KR102352411B1 - LED package for ramp of vehicle - Google Patents

Abstract

An LED package for a vehicle lamp is disclosed. PCB including an electric wiring layer; and an LED circuit unit including an LED chip, a Zener diode, a thermistor, and a resistor mounted on the electric wiring layer; and a connector having at least a first pin, a second pin, a third pin, and a fourth pin, wherein the first pin is connected to one end of each of the LED chip, the Zener diode, the thermistor, and the resistor, and the second pin is the resistor is connected to the other end of the , the third pin is connected to the other end of the thermistor, the fourth pin is connected to the other end of the LED chip and the Zener diode, and the first pin is a negative pole and is connected to the vehicle body to be used as a common ground, The PCB has a width of 16 mm to 18 mm and a height of 32 mm to 37 mm, and the LED chip is located in the center of the PCB in the width direction, and is located 8.5 to 10 mm apart from one edge in the height direction.

Description

LED package for ramp of vehicle

The present invention relates to an LED package, and more particularly, to an LED package for a vehicle lamp that can be applied to a headlamp of a vehicle.

In general, a lamp refers to a device for supplying or controlling light for a specific purpose, and may be mounted on a vehicle to serve as a backlight, a display device, a lighting lamp, a vehicle indicator lamp, or a head lamp.

Various exterior and interior lamps mounted on such vehicles use incandescent bulbs, fluorescent lamps, neons, and light emitting diodes (LEDs) as light sources.

Among them, LED is a device that converts an electric signal into infrared or light by using the characteristics of a compound semiconductor, and unlike fluorescent lamps, it does not use harmful substances such as mercury and thus causes less environmental pollution.

In addition, the lifespan of LED is longer than that of incandescent bulbs, fluorescent lamps, and neon lamps, and compared to incandescent bulbs, fluorescent lamps, and neon lamps, LEDs consume less power, and have excellent visibility and less glare due to their high color temperature. .

When a lamp is constructed using such an LED as a light source, the degree of freedom in the design of the lamp can be greatly improved, and the marketability of the lamp and the vehicle equipped with it can be greatly improved due to various advantages of LED such as long lifespan, eco-friendliness, and low power. In recent years, LEDs are being used as light sources for vehicle headlamps.

LEDs used as light sources for vehicle headlamps are usually manufactured in a chip form when there are a plurality of LEDs, and when mounted on a printed circuit board (PCB), light-emitting operation by receiving a current from the electrodes formed on the PCB is configured to

In general, a printed circuit board is manufactured by adding glass fiber to a phenol resin or an epoxy resin to make a board, and then forming electrodes and circuit patterns with a thin plate such as copper on the board.

However, since heat dissipation is an important factor in the case of a high-brightness LED, when a general epoxy substrate is used, the heat dissipation performance is greatly deteriorated, making it difficult to apply in practice.

Therefore, substrates made of metal such as copper or aluminum are mainly used for the high-brightness LED. Since the material of the metal substrate is a material that conducts electricity well, it is difficult to secure insulation between the metal substrate and the electric wiring. Accordingly, most of them are applied by coating an insulating layer made of epoxy or the like on the upper part of the metal substrate.

A product in which a printed circuit board, a chip-type LED, and various driving elements are combined as described above is usually called an LED package, and this LED package is modularized and can be applied to a vehicle headlamp, etc. It is preferable to be formed small for

The conventional LED package includes a connector that is connected to various LED driving devices (zener diode, thermistor, resistor) including the LED device and transmits a vehicle battery voltage to the LED device.

In the connector, each of the plurality of pins provided is connected to each of the various LED driving elements, and as they are connected to each of the various LED driving elements, the number of pins and the electrical wiring of the printed circuit board are unnecessarily increased, preventing the size reduction of the LED package. acting as a factor.

Accordingly, the present invention has been devised in consideration of the above circumstances, and is formed to be smaller than a conventional LED package by reducing the number of connector pins, so that when applied to a vehicle headlamp, the degree of design freedom of the vehicle headlamp can be increased. It aims to provide an LED package.

The LED package for a vehicle lamp according to an embodiment of the present invention for achieving the above object is a LED package for a vehicle lamp according to an embodiment of the present invention for achieving the above object, a PCB including an electric wiring layer; and an LED circuit unit including an LED chip, a Zener diode, a thermistor, and a resistor mounted on the electric wiring layer; and a connector having at least a first pin, a second pin, a third pin, and a fourth pin, wherein the first pin is connected to one end of each of the LED chip, the Zener diode, the thermistor, and the resistor, The second pin is connected to the other end of the resistor, the third pin is connected to the other end of the thermistor, the fourth pin is connected to the other end of the LED chip and the Zener diode, and the first pin is negative. As a pole, it is connected to the vehicle body and used as a common ground, and the PCB has a width of 16 mm to 18 mm and a height of 32 mm to 37 mm, and the LED chip is located in the center of the PCB in the width direction, and from one edge in the height direction. They are positioned 8.5 to 10 mm apart.

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The PCB includes a metal layer; and an insulating layer formed on the metal layer, wherein the electric wiring layer may be formed on the insulating layer.

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According to the LED package for a vehicle lamp according to an embodiment of the present invention, electrical wiring is simplified by reducing the number of connector pins, so that the size can be formed smaller than that of a conventional LED package.

In addition, since the size of the LED package may be smaller than that of the conventional LED package, it is possible to increase the design freedom of the vehicle headlamp when applied to the vehicle headlamp.

In addition, since the size is smaller than that of the conventional LED package and the electrical wiring is simplified due to a reduction in the number of pins of the connector, there is an effect of reducing the cost compared to the conventional LED package.

1 is a plan view of an LED package for a vehicle lamp according to an embodiment of the present invention.
2 is a schematic plan view for explaining the size of an LED package for a vehicle lamp according to an embodiment of the present invention.

In order to fully understand the present invention, the operational advantages of the present invention, and the objects achieved by the practice of the present invention, reference should be made to the accompanying drawings illustrating preferred embodiments of the present invention and the contents described in the accompanying drawings.

Hereinafter, the present invention will be described in detail by describing preferred embodiments of the present invention with reference to the accompanying drawings. However, the present invention may be implemented in several different forms, and is not limited to the described embodiments. In addition, in order to clearly explain the present invention, parts irrelevant to the description are omitted, and the same reference numerals in the drawings indicate the same members.

Throughout the specification, when a part “includes” a certain component, it does not exclude other components unless otherwise stated, but may further include other components.

Referring to FIG. 1 , the LED package 10 for a vehicle lamp according to an embodiment of the present invention may be applied to a vehicle headlamp in a modularized state, and in this case, a light emitting component used as a light source of the vehicle headlamp As such, it may include an LED circuit unit 100 , a connector 200 , and a printed circuit board (PCB 300).

The LED circuit unit 100 is an assembly of various elements necessary for converting a voltage received from a vehicle battery into light, and includes an LED chip 110 , a Zener diode 120 , a thermistor 130 , and a resistor 140 . ) and the like.

The LED chip 110 may be formed of a plurality of LED elements. The LED element constituting the LED chip 110 is a practical light emitting element that converts the voltage received from the vehicle battery into infrared rays or light. The LED chip 110 is preferably made of 4 or 5 LED elements.

In addition, the LED chip 110 may be of a detachable surface mount type, and in the event of damage or the like, it can be easily replaced with a new LED chip.

The Zener diode 120 is a constant voltage device connected to both ends of the LED chip 110 so that a constant voltage is applied to the LED chip 110 . The Zener diode 120 may protect the LED chip 110 from damage due to the excessive voltage by preventing an excessive voltage from being applied to the LED chip 110 .

The thermistor 130 is a resistance element provided to compensate for a change in characteristics of the LED element according to a change in temperature. The thermistor 130 is a resistor having a negative temperature coefficient whose resistance value decreases as the temperature increases. The thermistor 130 may compensate for a change in the characteristics of the LED device through these characteristics. The thermistor 130 may improve the accuracy of constant current control for the LED chip 110 by compensating for a change in characteristics of the LED device.

Unlike the thermistor 130 , the resistor 140 has a resistance value that does not change even with a change in temperature, and is provided for rank classification of the LED chip 110 . Here, when the LED chip 110 is modularized for lamp application, it is modularized with other LED chips of a similar rank as possible, and the resistor 140 has an appropriate resistance value to adjust the rank of the LED chip 110 .

The connector 200 is an electronic component that electrically connects the power source such as a vehicle battery and the aforementioned LED chip 110 , the Zener diode 120 , the thermistor 130 , and the resistor 140 .

The connector 200 has four pins, and each pin may be connected to at least one element of the LED chip 110 , the Zener diode 120 , the thermistor 130 , and the resistor 140 . Here, the connection with the LED chip 110 , the Zener diode 120 , the thermistor 130 , and the resistor 140 is possible through an electrical wiring formed on the PCB 300 .

The PCB 300 is a body portion of the LED package 10 on which the LED circuit unit 100 and the connector 200 are mounted, and may include a metal layer, an insulating layer, and an electrical wiring layer on which the above-described electrical wiring is formed.

The metal layer of the PCB 300 is located below the entire PCB 300 . The metal layer is preferably made of aluminum. As the conventional metal layer made of copper is changed to aluminum, there is an effect of reducing the cost compared to the conventional LED package 10 .

This metal layer can properly disperse heat generated when various elements of the LED circuit unit 100 are operated by the current flowing through the electrical wiring, and can prevent damage to the LED circuit unit 100 due to heat generation.

The insulating layer of the PCB 300 is formed on the metal layer, and is made of an insulating material such as epoxy. The insulating layer serves to insulate so that the current flowing through the electrical wiring does not flow to the metal layer when the current flows through the electrical wiring formed in the electrical wiring layer.

The electrical wiring layer of the PCB 300 is formed on the insulating layer. Electrical wiring for connecting various elements of the LED circuit unit 100 to the pins of the connector 200 may be formed in the electrical wiring layer.

The electrical wiring formed in the electrical wiring layer is when the LED circuit part 100 and the connector 200 are mounted, the first pin of the connector 200 and the LED chip 110 of the LED circuit part 100, the Zener diode 120, One end of the thermistor 130 and the resistor 140 may be connected to each other.

The electrical wiring may be formed such that the second pin of the connector 200 and the other end of the resistor 140 are connected. The electrical wiring may be formed such that the third pin of the connector 200 and the other end of the thermistor 130 are connected. The electrical wiring may be formed such that the fourth pin of the connector 200 is connected to the other end of the LED chip 110 and the Zener diode 120 .

Here, the first pin of the connector 200 is connected to the vehicle body and used as a common negative pole, that is, a common ground, and the second, third and fourth pins of the connector 200 are connected to the vehicle battery and the like and used as a positive pole. do.

Since most car bodies are utilized as a common negative pole (common ground), the voltage reference can be set to 0V, and accordingly, the LED chip 110, Zener diode 120, thermistor 130, and resistor 140 One can be tied to a common ground.

Through this, the pin of the connector can be made of four smaller than the conventional one, and the electrical wiring is simplified, and the size of the LED package 10 can be made smaller than that of the conventional LED package through the simplification of the electrical wiring.

Referring to FIG. 2 , the size of the LED package 10 according to an embodiment of the present invention can be confirmed.

The LED package 10 according to the embodiment of the present invention can be formed smaller than the conventional LED package through a reduction in the number of pins of the connector 200 and the simplification of electrical wiring as described above, and the area thereof is 16 to 16 in width. 18mm, it is preferable to be formed in a height of 32 to 37mm. Here, when the size of the LED package 10 is set as described above, it is possible to minimize the increase in thermal resistance due to the metal layer of the PCB 300 being made of aluminum, and to reduce the risk of damage to the PCB due to the increase in thermal resistance. can

The LED chip 110 is located in the center of the PCB 300 in the width direction, and is preferably located 8.5 to 10 mm apart from one edge in the height direction, through which the thermal resistance of the PCB 300 can be further minimized. .

Therefore, since the electrical wiring is simplified through the reduction of the number of pins of the connector 200, the size of the LED package can be smaller than that of the conventional LED package.

In addition, since the size can be formed smaller than that of the conventional LED package, when the LED package 10 according to an embodiment of the present invention is applied to a vehicle headlamp, there is an effect of increasing the design freedom of the vehicle headlamp.

Although the present invention has been described with reference to the embodiment shown in the drawings, which is merely exemplary, those skilled in the art will understand that various modifications and equivalent other embodiments are possible therefrom.

Accordingly, the true technical protection scope of the present invention should be determined by the technical spirit of the appended claims.

10: LED package
100: LED circuit unit
110: LED chip
120: zener diode
130: thermistor
140: resistance
200: connector
300: PCB

Claims (8)

PCB including an electric wiring layer; and
an LED circuit unit including an LED chip, a Zener diode, a thermistor, and a resistor mounted on the electric wiring layer; and
a connector having at least a first pin, a second pin, a third pin, and a fourth pin;
The first pin is connected to one end of each of the LED chip, the Zener diode, the thermistor and the resistor,
The second pin is connected to the other end of the resistor,
The third pin is connected to the other end of the thermistor,
The fourth pin is connected to the other end of the LED chip and the Zener diode,
The first pin is a negative pole, is connected to the vehicle body, and is used as a common ground,
The PCB has a width of 16mm to 18mm, and a height of 32mm to 37mm,
The LED chip is located in the center of the width direction of the PCB, and the LED package for a vehicle lamp, characterized in that it is spaced apart from one edge by 8.5 to 10 mm in the height direction. delete delete delete delete delete The method of claim 1,
The PCB is
metal layer; and
Further comprising an insulating layer formed on the metal layer,
The electric wiring layer is an LED package for a vehicle lamp, characterized in that formed on the insulating layer. delete

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