TWM608035U - Electronic device - Google Patents

Abstract

An electronic device includes a substrate and a flexible printed circuit board. The substrate includes a plurality of first pins. The first pins are disposed on the substrate. The flexible printed circuit board includes a plurality of second pins. The second pins are disposed on the flexible printed circuit board. The first pins and the second pins are bonding to each other to form a plurality of bonding points. The bonding points include at least one central bonding point and at least one first bonding point. The at least one central bonding point is located at a central area of the electronic device. The at least one first bonding point is located at a first area of the electronic device. The first area is located outside of the central area. The line width of the at least one central bonding point is greater than the line width of the at least one central bonding point.

Description

Electronic device

This case involves an electronic device. In detail, this case relates to an electronic device including a touch panel.

The bonding area of the existing touch panel is designed with equal line width and equal line spacing. The equal line width and equal line spacing are designed according to the maximum tolerance of the product, so sufficient design space is required.

However, with the development of ultra-thin flexible substrate technology, it is impossible to solve the problem of increasing tolerances as the length of the bonding area in the product increases.

Therefore, the above-mentioned technology still has many shortcomings, and it is necessary for practitioners in the field to develop other suitable pin design methods.

One aspect of this case involves an electronic device. The electronic device includes a substrate and a flexible circuit board. The substrate includes a plurality of first pins. The plurality of first pins are arranged on the substrate. The flexible circuit board contains a plurality of second pins. The plurality of second pins are arranged on the flexible circuit board. The plurality of first pins and the plurality of second pins are connected to each other to form a plurality of joints. The plurality of joints includes at least one central joint and at least one first joint. At least one central junction is located in the central area of the electronic device. At least the first junction is located in the first area of the electronic device. The first area is located outside the central area. The line width of the at least one first joint is greater than the line width of the at least one central joint.

In some embodiments, the at least one central junction includes a plurality of central junctions. The line width of each of the plurality of central junctions is equal.

In some embodiments, the at least one first joint includes a plurality of first joints. The line width of each of the plurality of first junction points is equal.

In some embodiments, the difference between the line width of each of the plurality of central junction points and the line width of each of the plurality of first junction points is equal. The difference between the line width of each of the plurality of central junction points and the line width of each of the plurality of first junction points is between 0 μm and 25 μm.

In some embodiments, the spacing between two adjacent central junctions among the plurality of central junctions is equal, and the spacing between two adjacent first junctions among the plurality of first junctions is equal.

In some embodiments, the spacing between two adjacent central junctions among the plurality of central junctions and the spacing between two adjacent first junctions among the plurality of first junctions are less than or equal to 380 μm.

In some embodiments, each of the plurality of central joints and each of the plurality of first joints are arranged on the same straight line.

In some embodiments, the electronic device includes a first side and a second side, and the second side is opposite to the first side. The first area is arranged adjacent to the central area and located near the first side in the central area.

In some embodiments, the electronic device includes a first side and a second side, and the second side is opposite to the first side. An arrangement sequence from the second side to the first side of the electronic device is the central area and the first area.

In some embodiments, the length of the central region and the length of the first region are between 4.75 mm and 5.25 mm.

In some embodiments, at least one second junction is located in the second area of the electronic device. The second area is located outside the first area. The line width of the at least one second joint is greater than the line width of the at least one first joint.

In some embodiments, the line width of the at least one central joint point, the line width of the at least one first joint point, and the line width of the at least one second joint point are distributed equally. The tolerance between the line width of the at least one central junction, the line width of the at least one first junction and the line width of the at least one second junction is between 0 μm and 25 μm.

In some embodiments, the line width of the at least one central joint point, the line width of the at least one first joint point, and the line width of the at least one second joint point are equal in increasing or decreasing in equal difference.

In some embodiments, the first distance between the at least one central junction and the at least one first junction and the second distance between the at least one first junction and the at least one second junction are less than or equal to 380 μm.

In some embodiments, at least one central junction, at least one first junction, and at least one second junction are arranged on the same straight line.

In some embodiments, the electronic device includes a first side and a second side, and the second side is opposite to the first side. The at least one first joint includes two first joints. The plurality of first joints are respectively arranged in the two first regions of the electronic device. The at least one second junction includes two second junctions. The plurality of second joints are respectively arranged in the two second areas of the electronic device. The arrangement sequence from the second side to the first side of the electronic device is the second area, the first area, the central area, the first area, and the second area.

In some embodiments, the length of the first region and the length of the second region are respectively between 4.75 mm and 5.25 mm, and the length of the central region is between 9.5 mm and 10.5 mm.

In summary, the present application provides an electronic device to improve the problem of increased tolerances caused by the increase in the length of the bonding area in the ultra-thin flexible substrate, and the accuracy of bonding can be improved.

The above description is only used to explain the problem to be solved in this case, the technical means to solve the problem, and the effects produced by it, etc. The specific details of this case will be described in detail in the following embodiments and related drawings.

The following will clearly illustrate the spirit of this case with diagrams and detailed descriptions. Anyone with ordinary knowledge in the technical field who understands the embodiments of this case can change and modify the technology taught in this case without departing from the scope of this case. Spirit and scope.

The terms used herein are only to describe specific embodiments, and are not intended to limit the present application. Singular forms such as "a", "this", "this", "本" and "this", as used herein, also include plural forms.

Regarding the "include", "include", "have", "contain", etc. used in this article, they are all open terms, which means including but not limited to.

Regarding the terms used in this article, unless otherwise specified, each term usually has the usual meaning when used in this field, in the content of this case, and in the special content. Some terms used to describe the case will be discussed below or elsewhere in this specification to provide those skilled in the art with additional guidance on the description of the case.

In some embodiments, in order to make the structure of the electronic device 100 of the present application easy to understand, please refer to FIGS. 1 to 3 together. FIG. 1 is a pin diagram of a substrate drawn according to some embodiments of the present application. FIG. 2 is a diagram of the pins of the flexible circuit board drawn according to some embodiments of the present application. FIG. 3 is a schematic diagram of the joint points according to some embodiments of the present application. Please refer to FIGS. 1 to 3, the electronic device 100 includes a substrate 120 and a flexible circuit board 220. In some embodiments, the electronic device 100 may be a panel or a display device.

Please refer to FIG. 1, the substrate 120 includes a plurality of first pins 110. Please refer to FIG. 2, the flexible circuit board 220 includes a plurality of second pins 210.

In some embodiments, the plurality of first pins 110 include pins with different line widths as shown in FIG. 1, for example, the pins 111, 112 and 113 as shown in FIG. 1.

In some embodiments, the plurality of second pins 210 include pins with different line widths as shown in FIG. 2, for example, the pins 211, 212 and 213 as shown in FIG. 1.

In some embodiments, in order to make the structure of the electronic device 100 in this case easy to understand, please refer to FIGS. 3 to 4 together. Fig. 4 is a schematic diagram of a joint point according to a modified embodiment of the embodiment in Fig. 3 of the present application.

In some embodiments, please refer to Fig. 3 first, which illustrates the basic structure of the joint in this case. As shown in the figure, the plurality of joints 310 includes at least one central joint 311 and at least one first joint 312. The line width of at least one central junction 311 is W1. The line width of at least one first junction 312 is W2. The line width W2 of the at least one first joint 312 is greater than the line width W1 of the at least one central joint 311. The distance between the at least one central junction point 311 and the at least one first junction point 312 is D1.

Based on the basic structure of the junction shown in Figure 3, Figure 4 shows a more complete application example of the junction of the modified embodiment of the embodiment in Figure 3 of this case. As shown in the figure, at least one central joint 311A is located in the central area A1 of the electronic device 100. At least the first joint 312A is located in the first area A2 of the electronic device 100. The first area A2 is located outside the central area A1. Similar to the basic structure of the joint shown in FIG. 3, the line width W2 of the at least one first joint 312A in the first area A2 is also larger than the line width W1 of the at least one central joint 311A in the central area A1.

In some embodiments, please refer to FIG. 4, at least one central joint 311A includes a plurality of central joints 311A and is located in the central area A1. The line width W1 of each of the plurality of central junction points 311A is equal. In some embodiments, the line width W1 of each of the plurality of central junctions 311A is greater than or equal to 380.

In some embodiments, the at least one first joint 312A includes a plurality of first joints 312A and is located in the first area A2. The line width W2 of each of the plurality of first junction points 312A is equal.

In some embodiments, the difference between the line width W1 of each of the plurality of central junction points 311A and the line width W2 of each of the plurality of first junction points 312A is equal. In addition, the difference between the line width W1 of each of the plurality of central junction points 311A and the line width W2 of each of the plurality of first junction points 312A is between 0 μm and 25 μm.

In some embodiments, the spacing between two adjacent central junction points 311A among the plurality of central junction points 311A is equal. In some embodiments, the distance between two adjacent first joints 312A among the plurality of first joints 312A is equal.

In some embodiments, the spacing between two adjacent central junctions in the plurality of central junctions 311A and the spacing between two adjacent first junctions in the plurality of first junctions 312A are less than or equal to 380μm.

In some embodiments, each of the plurality of central joints 311A and each of the plurality of first joints 312A are arranged on the same straight line.

In some embodiments, the electronic device 100 includes a first side M1 and a second side M2, and the second side M2 is opposite to the first side M1. It should be noted that in Figure 4, although the first side M1 and the second side M2 are shown as the left and right sides in the figure, in practice, the first side M1 and the second side M2 do not have the left and right sides. The right side is the limit. Furthermore, the structure in the direction in which the central line CL extends to the first side M1 is taken as an example for description. The first area A2 is arranged adjacent to the central area A12 and is located in the central area A12 close to the first side M1.

In some embodiments, the electronic device includes a first side M1 and a second side M2. The second side M2 is opposite to the first side M1. An arrangement sequence from the second side M2 to the first side M1 of the electronic device 100 is the central area A12 and the first area A2.

In some embodiments, the length of the central area A12 is equal to the length of the first area A2. In some embodiments, the length of the central area A12 and the length of the first area A2 are between 4.75 mm and 5.25 mm.

In some embodiments, referring to FIG. 3, the plurality of joints 310 further includes at least one second joint 313. The line width of at least one second junction 313 is W3. The line width W3 of the at least one second joint 313 is greater than the line width W2 of the at least one first joint 312. The distance between the at least one first joint 312 and the at least one second joint 313 is D2.

The same is based on the basic structure of the junction shown in Figure 3, and the junction of the modified embodiment of the embodiment shown in Figure 4 and Figure 3. As shown in the figure, the at least one second joint 313A includes a plurality of second joints 313A and is located in the second area A3 of the electronic device 100. The second area A3 is located outside the first area A2. Similar to the basic structure of the joint shown in FIG. 3, the line width W3 of the at least one second joint 313A in the second area A3 is larger than the line width W2 of the at least one first joint 312A in the first area A2.

In some embodiments, the line width W1 of the at least one central junction point 311A, the line width W2 of the at least one first junction point 312A, and the line width W3 of the at least one second junction point 313A are distributed equally. The tolerance between the line width W1 of the at least one central junction point 311A, the line width W2 of the at least one first junction point 312A and the line width W3 of the at least one second junction point 313A is between 0 μm and 25 μm.

In some embodiments, the line width W1 of the at least one central junction point 311A, the line width W2 of the at least one first junction point 312A, and the line width W3 of the at least one second junction point 313A are equal in increasing or decreasing in equal difference.

It should be noted that the line width in Figure 4 is difficult to show the subtle differences in the line width in the area on the drawing. In fact, the line width in Figure 4 is arithmetic increasing or decreasing according to the embodiment in Figure 3. Modified embodiment.

In some embodiments, the first distance D1 between the at least one central junction point 311A and the at least one first junction point 312A is equal to the second distance D2 between the at least one first junction point 312A and the at least one second junction point 313A. In some embodiments, both the first distance D1 and the second distance D2 are less than or equal to 380 μm.

In some embodiments, at least one central junction point 311A, at least one first junction point 312A, and at least one second junction point 313A are arranged on the same straight line.

In some embodiments, the electronic device 100 includes a first side M1 and a second side M2. The second side M2 is opposite to the first side M1. The at least one first joint 311A includes two first joints 312A, and the first joints 312A are respectively disposed in the two first areas A2 of the electronic device 100. The at least one second joint 313A includes two second joints 313A, and the second joints 313A are respectively disposed in the two second areas A3 of the electronic device 100. It should be noted that the entire description of Fig. 4 is used here. The arrangement order from the second side M2 to the first side M1 of the electronic device 100 is the second area A3, the first area A2, the central area A1, and the first area A1. Area A2 and the second area A3.

In some embodiments, as a whole in Figure 4, the length of the first area A2 is equal to the length of the second area A3, and the length of the central area A1 is the length of the first area A2 and the length of the second area A3, respectively. Twice the length. In some embodiments, the length of the first area A2 and the length of the second area A3 are between 4.75 mm and 5.25 mm. The length of the central area A1 is between 9.5mm and 10.5mm.

FIG. 5 is a flowchart of steps of a method of manufacturing an electronic device according to some embodiments of the present application. In some embodiments, the electronic device manufacturing method 500 is used to bond the substrate of FIG. 1 and the flexible circuit board of FIG. 2 to each other to form a plurality of bonding points 310 as shown in FIG. 3.

In step 510, a plurality of first pins are arranged on the substrate.

For example, referring to FIG. 1, a plurality of first pins 110 are provided on the substrate 120.

In step 520, a plurality of second pins are set on the flexible circuit board.

For example, referring to FIG. 2, a plurality of second pins 210 are provided on the flexible circuit board 220.

In step 530, the plurality of first pins and the plurality of second pins are joined to form at least one central joint in the central area of the electronic device, and at least one first joint is formed in the first area of the electronic device , Wherein the first area is located outside the central area, and the line width of the at least one first joint is greater than the line width of the at least one central joint.

For example, referring to FIGS. 1 to 4, a plurality of first pins 110 and a plurality of second pins 210 are joined to form at least one central joint 311A in the central area A1 of the electronic device 100, which is connected to the electronic device 100. The first area A2 in the device 100 forms at least one first joint 312A, wherein the first area A2 is located outside the central area A1, and the line width W2 of the at least one first joint 312A is greater than the line width of the at least one central joint 311A W1.

In some embodiments, the above step 530 includes the following operations: joining a plurality of first pins and a plurality of second pins to form at least one central joint in the central area of the electronic device, in the first area of the electronic device At least one first joint is formed, and at least one second joint is formed in the second area of the electronic device. The second area is located outside the first area, and the line width of at least one second joint is greater than the line width of at least one first joint.

For example, referring to FIGS. 1 to 4, a plurality of first pins 110 and a plurality of second pins 210 are joined to form at least one central joint 311A in the central area A1 of the electronic device 100, The first area A2 of the device 100 forms at least one first joint 312A, and the second area A3 of the electronic device 100 forms at least one second joint 313A. The second area A3 is located outside the first area A2. The line width W3 of the at least one second joint 313A is greater than the line width W2 of the at least one first joint 312A.

In some embodiments, the above step 530 further includes the following operations: bonding a plurality of first pins and a plurality of second pins so that the line width of at least one central bonding point, the line width of at least one first bonding point, and at least The line width of a second junction presents an equal distribution.

For example, referring to FIGS. 1 to 4, the plurality of first pins 110 and the plurality of second pins 210 are joined to make the line width W1 of the at least one central joint 311A and the at least one first joint 312A The line width W2 of the at least one second junction 313A and the line width W3 of the at least one second junction point 313A have an equal distribution.

In some embodiments, referring to FIG. 4, the bonding area is formed between the first side M1 and the second side M2. In practice, the length of the bonding area is 50.43 mm. After adopting the electronic device manufacturing method of this case, the length of the bonding area is reduced from 50.43mm to 49.79mm, which makes the design space more 0.64mm.

According to the foregoing embodiment, the present application provides an electronic device and an electronic device manufacturing method, so as to improve the problem of increased tolerances caused by the increase in the length of the bonding area in the ultra-thin flexible substrate, and the accuracy of bonding can be improved.

Although this case is disclosed as above with detailed embodiments, this case does not exclude other feasible implementation aspects. Therefore, the scope of protection of this case shall be determined by the scope of the attached patent application, and shall not be restricted by the foregoing embodiments.

For those skilled in the art, without departing from the spirit and scope of the case, various changes and modifications can be made to the case. Based on the foregoing embodiment, all changes and modifications made to this case are also covered by the scope of protection of this case.

100: electronic device 110: first pin 120: substrate 111~113: pin 210: second pin 220: flexible circuit board 211~113: Pin 310: Junction 311~311A: Central junction 312~312A: the first junction 313~313A: second junction M1: First side M2: second side W1: The line width of the central junction W2: The line width of the first junction W3: The line width of the second junction D1: The distance between the central junction and the first junction D2: The distance between the first junction and the second junction A1: Central area CL: Central Line A11, A12: Central area A2: The first area A3: The second area 500: method 510~530: steps

With reference to the implementation in the subsequent paragraphs and the following diagrams, you can better understand the content of this case: Figure 1 is a diagram showing the pins of the substrate according to some embodiments of the present case; Figure 2 is a pin diagram of a flexible circuit board drawn according to some embodiments of the present case; Figure 3 is a schematic diagram of the joints drawn according to some embodiments of the present case; Fig. 4 is a schematic diagram of a joint point according to a modified embodiment of the embodiment in Fig. 3 of the present case; and FIG. 5 is a flowchart of steps of a method of manufacturing an electronic device according to some embodiments of the present application.

100: electronic device

120: substrate

220: flexible circuit board

310: Junction

311: Central Joint

312: The first junction

313: second junction

M1: First side

M2: second side

W1: The line width of the central junction

W2: the line width of the first junction

W3: The line width of the second junction

D1: The distance between the central junction and the first junction

D2: The distance between the first junction and the second junction

Claims (17)

An electronic device including: A substrate, including: A plurality of first pins are arranged on the substrate; and A flexible circuit board, including: A plurality of second pins are arranged on the flexible circuit board; The first pins and the second pins are connected to each other to form a plurality of joints, and the joints include: At least one central junction is located in a central area of the electronic device; and At least one first joint is located in a first area of the electronic device, wherein the first area is located outside the central area, wherein the line width of the at least one first joint is greater than the line width of the at least one central joint . The electronic device according to claim 1, wherein the at least one central junction includes a plurality of central junctions, and each of the central junctions has the same line width. The electronic device according to claim 2, wherein the at least one first joint includes a plurality of first joints, and each of the first joints has the same line width. The electronic device according to claim 3, wherein the difference between the line width of each of the center joint points and the line width of each of the first joint points is equal, wherein the center The difference between the line width of each of the bonding points and the line width of each of the first bonding points is between 0 μm and 25 μm. The electronic device according to claim 4, wherein the distance between two adjacent central junctions among the central junctions is equal, and the distance between two adjacent first junctions among the first junctions is equal Are equally spaced. The electronic device according to claim 5, wherein the distance between two adjacent central joints among the central joints and the distance between two adjacent first joints among the first joints Less than or equal to 380μm. The electronic device according to any one of claims 1 to 6, wherein each of the central joints and each of the first joints are arranged on the same straight line. The electronic device according to any one of claims 1 to 6, wherein the electronic device includes a first side and a second side, the second side is opposite to the first side, and the first area is arranged adjacent to the The central area is located near the first side in the central area. The electronic device according to any one of claims 1 to 6, wherein the electronic device includes a first side and a second side, and the second side is opposite to the first side, wherein the second side of the electronic device is An arrangement sequence from the side to the first side is the central area and the first area. The electronic device according to any one of claims 1 to 6, wherein the length of the central area and the length of the first area are between 4.75 mm and 5.25 mm. The electronic device according to claim 1, wherein the junction points further include: At least one second junction is located in a second area of the electronic device, wherein the second area is located outside the first area, wherein the line width of the at least one second junction is greater than that of the at least one first junction Line width. The electronic device according to claim 11, wherein the line width of the at least one central junction, the line width of the at least one first junction, and the line width of the at least one second junction are distributed equally, wherein the at least The tolerance between the line width of a central junction, the line width of the at least one first junction and the line width of the at least one second junction is between 0 μm and 25 μm. The electronic device according to claim 12, wherein the line width of the at least one central junction, the line width of the at least one first junction, and the line width of the at least one second junction are arithmetic increasing or decreasing . The electronic device according to claim 13, wherein a first distance between the at least one central joint and the at least one first joint and a second distance between the at least one first joint and the at least one second joint The pitch is less than or equal to 380μm. The electronic device according to any one of claims 12 to 14, wherein the at least one central joint, the at least one first joint, and the at least one second joint are arranged on the same straight line. The electronic device according to any one of claims 12 to 14, wherein the electronic device includes a first side and a second side, the second side is opposite to the first side, and the at least one first junction includes Two first joints, the first joints are respectively arranged in two first regions of the electronic device, wherein the at least one second joint includes two second joints, and the second joints are respectively Are arranged in two second areas of the electronic device, wherein an arrangement sequence from the second side to the first side of the electronic device is the second area, the first area, the central area, the first Area and the second area. The electronic device according to any one of claims 12 to 14, wherein the length of the first area and the length of the second area are respectively between 4.75 mm and 5.25 mm, and the length of the central area is between 9.5 mm and 10.5 mm.

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