TWM605608U - Lamp device for vehicle - Google Patents

Abstract

A lamp device for vehicle is provided. The lamp device for vehicle includes a substrate, at least one light-emitting element strings, a first power input pin, a second power input pin, and a driving circuit. The driving circuit is arranged on the substrate. The driving circuit receives external power through the first power input pin and the second power input pin, and drives the at least one light-emitting element strings according to the external power.

Description

Bulb device for vehicle

The new creation relates to an automotive light bulb device, and in particular relates to an automotive light bulb device that can match the current automotive light bulb manufacturing process.

Light-emitting diode (LED) has the advantages of high conversion efficiency, long service life, small size, and power saving. Therefore, LEDs can be widely used in automotive lighting.

However, due to the high process temperature of the current vehicle lighting device, the current driving circuit for driving the LED cannot be integrated in the vehicle light bulb. Therefore, the current drive circuit is installed outside the vehicle bulb. As a result, the vehicle lighting device will occupy a larger installation space. Therefore, how to make the LED car light bulb device match the current car light bulb manufacturing process is one of the development focuses of skills and technicians.

This new creation provides an automotive light bulb device that can match the current automotive light bulb manufacturing process.

The vehicle light bulb device created by the present invention includes a substrate, a plurality of light-emitting element strings, a first power input pin, a second power input pin, and a driving circuit. The plurality of light-emitting element strings are arranged in the arrangement area of the substrate. At least one light-emitting element string includes at least one light-emitting element, respectively. The driving circuit is arranged on the substrate. The driving circuit is coupled to the plurality of light-emitting element strings, the first power input pin and the second power input pin. The driving circuit is configured to receive external power through the first power input pin and the second power input pin, and to provide driving power according to the external power to drive at least one light-emitting element string. The drive circuit is a single chip integrated circuit.

Based on the above, since the light-emitting element string and the driving circuit are arranged on the substrate, the present invention realizes the integration of the light-emitting element string and the driving circuit. Therefore, the present invention simplifies the manufacturing process of the vehicle light bulb device and reduces the installation space of the vehicle lighting device.

Some of the embodiments of the present invention will be described in detail in conjunction with the accompanying drawings. The component symbols cited in the following description will be regarded as the same or similar components when the same component symbols appear in different drawings. These embodiments are only a part of the creation of the new type, and do not disclose all the practicable ways of the creation of the new type. To be more precise, these embodiments are just examples of the devices and methods within the scope of the patent application of the invention.

Please refer to FIG. 1, which is a schematic diagram of a vehicle light bulb device according to the first embodiment of the invention. In this embodiment, the vehicle light bulb device 100 includes a substrate 110, light-emitting element strings LS1 to LS6, power input pins 120_1, 120_2, and a driving circuit 130. The substrate 110 has a first surface PL1. A partial area of the substrate 110 is planned as an installation area LA1 where the light-emitting element strings LS1 to LS6 are installed. In this embodiment, the area of the setting area LA1 is less than or equal to 50% of the area of the substrate 110. The setting area LA1 is located on the first surface PL1. In this embodiment, the substrate 110 may be a sapphire substrate or a quartz (Quartz) substrate. The sapphire substrate and the quartz (Quartz) substrate have the characteristics of light transmission and high temperature resistance. In some embodiments, the substrate 110 may be an opaque high temperature ceramic substrate. In this embodiment, the light-emitting element strings LS1 to LS6 are coupled to each other in parallel. The light emitting element strings LS1 to LS6 are installed in the installation area LA1. The light-emitting element strings LS1 to LS6 respectively include a single light-emitting element or a plurality of light-emitting elements (not shown) coupled to each other in series. The light-emitting element of this embodiment may be a light-emitting diode (LED) with high brightness performance. For ease of description, the number of light-emitting element strings LS1 to LS6 in this embodiment is six as an example, but the creation of the present invention is not limited to this. The number of light-emitting element strings created by the present invention can be one or more.

In some embodiments, the substrate 110 may be coated with phosphor. The fluorescent glue covers the light-emitting element strings LS1 to LS6. The laying area of the fluorescent glue will cover the installation area LA1 and the laying area of the fluorescent glue is larger than the area of the installation area LA1. Therefore, the fluorescent glue can increase the light emitting area of the light bulb device 100 for a vehicle. The laying area of the fluorescent glue is less than or equal to 90% of the area of the substrate 110. In some embodiments, the phosphor also covers the driving circuit 130.

In this embodiment, the driving circuit 130 is disposed on the substrate 110, for example, on the first surface PL1. The driving circuit 130 is coupled to the light-emitting element strings LS1 to LS6 and the power input pins 120_1 and 120_2. The driving circuit 130 receives external power through the power input pins 120_1 and 120_2, and provides a driving power PDR according to the external power to drive the light-emitting element strings LS1 to LS6. For example, when the driving circuit 130 receives an external power source, the driving circuit 130 will provide a corresponding driving current according to the brightness requirements of the product to drive the light-emitting element strings LS1 to LS6. In this embodiment, the power input pins 120_1 and 120_2 are, for example, pins formed by metal wires having a diameter of 0.3-1 mm. The driving circuit 130 is a single chip integrated circuit.

Incidentally, since the light-emitting element strings LS1 to LS6 and the driving circuit 130 are disposed on the substrate 110, the vehicle light bulb device 100 realizes the integration of the light-emitting element strings LS1 to LS6 and the driving circuit 130. Therefore, this embodiment simplifies the manufacturing process of the vehicle light bulb device 100 and reduces the installation space of the vehicle lighting device.

Furthermore, the vehicle light bulb device 100 further includes a vehicle light bulb shade A and an insertion portion B. In this embodiment, the lampshade A for the vehicle bulb has a transparent shell structure. The insertion part B is used to fix the parts of the power input pins 120_1 and 120_2, so as to ensure that the power input pins 120_1 and 120_2 can receive external power. The lampshade A and the inserting part B for the vehicle light bulb may conform to the T10 specification, for example. That is, the vehicle light bulb device 100 is, for example, a light bulb conforming to the T10 standard. In this embodiment, the substrate 110 is provided outside the insertion portion B, and is provided in the bulb lampshade A for the vehicle. It should be noted that the packaging of automotive bulbs requires a very high process temperature to form the mating portion B. In the packaging process, the driving circuit 130 and the light-emitting element strings LS1 to LS6 disposed in the setting area LA1 can be prevented from being damaged due to high temperature during the process of forming the insertion portion B. Therefore, the manufacturing process of the vehicle light bulb device 100 can match the current manufacturing process of the vehicle light bulb.

In this embodiment, the vehicle light bulb device 100 further includes connection pads 140_1 and 140_2. The connection pads 140_1 and 140_2 are respectively disposed on the first surface PL1 of the substrate 110 and are respectively coupled to the driving circuit 130. For example, the connection pad 140_1 can be directly connected to the power input pin 120_1 by electric welding. The connection pad 140_1 is connected to the conductive pattern C1. The connection pad 140_2 is directly connected to the power input pin 120_2 by electric welding. The connection pad 140_2 is connected to the conductive pattern C2. The connection pads 140_1 and 140_2 and the conductive patterns C1 and C2 can be completed by a thick film process (for example, screen printing technology). In this embodiment, the driving circuit 130 can be electrically connected to the conductive patterns C1 and C2 by wire bonding. The invention is not limited to this. In some embodiments, the driving circuit 130 may be electrically connected to the conductive patterns C1 and C2 through a flip chip process. In this way, the driving circuit 130 receives the high potential of the external power (for example, 9~38 volts) via the power input pin 120_1, the connection pad 140_1, and the conductive pattern C1, and receives the high potential (for example, 9~38 volts) via the power input pin 120_2, the connection pad 140_2, and the conductive pattern C1. The pattern C2 receives a low potential (for example, ground) of the external power source. The distance between the driving circuit 130 and the insertion portion B is greater than the distance between the connection pads 140_1 and 140_2 and the insertion portion B.

For example, in this embodiment, the driving circuit 130 can be electrically connected to the conductive patterns C3 and C4 by wire bonding. The present invention is not limited to this. In some embodiments, the driving circuit 130 may be electrically connected to the conductive pattern C3 and the first terminals of the light-emitting element strings LS1 to LS6 through a flip chip process and the conductive patterns C3 and C4. connection. The conductive pattern C4 is electrically connected to the second ends of the light-emitting element strings LS1 to LS6. The conductive patterns C3 and C4 in this embodiment can be completed by a thick film process. In this way, the driving circuit 130, the conductive patterns C3, C4, and the light-emitting element strings LS1 to LS6 form a power transmission path for the driving power PDR. The driving circuit 130, for example, provides the driving power PDR to the light emitting element strings LS1 to LS6 based on the power transmission path.

In this embodiment, the substrate 110 is set based on the setting direction SD. The installation direction SD is a direction away from the insertion portion B. In the setting direction SD, the driving circuit 130 is provided between the connection pads 140_1, 140_2 and the setting area LA1. Therefore, compared with the driving circuit 130, the setting area LA1 is farther away from the power input pins 120_1 and 120_2.

Please refer to FIG. 2, which is a schematic diagram of a vehicle light bulb device according to a second embodiment of the invention. The vehicle light bulb device 200 of this embodiment is exemplified in a side view. In this embodiment, the light-emitting element strings LS1 to LS3 are arranged in the arrangement area of the first surface PL1. The light emitting element strings LS4 to LS6 are arranged in the arrangement area of the second surface PL2. The first surface PL1 is opposite to the second surface PL2. The light-emitting element strings LS1 to LS6 are coupled in parallel. In the creation of the new model, based on design or use requirements, the number of light-emitting element strings arranged on the first surface PL1 can be one or more, and the number of light-emitting element strings arranged on the second surface PL2 can be one or more It is not limited to this embodiment.

In this embodiment, the first surface PL1 is covered with a fluorescent glue GL1, so that the light-emitting element strings LS1 to LS3 are covered by the fluorescent glue GL1. The second side PL2 will be covered with a fluorescent glue GL2, so that the light-emitting element strings LS4 to LS6 will be covered by the fluorescent glue GL2.

The connection between the driving circuit 130 and the light-emitting element strings LS1 to LS3 arranged on the first surface PL1 can be sufficiently taught by the first embodiment, so it will not be repeated here. In this embodiment, the driving circuit 130 disposed on the first surface PL1 can be, for example, connected in series with the light-emitting elements disposed on the second surface PL2 by a side wiring method or a via method. LS4~LS6 are electrically connected.

In some embodiments, another driving circuit may be disposed on the second surface PL2, and the implementation taught in the embodiment of FIG. 1 receives external power through the connection pads and power input pins, and drives the light-emitting element string LS4~LS6.

In some embodiments, the driving circuit 130 disposed on the substrate 100 may be covered by protective glue, fluorescent glue GL1, white glue, and transparent glue. The protective glue can be any color or transparent insulating and heat-dissipating glue. The protective glue can prevent the driving circuit 130 from being damaged during subsequent manufacturing processes (such as electric welding). In this embodiment, the substrate 110 may be a high-temperature ceramic substrate. In some embodiments, the light-emitting element strings LS1 to LS6 may be covered by protective glue. In other words, at least one of the light-emitting element strings LS1 to LS6 and/or the driving circuit 130 may be covered by one of the fluorescent glue and the protective glue.

In some embodiments, in this embodiment, the substrate 110 may be a sapphire substrate or a quartz substrate. In the vehicle light bulb device 200, the light-emitting element strings LS4 to LS6 may not be provided on the second surface PL2. That is, only the first surface PL1 has the light-emitting element strings LS1 to LS3. The first side PL1 will be coated with fluorescent glue GL1. The second side PL2 will be coated with fluorescent glue GL2. Therefore, the vehicle light bulb device 200 can achieve the effect of double-sided light emission.

In some embodiments, in this embodiment, the substrate 110 may be a sapphire substrate or a quartz substrate. In the vehicle light bulb device 200, the light-emitting element strings LS4 to LS6 may not be provided on the second surface PL2. That is, only the first surface PL1 has the light-emitting element strings LS1 to LS3. The fluorescent glue GL1 may not be laid on the first surface PL1. The second surface PL2 may not be covered with fluorescent glue GL2. Therefore, the vehicle light bulb device 200 can achieve the effect of double-sided light emission.

In this embodiment, the power input pin 120_1 and the connection pad 140_1 are electrically connected through a connection structure CP. For example, the connection structure CP may be a connection structure formed by electric welding. The connection method of the driving circuit 130 and the connection pad 140_1 can be sufficiently taught by the first embodiment, so it will not be repeated here. The connection pad 140_1 is not covered by the fluorescent glue GL1 and the protective glue.

In addition, the mating part B further includes a fixing part BP for fixing a part of the power input pin 120_1.

Please return to the first embodiment, the part of the power input pin 120_1 is bent or bent multiple times to form the first elastic contact structure. The part of the power input pin 120_2 is bent or bent multiple times to form a second elastic contact structure. In this way, the vehicle light bulb device 100 can increase the contact area for receiving external power through the first elastic contact structure of the power input pin 120_1 and the second elastic contact structure of the power input pin 120_2. The vehicle light bulb device 100 can prevent the vehicle light bulb device 100 from loosening due to the elasticity of the first elastic contact structure and the second elastic contact structure. In addition, when the vehicle light bulb device 100 is inserted and removed multiple times, the first elastic contact structure of the power input pin 120_1 and the second elastic contact structure of the power input pin 120_2 can also prevent the power input pin Damage of 120_1, 120_2.

For an example to illustrate the implementation details of the elastic contact structure, please refer to FIG. 3A. FIG. 3A is a schematic diagram of the elastic contact structure of the power input pin according to an embodiment of the invention. The power input pin 120 is bent multiple times to form parts P1 to P3. In this embodiment, taking the part P1 extending along the direction D1 as an example, the part P2 will extend along the direction D2 from the bend between the part P1 and the part P2. The direction D2 is different from the direction D1. The part P3 will extend from the bend between the part P2 and the part P3 in a direction opposite to the direction D1. In addition, the part P1 will be fixed by the mating part (the mating part B shown in FIG. 1). Parts P2 and P3 will be exposed at the mating part. Therefore, the parts P2 and P3 of the power input pin 120 may form an elastic contact structure (ie, a single meander metal conductor structure).

Please refer to FIG. 3B. FIG. 3B is a schematic diagram of another elastic contact structure of the power input pin according to an embodiment of the invention. The power input pin 120 is bent multiple times to form parts P1 to P7. In this embodiment, taking the part P1 extending along the direction D1 as an example, the part P2 will extend along the direction D2 from the bend between the part P1 and the part P2. The part P3 will extend from the bend between the part P2 and the part P3 in a direction opposite to the direction D1. The part P4 extends along the direction D3 from the bend between the part P3 and the part P4. The direction D3 is different from the directions D1, D2. The part P5 extends along the direction D1 from the bend between the part P4 and the part P5. The portion P6 will extend from the bend between the portion P5 and the portion P6 in a direction opposite to the direction D2. The portion P7 will extend from the bend between the portion P6 and the portion P7 in a direction opposite to the direction D1. In addition, the parts P1 and P7 will be fixed by the insertion part. Part of P2~P6 will be exposed at the mating part. Therefore, the parts P2 to P6 of the power input pin 120 can form an elastic contact structure (ie, a double meander metal conductor structure).

The power input pins 120 illustrated in the embodiments of FIGS. 3A and 3B are bent multiple times to form an elastic contact structure. In some embodiments, the power input pin 120 is bent and bent to form an elastic contact structure. In other embodiments, the power input pin 120 is bent multiple times to form an elastic contact structure. The elastic contact structure of the present invention is not limited to the embodiment of FIG. 3A and FIG. 3B.

Fig. 4 is a schematic diagram of a light bulb device for a vehicle according to a third embodiment of the invention. The difference from the first embodiment is that the connection pad 140_1 of the vehicle light bulb device 300 includes a conductive member 141_1. The connection pad 140_2 of the light bulb device 300 for a vehicle includes a conductive member 141_2. In this embodiment, the conductive element 141_1 can be connected to the connection pad 140_1 by electric welding, or connected to the connection pad 140_1 by conductive glue (for example, silver glue). The conductive member 141_1 extends from the connection pad 140_1 to the outside of the substrate 110. The power input pin 120_1 is electrically connected to the conductive element by electric welding. In this embodiment, the power input pin 120_1 includes a welding part 121_1. The welding part 121_1 is connected to the conductive member 141_1 by electric welding.

Similarly, the conductive member 141_2 can be connected to the connection pad 140_2 by electric welding or conductive glue, and extends from the connection pad 140_2 to the outside of the substrate 110. The power input pin 120_2 is electrically connected to the conductive member 141_2 by electric welding. In this embodiment, the power input pin 120_2 includes the welding part 121_2. The welding part 121_2 is connected to the conductive member 141_2 by electric welding.

Please refer to FIG. 5. FIG. 5 is a schematic diagram of a vehicle light bulb device according to a fourth embodiment of the invention. The difference from the first embodiment is that the area of the installation area LA2 of the vehicle light bulb device 400 of this embodiment is less than or equal to 30% of the area of the substrate 110. In addition, the setting area LA2 is also far away from the connection pads 140_1, 140_2 and the driving circuit 130. The density of the light-emitting element strings LS1 to LS6 of the vehicle light bulb device 400 will be more concentrated. Therefore, the light pattern provided by the vehicle light bulb device 400 is different from the light pattern provided by the vehicle light bulb device 100 of the first embodiment.

Please refer to FIG. 6. FIG. 6 is a schematic diagram of a vehicle light bulb device according to a fifth embodiment of the invention. The difference from the first embodiment is that in the installation direction SD, the installation area LA3 of the vehicle light bulb device 500 is provided between the connection pads 140_1 and 140_2 and the drive circuit 130. Compared with the setting area LA3, the driving circuit 130 is farther away from the power input pins 120_1 and 120_2. Therefore, compared with the first embodiment, the driving circuit 130 of this embodiment can be further away from the insertion portion B. In this way, this embodiment further ensures that the driving circuit 130 will not be damaged due to high temperature during the process of forming the mating portion B. Therefore, the manufacturing process of the vehicle light bulb device 500 can match the current manufacturing process of the vehicle light bulb.

Please refer to FIG. 1 and FIG. 7 at the same time. FIG. 7 is a driving current curve diagram drawn according to an embodiment of the invention. In this embodiment, the driving circuit 130 provides a driving power PDR to drive the light-emitting element strings LS1 to LS6. During the period when the light emitting element strings LS1 to LS6 are driven, the driving circuit 130 senses the temperature of the substrate 110. The temperature of the substrate 110 is related to the temperature generated when the light-emitting element strings LS1 to LS6 are driven. That is, the higher the temperature generated when the light-emitting element strings LS1 to LS6 are driven, the higher the temperature of the substrate 110. The driving circuit 130 determines whether the temperature of the substrate 110 is greater than a preset temperature TD. When the driving circuit 130 determines that the temperature of the substrate 110 is greater than the preset temperature TD, the power of the driving power PDR is reduced. For example, when the temperature of the substrate 110 is less than or equal to the preset temperature TD (for example, 125°C, which is not limited to this invention), the driving circuit 130 can provide an initial current value (for example, 400 millimetres). Ampere) drive current IDR drive power PDR. When the temperature of the substrate 110 is greater than the preset temperature TD, the driving circuit 130 activates the over-temperature protection mechanism. When the temperature of the substrate 110 is greater than the preset temperature TD, the current value of the driving current IDR will decrease as the temperature of the substrate 110 increases, thereby reducing the temperature generated by the driving of the light-emitting element strings LS1 to LS6. If the temperature of the substrate 110 decreases to less than or equal to the preset temperature TD, the current value of the driving current IDR will return to the initial current value.

In this embodiment, the driving circuit 130 can also be designed to have anti-surge (Surge) and anti-electrostatic discharge (Electrostatic Discharge, ESD) functions, so as to prevent the light-emitting element strings LS1 to LS6 from being subjected to surge and/or electrostatic discharge. Shock.

Please refer to FIG. 8. FIG. 8 is a schematic diagram of the configuration of the light-emitting element string and the driving circuit according to an embodiment of the invention. For ease of description, this embodiment takes as an example that the light-emitting element strings LS1 to LS6 each have a single light-emitting element. The present invention is not limited to the number of light-emitting elements connected in series in the light-emitting element string. In this embodiment, the driving power PDR provided by the driving circuit 130 is a constant current power supply. For example, in the light emitting element strings LS1 to LS6, the light emitting elements L1 to L6 respectively have the same specifications. Therefore, the driving current of the driving power supply PDR is evenly shunted to the light-emitting element strings LS1 to LS6.

When the light-emitting element L2 is damaged, the light-emitting element L2 will be disconnected, or the light-emitting element L2 will be disconnected after an instant short-circuit. Therefore, the constant driving current of the driving power supply PDR is evenly shunted to the light emitting element strings LS1, LS3 to LS6.

When the light-emitting element L2 is broken and turned off, the current value of the current flowing through the light-emitting element strings LS1, LS3 to LS6 increases. The brightness provided by the light-emitting element has a positive correlation with the current value. Therefore, the total brightness provided by the light-emitting element strings LS1, LS3~LS6 when the light-emitting element L2 is damaged is similar to the total brightness provided by the light-emitting element strings LS1~LS6 when the light-emitting element L2 is not damaged. In this way, the total brightness of the vehicle light bulb device can be maintained.

In summary, since the light-emitting element string and the driving circuit are arranged on the substrate, the present invention realizes the integration of the light-emitting element string and the driving circuit. Therefore, the present invention simplifies the manufacturing process of the vehicle light bulb device and reduces the installation space of the vehicle lighting device. The part of the power input pin is bent or bent multiple times to form an elastic contact structure. Therefore, the vehicle light bulb device can increase the contact area for receiving external power through the elastic contact structure. The vehicle light bulb device can prevent the vehicle light bulb device from loosening through the elastic contact structure. The elastic contact structure can also prevent damage to the power input pin when the vehicle light bulb device is inserted and removed many times. The drive circuit can provide over-temperature protection according to the temperature of the substrate. The driving circuit can also maintain the total brightness of the vehicle bulb device.

Although the creation of this new type has been disclosed in the above embodiments, it is not intended to limit the creation of this new type. Anyone with ordinary knowledge in the technical field can make some changes and changes without departing from the spirit and scope of the new creation. Retouching, therefore, the scope of protection of the creation of the new model shall be subject to the scope of the attached patent application.

100, 200, 300, 400, 500: car light bulb device 110: substrate 120, 120_1, 120_2: power input pins 121_1, 121_2: welding part 130: drive circuit 140_1, 140_2: connecting pad 141_1, 141_2: conductive parts A: Car light bulb shade B: Mating part BP: Fixed part C1~C4: conductive pattern CP: Link structure D1~D3: Direction GL1, GL2: fluorescent glue IDR: drive current L1~L6: Light-emitting element LS1~LS6: Light-emitting element string LA1, LA2, LA3: Setting area P1~P7: part of the power input pins PDR: drive power PL1: First side PL2: Second side SD: set direction

Fig. 1 is a schematic diagram of a vehicle light bulb device according to the first embodiment of the invention. Fig. 2 is a schematic diagram of a vehicle light bulb device according to a second embodiment of the invention. 3A and 3B are schematic diagrams of the elastic contact structure of the power input pin according to an embodiment of the invention. Fig. 4 is a schematic diagram of a light bulb device for a vehicle according to a third embodiment of the invention. Fig. 5 is a schematic diagram of a vehicle light bulb device according to a fourth embodiment of the invention. Fig. 6 is a schematic diagram of a vehicle light bulb device according to a fifth embodiment of the invention. FIG. 7 is a graph of driving current drawn according to an embodiment of the invention. FIG. 8 is a schematic diagram showing the configuration of a light-emitting element string and a driving circuit according to an embodiment of the invention.

100: Bulb device for car

110: substrate

120_1, 120_2: power input pins

130: drive circuit

140_1, 140_2: connecting pad

A: Car light bulb shade

B: Mating part

C1~C4: conductive pattern

LA1: Set area

LS1~LS6: Light-emitting element string

PDR: drive power

PL1: First side

SD: set direction

Claims (13)

A light bulb device for a vehicle, including: A substrate; At least one light-emitting element string is arranged in a setting area of the substrate, wherein the at least one light-emitting element string includes at least one light-emitting element; A first power input pin and a second power input pin; and A driving circuit is provided on the substrate, coupled to the at least one light-emitting element string, the first power input pin, and the second power input pin, and is configured to pass through the first power input pin and the second power input pin The power input pin receives an external power, and provides a driving power according to the external power to drive the at least one light-emitting element string, The drive circuit is a single chip integrated circuit. The vehicle light bulb device according to claim 1, wherein the substrate is one of a sapphire substrate, a quartz substrate, and a non-transparent ceramic substrate. The vehicle light bulb device according to claim 1, wherein the at least one light-emitting element string includes a plurality of light-emitting element strings coupled to each other in parallel, and the driving power source is a constant current power source. The vehicle light bulb device according to claim 1, wherein the driving circuit is further configured to: Sense the temperature of the substrate, Determine whether the temperature of the substrate is greater than a preset temperature, and When it is determined that the temperature of the substrate is greater than the preset temperature, the power of the driving power source is reduced. The vehicle light bulb device according to claim 1, wherein: The portion of the first power input pin is bent or bent multiple times to form a first elastic contact structure, and The part of the second power input pin is bent or bent multiple times to form a second elastic contact structure. The vehicle light bulb device according to claim 1, further comprising: A first connection pad and a second connection pad are respectively disposed on the substrate and respectively coupled to the driving circuit. The vehicle light bulb device according to claim 6, wherein: The first power input pin is directly connected to the first connection pad, and The second power input pin is directly connected to the second connection pad. The vehicle light bulb device according to claim 6, wherein: The first connection pad includes: A first conductive element extending from the first connection pad to the outside of the substrate, The second connecting pad includes: A second conductive element extending from the second connection pad to the outside of the substrate, The first power input pin is electrically connected to the first conductive member by electric welding, and The second power input pin is electrically connected to the second conductive element by electric welding. The vehicle light bulb device according to claim 6, wherein compared with the driving circuit, the setting area is farther from the first power input pin and the second power input pin. The vehicle light bulb device according to claim 6, wherein the driving circuit is farther away from the first power input pin and the second power input pin than the installation area. The vehicle light bulb device according to claim 1, wherein the area of the setting area is less than or equal to 50% of the area of the substrate. The vehicle light bulb device according to claim 1, wherein at least one of the at least one light-emitting element string and the driving circuit is covered by one of a fluorescent glue and a protective glue. In the vehicle light bulb device according to claim 12, the area covered by the phosphor is less than or equal to 90% of the area of the substrate.

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