CN214205938U - Bonding pad structure for electronic device - Google Patents

Abstract

A bonding pad structure for an electronic device comprises a substrate and a flexible circuit board. The plurality of first pins are arranged on the substrate. The second pins are arranged on the flexible circuit board. The first pins and the second pins are mutually jointed to form a plurality of jointing pins. The plurality of bonding pins include at least one central bonding pin and at least two first bonding pins. At least one central bonding pin is positioned at the center of the bonding pins. The at least two first bonding pins are farthest from the at least one central bonding pin and are mirror-symmetrical with the at least one central bonding pin. At least one central bonding pin comprises a first end and a second end. The first width a of the first end and the second width b of the second end satisfy the relation 0< a/b ≦ 1. One of the at least two first bonding pins and one side of the substrate include a tilt angle theta, and the tilt angle theta satisfies the relation 0< theta ≦ 90. The scheme improves the problem that the pin material on the ultrathin flexible substrate generates deviation during jointing due to thermal expansion and contraction.

Description

Bonding pad structure for electronic device

Technical Field

The present disclosure relates to an electronic device. In particular, the present disclosure relates to a bonding pad structure for an electronic device.

Background

The conventional display panel is developed toward the ultra-thin flexible substrate technology, and the bonding area around the panel is continuously compressed to increase the screen occupation ratio of the panel.

In addition, the pin material is subject to thermal expansion and contraction during the manufacturing process, which causes the problem of offset during bonding. According to the prior art CN201571253U, when two circuit substrates stacked on each other are stacked and aligned, the problem of tolerance increase is required, and the compression dislocation is often reduced by the expansion and contraction resistance of the hard board material itself; however, in the face of the next generation of ultra-thin flexible substrate technology development, the problem of thermal expansion and shrinkage of the laminated film substrate itself will be more serious, and the conventional lamination method cannot effectively inhibit lamination dislocation; therefore, there is a need for the skilled practitioner to develop other designs suitable for resisting the press-fit dislocation.

SUMMERY OF THE UTILITY MODEL

One aspect of the present disclosure relates to a bond pad structure for an electronic device. The bonding pad structure for the electronic device comprises a substrate and a flexible circuit board. The substrate comprises a plurality of first pins. The plurality of first pins are arranged on the substrate. The flexible circuit board comprises a plurality of second pins. The second pins are arranged on the flexible circuit board. The first pins and the second pins are mutually jointed to form a plurality of jointing pins. The plurality of bonding pins include at least one central bonding pin and at least two first bonding pins. At least one central bonding pin is positioned at the center of the bonding pins. The at least two first bonding pins are furthest away from the at least one central bonding pin and are in mirror symmetry with the at least one central bonding pin. At least one central bonding pin comprises a first end and a second end. The first width of the first end is set as a. The second width of the second end is set as b. a and b satisfy the relation 0< a/b ≦ 1. One of the at least two first bonding pins and one side of the substrate include an inclined angle. The tilt angle is set to θ. θ satisfies the relation 0< θ ≦ 90.

In some embodiments, the plurality of bonding pins further includes at least two second bonding pins. The at least two second joint pins are positioned between the at least one central joint pin and the at least two first joint pins and are in mirror symmetry with the at least one central joint pin. One of the at least two second bonding pins comprises a third end and a fourth end. The third width of the third end is set as c, the fourth width of the fourth end is set as d, and c and d satisfy the relation 0< c/d ≦ 1.

In some embodiments, the first width of the first end of at least one center bond pin is the same as the third width of the third end of one of the at least two second bond pins.

In some embodiments, the second width of the second end of at least one center bonding pin is the same as the fourth width of the fourth end of one of at least two second bonding pins.

In some embodiments, the first end of the at least one center bond pin and the third end of one of the at least two second bond pins comprise a first pitch therebetween. The first distance, the first width of the first end and the third width of the third end are the same.

In some embodiments, the second end of the at least one center bond pin and the fourth end of one of the at least two second bond pins comprise a second pitch therebetween. The second distance, the second width of the second end and the fourth width of the fourth end are the same. The first pitch is less than the second pitch.

In some embodiments, a plurality of bonding pins are located in a bonding area of an electronic device. The second pitch, the second width at the second end, and the fourth width at the fourth end are related to the length of the bonding region by the following equation:

b＝d＝f＝L/(x+y)

wherein b is a second width of the second end, d is a fourth width of the fourth end, f is a second pitch, L is a length of the bonding area, x is a number of the plurality of bonding pins, and y is a number of spaces between the plurality of bonding pins.

In some embodiments, at least one of the center bond pins includes a trapezoid, at least two of the first bond pins includes a trapezoid, and at least two of the second bond pins includes a trapezoid.

In some embodiments, the at least one central bonding pin, the at least two first bonding pins, and the at least two second bonding pins are arranged in a same straight line.

In some embodiments, the plurality of bonding pins further includes at least two third bonding pins. The at least two third joint pins are positioned between the at least two first joint pins and the at least two second joint pins and are in mirror symmetry with the at least one central joint pin. One of the at least two third bonding pins includes a fifth end and a sixth end. The fifth width of the fifth end is smaller than g, the sixth width of the sixth end is h, and g and h satisfy the relation 0< g/h ≦ 1.

In some embodiments, the third end of one of the at least two second bonding pins and the fifth end of one of the at least two third bonding pins comprise a pitch of three. The fourth end of one of the at least two second bonding pins and the sixth end of one of the at least two third bonding pins comprise a fourth pitch. The third pitch is less than the fourth pitch.

In some embodiments, the first pitch, the third pitch, the first width, the third width, and the fifth width are equal, and the second pitch, the fourth pitch, the second width, the fourth width, and the sixth width are equal.

In some embodiments, the at least one central bonding pin, the at least two first bonding pins, the at least two second bonding pins and the at least two third bonding pins are arranged on the same straight line.

In some embodiments, one of the first pins and the second pins has an expansion and contraction amount during the pre-bonding process of the bonding pins.

Another aspect of the present disclosure relates to a bond pad structure for an electronic device. The bonding pad structure for electronic device comprisesThe bonding pad structure of the electronic device comprises a substrate and a flexible circuit board. The substrate comprises a plurality of first pins. The plurality of first pins are arranged on the substrate. The flexible circuit board comprises a plurality of second pins. The second pins are arranged on the flexible circuit board. The first pins and the second pins are mutually jointed to form a plurality of jointing pins. The plurality of bonding pins include at least one central bonding pin and at least two first bonding pins. At least one central bonding pin is positioned at the center of the bonding pins. The at least two first bonding pins are furthest away from the at least one central bonding pin and are in mirror symmetry with the at least one central bonding pin. At least one central bonding pin comprises a first end and a second end. The first width of the first end is set as a'. The second width of the second end is set as b'. a 'and b' satisfy the relation a '/b' ≧ 1. One of the at least two first bonding pins and one side of the substrate include an inclined angle. The angle of inclination is set to

Satisfy the relation

In some embodiments, the at least two second bond pins are located between the at least one central bond pin and the at least two first bond pins and are mirror images of the at least one central bond pin. The at least two second bonding pins comprise a third end and a fourth end. The third width of the third end is set as c'. The fourth width of the fourth end is set to d'. c 'and d' satisfy the relation c '/d' ≧ 1.

In some embodiments, the first width of the first end of at least one center bond pin is the same as the third width of the third end of one of the at least two second bond pins.

In some embodiments, the second width of the second end of at least one center bonding pin is the same as the fourth width of the fourth end of one of at least two second bonding pins.

In some embodiments, the first end of the at least one center bond pin and the third end of one of the at least two second bond pins comprise a first pitch therebetween. The first distance, the first width of the first end and the third width of the third end are the same.

In summary, the present disclosure provides a bonding pad structure for an electronic device to improve the problem of offset generated during bonding due to thermal expansion and contraction of a pin material.

The foregoing is merely illustrative of the problems to be solved, solutions to problems, and effects thereof, and the specific details thereof will be set forth in the following description and the related drawings.

Drawings

The disclosure may be better understood with reference to the following description taken in the following paragraphs and the accompanying drawings in which:

fig. 1A is a schematic diagram of a predicted pin according to some embodiments of the disclosure;

fig. 1B is a schematic diagram of an actual pin according to some embodiments of the present disclosure;

fig. 2 is a pin diagram of a substrate according to some embodiments of the disclosure;

FIG. 3 is a pin diagram of a flexible circuit board according to some embodiments of the present disclosure;

fig. 4 is a schematic diagram of a bonding pin according to some embodiments of the disclosure;

fig. 5 is a schematic diagram of a bonding pin according to some embodiments of the disclosure;

fig. 6A is a diagram illustrating pre-compression expansion and contraction of a bonding pin according to some embodiments of the disclosure;

FIG. 6B is a schematic diagram of a joint pin alignment joint according to some embodiments of the present disclosure;

fig. 6C is a diagram illustrating pre-compression expansion and contraction of a bonding pin according to some embodiments of the disclosure;

FIG. 6D is a diagram illustrating a bond pin adjustment joint according to some embodiments of the present disclosure;

fig. 6E is a diagram illustrating pre-compression expansion and contraction of a bonding pin according to some embodiments of the disclosure;

FIG. 6F is a diagram illustrating pre-alignment bonding of bonding pins according to some embodiments of the present disclosure;

FIG. 7 is a flow chart illustrating steps in a method of fabricating a bond pad structure for an electronic device according to some embodiments of the disclosure; and

fig. 8 is a schematic diagram illustrating a bonding pin according to some embodiments of the disclosure.

[ notation ] to show

100: electronic device

10: pin

20: pin

120: substrate

220: flexible circuit board

110: first pin

a 1-a 2: width of upper end

b 1-b 2: width of lower end

210: second connecting pin

310: joint pin

Z: width of actual joint area

410-410A: central joint pin

420-420A: second joint pin

430-430A: third joint pin

440-440A: fourth joint pin

450 to 450A: first joint pin

a, a': first width

b, b': second width

c, c': third width

d, d': fourth width

e, e': first interval

f, f': second pitch

g, g': fifth width

h, h': sixth width

i, i': third distance

j, j': a fourth interval

θ,

Angle of inclination

P1: boundary line

P2: boundary line

L, L': length of the joint area

L1-L2: designed length of the joint region

M1: first side

M2: second side

o, t, o ', t': upper spacing

q, u, q ', u': lower spacing

r, v, r ', v': width of upper end

s, w, s ', w': width of lower end

α 1 to α 3: amount of expansion and contraction

β 1 to β 3: displacement of

700: method of producing a composite material

710 to 730: step (ii) of

Detailed Description

The spirit of the present disclosure will be described more fully hereinafter with reference to the accompanying drawings and detailed description, in which it is apparent to one skilled in the art that various changes and modifications can be made therein without departing from the spirit and scope of the disclosure as taught herein.

The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the disclosure. The singular forms "a", "an", "the" and "the", as used herein, also include the plural forms.

As used herein, the terms "comprising," "including," "having," "containing," and the like are open-ended terms that mean including, but not limited to.

With respect to the term (terms) used herein, it is generally understood that each term has its ordinary meaning in the art, in the context of this document, and in the context of particular contexts, unless otherwise indicated. Certain words used to describe the disclosure are discussed below or elsewhere in this specification to provide additional guidance to those skilled in the art in describing the disclosure.

In some embodiments, to make the structure of the electronic device 100 of the present disclosure easy to understand, please refer to fig. 1A to 1B together, where fig. 1A is a schematic diagram of a predicted pin according to some embodiments of the present disclosure. Fig. 1B is a schematic diagram of an actual pin according to some embodiments of the disclosure. Referring to fig. 1A to fig. 1B, the electronic device 100 includes a substrate 120 and a flexible circuit board 220. In some embodiments, the electronic device 100 may be a panel and a display device.

In some embodiments, referring to fig. 1A and 1B, the substrate 120 includes pins 10. The flexible circuit board 220 includes pins 20. In simulation, the permission pin 10 and the pin 20 are completely overlapped as shown in fig. 1A. In practice, however, the pins 10 and 20 are misaligned as shown in fig. 1B due to expansion and contraction of the material of the pins.

In some embodiments, in order to make the structure of the bonding pad of the electronic device 100 easier to understand, please refer to fig. 2 to 4 together, and fig. 2 is a pin diagram of the substrate according to some embodiments of the present disclosure. Fig. 3 is a pin diagram of a flexible circuit board according to some embodiments of the disclosure. Fig. 4 is a schematic diagram of a bonding pin according to some embodiments of the disclosure.

In some embodiments, referring to fig. 2, fig. 2 is a schematic diagram of a substrate pin of the electronic device 100. The substrate 120 includes a plurality of first pins 110. The width a1 of the illustrated upper end of the first leg 110 has a self-tolerance of + -50 μm. The self-tolerance of the width b1 of the illustrated lower end of the first leg 110 is within 50 μm.

In some embodiments, please refer to fig. 3, fig. 3 is a schematic diagram of a pin of a flexible circuit board in the electronic device 100. The flexible circuit board 220 includes a plurality of second pins 210. The width a2 of the illustrated upper end of the second leg 210 has a self-tolerance of + -50 μm. The width b2 of the lower end of the second leg 210 is within a self-tolerance of + -50 μm.

In some embodiments, referring to fig. 2 to 4, the first pins 110 and the second pins 210 are bonded to each other to form a plurality of bonding pins 310. In some embodiments, Z is the width of the bonding area where the first pins 110 and the second pins 210 are actually bonded.

Fig. 5 is a schematic diagram of a bonding pin according to some embodiments of the disclosure. In some embodiments, the plurality of bond pins 310 of FIG. 4 are actually bonded to form the bond pins 410, 420, and 430 shown in FIG. 5. The electronic device 100 includes a first side M1 and a second side M2, it should be noted that, although the first side M1 and the second side M2 are illustrated as left and right sides in fig. 5, in practice, the first side M1 and the second side M2 are not limited to left and right sides.

In addition, the plurality of bond pins includes at least one central bond pin 410 and at least two first bond pins 450. At least one central bond pin 410 is located at the center of the plurality of bond pins. The at least two first bond pins 450 are furthest from the at least one central bond pin 410 and mirror-symmetrical about the at least one central bond pin 410. The first bonding pin 450 is closest to the first side M1 and the second side M2, and an angle between the first bonding pin 450 and a side (e.g., a lower side of the drawing) of the substrate 120 is an inclined angle θ. The tilt angle theta is closer to 90 deg. as the bond pin is closer to the center position.

The first width of the first end is a. The second width of the second end is set as b. a and b satisfy the relation 0< a/b ≦ 1. One of the at least two first bonding pins 450 and one side (e.g., the lower side of the figure) of the substrate 120 include an inclination angle θ. θ satisfies the relation 0< θ ≦ 90.

In some embodiments, the plurality of bond pins further includes at least two second bond pins 420 located between the at least one central bond pin 410 and the at least two first bond pins 450 and mirrored about the at least one central bond pin 410. The at least two second bonding pins 420 include a third end and a fourth end. The third width of the third end is set as c. The fourth width of the fourth end is set to d. c and d satisfy the relation 0< c/d ≦ 1.

In addition, the at least one center bond pin 410 includes a first end (e.g., upper end) and a second end (e.g., lower end). In some embodiments, at least one of the central bonding pins 410 may be trapezoidal in shape.

In addition, one of the at least two second bonding pins 420 (e.g., the second bonding pin 420 on the right side in the figure) includes a third end (e.g., the upper end) and a fourth end (e.g., the lower end). In some embodiments, each of the second bonding pins 420 may be trapezoidal.

Furthermore, at least two first bonding pins 450 closest to both sides of the first side M1 and the second side M2 may be trapezoidal.

In some embodiments, referring to fig. 5, the first width a of the first end of at least one center bond pin 410 is the same as the third width c of the third end of one of at least two second bond pins 420.

In some embodiments, the second width b of the second end of the at least one center bonding pin 410 is the same as the fourth width d of the fourth end of one of the at least two second bonding pins 420.

In some embodiments, the first end of the at least one center bond pin 410 and the third end of one of the at least two second bond pins 420 (e.g., the second bond pin 420 on the right side of the figure) comprise a first spacing e therebetween. The first spacing e, the first width a of the first end and the third width c of the third end are all the same.

In some embodiments, a second spacing f is included between the second end of at least one central bonding pin 410 and the fourth end of one of at least two second bonding pins 420 (e.g., the second bonding pin 420 on the right side of the figure). The second distance f, the second width b of the second end and the fourth width d of the fourth end are all the same. The first pitch e is smaller than the second pitch f. It should be noted that, since the boundary line P1 of the at least one center joint pin 410 is not parallel to the boundary line P2 of one of the at least two second joint pins 420 (e.g., the second joint pin 420 on the right side in the figure), the interval gradually shrinks from the second distance f to the first distance e along the boundary line P1 and the boundary line P2.

In some embodiments, a plurality of bonding pins are located in the bonding area of the electronic device 100. The second pitch f, the second width b of the second end, and the fourth width d of the fourth end are related to the length L of the bonding region as follows:

l/(x + y) … formula 1

In equation 1, x is the number of the plurality of bond pins and y is the number of the spaces between the plurality of bond pins, for example, the space may be the pitch f between the bond pin 410 and the bond 2 pin 420 of fig. 4.

Then, the first pitch e, the first width a of the first end, and the third width c of the third end are related to the designed length L1 of the bonding region as follows:

l1/(x + y) … formula 2

In equation 2, L1 is the design length of the bonding area for the bonding pin to have a splayed shape, and the relationship between L and L1 satisfies 0< L1/L ≦ 1.

In some embodiments, referring to fig. 4, the at least one central bonding pin 410 is an isosceles trapezoid, wherein the greater the number of bonding pins on both sides of the at least one central bonding pin 410, the more the bonding pins on both sides approach a parallelogram.

In some embodiments, the at least one central bond pin 410, the at least two second bond pins 420, and the at least two first bond pins 450 are arranged in a common line.

In some embodiments, the plurality of bond pins further includes at least two third bond pins 430. The at least two third bond pins 430 are disposed between the at least two second bond pins 420 and the at least two first bond pins 450 and are mirror images of the at least one central bond pin 410. One of the at least two third bond pins 430 (e.g., the third bond pin 430 on the right side of the figure) includes a fifth end (e.g., the upper end of the figure) and a sixth end (e.g., the lower end of the figure). The fifth width of the fifth end is set to g. A sixth width of the sixth end is set to h. g and h satisfy the relation 0< g/h ≦ 1.

In some embodiments, referring to fig. 4, the first end of one of the at least two second bond pins 420 (e.g., the second bond pin 420 on the right in the figure) and the third end of one of the at least two third bond pins 430 (e.g., the third bond pin 430 on the right in the figure) comprise a third spacing i.

In addition, the second end of one of the at least two second bonding pins 420 and the fourth end of one of the at least two third bonding pins 430 comprise a fourth pitch j. The third pitch i is less than the fourth pitch j. It should be noted that at least two second bonding pins 420 may be trapezoidal, and at least two third bonding pins 430 may be trapezoidal.

In some embodiments, the first distance e, the third distance i, the first width a of the first end, the third width c of the third end, and the fifth width g of the fifth end are equal. The second distance f, the fourth distance j, the second width b of the second end, the fourth width d of the fourth end and the sixth width h of the sixth end are equal.

In some embodiments, the at least one central bond pin 410, the at least two second bond pins 420, the at least two third bond pins 430, and the at least two first bond pins 450 are arranged in a common line.

In some embodiments, referring to fig. 5, according to the above embodiments, the fourth bonding pin 440, the third bonding pin 430 and the first bonding pin 450 respectively include an upper pitch o and an upper pitch t. The fourth bond leg 440 includes an upper width r and a lower width s.

In some embodiments, the fourth bond leg 440, the third bond leg 430 and the first bond leg 450 include a bottom pitch q and a bottom pitch u, respectively. The first bonding pin 450 includes an upper width v and a lower width w.

In some embodiments, the first pitch e, the third pitch i, the first width a of the first end, the third width c of the third end, the fifth width g of the fifth end, the upper width r, the upper width v, the upper pitch o, and the upper pitch t are equal.

The second pitch f, the fourth pitch j, the second end second width b, and the fourth end fourth width d are equal to the sixth end sixth width h, the lower end width s, the lower end width w, the lower pitch q, and the lower pitch u.

In some embodiments, please refer to fig. 6A to 6F and fig. 7 together in order to make the bonding pin of the present disclosure easily understood due to the expansion and contraction of the material and the adjustment of the bonding difference. Fig. 6A-6F are diagrams illustrating pre-compression expansion and adjustment of a bond pin according to some embodiments of the disclosure. Fig. 7 is a flowchart illustrating steps of a method for fabricating a bond pad structure for an electronic device according to some embodiments of the disclosure. In some embodiments, the method 700 for manufacturing a bonding pad structure of an electronic device is used to bond the substrate 120 of fig. 2 and the flexible circuit board 220 of fig. 3 to each other to form a plurality of bonding pins 310 as shown in fig. 4.

In step 710, a plurality of first pins are disposed on the substrate.

For example, referring to fig. 2, a plurality of first pins 110 are disposed on a substrate 120.

In step 720, a plurality of second pins are disposed on the flexible circuit board.

For example, referring to fig. 3, a plurality of second pins 210 are disposed on the flexible circuit board 220.

In step 730, the first and second pins are bonded to form at least one central bonding pin at a center of a bonding area of the electronic device, and at least two first bonding pins are formed at a position farthest from the central bonding pin and are mirror-symmetrical to the central bonding pin. At least one central bonding pin comprises a first end and a second end. The first width of the first end is set as a. The second width of the second end is set as b. a and b satisfy the relation 0< a/b ≦ 1. One of the at least two first bonding pins and one side of the substrate include an inclined angle. The tilt angle is set to θ. θ satisfies the relation 0< θ ≦ 90.

For example, referring to fig. 2 to 7, the first bonding pins 110 and the second bonding pins 220 are bonded to form at least one central bonding pin 410 at a central position of a bonding area in the electronic device 100, and at least two first bonding pins 450, which are mirror-symmetrical to the at least one central bonding pin 410, are formed at a position farthest from the at least one central bonding pin 410. The at least one center bond pin 410 includes a first end (e.g., upper end) and a second end (e.g., lower end). The first width of the first end is set as a. The second width of the second end is set as b. a and b satisfy the relation 0< a/b ≦ 1. One of the at least two first bonding pins 450 and one side (e.g., the lower side of the figure) of the substrate 120 include an inclination angle θ. θ satisfies the relation 0< θ ≦ 90.

In some embodiments, the step 730 includes the following operations: a plurality of first pins and a plurality of second pins are bonded in advance. The second pins generate expansion and contraction in the pre-bonding process.

For example, referring to fig. 6A, 6C and 6E, the first pins and the second pins respectively generate the expansion amount α 1 in fig. 6A, the expansion amount α 2 in fig. 6C or the expansion amount α 3 in fig. 6E during the pre-bonding process.

In some embodiments, the step 730 further comprises the following operations: the first pins and the second pins are adjusted according to the expansion and contraction amount to form at least one central joint pin and at least two first joint pins.

For example, referring to fig. 6A-6F, using the Y-direction adjustment translation technique, the displacement β 1 in fig. 6B is adjusted by Y-direction adjustment according to the amount of expansion α 1 in fig. 6A. The displacement β 2 as in fig. 6D is adjusted by Y-direction adjustment according to the amount of expansion α 2 as in fig. 6C. The displacement β 3 as in fig. 6F is adjusted by Y-direction adjustment according to the amount of expansion α 3 as in fig. 6E.

In some embodiments, the amount of expansion α 1 is 0.5% o and the shift β 1 is 17 μm. In still other embodiments, the amount of expansion and contraction α 2 is 1% o and the shift β 2 is 35 μm. In other embodiments, the amount of expansion and contraction α 3 is 2% o and the shift β 3 is 70 μm. The above is a specific Y-direction translation adjustment skill practice.

In some embodiments, the step 730 includes the following operations: the first pins and the second pins are jointed to form at least one central jointing pin in the central position of the jointing area in the electronic device, at least two first jointing pins which are mirror symmetrical with the central jointing pin are formed at the position farthest away from the central jointing pin, and at least two second jointing pins which are mirror symmetrical with the central jointing pin are formed between the central jointing pin and the first jointing pins. One of the at least two second bonding pins comprises a third end and a fourth end. The third width of the third end is set as c, the fourth width of the fourth end is set as d, and c and d satisfy the relation 0< c/d ≦ 1.

For example, referring to fig. 2 to 7, the first bonding pins 110 and the second bonding pins 210 are bonded to form at least one central bonding pin 410 at a central position of a bonding area in the electronic device 100, at least two first bonding pins 450 are formed at positions farthest from the at least one central bonding pin 410 and are mirror-symmetrical to the at least one central bonding pin 410, and at least two second bonding pins 420 are formed between the at least one central bonding pin 410 and the at least two first bonding pins 450 and are mirror-symmetrical to the at least one central bonding pin 410. One of the at least one second bonding pin 420 includes a third end (e.g., upper end) and a fourth end (e.g., lower end). The third width of the third end is set as c, the fourth width of the fourth end is set as d, and c and d satisfy the relation 0< c/d ≦ 1.

In some embodiments, referring to fig. 4 and 5, when the actual bonding region width Z and the bonding region length L are not changed, the relationship between the pitch and the width of the bonding pins according to the above embodiments is known, and thus, the design length L1 of the bonding region and the tilt angle θ are changed as follows:

watch 1

As can be seen from the table I, the optimum tilt angle of the bonding pin is 80 degrees, and the actual bonding area is increased by 29%.

Fig. 8 is a schematic diagram illustrating a bonding pin according to some embodiments of the disclosure. Fig. 8 is a view showing a bonding pin according to a modified embodiment of the embodiment of fig. 5. In some embodiments, the embodiment of fig. 5 is a trapezoidal bond pin design with a smaller upper base and a larger lower base, while the embodiment of fig. 8 is a trapezoidal bond pin design with a larger upper base and a smaller lower base. The plurality of bond pins of fig. 8 includes a bond area length L' and a design bond area length L2.

In addition, the plurality of bond pins includes at least one central bond pin 410A and at least two first bond pins 450A. At least one central bond pin 410A is located at the center of the plurality of bond pins. The at least two first bond pins 450A are furthest from the at least one central bond pin 410A and mirror-symmetrical about the at least one central bond pin 410A. The first bonding pin 450A is closest to the first side M1 and the second side M2, and the angle between the first bonding pin 450A and one side (e.g., the upper side of the figure) of the substrate 120 is an inclined angle

The tilt angle is increased as the bonding pin gets closer to the center

The closer to 90.

The first width of the first end is a'. The second width of the second end is set as b'. a 'and b' satisfy the relation a '/b' ≧ 1. One of the at least two first bonding pins 450A and one side (as the upper side of the figure) of the substrate 120 include an inclined angle

Satisfy the relation

In some embodiments, the plurality of bond pins further includes at least two second bond pins 420A disposed between the at least one central bond pin 410A and the at least two first bond pins 450A and mirrored about the at least one central bond pin 410A. The at least two second bonding pins 420A include a third end and a fourth end. The third width of the third end is set as c'. The fourth width of the fourth end is set to d'. 'c and d' satisfy the relation c '/d' ≧ 1.

In some embodiments, according to the above embodiments, each of the bonding pins (e.g., the central bonding pin 410A, the second bonding pin 420A, the third bonding pin 430A, the fourth bonding pin 440A and the first bonding pin 450A from the center to the first side M1 in the drawing) has a respective upper bottom (e.g., upper side) width and lower bottom (e.g., lower side) width. The adjacent joint pins are respectively provided with an upper pitch and a lower pitch.

In addition, from the central bonding pin 410A to the first side M1, a first width a ' of the first end, a first pitch e ', a third width c ' of the third end, a third pitch i ', a fifth width g ' of the fifth end, an upper pitch o ', an upper width r ', an upper pitch t ', and an upper width v ' are defined, respectively. The top width and the top pitch of the bonding pins are equal.

Furthermore, from the central bonding pad 410A to the first side M1, the second width b ' of the second end, the second pitch f ', the fourth width d ' of the fourth end, the fourth pitch j ', the sixth width h ' of the sixth end, the lower pitch q ', the lower width s ', the lower pitch u ' and the lower width w ' are respectively defined. The widths of the lower bottoms and the lower pitches of the bonding pins are equal.

In some embodiments, the length L' of the joining region and the length L of the joining region may be the same or different. In some embodiments, the designed length L1 of the joint region and the designed length L2 of the joint region may be the same or different.

According to the foregoing embodiments, a bonding pad structure for an electronic device is provided to improve the problem of offset of a pin material on an ultra-thin flexible substrate during bonding caused by thermal expansion and contraction.

Although the present disclosure has been described with reference to specific embodiments, other possible implementations are not excluded. Therefore, the protection scope of the present application shall be determined by the scope defined by the appended claims, and shall not be limited by the foregoing embodiments.

It will be apparent to those skilled in the art that various changes and modifications can be made therein without departing from the spirit and scope thereof. All changes and modifications that come within the meaning and range of equivalency of the claims are to be embraced within their scope.

Claims (19)

1. A bond pad structure for an electronic device, comprising:

a substrate, comprising:

a plurality of first pins arranged on the substrate; and

a flexible circuit board, comprising:

a plurality of second pins arranged on the flexible circuit board;

wherein the plurality of first pins and the plurality of second pins are bonded to each other to form a plurality of bonding pins, the plurality of bonding pins comprising:

at least one central joint pin, which is positioned at the central position of the joint pins; and

at least two first joint pins which are farthest away from the at least one central joint pin and are in mirror symmetry with the at least one central joint pin;

wherein the at least one central bonding pin comprises:

a first end and a second end, a first width of the first end is set as a, a second width of the second end is set as b, and a and b satisfy the relation 0< a/b ≦ 1;

wherein one of the at least two first bonding pins and one side of the substrate include a tilt angle, the tilt angle is set to θ, and θ satisfies the relation 0< θ ≦ 90.

2. The bond pad structure of claim 1, wherein said plurality of bond pins further comprise:

at least two second joint pins which are positioned between the at least one central joint pin and the at least two first joint pins and are in mirror symmetry with the at least one central joint pin;

wherein the at least two second bonding pins comprise:

a third end and a fourth end, a third width of the third end is set as c, a fourth width of the fourth end is set as d, and c and d satisfy the relation 0< c/d ≦ 1.

3. The bond pad structure of claim 2, wherein said first width of said first end of said at least one central bond pin is the same as said third width of said third end of one of said at least two second bond pins.

4. The bonding pad structure of claim 3, wherein the second width of the second end of the at least one central bonding pin is the same as the fourth width of the fourth end of one of the at least two second bonding pins.

5. The bonding pad structure of claim 4, wherein a first distance is defined between the first end of the at least one central bonding pin and the third end of one of the at least two second bonding pins, and the first distance, the first width of the first end and the third width of the third end are the same.

6. The bonding pad structure of claim 5, wherein a second pitch is included between the second end of the at least one central bonding pin and the fourth end of one of the at least two second bonding pins, the second pitch, the second width of the second end and the fourth width of the fourth end being the same, wherein the first pitch is smaller than the second pitch.

7. The bonding pad structure of claim 2, wherein the bonding pins are located in a bonding area of the electronic device, and wherein the second pitch, the second width of the second end, and the fourth width of the fourth end have a relationship with a length of the bonding area as follows:

b＝d＝f＝L/(x+y)

wherein b is the second width of the second end, d is the fourth width of the fourth end, f is the second pitch, L is the length of the bonding area, x is the number of the plurality of bonding pins, and y is the number of spaces between the plurality of bonding pins.

8. The bond pad structure of any of claims 1-7, wherein the at least one central bond pin comprises a trapezoid, wherein the at least two first bond pins comprise trapezoids, and wherein the at least two second bond pins comprise trapezoids.

9. The bonding pad structure of any one of claims 1 to 7, wherein the at least one central bonding pin, the at least two first bonding pins and the at least two second bonding pins are arranged in a same line.

10. The bond pad structure of claim 6, wherein said plurality of bond pins further comprise:

at least two third joint pins which are positioned between the at least two first joint pins and the at least two second joint pins and are in mirror symmetry with the at least one central joint pin,

wherein one of the at least two third bonding pins comprises:

a fifth end and a sixth end, a fifth width of the fifth end is set to g, a sixth width of the sixth end is set to h, and g and h satisfy the relation 0< g/h ≦ 1.

11. The bond pad structure of claim 10, wherein the third end of one of the at least two second bond pins and the fifth end of one of the at least two third bond pins comprise a third pitch, wherein the fourth end of one of the at least two second bond pins and the sixth end of one of the at least two third bond pins comprise a fourth pitch, and wherein the third pitch is less than the fourth pitch.

12. The bond pad structure of claim 11, wherein the first pitch, the third pitch, the first width, the third width, and the fifth width are equal, and the second pitch, the fourth pitch, the second width, and the fourth width are equal to the sixth width.

13. The bonding pad structure of any of claims 10 to 12, wherein the at least one central bonding pin, the at least two first bonding pins, the at least two second bonding pins and the at least two third bonding pins are arranged in a same straight line.

14. The bonding pad structure of claim 5, wherein one of the first and second pins has an expansion and contraction amount during a pre-bonding process of the bonding pins.

15. A bond pad structure for an electronic device, comprising:

a substrate, comprising:

a plurality of first pins arranged on the substrate; and

a flexible circuit board, comprising:

a plurality of second pins arranged on the flexible circuit board;

wherein the plurality of first pins and the plurality of second pins are bonded to each other to form a plurality of bonding pins, the plurality of bonding pins comprising:

at least one central joint pin, which is positioned at the central position of the joint pins;

and

at least two first joint pins which are farthest away from the at least one central joint pin and are in mirror symmetry with the at least one central joint pin;

wherein the at least one central bonding pin comprises:

a first end and a second end, wherein a first width of the first end is set as a ', a second width of the second end is set as b', and a 'and b' satisfy the relation a '/b' ≧ 1;

wherein one of the at least two first bonding pins and one side of the substrate have a tilt angle set as

Satisfy the relation

。

16. The bond pad structure of claim 15, wherein the plurality of bond pins further comprise:

at least two second joint pins which are positioned between the at least one central joint pin and the at least two first joint pins and are in mirror symmetry with the at least one central joint pin;

wherein the at least two second bonding pins comprise:

a third end and a fourth end, wherein the third width of the third end is set as c ', the fourth width of the fourth end is set as d', and c 'and d' satisfy the relation c '/d' ≧ 1.

17. The bond pad structure of claim 16, wherein said first width of said first end of said at least one central bond pin is the same as said third width of said third end of one of said at least two second bond pins.

18. The bonding pad structure of claim 17, wherein the second width of the second end of the at least one central bonding pin is the same as the fourth width of the fourth end of one of the at least two second bonding pins.

19. The bond pad structure of claim 18, wherein a first spacing is defined between the first end of the at least one central bond pin and the third end of one of the at least two second bond pins, the first spacing, the first width of the first end, and the third width of the third end being the same.

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