TWM590309U - Vacuum fixture - Google Patents

Abstract

The disclosure relates to a vacuum fixture comprising: a body, a first O-ring and a carrier. The top of the body has a recess along the edge, and the center of the top of the body has an recessed accommodating space, and the body has a first through hole penetrating from the top of the body to the bottom of the body. The first O-ring is resilient and placed within the recess. The stage is placed in the accommodating space and has a second through hole penetrating from a top of the stage to the bottom of the stage, wherein the second through hole is connected with the first through hole. The first through hole and the second through hole are connected with a pumping device configured to produce suction to the accommodating space.

Description

Vacuum fixture

The new type described herein is related to the field of chip packaging, and more specifically to a jig for fixing a wafer during chip packaging.

With the proficiency and competition of chip packaging technology, not only the volume of the package is getting smaller and smaller, but the functions of the chip are becoming more and more diverse. When the components of many different materials are combined on the wafer, as the temperature in the process is high and low Cycling, due to differences in the coefficient of thermal expansion (CTE) of these materials, the overall wafer structure is prone to deformation or warpage.

In the overall process of the packaging process, warpage is a difficult problem. If the wafer after the molding (M/D) is warped, the die attach (D/A) or When the ball is mounted (B/M), it will cause more serious warpage after being processed in the reflow furnace. In addition, when the die-bonding or bumping work on a warped wafer, the high-temperature baking will cause the deviation of the die or the abnormal phenomenon of the solder ball. The abnormal situation of the solder ball may include a situation in which adjacent solder balls are bridged (such as a short circuit) or even combined into a large ball.

According to an embodiment of the present invention, a vacuum jig includes a body, a first O-ring, and a stage. The body has a top, the top has a groove along the edge, wherein the center of the top of the body has a recessed accommodating space, and the body has a portion extending from the top of the body to a bottom of the body A first through hole. The first O-ring has elasticity and is placed in the groove. The carrier is placed in the accommodating space, the carrier has a second through hole penetrating from a top of the carrier to a bottom of the carrier, wherein the second through hole communicates with the first through hole , Wherein the first through hole and the second through hole are connected to a suction device, and are configured to generate a suction force to the accommodating space.

This section describes representative applications of the method and device according to the present application. These examples are provided to merely add context and assist in understanding the described embodiments. Therefore, it will be apparent to those skilled in the art that the described embodiments can be practiced without some or all of these specific details. In other instances, well-known process steps have not been described in detail in order to avoid unnecessarily obscuring the described embodiments. Other applications are possible, so that the following examples should not be considered limiting.

In the following detailed description, reference is made to the accompanying drawings, which form part of the description and in which specific embodiments according to the described embodiments are shown as illustrations. Although these embodiments are described in sufficient detail to enable those skilled in the art to practice the described embodiments, it should be understood that these examples are not limiting; so that without departing from the spirit and scope of the described embodiments Other embodiments can be used and changes can be made.

In this creation, the product can be continuously fixed by vacuum adsorption during the heating of the reflow furnace to maintain the flatness of the product. After leaving the reflow furnace and returning to normal temperature, the vacuum is released to release the product. The above heating process works on the product The fixing will reduce the warpage of the product, or at least maintain the quality of the product during operation.

This creation proposes a new type of jig, which can be baked at a high temperature in a reflow furnace without generating a vacuum leak, resulting in the shedding of wafers and other materials. In one embodiment, the jig can withstand high temperatures to 280°C or above without vacuum leakage. This creation can effectively improve the warpage of wafers or strontium bismuth tantalate (SBT) caused by high temperature baking, and there is no need to keep the gas pipeline connected, so it has high mobility and can also be used in other processes that require heating .

The embodiments shown and described herein can be used to secure a wafer. However, in various other embodiments, it can be used to fix any suitable product (such as die, crystal strip, wafer or substrate, etc.).

FIG. 1A shows a top view of a vacuum jig 1. FIG. The vacuum jig 1 includes a body 11, an O-ring 12, a stage 13 and a suction device 17. In some embodiments of the present invention, the air extraction device 17 may include a slot 171, a valve 173, and an air inlet 175. In some embodiments of the present invention, the stage 13 may include a through hole 131 penetrating from the top of the stage 13 to the bottom of the stage 13. It should be noted that in the top view shown, the vacuum fixture 1 is circular because the shape of the wafer fixed in this embodiment is circular. In different embodiments, the shape of the vacuum fixture 1 can be based on The different shapes of the fixed products are implemented in different shapes. For example, the vacuum fixture 1 may be square, oval, or any other shape.

FIG. 1B is a cross-sectional view of the vacuum jig 1 of FIG. 1A. The vacuum jig 1 includes a body 11, an O-ring 12, a stage 13, a plurality of buffers 15, a suction device 17 and an O-ring 19. In some embodiments of the present invention, the air extraction device 17 may include a slot 171, a valve 173, and an air inlet 175. There are grooves on both sides of the top edge of the body 11 to place the O-ring 12, the center of the top of the body 11 has a recessed receiving space, and the stage 13 is placed in the receiving space, One end of the plurality of buffers 15 is connected to the bottom of the accommodating space, and the other end of each of the plurality of buffers is connected to the bottom of the stage 13 so that the stage 13 is floatingly connected to the body 11 . The plurality of buffers 15 provide an elastic connection between the body 11 and the stage 13, so there is a gap between the body 11 and the stage 13. In some embodiments of the present invention, the plurality of buffers 15 may be a plurality of springs.

The body 11 has a through hole 111 extending from the top of the body 11 to a bottom of the body 11. The stage 13 further has a through hole 131 penetrating from a top of the stage 13 to the bottom of the stage 13, the through hole 131 communicates with the through hole 111 in the body 11 and passes through the body 11 The through hole 111 penetrates to the bottom of the body 11. In some embodiments of the present invention, the through hole 111 and the through hole 131 are connected to the air extraction device 17, and the air extraction device 17 is configured to generate a suction force to the accommodating space.

The body 11 is further placed above the air extraction device 17. As shown in FIG. 1B, in some embodiments of the present invention, the air extraction device 17 may include a groove 171, a valve 173, and an air inlet 175. The groove 171 can be a hollow metal groove with an internal space 1711. In some embodiments of the present invention, the groove 171 may be a hollow stainless steel groove. In some embodiments of the present creation, the groove 171 and the body 11 can be made of different materials. In some embodiments of the present creation, the groove 171 may be made of the same material as the body 11. In some embodiments of the present creation, the groove 171 can be integrally formed with the body 11. The top surface of the groove 171 has an opening 1713 which communicates with the through hole 131.

In some embodiments of the present invention, an O-ring 19 is further included between the groove 171 and the body 11, and the O-ring 19 can seal the groove 171 and the body 11 to ensure the above The space is isolated from the outside world.

In an embodiment of the present invention, the air extraction device 17 may further include a valve 173 and an air inlet 175, wherein the valve 173 may be adjusted so that the internal space 1711 of the groove 173 communicates with the air inlet 175 Or isolate. In some embodiments of the present invention, the internal space 1711 of the groove 171 can open the internal space 1711 of the groove 171 through the air inlet 175 when the valve 173 is opened and communicates with the air inlet 175 Air intake. In some embodiments of the present invention, when the internal space 1711 of the groove 171 is opened and communicated with the air inlet 175, the air inlet 175 may be connected to a pipeline to the groove 171 The internal space 1711 is evacuated to form a vacuum.

FIG. 2A shows a top view of the vacuum jig 1 (including the fixed wafer). The vacuum jig 1 is the same as or similar to the vacuum jig 1 in FIG. 1A. As shown in FIG. 2A, a wafer 21 is placed on the vacuum jig 1.

FIG. 2B is a cross-sectional view of the vacuum jig 1 of FIG. 2A (including the fixed wafer 21). The vacuum jig 1 is the same as or similar to the vacuum jig 1 in FIG. 2A. As shown in FIG. 2B, the body 10 and the stage 13 need to be used to fix the wafer 21 and reduce the warpage of the wafer 21, so the material of the body 11 and the stage 13 is preferably used in a reflow furnace A relatively hard material at high temperatures. In some embodiments of the present creation, the body 11 may be made of metal. In some embodiments of the present invention, the body 11 may be made of aluminum alloy. In some embodiments of the present creation, the body 11 may be made of stainless steel. In some embodiments of the present creation, the stage 13 may be made of metal. In some embodiments of the present creation, the stage 13 may be made of plastic. In some embodiments of the present creation, the stage 13 may be made of Teflon.

As shown in FIG. 2B, the wafer 21 can be placed on the O-ring 12 and the stage 13, the O-ring 12 itself has an elasticity, and the stage 13 is floatingly connected to the body 11, so The wafer 21 placed on the O-ring 12 and the stage 13 is also not completely fixed relative to the body 11 and has floatability, so there is also a gap between the wafer 21 and the body 11. The stage 13 further has a through hole 131 extending through the through hole 111 in the body to the bottom of the body 11. In some embodiments of the present invention, the through hole 131 communicates with the gap between the body 11 and the stage 13 and the gap between the body 11 and the wafer 21, and the same space is used The O-ring 12 is sealed from the outside world.

The top surface of the groove 171 has an opening 1713 that communicates with the through hole 131, so that the through hole 131 and the gap between the body 11 and the stage 13 and between the body 11 and the wafer The space formed by the gap between 21 is further extended to the internal space 1711 of the groove 171. In some embodiments of the present invention, an O-ring 19 is further included between the groove 171 and the body 11, and the O-ring 19 can seal the groove 171 and the body 11 to ensure the above The space is isolated from the outside world.

Since the through hole 131 is connected to the internal space 1711 of the groove 171, when the internal space 1711 of the groove 171 forms a vacuum state, a vacuum state can also be formed in the through hole 131. A pressure difference is formed above and below the wafer 21, thereby generating a suction force to attract and fix the wafer 21 on the stage 13, at this time the gap between the body 11 and the stage 13 and the body 11 and the gap between the wafer 21 can also form a vacuum state.

In some embodiments of the present invention, the stage 13 may have a plurality of through holes similar to the through hole 131, the body 11 may have a plurality of through holes similar to the through hole 111, and the groove 171 also There will be a corresponding number of openings similar to the opening 1713, and an individual O-ring similar to the O-ring 19 is also included between each opening and the corresponding through-hole.

In some embodiments of the present invention, the O-ring is made of rubber material, and the shape and cross section are circular, which is suitable for axial and radial sealing elements. In some embodiments of this creation, the material of the O-ring may be oil-resistant rubber (NBR), fluororubber (FKM), silicone (Silicon), etc., to be suitable for various high and low temperatures, acids, bases, solvents, Static electricity and other environments. In some embodiments of the present invention, the materials of the O-ring 12 and the O-ring 19 are selected so that the O-ring 12 and the O-ring 19 can withstand the high temperature baking of the reflow furnace (for example 280 ℃ or above) and still maintain the characteristics of the seal without causing the vacuum formed to disappear at a high temperature.

Figures 3A-H further illustrate embodiments of the operation of this creation in the manufacturing process.

FIG. 3A shows a cross-sectional view of the vacuum jig 1 connected to the gas pipeline before the wafer 21 is placed. As shown in FIG. 3A, the vacuum jig 1 has not yet placed a wafer.

FIG. 3B shows a cross-sectional view of the vacuum jig after the wafer 21 is placed and connected to the gas pipeline before being evacuated. As shown in FIG. 3B, the wafer 21 is placed on the vacuum jig 1. At this time, the air inlet 175 is connected to a pipeline 23, but the valve 173 is closed to isolate the internal space 1711 of the groove 171 from the air inlet 175.

FIG. 3C shows a cross-sectional view of the vacuum jig 1 after the wafer 21 is placed and connected to a gas line to evacuate. As shown in FIG. 3C, the valve 173 is opened to allow the internal space 1711 of the groove 171 to communicate with the air inlet 175, and at the same time to evacuate through the pipeline 23 connected to the air inlet 175. When the internal space 1711 of the groove 171 forms a vacuum state, since the through hole 131 is connected to the internal space 1711 of the groove 171, a vacuum state can also be formed in the through hole 131, through the through hole 131 in the A pressure difference is formed above and below the wafer 21, so that the wafer 21 can be adsorbed and fixed on the stage 13, the gap between the body 11 and the stage 13 and the body 11 and the crystal The gap between the circles 21 can also form a vacuum. At this time, since the wafer 21 has a downward force, the stage 13 will be pulled down to approach the body 11, and the plurality of buffers 15 will be compressed, and the wafer 21 will be compressed toward the body 11 close, the O-ring 12 is squeezed between the wafer 21 and the body 11 so that the cross-section of the O-ring 12 is oval, the O-ring 12 can now the body 11 and the crystal The gap between the circles 21 is sealed and isolated from the outside world.

FIG. 3D shows a cross-sectional view of the vacuum jig 1 connected to a gas line after the wafer 21 is placed, and then the valve is closed. As shown in FIG. 3D, when the internal space 1711 of the tank 171 is in a vacuum state, the valve 173 is closed to isolate the internal space 1711 of the tank 171 from the air inlet 175.

FIG. 3E illustrates a cross-sectional view of the vacuum jig after removing the gas pipeline after the wafer is placed. As shown in FIG. 3E, the pipeline 23 connected to the air inlet 175 is removed. At this time, since the valve 173 has been closed, the internal space 1711 of the groove 171 is isolated from the air inlet 175, so the groove The internal space 1711 of the 171 and the through hole 131 still maintain a vacuum state, and the wafer 21 also maintains a state of being attracted to the stage 13. And since the pipeline 23 connected to the air inlet 175 has been removed, the wafer 21 and the vacuum jig 1 will be free to move and have mobility, and the material of the pipeline 23 will not be produced Subject to the high temperature of the reflow furnace. In some embodiments of the present invention, the wafer 21 and the vacuum jig 1 may be placed in a reflow furnace in the state shown in FIG. 3D for operation.

3F shows a cross-sectional view of the valve 173 after the vacuum jig 1 is placed on the wafer 21. As shown in FIG. 3F, after the operation in the reflow furnace is completed and the reflow furnace is removed, the valve 173 can be opened to allow the internal space 1711 of the groove 171 and the through hole 131 to communicate with the air inlet 175. At this time, the outside air will enter the internal space 1711 of the groove 171 and the through hole 131 through the air inlet 175, so as to release the vacuum state. The force will be reduced, so that the stage 13 is away from the body 11 and the plurality of buffers 15 are released from the compressed state. At this time, since the wafer 21 is away from the body 11, the O-ring 12 will release the compressed state and return to its original shape.

FIG. 3G shows a cross-sectional view of the vacuum jig after removing the wafer. As shown in FIG. 3G, since the vacuum state has been released, the wafer 21 can be removed from the vacuum jig 1, and the valve 173 remains open.

FIG. 3H shows a cross-sectional view of the vacuum jig after the wafer is removed and the valve is closed. As shown in FIG. 3H, the valve 173 is closed, and then another wafer can be prepared to be placed on the vacuum jig 1 for reflow furnace operation.

It should be noted that the operations in FIGS. 3A-H are only one embodiment of this creation. In some embodiments, operations may be performed in a different order. In addition, in various embodiments, additional operations may be included.

Although specific embodiments have been described above, these embodiments are not intended to limit the scope of the present disclosure, even if only a single embodiment is described for a specific feature. The examples of features provided in this disclosure are intended to be illustrative and not limiting, unless stated otherwise. The above description is intended to cover such alternatives, modifications, and equivalents that will be apparent to those of ordinary skill in the art to benefit from the present disclosure.

1‧‧‧Vacuum Fixture 11‧‧‧Body 12‧‧‧O-ring 13‧‧‧ stage 15‧‧‧buffer 17‧‧‧Suction device 19‧‧‧O-ring 21‧‧‧ Wafer 23‧‧‧ pipeline 111‧‧‧Through hole 131‧‧‧Through hole 171‧‧‧slot 173‧‧‧Valve 175‧‧‧Air inlet 1711‧‧‧Internal space 1713‧‧‧ opening

The described embodiments can be better understood by referring to the following description and accompanying drawings. In addition, the advantages of the described embodiments can be better understood by referring to the following description and accompanying drawings, in which:

FIG. 1A shows a top view of a vacuum fixture.

FIG. 1B is a cross-sectional view of the vacuum jig of FIG. 1A.

FIG. 2A shows a top view of the vacuum jig (including the fixed wafer).

FIG. 2B is a cross-sectional view of the vacuum jig of FIG. 2A (including the fixed wafer).

FIG. 3A shows a cross-sectional view of the vacuum jig connected to the gas pipeline before the wafer is placed.

FIG. 3B shows a cross-sectional view of the vacuum jig after the wafer is placed and before connecting the gas pipeline to evacuate.

FIG. 3C shows a cross-sectional view of the vacuum jig after the wafer is placed and connected to the gas pipeline for evacuation.

FIG. 3D shows a cross-sectional view of the vacuum jig connected to the gas pipeline after the wafer is placed, and then the valve is closed.

FIG. 3E illustrates a cross-sectional view of the vacuum jig after removing the gas pipeline after the wafer is placed.

FIG. 3F shows a cross-sectional view of the vacuum jig after the wafer is placed and the valve is opened.

FIG. 3G shows a cross-sectional view of the vacuum jig after removing the wafer.

FIG. 3H shows a cross-sectional view of the vacuum jig after the wafer is removed and the valve is closed.

1‧‧‧Vacuum Fixture

11‧‧‧Body

12‧‧‧O-ring

13‧‧‧ stage

15‧‧‧buffer

17‧‧‧Suction device

19‧‧‧O-ring

21‧‧‧ Wafer

111‧‧‧Through hole

131‧‧‧Through hole

171‧‧‧slot

173‧‧‧Valve

175‧‧‧Air inlet

1711‧‧‧Internal space

1713‧‧‧ opening

Claims (10)

A vacuum fixture includes: A body has a top, the top has a groove along the edge, wherein the center of the top of the body has a recessed receiving space, and the body has one extending from the top of the body to the body One of the first through holes at the bottom; A first O-ring, which is elastic and placed in the groove; and A carrier placed in the accommodating space, the carrier having a second through hole penetrating from a top of the carrier to a bottom of the carrier, wherein the second through hole communicates with the first The holes are connected, The first through hole and the second through hole are connected to a suction device, and are configured to generate a suction force to the accommodating space. If the vacuum fixture of claim 1, it further includes: In the plurality of buffers, a first end of each of the plurality of buffers is connected to the top of the body, and a second end of each of the plurality of buffers is connected to the bottom of the stage. The vacuum fixture according to claim 2, wherein the plurality of buffers are springs. The vacuum fixture according to claim 1, wherein the air extraction device further includes: A slot having an internal space, wherein the bottom of the body contacts a top of the slot, the top of the slot has a first opening, the first opening corresponds to the first through hole and communicates with the first The hole and the second through hole communicate; A second O-ring placed between the opening of the groove and the first through hole; An air inlet; and A valve, wherein when the valve is opened, it will communicate with the air inlet and the internal space of the tank, and when the valve is closed, it will isolate the air inlet and the internal space of the tank. The vacuum jig of claim 4, wherein the body has a third through hole penetrating from the top of the body to the bottom of the body, wherein the stage has a penetrating from the top of the stage to the stage A fourth through hole at the bottom, wherein the third through hole communicates with the fourth through hole, and wherein the top of the groove has a second opening corresponding to the third through hole and The third through hole and the fourth through hole communicate with each other. The vacuum jig of claim 4, wherein when the valve is closed and the internal space is in a vacuum state, the first O-ring seals a gap between the wafer and the body to maintain the internal space This vacuum state. The vacuum fixture as claimed in claim 4, wherein the air inlet is connected to a pipeline. The vacuum fixture as claimed in claim 1, wherein the material of the first O-ring is rubber. The vacuum fixture as claimed in claim 1, wherein the materials of the body, the stage and the groove are metals. The vacuum jig of claim 1, wherein the stage and the first O-ring are used to carry a wafer.

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