TWM591103U - Water seal conductive clamp - Google Patents
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- TWM591103U TWM591103U TW108215417U TW108215417U TWM591103U TW M591103 U TWM591103 U TW M591103U TW 108215417 U TW108215417 U TW 108215417U TW 108215417 U TW108215417 U TW 108215417U TW M591103 U TWM591103 U TW M591103U
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Abstract
Description
本新型創作是有關於一種加工處理設備,且特別是有關於一種水封導電夾。This new creation is about a processing equipment, and especially about a water-sealed conductive clip.
在印刷電路板(PCB)或其他相關產業中,電鍍技術的發展隨著用戶的需求不斷地演變,特別是對於製作產品的品質及其產量,往往無法兼顧。In the printed circuit board (PCB) or other related industries, the development of electroplating technology continues to evolve with the needs of users, especially for the quality of manufactured products and their output, often unable to take into account.
以PCB製程的電鍍方面而言,由於需求的工件(即,產品標的物)的夾點接觸面積愈大愈好,所以目前的方式是增加被鍍物的夾持面積,又要有良好的電鍍液阻隔效果,造成產品標的物的邊線材料浪費。目前在實際量產下發現若夾臂進入電鍍液後,若電鍍液進入接觸到凸塊,會導致凸塊也會或多或少鍍上殘銅,造成品質不好,當到達一定程度後,則必須透過人工方式以化學液清洗(反電鍍方式)將殘銅去除,除增加污染外也會增加成本。In terms of the electroplating of the PCB process, as the required contact area of the workpiece (that is, the product target) is as large as possible, the current method is to increase the clamping area of the object to be plated, and to have good plating The liquid barrier effect causes waste of the edge material of the product target. Under actual mass production, it is found that if the clamping arm enters the plating solution, if the plating solution comes into contact with the bumps, it will cause the bumps to be more or less plated with residual copper, resulting in poor quality. When it reaches a certain level, It must be manually removed by chemical liquid cleaning (reverse plating) to remove residual copper, in addition to increasing pollution will also increase costs.
除了電鍍技術之外,凡是需要導電夾的設備,也都會遭遇上述技術問題。In addition to electroplating technology, all equipment that requires conductive clips will also encounter the above-mentioned technical problems.
本新型創作提供一種水封導電夾,除減少產品標的物的邊線材料浪費外,還能避免或降低污染的增加以及成本的增加。The novel creation provides a water-sealed conductive clip, which can avoid or reduce the increase of pollution and the increase of cost, in addition to reducing the waste of the edge material of the product target.
本新型創作的水封導電夾,至少包括第一夾臂、第二夾臂、第一軟質密封件、第二軟質密封件、液體供應組件以及數個硬質保護套。第一與第二夾臂的相向側面分別具有夾面位置相對應的第一與第二凸塊。而且,第一夾臂還具有設置於第一凸塊上方貫穿第一夾臂的一開孔。所述第一夾臂夾持一工件時,所述第一凸塊與所述工件的接觸面積小於所述第一凸塊的夾面。所述第二夾臂夾持所述工件時,所述第二凸塊與所述工件的接觸面積小於所述第二凸塊的所述夾面。液體供應組件連通至第一夾臂中的所述開孔,以往第一夾臂與第二夾臂之間的空間輸液。第一軟質密封件具有位置與第一凸塊與所述開孔相符的第一開口以及分別位於第一開口兩側的數個第一閒置開口,其中所述第一開口包覆所述第一凸塊的周緣並連通所述開孔,且每個所述第一閒置開口是設置在所述第一凸塊的側面。第二軟質密封件具有位置與第二凸塊相符的第二開口以及分別位於第二開口兩側的數個第二閒置開口,其中所述第二開口包覆所述第二凸塊的周緣,且每個所述第二閒置開口是設置在所述第二凸塊的側面。硬質保護套則包覆第一與第二夾臂的表面。The water-sealed conductive clip created by the novel includes at least a first clip arm, a second clip arm, a first soft seal, a second soft seal, a liquid supply assembly, and several hard protective sleeves. The opposite side surfaces of the first and second clamping arms respectively have first and second protrusions corresponding to the positions of the clamping surfaces. Moreover, the first clamp arm also has an opening disposed above the first protrusion and penetrating the first clamp arm. When the first clamping arm clamps a workpiece, the contact area between the first projection and the workpiece is smaller than the clamping surface of the first projection. When the second clamping arm clamps the workpiece, the contact area of the second projection and the workpiece is smaller than the clamping surface of the second projection. The liquid supply assembly communicates with the opening in the first clamp arm, and in the past, the space between the first clamp arm and the second clamp arm was used to deliver liquid. The first soft seal has a first opening with a position corresponding to the first bump and the opening, and a plurality of first idle openings on both sides of the first opening, wherein the first opening covers the first The periphery of the bump communicates with the opening, and each of the first idle openings is disposed on the side of the first bump. The second soft seal has a second opening with a position corresponding to the second protrusion and a plurality of second idle openings respectively located on both sides of the second opening, wherein the second opening covers the periphery of the second protrusion, And each of the second idle openings is disposed on the side of the second bump. The hard protective sleeve covers the surfaces of the first and second clamping arms.
在本新型創作的一實施例中,上述液體供應組件包括一液體儲存槽與一液體管路。液體儲存槽設置於第一夾臂的另一側面,且所述液體儲存槽與第一夾臂的開孔連通,並具有一開口部。液體管路則與所述開口部相接。In an embodiment of the invention, the liquid supply assembly includes a liquid storage tank and a liquid pipeline. The liquid storage tank is disposed on the other side of the first clamp arm, and the liquid storage tank communicates with the opening of the first clamp arm and has an opening. The liquid line is connected to the opening.
在本新型創作的一實施例中,上述液體供應組件可只包括與第一夾臂的開孔相接的一液體管路。In an embodiment of the invention, the liquid supply assembly may only include a liquid line connected to the opening of the first clamp arm.
在本新型創作的一實施例中,上述液體例如水。In an embodiment of the invention, the liquid is water.
在本新型創作的一實施例中,上述第一凸塊的所述夾面的寬度大於所述第一夾臂的寬度的一半以上。In an embodiment of the invention, the width of the clamping surface of the first bump is greater than half of the width of the first clamping arm.
在本新型創作的一實施例中,上述第二凸塊的所述夾面的寬度大於所述第二夾臂的寬度的一半以上。In an embodiment of the invention, the width of the clamping surface of the second protrusion is greater than half of the width of the second clamping arm.
在本新型創作的一實施例中,上述第一夾臂設有所述第一凸塊的部位的寬度大於其餘部位的寬度。In an embodiment of the present invention, the width of the portion where the first protrusion is provided on the first clip arm is greater than the width of the remaining portions.
在本新型創作的一實施例中,上述第二夾臂設有所述第二凸塊的部位的寬度大於其餘部位的寬度。In an embodiment of the present invention, the width of the portion where the second protrusion is provided on the second clip arm is greater than the width of the remaining portions.
在本新型創作的一實施例中,上述第一凸塊與所述工件的接觸面積等於或小於所述第一凸塊的所述夾面的一半、1/3或2/3。In an embodiment of the invention, the contact area between the first bump and the workpiece is equal to or less than half, 1/3, or 2/3 of the clamping surface of the first bump.
在本新型創作的一實施例中,上述第二凸塊與所述工件的接觸面積等於或小於所述第二凸塊的所述夾面的一半、1/3或2/3。In an embodiment of the invention, the contact area between the second bump and the workpiece is equal to or less than half, 1/3, or 2/3 of the clamping surface of the second bump.
在本新型創作的一實施例中,上述第一閒置開口的數目在2以上。In an embodiment of the invention, the number of the first idle openings is more than 2.
在本新型創作的一實施例中,上述第二閒置開口的數目在2以上。In an embodiment of the invention, the number of the second idle openings is more than 2.
基於上述,本新型創作藉由特定結構設計的密封構件搭配液體供應組件,能在被鍍物不像過去需要完全夾貼凸塊的情況下,即使凸塊上半部沒有夾被鍍物,仍舊能藉由軟質密封件上方以設計不對稱的方式,使軟質密封件上方的部分能夠緊密貼合,並且藉由液體供應組件在整個處理期間往凸塊上半部無被鍍物的空間輸送液體,使得該處空間內的壓力等於或略大於外界壓力,因此能阻隔藥液或其他處理溶液由上方或者側面滲漏到作為電極的凸塊夾面,導致凸塊也會鍍上殘銅影響品質,甚至須透過人工方式以化學液清洗(反電鍍方式)將殘銅去除等增加污染與成本的問題。而且,軟質密封件(如橡膠)也可能會鍍上殘銅,所以在凸塊兩側設計的的閒置開口,能提供數個軟質空間,讓滲入的導電液不會直接滲進導電的凸塊,除保護凸塊外,也可以保護凸塊內圈的軟質部分。Based on the above, this new creation uses a sealing structure with a specific structural design and a liquid supply assembly to enable the object to be plated to be completely sandwiched with the bump, unlike the past, even if there is no object to be plated on the upper half of the bump The upper part of the soft seal can be closely matched by the asymmetric design of the upper part of the soft seal, and the liquid supply assembly can transport the liquid to the space where there is no object to be plated on the upper half of the bump during the entire process , So that the pressure in the space is equal to or slightly greater than the external pressure, so it can block the leakage of the chemical solution or other processing solution from the top or side to the bump clamping surface as the electrode, resulting in the bumps also coated with residual copper to affect the quality It is even necessary to manually remove the residual copper by chemical liquid cleaning (reverse plating) to increase the problem of pollution and cost. Moreover, soft seals (such as rubber) may also be coated with residual copper, so the idle openings designed on both sides of the bump can provide several soft spaces so that the infiltrating conductive liquid will not directly penetrate into the conductive bump In addition to protecting the bumps, the soft parts of the inner ring of the bumps can also be protected.
為讓本新型創作的上述特徵和優點能更明顯易懂,下文特舉實施例,並配合所附圖式作詳細說明如下。In order to make the above-mentioned features and advantages of the creation of the new model more obvious and understandable, the embodiments are specifically described below and described in detail in conjunction with the accompanying drawings.
以下揭示內容提供許多不同的實施方式或範例,用於實施本新型創作的不同特徵。當然這些實施例僅為範例,並非用於限制本新型創作的範圍與應用。再者,為了清楚起見,各個構件、膜層或區域的相對厚度及位置可能縮小或放大。另外,在各圖式中使用相似或相同的元件符號來標示相似或相同元件或特徵,且圖式中如有與前一圖相同的元件符號,則將省略其贅述。The following disclosure provides many different implementations or examples for implementing different features of the novel creation. Of course, these embodiments are only examples, and are not intended to limit the scope and application of the novel creation. Furthermore, for the sake of clarity, the relative thicknesses and positions of various components, films, or regions may be reduced or enlarged. In addition, similar or identical element symbols are used in each drawing to indicate similar or identical elements or features, and if the same element symbol in the drawings is the same as the previous figure, its redundant description will be omitted.
圖1是依照本新型創作的第一實施例的一種水封導電夾打開時的立體示意圖。FIG. 1 is a schematic perspective view of a water-sealed conductive clip according to a first embodiment of the invention.
請參照圖1,實施例中的水封導電夾100至少包括第一夾臂102、第二夾臂104、第一軟質密封件106、第二軟質密封件108、硬質保護套110與液體供應組件112。文中的「軟質」與「硬質」是相對性用語;詳細來說,軟質是可變形的材料、硬質是不可變形的材料或者變形量比軟質低的材料。Referring to FIG. 1, the water-sealed
關於第一夾臂102的詳細構造請參照圖2與圖3,圖2是圖1之第一夾臂102的部分放大圖,圖3是圖2的縱向半切示意圖。Please refer to FIGS. 2 and 3 for the detailed structure of the
請參照圖2和圖3,第一夾臂102的一側面102a具有一個第一凸塊114,第一凸塊114具有夾面114a以及側面114b,其中夾面114a是指夾持工件(未繪示)的表面,且第一凸塊114是第一夾臂102的一部分,所以其材料與第一夾臂102相同,例如不銹鋼或其他導電材料。第一夾臂102於第一凸塊114上方還有一個貫穿第一夾臂102的開孔116。液體供應組件112則連通至第一夾臂102中的開孔116,以往第一夾臂102與第二夾臂之間的空間輸送液體,所述液體例如水或其他不會腐蝕第一夾臂102(與第一凸塊114)的液體。在本實施例中,液體供應組件112可包含一液體儲存槽118與一液體管路(未繪示),其中液體儲存槽118是形成於第一夾臂102的另一側面102b,且液體儲存槽118與開孔116連通,並具有一開口部(圖1的118a),其餘詳細構造將於下文描述。然而,本新型創作並不限於此,凡是能往第一夾臂102與第二夾臂之間的空間輸送液體的結構均可作為液體供應組件112。而第一軟質密封件106具有位置與第一凸塊114與開孔116相符的第一開口106a以及分別位於所述第一開口106a兩側的第一閒置開口106b,其中第一開口106a包覆第一凸塊114的周緣並連通所述開孔116,且每個第一閒置開口106b是設置在第一凸塊114的側面114b,用以防止藥液或其他處理溶液由側面直接滲進導電的第一凸塊114,除保護第一凸塊114外,也可以保護第一開口106a部位的軟質部分。在本實施例中,第一閒置開口106b的數目是2個,但是本新型創作並不限於此,第一閒置開口106b的數目也可以是2以上,譬如在第一開口106a兩側分別有2個第一閒置開口106b,所以總共有4個第一閒置開口106b,依此類推。2 and 3, a
第一凸塊114的夾面114a稍微內縮於第一開口106a內,以利水封導電夾100夾持工件時,第一與第二軟質密封件106和108能緊密地封住第一凸塊114與第二凸塊。同時,第一閒置開口106b有空間可以容置滲入的藥液或其他處理溶液。於本實施例中,硬質保護套110是包覆第一夾臂102接近第一凸塊114的表面,但本新型創作並不限於此,硬質保護套110也可以一直延伸至圖1的第一與第二夾臂102和104的上半部。而且,硬質保護套110還可一體地包覆第一夾臂102與液體供應組件112的液體儲存槽118,以全面地保護前述結構。The
雖然圖2和圖3是第一夾臂102,但應知第二夾臂104的結構基本上與第一夾臂102相對應,但並不包含開孔116與液體供應組件112,請見圖4。譬如第二夾臂104與第一夾臂102相向的側面104a具有一個第二凸塊120,第二凸塊120具有夾面120a以及側面120b,且第二凸塊120的夾面120a位置對應第一凸塊114的夾面114a位置,第二凸塊120是第二夾臂104的一部分,所以其材料與第二夾臂104相同,例如不銹鋼或其他導電材料。第二軟質密封件108同樣具有位置與第二凸塊120相符的第二開口108a以及分別位於第二開口108a兩側的第二閒置開口(未繪示),其中第二開口108a包覆第二凸塊120的周緣,且每個第二閒置開口是設置在第二凸塊120的側面,用以防止藥液或其他處理溶液由側面直接滲進導電的第二凸塊120,除保護第二凸塊120外,也可以保護第二開口108a部位的軟質部分。同樣地,第二閒置開口的數目是2個,但是本新型創作並不限於此,第二閒置開口的數目也可以是2以上,譬如在第二開口108a兩側分別有2個第二閒置開口,所以總共有4個第二閒置開口,依此類推。而硬質保護套110則包覆第一與第二夾臂102和104的表面。Although FIGS. 2 and 3 are the
在本實施例中,第一與第二夾臂102和104在夾持工件122時,工件122(被鍍物)不像過去需要完全夾貼第一與第二凸塊114與120(例如第一凸塊114與工件122的接觸面積小於第一凸塊114的夾面114a、第二凸塊120與工件122的接觸面積小於第二凸塊120的夾面120a),所以第一與第二凸塊114與120上半部是沒有夾工件122的。舉例來說,第一凸塊114與工件122的接觸面積可等於或小於第一凸塊114的夾面114a的一半、1/3或2/3,但本新型創作不限於此。同樣地,第二凸塊120與工件122的接觸面積例如等於或小於第二凸塊120的夾面120a的一半、1/3或2/3,但本新型創作不限於此。一旦工件122被夾持,第一與第二夾臂102和104下方與工件122接觸的部分(即第一與第二凸塊114/120)會緊密貼合於工件122,第一與第二凸塊114/120上方的第一與第二軟質密封件106/108則會彼此貼合並將工件120上緣封住,呈現不對稱的樣貌。依過去的夾具,若這樣夾持,藥液或其他處理溶液就會進入此空間。然而,本新型創作在第一與第二軟質密封件106與108上部以不對稱的設計,讓上方軟質密封件(106與108)能夠緊密貼合,並且藉由液體供應組件112在整個處理期間持續或間斷地往無工件120的空間124輸送如水的液體,使得空間124內的壓力(水壓)等於或略大於外界壓力,因此能解決上述藥液(或其他處理溶液)進入的問題。而達到阻擋藥液透過上方進入的功能,第一與第二凸塊114/120的側面則有第一與第二閒置開口而達到暫存側邊滲入的藥液的功能,故能有效防止第一與第二凸塊114和120長銅。In this embodiment, when the first and second clamping
為了說明第一實施例的液體供應組件的示範性結構與其運作方式,請參照圖5。In order to explain the exemplary structure and operation of the liquid supply assembly of the first embodiment, please refer to FIG. 5.
圖5是圖1之第一與第二夾臂102與104打開的情況,而液體供應組件112的液體管路126會與液體儲存槽118的開口部118a相連,且液體管路126可連至外加的容器128,所以容器128內的液體可經由液體供應組件112往第一與第二夾臂102與104之間輸送。一旦水封導電夾100夾持工件,液體會自然流入第一夾臂102與第二夾臂104之間的空間,使得該處的水壓與外界水壓接近或者略大於外界水壓。此外,圖5的水封導電夾100可另設有一個傳送棒130以及連接第一和第二夾臂102和104到傳送棒130上的兩個可動支架132a與132b。然而,本新型創作並不限於此,水封導電夾100中與第一和第二夾臂102和104相連的其餘構件也可採用其他設計。5 is the first and second clamp
圖6是依照本新型創作的第二實施例的一種水封導電夾在夾持工件的剖面示意圖,其中使用與圖4相同的元件符號來表示相同或近似的構件,且相同或近似的構件也可參照第一實施例,不再贅述。6 is a schematic cross-sectional view of a water-sealed conductive clamp clamping a workpiece according to a second embodiment of the present invention, in which the same element symbols as in FIG. 4 are used to denote the same or similar components, and the same or similar components are also Reference may be made to the first embodiment, and no further description will be given.
請參照圖6,第二實施例與第一實施例的差異在於,第二實施例中的液體供應組件600並無液體儲存槽,而是包含與開孔116相接的一液體管路602,其可直接外接至一將有液體的容器(如圖5的128)。液體供應組件600一樣能往第一夾臂102與第二夾臂104之間的空間124輸液,使得空間124內的壓力等於或略大於外界壓力,因此能達到阻擋藥液透過上方進入的功能,故能有效防止第一與第二凸塊114和120長銅。6, the difference between the second embodiment and the first embodiment is that the
綜上所述,本新型創作不需像傳統需要完全夾貼凸塊,所以凸塊上半部是沒有夾被鍍物的,依過去的夾具,若這樣夾持工件,液體就會進入,而為解決上述情形,所以本新型創作藉由軟質密封件上方以設計不對稱的方式再搭配液體供應組件,讓上方軟質部能夠緊密貼合,並且藉由液體供應組件在整個處理期間持續地往凸塊上半部無被鍍物的空間輸送液體,使得該處空間內的壓力等於或略大於外界壓力,因此能阻隔藥液(或其他處理溶液)進入,能同時兼顧縮減工件邊緣(板邊)無效區面積以及防止藥液或其他處理溶液滲漏到電極凸塊的夾面,導致凸塊也會鍍上殘銅影響品質,甚至須透過人工方式以化學液清洗(反電鍍方式)將殘銅去除等增加污染與成本的問題。而且,在凸塊兩側設計的的閒置開口,能提供數個軟質空間,讓滲入的導電液不會直接滲進導電的凸塊,除保護凸塊外,也可以保護凸塊內圈的軟質部分。To sum up, the new creation does not need to completely clamp the bump as traditional, so the upper half of the bump is not clamped by the plating. According to the past clamp, if the workpiece is clamped in this way, the liquid will enter, and In order to solve the above-mentioned situation, the new creation uses a liquid supply component in an asymmetric design above the soft seal, so that the upper soft part can closely fit, and the liquid supply component continues to protrude toward the entire process. The space in the upper half of the block without plating is to transport liquid, so that the pressure in the space is equal to or slightly greater than the external pressure, so it can block the entry of chemical liquid (or other processing solution), and can simultaneously reduce the edge of the workpiece (board edge) The area of the ineffective area and prevent the leakage of the chemical solution or other processing solution to the electrode bump surface, resulting in the bump will also be coated with residual copper to affect the quality, and even manual cleaning with chemical solution (reverse plating) Removal and other issues that increase pollution and cost. Moreover, the idle openings designed on both sides of the bump can provide several soft spaces, so that the infiltrating conductive liquid will not directly penetrate into the conductive bump. In addition to protecting the bump, it can also protect the softness of the inner ring of the bump section.
雖然本新型創作已以實施例揭露如上,然其並非用以限定本新型創作,任何所屬技術領域中具有通常知識者,在不脫離本新型創作的精神和範圍內,當可作些許的更動與潤飾,故本新型創作的保護範圍當視後附的申請專利範圍所界定者為準。Although the new creation has been disclosed as above with examples, it is not intended to limit the creation of the new creation. Anyone with ordinary knowledge in the technical field of the subject can make some changes and without departing from the spirit and scope of the creation of the new creation. Retouching, so the scope of protection of this new creation shall be subject to the scope defined in the appended patent application.
100‧‧‧水封導電夾
102‧‧‧第一夾臂
102a、102b、104a、114b、120b‧‧‧側面
104‧‧‧第二夾臂
106‧‧‧第一軟質密封件
106a‧‧‧第一開口
106b‧‧‧第一閒置開口
108‧‧‧第二軟質密封件
108a‧‧‧第二開口
110‧‧‧硬質保護套
112、600‧‧‧液體供應組件
114‧‧‧第一凸塊
114a、120a‧‧‧夾面
116‧‧‧開孔
118‧‧‧液體儲存槽
118a‧‧‧開口部
120‧‧‧第二凸塊
122‧‧‧工件
124‧‧‧空間
126、602‧‧‧液體管路
128‧‧‧容器
130‧‧‧傳送棒
132a、132b‧‧‧可動支架
100‧‧‧Waterproof
圖1是依照本新型創作的第一實施例的一種水封導電夾打開時的立體示意圖。 圖2是圖1之第一夾臂的部分放大圖。 圖3是圖2的縱向半切示意圖。 圖4是圖1的水封導電夾在夾持工件時的剖面示意圖。 圖5是第一實施例之水封導電夾的應用例的立體示意圖。 圖6是依照本新型創作的第二實施例的一種水封導電夾在夾持工件的剖面示意圖。 FIG. 1 is a schematic perspective view of a water-sealed conductive clip according to a first embodiment of the invention. FIG. 2 is a partially enlarged view of the first clamp arm of FIG. 1. FIG. FIG. 3 is a schematic longitudinal half-cut view of FIG. 2. 4 is a schematic cross-sectional view of the water-sealed conductive clip of FIG. 1 when clamping a workpiece. 5 is a schematic perspective view of an application example of the water-sealed conductive clip of the first embodiment. 6 is a schematic cross-sectional view of a water-sealed conductive clip clamping a workpiece according to a second embodiment of the present invention.
100‧‧‧水封導電夾 100‧‧‧Waterproof conductive clip
102‧‧‧第一夾臂 102‧‧‧First arm
104‧‧‧第二夾臂 104‧‧‧Second clamp arm
106‧‧‧第一軟質密封件 106‧‧‧The first soft seal
108‧‧‧第二軟質密封件 108‧‧‧Second soft seal
110‧‧‧硬質保護套 110‧‧‧ Hard case
112‧‧‧液體供應組件 112‧‧‧Liquid supply components
118a‧‧‧開口部 118a‧‧‧Opening
Claims (12)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW108215417U TWM591103U (en) | 2019-11-21 | 2019-11-21 | Water seal conductive clamp |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW108215417U TWM591103U (en) | 2019-11-21 | 2019-11-21 | Water seal conductive clamp |
Publications (1)
Publication Number | Publication Date |
---|---|
TWM591103U true TWM591103U (en) | 2020-02-21 |
Family
ID=70414148
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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TW108215417U TWM591103U (en) | 2019-11-21 | 2019-11-21 | Water seal conductive clamp |
Country Status (1)
Country | Link |
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TW (1) | TWM591103U (en) |
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2019
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