TWM597028U - Circuit board and circuit board assembly - Google Patents
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Abstract
本新型係電路板組件,其包含一電路板、複數錫膏及複數導線。電路板包含一板體及複數導電片。板體的一側邊緣凹設有複數導線槽。導電片設於板體,且相鄰於該側邊緣,導電片的位置對應於導線槽。該等導線分別容置於該等導線槽中而被限制該等導線與該電路板的相對位置。該等導線分別連接該等錫膏而分別電性連接該等導電片。電路板邊緣的導線槽可直接限制導線的位置,因此無需使用線夾而可節省成本。並且免去使用線夾,使電子裝置可更貼近電路板,而有利於縮小產品體積。最後,本新型在加熱的過程中,導線槽也仍持續限位,因此無須設置理線治具。The novel type circuit board assembly includes a circuit board, plural solder pastes and plural wires. The circuit board includes a board body and a plurality of conductive sheets. A plurality of wire grooves are recessed on one edge of the board body. The conductive sheet is arranged on the board body and is adjacent to the side edge, and the position of the conductive sheet corresponds to the wire groove. The wires are respectively accommodated in the wire grooves to limit the relative positions of the wires and the circuit board. The wires are respectively connected to the solder pastes and electrically connected to the conductive sheets. The wire groove on the edge of the circuit board can directly limit the position of the wire, so there is no need to use a wire clip and cost savings. Moreover, the use of wire clips is eliminated, so that the electronic device can be closer to the circuit board, which is conducive to reducing the volume of the product. Finally, during the heating process of the present invention, the wire groove also continues to limit, so there is no need to install a wire management jig.
Description
本新型係涉及一種電路板以及進一步包含錫膏及導線的電路板組件。The present invention relates to a circuit board and a circuit board assembly further including solder paste and wires.
請參閱圖5至圖7所示,現有技術的電路板91與其他電子裝置92的導線93在進行熱壓熔錫焊接(Hot Bar)時,會使該等導線93的端部分別放置於電路板91的複數導電片911,而導電片911上會塗佈錫膏,之後再加熱(例如經過回焊爐)使錫膏融化以連接導線93,進而使導線93電性連接導電片911。Please refer to FIG. 5 to FIG. 7, when the
在前述過程中,為了能使導線93方便貼合到導電片911的位置,導線93往往會預折,接著再用線夾94固定該等導線93的間距,以使該等導線93的端部的間距大致等同導電片911彼此的間距。當該等導線93的端部分別貼合到導電片911上的錫膏後,先將線夾94卸除之後才進行加熱。In the foregoing process, in order to facilitate the bonding of the
然而使用線夾94的缺點在於,將導線93貼合到導電片911上的錫膏時,線夾94需與電路板91的邊緣保持一定距離(例如2mm),再加上線夾94本身有一定的寬度(例如3mm),如此造成電子裝置92與電路板91之間須保持一定的間距(至少5mm),而電子裝置92也因此無法更貼近電路板91,因此不利於縮小產品體積。However, the disadvantage of using the
除此之外,線夾94本身需要耗費一定的成本。並且線夾94雖然理論上可重複使用,但若電子裝置92為其他供應商所製造,則該電子裝置92出廠時,線夾94往往已經設置於導線93了,而線夾94取下後往往也不會再還給供應商,因此實際上線夾94為消耗品,不僅需耗費一定成本也不環保。In addition, the
另外,縱使有裝設線夾94,加熱之前也會將線夾94取下,因此在加熱的過程中,還是有可能動到該等導線93的位置,所以為了確保導線93的端部能保持位於導電片911,下方的底座上須設置理線治具來固定導線93的位置,而理線治具同樣也要一定的成本,設置理線治具也要一定的時間。In addition, even if the
因此現有技術的電路板,實有待加以改良。Therefore, the circuit board in the prior art needs to be improved.
有鑑於前述之現有技術的缺點及不足,本新型提供一種電路板及電路板組件,其有助於讓該等導線保持固定的間距,而無需使用線夾及理線治具。In view of the aforementioned shortcomings and deficiencies of the prior art, the present invention provides a circuit board and a circuit board assembly, which helps to keep the wires at a fixed distance without the use of wire clips and cable management jigs.
為達到上述的創作目的,本新型所採用的技術手段為設計一種電路板,其用以電性連接複數導線,該電路板包含一板體及複數導電片。該板體的一側邊緣凹設有複數導線槽,該等導線槽用以容置該等導線以限制該等導線的位置。該等導電片設於該板體,且相鄰於該板體凹設該等導線槽的該側邊緣,該等導電片的位置分別對應於該等導線槽的位置。該等導電片分別用以電性連接該等導線。In order to achieve the above-mentioned creative purpose, the technical means adopted by the present invention is to design a circuit board for electrically connecting a plurality of conductors. The circuit board includes a board body and a plurality of conductive sheets. A plurality of wire grooves are recessed on one edge of the board body, and the wire grooves are used to accommodate the wires to limit the positions of the wires. The conductive pieces are arranged on the plate body, and the side edges of the wire grooves are recessed adjacent to the plate body, and the positions of the conductive pieces correspond to the positions of the wire grooves, respectively. The conductive sheets are respectively used to electrically connect the wires.
為達到上述的創作目的,本新型進一步提供一種電路板組件,其中包含一電路板、複數錫膏及複數導線。該電路板包含一板體及複數導電片。該板體的一側邊緣凹設有複數導線槽。該等導電片設於該板體,且相鄰於該板體凹設該等導線槽的該側邊緣,該等導電片的位置分別對應於該等導線槽的位置。該等錫膏分別設於該等導電片。該等導線分別被容置於該電路板的該等導線槽中而被該等導線槽限制與該電路板的相對位置。該等導線透過該等錫膏而分別電性連接該等導電片。In order to achieve the above creation purpose, the present invention further provides a circuit board assembly, which includes a circuit board, a plurality of solder pastes and a plurality of wires. The circuit board includes a board body and a plurality of conductive sheets. A plurality of wire grooves are recessed on one edge of the board body. The conductive pieces are arranged on the plate body, and the side edges of the wire grooves are recessed adjacent to the plate body, and the positions of the conductive pieces correspond to the positions of the wire grooves, respectively. The solder pastes are respectively provided on the conductive sheets. The wires are respectively accommodated in the wire grooves of the circuit board and restricted by the wire grooves relative to the circuit board. The wires are electrically connected to the conductive sheets through the solder paste, respectively.
本新型的優點在於,藉由在電路板的板體的邊緣設置導線槽,因此導線可直接容置於導線槽內,以達到限制導線位置的理線作用。因此本新型無需使用線夾便可對導線進行限位,進而可省下線夾的成本同時也達到環保的目的。並且免去使用線夾,更可使電子裝置更貼近電路板,如此有利於縮小產品體積。最後,本新型在加熱的過程中,導線槽也仍持續的發揮限位的作用,因此無須設置現有技術的理線治具,而可省下一定的成本及設置理線治具的時間。本新型藉此達到縮小體積、降低成本及提高生產效率的創作目的。The advantage of the present invention lies in that, by providing a wire groove on the edge of the board body of the circuit board, the wire can be directly accommodated in the wire groove, so as to achieve the function of restricting the position of the wire. Therefore, the present invention can limit the wire without using a clamp, which can save the cost of the clamp and achieve the purpose of environmental protection. Moreover, the use of wire clips is eliminated, and the electronic device can be closer to the circuit board, which is conducive to reducing the volume of the product. Finally, during the heating process of the present invention, the wire groove also continues to play a limiting role, so there is no need to install the prior art cable management jig, and a certain cost and time for installing the cable management jig can be saved. The new model thus achieves the creative purpose of reducing volume, reducing cost and improving production efficiency.
進一步而言,各該導線槽與相對應的該導電片定義出一連線,該等導線槽與該等導電片定義出的該等連線相互平行。Further, each of the wire grooves and the corresponding conductive sheet define a line, and the wire grooves and the wires defined by the conductive plates are parallel to each other.
進一步而言,各該導線槽的寬度大於相對應的該導線的寬度。Further, the width of each wire groove is larger than the width of the corresponding wire.
進一步而言,各該導線槽的寬度介於1.5mm至9mm之間。Further, the width of each wire groove is between 1.5 mm and 9 mm.
進一步而言,各該導線槽的深度介於1mm至8.5mm之間。Further, the depth of each wire groove is between 1 mm and 8.5 mm.
以下配合圖式及本新型之較佳實施例,進一步闡述本新型為達成預定創作目的所採取的技術手段。In the following, with reference to the drawings and preferred embodiments of the present invention, the technical means adopted by the present invention to achieve the intended creative purpose will be further described.
請參閱圖1至圖3所示,本新型的電路板組件包含一電路板10、複數錫膏(圖中未示)及複數導線20。Please refer to FIGS. 1 to 3. The circuit board assembly of the present invention includes a
前述之電路板10用以電性連接導線20。電路板10包含一板體11及複數導電片12。板體11的一側邊緣111凹設有複數導線槽112,導線槽112用以容置導線20以限制導線20的位置。在本實施例中,導線槽112的寬度大於相對應的導線20的寬度,藉此達到限位的作用,但不以此為限,導線槽112的寬度亦可等於或略小於導線20的寬度,藉此可直接將導線20卡合於導線槽112中。The
請進一步參閱圖4所示,在本實施例中,導線槽112的寬度W介於1.5mm至9mm之間(包含1.5mm及9mm),而深度D介於1mm至8.5mm之間(包含1mm及8.5mm),但不以此為限。Please further refer to FIG. 4. In this embodiment, the width W of the
此外,在一較佳實施例中,當用於配合AWG(美國線規表) 1至AWG 18的導線20時,導線槽112的寬度W可在導線20的兩側各多預留0.5mm,導線槽112的深度D可在導線20的內側多預留0.5mm。以AWG 14的導線為例,其導線直徑約為1.628mm,因此導線槽112的寬度W較佳約為2.628mm,導線槽112的深度D較佳約為2.128mm。但此為一較佳實施例,而不以此為限。In addition, in a preferred embodiment, when used with the
前述之複數導電片12設於板體11,且分別用以電性連接導線20。導電片12相鄰於板體11凹設導線槽112的側邊緣111,且導電片12的位置分別對應於導線槽112的位置。例如在本實施例中,任兩相鄰導電片12的間距與相對應的兩導線槽112的間距相同,且較佳地,各導線槽112與相對應的導電片12定義出一連線L,而複數導線槽112與複數導電片12定義出的複數連線L相互平行等等,但不以此為限,導電片12的位置僅要讓導線20通過導線槽112後,方便讓導線20就近貼靠即可。The aforementioned plural
前述之複數錫膏分別設於導電片12。The aforementioned plural solder pastes are respectively provided on the
前述之複數導線20分別被容置於電路板10的導線槽112中而被導線槽112限制與電路板10的相對位置。導線20透過錫膏而分別電性連接導電片12。在本實施例中,導線20係以端部連接於錫膏及導電片12,但不以此為限,亦可視情況而讓導線20的其中一段連接於錫膏及導電片12,如此同樣可發揮理線的效果。The aforementioned plural
本新型用於熱壓熔錫焊接(Hot Bar)製程時,首先將電子裝置30的導線20預折,然後使導線20分別通過電路板10的導線槽112,接著使導線20貼靠於電路板10的導電片12上的錫膏。之後加熱使錫膏融化以連接導線20,進而使導線20電性連接導電片12,到此即完成組裝。When the new type is used in the hot-press soldering (Hot Bar) process, the
前述過程中,電路板10的板體11邊緣111的導線槽112便可限制導線20的位置,並且在加熱的過程中仍能持續維持限位作用。In the foregoing process, the
本新型較佳用於熱壓熔錫焊接(Hot Bar)的製程,但不以此為限,亦可用於其他製程。此外,本新型較佳用於連接複數導線20之情形,但亦可用於單一導線20之情形,換言之,本新型的電路板10的板體11也可以只有一個導線槽112,並且電路板10只有一個導電片12,如此同樣可以對導線20限位,以避免導線20於加熱過程中不慎更動到其位置。The present invention is preferably used in the process of hot-pressing soldering (Hot Bar), but it is not limited to this and can also be used in other processes. In addition, the present invention is preferably used in the case of connecting a plurality of
以上所述僅是本新型的較佳實施例而已,並非對本新型做任何形式上的限制,雖然本新型已以較佳實施例揭露如上,然而並非用以限定本新型,任何所屬技術領域中具有通常知識者,在不脫離本新型技術方案的範圍內,當可利用上述揭示的技術內容作出些許更動或修飾為等同變化的等效實施例,但凡是未脫離本新型技術方案的內容,依據本新型的技術實質對以上實施例所作的任何簡單修改、等同變化與修飾,均仍屬於本新型技術方案的範圍內。The above is only the preferred embodiment of the present invention, and does not limit the present invention in any form. Although the present invention has been disclosed in the preferred embodiment as above, it is not intended to limit the present invention. Generally, as long as the knowledge does not deviate from the scope of the new technical solution, the above disclosed technical content can be used to make some changes or modifications to equivalent embodiments of equivalent changes, but any content that does not deviate from the new technical solution, based on this Any simple modifications, equivalent changes and modifications made to the above embodiments by the new technical essence still fall within the scope of the new technical solution.
10:電路板 11:板體 111:邊緣 112:導線槽 12:導電片 20:導線 30:電子裝置 W:寬度 D:深度 L:連線 91:電路板 911:導電片 92:電子裝置 93:導線 94:線夾 10: Circuit board 11: Board body 111: edge 112: wire duct 12: conductive sheet 20: Wire 30: Electronic device W: width D: depth L: Connect 91: Circuit board 911: conductive sheet 92: Electronic device 93: Wire 94: wire clamp
圖1係本新型的電路板組件的俯視示意圖。 圖2係本新型的電路板組件的仰視示意圖。 圖3係本新型的電路板組件的側視剖面示意圖。 圖4係本新型的電路板的俯視示意圖。 圖5係現有技術的電路板組裝後的俯視示意圖。 圖6係現有技術的電路板組裝後的仰視示意圖。 圖7係現有技術的電路板組裝後的側視剖面示意圖。 FIG. 1 is a schematic top view of the circuit board assembly of the present invention. 2 is a schematic bottom view of the circuit board assembly of the present invention. FIG. 3 is a schematic side sectional view of the circuit board assembly of the present invention. 4 is a schematic top view of the circuit board of the present invention. 5 is a schematic top view of the prior art circuit board after assembly. 6 is a schematic bottom view of the prior art circuit board after assembly. 7 is a schematic cross-sectional side view of the prior art circuit board after assembly.
10:電路板 10: Circuit board
11:板體 11: Board body
112:導線槽 112: wire duct
12:導電片 12: conductive sheet
20:導線 20: Wire
30:電子裝置 30: Electronic device
Claims (11)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
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TW109202409U TWM597028U (en) | 2020-03-04 | 2020-03-04 | Circuit board and circuit board assembly |
CN202120283177.2U CN214256729U (en) | 2020-03-04 | 2021-02-01 | Circuit board and circuit board assembly |
Applications Claiming Priority (1)
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TW109202409U TWM597028U (en) | 2020-03-04 | 2020-03-04 | Circuit board and circuit board assembly |
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TWM597028U true TWM597028U (en) | 2020-06-11 |
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TW109202409U TWM597028U (en) | 2020-03-04 | 2020-03-04 | Circuit board and circuit board assembly |
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CN (1) | CN214256729U (en) |
TW (1) | TWM597028U (en) |
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2020
- 2020-03-04 TW TW109202409U patent/TWM597028U/en unknown
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