TWI751722B - Wafer cloth glue fixture - Google Patents

Abstract

A wafer cloth glue jig is used to perform glue operation on the front side of a wafer, and includes a jig body and a carrier plate that can be relatively clutched up and down, and an adhesive film that can pass between the jig body and the carrier plate, The jig body located above the carrier includes a mold base with a glue groove, a cover plate, an air suction channel and a glue injection channel. The wafer can be placed on the mold base with its face down and fixed by the cover plate. , so that the front side of the wafer forms a closed adhesive space between the adhesive films exposed at the bottom of the adhesive tank, and the adhesive space is pumped through the air extraction channel, and liquid colloid is injected into the adhesive space through the injection channel. , the liquid colloid flows and is fully coated between the front side of the wafer and the adhesive film by the suction effect of negative pressure and the glue injection pressure after the vacuuming of the adhesive space, so as to form a tearable protection on the front side of the wafer colloid layer.

Description

Wafer cloth glue

The present invention relates to a cloth glue jig, in particular to a wafer cloth glue jig which is applied to the front face cloth glue process of wafers.

At present, the wafers that have completed the front-end semiconductor process must be ground to a predetermined thickness before the back-end packaging process. In order to protect the multiple die units on the front side of the wafer from being damaged in the subsequent grinding process A protective film is attached to the round front, so that the front side of the wafer with the protective film can be fixed on the machine, and then the surface grinding step is performed on the back of the wafer until the wafer is ground and polished to a predetermined thickness, and then the surface is cleaned. Re-attach the dicing film on the back of the wafer and peel off the protective film.

The aforementioned method of attaching a protective film to the front side of the wafer before grinding the wafer can provide a certain protective effect on the front side of the wafer during the backside grinding of the wafer. However, the surface of the die unit on the front side of the wafer is a non-flat surface. It is difficult for the protective film to fully cover the front side of the wafer. Therefore, when the wafer is subjected to back grinding, the protective film cannot provide sufficient mechanical strength to the front side of the wafer, so that the backside grinding of the wafer will easily cause die on the front side of the wafer. The unit is damaged, and there is a need for further improvement.

The purpose of the present invention is to provide a wafer cloth adhesive jig, which solves the problem that the current protective film is attached to the front side of the wafer, and the protective film cannot provide sufficient mechanical strength to the front side of the wafer during the backside grinding process of the wafer.

In order to achieve the aforementioned object, the wafer adhesive jig provided by the present invention is used for performing adhesive on the front side of a wafer, and includes: a carrier board having a flat carrier surface; and a jig body, which can be detachably installed above the carrier board, and has a transverse channel between the bottom of the fixture body and the bearing surface of the carrier board, and can provide an adhesive film to pass through the transverse channel, And the fixture body includes a mold seat, a cover plate, an air suction channel and a glue injection channel, wherein: a cloth glue groove is formed in the mold seat from top to bottom, and the glue film is covered on the The bottom of the glue tank, the wafer can be placed on the mold base with the front side facing the glue tank; the cover plate is detachably installed on the mold base, and can close the mold base an opening at the upper end of the glue dispensing tank and fixing the wafer, so that a closed glue dispensing space is formed between the front side of the wafer facing the glue dispensing tank and the glue film covering the bottom of the glue dispensing tank; The air channel and the glue injection channel are respectively communicated with the glue distribution space and opposite sides relative to the center of the glue glue space, and the glue space can be pumped through the air suction channel, and the glue injection channel Liquid colloid with fluidity is injected into the adhesive space, so that the liquid colloid can be arranged between the front surface of the wafer and the adhesive film to form a protective colloid layer.

The aforementioned wafer cloth glue jig can be applied to the front side gluing operation of the wafer, and a protective colloid layer is formed on the front side of the wafer. The adhesive film between the carrier and the carrier, the jig body located above the carrier, provides wafers with the upper and lower through-through glue grooves in the die base, and is placed on the die base face down, and the cover plate can close the die base. The glue tank and the wafer are fixed so that the front side of the wafer forms a closed glue space relative to the glue film exposed at the bottom of the glue bath, and the glue space is evacuated through the air suction channel, and the glue injection channel is used. The liquid colloid is injected into the adhesive space, and the liquid colloid flows and is fully coated between the front side of the wafer and the adhesive film by the suction effect of negative pressure after the adhesive space is evacuated and the glue injection pressure, and is controlled by the fixture body. The thickness and flatness of the colloid coated between the front side of the wafer and the adhesive film form a peelable protective colloid layer between the front side of the wafer and the adhesive film.

In this way, the subsequent grinding process of the wafer on the backside of the wafer after the adhesive dispensing operation is completed, the front side of the wafer is arranged and fixed on the grinding machine through the outer adhesive film of the protective colloid layer, and the backside grinding of the wafer can be carried out. Grinding, polishing to a predetermined thickness and other wafer back grinding processes. In the wafer back grinding process, the front side of the wafer coated with colloid is provided with a protective colloid layer and an outer side film to provide a protective function, which provides sufficient mechanical strength to the front side of the wafer with multiple die units. With the protection performance, in the wafer back grinding process, it can effectively reduce the damage of the die units on the front side of the wafer during the back grinding of the wafer. After the wafer backside grinding process is completed, before the die unit cutting process, the protective colloid layer covering the front side of the wafer can be torn off by an adhesive film.

10: Carrier board

11: Bearing surface

20: Fixture body

200: Fabric space

21: Mold base

211: Cloth glue tank

22: Cover

23: exhaust channel

24: glue injection channel

30: film

40: UV lamps

50: Wafer

51: front

52: Back

60: Protective colloid layer

70: Grinding Machines

FIG. 1 is a schematic diagram of a preferred embodiment of a wafer cloth adhesive fixture of the present invention.

FIG. 2 is a reference diagram (1) of the use state of the preferred embodiment of the wafer adhesive jig shown in FIG. 1 applied to the wafer adhesive operation.

FIG. 3 is a reference diagram (2) of the use state of the preferred embodiment of the wafer glue jig shown in FIG. 1 applied to the wafer glue operation.

FIG. 4 is a reference diagram (3) of the use state of the preferred embodiment of the wafer adhesive jig shown in FIG. 1 applied to the wafer adhesive operation.

FIG. 5 is a schematic plan view of a wafer with a protective colloid layer placed on a polishing machine after being glued.

As shown in FIG. 1, which discloses a preferred embodiment of the wafer adhesive jig of the present invention, the wafer adhesive jig is used to perform adhesive bonding on the front side of a wafer, and the front side of the wafer is Refers to the surface of the wafer having a plurality of die units, the other side of the wafer relative to the front surface is a back surface, and the back surface is covered with a protective film. The wafer cloth adhesive jig includes a carrier 10 and a jig body 20 that can be relatively clutched, and an adhesive film 30 that can pass between the carrier 10 and the jig body 20 .

As shown in FIG. 1 , the top of the carrier board 10 has a flat bearing surface 11 . In this preferred embodiment, the bearing surface 11 is a smooth plane. The carrier 10 is matched with the light-curable adhesive that is pre-coated on the wafer When the carrier board 10 is made of light-transmitting material, the light-transmitting material can be selected from quartz glass or the like. An ultraviolet light fixture 40 can be arranged under the carrier board 10, and the ultraviolet light fixture 40 emits light. Ultraviolet light can pass upwardly through the carrier 10 . If the carrier 10 is a heat-curable colloid that is to be coated on the wafer, the carrier 10 can be made of light-transmitting or non-light-transmitting materials, and a heater 50 can be disposed below the carrier 10 . , in order to provide the heat energy required for the curing of the heat-curable colloid, and the heater 50 can be an electric heater.

As shown in FIG. 1 , the jig body 20 can be detachably installed above the carrier board 10 , and there is a transverse channel between the bottom of the jig body 20 and the bearing surface of the carrier board 10 , and can The glue film 30 is provided through the transverse channel. In this preferred embodiment, the height of the transverse channel corresponds to the thickness of the adhesive film 30 , and the adhesive film 30 can be in a tape form and conveyed through the transverse channel by a tape conveying device. The adhesive film 30 can be a translucent or non-translucent film, and the adhesive film 30 can be selected from polyparaphenylene with excellent toughness, tensile strength, impact strength, abrasion resistance and electrical insulation. Diaphragm made of polyethylene terephthalate (PET). When the adhesive film 30 is matched with the light-curable colloid that is to be coated on the wafer, the adhesive film 30 is a film with light transmittance. Non-transparent film can be selected.

As shown in FIG. 1 , as mentioned above, the fixture body 20 includes a mold base 21 , a cover plate 22 , an air suction channel 23 and a glue injection channel 24 , and the mold base 21 can be disposed on the carrier plate 10 to carry On the surface 11 and the adhesive film 30, and a glue groove 211 is formed in the die base 21 from top to bottom, the wafer to be glued can be placed on the top of the die base 21, and the wafer can be The front side faces down to the glue trough 211 , and the glue film 30 is located at the bottom of the mold base 21 and covers the bottom of the glue trough 211 . The cover plate 22 is detachably installed on the mold base 21, and can close the opening of the upper end of the glue dispensing groove 211 and fix the wafer, so that the front surface of the wafer facing the glue dispensing groove 211 is covered with A closed glue glue space 200 is formed between the glue films 30 at the bottom of the glue glue tank 211 .

As shown in FIG. 1 , the air suction channel 23 and the glue injection channel 24 are respectively connected to opposite sides of the glue dispensing space 200 and relative to the center of the glue dispensing space 200 . The air extraction channel 23 can be connected to an external air extraction device, and the adhesive space 200 can be pumped through the air extraction channel 23 to generate a negative pressure in the adhesive space 200; the glue injection channel 24 can be connected to an external supply source of liquid colloid , and can inject liquid colloid with fluidity into the adhesive space 200 through the adhesive injection channel 24 , and the liquid colloid can flow in the adhesive space 200 by the suction effect of negative pressure after the adhesive space 200 is evacuated.

As shown in FIG. 1 , in this preferred embodiment, the air extraction channel 23 and the glue injection channel 24 can be respectively disposed in the mold base 21 of the fixture body 20 , the air extraction channel 23 and the glue injection channel 24 They are respectively located on opposite sides of the center of the adhesive space 200 . In addition, the setting positions of the air extraction channel and the glue injection channel can also be changed, and the same effect can be achieved. located on opposite sides of the center of the adhesive space. Or, any one of the air extraction channel and the glue injection channel is set in the mold base of the fixture body and communicates with the glue dispensing space, and the other channel is set in the cover plate of the fixture body and The glue distribution space is communicated, and the air suction channel and the glue injection channel are located on opposite sides of the center of the glue distribution space.

When the wafer adhesive jig of the present invention is applied to the front side of the wafer, as shown in FIG. 2 to FIG. The mold base 21 with the main body 20 is aligned and fixed on the carrier board 10 with the adhesive film 30 , and then the wafer 50 to be glued is placed on the mold base 21 , and the wafer 50 has a plurality of die units. The front side 51 of the die face 51 faces the glue groove 211 of the die base 21, and the cover plate 22 is closed on the die base 21. The cover plate 22 closes the opening of the upper end of the glue groove 211 and fixes the wafer 50 so that the wafer 50 faces the die base 21. A closed adhesive space 200 is formed between the front surface 51 of the wafer 50 of the adhesive tank 211 and the adhesive film 30 exposed at the bottom of the adhesive tank 211 , and then the adhesive space 200 is pumped through the air suction channel 23 . , the adhesive space 200 is evacuated to generate negative pressure, and then the liquid colloid with fluidity is injected into the adhesive space 200 through the adhesive injection channel 24 . Under the action of pressure and suction, it flows in the glue space 200 until the liquid colloid fills the glue space 200, and the liquid glue That is, the body is fully coated on the front side 51 of the wafer 50 and covered with the adhesive film 30 exposed at the bottom of the adhesive groove 211, and then the adhesive injection is stopped. The thickness of the adhesive between the adhesive films 30 forms a protective adhesive layer 60 between the front surface 51 of the wafer 50 and the adhesive films 30 .

Then, according to whether the liquid colloid injected into the adhesive space 200 is a light-curable colloid or a heat-curable colloid, the corresponding ultraviolet light fixture 40 or heater is activated, wherein the ultraviolet light emitted by the ultraviolet light fixture 40 passes through the light-transmitting colloid. The carrier 10 and the light-transmitting adhesive film 30 are projected on the light-curing liquid colloid, so that the liquid colloid is photo-cured; or the heat energy is provided by a heater, and the thermally curable liquid colloid is transferred to the thermally curable liquid colloid through the heat conduction between the carrier 10 and the adhesive film 30 . Heating, the liquid colloid is cured by heat. After the liquid colloid is cured, the jig body 20 is sequentially separated and the adhesive film 30 is cut off and taken out. At this time, the front surface 51 of the wafer 50 has a protective colloidal layer 60 and an adhesive film 30 located outside the protective colloidal layer 60 .

As mentioned above, the liquid colloid needs to be peeled off from the front surface 51 of the wafer 50 based on the subsequent wafer manufacturing process. Therefore, the material of the liquid colloid must be selected between the cured protective colloid layer 60 and the front surface 51 of the wafer 50 . There is a colloidal material with low adhesiveness, so that the cured protective colloidal layer 60 can be easily peeled off from the front side 51 of the wafer 50 without damaging the die units on the front side of the wafer. This will not be repeated here. The adhesiveness between the adhesive film 30 and the cured protective colloid layer 60 should preferably be greater than the adhesiveness between the cured protective colloidal layer 60 and the front surface 51 of the wafer 50 , so as to facilitate subsequent removal from the wafer through the adhesive film 30 The front side 51 of 50 is torn off the protective colloid layer 60 .

In the above, the wafer 50 after the adhesive bonding operation can be followed by the grinding process of the back of the wafer. As shown in FIG. 5 , during the grinding process of the wafer, the protective colloid layer 60 formed on the front side 51 of the wafer 50 is used to adhere to the outer side of the wafer. The adhesive film 30 is fixed on the machine table of the grinding tool 70 with the backside 52 of the wafer 50 facing upwards. After that, the protective film on the backside 52 of the wafer 50 is peeled off, and the backside of the wafer 50 is cleaned by the grinding mechanism of the grinding tool 70 . 52 Execute a backside grinding process of the wafer, such as grinding and polishing to a predetermined thickness. In the grinding process of the back side of the wafer, the front side 51 of the wafer 50 has a protective colloid layer on the front side of the wafer. circle with multiple grain units positive The surface provides sufficient mechanical strength and protection performance, which can effectively reduce the damage to the die units on the front side of the wafer during the back grinding process of the wafer.

After the backside grinding process of the wafer is completed, before the die cutting process of the wafer is performed, the protective film is reapplied on the backside of the wafer after the grinding process is completed, and then the adhesive applied to the outer side of the protective colloid layer 60 is used. The film 30 peels off the protective colloid layer 60 from the front surface 51 of the wafer 50 , so that the subsequent wafer dicing process can be performed.

10: Carrier board

11: Bearing surface

20: Fixture body

200: Fabric space

21: Mold base

211: Cloth glue tank

22: Cover

23: exhaust channel

24: glue injection channel

30: film

40: UV lamps

50: Wafer

51: front

52: Back

Claims (6)

A wafer cloth glue jig is used to perform glue on the front side of a wafer, and the wafer cloth glue jig includes: a carrier plate having a flat bearing surface; and a jig body, which can be detachably installed above the carrier board, and has a transverse channel between the bottom of the fixture body and the bearing surface of the carrier board, and can provide an adhesive film to pass through the transverse channel, And the fixture body includes a mold seat, a cover plate, an air extraction channel and a glue injection channel, wherein: A glue groove is formed in the mold base from top to bottom, and the glue film is covered on the bottom of the glue groove. The wafer can be placed on the glue groove with the front side facing the glue groove. on the mold base; The cover plate is detachably installed on the mold base, and can close the opening at the upper end of the glue-dispensing groove and fix the wafer, so that the front side of the wafer facing the glue-disposing groove is covered on the A closed glue space is formed between the glue films at the bottom of the glue groove; The air suction channel and the glue injection channel are respectively communicated with the glue distribution space on opposite sides relative to the center of the glue glue space, and the glue distribution space can be pumped through the air suction channel and the glue injection can be passed through the glue filling space. The channel injects liquid colloid with fluidity into the adhesive space, so that the liquid colloid can be arranged between the front surface of the wafer and the adhesive film to form a protective colloid layer. The wafer cloth glue jig according to claim 1, wherein the air suction channel and the glue injection channel are respectively disposed in the mold base of the jig body. The wafer cloth adhesive jig according to claim 1, wherein any one of the air extraction channel and the glue injection channel is provided in the mold seat of the fixture body, and the other channel is provided in the in the cover of the fixture body. The wafer adhesive jig according to any one of claims 1 to 3, wherein the bearing surface of the carrier board is a smooth plane. The wafer cloth adhesive jig according to any one of claims 1 to 3, wherein the adhesive film is a film made of a light-transmitting material, the carrier is a board body of a light-transmitting material, and the lower part of the carrier is An ultraviolet light fixture is arranged, and the ultraviolet light emitted by the ultraviolet light fixture can be projected into the adhesive space through the carrier board and the adhesive film. The wafer cloth adhesive jig according to claim 5, wherein the bearing surface of the carrier board is a smooth plane.

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