TWM590269U - Touch screen detection chip assembly and terminal device - Google Patents
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Abstract
本創作公開了一種觸控式螢幕檢測晶片組合,包括主檢測晶片和從檢測晶片;其中,主檢測晶片和從檢測晶片用於處理同一觸控式螢幕不同區域的觸摸信號;且主檢測晶片與從檢測晶片連接,主檢測晶片控制從檢測晶片處理觸控式螢幕的觸摸信號;本創作實施例還提供一種終端設備,在工作過程中,主檢測晶片用於獲取觸控式螢幕第一區域的觸摸信號,從檢測晶片用於獲取觸控式螢幕第一區域外的觸摸信號,從而實現觸控式螢幕全部觸摸感應區域的觸摸信號處理。主檢測晶片與從檢測晶片連接,且主檢測晶片控制從檢測晶片同步處理觸控式螢幕的觸摸信號,從而在不改變觸控檢測晶片結構的情況下,通過觸控式螢幕檢測晶片的組合方式來適應不同尺寸的觸控式螢幕,降低成本,提高兼容性。This creation discloses a touch screen inspection chip combination, including a master inspection chip and a slave inspection chip; wherein the master inspection chip and the slave inspection chip are used to process touch signals in different areas of the same touch screen; and the master inspection chip and The slave detection chip is connected, and the master detection chip controls the slave detection chip to process the touch signals of the touch screen; this creative embodiment also provides a terminal device. During the work process, the master detection chip is used to obtain the first area of the touch screen The touch signal is used to acquire the touch signal outside the first area of the touch screen from the detection chip, so as to realize the touch signal processing of all the touch sensitive areas of the touch screen. The master detection chip is connected to the slave detection chip, and the master detection chip controls the slave detection chip to process the touch signals of the touch screen synchronously, so that the combination method of detecting the chip through the touch screen without changing the structure of the touch detection chip To adapt to different sizes of touch screens, reduce costs and improve compatibility.
Description
本創作涉及電子設備領域,具體涉及一種觸控式螢幕檢測晶片組合及終端設備。This creation relates to the field of electronic equipment, in particular to a touch screen detection chip combination and terminal equipment.
隨著智慧手機、平板電腦等智慧終端設備的興起,觸控式螢幕應用越來越廣泛。根據這一應用需求,市場上也出現了很多觸控式螢幕檢測晶片。如圖1所示,目前市場上會根據觸控式螢幕尺寸大小不同,採用不同的觸控式螢幕檢測晶片(integrated circuit,IC)來進行觸控檢測。根據人手的尺寸大小,一般觸控式螢幕都是將屏體劃分成多個5mm*5mm左右的方塊區域單獨進行檢測,屏體越大,上述劃分的區域越多,檢測電極就越多,對應的觸控式螢幕檢測晶片需要的通道數就越多。如說明書圖1左側觸控式螢幕尺寸小於右側觸控式螢幕尺寸,則左側採用檢測通道相對右側更少的觸控式螢幕檢測晶片來完成觸控檢測。檢測通道數不同決定了晶片的面積大小,也就決定了產品的成本。隨著市場上觸控顯示幕體越做越大,如果所有觸控檢測功能都由一個IC完成,則需要一個面積非常大的IC。而且IC開發難度、週期、成本都很高,為了支持不同尺寸的屏體,需要設計不同的觸控檢測晶片,所需耗費的人力、物力、時間都很長,另外,當晶片大到一定程度後,內部時序設計難度會顯著增加,生產良率會顯著下降。With the rise of smart terminal devices such as smartphones and tablets, touch screens are becoming more and more widely used. According to this application requirement, many touch screen inspection chips have also appeared on the market. As shown in FIG. 1, different touch screen detection chips (integrated circuits, ICs) are used in the current market for touch detection according to the size of the touch screen. According to the size of the human hand, the general touch screen is divided into a plurality of 5mm*5mm square areas for independent detection. The larger the screen, the more the above divided areas, the more detection electrodes, corresponding The more the number of channels required for the touch screen detection chip. As shown in FIG. 1 of the specification, the size of the left touch screen is smaller than that of the right touch screen, then the left side uses a touch screen detection chip with fewer detection channels than the right side to complete touch detection. The difference in the number of detection channels determines the area of the wafer, which also determines the cost of the product. With the larger and larger touch display screens on the market, if all touch detection functions are performed by one IC, an IC with a very large area is required. Moreover, the difficulty, cycle and cost of IC development are very high. In order to support different sizes of screens, different touch detection chips need to be designed, which requires a lot of manpower, material resources and time. In addition, when the chip is large to a certain extent After that, the difficulty of internal timing design will increase significantly, and the production yield will decrease significantly.
當然考慮到兼容性問題,也可以用通道比較多的晶片用在小尺寸屏體上,不過這又造成了“大馬拉小車”的結果,是比較浪費的。Of course, considering the compatibility issue, it is also possible to use a chip with more channels for a small-sized screen body, but this causes the result of a "large horse-drawn cart", which is relatively wasteful.
現有技術中存在的上述技術問題有待於改進。The above technical problems in the prior art need to be improved.
本創作的目的在於提供一種觸控式螢幕檢測晶片組合,能夠通過級聯架構,使得多個觸控式螢幕檢測晶片能夠協同工作,共同對大尺寸觸控式螢幕進行觸摸檢測。The purpose of this creation is to provide a touch screen detection chip combination, which can enable multiple touch screen detection chips to work together through a cascade structure to jointly perform touch detection on a large-size touch screen.
本創作的另一目的在於提供一種終端設備,採用前述觸控式螢幕檢測晶片組合。Another purpose of this creation is to provide a terminal device that uses the aforementioned touch screen detection chip combination.
有鑑於此,本創作第一方面提供一種觸控式螢幕檢測晶片組合,包括主檢測晶片和從檢測晶片;其中,主檢測晶片和從檢測晶片用於處理同一觸控式螢幕不同區域的觸摸信號;且主檢測晶片與從檢測晶片連接,主檢測晶片控制從檢測晶片處理觸控式螢幕的觸摸信號。In view of this, the first aspect of the present creation provides a touch screen inspection chip combination, including a master inspection chip and a slave inspection chip; wherein the master inspection chip and the slave inspection chip are used to process touch signals from different areas of the same touch screen ; And the main detection chip is connected to the slave detection chip, the master detection chip controls the slave detection chip to process the touch signal of the touch screen.
結合上述第一方面,在第一種可能的實現方式中,主檢測晶片與從檢測晶片分別設置有電位引腳和第二引腳,電位引腳接收第一電位,第二引腳接收第二電位,第一電位與第二電位不同。結合上述第一方面第一種可能的實現方式,在第二種可能的實現方式中,第一電位是電源電位,第二電位是地電位;或第一電位是地電位,第二電位是電源電位。With reference to the first aspect above, in a first possible implementation manner, the master detection chip and the slave detection chip are respectively provided with a potential pin and a second pin, the potential pin receives the first potential, and the second pin receives the second Potential, the first potential is different from the second potential. With reference to the first possible implementation manner of the first aspect above, in a second possible implementation manner, the first potential is a power supply potential and the second potential is a ground potential; or the first potential is a ground potential and the second potential is a power supply Potential.
結合上述第一方面第一種可能的實現方式,在第三種可能的實現方式中,主檢測晶片設置有啟動信號輸出引腳和時鐘信號輸出引腳,從檢測晶片設置有啟動信號輸入引腳和時鐘信號輸入引腳;主檢測晶片的啟動信號輸出引腳連接從檢測晶片的啟動信號輸入引腳,以使得主檢測晶片控制從檢測晶片啟動觸控檢測;主檢測晶片的時鐘信號輸出引腳連接從檢測晶片的時鐘信號輸入引腳,以使得主檢測晶片控制從檢測晶片以相同的頻率進行觸控檢測。With reference to the first possible implementation manner of the first aspect above, in a third possible implementation manner, the master detection chip is provided with a start signal output pin and a clock signal output pin, and the slave detection chip is provided with a start signal input pin And clock signal input pin; the start signal output pin of the master detection chip is connected to the start signal input pin of the slave detection chip, so that the master detection chip controls the slave detection chip to start touch detection; the clock signal output pin of the master detection chip Connect the clock signal input pin of the slave inspection wafer, so that the master inspection wafer controls the slave inspection wafer to perform touch detection at the same frequency.
結合上述第一方面第三種可能的實現方式,在第四種可能的實現方式中,主檢測晶片的數量為一個,從檢測晶片的數量為多個;主檢測晶片設置有多個同步的啟動信號輸出引腳和多個同步的時鐘信號輸出引腳,多個從檢測晶片各自設置有一個啟動信號輸入引腳和一個時鐘信號輸入引腳;各個從檢測晶片的啟動信號輸入引腳分別連接主檢測晶片的一個啟動信號輸出引腳,各個從檢測晶片的時鐘信號輸入引腳分別連接主檢測晶片的一個時鐘信號輸出引腳。With reference to the third possible implementation manner of the first aspect above, in a fourth possible implementation manner, the number of master inspection wafers is one, and the number of slave inspection wafers is multiple; the master inspection wafer is provided with multiple synchronized startups Signal output pins and multiple synchronized clock signal output pins, multiple slave detection chips are each provided with a start signal input pin and a clock signal input pin; the start signal input pins of each slave detection chip are respectively connected to the master A start signal output pin of the detection chip, and the clock signal input pins of each slave detection chip are respectively connected to a clock signal output pin of the main detection chip.
結合上述第一方面第一種可能的實現方式,在第五種可能的實現方式中,主檢測晶片和從檢測晶片各自分別設置有啟動信號輸出引腳、啟動信號輸入引腳、時鐘信號輸出引腳和時鐘信號輸入引腳;主檢測晶片的啟動信號輸出引腳連接到主檢測晶片和相鄰的從檢測晶片的中間區域,並分別連接主檢測晶片和從檢測晶片各自的啟動信號輸入引腳,主檢測晶片和從檢測晶片接收到啟動信號後啟動觸控檢測;主檢測晶片的時鐘信號輸出引腳連接到主檢測晶片和相鄰的從檢測晶片的中間區域,並分別連接主檢測晶片和從檢測晶片各自的時鐘信號輸入引腳,主檢測晶片和從檢測晶片接收到時鐘信號後以相同的頻率進行觸控檢測。With reference to the first possible implementation manner of the first aspect above, in a fifth possible implementation manner, the master detection chip and the slave detection chip are respectively provided with a start signal output pin, a start signal input pin, and a clock signal output lead Pin and clock signal input pin; the start signal output pin of the master detection chip is connected to the middle area of the master detection chip and the adjacent slave detection chip, and respectively connected to the respective start signal input pins of the master detection chip and the slave detection chip , The master detection chip and the slave detection chip start the touch detection after receiving the start signal; the clock signal output pin of the master detection chip is connected to the middle area of the master detection chip and the adjacent slave detection chip, and the master detection chip and The clock signal input pins of the slave detection wafers, and the master detection wafer and the slave detection wafers perform touch detection at the same frequency after receiving the clock signals.
結合上述第一方面第五種可能的實現方式,在第六種可能的實現方式中,主檢測晶片和從檢測晶片分別設置有升頻模組,用於將主檢測晶片和從檢測晶片各自的時鐘信號輸入引腳接收到的時鐘信號進行頻率提升,主檢測晶片和從檢測晶片分別以提升後頻率進行觸控檢測。With reference to the fifth possible implementation manner of the first aspect described above, in a sixth possible implementation manner, the master detection chip and the slave detection chip are respectively provided with up-conversion modules, which are used to separate the master detection chip and the slave detection chip. The clock signal received by the clock signal input pin is increased in frequency, and the master detection chip and the slave detection chip respectively perform touch detection at the increased frequency.
結合上述第一方面第四或第五種可能的實現方式,在第七種可能的實現方式中,主檢測晶片的數量為一個,從檢測晶片的數量為兩個,該兩個從檢測晶片分別設置在主檢測晶片的兩側。With reference to the fourth or fifth possible implementation manners of the first aspect above, in a seventh possible implementation manner, the number of master inspection wafers is one and the number of slave inspection wafers is two, and the two slave inspection wafers are respectively Set on both sides of the main inspection wafer.
結合上述第一方面第三或第五種可能的實現方式,在第八種可能的實現方式中,主檢測晶片和從檢測晶片接收到啟動信號後執行一幀觸控檢測;或主檢測晶片和從檢測晶片接收到啟動信號後執行兩幀以上觸控檢測;或主檢測晶片和從檢測晶片在接收到兩個以上啟動信號後完成一幀觸控檢測。With reference to the third or fifth possible implementation manners of the first aspect above, in an eighth possible implementation manner, the master detection chip and the slave detection chip perform a frame of touch detection after receiving a start signal; or the main detection chip and After receiving the activation signal from the detection chip, perform more than two frames of touch detection; or the master detection chip and the slave detection chip complete one frame of touch detection after receiving more than two activation signals.
本創作第二方面提供一種終端設備,終端設備包括:觸控式螢幕和觸控式螢幕檢測晶片組合,觸控式螢幕檢測晶片組合包括如上述第一方面或第一方面第一至第八任意一種可能的實現方式所述的觸控式螢幕檢測晶片組合。A second aspect of the present invention provides a terminal device. The terminal device includes: a touch screen and a touch screen detection chip combination. The touch screen detection chip combination includes the first aspect described above or any one of the first to eighth aspects A possible implementation of the touch screen detection chip combination.
從以上技術方案可以看出,本創作實施例具有以下優點:As can be seen from the above technical solutions, this creative embodiment has the following advantages:
本創作實施例中,觸控式螢幕檢測晶片組合包括主檢測晶片和從檢測晶片;其中,主檢測晶片和從檢測晶片用於處理同一觸控式螢幕不同區域的觸摸信號;且主檢測晶片與從檢測晶片連接,主檢測晶片控制從檢測晶片處理觸控式螢幕的觸摸信號;本創作實施例還提供一種終端設備,在工作過程中,主檢測晶片用於獲取觸控式螢幕第一區域的觸摸信號,從檢測晶片用於獲取觸控式螢幕第一區域外的觸摸信號,從而實現觸控式螢幕全部觸摸感應區域的觸摸信號處理。主檢測晶片與從檢測晶片連接,且主檢測晶片控制從檢測晶片同步處理觸控式螢幕的觸摸信號,從而在不改變觸控檢測晶片結構的情況下,通過觸控式螢幕檢測晶片的組合方式來適應不同尺寸的觸控式螢幕,降低成本,提高兼容性。In this creative embodiment, the touch screen detection chip combination includes a master detection chip and a slave detection chip; wherein the master detection chip and the slave detection chip are used to process touch signals from different areas of the same touch screen; and the master detection chip and The slave detection chip is connected, and the master detection chip controls the slave detection chip to process the touch signals of the touch screen; this creative embodiment also provides a terminal device. During the work process, the master detection chip is used to obtain the first area of the touch screen The touch signal is used to acquire the touch signal outside the first area of the touch screen from the detection chip, so as to realize the touch signal processing of all the touch sensitive areas of the touch screen. The master detection chip is connected to the slave detection chip, and the master detection chip controls the slave detection chip to process the touch signals of the touch screen synchronously, so that the combination method of detecting the chip through the touch screen without changing the structure of the touch detection chip To adapt to different sizes of touch screens, reduce costs and improve compatibility.
為了使本技術領域的人員更好地理解本創作方案,下面將結合本創作實施例中的圖式,對本創作實施例中的技術方案進行清楚、完整地描述,顯然,所描述的實施例僅僅是本創作一部分的實施例,而不是全部的實施例。基於本創作中的實施例,本領域普通技術人員在沒有做出創造性勞動前提下所獲得的所有其他實施例,都應當屬於本創作保護的範圍。In order to enable those skilled in the art to better understand the creative solution, the technical solution in the creative embodiment will be described clearly and completely in conjunction with the drawings in the creative embodiment. Obviously, the described embodiment is only This is an example of a part of this creation, not all of it. Based on the embodiments in this creation, all other embodiments obtained by those of ordinary skill in the art without creative work shall fall within the scope of protection of this creation.
本創作的說明書和申請專利範圍及上述圖式中的術語“第一”、“第二”、“第三”“第四”等(如果存在)是用於區別類似的物件,而不必用於描述特定的順序或先後次序。應該理解這樣使用的數據在適當情況下可以互換,以便這裡描述的實施例能夠以除了在這裡圖示或描述的內容以外的順序實施。此外,術語“包括”和“具有”以及他們的任何變形,意圖在於覆蓋不排他的包含,例如,包含了一系列步驟或單元的過程、方法、系統、產品或設備不必限於清楚地列出的哪些步驟或單元,而是可包括沒有清楚地列出的或對於這些過程、方法、產品或設備固有的其它步驟或單元。The description of this creation and the scope of patent application and the terms "first", "second", "third", "fourth", etc. (if any) in the above drawings are used to distinguish similar items, not necessarily Describe a specific order or sequence. It should be understood that the data used in this way can be interchanged under appropriate circumstances so that the embodiments described herein can be implemented in an order other than what is illustrated or described herein. In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusions, for example, processes, methods, systems, products or devices that contain a series of steps or units need not be limited to those clearly listed Which steps or units may include other steps or units that are not explicitly listed or inherent to these processes, methods, products or equipment.
本實施例提供一種觸控式螢幕檢測晶片組合及終端設備,能夠實現不同尺寸觸控式螢幕體的相容,降低成本。用多顆IC進行組合工作完成大尺寸螢幕的觸控檢測,觸控式螢幕檢測晶片組合中的任意單顆IC也可完成小尺寸螢幕的觸控檢測。This embodiment provides a touch screen detection chip combination and a terminal device, which can realize compatibility of touch screen bodies of different sizes and reduce costs. Multiple ICs are used for combination work to complete touch detection of large-size screens. Any single IC in the touch screen detection chip combination can also complete touch detection of small-size screens.
為便於理解,下面對本創作實施例中的具體實施方式進行描述,請參閱圖2。For ease of understanding, the following describes the specific implementation manner in this creative embodiment, please refer to FIG. 2.
如圖2所示,本創作實施例中的觸控式螢幕檢測晶片組合,包括主檢測晶片和從檢測晶片;其中,主檢測晶片和從檢測晶片用於處理同一觸控式螢幕不同區域的觸摸信號;且主檢測晶片與從檢測晶片連接,主檢測晶片控制從檢測晶片處理觸控式螢幕的觸摸信號。主檢測晶片與從檢測晶片可以是以集成晶片(integrated circuit,IC)晶片的形式來實現的。As shown in FIG. 2, the touch screen inspection chip combination in this creative embodiment includes a master inspection chip and a slave inspection chip; wherein, the master inspection chip and the slave inspection chip are used to process touches in different areas of the same touch screen Signal; and the main detection chip is connected to the slave detection chip, the master detection chip controls the slave detection chip to process the touch signal of the touch screen. The master inspection wafer and the slave inspection wafer may be implemented in the form of an integrated circuit (IC) wafer.
本實施例中,主檢測晶片與從檢測晶片在不工作狀態下,功能設置上沒有任何區別,只需要通過相應的配置就可以在組合工作時實現主或從的晶片功能。即同一觸控檢測晶片,可設置實現主檢測晶片的功能,也可以設置實現從檢測晶片的功能。而在多個觸控式螢幕檢測晶片構成組合的狀態時,則由其中一個觸控式螢幕檢測晶片來主導控制觸控檢測流程,該觸控式螢幕檢測晶片為主檢測晶片(Master),其餘觸控式螢幕檢測晶片為從檢測晶片(Slave)。在工作過程中,主檢測晶片用於獲取觸控式螢幕第一區域的觸摸信號,從檢測晶片用於獲取觸控式螢幕第一區域外的觸摸信號,從而實現觸控式螢幕全部觸摸感應區域的觸摸信號處理。主檢測晶片與從檢測晶片連接,且主檢測晶片控制從檢測晶片同步處理觸控式螢幕的觸摸信號。In this embodiment, there is no difference in the function setting between the master detection wafer and the slave detection wafer in the non-working state, and the master or slave wafer functions can be realized during combined work only by corresponding configuration. That is, the same touch detection chip can be set to realize the function of the main detection chip, and can also be set to realize the function of the slave detection chip. When multiple touch screen detection chips form a combined state, one touch screen detection chip dominates the touch detection process. The touch screen detection chip is the master detection chip, and the rest The touch screen inspection chip is a slave inspection chip (Slave). In the working process, the master detection chip is used to obtain the touch signal of the first area of the touch screen, and the slave detection chip is used to obtain the touch signal outside the first area of the touch screen, so as to realize all the touch sensitive areas of the touch screen Touch signal processing. The master detection chip and the slave detection chip are connected, and the master detection chip controls the slave detection chip to simultaneously process the touch signals of the touch screen.
本實施例在不改變觸控檢測晶片結構的情況下,通過觸控式螢幕檢測晶片的組合方式來適應不同尺寸的觸控式螢幕。In this embodiment, without changing the structure of the touch detection chip, a combination of touch screen detection chips is used to adapt to different sizes of touch screens.
但由於主檢測晶片為主導控制檢測流程的檢測晶片,因此主檢測晶片的數量始終只有一個,終端設備的系統(手機、平板、電腦等)只和主檢測晶片通訊,主檢測晶片向從檢測晶片傳送initial code(初始化代碼)、FireWare(固件)、以及每幀的顯示數據等;從檢測晶片做完觸控掃描完後向主檢測晶片傳送觸控raw data(原始數據),然後由主檢測晶片統一來做觸控判斷、座標計算等,最後上報給系統。However, since the main inspection wafer is the inspection wafer that controls the inspection process, the number of main inspection wafers is always only one, and the system of the terminal device (mobile phone, tablet, computer, etc.) only communicates with the main inspection wafer. Send the initial code (initialization code), FireWare (firmware), and display data for each frame, etc.; after the touch scan is completed from the detection chip, the touch raw data is sent to the main detection chip, and then the main detection chip Unified to do touch judgment, coordinate calculation, etc., and finally reported to the system.
主檢測晶片與從檢測晶片各自分別包括電位引腳(圖式中以M/S標示),定義電位引腳接收第一電位的晶片為主檢測晶片,定義電位引腳接收第二電位的晶片為從檢測晶片,第一電位和第二電位不同。本實施例中,主檢測晶片的M/S引腳接收電源電位,從檢測晶片的M/S引腳接地。在其它實施方式中,也可以主檢測晶片的M/S引腳接地,從檢測晶片的M/S引腳接電源電位。亦或,主檢測晶片和從檢測晶片的M/S引腳接不同電位即可。需要說明的是,本創作實施例並不對第一電位和第二電位的具體類型進行區分,只要兩個電位不相同,能夠對主檢測晶片和從檢測晶片進行區別,即屬於本創作實施例的保護範圍。The main detection chip and the slave detection chip respectively include potential pins (marked with M/S in the figure), the chip defining the potential pin to receive the first potential is the main detection chip, and the chip defining the potential pin to receive the second potential is From the detection wafer, the first potential and the second potential are different. In this embodiment, the M/S pin of the master inspection chip receives the power supply potential, and the M/S pin of the slave inspection chip is grounded. In other embodiments, the M/S pin of the main detection chip may be grounded, and the M/S pin of the secondary detection chip may be connected to a power supply potential. Alternatively, the M/S pins of the master inspection chip and the slave inspection chip may be connected to different potentials. It should be noted that this authoring embodiment does not distinguish between the specific types of the first potential and the second potential, as long as the two potentials are not the same, it is possible to distinguish the master detection wafer from the slave detection wafer, which belongs to the authoring embodiment protected range.
進一步,請參考圖2,主檢測晶片設置有啟動信號輸出引腳和時鐘信號輸出引腳,從檢測晶片設置有啟動信號輸入引腳和時鐘信號輸入引腳;主檢測晶片的啟動信號輸出引腳連接從檢測晶片的啟動信號輸入引腳,以使得主檢測晶片控制從檢測晶片啟動觸控檢測;主檢測晶片的時鐘信號輸出引腳連接從檢測晶片的時鐘信號輸入引腳,以使得主檢測晶片控制從檢測晶片以相同的頻率進行觸控檢測。Further, please refer to FIG. 2, the main detection chip is provided with a start signal output pin and a clock signal output pin, and the slave detection chip is provided with a start signal input pin and a clock signal input pin; the main detection chip has a start signal output pin Connect the start signal input pin of the slave detection chip to make the master detection chip control the touch detection of the slave detection chip; the clock signal output pin of the master detection chip is connected to the clock signal input pin of the slave detection chip to make the master detection chip Control the touch detection at the same frequency from the detection wafer.
圖2所示實施例中,主檢測晶片通過啟動信號輸出引腳和時鐘信號輸出引腳向從檢測晶片發送時鐘信號100和啟動信號200,驅動從檢測晶片獲取觸控式螢幕的觸摸信號,從而實現主檢測晶片和從檢測晶片的同步工作,保證了多檢測晶片的協同工作,同時,由於觸控式螢幕的屏體上不同檢測電極之間是有寄生電容存在的,主檢測晶片與從檢測晶片同步工作的方式可以避免屏體內不同區域電極檢測不同步帶來的相互干擾而引入噪聲,提升了檢測精準度。In the embodiment shown in FIG. 2, the master detection chip sends the
當觸控式螢幕面積增大時,可以相應地增加從檢測晶片的數量。以圖3為例,為適應更大尺寸觸控式螢幕的工作需求,設置了兩個從檢測晶片,分別即為第一從檢測晶片和第二從檢測晶片,其中,該第一從檢測晶片設置在主檢測晶片的一側,該第二從檢測晶片設置在主檢測晶片的另一側,第一從檢測晶片和第二從檢測晶片分別對觸控式螢幕的不同區域進行觸控檢測。圖3所示實施例中,主檢測晶片設置有兩個同步的啟動信號輸出引腳和兩個同步的時鐘信號輸出引腳,各個從檢測晶片均設置有一個啟動信號輸入引腳和一個時鐘信號輸入引腳;從檢測晶片的啟動信號輸入引腳連接主檢測晶片的其中一個啟動信號輸出引腳,以接收主檢測晶片發出的啟動信號200,使得主檢測晶片控制從檢測晶片同步啟動觸控檢測;從檢測晶片的時鐘信號輸入引腳連接主檢測晶片的其中一個時鐘信號輸出引腳,以接收主檢測晶片發出的時鐘信號100,使得主檢測晶片控制從檢測晶片以相同的頻率進行觸控檢測。一顆主檢測晶片和兩顆從檢測晶片組合同步工作,協同進行觸控式螢幕檢測。When the area of the touch screen increases, the number of slave chips can be increased accordingly. Taking FIG. 3 as an example, in order to meet the working requirements of a larger-sized touch screen, two slave detection chips are provided, namely a first slave detection chip and a second slave detection chip, wherein the first slave detection chip The second slave detection chip is provided on one side of the master detection chip, and the second slave detection chip is provided on the other side of the master detection chip. The first slave detection chip and the second slave detection chip respectively perform touch detection on different areas of the touch screen. In the embodiment shown in FIG. 3, the master detection chip is provided with two synchronized start signal output pins and two synchronized clock signal output pins, and each slave detection chip is provided with a start signal input pin and a clock signal Input pin; the start signal input pin of the slave detection chip is connected to one of the start signal output pins of the master detection chip to receive the start signal 200 from the master detection chip, so that the master detection chip controls the slave detection chip to initiate touch detection simultaneously ; The clock signal input pin of the slave inspection wafer is connected to one of the clock signal output pins of the master inspection wafer to receive the
需要說明的是,本創作創造的從檢測晶片不限於以上列舉的1個或2個,還可以是其它數量。It should be noted that the secondary detection wafers created in this creation are not limited to the one or two listed above, but may be other quantities.
但創作人發現,在上述實施方案中,如果主檢測晶片直接發送時鐘信號和啟動信號給從檢測晶片,由於走線上的延遲,就會存在主檢測晶片比從檢測晶片稍微早一點開始檢測的情況,無法做到精確的同步,針對這一問題,本實施例提供了一種解決方案,為便於理解,請參閱圖4,以下對此方案進行詳細說明。However, the author found that in the above embodiment, if the master inspection wafer directly sends the clock signal and the start signal to the slave inspection wafer, there may be a situation where the master inspection wafer starts to be inspected slightly earlier than the slave inspection wafer due to the delay of the wiring It is impossible to achieve accurate synchronization. To solve this problem, this embodiment provides a solution. For ease of understanding, please refer to FIG. 4, and this solution will be described in detail below.
如圖4所示,主檢測晶片和從檢測晶片各自分別設置有啟動信號輸出引腳、啟動信號輸入引腳、時鐘信號輸出引腳和時鐘信號輸入引腳;為便於區分,圖4中針對主檢測晶片和從檢測晶片相同功能的引腳採用不同的標示,對應如下:主檢測晶片啟動信號輸出引腳Start1 out、啟動信號輸入引腳Start1 in、時鐘信號輸出引腳CLK1 out和時鐘信號輸入引腳CLK1 in; 從檢測晶片啟動信號輸出引腳Start2 out、啟動信號輸入引腳Start2 in、時鐘信號輸出引腳CLK2 out和時鐘信號輸入引腳CLK2 in。As shown in FIG. 4, the main detection chip and the slave detection chip are respectively provided with a start signal output pin, a start signal input pin, a clock signal output pin, and a clock signal input pin; The pins of the same function of the detection chip and the slave detection chip are marked differently, corresponding to the following: the main detection chip start signal output pin Start1 out, the start signal input pin Start1 in, the clock signal output pin CLK1 out and the clock signal input pin Pin CLK1 in; Start signal output pin Start2 out, start signal input pin Start2 in, start signal input pin CLK2 out and clock signal input pin CLK2 in from the detection chip.
其中,主檢測晶片的啟動信號輸出引腳Start1 out連接到主檢測晶片和相鄰的從檢測晶片的中間區域,並分別連接主檢測晶片的啟動信號輸入引腳Start1 in和從檢測晶片的啟動信號輸入引腳Start2 in,從而主檢測晶片輸出的啟動信號220可以轉換成啟動信號210發送給引腳Start1 in和引腳Start2 in;進一步地,主檢測晶片的時鐘信號輸出引腳CLK1 out連接到主檢測晶片和相鄰的從檢測晶片的中間區域,並分別連接主檢測晶片的時鐘信號輸入引腳CLK1 in和從檢測晶片的時鐘信號輸入引腳CLK2 in,從而主檢測晶片輸出的時鐘信號120可以轉換成時鐘信號110發送給引腳CLK1 in和引腳CLK2 in;本實施例通過將主檢測晶片初始輸出的啟動信號220和時鐘信號120在相鄰兩個主從晶片中間位置進行轉換後再同時輸入給主從晶片,因中間位置和主、從檢測晶片的距離相同,所以克服距離原因造成的信號接收存在先後的問題,進而實現主從檢測晶片接收到的啟動信號和時鐘信號高度同步。Among them, the start signal output pin Start1 out of the main detection wafer is connected to the middle area of the main detection wafer and the adjacent slave detection wafer, and respectively connected to the start signal input pin Start1 in of the main detection wafer and the start signal of the slave detection wafer Input the pin Start2 in, so that the start signal 220 output by the main detection chip can be converted into a start signal 210 and sent to the pins Start1 in and Start2 in; further, the clock signal output pin CLK1 out of the main detection chip is connected to the main The middle area of the inspection wafer and the adjacent slave inspection wafer, and connect the clock signal input pin CLK1 in of the master inspection wafer and the clock signal input pin CLK2 in of the slave inspection wafer respectively, so that the clock signal 120 output by the master inspection wafer can be Converted into a clock signal 110 and sent to the pin CLK1 in and pin CLK2 in; in this embodiment, the start signal 220 and the clock signal 120 initially output by the master detection wafer are converted at the middle position of the adjacent two master and slave wafers, and then simultaneously Input to the master-slave wafer, because the intermediate position is the same as the distance between the master and slave detection wafers, so overcoming the problem of signal reception caused by the distance, there is a high degree of synchronization between the start signal and the clock signal received by the master-slave detection wafer.
引腳Start1 out和中間位置、中間位置和引腳Start1 in及引腳Start2 in的連接;引腳CLK1 out和中間位置、中間位置和引腳CLK1 in及引腳CLK2 in的連接均可採用外圍線路(即非集成在IC內部的線路)實現。The connection between the pin Start1 out and the middle position, the middle position and the pin Start1 in and the pin Start2 in; the connection between the pin CLK1 out and the middle position, the middle position and the pin CLK1 in and the pin CLK2 in can use the peripheral circuit (That is, a circuit that is not integrated within the IC).
由於主檢測晶片的結構與從檢測晶片的結構完全相同,因此從檢測晶片上也設置有時鐘信號輸出引腳CLK2 out和啟動信號輸出引腳Start2 out,但由於從檢測晶片是在主檢測的路的主導下工作,僅僅接收而並不發送時鐘信號和啟動信號,因此CLK2 out和Start2 out並不工作。Since the structure of the master inspection wafer is exactly the same as the structure of the slave inspection wafer, the slave inspection wafer is also provided with a clock signal output pin CLK2 out and a start signal output pin Start2 out, but since the slave inspection wafer is in the path of the master inspection Work under the leadership of the ,only receive but not send the clock signal and start signal, so CLK2 out and Start2 out do not work.
創作人進一步發現,上述晶片在實際產品中,一般檢測晶片內部的時鐘信號速度都比較快,而外圍線路主要以印製電路板(printed circuit board,PCB)實現,PCB上由於負載比較大,很難傳輸高速信號,如果主檢測晶片直接輸出高速的時鐘信號,信號可能會失真,導致主檢測晶片或從檢測晶片收到的時鐘信號異常而無法正常進行觸控檢測。針對此問題,本創作實施例提出了相應的解決方案,主檢測晶片和從檢測晶片分別設置有升頻模組,用於將主檢測晶片和從檢測晶片各自的時鐘信號輸入引腳接收到的時鐘信號進行頻率提升,主檢測晶片和從檢測晶片分別以提升後頻率進行觸控檢測。The creator further found that in the actual products of the above-mentioned chips, the clock signal speed inside the chip is generally detected to be relatively fast, and the peripheral circuits are mainly realized by printed circuit boards (printed circuit boards, PCBs). It is difficult to transmit high-speed signals. If the main inspection chip directly outputs a high-speed clock signal, the signal may be distorted, causing the clock signal received by the main inspection chip or the slave inspection chip to be abnormal and unable to perform touch detection normally. In response to this problem, this creative embodiment proposes a corresponding solution. The master detection chip and the slave detection chip are respectively provided with up-conversion modules for receiving the clock signal input pins of the master detection chip and the slave detection chip. The frequency of the clock signal is increased, and the master detection chip and the slave detection chip respectively perform touch detection at the increased frequency.
為便於理解,請參閱圖5,以下結合圖5對該方案做具體說明。本實施例中,主從檢測晶片的升頻模組均採用鎖相環(phase locked loop,PLL),並分別以PLL1和PLL2進行標示。具體工作時,主從檢測晶片各自還設置有微控制單元MCU,並分別以MCU1和MCU2進行標示。主檢測晶片輸出一個低速時鐘信號,轉換後再分別送給引腳CLK1 in及引腳CLK2 in後,各自經過PLL1和PLL2進行升頻,得到高速時鐘信號,主從晶片的MCU再用這一高速時鐘來控制觸控檢測。因為引腳CLK1 in及引腳CLK2 in接收到的時鐘信號是同步的,所以主從晶片的鎖相環收到的低速時鐘信號是相同的,那麼經PLL1和PLL2產生的高速時鐘信號也是相同的,即主從晶片用於觸控檢測的時鐘信號是同頻、同相。但本創作創造的升頻模組除了鎖相環外,還可以是其他用於提升時鐘信號頻率的電路或電子器件,對此本創作實施例並不進行限定。For ease of understanding, please refer to FIG. 5, and the solution will be described in detail in conjunction with FIG. 5 below. In this embodiment, the frequency-up modules of the master-slave detection chips all use a phase locked loop (PLL), and are labeled with PLL1 and PLL2, respectively. During specific work, the master-slave detection wafers are each also provided with a micro-control unit MCU, and are marked with MCU1 and MCU2 respectively. The master detection chip outputs a low-speed clock signal. After conversion, it is sent to the pin CLK1 in and the pin CLK2 in respectively, and then up-converted through PLL1 and PLL2 respectively to obtain a high-speed clock signal. Clock to control touch detection. Because the clock signals received at pins CLK1 in and CLK2 in are synchronous, the low-speed clock signals received by the master and slave PLLs are the same, so the high-speed clock signals generated by PLL1 and PLL2 are also the same That is, the clock signals used for touch detection by the master and slave chips are of the same frequency and same phase. However, in addition to the phase-locked loop, the up-conversion module created in this creation may also be other circuits or electronic devices for increasing the frequency of the clock signal, and this embodiment of the creation is not limited.
首選地,在上述方案中,一個主檢測晶片與兩個從檢測晶片配合工作,能夠實現當前常用終端設備中大部分觸控式螢幕的檢測,其中主檢測晶片的數量為一個,從檢測晶片的數量為兩個,該兩個從檢測晶片分別設置在主檢測晶片的兩側,具體設置方式可以是上述主檢測晶片與從檢測晶片連接方式中的任意一種,此處不再贅述。Preferably, in the above solution, one master detection chip and two slave detection chips work together to realize the detection of most touch screens in current commonly used terminal devices, where the number of master detection chips is one, and the number of slave detection chips The number is two, and the two slave inspection wafers are respectively disposed on both sides of the master inspection wafer. The specific setting method may be any one of the above-mentioned connection methods of the master inspection wafer and the slave inspection wafer, which will not be repeated here.
主從檢測晶片組合接收到啟動信號後,開始對各自對應區域內的觸控電極進行觸摸檢測,其時鐘信號、啟動信號和電極上檢測信號的時序關係包括:1、主檢測晶片和從檢測晶片接收到啟動信號後執行一幀觸控檢測;或者,2、主檢測晶片和從檢測晶片接收到啟動信號後執行兩幀以上觸控檢測;或者,3、主檢測晶片和從檢測晶片在接收到兩個以上啟動信號後完成一幀觸控檢測。為便於理解,以下結合圖式對此三種方法進行詳細說明。After receiving the start signal from the master-slave detection chip combination, it starts to perform touch detection on the touch electrodes in their corresponding areas. The timing relationship between the clock signal, the start signal and the detection signal on the electrode includes: 1. The master detection chip and the slave detection chip Perform a frame of touch detection after receiving the start signal; or, 2. The main detection chip and the slave detection chip perform two or more touch detections after receiving the start signal; or, 3. The main detection chip and the slave detection chip receive After more than two start signals, a frame of touch detection is completed. For ease of understanding, the three methods are described in detail below with reference to the drawings.
1、主檢測晶片和從檢測晶片接收到啟動信號後執行一幀觸控檢測。1. The master detection chip and the slave detection chip perform a frame of touch detection after receiving the start signal.
如圖6所示,啟動信號脈衝到來後,主從檢測晶片開始對各自對應的觸控電極進行觸摸檢測,且每次啟動信號後啟動一幀觸摸檢測,每幀觸摸檢測結束後(或結束一段時間後),主檢測晶片再次輸出一個脈衝的啟動信號,主從檢測晶片再次對觸控電極進行觸摸檢測。啟動信號的頻率取決於所需觸摸檢測幀率,比如60Hz或者120Hz。該啟動信號的具體發送方式與上述相同,此處不再贅述。As shown in FIG. 6, after the start signal pulse arrives, the master-slave detection wafer starts to perform touch detection on the corresponding touch electrodes, and each time the start signal starts a frame of touch detection, after each frame of touch detection ends (or ends a period After time), the master detection wafer outputs a pulse start signal again, and the master-slave detection wafer again performs touch detection on the touch electrodes. The frequency of the activation signal depends on the desired touch detection frame rate, such as 60 Hz or 120 Hz. The specific sending method of the start signal is the same as the above, and will not be repeated here.
2、主檢測晶片和從檢測晶片接收到啟動信號後執行兩幀以上觸控檢測。2. The master detection chip and the slave detection chip perform touch detection over two frames after receiving the start signal.
請參考圖7,啟動信號脈衝到來後,主從檢測晶片開始對各自對應的觸控電極進行觸摸檢測,且每次啟動信號後啟動兩幀(其它實施方式中也可以多於兩幀)觸摸檢測,這兩幀或者多幀之間,觸摸檢測方式和參數可能是完全相同的,也可能是不同的,比如信號驅動頻率不同,或者一次自電容檢測,一次互電容檢測。上述兩幀或者多幀觸摸檢測後(或結束一段時間後),主檢測晶片再次輸出一個脈衝的啟動信號,主從檢測晶片再次對觸控電極進行觸摸檢測。啟動信號的頻率取決於觸摸檢測幀率,比如60Hz或者120Hz。Please refer to FIG. 7, after the start signal pulse arrives, the master-slave detection chip starts to perform touch detection on the corresponding touch electrodes, and each start signal starts two frames (in other embodiments, it may be more than two frames) touch detection Between these two frames or multiple frames, the touch detection method and parameters may be the same or different, such as different signal driving frequencies, or one self-capacitance detection and one mutual capacitance detection. After the above two or more frames of touch detection (or after a period of time), the master detection wafer outputs a pulse start signal again, and the master and slave detection wafers again perform touch detection on the touch electrodes. The frequency of the activation signal depends on the touch detection frame rate, such as 60 Hz or 120 Hz.
3、主檢測晶片和從檢測晶片在接收到兩個以上啟動信號後完成一幀觸控檢測。3. The master detection chip and the slave detection chip complete a frame of touch detection after receiving more than two activation signals.
請參考圖8,這種方案和前兩種方案的主要區別是,一幀觸摸偵測需要分幾次來完成,每次都需要一個啟動信號脈衝來啟動,因此每個完整的觸摸偵測週期中,會有多個啟動信號脈衝,脈衝信號也可能會是非均勻的。假設觸摸檢測幀率是60Hz,對應完整觸摸偵測週期是16.7ms,每16.7ms就會出現均勻或非均勻的多個啟動信號脈衝,且未必每個啟動脈衝後都會執行觸摸偵測。Please refer to Figure 8. The main difference between this solution and the previous two solutions is that a frame of touch detection needs to be completed several times, each time requires a start signal pulse to start, so each complete touch detection cycle There will be multiple start signal pulses, and the pulse signal may also be non-uniform. Assuming that the touch detection frame rate is 60 Hz, and the corresponding full touch detection period is 16.7 ms, multiple start signal pulses, uniform or non-uniform, appear every 16.7 ms, and touch detection may not be performed after each start pulse.
本創作實施例還提供了一種終端設備,該終端設備包括:觸控式螢幕和觸控式螢幕檢測晶片組合,該觸控式螢幕檢測晶片組合可以為上述圖2至圖8任意一種實施方式所述的觸控式螢幕檢測晶片組合。This creative embodiment also provides a terminal device. The terminal device includes: a touch screen and a touch screen detection chip combination. The touch screen detection chip combination may be any of the above-mentioned embodiments shown in FIG. 2 to FIG. 8. The touch screen detection chip combination described above.
在本創作所提供的幾個實施例中,應該理解到,所揭露的晶片和電路,可以通過其它的方式實現。例如,以上所描述的裝置實施例僅僅是示意性的,例如,所述電路的劃分,僅僅為一種邏輯功能劃分,實際實現時可以有另外的劃分方式,例如多個電路或組件可以結合或者可以集成到另一個系統,或一些特徵可以忽略,或不執行。另一點,所顯示或討論的相互之間的耦合或直接耦合或通信連接可以是通過一些介面,裝置或電路的間接耦合或通信連接,可以是電性,機械或其它的形式。In the several embodiments provided in this creation, it should be understood that the disclosed chips and circuits may be implemented in other ways. For example, the device embodiments described above are only schematic. For example, the division of the circuit is only a logical function division. In actual implementation, there may be another division manner, for example, multiple circuits or components may be combined or may Integration into another system, or some features can be ignored, or not implemented. In addition, the displayed or discussed mutual coupling or direct coupling or communication connection may be an indirect coupling or communication connection through some interfaces, devices, or circuits, and may be in electrical, mechanical, or other forms.
所述作為分離部件說明的電路可以是或者也可以不是物理上分開的,作為電路顯示的部件可以是或者也可以不是物理電路,即可以位於一個地方,或者也可以分佈到多個網路電路上。可以根據實際的需要選擇其中的部分或者全部電路來實現本實施例方案的目的。The circuit described as a separate component may or may not be physically separated, and the component displayed as a circuit may or may not be a physical circuit, that is, it may be located in one place, or may be distributed on multiple network circuits . A part or all of the circuits may be selected according to actual needs to achieve the purpose of the solution of this embodiment.
在本創作實施例中使用的術語是僅僅出於描述特定實施例的目的,而非旨在限制本創作。在本創作實施例和所附實施例書中所使用的單數形式的“一種”、“所述”和“該”也旨在包括多數形式,除非上下文清楚地表示其他含義。本創作中字符“/”,一般表示前後關聯對象是一種“或”的關係。The terminology used in this authoring embodiment is for the purpose of describing particular embodiments only, and is not intended to limit this authoring. The singular forms "a", "said", and "the" used in this creative embodiment and the accompanying embodiment books are also intended to include most forms unless the context clearly indicates other meanings. The character "/" in this composition generally indicates that the related objects are a "or" relationship.
以上對本創作實施例所提供的觸控式螢幕檢測晶片組合及終端設備進行了詳細介紹,本文中應用了具體個例對本創作的原理及實施方式進行了闡述,以上實施例的說明只是用於幫助理解本創作的方法及其核心思想;同時,對於本領域的一般技術人員,依據本創作的思想,在具體實施方式及應用範圍上均會有改變之處,綜上所述,本說明書內容不應理解為對本創作的限制。The touch screen detection chip combination and the terminal device provided by the authoring embodiment are described in detail above. Specific examples are used in this article to explain the principle and implementation of the authoring. The descriptions of the above embodiments are only for help Understand the method and core idea of this creation; meanwhile, for those of ordinary skill in the art, according to the idea of this creation, there will be changes in the specific implementation and application scope. In summary, the content of this manual is not It should be understood as a limitation on this creation.
100‧‧‧時鐘信號 110‧‧‧時鐘信號 120‧‧‧時鐘信號 200‧‧‧啟動信號 210‧‧‧啟動信號 220‧‧‧啟動信號100‧‧‧clock signal 110‧‧‧clock signal 120‧‧‧clock signal 200‧‧‧Start signal 210‧‧‧Start signal 220‧‧‧Start signal
圖1為現有技術中不同尺寸的觸控式螢幕與觸控式螢幕檢測晶片連接的示意圖; 圖2為本創作實施例中觸控式螢幕檢測晶片組合的一實施例示意圖; 圖3為本創作實施例中觸控式螢幕檢測晶片組合的另一實施例示意圖; 圖4為本創作實施例中觸控式螢幕檢測晶片組合的另一實施例示意圖; 圖5為本創作實施例中觸控式螢幕檢測晶片組合的另一實施例示意圖; 圖6為本創作實施例觸控式螢幕檢測晶片組合中一種信號發送方式的示意圖; 圖7為本創作實施例觸控式螢幕檢測晶片組合中另一種信號發送方式的示意圖;以及 圖8為本創作實施例觸控式螢幕檢測晶片組合中另一種信號發送方式的示意圖。 1 is a schematic diagram of the connection between touch screens of different sizes and touch screen detection chips in the prior art; FIG. 2 is a schematic diagram of an embodiment of a touch screen detection chip combination in the creative embodiment; FIG. 3 is a schematic diagram of another embodiment of the touch screen detection chip combination in the creative embodiment; FIG. 4 is a schematic diagram of another embodiment of the touch screen detection chip combination in the creative embodiment; FIG. FIG. 5 is a schematic diagram of another embodiment of the touch screen detection chip combination in the creative embodiment; FIG. 6 is a schematic diagram of a signal transmission method in a touch screen detection chip combination in an embodiment of the invention; 7 is a schematic diagram of another signal transmission method in the touch screen detection chip combination of the creative embodiment; and FIG. 8 is a schematic diagram of another signal transmission method in the touch screen detection chip combination of the creative embodiment.
100‧‧‧時鐘信號 100‧‧‧clock signal
200‧‧‧啟動信號 200‧‧‧Start signal
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