TWM600000U - Thick film resistor element - Google Patents

Abstract

The present creation provides a thick-film resistor element, which comprises a glass layer, a conductor layer and an electroplated layer to prevent water and sulfur gas penetrating into the resistor element and reacting with the resistor layer or electrode. In addition, due to the large-area conductor layer, the heat dissipation area of the resistor element can be increased to maintain its electrical functions.

Description

Thick film resistance element

This creation is about a thick film resistor element, especially a thick film resistor element that can prevent sulfur from entering and promote heat dissipation.

Generally, the silver electrode layer of the resistance element is covered with a plating layer. However, sulfur or moisture in the environment easily invades from the gap between the plating layer and the substrate, reacts with the silver electrode, and forms insulating silver sulfide (Ag ₂ S), resulting in an increase in resistance or failure.

In order to solve the above-mentioned problems, this creation provides a thick film resistor element to strengthen the coverage of the electrode layer and prevent the intrusion of sulfur gas/moisture gas. In this creation, a glass layer is arranged on the resistance layer between the electrodes, and then an electroplating layer is covered on the glass layer and the electrode layer to prevent the intrusion of sulfur or water vapor, and because the conductive layer covers the glass layer and the electrodes, the heat dissipation area can be increased . Therefore, the structure design of the thick film resistor element of this creation can avoid the invasion of sulfur and water vapor, and at the same time improve the heat dissipation performance to maintain the stability of the resistance value.

The embodiments of this creation will be described in detail below, and the drawings will be used as examples to enable readers to have a more complete understanding of this creation. The description herein can be widely implemented in other embodiments. Under the spirit of this creation, any easy substitutions, modifications, and equivalent changes of the embodiments should be included in the scope of this creation. The patent right of this creation should be defined based on the scope of the patent application. It is particularly important to note that the drawings are for illustrative purposes only, and do not represent the actual size or quantity of the components. Some details may not be completely drawn in order to keep the drawings concise.

Please refer to FIG. 1 for a schematic cross-sectional view of an embodiment of the thick film resistor element of the present invention. In this embodiment, the thick film resistance element includes a substrate 10, a resistance layer 11, a glass layer 13, two electrodes 12, a conductor layer 14, two electroplating layers 15, a protective layer 16, and two bottom conductor layers 17 .

The resistance layer 11 is provided on the upper surface of the substrate 10. The two ends of the substrate 10 are provided with electrode layers connected to the resistance layer to form two electrodes. A glass layer 13 is provided on the resistance layer between the two electrodes. The conductive layer 14 substantially covers the glass layer 13 and the two electrodes 12. The bottom surface of the substrate 10 is provided with two bottom conductor layers 17. The two ends of the resistance element are covered with electroplating layer 15, extending from the upper surface, through the side, to the lower surface, to seal the resistance layer 11, glass layer 13, two electrodes 12, conductor layer 14, bottom conductor layer 17 and substrate 10 On both sides, the conductor layer 14 is electrically connected to the two bottom conductor layers 17. Finally, the protective layer 16 is covered between the plating layers 15 at both ends of the upper surface of the resistance element.

The thick film resistor element of this creation is provided with a glass layer and a conductor layer between the electroplating layer and the electrode layer to effectively prevent the penetration of moisture or sulfur gas, and provide a large area of heat dissipation, reduce thermal effects, and maintain good electrical functions.

10: substrate 11: Resistance layer 12: Electrode 13: glass layer 14: Conductor layer 15: Plating layer 16: protective layer 17: bottom conductor layer

Figure 1 is a schematic cross-sectional view of this creative thick film resistor element.

10: substrate

11: Resistance layer

12: Electrode

13: glass layer

14: Conductor layer

15: Plating layer

16: protective layer

17: bottom conductor layer

Claims (2)

A thick film resistor element, including: A substrate; A resistance layer disposed on the upper surface of the substrate; A glass layer is arranged on the resistance layer, and two parts of the resistance layer are exposed at the corresponding two ends; An electrode layer covering the two parts of the resistance layer to form two electrodes; A conductor layer substantially covering the glass layer and the two electrodes; Two electroplating layers are provided at both ends of the substrate, covering the two electrodes, the conductor layer or the glass layer; and A protective layer covers the conductor layer between the two electroplating layers. The thick film resistor element according to claim 1, which further comprises two bottom conductor layers disposed on the lower surface of the substrate, and the two electroplating layers extend from the upper surface of the two ends of the substrate to the lower surface along the side surface of the substrate. Cover the two bottom conductor layers.

Images