TWI692551B - Asymmetric water seal conductive clamp - Google Patents
Asymmetric water seal conductive clamp Download PDFInfo
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- TWI692551B TWI692551B TW108107000A TW108107000A TWI692551B TW I692551 B TWI692551 B TW I692551B TW 108107000 A TW108107000 A TW 108107000A TW 108107000 A TW108107000 A TW 108107000A TW I692551 B TWI692551 B TW I692551B
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/06—Suspending or supporting devices for articles to be coated
- C25D17/08—Supporting racks, i.e. not for suspending
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/004—Sealing devices
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/188—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by direct electroplating
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Abstract
Description
本發明是有關於一種加工處理設備,且特別是有關於一種不對稱式水封導電夾。The invention relates to a processing equipment, and in particular to an asymmetric water-sealed conductive clip.
在印刷電路板(PCB)或其他相關產業中,電鍍技術的發展隨著用戶的需求不斷地演變,特別是對於製作產品的品質及其產量,往往無法兼顧。In the printed circuit board (PCB) or other related industries, the development of electroplating technology continues to evolve with the needs of users, especially for the quality of manufactured products and their output, often unable to take into account.
以PCB製程的電鍍方面而言,由於需求的工件(即,產品標的物)的夾點接觸面積愈大愈好,所以目前的方式是增加被鍍物的夾持面積,又要有良好的電鍍液阻隔效果,造成產品標的物的邊線材料浪費。目前在實際量產下發現若夾臂進入電鍍液後,若電鍍液進入接觸到凸塊,會導致凸塊也會或多或少鍍上殘銅,造成品質不好,當到達一定程度後,則必須透過人工方式以化學液清洗(反電鍍方式)將殘銅去除,除增加污染外也會增加成本。In terms of the electroplating of the PCB process, as the required contact area of the workpiece (that is, the product target) is as large as possible, the current method is to increase the clamping area of the object to be plated, and to have good plating The liquid barrier effect causes waste of the edge material of the product target. Under actual mass production, it is found that if the clamping arm enters the plating solution, if the plating solution comes into contact with the bumps, it will cause the bumps to be more or less plated with residual copper, resulting in poor quality. When it reaches a certain level, It must be manually removed by chemical liquid cleaning (reverse plating) to remove residual copper, in addition to increasing pollution will also increase costs.
除了電鍍技術之外,凡是需要導電夾的設備,也都會遭遇上述技術問題。In addition to electroplating technology, all equipment that requires conductive clips will also encounter the above-mentioned technical problems.
本發明提供一種不對稱式水封導電夾,除減少產品標的物的邊線材料浪費外,還能避免或降低污染的增加以及成本的增加。The invention provides an asymmetrical water-sealed conductive clip, which can avoid or reduce the increase of pollution and the increase of cost, in addition to reducing the waste of the edge material of the product target.
本發明的不對稱式水封導電夾,至少包括第一夾臂、第二夾臂、第一軟質密封件、第二軟質密封件以及數個硬質保護套。第一與第二夾臂的相向側面分別具有夾面位置相對應的第一與第二凸塊。所述第一夾臂夾持一工件時,所述第一凸塊與所述工件的接觸面積小於所述第一凸塊的夾面。所述第二夾臂夾持所述工件時,所述第二凸塊與所述工件的接觸面積小於所述第二凸塊的所述夾面。第一軟質密封件具有位置與第一凸塊相符的第一開口以及分別位於第一開口兩側的數個第一閒置開口,其中所述第一開口包覆所述第一凸塊的周緣,且每個所述第一閒置開口是設置在所述第一凸塊的側面。第二軟質密封件具有位置與第二凸塊相符的第二開口以及分別位於第二開口兩側的數個第二閒置開口,其中所述第二開口包覆所述第二凸塊的周緣,且每個所述第二閒置開口是設置在所述第二凸塊的側面。硬質保護套則包覆第一與第二夾臂的表面。The asymmetric water-sealed conductive clip of the present invention at least includes a first clip arm, a second clip arm, a first soft seal, a second soft seal, and several hard protective sleeves. The opposite side surfaces of the first and second clamping arms respectively have first and second protrusions corresponding to the positions of the clamping surfaces. When the first clamping arm clamps a workpiece, the contact area between the first projection and the workpiece is smaller than the clamping surface of the first projection. When the second clamping arm clamps the workpiece, the contact area of the second projection and the workpiece is smaller than the clamping surface of the second projection. The first soft seal has a first opening with a position corresponding to the first protrusion and a plurality of first idle openings located on both sides of the first opening, wherein the first opening covers the periphery of the first protrusion, And each of the first idle openings is disposed on the side of the first protrusion. The second soft seal has a second opening with a position corresponding to the second protrusion and a plurality of second idle openings respectively located on both sides of the second opening, wherein the second opening covers the periphery of the second protrusion, And each of the second idle openings is disposed on the side of the second bump. The hard protective sleeve covers the surfaces of the first and second clamping arms.
在本發明的一實施例中,上述第一凸塊的所述夾面的寬度大於所述第一夾臂的寬度的一半以上。In an embodiment of the invention, the width of the clamping surface of the first bump is greater than half of the width of the first clamping arm.
在本發明的一實施例中,上述第二凸塊的所述夾面的寬度大於所述第二夾臂的寬度的一半以上。In an embodiment of the invention, the width of the clamping surface of the second bump is greater than half of the width of the second clamping arm.
在本發明的一實施例中,上述第一夾臂設有所述第一凸塊的部位的寬度大於其餘部位的寬度。In an embodiment of the invention, the width of the portion where the first protrusion is provided on the first clamping arm is greater than the width of the remaining portions.
在本發明的一實施例中,上述第二夾臂設有所述第二凸塊的部位的寬度大於其餘部位的寬度。In an embodiment of the invention, the width of the portion where the second protrusion is provided on the second clip arm is greater than the width of the remaining portions.
在本發明的一實施例中,上述第一凸塊與所述工件的接觸面積等於或小於所述第一凸塊的所述夾面的一半、1/3或2/3。In an embodiment of the present invention, the contact area between the first bump and the workpiece is equal to or less than half, 1/3, or 2/3 of the clamping surface of the first bump.
在本發明的一實施例中,上述第二凸塊與所述工件的接觸面積等於或小於所述第二凸塊的所述夾面的一半、1/3或2/3。In an embodiment of the invention, the contact area between the second bump and the workpiece is equal to or less than half, 1/3, or 2/3 of the clamping surface of the second bump.
在本發明的一實施例中,上述第一閒置開口的數目在2以上。In an embodiment of the invention, the number of the first idle openings is more than 2.
在本發明的一實施例中,上述第二閒置開口的數目在2以上。In an embodiment of the invention, the number of the second idle openings is more than 2.
基於上述,本發明藉由特定結構設計的密封構件,能在被鍍物不像過去需要完全夾貼凸塊的情況下,雖然凸塊上半部沒有夾被鍍物,但能藉由軟質密封件上方以設計不對稱的方式,讓軟質密封件上方的部分能夠緊密貼合,阻隔藥液或其他處理溶液由上方或者側面滲漏到作為電極的凸塊夾面,導致凸塊也會鍍上殘銅影響品質,甚至須透過人工方式以化學液清洗(反電鍍方式)將殘銅去除等增加污染與成本的問題。而且,軟質密封件(如橡膠)也可能會鍍上殘銅,所以在凸塊兩側設計的的閒置開口,能提供數個軟質空間,讓滲入的導電液不會直接滲進導電的凸塊,除保護凸塊外,也可以保護凸塊內圈的軟質部分。Based on the above, the sealing member of the present invention designed by a specific structure can be used to seal the bumps without the need to completely sandwich the bumps in the past, although the bumps are not sandwiched by the upper half of the bumps, but can be sealed by soft The upper part of the part is designed in an asymmetrical way, so that the part above the soft seal can be closely attached, blocking the leakage of the chemical liquid or other processing solution from the upper side or the side to the bump clamping surface as the electrode, resulting in the bumps also being plated Residual copper affects the quality, and it is even necessary to manually remove the residual copper by chemical liquid cleaning (reverse plating) to increase pollution and cost. Moreover, soft seals (such as rubber) may also be coated with residual copper, so the idle openings designed on both sides of the bump can provide several soft spaces so that the infiltrating conductive liquid will not directly infiltrate the conductive bump In addition to protecting the bumps, the soft parts of the inner ring of the bumps can also be protected.
為讓本發明的上述特徵和優點能更明顯易懂,下文特舉實施例,並配合所附圖式作詳細說明如下。In order to make the above-mentioned features and advantages of the present invention more obvious and understandable, the embodiments are specifically described below in conjunction with the accompanying drawings for detailed description as follows.
以下揭示內容提供許多不同的實施方式或範例,用於實施本發明的不同特徵。當然這些實施例僅為範例,並非用於限制本發明的範圍與應用。再者,為了清楚起見,各個構件、膜層或區域的相對厚度及位置可能縮小或放大。另外,在各圖式中使用相似或相同的元件符號來標示相似或相同元件或特徵,且圖式中如有與前一圖相同的元件符號,則將省略其贅述。The following disclosure provides many different embodiments or examples for implementing different features of the present invention. Of course, these embodiments are only examples and are not intended to limit the scope and application of the present invention. Furthermore, for the sake of clarity, the relative thicknesses and positions of various components, films, or regions may be reduced or enlarged. In addition, similar or identical element symbols are used in each drawing to indicate similar or identical elements or features, and if the same element symbol in the drawings is the same as the previous figure, its redundant description will be omitted.
圖1是依照本發明的一實施例的一種不對稱式水封導電夾的剖面示意圖。FIG. 1 is a schematic cross-sectional view of an asymmetric water-sealed conductive clip according to an embodiment of the invention.
請參照圖1,實施例中的不對稱式水封導電夾100至少包括第一夾臂102、第二夾臂104、第一軟質密封件106、第二軟質密封件108以及硬質保護套110。文中的「軟質」與「硬質」是相對性用語;詳細來說,軟質是可變形的材料、硬質是不可變形的材料或者變形量比軟質低的材料。此外,本實施例的不對稱式水封導電夾100可另設有一個傳送棒112、分別連至傳送棒112與第一和第二夾臂102和104的兩個彈性元件114a與114b以及從第一和第二夾臂102和104分別接到傳送棒112上的轉動軸116的兩個可動支架118a與118b。圖中所示為第一與第二夾臂102和104夾持一工件120的情況,若施力F至第一和第二夾臂102和104,則可使不對稱式水封導電夾100打開。然而,本發明並不限於此,不對稱式水封導電夾100中與第一和第二夾臂102和104相連的其餘構件也可採用其他設計。Referring to FIG. 1, the asymmetric water-sealed
關於第一與第二夾臂102和104的詳細構造請參照圖2A和圖2B,圖2A是圖1之第一與第二夾臂102和104的部分放大圖。圖2B是圖2A中之第一(或第二)夾臂的正視圖,且文中是以第一夾臂102為例,並且為了清楚表示起見,省略部分構件。Please refer to FIGS. 2A and 2B for detailed structures of the first and
請參照圖2A和圖2B,第一夾臂102的一側面102a具有一個第一凸塊122,第一凸塊122具有夾面122a以及側面122b,其中夾面122a是指夾持工件120的表面,且第一凸塊122是第一夾臂102的一部分,所以其材料與第一夾臂102相同,例如不銹鋼或其他導電材料。第二夾臂104的結構基本上與第一夾臂102相對應,譬如與第一夾臂102相向的一側面104a具有一個第二凸塊124,第二凸塊124具有夾面124a以及側面124b,且第二凸塊124的夾面124a位置對應第一凸塊122的夾面122a位置,且第二凸塊124是第二夾臂104的一部分,所以其材料與第二夾臂104相同,例如不銹鋼或其他導電材料。2A and 2B, a
而第一軟質密封件106具有位置與第一凸塊122相符的第一開口106a以及分別位於所述第一開口106a兩側的第一閒置開口106b,其中第一開口106a包覆第一凸塊122的周緣,且每個第一閒置開口106b是設置在第一凸塊122的側面122b,用以防止藥液或其他處理溶液由側面直接滲進導電的第一凸塊122,除保護第一凸塊122外,也可以保護第一開口106a部位的軟質部分。第二軟質密封件108同樣具有位置與第二凸塊124相符的第二開口108a以及分別位於第二開口108a兩側的第二閒置開口108b ,其中第二開口108a包覆第二凸塊124的周緣,且每個第二閒置開口108b是設置在第二凸塊124的側面124b,用以防止藥液或其他處理溶液由側面直接滲進導電的第二凸塊124,除保護第二凸塊124外,也可以保護第二開口108a部位的軟質部分。在本實施例中,第一閒置開口106b的數目是2個,但是本發明並不限於此,第一閒置開口106b的數目也可以是2以上,譬如在第一開口106a兩側分別有2個第一閒置開口106b,所以總共有4個第一閒置開口106b,依此類推。同樣地,第二閒置開口108b的數目是2個,但是本發明並不限於此,第二閒置開口108b的數目也可以是2以上,譬如在第二開口108a兩側分別有2個第二閒置開口108b,所以總共有4個第二閒置開口108b,依此類推。硬質保護套110則包覆第一與第二夾臂102和104的表面,請見圖2A。於本實施例中,硬質保護套110是包覆第一夾臂102接近第一凸塊122的表面以及包覆第二夾臂104接近第二凸塊124的表面,但本發明並不限於此,硬質保護套110也可以一直延伸至圖1的可動支架118a與118b附近的第一與第二夾臂102和104的表面。The first
在本實施例中,第一與第二夾臂102和104在夾持工件120時,如圖2A所示,工件120(被鍍物)不像過去需要完全夾貼第一與第二凸塊122與124(例如第一凸塊122與工件120的接觸面積小於第一凸塊122的夾面122a、第二凸塊124與工件120的接觸面積小於第二凸塊124的夾面124a),所以第一與第二凸塊122與124上半部是沒有夾工件120的,依過去的夾具,若這樣夾持,液體就會進入此空間。然而,本發明在第一與第二軟質密封件106與108上部以不對稱的設計,讓上方軟質密封件(106與108)能夠緊密貼合,而解決上述液體進入的問題。舉例來說,第一凸塊122與工件120的接觸面積可等於或小於第一凸塊122的夾面122a的一半、1/3或2/3,但本發明不限於此。同樣地,第二凸塊124與工件120的接觸面積例如等於或小於第二凸塊124的夾面124a的一半、1/3或2/3,但本發明不限於此。一旦工件120被夾持,第一與第二夾臂102和104下方與工件120接觸的部分(即第一與第二凸塊122/124)會緊密貼合於工件120,第一與第二凸塊122/124上方則會彼此貼合並將工件120上緣封住,呈現不對稱的樣貌,而達到阻擋藥液透過上方進入的功能,第一與第二凸塊122/124的側面122b/124b則有第一與第二閒置開口106b/108b而達到暫存側邊滲入的藥液的功能,故能有效防止第一與第二凸塊122和124長銅。In this embodiment, when the first and second clamping
請繼續參照圖2B,在本實施例中的第一凸塊122的夾面122a的寬度w1大於第一夾臂102的寬度w2的一半以上;第二凸塊124的夾面124a的寬度w1大於第二夾臂104的寬度w2的一半以上。而且,第一夾臂102設有第一凸塊122的部位的寬度w2可大於其餘部位的寬度w3;第二夾臂104設有第二凸塊124的部位的寬度w2大於其餘部位的寬度w3。2B, in this embodiment, the width w1 of the
圖3是圖1之第一(或第二)夾臂102(或104)的部分放大立體圖,且圖3是不對稱式水封導電夾打開的情況,所以第一凸塊122的夾面122a稍微內縮於第一開口106a內、第二凸塊124的夾面124a稍微內縮於第二開口108a內,以利不對稱式水封導電夾夾持工件時,第一與第二軟質密封件106和108能緊密地封住第一與第二凸塊122和124。同時,第一與第二閒置開口106b和108b有空間可以容置滲入的藥液或其他處理溶液。FIG. 3 is a partially enlarged perspective view of the first (or second) clamping arm 102 (or 104) of FIG. 1, and FIG. 3 is a case where the asymmetrical water-sealed conductive clamp is opened, so the clamping
綜上所述,本發明不需像傳統需要完全夾貼凸塊,所以凸塊上半部是沒有夾被鍍物的,依過去的夾具,若這樣夾持工件,液體就會進入,而為解決上述情形,所以本發明藉由軟質密封件上方以設計不對稱的方式,讓上方軟質部能夠緊密貼合,阻隔液體進入,能同時兼顧縮減工件邊緣(板邊)無效區面積以及防止藥液或其他處理溶液滲漏到電極凸塊的夾面,導致凸塊也會鍍上殘銅影響品質,甚至須透過人工方式以化學液清洗(反電鍍方式)將殘銅去除等增加污染與成本的問題。而且,在凸塊兩側設計的的閒置開口,能提供數個軟質空間,讓滲入的導電液不會直接滲進導電的凸塊,除保護凸塊外,也可以保護凸塊內圈的軟質部分。In summary, the present invention does not need to completely clamp the bump as in the traditional, so the upper half of the bump is not clamped by the plated object. According to the previous clamp, if the workpiece is clamped in this way, the liquid will enter, and To solve the above situation, the present invention uses the asymmetric design above the soft seal to allow the upper soft part to closely fit to block the liquid from entering, at the same time reducing the area of the invalid area of the workpiece edge (board edge) and preventing the chemical solution Or other treatment solution leaked to the electrode bump surface, resulting in bumps will also be coated with residual copper to affect the quality, and even need to be manually removed by chemical liquid cleaning (reverse plating) to increase pollution and cost problem. Moreover, the idle openings designed on both sides of the bump can provide several soft spaces, so that the infiltrating conductive liquid will not directly penetrate into the conductive bump. In addition to protecting the bump, it can also protect the softness of the inner ring of the bump section.
雖然本發明已以實施例揭露如上,然其並非用以限定本發明,任何所屬技術領域中具有通常知識者,在不脫離本發明的精神和範圍內,當可作些許的更動與潤飾,故本發明的保護範圍當視後附的申請專利範圍所界定者為準。Although the present invention has been disclosed as above with examples, it is not intended to limit the present invention. Any person with ordinary knowledge in the technical field can make some changes and modifications without departing from the spirit and scope of the present invention. The scope of protection of the present invention shall be subject to the scope defined in the appended patent application.
100:不對稱式水封導電夾
102:第一夾臂
102a、104a:(夾臂的)側面
104:第二夾臂
106:第一軟質密封件
106a:第一開口
106b:第一閒置開口
108:第二軟質密封件
108a:第二開口
108b:第二閒置開口
110:硬質保護套
112:傳送棒
114a、114b:彈性元件
116:轉動軸
118a、118b:可動支架
120:工件
122:第一凸塊
122a、124a:夾面
122b、124b:(凸塊的)側面
124:第二凸塊
F:力
w1、w2、w3:寬度100: Asymmetrical water seal conductive clip
102:
圖1是依照本發明的一實施例的一種不對稱式水封導電夾的剖面示意圖。 圖2A是圖1之第一與第二夾臂的部分放大圖。 圖2B是圖2A中之第一(或第二)夾臂的正視圖。 圖3是圖1之第一(或第二)夾臂的部分放大立體圖。 FIG. 1 is a schematic cross-sectional view of an asymmetric water-sealed conductive clip according to an embodiment of the invention. FIG. 2A is a partial enlarged view of the first and second clamping arms of FIG. 1. FIG. FIG. 2B is a front view of the first (or second) clamp arm in FIG. 2A. 3 is a partially enlarged perspective view of the first (or second) clamp arm of FIG. 1.
102:第一夾臂 102: First clamp arm
104:第二夾臂 104: second clamp arm
102a、104a:(夾臂的)側面 102a, 104a: (clamp arm) side
106:第一軟質密封件 106: The first soft seal
106a:第一開口 106a: the first opening
106b:第一閒置開口 106b: The first idle opening
108:第二軟質密封件 108: second soft seal
108a:第二開口 108a: second opening
108b:第二閒置開口 108b: second idle opening
122:第一凸塊 122: First bump
122a、124a:夾面 122a, 124a: surface
122b、124b:(凸塊的)側面 122b, 124b: (bumped) side
124:第二凸塊 124: second bump
w1、w2、w3:寬度 w1, w2, w3: width
Claims (9)
Priority Applications (3)
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TW108107000A TWI692551B (en) | 2019-03-04 | 2019-03-04 | Asymmetric water seal conductive clamp |
CN201910288105.4A CN111647933B (en) | 2019-03-04 | 2019-04-11 | Asymmetric water seal conductive clamp |
CN201920484046.3U CN209974946U (en) | 2019-03-04 | 2019-04-11 | Asymmetric water seal conductive clamp |
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TW108107000A TWI692551B (en) | 2019-03-04 | 2019-03-04 | Asymmetric water seal conductive clamp |
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TW202033836A TW202033836A (en) | 2020-09-16 |
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- 2019-03-04 TW TW108107000A patent/TWI692551B/en active
- 2019-04-11 CN CN201920484046.3U patent/CN209974946U/en active Active
- 2019-04-11 CN CN201910288105.4A patent/CN111647933B/en active Active
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US5901997A (en) * | 1995-10-26 | 1999-05-11 | Lea Ronal Gmbh | Conveyor device for vertically guiding plate-like objects for electroylic surface-treatment |
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Also Published As
Publication number | Publication date |
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CN111647933A (en) | 2020-09-11 |
CN209974946U (en) | 2020-01-21 |
TW202033836A (en) | 2020-09-16 |
CN111647933B (en) | 2023-05-23 |
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