with mirror symmetry of at least one center bonding pin 410 at the farthest from at least one center bonding pin 410, and at least one center bonding pin 410 and at least two first bonding pins At least two second bonding pins 420 with at least one central bonding pin 410 mirror-symmetrical are formed therebetween. One of the at least one second bonding pin 420 includes a third end (upper end in the figure) and a fourth end (lower end in the figure). The third width at the third end is set to c, and the fourth width at the fourth end is set to d, and c and d satisfy the relationship 0<c/d≦1.

In some embodiments, please refer to FIGS. 4 and 5. When the actual bonding area width Z and the bonding area length L remain unchanged, according to the foregoing embodiment, the relationship between the distance and the width of the bonding pins is known, so the bonding area is changed The design length L1 and the above-mentioned inclination angle θ are as follows: Tilt angle θ Bonding pin width (μm) Actual overlap area (μm ² ) Increase in overlap area (compared to 90˚) 90˚ 52.000 55329 0% 85˚ 51.000 67955 twenty three% 80˚ 49.627 71279 29% 75˚ 47.868 71602 29% 70˚ 45.745 71027 28% 65˚ 43.274 70004 27% 60˚ 40.474 68827 27% Table I

It can be seen from Table 1 that the best inclination angle of the joint pins is 80˚, and the actual overlap area is increased by 29%.

FIG. 8 is a schematic diagram showing bonding pins according to some embodiments of the present application. Fig. 8 shows the bonding pins of a modified embodiment of the embodiment shown in Fig. 5; In some embodiments, the embodiment in Fig. 5 is a trapezoidal joint pin design with a smaller upper base and a larger lower base, and the embodiment in Fig. 8 is a trapezoidal joint pin design with a larger upper base and a smaller bottom base. The plurality of bonding pins in Fig. 8 includes a bonding area length L'and a design length L2 of the bonding area.

In addition, the plurality of bonding pins includes at least one central bonding pin 410A and at least two first bonding pins 450A. At least one central bonding pin 410A is located at the center of the plurality of bonding pins. The at least two first bonding pins 450A are farthest away from the at least one central bonding pin 410A and exhibit mirror symmetry based on the at least one central bonding pin 410A. The first bonding pin 450A is closest to the first side M1 and the second side M2, and the included angle between the first bonding pin 450A and one side of the substrate 120 (upper side as shown in the figure) is an inclination angle φ. When the joint pin is closer to the center position, the tilt angle φ is closer to 90˚.

In addition, the first width of the first end is set to a'. The second width of the second end is set to b'. a'and b'satisfy the relationship a'/b'≧1. One of the at least two first bonding pins 450A and one side of the substrate 120 (upper side as shown in the figure) include an inclination angle φ. φ satisfies the relationship 0<φ≦90.

In some embodiments, the plurality of bonding pins further includes at least two second bonding pins 420A, located between at least one central bonding pin 410A and at least two first bonding pins 450A and having at least one central bonding pin 410A Mirror symmetry. The at least two second bonding pins 420A include a third end and a fourth end. The third width at the third end is set to c'. The fourth width of the fourth end is set as d'. ’C and d’ satisfy the relation c’/d’≧1.

In some embodiments, according to the foregoing embodiments, each bonding pin (as shown in the figure from the center to the center bonding pin 410A of the first side M1, the second bonding pin 420A, the third bonding pin 430A, The fourth bonding pin 440A and the first bonding pin 450A have respective widths of the upper bottom (upper end as shown in the figure) and the width of the bottom bottom (lower end as shown in the figure) respectively. Adjacent bonding pins have upper and lower pitches respectively.

In addition, from the central joint pin 410A to the first side M1, the first width a', the first pitch e', the third width c'of the third end, the third pitch i', and the fifth end of the first end are respectively The fifth width g', upper spacing o', upper end width r', upper spacing t'and upper end width v'. The upper and bottom widths and the upper spacing of the aforementioned bonding pins are equal.

Furthermore, from the central joint pin 410A to the first side M1 are the second width b', the second spacing f', the fourth width d', the fourth spacing j', and the sixth end of the second end. The sixth width h'of the end, the lower interval q', the lower end width s', the lower interval u', and the lower end width w'. The width of the bottom bottom and the bottom spacing of the aforementioned bonding pins are equal.

In some embodiments, the above-mentioned joining area length L'and the above-mentioned joining area length L may be the same or different. In some embodiments, the design length L1 of the joint area and the design length L2 of the joint area may be the same or different.

According to the foregoing embodiment, the present application provides a bonding pad structure for an electronic device, so as to improve the problem that the pin material on the ultra-thin flexible substrate will be offset due to thermal expansion and contraction during bonding.

Although this case is disclosed as above with detailed embodiments, this case does not exclude other feasible implementation aspects. Therefore, the scope of protection of this case shall be determined by the scope of the attached patent application, and shall not be restricted by the foregoing embodiments.

For those skilled in the art, without departing from the spirit and scope of the case, various changes and modifications can be made to the case. Based on the foregoing embodiment, all changes and modifications made to this case are also covered by the scope of protection of this case.

100: electronic device 10: Pin 20: Pin 120: substrate 220: flexible circuit board 110: first pin a1~a2: the width of the upper end b1~b2: the width of the lower end 210: second pin 310: Bonding pin Z: The width of the actual joint area 410~410A: Central bonding pin 420~420A: second bonding pin 430~430A: third bonding pin 440~440A: Fourth bonding pin 450~450A: The first bonding pin a, a’: first width b, b’: second width c, c’: third width d, d’: fourth width e, e’: first spacing f, f’: second spacing g, g’: fifth width h, h’: sixth width i, i’: third spacing j, j’: fourth spacing θ, φ: tilt angle P1: boundary line P2: boundary line L, L’: Length of joint area L1~L2: Design length of the joint area M1: First side M2: second side o, t, o’, t’: upper spacing q, u, q’, u’: lower spacing r, v, r’, v’: upper end width s, w, s’, w’: bottom width α1~α3: The amount of expansion and contraction β1~β3: displacement 700: method 710~730: steps

With reference to the implementation in the subsequent paragraphs and the following diagrams, you can better understand the content of this case: FIG. 1A is a schematic diagram of expected pins according to some embodiments of the present case; Figure 1B is a schematic diagram of actual pins drawn according to some embodiments of the present case; Figure 2 is a schematic diagram showing the pins of the substrate according to some embodiments of the present case; Figure 3 is a schematic diagram of the pins of a flexible circuit board drawn according to some embodiments of the present case; Figure 4 is a schematic diagram of bonding pins according to some embodiments of the present case; Figure 5 is a schematic diagram of bonding pins according to some embodiments of the present case; Fig. 6A is a schematic diagram of the pre-compression expansion and contraction of the joint pins according to some embodiments of the present case; FIG. 6B is a schematic diagram of adjusting the bonding of the bonding pins according to some embodiments of the present case; FIG. Fig. 6C is a schematic diagram of the pre-compression expansion and contraction of the joint pins according to some embodiments of the present case; FIG. 6D is a schematic diagram of adjusting the bonding of bonding pins according to some embodiments of the present application; FIG. Fig. 6E is a schematic diagram of the pre-compression expansion and contraction of the joint pins according to some embodiments of the present case; FIG. 6F is a schematic diagram of pre-adjusted bonding of bonding pins according to some embodiments of the present case; FIG. 7 is a flowchart of steps of a method for manufacturing a bonding pad structure for an electronic device according to some embodiments of the present case; and FIG. 8 is a schematic diagram showing bonding pins according to some embodiments of the present application.

100: electronic device

120: substrate

220: flexible circuit board

Z: The width of the actual joint area

410: Central bonding pin

420: second bonding pin

430: third bonding pin

440: Fourth bonding pin

450: The first bonding pin

a: first width

b: second width

c: third width

d: fourth width

e: first spacing

f: second spacing

g: fifth width

h: sixth width

i: third spacing

j: fourth spacing

θ: tilt angle

P1: boundary line

P2: boundary line

L: Length of joint area

L1: Design length of joint area

M1: First side

M2: second side

o, t: upper spacing

q, u: lower spacing

r,v: upper end width

s, w: lower end width

Claims (19)

A bonding pad structure for electronic devices, including: A substrate, including: A plurality of first pins are arranged on the substrate; and A flexible circuit board, including: A plurality of second pins are arranged on the flexible circuit board; The first pins and the second pins are connected to each other to form a plurality of bonding pins, and the bonding pins include: At least one central bonding pin is located at the center of the bonding pins; as well as At least two first bonding pins, farthest away from the at least one central bonding pin and mirror-symmetrical with the at least one central bonding pin; Wherein the at least one central bonding pin includes: A first end and a second end, a first width of the first end is set to a, and a second width of the second end is set to b, a and b satisfy the relationship 0<a/b≦1; Wherein, one of the at least two first bonding pins and one side of the substrate includes an inclination angle, the inclination angle is set to θ, and θ satisfies the relationship 0<θ≦90. The bonding pad structure according to claim 1, wherein the bonding pins further include: At least two second joint pins, located between the at least one central joint pin and the at least two first joint pins, and are mirror-symmetrical with the at least one central joint pin; Wherein the at least two second bonding pins include: A third end and a fourth end, the third width of the third end is set to c, and the fourth width of the fourth end is set to d, and c and d satisfy the relationship 0<c/d≦1. The bonding pad structure according to claim 2, wherein the first width of the first end of the at least one central bonding pin and the third end of the third end of one of the at least two second bonding pins The width is the same. The bonding pad structure according to claim 3, wherein the second width of the second end of the at least one central bonding pin and the fourth width of the fourth end of one of the at least two second bonding pins the same. The bonding pad structure according to claim 4, wherein the first end of the at least one central bonding pin and the third end of one of the at least two second bonding pins include a first gap, the The first pitch, the first width of the first end, and the third width of the third end are all the same. The bonding pad structure according to claim 5, wherein the second end of the at least one central bonding pin and the fourth end of one of the at least two second bonding pins include a second gap, the The second pitch, the second width of the second end, and the fourth width of the fourth end are all the same, wherein the first pitch is smaller than the second pitch. The bonding pad structure according to claim 2, wherein the bonding pins are located in a bonding area of the electronic device, wherein the second pitch, the second width of the second end, and the fourth end of the fourth end The relationship between the width and the length of the joint area is as follows: b=d=f=L/(x+y) Where b is the second width of the second end, d is the fourth width of the fourth end, f is the second spacing, L is the length of the bonding area, and x is the number of bonding pins, y is the number of intervals between the bonding pins. The bonding pad structure according to any one of claims 1 to 7, wherein the at least one central bonding pin includes a trapezoid shape, wherein the at least two first bonding pins include a trapezoid shape, and the at least two second bonding pins include a trapezoid shape . The bonding pad structure according to any one of claims 1 to 7, wherein the at least one central bonding pin, the at least two first bonding pins, and the at least two second bonding pins are arranged on the same straight line. The bonding pad structure according to claim 5, wherein the bonding pins further include: At least two third bonding pins are located between the at least two first bonding pins and the at least two second bonding pins and are mirror-symmetrical with the at least one central bonding pin, One of the at least two third bonding pins includes: A fifth end and a sixth end, a fifth width of the fifth end is set to g, and a sixth width of the sixth end is set to h, and g and h satisfy the relationship 0<g/h≦1. The bonding pad structure according to claim 10, wherein the third end of one of the at least two second bonding pins and the fifth end of one of the at least two third bonding pins include a third distance , Wherein the fourth end of one of the at least two second bonding pins and the sixth end of one of the at least two third bonding pins include a fourth pitch, wherein the third pitch is smaller than the fourth spacing. The bonding pad structure according to claim 11, wherein the first pitch, the third pitch, the first width, the third width and the fifth width are equal, and the second pitch, the fourth pitch, and the first pitch are equal to each other. Two widths, the fourth width is equal to the sixth width. The bonding pad structure according to any one of claims 10 to 12, wherein the at least one central bonding pin, the at least two first bonding pins, the at least two second bonding pins, and the at least two third bonding pins The feet are arranged on the same line. The bonding pad structure according to claim 5, wherein the bonding pins are in a pre-bonding process, and one of the first pins and the second pins has an amount of expansion and contraction. A bonding pad structure for electronic devices, including: A substrate, including: A plurality of first pins are arranged on the substrate; and A flexible circuit board, including: A plurality of second pins are arranged on the flexible circuit board; The first pins and the second pins are connected to each other to form a plurality of bonding pins, and the bonding pins include: At least one central bonding pin is located at the center of the bonding pins; as well as At least two first bonding pins, farthest away from the at least one central bonding pin and mirror-symmetrical with the at least one central bonding pin; Wherein the at least one central bonding pin includes: A first end and a second end, a first width of the first end is set to a', a second width of the second end is set to b', a'and b'satisfy the relationship a'/b '≧1; One of the at least two first bonding pins and one side of the substrate includes an inclination angle, the inclination angle is set to φ, and φ satisfies the relationship 0<φ≦90. The bonding pad structure according to claim 15, wherein the bonding pins further comprise: At least two second joint pins, located between the at least one central joint pin and the at least two first joint pins, and are mirror-symmetrical with the at least one central joint pin; Wherein the at least two second bonding pins include: A third end and a fourth end, the third width of the third end is set to c', the fourth width of the fourth end is set to d', c'and d'satisfy the relation c'/d '≧1. The bonding pad structure according to claim 16, wherein the first width of the first end of the at least one central bonding pin and the third end of the third end of one of the at least two second bonding pins The width is the same. The bonding pad structure according to claim 17, wherein the second width of the second end of the at least one central bonding pin and the fourth width of the fourth end of one of the at least two second bonding pins the same. The bonding pad structure according to claim 18, wherein the first end of the at least one central bonding pin and the third end of one of the at least two second bonding pins include a first distance, the The first pitch, the first width of the first end, and the third width of the third end are all the same.

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