TWM576519U - Composite processing machine with laser cutting and laser engraving functions - Google Patents
Composite processing machine with laser cutting and laser engraving functions Download PDFInfo
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Abstract
本創作提供一種結合雷射切割和雷射雕刻的複合式加工機,其主包括有一加工機、一工作平台與一複合式刀具;該加工機具有一底座,該底座用來提供該加工機的置放,以進行加工作業,該底座一側設置有一機身,該機身提供該複合式刀具的裝置,該工作平台裝置在該底座上,其上固定有待加工的一工件,而複合式刀具裝置在該機身上,該刀具底部設置有一雷射切割單元和一雷射雕刻單元;藉由上述結構,首先將該工件固定在該工作平台上,然後移動該工作平台或該複合式刀具,使該雷射切割單元和該雷射雕刻單元靠近該工件的被加工面分別進行加工,即可完成所需的加工作業。 The present invention provides a composite processing machine combining laser cutting and laser engraving, which mainly comprises a processing machine, a working platform and a composite cutter; the processing machine has a base for providing the processing machine Positioning for processing operation, a side of the base is provided with a fuselage, the body provides a device for the composite cutter, the work platform is mounted on the base, and a workpiece to be processed is fixed thereon, and the composite cutter is fixed The device is disposed on the body, and a laser cutting unit and a laser engraving unit are disposed at the bottom of the tool; by the above structure, the workpiece is first fixed on the working platform, and then the working platform or the composite tool is moved, so that The laser cutting unit and the laser engraving unit are respectively processed near the processed surface of the workpiece to complete the required machining operation.
Description
本創作屬於機械加工領域,尤其是關於一種將二種加工刀具裝置在單一加工機上,簡化生產流程,增加效能並提高加工精密度的結合雷射切割和雷射雕刻的複合式加工機。 This creation belongs to the field of machining, especially a composite machining machine combining laser cutting and laser engraving, which combines two processing tools on a single processing machine, simplifies the production process, increases the efficiency and improves the processing precision.
習知的加工機設備多屬於專用加工機,其僅具有單一的加工效果,能對工件進行固定的加工作業,以滿足所需的加工需求。 The conventional processing machine equipment is mostly a special processing machine, which has only a single processing effect, and can perform fixed processing operations on the workpiece to meet the required processing requirements.
但是,要將一個工件製作為成品,其通常必須進行多次加工製程,且不僅是切削、鑽孔、研磨等傳統工法,更可能包括如超音波加工、雷射加工等製程,使每一製程都需要專用的加工機,以依序對工件進行所需的加工,得到工件的完整製程。 However, in order to make a workpiece into a finished product, it usually has to carry out multiple processing processes, and not only traditional methods such as cutting, drilling, grinding, etc., but also processes such as ultrasonic processing and laser processing, so that each process is made. A special processing machine is required to perform the required processing on the workpiece in order to obtain a complete process of the workpiece.
例如,雷射切割機能適用於金屬或是非金屬材料之切割分離作業,例如運用於金屬或是非金屬材料之板材切割上;將高功率之雷射聚焦在工件上,藉由高功率的雷射能量使工件被切斷而分開來。 For example, laser cutting machines can be used for cutting and separating metal or non-metallic materials, such as for sheet metal cutting of metal or non-metallic materials; focusing high-power lasers on workpieces with high-power laser energy The workpiece is cut and separated.
而雷射雕刻機能適用於金屬或是非金屬材料之表面層的材料移除,例如材料表面的打印、咬花,或是超硬刀片材料的移除上;藉由低功率、高頻的雷射聚焦在被加工表面的原子/分子而使之剝離。 The laser engraving machine can be applied to the removal of materials from the surface layer of metal or non-metallic materials, such as printing on the surface of the material, biting, or removal of super-hard blade material; with low power, high frequency laser The atoms/molecules that are focused on the surface being processed are stripped.
然而,習知加工機設備的主要問題,在於將雷射切割或是雷射雕刻之機能裝置於獨立之機械設備上,因此,必須配置多部加工機而形成龐大的生產線規模;更重要者,每一次加工作業時,必須將工件自前一製程的加工機取下,然後重新夾固於次一製程的加工機上,而每一次的夾固作業都需要重新校正,不僅浪費時間也造成製程複雜化;且每一次的夾固作業都會產生誤差,經過多次加工而累積之後,必然會使加工成品的精密度下降。 However, the main problem of the conventional processing machine equipment is that the laser cutting or laser engraving function is installed on a separate mechanical device. Therefore, it is necessary to configure a plurality of processing machines to form a large production line scale; more importantly, During each machining operation, the workpiece must be removed from the processing machine of the previous process, and then re-clamped to the processing machine of the next process, and each clamping operation needs to be recalibrated, which not only wastes time but also complicates the process. And each time the clamping work will produce an error, after a number of processing and accumulation, it will inevitably reduce the precision of the finished product.
有鑒於前述的缺失,顯見習用技術仍存有改善空間而亟待加以解決。 In view of the aforementioned shortcomings, it is obvious that there is still room for improvement in the conventional technology and it needs to be solved.
為此,創作人著手進行改良,經由長期的研發與實作後,終能完成本件結合雷射切割和雷射雕刻的複合式加工機。 To this end, the creators set out to improve, through long-term research and development and implementation, can finally complete this combination of laser cutting and laser engraving composite processing machine.
本創作的主要目的在於提供一種結合雷射切割和雷射雕刻的複合式加工機,其將雷射切割和雷射雕刻二種加工機能整合在單一的加工機上,可以大幅簡化工作流程與生產線配置,提高整體的工作效能,同時降低加工機的配置成本。 The main purpose of this creation is to provide a hybrid processing machine that combines laser cutting and laser engraving, which combines laser cutting and laser engraving into a single processing machine, which greatly simplifies the workflow and production line. Configuration, improve overall performance, while reducing the cost of processing machine configuration.
本創作的另一目的在於提供一種結合雷射切割和雷射雕刻的複合式加工機,當有需要施行雷射切割或是雷射雕刻機能於同一工件時,可以避免重複使用固定工件之夾治具、搬運、設定等,使得工件的加工精密度大幅提升,也更有工作效能。 Another object of the present invention is to provide a composite processing machine combining laser cutting and laser engraving. When there is a need to perform laser cutting or a laser engraving machine can be used on the same workpiece, the re-use of the fixed workpiece can be avoided. The handling, handling, setting, etc., make the machining precision of the workpiece greatly improved, and it also has more work efficiency.
本創作的再一目的在於提供一種結合雷射切割和雷射雕刻 的複合式加工機,其可結合於現有各種控制軸數的加工機設備,減少重複投資;且更進一步可結合影像處理設備、工件量測設備及自動化上下料裝置於整合的加工機設備上。 A further object of the present invention is to provide a combination of laser cutting and laser engraving The compound processing machine can be combined with various existing processing machine equipments for controlling the number of axes, reducing the repetitive investment; and further integrating the image processing equipment, the workpiece measuring equipment and the automatic loading and unloading device on the integrated processing machine equipment.
為達到上述目的所稱的一種結合雷射切割和雷射雕刻的複合式加工機,包括有一加工機、一工作平台和一複合式刀具。 A composite machining machine incorporating laser cutting and laser engraving for the above purposes includes a processing machine, a working platform and a composite tool.
該加工機具有一底座以提供該加工機的置放,該底座一側設置有一機身;該工作平台裝置在該底座上,用來固定有一工件;該複合式刀具裝置在該機身上,該刀具底部設置有一雷射切割單元和一雷射雕刻單元,使該雷射切割單元和該雷射雕刻單元針對該工件進行加工。 The processing machine has a base for providing the processing machine, and a working body is disposed on one side of the base; the working platform is disposed on the base for fixing a workpiece; the composite cutter device is disposed on the body A laser cutting unit and a laser engraving unit are disposed at the bottom of the tool to cause the laser cutting unit and the laser engraving unit to process the workpiece.
其中,該底座上設置有軌道,該工作平台底部抵靠在該軌道上進行移動,以將該工件的被加工表面對正該複合式刀具。 Wherein, the base is provided with a rail, and the bottom of the working platform is moved against the rail to align the processed surface of the workpiece with the composite cutter.
另外,該複合式刀具外部封裝有一外殼,該機身上設置有滑軌,使該外殼抵靠在該滑軌上進行移動,以將該複合式刀具靠近該工件。 In addition, the composite tool is externally packaged with a casing, and the body is provided with a sliding rail, so that the casing moves against the sliding rail to bring the composite cutter close to the workpiece.
並且,該工作平台上設置有一夾治具,該夾治具用來固定並調整該工件位置。 Moreover, the working platform is provided with a jig for fixing and adjusting the position of the workpiece.
100‧‧‧加工機 100‧‧‧Processing machine
110‧‧‧底座 110‧‧‧Base
111‧‧‧軌道 111‧‧‧ Track
120‧‧‧機身 120‧‧‧ body
121‧‧‧滑軌 121‧‧‧Slide rails
200‧‧‧工作平台 200‧‧‧Working Platform
210‧‧‧夾治具 210‧‧‧Clamps
300‧‧‧複合式刀具 300‧‧‧Composite tool
310‧‧‧雷射切割單元 310‧‧‧Laser cutting unit
320‧‧‧雷射雕刻單元 320‧‧‧Laser engraving unit
330‧‧‧外殼 330‧‧‧Shell
400‧‧‧工件 400‧‧‧Workpiece
圖1是本創作的立體示意圖;圖2是本創作的複合式刀具結構示意圖;圖3是本創作的雷射切割單元加工示意圖; 圖4是本創作的雷射雕刻單元加工示意圖;以及圖5是本創作的操作步驟流程圖。 1 is a schematic perspective view of the present invention; FIG. 2 is a schematic view of the composite cutter structure of the present invention; FIG. 3 is a schematic view of the laser cutting unit of the present invention; 4 is a schematic view of the processing of the laser engraving unit of the present invention; and FIG. 5 is a flow chart of the operation steps of the present creation.
為了使本創作的目的、技術方案及優點更加清楚明白,下面結合附圖及實施例,對本創作進行進一步詳細說明。此處所描述的具體實施例僅用以解釋本創作,並不用於限定本創作。 In order to make the purpose, technical solution and advantages of the present invention more clear, the present invention will be further described in detail below with reference to the accompanying drawings and embodiments. The specific embodiments described herein are merely illustrative of the present invention and are not intended to limit the present invention.
請參閱圖1、圖2所示,為本創作所提供的一種結合雷射切割和雷射雕刻的複合式加工機,其主包括有一加工機100、一工作平台200與一複合式刀具300。 Please refer to FIG. 1 and FIG. 2 , which is a composite processing machine combined with laser cutting and laser engraving provided by the present invention, which mainly comprises a processing machine 100 , a working platform 200 and a composite cutter 300 .
該加工機100提供各組成單元的裝置空間,以及其它動力、控制機能的配置,其具有一底座110,該底座110用來提供該加工機100的置放,以進行加工作業,該底座110一側設置有一機身120,該機身120提供該複合式刀具300的裝置。 The processing machine 100 provides a device space of each component unit, and other power and control function configurations, and has a base 110 for providing the processing machine 100 for processing. The base 110 A body 120 is provided on the side, and the body 120 provides means for the composite cutter 300.
該工作平台200裝置在該底座110上,其上固定有待加工的一工件400。 The work platform 200 is mounted on the base 110 to which a workpiece 400 to be processed is fixed.
而複合式刀具300裝置在該機身120上,該複合式刀具300底部設置有一雷射切割單元310和一雷射雕刻單元320,使該雷射切割單元310和該雷射雕刻單元320針對該工件400分別進行加工。 The composite cutter 300 is disposed on the body 120, and a laser cutting unit 310 and a laser engraving unit 320 are disposed at the bottom of the composite cutter 300, so that the laser cutting unit 310 and the laser engraving unit 320 The workpieces 400 are processed separately.
因此,請參閱圖3、圖4所示,首先將該工件400固定在該工作平台200上,然後移動該工作平台200或該複合式刀具300,使該雷射切割310和該雷射雕刻單元320靠近該工件400的被加工面,並且分別進 行加工,即可完成所需的加工作業。 Therefore, referring to FIG. 3 and FIG. 4, the workpiece 400 is first fixed on the working platform 200, and then the working platform 200 or the composite cutter 300 is moved to make the laser cutting 310 and the laser engraving unit. 320 is close to the processed surface of the workpiece 400, and separately Once processed, the required machining operations can be completed.
請參閱圖5為本創作的工作流程圖,本創作的實施步驟簡述如下:5-1.夾固該工件400,將該工件400放置在該工作平台200上,調整其工作位置,並且進行鎖固,完成該工件400在加工前的初期定位;5-2.雷射切割,利用該雷射切割單元310以高能集中的雷射光束,依該工件400的輪廓線進行切割;5-3.雷射雕刻,利用該雷射雕刻單元320在該工件400表面利用雷射熱能移除部分表層材料,通常可見的應用在於備註製造日期、物件型號、QR Code等,也可以單純為產品美觀的目的;5-4.成品卸料,將該工件400進行複合式加工後的加工成品移除。 Please refer to FIG. 5 for the working flow chart of the present creation. The implementation steps of the present creation are briefly described as follows: 5-1. The workpiece 400 is clamped, the workpiece 400 is placed on the working platform 200, the working position is adjusted, and the work is performed. Locking, completing the initial positioning of the workpiece 400 before processing; 5-2. Laser cutting, using the laser cutting unit 310 to cut the laser beam with high energy, according to the contour of the workpiece 400; 5-3 Laser engraving, using the laser engraving unit 320 to remove part of the surface material by using the laser thermal energy on the surface of the workpiece 400. The commonly used applications are the date of manufacture of the remarks, the model of the object, the QR Code, etc., or the aesthetics of the product. Purpose; 5-4. Finished product unloading, removing the processed product after the workpiece 400 is composite processed.
上述步驟2、3的順序可以交換,也可重複進行,而在加工過程期間,完全不需將該工件400卸下或調整位置,可以藉由加工程式呼叫複合式加工模組(該雷射切割單元310/該雷射雕刻單元320),即可依照各加工模組位置,自動定位該工件400,完成所有加工。 The sequence of steps 2 and 3 above may be exchanged or repeated, and during the machining process, the workpiece 400 may not be removed or adjusted at all, and the composite machining module may be called by the machining program (the laser cutting is performed). The unit 310 / the laser engraving unit 320) can automatically position the workpiece 400 according to the position of each processing module to complete all processing.
複參圖1、圖2所示,進一步說明,該工作平台200可在該底座110上移動,以將該工件400靠近該複合式刀具300便於加工,其方式在於,該底座110上設置有軌道111,該工作平台200底部抵靠在該軌道 111上而進行移動,該軌道111可以設置為橫向或縱向,通常為同時設置有橫向與縱向以便於該工件400的自由移動。 Referring to FIG. 1 and FIG. 2, it is further illustrated that the working platform 200 can be moved on the base 110 to facilitate the processing of the workpiece 400 adjacent to the composite cutter 300, wherein the base 110 is provided with a track. 111, the bottom of the working platform 200 abuts on the track Moving over 111, the track 111 can be disposed in a lateral or longitudinal direction, typically with lateral and longitudinal directions to facilitate free movement of the workpiece 400.
類似的,該複合式刀具300外部封裝有一外殼330,該外殼330內可裝置驅動該複合式刀具300產生功能的動力或控制機能,在此不予贅述,而該機身120上設置有滑軌121,使該外殼330抵靠在該滑軌121上進行移動,該滑軌121通常是上下走向,以將該複合式刀具300靠近或遠離該工件400。 Similarly, the composite tool 300 is externally packaged with a housing 330. The housing 330 can be configured to drive the composite tool 300 to generate functional power or control functions, which are not described herein, and the body 120 is provided with a slide rail. 121, the outer casing 330 is moved against the sliding rail 121, and the sliding rail 121 is generally up and down to bring the composite cutter 300 closer to or away from the workpiece 400.
另外,對於該工件400的鎖固,可以在該工作平台200設置磁吸機能或真空吸附方式,直接將該工件400吸附在該工作平台200上,或者,該工作平台200上設置有一夾治具210,利用該夾治具210固定並調整該工件400位置。 In addition, for the locking of the workpiece 400, a magnetic function or a vacuum adsorption mode may be disposed on the working platform 200 to directly adsorb the workpiece 400 on the working platform 200, or a clamping fixture is disposed on the working platform 200. 210. The fixture 200 is used to fix and adjust the position of the workpiece 400.
以上該僅為本創作之較佳實施例,並非用來限定本創作之實施範圍;如果不脫離本創作之精神和範圍,對本創作進行修改或者等同替換,均應涵蓋在本創作申請專利範圍的保護範圍當中。 The above is only a preferred embodiment of the present invention, and is not intended to limit the scope of the present invention; if the spirit and scope of the present invention are not deviated from, the modification or equivalent replacement of the present invention should be covered in the scope of the present patent application. Within the scope of protection.
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TWI768235B (en) * | 2019-08-14 | 2022-06-21 | 健鼎科技股份有限公司 | 2d-barcode laser engraver and position method |
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