TWM590269U - Touch screen detection chip assembly and terminal device - Google Patents

Abstract

This creation discloses a touch screen inspection chip combination, including a master inspection chip and a slave inspection chip; wherein the master inspection chip and the slave inspection chip are used to process touch signals in different areas of the same touch screen; and the master inspection chip and The slave detection chip is connected, and the master detection chip controls the slave detection chip to process the touch signals of the touch screen; this creative embodiment also provides a terminal device. During the work process, the master detection chip is used to obtain the first area of the touch screen The touch signal is used to acquire the touch signal outside the first area of the touch screen from the detection chip, so as to realize the touch signal processing of all the touch sensitive areas of the touch screen. The master detection chip is connected to the slave detection chip, and the master detection chip controls the slave detection chip to process the touch signals of the touch screen synchronously, so that the combination method of detecting the chip through the touch screen without changing the structure of the touch detection chip To adapt to different sizes of touch screens, reduce costs and improve compatibility.

Description

Touch screen detection chip combination and terminal equipment

This creation relates to the field of electronic equipment, in particular to a touch screen detection chip combination and terminal equipment.

With the rise of smart terminal devices such as smartphones and tablets, touch screens are becoming more and more widely used. According to this application requirement, many touch screen inspection chips have also appeared on the market. As shown in FIG. 1, different touch screen detection chips (integrated circuits, ICs) are used in the current market for touch detection according to the size of the touch screen. According to the size of the human hand, the general touch screen is divided into a plurality of 5mm*5mm square areas for independent detection. The larger the screen, the more the above divided areas, the more detection electrodes, corresponding The more the number of channels required for the touch screen detection chip. As shown in FIG. 1 of the specification, the size of the left touch screen is smaller than that of the right touch screen, then the left side uses a touch screen detection chip with fewer detection channels than the right side to complete touch detection. The difference in the number of detection channels determines the area of the wafer, which also determines the cost of the product. With the larger and larger touch display screens on the market, if all touch detection functions are performed by one IC, an IC with a very large area is required. Moreover, the difficulty, cycle and cost of IC development are very high. In order to support different sizes of screens, different touch detection chips need to be designed, which requires a lot of manpower, material resources and time. In addition, when the chip is large to a certain extent After that, the difficulty of internal timing design will increase significantly, and the production yield will decrease significantly.

Of course, considering the compatibility issue, it is also possible to use a chip with more channels for a small-sized screen body, but this causes the result of a "large horse-drawn cart", which is relatively wasteful.

The above technical problems in the prior art need to be improved.

The purpose of this creation is to provide a touch screen detection chip combination, which can enable multiple touch screen detection chips to work together through a cascade structure to jointly perform touch detection on a large-size touch screen.

Another purpose of this creation is to provide a terminal device that uses the aforementioned touch screen detection chip combination.

In view of this, the first aspect of the present creation provides a touch screen inspection chip combination, including a master inspection chip and a slave inspection chip; wherein the master inspection chip and the slave inspection chip are used to process touch signals from different areas of the same touch screen ; And the main detection chip is connected to the slave detection chip, the master detection chip controls the slave detection chip to process the touch signal of the touch screen.

With reference to the first aspect above, in a first possible implementation manner, the master detection chip and the slave detection chip are respectively provided with a potential pin and a second pin, the potential pin receives the first potential, and the second pin receives the second Potential, the first potential is different from the second potential. With reference to the first possible implementation manner of the first aspect above, in a second possible implementation manner, the first potential is a power supply potential and the second potential is a ground potential; or the first potential is a ground potential and the second potential is a power supply Potential.

With reference to the first possible implementation manner of the first aspect above, in a third possible implementation manner, the master detection chip is provided with a start signal output pin and a clock signal output pin, and the slave detection chip is provided with a start signal input pin And clock signal input pin; the start signal output pin of the master detection chip is connected to the start signal input pin of the slave detection chip, so that the master detection chip controls the slave detection chip to start touch detection; the clock signal output pin of the master detection chip Connect the clock signal input pin of the slave inspection wafer, so that the master inspection wafer controls the slave inspection wafer to perform touch detection at the same frequency.

With reference to the third possible implementation manner of the first aspect above, in a fourth possible implementation manner, the number of master inspection wafers is one, and the number of slave inspection wafers is multiple; the master inspection wafer is provided with multiple synchronized startups Signal output pins and multiple synchronized clock signal output pins, multiple slave detection chips are each provided with a start signal input pin and a clock signal input pin; the start signal input pins of each slave detection chip are respectively connected to the master A start signal output pin of the detection chip, and the clock signal input pins of each slave detection chip are respectively connected to a clock signal output pin of the main detection chip.

With reference to the first possible implementation manner of the first aspect above, in a fifth possible implementation manner, the master detection chip and the slave detection chip are respectively provided with a start signal output pin, a start signal input pin, and a clock signal output lead Pin and clock signal input pin; the start signal output pin of the master detection chip is connected to the middle area of the master detection chip and the adjacent slave detection chip, and respectively connected to the respective start signal input pins of the master detection chip and the slave detection chip , The master detection chip and the slave detection chip start the touch detection after receiving the start signal; the clock signal output pin of the master detection chip is connected to the middle area of the master detection chip and the adjacent slave detection chip, and the master detection chip and The clock signal input pins of the slave detection wafers, and the master detection wafer and the slave detection wafers perform touch detection at the same frequency after receiving the clock signals.

With reference to the fifth possible implementation manner of the first aspect described above, in a sixth possible implementation manner, the master detection chip and the slave detection chip are respectively provided with up-conversion modules, which are used to separate the master detection chip and the slave detection chip. The clock signal received by the clock signal input pin is increased in frequency, and the master detection chip and the slave detection chip respectively perform touch detection at the increased frequency.

With reference to the fourth or fifth possible implementation manners of the first aspect above, in a seventh possible implementation manner, the number of master inspection wafers is one and the number of slave inspection wafers is two, and the two slave inspection wafers are respectively Set on both sides of the main inspection wafer.

With reference to the third or fifth possible implementation manners of the first aspect above, in an eighth possible implementation manner, the master detection chip and the slave detection chip perform a frame of touch detection after receiving a start signal; or the main detection chip and After receiving the activation signal from the detection chip, perform more than two frames of touch detection; or the master detection chip and the slave detection chip complete one frame of touch detection after receiving more than two activation signals.

A second aspect of the present invention provides a terminal device. The terminal device includes: a touch screen and a touch screen detection chip combination. The touch screen detection chip combination includes the first aspect described above or any one of the first to eighth aspects A possible implementation of the touch screen detection chip combination.

As can be seen from the above technical solutions, this creative embodiment has the following advantages:

In this creative embodiment, the touch screen detection chip combination includes a master detection chip and a slave detection chip; wherein the master detection chip and the slave detection chip are used to process touch signals from different areas of the same touch screen; and the master detection chip and The slave detection chip is connected, and the master detection chip controls the slave detection chip to process the touch signals of the touch screen; this creative embodiment also provides a terminal device. During the work process, the master detection chip is used to obtain the first area of the touch screen The touch signal is used to acquire the touch signal outside the first area of the touch screen from the detection chip, so as to realize the touch signal processing of all the touch sensitive areas of the touch screen. The master detection chip is connected to the slave detection chip, and the master detection chip controls the slave detection chip to process the touch signals of the touch screen synchronously, so that the combination method of detecting the chip through the touch screen without changing the structure of the touch detection chip To adapt to different sizes of touch screens, reduce costs and improve compatibility.

In order to enable those skilled in the art to better understand the creative solution, the technical solution in the creative embodiment will be described clearly and completely in conjunction with the drawings in the creative embodiment. Obviously, the described embodiment is only This is an example of a part of this creation, not all of it. Based on the embodiments in this creation, all other embodiments obtained by those of ordinary skill in the art without creative work shall fall within the scope of protection of this creation.

The description of this creation and the scope of patent application and the terms "first", "second", "third", "fourth", etc. (if any) in the above drawings are used to distinguish similar items, not necessarily Describe a specific order or sequence. It should be understood that the data used in this way can be interchanged under appropriate circumstances so that the embodiments described herein can be implemented in an order other than what is illustrated or described herein. In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusions, for example, processes, methods, systems, products or devices that contain a series of steps or units need not be limited to those clearly listed Which steps or units may include other steps or units that are not explicitly listed or inherent to these processes, methods, products or equipment.

This embodiment provides a touch screen detection chip combination and a terminal device, which can realize compatibility of touch screen bodies of different sizes and reduce costs. Multiple ICs are used for combination work to complete touch detection of large-size screens. Any single IC in the touch screen detection chip combination can also complete touch detection of small-size screens.

For ease of understanding, the following describes the specific implementation manner in this creative embodiment, please refer to FIG. 2.

As shown in FIG. 2, the touch screen inspection chip combination in this creative embodiment includes a master inspection chip and a slave inspection chip; wherein, the master inspection chip and the slave inspection chip are used to process touches in different areas of the same touch screen Signal; and the main detection chip is connected to the slave detection chip, the master detection chip controls the slave detection chip to process the touch signal of the touch screen. The master inspection wafer and the slave inspection wafer may be implemented in the form of an integrated circuit (IC) wafer.

In this embodiment, there is no difference in the function setting between the master detection wafer and the slave detection wafer in the non-working state, and the master or slave wafer functions can be realized during combined work only by corresponding configuration. That is, the same touch detection chip can be set to realize the function of the main detection chip, and can also be set to realize the function of the slave detection chip. When multiple touch screen detection chips form a combined state, one touch screen detection chip dominates the touch detection process. The touch screen detection chip is the master detection chip, and the rest The touch screen inspection chip is a slave inspection chip (Slave). In the working process, the master detection chip is used to obtain the touch signal of the first area of the touch screen, and the slave detection chip is used to obtain the touch signal outside the first area of the touch screen, so as to realize all the touch sensitive areas of the touch screen Touch signal processing. The master detection chip and the slave detection chip are connected, and the master detection chip controls the slave detection chip to simultaneously process the touch signals of the touch screen.

In this embodiment, without changing the structure of the touch detection chip, a combination of touch screen detection chips is used to adapt to different sizes of touch screens.

However, since the main inspection wafer is the inspection wafer that controls the inspection process, the number of main inspection wafers is always only one, and the system of the terminal device (mobile phone, tablet, computer, etc.) only communicates with the main inspection wafer. Send the initial code (initialization code), FireWare (firmware), and display data for each frame, etc.; after the touch scan is completed from the detection chip, the touch raw data is sent to the main detection chip, and then the main detection chip Unified to do touch judgment, coordinate calculation, etc., and finally reported to the system.

The main detection chip and the slave detection chip respectively include potential pins (marked with M/S in the figure), the chip defining the potential pin to receive the first potential is the main detection chip, and the chip defining the potential pin to receive the second potential is From the detection wafer, the first potential and the second potential are different. In this embodiment, the M/S pin of the master inspection chip receives the power supply potential, and the M/S pin of the slave inspection chip is grounded. In other embodiments, the M/S pin of the main detection chip may be grounded, and the M/S pin of the secondary detection chip may be connected to a power supply potential. Alternatively, the M/S pins of the master inspection chip and the slave inspection chip may be connected to different potentials. It should be noted that this authoring embodiment does not distinguish between the specific types of the first potential and the second potential, as long as the two potentials are not the same, it is possible to distinguish the master detection wafer from the slave detection wafer, which belongs to the authoring embodiment protected range.

Further, please refer to FIG. 2, the main detection chip is provided with a start signal output pin and a clock signal output pin, and the slave detection chip is provided with a start signal input pin and a clock signal input pin; the main detection chip has a start signal output pin Connect the start signal input pin of the slave detection chip to make the master detection chip control the touch detection of the slave detection chip; the clock signal output pin of the master detection chip is connected to the clock signal input pin of the slave detection chip to make the master detection chip Control the touch detection at the same frequency from the detection wafer.

In the embodiment shown in FIG. 2, the master detection chip sends the clock signal 100 and the start signal 200 to the slave detection chip through the start signal output pin and the clock signal output pin to drive the slave detection chip to obtain the touch signal of the touch screen, thereby The synchronous work of the master detection chip and the slave detection chip is realized to ensure the cooperative work of multiple detection chips. At the same time, because there is parasitic capacitance between different detection electrodes on the screen of the touch screen, the master detection chip and the slave detection chip The synchronous working mode of the chip can avoid the mutual interference caused by the asynchronous detection of electrodes in different regions of the screen and introduce noise, which improves the detection accuracy.

When the area of the touch screen increases, the number of slave chips can be increased accordingly. Taking FIG. 3 as an example, in order to meet the working requirements of a larger-sized touch screen, two slave detection chips are provided, namely a first slave detection chip and a second slave detection chip, wherein the first slave detection chip The second slave detection chip is provided on one side of the master detection chip, and the second slave detection chip is provided on the other side of the master detection chip. The first slave detection chip and the second slave detection chip respectively perform touch detection on different areas of the touch screen. In the embodiment shown in FIG. 3, the master detection chip is provided with two synchronized start signal output pins and two synchronized clock signal output pins, and each slave detection chip is provided with a start signal input pin and a clock signal Input pin; the start signal input pin of the slave detection chip is connected to one of the start signal output pins of the master detection chip to receive the start signal 200 from the master detection chip, so that the master detection chip controls the slave detection chip to initiate touch detection simultaneously ; The clock signal input pin of the slave inspection wafer is connected to one of the clock signal output pins of the master inspection wafer to receive the clock signal 100 from the master inspection wafer, so that the master inspection wafer controls the slave inspection wafer to perform touch detection at the same frequency . One master detection chip and two slave detection chips work in synchronism to coordinate touch screen detection.

It should be noted that the secondary detection wafers created in this creation are not limited to the one or two listed above, but may be other quantities.

However, the author found that in the above embodiment, if the master inspection wafer directly sends the clock signal and the start signal to the slave inspection wafer, there may be a situation where the master inspection wafer starts to be inspected slightly earlier than the slave inspection wafer due to the delay of the wiring It is impossible to achieve accurate synchronization. To solve this problem, this embodiment provides a solution. For ease of understanding, please refer to FIG. 4, and this solution will be described in detail below.

As shown in FIG. 4, the main detection chip and the slave detection chip are respectively provided with a start signal output pin, a start signal input pin, a clock signal output pin, and a clock signal input pin; The pins of the same function of the detection chip and the slave detection chip are marked differently, corresponding to the following: the main detection chip start signal output pin Start1 out, the start signal input pin Start1 in, the clock signal output pin CLK1 out and the clock signal input pin Pin CLK1 in; Start signal output pin Start2 out, start signal input pin Start2 in, start signal input pin CLK2 out and clock signal input pin CLK2 in from the detection chip.

Among them, the start signal output pin Start1 out of the main detection wafer is connected to the middle area of the main detection wafer and the adjacent slave detection wafer, and respectively connected to the start signal input pin Start1 in of the main detection wafer and the start signal of the slave detection wafer Input the pin Start2 in, so that the start signal 220 output by the main detection chip can be converted into a start signal 210 and sent to the pins Start1 in and Start2 in; further, the clock signal output pin CLK1 out of the main detection chip is connected to the main The middle area of the inspection wafer and the adjacent slave inspection wafer, and connect the clock signal input pin CLK1 in of the master inspection wafer and the clock signal input pin CLK2 in of the slave inspection wafer respectively, so that the clock signal 120 output by the master inspection wafer can be Converted into a clock signal 110 and sent to the pin CLK1 in and pin CLK2 in; in this embodiment, the start signal 220 and the clock signal 120 initially output by the master detection wafer are converted at the middle position of the adjacent two master and slave wafers, and then simultaneously Input to the master-slave wafer, because the intermediate position is the same as the distance between the master and slave detection wafers, so overcoming the problem of signal reception caused by the distance, there is a high degree of synchronization between the start signal and the clock signal received by the master-slave detection wafer.

The connection between the pin Start1 out and the middle position, the middle position and the pin Start1 in and the pin Start2 in; the connection between the pin CLK1 out and the middle position, the middle position and the pin CLK1 in and the pin CLK2 in can use the peripheral circuit (That is, a circuit that is not integrated within the IC).

Since the structure of the master inspection wafer is exactly the same as the structure of the slave inspection wafer, the slave inspection wafer is also provided with a clock signal output pin CLK2 out and a start signal output pin Start2 out, but since the slave inspection wafer is in the path of the master inspection Work under the leadership of the ，only receive but not send the clock signal and start signal, so CLK2 out and Start2 out do not work.

The creator further found that in the actual products of the above-mentioned chips, the clock signal speed inside the chip is generally detected to be relatively fast, and the peripheral circuits are mainly realized by printed circuit boards (printed circuit boards, PCBs). It is difficult to transmit high-speed signals. If the main inspection chip directly outputs a high-speed clock signal, the signal may be distorted, causing the clock signal received by the main inspection chip or the slave inspection chip to be abnormal and unable to perform touch detection normally. In response to this problem, this creative embodiment proposes a corresponding solution. The master detection chip and the slave detection chip are respectively provided with up-conversion modules for receiving the clock signal input pins of the master detection chip and the slave detection chip. The frequency of the clock signal is increased, and the master detection chip and the slave detection chip respectively perform touch detection at the increased frequency.

For ease of understanding, please refer to FIG. 5, and the solution will be described in detail in conjunction with FIG. 5 below. In this embodiment, the frequency-up modules of the master-slave detection chips all use a phase locked loop (PLL), and are labeled with PLL1 and PLL2, respectively. During specific work, the master-slave detection wafers are each also provided with a micro-control unit MCU, and are marked with MCU1 and MCU2 respectively. The master detection chip outputs a low-speed clock signal. After conversion, it is sent to the pin CLK1 in and the pin CLK2 in respectively, and then up-converted through PLL1 and PLL2 respectively to obtain a high-speed clock signal. Clock to control touch detection. Because the clock signals received at pins CLK1 in and CLK2 in are synchronous, the low-speed clock signals received by the master and slave PLLs are the same, so the high-speed clock signals generated by PLL1 and PLL2 are also the same That is, the clock signals used for touch detection by the master and slave chips are of the same frequency and same phase. However, in addition to the phase-locked loop, the up-conversion module created in this creation may also be other circuits or electronic devices for increasing the frequency of the clock signal, and this embodiment of the creation is not limited.

Preferably, in the above solution, one master detection chip and two slave detection chips work together to realize the detection of most touch screens in current commonly used terminal devices, where the number of master detection chips is one, and the number of slave detection chips The number is two, and the two slave inspection wafers are respectively disposed on both sides of the master inspection wafer. The specific setting method may be any one of the above-mentioned connection methods of the master inspection wafer and the slave inspection wafer, which will not be repeated here.

After receiving the start signal from the master-slave detection chip combination, it starts to perform touch detection on the touch electrodes in their corresponding areas. The timing relationship between the clock signal, the start signal and the detection signal on the electrode includes: 1. The master detection chip and the slave detection chip Perform a frame of touch detection after receiving the start signal; or, 2. The main detection chip and the slave detection chip perform two or more touch detections after receiving the start signal; or, 3. The main detection chip and the slave detection chip receive After more than two start signals, a frame of touch detection is completed. For ease of understanding, the three methods are described in detail below with reference to the drawings.

1. The master detection chip and the slave detection chip perform a frame of touch detection after receiving the start signal.

As shown in FIG. 6, after the start signal pulse arrives, the master-slave detection wafer starts to perform touch detection on the corresponding touch electrodes, and each time the start signal starts a frame of touch detection, after each frame of touch detection ends (or ends a period After time), the master detection wafer outputs a pulse start signal again, and the master-slave detection wafer again performs touch detection on the touch electrodes. The frequency of the activation signal depends on the desired touch detection frame rate, such as 60 Hz or 120 Hz. The specific sending method of the start signal is the same as the above, and will not be repeated here.

2. The master detection chip and the slave detection chip perform touch detection over two frames after receiving the start signal.

Please refer to FIG. 7, after the start signal pulse arrives, the master-slave detection chip starts to perform touch detection on the corresponding touch electrodes, and each start signal starts two frames (in other embodiments, it may be more than two frames) touch detection Between these two frames or multiple frames, the touch detection method and parameters may be the same or different, such as different signal driving frequencies, or one self-capacitance detection and one mutual capacitance detection. After the above two or more frames of touch detection (or after a period of time), the master detection wafer outputs a pulse start signal again, and the master and slave detection wafers again perform touch detection on the touch electrodes. The frequency of the activation signal depends on the touch detection frame rate, such as 60 Hz or 120 Hz.

3. The master detection chip and the slave detection chip complete a frame of touch detection after receiving more than two activation signals.

Please refer to Figure 8. The main difference between this solution and the previous two solutions is that a frame of touch detection needs to be completed several times, each time requires a start signal pulse to start, so each complete touch detection cycle There will be multiple start signal pulses, and the pulse signal may also be non-uniform. Assuming that the touch detection frame rate is 60 Hz, and the corresponding full touch detection period is 16.7 ms, multiple start signal pulses, uniform or non-uniform, appear every 16.7 ms, and touch detection may not be performed after each start pulse.

This creative embodiment also provides a terminal device. The terminal device includes: a touch screen and a touch screen detection chip combination. The touch screen detection chip combination may be any of the above-mentioned embodiments shown in FIG. 2 to FIG. 8. The touch screen detection chip combination described above.

In the several embodiments provided in this creation, it should be understood that the disclosed chips and circuits may be implemented in other ways. For example, the device embodiments described above are only schematic. For example, the division of the circuit is only a logical function division. In actual implementation, there may be another division manner, for example, multiple circuits or components may be combined or may Integration into another system, or some features can be ignored, or not implemented. In addition, the displayed or discussed mutual coupling or direct coupling or communication connection may be an indirect coupling or communication connection through some interfaces, devices, or circuits, and may be in electrical, mechanical, or other forms.

The circuit described as a separate component may or may not be physically separated, and the component displayed as a circuit may or may not be a physical circuit, that is, it may be located in one place, or may be distributed on multiple network circuits . A part or all of the circuits may be selected according to actual needs to achieve the purpose of the solution of this embodiment.

The terminology used in this authoring embodiment is for the purpose of describing particular embodiments only, and is not intended to limit this authoring. The singular forms "a", "said", and "the" used in this creative embodiment and the accompanying embodiment books are also intended to include most forms unless the context clearly indicates other meanings. The character "/" in this composition generally indicates that the related objects are a "or" relationship.

The touch screen detection chip combination and the terminal device provided by the authoring embodiment are described in detail above. Specific examples are used in this article to explain the principle and implementation of the authoring. The descriptions of the above embodiments are only for help Understand the method and core idea of this creation; meanwhile, for those of ordinary skill in the art, according to the idea of this creation, there will be changes in the specific implementation and application scope. In summary, the content of this manual is not It should be understood as a limitation on this creation.

100‧‧‧clock signal 110‧‧‧clock signal 120‧‧‧clock signal 200‧‧‧Start signal 210‧‧‧Start signal 220‧‧‧Start signal

1 is a schematic diagram of the connection between touch screens of different sizes and touch screen detection chips in the prior art; FIG. 2 is a schematic diagram of an embodiment of a touch screen detection chip combination in the creative embodiment; FIG. 3 is a schematic diagram of another embodiment of the touch screen detection chip combination in the creative embodiment; FIG. 4 is a schematic diagram of another embodiment of the touch screen detection chip combination in the creative embodiment; FIG. FIG. 5 is a schematic diagram of another embodiment of the touch screen detection chip combination in the creative embodiment; FIG. 6 is a schematic diagram of a signal transmission method in a touch screen detection chip combination in an embodiment of the invention; 7 is a schematic diagram of another signal transmission method in the touch screen detection chip combination of the creative embodiment; and FIG. 8 is a schematic diagram of another signal transmission method in the touch screen detection chip combination of the creative embodiment.

100‧‧‧clock signal

200‧‧‧Start signal

Claims (10)

A touch screen detection chip combination, including: A master inspection wafer and a slave inspection wafer; where, The master detection chip and the slave detection chip are used to process a touch signal in different areas of the same touch screen; and The master detection chip is connected to the slave detection chip, and the master detection chip controls the slave detection chip to process the touch signal of the touch screen. The touch screen detection chip assembly according to claim 1, wherein the master detection chip and the slave detection chip are respectively provided with a potential pin, and the chip whose potential pin receives a first potential is defined as the master detection chip It is defined that the chip where the potential pin receives a second potential is the slave detection chip, and the first potential is different from the second potential. The touch screen detection chip assembly according to claim 2, wherein the first potential is a power supply potential and the second potential is a ground potential; Or the first potential is the ground potential, and the second potential is the power supply potential. The touch screen detection chip assembly according to claim 2, wherein the master detection chip is provided with an enable signal output pin and a clock signal output pin, and the slave detection chip is provided with an enable signal input pin and a clock Signal input pin; The activation signal output pin of the master inspection chip is connected to the activation signal input pin of the slave inspection chip, so that the master inspection chip controls the slave inspection chip to initiate touch detection; and The clock signal output pin of the master inspection wafer is connected to the clock signal input pin of the slave inspection wafer, so that the master inspection wafer controls the slave inspection wafer to perform touch detection at the same frequency. The touch screen inspection chip assembly according to claim 4, wherein the number of the main inspection chip is one, and the number of the secondary inspection chips is multiple; The master detection chip is provided with a plurality of synchronized start signal output pins and a plurality of synchronized clock signal output pins, and the plurality of slave detection chips are each provided with a start signal input pin and a clock signal input Pins; and The start signal input pins of each slave detection chip are respectively connected to one of the start signal output pins of the master detection chip, and the clock signal input pins of each slave detection chip are respectively connected to one of the clock signal output of the master detection chip Pins. The touch screen detection chip combination according to claim 2, wherein the master detection chip and the slave detection chip are respectively provided with an enable signal output pin, an enable signal input pin, a clock signal output pin and A clock signal input pin; The start signal output pin of the master test wafer is connected to the middle area of the master test wafer and the adjacent slave test wafer, and respectively connected to the respective start signal input pins of the master test wafer and the slave test wafer, The master detection chip and the slave detection chip start touch detection after receiving a start signal; and The clock signal output pin of the master inspection wafer is connected to the intermediate area of the master inspection wafer and the adjacent slave inspection wafer, and respectively connected to the clock signal input pins of the master inspection wafer and the slave inspection wafer, After receiving a clock signal from the master inspection wafer and the slave inspection wafer, touch detection is performed at the same frequency. The touch screen inspection chip assembly according to claim 6, wherein the master inspection chip and the slave inspection chip are respectively provided with an up-conversion module for the clocks of the master inspection chip and the slave inspection chip respectively The clock signal received by the signal input pin is frequency-raised, and the master detection chip and the slave detection chip respectively perform touch detection at the increased frequency. The touch screen inspection chip assembly according to claim 5 or 6, wherein the number of the master inspection chip is one, the number of the slave inspection chips is two, and two slave inspection chips are respectively provided in the master inspection Both sides of the wafer. The touch screen detection chip combination according to claim 4 or 6, wherein the master detection chip and the slave detection chip perform a frame of touch detection after receiving the activation signal; Or the master detection chip and the slave detection chip perform touch detection for more than two frames after receiving the start signal; Or the master detection chip and the slave detection chip complete a frame of touch detection after receiving more than two activation signals. A terminal device, including: A touch screen and a touch screen inspection chip combination, the touch screen inspection chip combination includes a master inspection chip and a slave inspection chip, wherein, The master detection chip and the slave detection chip are used to process a touch signal in different areas of the same touch screen; and The master detection chip is connected to the slave detection chip. The master detection chip controls the slave detection chip to process the touch signal of the touch screen.

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