TWI805433B - Liquid-cooling cold plate having pin-fins and closed-loop cooling device having the same - Google Patents

Abstract

A liquid-cooling cold plate having pin-fins includes a plate body, a plurality of diamond-shaped pin-fins, and a plurality of oval-shaped pin-fins. The plate body has opposite first heat-dissipation surface and second heat-dissipation surface, the first heat-dissipation surface is used for contacting the heat source, and the second heat-dissipation surface is used for contacting the cooling liquid. The diamond-shaped pin-fins and the oval-shaped pin-fins are integrally formed on the second heat-dissipation surface and arranged with high density. The minimum distance between any two adjacent oval-shaped pin-fins ranges from 0.3 mm to 1.5 mm, and the minimum distance between any two adjacent diamond-shaped pin-fins ranges from 0.3 mm to 1.5 mm. At least one of the oval-shaped pin-fins is arranged corresponding to the position of a relatively low temperature region of the heat source, and at least one of the diamond-shaped pin-fins is arranged corresponding to the position of a relatively high temperature region of the heat source.

Description

Water-cooled heat sink with pin-column fins, and closed water-cooled radiator with same

The invention relates to a water-cooling radiator and a water-cooling radiator, in particular to a water-cooling radiator with pin-column fins and a closed water-cooling radiator with the same.

Radiators are widely used in various products. Generally speaking, higher-end products usually use water-cooled/liquid-cooled radiators, which have the advantages of quietness and stable cooling compared with air-cooled radiators. However, for chips that operate faster and faster, the current water-cooled The heat sink still cannot meet the heat dissipation requirements of these chips in terms of heat dissipation effect. Therefore, how to dissipate heat more effectively through the water cooling technology has always been a problem to be solved in the industry.

In view of this, the inventor has been engaged in the development and design of related products for many years, and felt that the above-mentioned defects can be improved, so he devoted himself to research and combined with the application of theories, and finally proposed an invention with a reasonable design and effective improvement of the above-mentioned defects.

The technical problem to be solved by the present invention is to provide a water-cooled radiator plate with pin-column fins and a closed water-cooled radiator with the same in view of the deficiencies in the prior art.

An embodiment of the present invention provides a water-cooled heat sink with pin-pillar fins, comprising: a heat sink body, a plurality of diamond-shaped pin-pillar fins, and a plurality of elliptical pin-pillar fins, the The heat dissipation plate body has a first heat dissipation surface and a second heat dissipation surface opposite, the first heat dissipation surface is used to contact the heat source, the second heat dissipation surface is used to contact the cooling fluid, and the plurality of diamond-shaped The pin-pillar fins and the plurality of elliptical pin-pillar fins are integrally formed on the second heat dissipation surface and arranged in high density, any two adjacent elliptical pin-pillar fins The minimum distance between them is 0.3 to 1.5 mm, the minimum distance between any two adjacent diamond-shaped pin-column fins is 0.3-1.5 mm, and at least one of the elliptical pin-column fins The position of is corresponding to the relatively low-temperature region of the heat source, and the position of at least one of the diamond-shaped pin-pillar fins is corresponding to the relatively high-temperature region of the heat source.

An embodiment of the present invention provides a closed water-cooling radiator, comprising: a heat dissipation plate body, a plurality of diamond-shaped pin-column fins, and a plurality of oval-shaped pin-column fins, the heat dissipation plate body has opposite The first heat dissipation surface and the second heat dissipation surface, the first heat dissipation surface is used to contact the heat source, the second heat dissipation surface is used to contact the cooling fluid, the plurality of diamond-shaped pin-pillar fins and the The plurality of elliptical pin-pillar fins are integrally formed on the second heat dissipation surface and arranged in high density, and the minimum distance between any two adjacent elliptical pin-pillar fins is 0.3 to 1.5 mm, the minimum distance between any two adjacent diamond-shaped pin-column fins is 0.3 to 1.5 mm, and the position of at least one oval-shaped pin-column fin is corresponding to the heat source The relatively low-temperature region of the heat source, and at least one of the diamond-shaped pin-pillar fins is located in a relatively high-temperature region corresponding to the heat source. The enclosed water-cooled radiator also includes a heat dissipation seat body, the heat dissipation seat body is formed with a groove, and the heat dissipation seat body is combined with the heat dissipation plate body, so that the groove of the heat dissipation seat body and the heat dissipation plate body A cavity is formed between the second heat dissipation surface of the heat dissipation plate body, and the plurality of diamond-shaped pin-pillar fins and the plurality of elliptical pin-pillar fins are located in the cavity in the room.

In a preferred embodiment, the rhombic cross-section of the rhombic pin-pillar fins is formed with two diagonal lines of equal length, and one of the diagonal lines is parallel to the flow direction of the cooling fluid .

In a preferred embodiment, the elliptical cross-section of the elliptical pin-column fin A major axis and a minor axis of unequal length are formed, and the major axis is parallel to the flow direction of the cooling fluid.

In a preferred embodiment, the length of one of the diagonals of the diamond-shaped pin-pillar fins is 0.5 mm.

In a preferred embodiment, the length of the short axis of the elliptical pin-column fin is 0.5 mm.

In a preferred embodiment, the plurality of diamond-shaped pin-pillar fins and the plurality of elliptical pin-pillar fins form fins with at least two different areas on the second heat dissipation surface. arrangement density, and the position of the region with the highest fin arrangement density in the at least two regions is a relatively high temperature region corresponding to the heat source.

In a preferred embodiment, the plurality of diamond-shaped pin-pillar fins and the plurality of elliptical pin-pillar fins form fins with at least two different areas on the second heat dissipation surface. height, and the position of the region with the highest fin height among the at least two regions is a relatively high temperature region corresponding to the heat source.

In a preferred embodiment, the plurality of diamond-shaped pin-pillar fins, the plurality of elliptical pin-pillar fins, and the heat sink body are integrally connected by metal injection molding.

In a preferred embodiment, the second heat dissipation surface of the heat dissipation plate body is further integrally formed with a plurality of pin-pillar fins of any geometric shape, and at least one of the pin-pillar fins of any geometric shape The position is between the plurality of diamond-shaped pin-pillar fins and the plurality of elliptical pin-pillar fins.

In order to further understand the features and technical content of the present invention, please refer to the following detailed description and drawings related to the present invention. However, the provided drawings are only for reference and description, and are not intended to limit the present invention.

10: Heat sink body

11: The first cooling surface

12: Second cooling surface

20: Rhombus-shaped pin-column fins

201: Diagonal

30: Elliptical pin-column fins

301: long axis

302: Minor axis

40:Pin column fins of any geometric shape

50: Heat sink body

501: water inlet through hole

502: Water outlet hole

51: Groove

CH: chamber

C1: The first automotive chip

C2: Second car chip

C3: The third car chip

D: flow direction

Fig. 1 is a schematic side view of the structure of the first embodiment of the present invention.

Fig. 2 is a schematic bottom view of the structure of the first embodiment of the present invention.

FIG. 3 is a schematic diagram of a diamond-shaped pin-column fin of the present invention.

FIG. 4 is a schematic diagram of an elliptical pin-column fin of the present invention.

Fig. 5 is a schematic side view of the structure of the second embodiment of the present invention.

Fig. 6 is a schematic bottom view of the structure of the second embodiment of the present invention.

Fig. 7 is a schematic bottom view of the structure of the third embodiment of the present invention.

Fig. 8 is a schematic side view of the structure of the fourth embodiment of the present invention.

Fig. 9 is a schematic bottom view of the structure of the fifth embodiment of the present invention.

Fig. 10 is a schematic side view of the structure of the sixth embodiment of the present invention.

[first embodiment]

Please refer to FIGS. 1 and 2 , which are one of the embodiments of the present invention. The embodiment of the present invention provides a water-cooled heat sink with pin-pillar fins. As shown in Figures 1 and 2, the water-cooled radiator plate with pin-pillar fins provided according to the embodiment of the present invention basically includes a radiator plate body 10, a plurality of diamond-shaped pin-pillar fins (diamond- shaped pin-fins) 20, and a plurality of oval-shaped pin-fins (oval-shaped pin-fins) 30.

In this embodiment, the heat dissipation plate body 10 can be made of high thermal conductivity materials, such as aluminum, copper or alloys thereof. Moreover, the heat dissipation plate body 10 has a first heat dissipation surface 11 and a second heat dissipation surface 12 opposite to each other. The first heat dissipation surface 11 is used to contact a heat source (such as a chip for a vehicle), and the second heat dissipation surface 12 is used to contact a cooling fluid. (e.g. water or ethylene glycol) contact.

In this embodiment, a plurality of diamond-shaped pin-pillar fins 20 and a plurality of elliptical pin-pillar fins 30 are integrally formed on the second heat dissipation surface 12 of the heat dissipation plate body 10 . Furthermore, multiple The rhombic pin-pillar fins 20, a plurality of elliptical pin-pillar fins 30, and the heat sink body 10 can be integrally connected in a metal injection molding (Metal Injection Molding, MIM) manner, that is, integrally formed, thereby Has material continuity. In addition, a plurality of rhombic pin-pillar fins 20 and a plurality of elliptical pin-pillar fins 30 are arranged at a high density. In detail, the minimum distance between any two adjacent elliptical pin-column fins 30 is 0.3 to 1.5 mm, and the minimum distance between any two adjacent diamond-shaped pin-column fins 20 is 0.3 to 1.5 mm to improve heat dissipation performance.

Furthermore, at least one elliptical pin-pillar fin 30 is located at a relatively low-temperature zone corresponding to the heat source, and at least one diamond-shaped pin-pillar fin 20 is located at a relatively high-temperature zone corresponding to the heat source. In this embodiment, the heat source can be formed by at least two vehicle chips (the first vehicle chip C1 and the second vehicle chip C2), but it can also be formed by three or more vehicle chips . Moreover, the first vehicle chip C1 and the second vehicle chip C2 are arranged on the first heat dissipation surface 11 along the flow direction D of the cooling fluid. C1 flows toward the second vehicle wafer C2. The power of the first vehicle chip C1 and the power of the second vehicle chip C2 may be the same or different. When the power of the second automotive chip C2 is greater than the power of the second automotive chip C2, the operating temperature of the second automotive chip C2 will be greater than the operating temperature of the first automotive chip C1, so that the second automotive chip C2 and The first automotive wafer C1 forms a relatively high-temperature region of the heat source and a relatively low-temperature region of the heat source, respectively. However, even if the power of the second vehicle chip C2 is equal to the power of the first vehicle chip C1, the flow direction D of the cooling fluid is from the first vehicle chip C1 to the direction of the second vehicle chip C2, making cooling The fluid temperature when the fluid flows to the position corresponding to the first vehicle chip C1 will be lower, and the fluid temperature will be higher when it flows to the position corresponding to the second vehicle chip C2 after absorbing heat, so that the temperature of the second vehicle chip C2 The operating temperature is relatively high, which still causes the second vehicle chip C2 and the first vehicle chip C1 to form a relatively high temperature region of the heat source and a relatively low temperature region of the heat source, respectively. Therefore, the oval shape of this embodiment The position of the pin post type fin 30 is corresponding to the position of the first vehicle chip C1, and the position of the diamond-shaped pin post type fin 20 is corresponding to the position of the second vehicle chip C2, so as to penetrate the diamond-shaped pin The column fins 20 can have the best heat dissipation performance, and at the same time, the elliptical needle column fins 30 can reduce the fluid pressure drop, so as to avoid further increase in the energy consumption of the water pump.

Furthermore, in order to improve the heat dissipation performance while avoiding the need to further increase the energy consumption of the operation, the diamond-shaped cross-section of the diamond-shaped pin-pillar fin 20 in this embodiment is shown in FIG. 3 , which forms two diagonal lines 201, The two diagonals 201 can be unequal in length, but the optimal length is equal to increase the arrangement density of the fins to improve the heat dissipation performance, and one of the diagonals 201 must be parallel to the flow direction D of the cooling fluid. Furthermore, the elliptical cross-section of the elliptical pin-column fin 30 of this embodiment is shown in FIG. The flow direction D is parallel. Furthermore, through actual tests, the optimal length of the diagonal 201 of the diamond-shaped pin-pillar fin 20 is 0.5 mm, and the optimum length of the minor axis 302 of the elliptical pin-pillar fin 30 is 0.5 mm.

[Second embodiment]

Please refer to FIGS. 5 and 6 , which are the second embodiment of the present invention. This embodiment is substantially the same as the first embodiment, and the differences are described as follows.

In this embodiment, the heat source can be formed by three automotive chips (the first automotive chip C1, the second automotive chip C2 and the third automotive chip C3), but it can also be more automotive chips formed. And, the first vehicle chip C1, the second vehicle chip C2 and the third vehicle chip C3 are arranged on the first heat dissipation surface 11 along the flow direction D of the cooling fluid. It can also be said that the flow direction D of the cooling fluid is The flow flows from the first vehicle wafer C1 to the second vehicle wafer C2 and to the third wafer C3. The power of the first vehicle chip C1 , the power of the second vehicle chip C2 and the power of the third vehicle chip C3 may be the same or different. Since the flow direction D of the cooling fluid flows from the first vehicle wafer C1 to the second vehicle wafer C2 and then to the third vehicle wafer C3, When the cooling fluid flows to the position corresponding to the third vehicle chip C3, the fluid temperature will be the highest, which will easily cause the last third vehicle chip C3 to have poor heat dissipation, high operating temperature or even exceed the upper limit and be damaged. The positions of the elliptical pin-pillar fins 30 correspond to the positions of the first automotive wafer C1 and the second automotive wafer C2, while the positions of the diamond-shaped pin-pillar fins 20 correspond to the positions of the third automotive wafer C1 and the second automotive wafer C2. The position of wafer C3 can have the effect of reducing the fluid pressure drop through the elliptical pin-pillar fin 30, and can have the best heat dissipation performance through the diamond-shaped pin-pillar fin 20 at the same time, so that it can be used at a higher temperature of the heat source. where more heat can be dissipated.

[Third embodiment]

Please refer to FIG. 7 , which is the third embodiment of the present invention. This embodiment is substantially the same as the first embodiment, and the differences are described as follows.

In this embodiment, a plurality of diamond-shaped pin-pillar fins 20 and a plurality of elliptical pin-pillar fins 30 form at least two different fin arrangement densities on the second heat dissipation surface 12 . Furthermore, the arrangement density of fins on the left side of the second heat dissipation surface 12 is different from that on the right side, and the arrangement density of fins on the right side is higher than that on the left side. Moreover, the position of the area with the highest fin arrangement density in the two areas, that is, the position of the right area corresponds to the relatively high temperature area of the heat source, so as to further improve the heat dissipation performance by different fin arrangement densities.

[Fourth Embodiment]

Please refer to FIG. 8 , which is the fourth embodiment of the present invention. This embodiment is substantially the same as the first embodiment, and the differences are described as follows.

In this embodiment, a plurality of diamond-shaped pin-pillar fins 20 and a plurality of elliptical pin-pillar fins 30 form at least two different fin heights on the second heat dissipation surface 12 . Furthermore, the height of the fins on the left side of the second heat dissipation surface 12 is different from that on the right side, and the height of the fins on the right side is higher than that on the left side. Also, the fins in both regions The position of the highest height area, that is, the position of the right area corresponds to the relatively high temperature area of the heat source, so as to further improve the heat dissipation performance by using different fin heights.

[Fifth Embodiment]

Please refer to FIG. 9 , which is the fifth embodiment of the present invention. This embodiment is substantially the same as the first embodiment, and the differences are described as follows.

In this embodiment, the second heat dissipation surface 12 of the heat dissipation plate body 10 is more integrally formed with a plurality of pin-pillar fins 40 of any geometric shape, and the position of at least one pin-pillar fin 40 of any geometric shape is at Between a plurality of diamond-shaped pin-column fins 20 and a plurality of oval-shaped pin-column fins 30, it can also be said that the position of at least one pin-column fin 40 of any geometric shape can be corresponding to the relative position of the heat source. The transition region between the low temperature region and the relatively high temperature region of the heat source. Moreover, the pin-pillar fins 40 of any geometric shape are preferably triangular pin-pillar fins or circular pin-pillar fins.

[Sixth embodiment]

Please refer to FIG. 10 , which is the sixth embodiment of the present invention. This embodiment is substantially the same as the first embodiment, and the differences are described as follows.

In this embodiment, a closed water cooling radiator is provided. Furthermore, the enclosed water-cooling radiator of this embodiment also includes a heat-dissipating seat 50 in addition to the water-cooling heat sink with pin-pillar fins as described in any of the above-mentioned embodiments. The heat dissipation base 50 of this embodiment is formed with a groove 51, and the heat dissipation base 50 is combined with the heat dissipation plate body 10, so that a groove 51 of the heat dissipation base body 50 and the second heat dissipation surface 12 of the heat dissipation plate body 10 are formed. There is a chamber CH, and a plurality of diamond-shaped pin-pillar fins 20 and a plurality of elliptical pin-pillar fins 30 are located in the chamber CH. Moreover, the heat sink body 50 is also formed with a water inlet through hole 501 and a water outlet through hole 502 respectively communicating with the chamber CH, so that the cooling fluid can flow into the chamber CH through the water inlet through hole 501 and flow out of the chamber CH through the water outlet through hole 502. To further improve the heat dissipation performance through the closed fluid circulation loop.

Based on the above, the water-cooled radiator plate with pin-pillar fins provided by the present invention can at least pass through the "radiating plate body", "diamond-shaped pin-pillar fins", and "elliptical pin-pillar fins". ", "The heat dissipation plate body has a first heat dissipation surface and a second heat dissipation surface opposite, the first heat dissipation surface is used to contact the heat source, and the second heat dissipation surface is used to contact the cooling fluid", "Multiple diamond-shaped needle column type Fins and a plurality of elliptical pin-column fins are integrally formed on the second heat dissipation surface and arranged in high density", "the minimum distance between any two adjacent elliptical pin-column fins is 0.3 to 1.5 mm, the minimum distance between any two adjacent rhombus-shaped pin-column fins is 0.3 to 1.5 mm", "the position of at least one elliptical pin-column fin is a relatively low-temperature area corresponding to the heat source, And the position of at least one rhombus-shaped pin-column fin corresponds to the overall technical solution of the relatively high-temperature zone of the heat source, so that the pressure drop of the fluid will not drop too much, and the hotter part of the heat source can be dissipated. More heat.

The content disclosed above is only a preferred feasible embodiment of the present invention, and does not therefore limit the scope of the patent application of the present invention. Therefore, all equivalent technical changes made by using the description and drawings of the present invention are included in the application of the present invention. within the scope of the patent.

10: Heat sink body

12: Second cooling surface

20: Rhombus-shaped pin-column fins

30: Elliptical pin-column fins

D: flow direction

Claims (10)

A water-cooled heat dissipation plate with pin-column fins, comprising: a heat-dissipating plate body, a plurality of diamond-shaped pin-column fins, and a plurality of oval-shaped pin-column fins, the heat-dissipating plate body has opposite The first heat dissipation surface and the second heat dissipation surface, the first heat dissipation surface is used to contact the heat source, the second heat dissipation surface is used to contact the cooling fluid, the plurality of rhombic needle column fins and the A plurality of elliptical pin-column fins are integrally formed on the second heat dissipation surface and arranged in high density, and the minimum distance between any two adjacent oval-shaped pin-column fins is 0.3 to 1.5 mm, the minimum distance between any two adjacent diamond-shaped pin-column fins is 0.3 to 1.5 mm, and the position of at least one oval-shaped pin-column fin corresponds to that of the heat source A relatively low temperature zone, and the position of at least one diamond-shaped pin-pillar fin corresponds to a relatively high temperature zone of the heat source. The water-cooled radiator plate with pin-column fins as claimed in claim 1, wherein, the diamond-shaped cross-section of the diamond-shaped pin-column fins is formed with two diagonal lines of equal length, and one of them is Diagonal lines are parallel to the flow direction of the cooling fluid. The water-cooled radiator plate with pin-column fins according to claim 2, wherein the elliptical cross-section of the elliptical pin-column fins is formed with a major axis and a minor axis of unequal length, and the long The axis is parallel to the flow direction of the cooling fluid. The water-cooled radiator plate with pin-pillar fins according to claim 2, wherein the length of one of the diagonals of the diamond-shaped pin-pillar fins is 0.5 mm. The water-cooled heat dissipation plate with pin-pillar fins according to claim 3, wherein the length of the minor axis of the elliptical pin-pillar fins is 0.5 mm. The water-cooling radiator plate with pin-column fins according to claim 1, wherein the plurality of diamond-shaped pin-column fins and the plurality of elliptical pin-column fins are on the second At least two regions with different fin arrangement densities are formed on the heat dissipation surface, and the region with the highest fin arrangement density in the at least two regions corresponds to a relatively high temperature region of the heat source. The water-cooling radiator plate with pin-column fins according to claim 1, wherein the plurality of diamond-shaped pin-column fins and the plurality of elliptical pin-column fins are on the second At least two areas with different fin heights are formed on the heat dissipation surface, and the position of the highest fin height among the at least two areas is a relatively high temperature area corresponding to the heat source. The water-cooled radiator plate with pin-pillar fins as claimed in claim 1, wherein, the plurality of diamond-shaped pin-pillar fins, the plurality of elliptical pin-pillar fins, and the heat dissipation The boards are integrally connected by metal injection molding. The water-cooled heat dissipation plate with pin-pillar fins according to claim 1, wherein the second heat dissipation surface of the heat dissipation plate body is further integrally formed with a plurality of pin-pillar fins of any geometric shape, and at least The position of one pin-pillar fin of any geometric shape is between the plurality of diamond-shaped pin-pillar fins and the plurality of elliptical pin-pillar fins. A closed water-cooled radiator, comprising the water-cooled heat dissipation plate with pin-column fins as described in claim 1, and a heat dissipation base, the heat dissipation base is formed with a groove, and the heat dissipation base and the heat dissipation base are The heat dissipation plate is combined to form a cavity between the groove of the heat dissipation base and the second heat dissipation surface of the heat dissipation plate, and the plurality of rhombic pin-column fins The sheet and the plurality of elliptical pin post fins are located in the chamber.

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