CN214256729U - Circuit board and circuit board assembly - Google Patents
Circuit board and circuit board assembly Download PDFInfo
- Publication number
- CN214256729U CN214256729U CN202120283177.2U CN202120283177U CN214256729U CN 214256729 U CN214256729 U CN 214256729U CN 202120283177 U CN202120283177 U CN 202120283177U CN 214256729 U CN214256729 U CN 214256729U
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- CN
- China
- Prior art keywords
- circuit board
- wire
- conducting
- plate body
- groove
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 229910000679 solder Inorganic materials 0.000 claims abstract description 23
- 238000010438 heat treatment Methods 0.000 abstract description 6
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 abstract description 4
- 238000000034 method Methods 0.000 abstract description 4
- 239000006071 cream Substances 0.000 abstract description 2
- 230000000694 effects Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 238000007731 hot pressing Methods 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 230000002349 favourable effect Effects 0.000 description 2
- 230000000670 limiting effect Effects 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 230000007613 environmental effect Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
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Abstract
The utility model provides a circuit board and circuit board assembly, circuit board assembly contain a circuit board, a plurality of tin cream and a plurality of wire. The circuit board comprises a board body and a plurality of conducting strips. A plurality of wire grooves are concavely arranged on one side edge of the plate body. The conducting strip is arranged on the plate body and is adjacent to the side edge, and the position of the conducting strip corresponds to the wire groove. The plurality of leads are respectively accommodated in the plurality of lead slots to limit the relative positions of the plurality of leads and the circuit board. The plurality of wires are respectively connected with the plurality of solder pastes and are respectively electrically connected with the plurality of conducting strips. The wire groove on the edge of the circuit board can directly limit the position of the wire, so that a wire clamp is not needed, and the cost can be saved. And the use of a wire clamp is omitted, so that the electronic device can be closer to the circuit board, and the product volume is favorably reduced. Finally, the utility model discloses at the in-process of heating, the metallic channel also lasts spacingly, consequently need not set up the reason line tool.
Description
Technical Field
The utility model relates to a circuit board and further contain circuit board assembly of tin cream and wire.
Background
Referring to fig. 5 to 7, when the conductive wires 93 of the circuit board 91 and the other electronic devices 92 are soldered by Hot-pressing and tin-melting (Hot Bar), the ends of the conductive wires 93 are respectively placed on the conductive sheets 911 of the circuit board 91, and the conductive sheets 911 are coated with solder paste, and then heated (e.g., by a reflow furnace) to melt the solder paste to connect the conductive wires 93, so that the conductive wires 93 are electrically connected to the conductive sheets 911.
In the foregoing process, in order to facilitate the wire 93 to be attached to the position of the conductive sheet 911, the wire 93 is usually pre-folded, and then the wire clamp 94 is used to fix the distance between the wires 93, so that the distance between the ends of the wires 93 is approximately equal to the distance between the conductive sheets 911. After the ends of the plurality of wires 93 are respectively attached to the solder paste on the conductive sheet 911, the clip 94 is removed and then heated.
However, the use of the clip 94 has the disadvantage that when the lead 93 is attached to the solder paste on the conductive sheet 911, the clip 94 needs to be kept at a certain distance (e.g. 2mm) from the edge of the circuit board 91, and the width of the clip 94 itself (e.g. 3mm), so that a certain distance (at least 5mm) must be kept between the electronic device 92 and the circuit board 91, and the electronic device 92 cannot be closer to the circuit board 91, which is not favorable for reducing the volume of the product.
In addition, the wire clamp 94 itself requires a certain cost. Although the wire clamp 94 can be reused theoretically, if the electronic device 92 is manufactured by other suppliers, the wire clamp 94 is often already arranged on the conducting wire 93 when the electronic device 92 leaves a factory, and the wire clamp 94 is not returned to the supplier after being removed, so that the wire clamp 94 is a consumable product in practice, and not only is certain cost consumed, but also the wire clamp is not environment-friendly.
In addition, even if the wire clamp 94 is installed, the wire clamp 94 is removed before heating, so that the position of the plurality of wires 93 may be moved during heating, and therefore, in order to ensure that the end of the wire 93 can be kept at the conductive sheet 911, a wire arranging jig needs to be arranged on the lower base to fix the position of the wire 93, and the wire arranging jig also needs to be arranged for a certain time and at a certain cost.
Therefore, the circuit board in the prior art needs to be improved.
SUMMERY OF THE UTILITY MODEL
In view of the foregoing disadvantages and shortcomings of the prior art, it is an object of the present invention to provide a circuit board and a circuit board assembly that can help keep a plurality of wires at a fixed distance without using a wire clamp and a wire arranging jig.
In order to achieve the above-mentioned creation purpose, the present invention provides a circuit board for electrically connecting a plurality of wires, wherein the circuit board comprises a board body and a plurality of conductive strips. The plate body is provided with a plurality of concave lead grooves at one side edge, and the lead grooves are used for accommodating a plurality of leads so as to limit the positions of the leads. The conducting strips are arranged on the plate body, a plurality of conducting grooves are concavely arranged adjacent to the side edge of the plate body, and the positions of the conducting strips correspond to the positions of the conducting grooves respectively. The conducting strips are respectively used for electrically connecting the conducting wires.
In order to achieve the above-mentioned creation purpose, the present invention further provides a circuit board assembly, which comprises a circuit board, a plurality of solder pastes and a plurality of wires. The circuit board comprises a board body and a plurality of conducting strips. A plurality of wire grooves are concavely arranged on one side edge of the plate body. The conducting strips are arranged on the plate body, a plurality of conducting grooves are concavely arranged adjacent to the side edge of the plate body, and the positions of the conducting strips correspond to the positions of the conducting grooves respectively. The plurality of solder pastes are respectively arranged on the plurality of conducting strips. The plurality of leads are respectively accommodated in the plurality of lead slots of the circuit board and are limited by the plurality of lead slots to be in relative positions with the circuit board. The plurality of wires are respectively and electrically connected with the plurality of conducting strips through the plurality of solder pastes.
To achieve the above-mentioned creation purpose, the present invention further provides a circuit board assembly, which comprises a circuit board, a solder paste and a wire. The circuit board comprises a board body and a conducting strip, wherein a wire groove is concavely arranged on one side edge of the board body; a conducting strip is arranged on the plate body, is adjacent to the side edge of the wire groove concavely arranged on the plate body, and corresponds to the wire groove in position; a solder paste arranged on the conductive sheet; a wire is accommodated in the wire groove of the circuit board and is limited by the wire groove in relative position with the circuit board, and the wire is electrically connected with the conducting strip through the solder paste.
Furthermore, each wire groove and the corresponding conductive sheet define a connection line, and the plurality of wire grooves and the plurality of connection lines defined by the plurality of conductive sheets are parallel to each other.
Further, the width of each wire groove is larger than the width of the corresponding wire.
Further, the width of each wire groove is between 1.5mm and 9 mm.
Further, the depth of each wire groove is between 1mm and 8.5 mm.
The utility model has the advantages of, set up the metallic channel through the edge at the plate body of circuit board, consequently the wire can directly hold in the metallic channel to reach the reason line effect of restriction wire position. Therefore the utility model discloses need not to use the fastener alright carry on spacingly to the wire, and then the cost that can save the fastener also reaches the purpose of environmental protection simultaneously. And remove from using the fastener, more can make electron device more press close to the circuit board, so be favorable to reducing the product volume. Finally, the utility model discloses at the in-process of heating, the wire casing also still plays spacing effect of continuous performance, consequently need not set up prior art's reason line tool, and can save certain cost and set up the time of reason line tool. The utility model discloses reach from this and reduce volume, reduce cost and improve production efficiency's utility model purpose.
Drawings
Fig. 1 is a schematic top view of the circuit board assembly of the present invention.
Fig. 2 is a schematic bottom view of the circuit board assembly of the present invention.
Fig. 3 is a schematic side view of the circuit board assembly of the present invention.
Fig. 4 is a schematic top view of the circuit board according to the present invention.
Fig. 5 is a schematic top view of a circuit board of the prior art after assembly.
Fig. 6 is a bottom view of the assembled circuit board of the prior art.
Fig. 7 is a side sectional view of the assembled circuit board of the prior art.
The reference numbers are as follows:
10: circuit board
11: plate body
111: edge
112, lead groove
12 conductive sheet
20: conducting wire
30 electronic device
W is width
D is depth
L is a connecting line
91 circuit board
911 conductive plate
92 electronic device
93 conducting wire
94: wire clamp
Detailed Description
The following describes the technical means of the present invention to achieve the predetermined creation purpose with reference to the accompanying drawings and the preferred embodiments of the present invention.
Referring to fig. 1 to 3, the circuit board assembly of the present invention includes a circuit board 10, a plurality of solder pastes (not shown) and a plurality of wires 20.
The circuit board 10 is electrically connected to the conductive wires 20. The circuit board 10 includes a board body 11 and a plurality of conductive sheets 12. A plurality of wire slots 112 are recessed from a side edge 111 of the board 11, and the wire slots 112 are used for accommodating the wires 20 to limit the positions of the wires 20. In the present embodiment, the width of the wire groove 112 is greater than the width of the corresponding wire 20, so as to achieve the limiting effect, but not limited to this, the width of the wire groove 112 may also be equal to or slightly less than the width of the wire 20, so that the wire 20 can be directly clamped in the wire groove 112.
As further shown in fig. 4, in the present embodiment, the width W of the wire groove 112 is between 1.5mm and 9mm (including 1.5mm and 9mm), and the depth D is between 1mm and 8.5mm (including 1mm and 8.5mm), but not limited thereto.
In addition, in a preferred embodiment, when used to fit wires 20 of AWGs (American wire gauge) 1-18, the width W of the wire groove 112 may be reserved 0.5mm more on each side of the wire 20, and the depth D of the wire groove 112 may be reserved 0.5mm more on the inner side of the wire 20. Taking the example of AWG 14, the diameter of the wire is about 1.628mm, so the width W of the wire groove 112 is preferably about 2.628mm, and the depth D of the wire groove 112 is preferably about 2.128 mm. However, this is a preferred embodiment and not a limitation.
The conductive sheets 12 are disposed on the board 11 and electrically connected to the wires 20 respectively. The conductive sheet 12 is adjacent to the side edge 111 of the concave wire groove 112 of the board body 11, and the positions of the conductive sheet 12 respectively correspond to the positions of the wire groove 112. For example, in the present embodiment, the distance between any two adjacent conductive sheets 12 is the same as the distance between two corresponding conductive slots 112, and preferably, each conductive slot 112 and the corresponding conductive sheet 12 define a connection line L, and the connection lines L defined by the conductive slots 112 and the conductive sheets 12 are parallel to each other, but not limited thereto, the position of the conductive sheet 12 only needs to allow the wires 20 to pass through the conductive slots 112, so as to facilitate the wires 20 to be closely attached.
The plurality of solder pastes are respectively disposed on the conductive sheet 12.
The plurality of wires 20 are respectively accommodated in the wire grooves 112 of the circuit board 10, and the relative position of the wires 20 to the circuit board 10 is limited by the wire grooves 112. The wires 20 are electrically connected to the conductive sheets 12 by solder paste, respectively. In the present embodiment, the end of the wire 20 is connected to the solder paste and the conductive sheet 12, but not limited thereto, and one section of the wire 20 may be connected to the solder paste and the conductive sheet 12 as appropriate, so as to exert the wire-arranging effect.
The utility model is used for during Hot pressing molten tin welding (Hot Bar) technology, at first with the wire 20 preflex of electron device 30, then make wire 20 respectively through the metallic channel 112 of circuit board 10, make wire 20 paste the solder paste that leans on the conducting strip 12 of circuit board 10 after that. The solder paste is then heated to melt the solder paste to connect the wires 20, and the wires 20 are electrically connected to the conductive sheet 12, thereby completing the assembly.
In the above process, the position of the lead 20 can be limited by the lead groove 112 on the edge 111 of the board body 11 of the circuit board 10, and the limiting effect can be maintained continuously during the heating process.
The utility model discloses the preferred is used for Hot pressing molten tin welding (Hot Bar) technology, but does not regard this as the limit, also can be used to other technologies. In addition, the present invention is preferably used for connecting a plurality of wires 20, but can also be used for connecting a single wire 20, in other words, the board body 11 of the circuit board 10 of the present invention can also have only one wire groove 112, and the circuit board 10 has only one conductive sheet 12, so that the wire 20 can be limited, so as to avoid the wire 20 from carelessly moving to its position in the heating process.
The above description is only a preferred embodiment of the present invention, and is not intended to limit the present invention in any way, and although the present invention has been disclosed in the above description with reference to the preferred embodiments, it is not intended to limit the present invention, and those skilled in the art can make some changes or modifications to equivalent embodiments without departing from the scope of the present invention, but all the simple modifications, equivalent changes and modifications made to the above embodiments by the technical spirit of the present invention are within the scope of the present invention.
Claims (11)
1. A circuit board for electrically connecting a plurality of wires, the circuit board comprising
A plurality of lead slots are concavely arranged on one side edge of the plate body, and the plurality of lead slots are used for accommodating a plurality of leads so as to limit the positions of the leads; and
the conducting strips are arranged on the plate body, a plurality of conducting strips are concavely arranged adjacent to the side edge of the wire groove of the plate body, the positions of the conducting strips respectively correspond to the positions of the wire grooves, and the conducting strips are respectively used for electrically connecting the wires.
2. The circuit board of claim 1, wherein each of the wire grooves and the corresponding conductive sheet define a connection line, and a plurality of the wire grooves and a plurality of the connection lines defined by a plurality of the conductive sheets are parallel to each other.
3. The circuit board of claim 1 or 2, wherein the width of each wire groove is between 1.5mm and 9 mm.
4. The circuit board of claim 1 or 2, wherein the depth of each wire groove is between 1mm and 8.5 mm.
5. A circuit board for electrically connecting a wire, the circuit board comprising
A plate body, one side edge of which is concavely provided with a wire groove used for accommodating the wire to limit the position of the wire; and
the conducting strip is arranged on the plate body, is adjacent to the side edge of the concave conducting wire groove of the plate body, corresponds to the conducting wire groove, and is used for electrically connecting the conducting wire.
6. A circuit board assembly, comprising
A circuit board comprising
A plate body, one side edge of which is concavely provided with a plurality of wire grooves; and
the conducting strips are arranged on the plate body, the side edges of the conducting slots are concavely arranged adjacent to the plate body, and the positions of the conducting strips respectively correspond to the positions of the conducting slots;
a plurality of solder pastes respectively arranged on the plurality of conductive sheets; and
the conducting wires are respectively accommodated in the conducting wire grooves of the circuit board and are limited by the conducting wire grooves in relative positions with the circuit board, and the conducting wires are respectively and electrically connected with the conducting strips through the solder pastes.
7. The circuit board assembly of claim 6, wherein each of the wire grooves and the corresponding conductive sheet define a connection line, and a plurality of the wire grooves and a plurality of the connection lines defined by a plurality of the conductive sheets are parallel to each other.
8. A circuit board assembly according to claim 6 or 7, wherein the width of each wire guide slot is greater than the width of the corresponding wire.
9. A circuit board assembly according to claim 6 or 7, wherein the width of each wire guide slot is between 1.5mm and 9 mm.
10. A circuit board assembly according to claim 6 or 7, wherein the depth of each wire guide groove is between 1mm and 8.5 mm.
11. A circuit board assembly, comprising
A circuit board comprising
A plate body, one side edge of which is concavely provided with a wire groove; and
the conducting plate is arranged on the plate body, is adjacent to the side edge of the concave conducting wire groove of the plate body, and corresponds to the conducting wire groove;
a solder paste disposed on the conductive sheet; and
and the lead is accommodated in the lead groove of the circuit board and is limited by the lead groove to be in relative position with the circuit board, and the lead is electrically connected with the conducting strip through the solder paste.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW109202409 | 2020-03-04 | ||
| TW109202409U TWM597028U (en) | 2020-03-04 | 2020-03-04 | Circuit board and circuit board assembly |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN214256729U true CN214256729U (en) | 2021-09-21 |
Family
ID=72176747
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202120283177.2U Active CN214256729U (en) | 2020-03-04 | 2021-02-01 | Circuit board and circuit board assembly |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN214256729U (en) |
| TW (1) | TWM597028U (en) |
-
2020
- 2020-03-04 TW TW109202409U patent/TWM597028U/en unknown
-
2021
- 2021-02-01 CN CN202120283177.2U patent/CN214256729U/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| TWM597028U (en) | 2020-06-11 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |