TWM583075U - Thermal module - Google Patents

Abstract

A thermal module being used in combination with a fluid, wherein the fluid flows vertically from the above of the thermal module to the thermal module is provided. The thermal module includes a base, a first fin set and a flow guiding member. The base has a surface, and the first fin set is disposed on the base and has a plurality of fins. The flow guiding member has a first guiding surface, and an obtuse angle is formed between the first guiding surface and the surface, wherein a portion of the fluid flowing vertically from the above of the thermal module is guided to flow into a space between the adjacent fins via the guiding of the first guiding surface. The flow guiding member is arranged to introduce the fluid between the fins, thereby improving the heat dissipation efficiency of the thermal module.

Description

Thermal module

The novel creation is related to a device, and in particular to a heat dissipation module.

Common heat dissipation modules can be divided into liquid cooling or air cooling, which are fluids flowing through the fins of the heat dissipation module to improve the heat dissipation effect of the heat dissipation module.

FIG. 1 is a schematic diagram of a conventional heat dissipation module. Referring to FIG. 1, the fluid enters the heat dissipation module 10 in a direction perpendicular to the fins 12, and when the fluid enters, the fluid collides with the fins 12 to rebound, so that the fluid cannot enter the adjacent fins as expected. The space between the 12 pieces of the film does not effectively improve the heat dissipation effect, only the internal energy loss that generates water pressure.

The novel creation provides a heat dissipation module with good heat dissipation efficiency.

The heat dissipation module created by the novel is matched with a fluid application, wherein the fluid flows vertically from the upper side of the heat dissipation module to the heat dissipation module. The heat dissipation module includes a base, a first fin set, and a flow guide. The base has a surface, and the first fin set is disposed on the base and has a plurality of fins. The flow guiding member has a first guiding surface, and the first guiding surface and the surface have an obtuse angle, wherein a portion of the fluid flowing vertically from above the heat dissipation module flows into the two adjacent portions via the guiding of the first guiding surface Between the fins.

In an embodiment of the present invention, the heat dissipation module further includes a second fin set disposed on the base. The second fin set also has a plurality of fins, and the flow guiding member has a second guiding surface opposite to the first guiding surface, wherein another part of the fluid flows into the second fin via the guiding of the second guiding surface Between two adjacent fins of the slice set.

In an embodiment of the present invention, the shape of the flow guiding member is tapered, and the fins are radially arranged around the flow guiding member.

In an embodiment of the present invention, the first guiding surface is a plane or a curved surface.

In an embodiment of the present invention, the height of the flow guiding member on the surface is greater than the height of the fin on the surface.

In an embodiment of the present invention, the height of the flow guide on the surface is equal to the height of the fin on the surface.

In an embodiment of the present invention, the height of the flow guiding member on the surface is smaller than the height of the fin on the surface.

Based on the above, by providing a flow guiding member in the heat dissipation module, the fluid flowing to the heat dissipation module above the self-heating module can be guided by the flow guiding member to the fins of the fin group, thereby effectively lifting the heat dissipation module. Cooling efficiency.

The above described features and advantages of the present invention will become more apparent and understood from the following description.

The heat-dissipating module created by the present invention is used in combination with a fluid, and the fluid may be a gas or a liquid, wherein the fluid flows vertically from above the heat-dissipating module to the heat-dissipating module. The heat-dissipating module of the present invention, through the use of the flow guiding member, allows a portion of the fluid that flows vertically from above the heat-dissipating module to flow exactly between the adjacent fins through the guiding surface of the guiding member. It can effectively improve the heat dissipation efficiency of the heat dissipation module.

The various embodiments of the heat dissipation module will be specifically described below.

FIG. 2 is a schematic diagram of a heat dissipation module according to an embodiment of the present invention. Referring to FIG. 2, the heat dissipation module 100 of the present embodiment is described by taking a water-cooling head as an example, and the water-cooling head can be used, for example, but not limited to, as a heat dissipation of a display card or a motherboard in a computer. The heat dissipation module 100 is disposed on a heat source (not shown), and includes a base 110, a first fin set 120, a second fin set 130, and a flow guiding member 140. The base 110 has a surface 112, and the first fin set 120 and the second fin set 130 are disposed on the base 110, and the first fin set 120 and the second fin set 130 respectively have a plurality of fins 122, 132. Wherein the fins 122, 132 are arranged to extend in the X direction and are arranged in a row at intervals in the Y direction.

The flow guiding member 140 of the present embodiment has a substantially triangular column shape and is located between the first fin group 120 and the second fin group 130, wherein the length direction of the flow guiding member 140 is parallel to the Y direction. In this embodiment, the flow guiding member 140 has a first guiding surface 142 and a second guiding surface 144 opposite to each other, wherein the first guiding surface 142 faces the first fin group 120 and is second. The guiding surface 144 faces the second fin set 130, and the first guiding surface 142 and the second guiding surface 144 respectively form an obtuse angle q with the surface 112. In other embodiments, the first guiding surface 142 and the second guiding surface 144 opposite to each other may not be adjacent, and the flow guiding member 140 is substantially trapezoidal.

The flow guide 140, the first fin set 120, and the second fin set 130 of the present embodiment may be separate components, and may be assembled on the surface 112 of the base 110 by CNC machining, pasting, welding, or other suitable means. Up, but not limited to this. It is also possible for a person skilled in the art to simultaneously fabricate the susceptor 110, the flow guiding member 140, the first fin group 120 and the second fin group 130 on the same material through other processing methods; in other words, the flow guiding member 140, the first The fin set 120, the second fin set 130 and the base 110 are structurally integral members. Preferably, the integrally formed base 110, the flow guiding member 140, the first fin set 120 and the second fin set 130 are compared to the flow guiding member 140, the first fin set 120 and the second as individual independent components. Assembly of the fin set 130 onto the base 110 is more resistant to leakage of fluid from the assembly.

When the fluid (liquid in this embodiment) flows vertically from the upper side of the heat dissipation module 100 along the Z direction toward the heat dissipation module 100, the fluid will rush toward the first fin group 120, the flow guide 140, and the second fin group. 130, a portion of the fluid flows into any of the two adjacent fins 122 of the first fin set 120 via the guiding of the first guiding surface 142, and part of the fluid is guided by the second guiding surface 144 Flows between any two adjacent fins 132 in the second fin set 130. As the fluid is effectively directed between the fins 122, 132 by the flow guide 140, the fluid and the fins 122, 132 are capable of heat exchange such that heat on the fins 122, 132 is carried away by the fluid, thereby increasing The overall performance of the heat dissipation module 100. In addition, since the flow guiding member 140 extends upward from the surface 112 of the base 110, the heat conduction path of the heat source attached to the base 110 is further increased, and the heat conduction efficiency is improved, thereby improving the heat dissipation effect.

Incidentally, the first guiding surface 142 and the second guiding surface 144 may be planar, and in another embodiment, the first guiding surface 142 ′ and the second guiding surface 144 ′ may also be curved surfaces. As shown in FIG. 3, FIG. 3 is a schematic diagram of the guiding surface being a curved surface. Of course, one of the first guiding surface 142 and the second guiding surface 144 is a plane, and the other of the first guiding surface 142 and the second guiding surface 144 is a curved surface, which can be according to actual needs. And choose.

In particular, when the first guiding surface 142 and/or the second guiding surface 144 are curved, the angle between the first guiding surface 142, the second guiding surface 144 and the surface 112 of the base 110 is It is smoother than when the first guiding surface 142 and the second guiding surface 144 are planar, and can reduce the sudden change between the slope between the first guiding surface 142 and/or the second guiding surface 144 and the surface 112. The probability of turbulence is generated, so that the fluid can flow smoothly onto the surface 112 along the curved first guiding surface 142 and/or the second guiding surface 144, allowing the fluid to flow more smoothly into the fins 122 and / or between the fins 132.

In addition, the flow guiding member 140 may be adjacent to the first fin group 120 and the second fin group 130, as shown in FIG. 2; or, as shown in FIG. 4, FIG. 4 is another embodiment of the heat dissipation module. Sectional view of the group. The portion of the flow guide 140a may also be a portion that overlaps the fins 122, 132 of the first fin set 120 and the second fin set 130. In other words, the edge of the flow guiding member 140a extends between the spaces of two adjacent fins 122 or two adjacent fins 132. In some embodiments, the fins 122, 132 of the first fin set 120 and the second fin set 130 may be respectively connected.

5A to 5C are schematic views of a flow guide and a fin. In the novel creation, the height of the flow guiding member 140 on the surface 112 may be greater than the height of the fins 122, 132 on the surface 112 (as shown in FIG. 5A), and the height of the flow guiding member 140' on the surface 112 may be equal to the fin. The height of the sheets 122, 132 on the surface 112 (as shown in Figure 5B), or the height of the flow guide 140" on the surface 112 is less than the height of the fins 122, 132 on the surface 112 (as shown in Figure 5C), Wherein the higher flow guiding member 140 has a farther heat conduction path, which can improve the heat conduction effect. Those skilled in the art can change the flow guiding member 140 on the surface according to the configuration requirements of other components in the electronic device provided with the heat dissipation module 100. The height on 112.

FIG. 6 is a schematic diagram of a heat dissipation module according to still another embodiment of the present invention. Referring to FIG. 6 , in the heat dissipation module 200 of the embodiment, the shape of the flow guiding member 240 is tapered, and the fins 222 are radially arranged around the flow guiding member 240 .

The tapered baffle 240 is disposed in the fin 222. When the fluid flows vertically from the upper side of the heat dissipation module 200 to the heat dissipation module 200 along the Z direction, the fluid can follow the diversion flow after contacting the flow guide 240. The guiding surface 242 of the member 240 flows between the fins 222 along the radial direction of the flow guiding member 240 to enable heat exchange between the fluid and the fins 222.

The description of the novel creation is not intended to limit the shape, density, and spacing of the fins 122, 132, and 222 in the foregoing embodiments, and those skilled in the art may not violate the spirit of the novel creation. Adapt to changes according to actual needs.

The foregoing heat dissipation modules 100 and 200 can be used in combination with other heat dissipation components, such as heat pipes.

In summary, in the heat dissipation module of the present invention, the fluid flowing to the heat dissipation module above the self-heating module can be guided by the flow guiding member to the fins of the fin group through the arrangement of the flow guiding member. The heat exchange between the fins and the fins can effectively improve the heat dissipation efficiency of the heat dissipation module.

Moreover, compared with the conventional heat dissipation module, when the fluid flows vertically to the heat dissipation module above the heat dissipation module, the fluid rebounds when it hits the fin, and the heat dissipation module created by the novel has a baffle. The arrangement can effectively guide the flow direction of the fluid and reduce the internal energy consumption due to the water pressure.

Although the present invention has been disclosed in the above embodiments, it is not intended to limit the novel creation, and any person skilled in the art can make some changes without departing from the spirit and scope of the novel creation. Retouching, the scope of protection of this new creation is subject to the definition of the scope of the patent application attached.

10, 100, 200‧‧‧ Thermal Module  12, 122, 132, 222‧‧‧ fins  110‧‧‧Base  112‧‧‧ surface  120‧‧‧First fin set  130‧‧‧second fin set  140, 140a, 140', 140", 240‧‧‧ flow guides  142, 142'‧‧‧ first guiding surface  144, 144’‧‧‧ second guiding surface  242‧‧‧ Guide surface  Q‧‧‧obtuse angle  X, Y, Z‧‧ Direction  

FIG. 1 is a schematic diagram of a conventional heat dissipation module.  FIG. 2 is a schematic diagram of a heat dissipation module according to an embodiment of the present invention.  Fig. 3 is a schematic view showing the guide surface as a curved surface.  4 is a cross-sectional view of a heat dissipation module of another embodiment.  5A to 5C are schematic views of a flow guide and a fin.  FIG. 6 is a schematic diagram of a heat dissipation module according to still another embodiment of the present invention.  

Claims (7)

A heat dissipating module is disposed in a fluid pairing manner, and the fluid flows vertically from above the heat dissipating module to the heat dissipating module, and the heat dissipating module comprises:
a base having a surface;
a first fin set disposed on the base and having a plurality of fins; and a flow guiding member having a first guiding surface, the first guiding surface and the surface having an obtuse angle, wherein A portion of the fluid that flows vertically above the heat dissipation module flows between the two adjacent fins via the guiding of the first guiding surface. The heat dissipation module of claim 1, further comprising a second fin set disposed on the base and having a plurality of fins, the flow guiding member having a first guiding surface opposite to the first guiding surface a second guiding surface, wherein another portion of the fluid flows into between the two adjacent fins of the second fin group via the guiding of the second guiding surface. The heat dissipation module of claim 1, wherein the flow guiding member has a tapered shape, and the fins are radially arranged around the flow guiding member. The heat dissipation module of claim 1, wherein the first guiding surface is a plane or a curved surface. The heat dissipation module of claim 1, wherein the height of the flow guide on the surface is greater than the height of the fins on the surface. The heat dissipation module of claim 1, wherein the height of the flow guide on the surface is equal to the height of the fins on the surface. The heat dissipation module of claim 1, wherein the height of the flow guiding member on the surface is smaller than the height of the fins on the surface.